WO2021012273A1 - 一种电子产品 - Google Patents

一种电子产品 Download PDF

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Publication number
WO2021012273A1
WO2021012273A1 PCT/CN2019/097760 CN2019097760W WO2021012273A1 WO 2021012273 A1 WO2021012273 A1 WO 2021012273A1 CN 2019097760 W CN2019097760 W CN 2019097760W WO 2021012273 A1 WO2021012273 A1 WO 2021012273A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
electronic product
wall
product according
cavity
Prior art date
Application number
PCT/CN2019/097760
Other languages
English (en)
French (fr)
Inventor
黄兴志
柳林
童迪江
张哲�
吴军
陈志臣
印兆宇
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to US16/995,818 priority Critical patent/US20210029429A1/en
Publication of WO2021012273A1 publication Critical patent/WO2021012273A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the technical field of electronic product structure, in particular to an electronic product capable of rapid heat dissipation.
  • the communication industry has always maintained a high degree of attention to the heat dissipation of mobile phones and other electronic products.
  • Electronic products contain various components that generate heat during operation.
  • the heat is dissipated through the chassis of the whole machine, such as a metal shell.
  • the housing material There will be requirements for the housing material, which will affect the circuit layout or antenna performance.
  • the purpose of the utility model is to provide an electronic product that does not require the material of the casing and can quickly dissipate heat.
  • the present invention provides an electronic product, which includes a speaker box and a heating element, and also includes a heat conducting member connected between the speaker box and the heating element, the speaker box including a sound hole
  • the metal insert includes a first reinforcement plate embedded in the housing and correspondingly covering the first through hole, and a second reinforcement plate extending from the first reinforcement plate and covering the second through hole, The edges of the metal inserts are all embedded in the shell;
  • One end of the heat conducting element is connected to the second reinforcing plate, and the other end is connected to the heating element.
  • the heat conducting element transfers the heat generated by the heating element to the metal insert, and the metal insert connects The heat is conducted to the front cavity and transferred from the air in the front cavity to the outside of the sound outlet.
  • the housing includes a top wall directly opposite to the diaphragm and spaced apart, a bottom wall opposite to the top wall, and a side bent and extended from the edge of the top wall toward the bottom wall.
  • the wall, the first through hole and the second through hole are spaced apart on the top wall.
  • the housing further includes a support wall extending from the top wall into the receiving space, the speaker unit is fixed to the support wall and is spaced apart from the top wall, and the support A wall interval is provided between the front cavity and the rear cavity.
  • the sound hole is formed on the side wall, the diaphragm and the top wall facing the diaphragm form a front acoustic cavity, and the housing forms a communication with the front acoustic cavity.
  • a sound guide channel with the sound hole, the front cavity includes the front sound cavity and the sound guide channel.
  • the housing further includes a partition wall separating the sound guide channel and the rear cavity, and the partition wall faces the side wall from the side of the speaker unit close to the sound hole Extending, the partition wall, the top wall and the side wall enclose the sound guide channel.
  • the first reinforcing plate includes a main body portion directly opposite to the diaphragm and a bending portion that is bent from the edge of the main body portion toward the bottom wall and embedded in the housing, The second reinforcement plate is bent and extended from the bending portion.
  • At least part of the bending portion is embedded in the supporting wall.
  • the main body and the second reinforcing plate are both flat, and the metal insert is integrally formed.
  • it further includes a cabinet for fixing the speaker box and the heating element, the side wall is correspondingly attached and fixed to the cabinet, and the cabinet is penetrated with the sound hole. Corresponding to several connected sound holes.
  • the metal insert is in the form of a sheet and is integrally molded with the shell by injection molding.
  • the heat conducting element is a solid heat conducting body.
  • the heat conducting element is a heat conducting pipe with a built-in cooling liquid.
  • the heat-conducting member includes a contact portion superimposed on the second reinforcing plate and a connecting portion extending from one side of the contact portion and connected to the heating element.
  • the width of the contact portion is greater than that of the connecting portion.
  • the orthographic projection of the contact portion on the second reinforcing plate covers more than 2/3 of the surface of the second reinforcing plate.
  • the beneficial effect of the utility model is that the heat conducting part of the utility model is closely attached to the surface of the metal insert of the speaker box, the heat conducting part transfers the heat generated by the heating element to the first reinforcing plate of the metal insert, and the metal insert transfers the heat Conducted to the front cavity, and then through the vibration of the diaphragm, high-speed airflow is generated in the front cavity area, and the air in the front cavity is directly transferred to the sound hole for convective exchange with external air, and the heat in the front cavity is quickly exported to In the outside air, there is no requirement for the material of the casing, the heat dissipation efficiency is high, and the heat dissipation can be carried out over a long distance.
  • Figure 1 is a perspective view of an electronic product provided by an embodiment of the utility model
  • Figure 2 is an exploded schematic diagram of Figure 1;
  • Figure 3 is a top view of a speaker box provided by an embodiment of the utility model
  • Fig. 4 is a schematic cross-sectional view at A-A in Fig. 3;
  • Fig. 5 is a schematic cross-sectional view at B-B in Fig. 3;
  • Figure 6 is an exploded view of the speaker box provided by the embodiment of the utility model
  • Figure 7 is a perspective view of a metal insert provided by an embodiment of the present invention.
  • an element when an element is referred to as being “fixed on” or “disposed on” another element, the element may be directly on the other element or there may be a centering element at the same time.
  • an element When an element is referred to as being “connected” to another element, it can be directly connected to the other element or an intermediate element may also exist.
  • the embodiment of the present invention provides an electronic product.
  • the electronic product includes a housing 10, a speaker box 20, a heating element 30, and a heat conducting member connected between the speaker box 20 and the heating element 30 40.
  • the speaker box 20, the heating element 30, and the heat-conducting member 40 are all installed in the casing 10.
  • the heat generated in the heating element 30 can be introduced into the speaker box 20 by the heat-conducting member 40, and then the heat is continuously discharged from the casing by the speaker box 20
  • the heating element 30 in this embodiment may be a mobile phone CPU or a battery, or any parts in the mobile phone that require heat dissipation.
  • the speaker box 20 includes a housing 21 with a sound hole 211, a speaker unit 25 housed in the housing 21, and a metal insert 26 embedded in the housing 21,
  • the housing 21 encloses to form a receiving space 22 for accommodating the speaker unit 25.
  • the sound outlet 211 penetrates through the housing 21.
  • the speaker unit 25 includes a diaphragm 251 that divides the housing space 22 into a front cavity. 23 and the rear cavity 24, when conducting heat, the heat conducting member 40 transfers the heat generated by the heating element 30 to the metal insert 26, and the diaphragm 251 can generate high-speed airflow in the area of the front cavity 23 during operation to form an air-cooling effect , So that the metal insert 26 continuously conducts heat into the front cavity 23.
  • a number of sound holes 11 corresponding to the sound holes 211 are penetrated through the casing 10, and the front cavity 23 communicates with the outside through the sound holes 211.
  • the housing 21 is provided with a first through hole 212 communicating with the front cavity 23 and a second through hole 213 communicating with the rear cavity 24, and the metal insert 26 includes embedded in the housing 21 Corresponding to the first reinforcement plate 261 covering the first through hole 212 and the second reinforcement plate 262 extending from the first reinforcement plate 261 and covering the second through hole 213, the edges of the metal insert 26 are embedded on the housing 21
  • the metal insert 26 has a sheet shape and is injection-molded with the housing 21 as a whole, and the heat conducting member 40 is directly attached to the second reinforcing plate 262 of the metal insert 26.
  • one end of the heat-conducting element 40 is connected to the second reinforcing plate 262, and the other end of the heat-conducting element 40 is connected to the heating element 30.
  • the heat-conducting element 40 transfers the heat generated by the heating element 30 to the metal insert 26.
  • the metal insert 26 Conducting heat to the front cavity 23, the diaphragm 251 on the speaker unit 25 can transfer the hot air in the front cavity 23 to the outside of the sound hole 211 through the sound hole 211 and the sound hole 11, so as to exchange with the outside air. heat.
  • the speaker unit 25 in this embodiment When the speaker unit 25 in this embodiment performs heat dissipation work, it can input a lower frequency (less than 1000 Hz) pulse signal to drive the diaphragm 251 in the speaker unit 25 to vibrate, and push the air flow of the front cavity 23 to form air cooling. effect.
  • the pulse signal can be played alone when the speaker box 20 is not performing a music playback task; when the music playback task is performed, the pulse signal can be superimposed into the music signal.
  • This signal is an ultra-low frequency pulse signal, which will not be heard by the human ear and will not affect the normal listening effect.
  • the housing 21 includes a top wall 214 directly opposite to the diaphragm 251 and spaced apart, a bottom wall 215 opposite to the top wall 214, side walls 216 bent and extended from the edge of the top wall 214 toward the bottom wall 215, and
  • the top wall 214 extends to the supporting wall 217 in the receiving space 22.
  • the top wall 214, the side walls 216 and the bottom wall 215 enclose the receiving space 22.
  • the first through hole 212 and the second through hole 213 are spaced apart on the top wall 214.
  • the supporting wall 217 is arranged at intervals between the front cavity 23 and the rear cavity 24, the speaker unit 25 is fixed to the supporting wall 217 and spaced from the top wall 214, and the diaphragm 251 is located on the top of the speaker unit 25 and opposite to the top wall 214.
  • the front cavity 23 includes a front acoustic cavity 231 and a sound guide channel 232, the sound outlet 211 is formed in the side wall 216, and the front acoustic cavity 231 is formed at intervals between the diaphragm 251 and the top wall 214 facing the diaphragm 251,
  • the housing 21 forms a sound guide channel 232 that communicates the front sound cavity 231 and the sound hole 211, the side wall 216 of the housing 21 is fixed to the cabinet 10 correspondingly, the front sound cavity 231, the sound guide channel 232, the sound hole 211 and the sound The holes 11 communicate sequentially.
  • the housing 21 further includes a partition wall 218 separating the sound guide channel 232 and the rear cavity 24.
  • the partition wall 218 extends from the side of the speaker unit 25 close to the sound outlet 211 toward the side wall 216.
  • the partition wall 218 , The top wall 214 and the side wall 216 are enclosed to form a sound guide channel 232.
  • the first reinforcing plate 261 includes a main body portion 263 directly opposite to the diaphragm 251 and a bending portion 264 that is bent from the edge of the main body portion 263 toward the bottom wall 215 and embedded in the housing 21.
  • the reinforcing plate 262 is bent and extended from the bending portion 264, and at least a part of the bending portion 264 is embedded in the supporting wall 217 so as to support the metal insert 26.
  • the main body 263 and the second reinforcing plate 262 are both flat plates, and the main body 263, the bending part 264 and the second reinforcing plate 262 on the metal insert 26 are integrally formed to reduce the production cost of the speaker box 20.
  • the heat-conducting element 40 may be a solid heat-conductor, and the heat-conducting element 40 and the metal insert 26 may be fixedly connected by welding or gluing; of course, the heat-conducting element 40 may also be built-in cooling liquid. At this time, the heat-conducting element 40 and the metal insert 26 can be fixedly connected by welding.
  • the heat-conducting element 40 includes a contact portion 41 superimposed on the second reinforcing plate 262 and a connecting portion 42 extending from one side of the contact portion 41 and connected to the heating element 30.
  • the width of the contact portion 41 is larger than that of the connecting portion. 42 in order to increase the heat dissipation of the heat conducting element 40.
  • the orthographic projection of the contact portion 41 on the second reinforcing plate 262 covers more than 2/3 of the surface of the second reinforcing plate 262.
  • the two ends of the heat-conducting element 40 are defined as the input end and the condensing end.
  • the input end of the heat-conducting element 40 in the mobile phone can be close to the heating element 30 such as the CPU, and the condensing end is close to the speaker
  • the heat conduction element 40 is a heat conduction pipe with a built-in cooling liquid
  • the cooling liquid at the input end is heated and evaporated, and passes through the hollow heat conduction pipe.
  • the condensing end gradually cools down, changing from steam to liquid again, and returning from the heat pipe to the input end, repeating this process continuously, so as to quickly transfer the heat generated by the heating element 30 to the metal insert 26, and the metal insert 26 then transfers the heat It is conducted to the front cavity 23, and the air cooling effect of the speaker unit 25 is used to quickly export the heat in the heat conducting member 40 to the outside air, so as to achieve the combined effect of liquid cooling and air cooling.
  • the heat dissipation efficiency is higher and can be fast Effective heat dissipation.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种电子产品,包括扬声器箱(20)、发热元件(30)以及导热件(40),扬声器箱(20)包括具有出声孔(211)的壳体(21)、收容于壳体(21)内的扬声器单体(25)以及嵌设于壳体(21)上的金属嵌件(26),壳体(21)围成收容扬声器单体(25)的收容空间(22),扬声器单体(25)包括振膜(251),振膜(251)将收容空间(22)分隔成前腔(23)与后腔(24),前腔(23)经出声孔(211)与外界连通,壳体(21)开设有与前腔(23)连通的第一通孔(212)以及与后腔(24)连通的第二通孔(213);金属嵌件(26)包括嵌设于壳体(21)并对应覆盖第一通孔(212)的第一加强板(261)以及自第一加强板(261)延伸并覆盖第二通孔(213)的第二加强板(262),金属嵌件(26)的边缘均嵌设于壳体(21);导热件(40)的一端与第二加强板(262)连接、另一端与发热元件(30)连接。其中导热件(40)将发热元件(30)产生的热量传递至金属嵌件(26),金属嵌件(26)将热量传导至前腔(23)并由前腔(23)内空气传递至出声孔(211)外。

Description

一种电子产品 技术领域
本实用新型涉及电子产品结构技术领域,尤其涉及一种能快速散热的电子产品。
背景技术
通讯行业对手机等电子产品的散热问题一直保持着较高的关注度,电子产品内含有各种在运行过程中会发热的元件,一般通过整机的机壳散热,比如金属外壳这些,这样就会对机壳材料有要求,将会影响电路布置或者天线性能。
因此,有必要提供一种电子产品来解决上述问题。
技术问题
本实用新型的目的在于提供一种对机壳材料没有要求且能快速散热的电子产品。
技术解决方案
本实用新型的技术方案如下:
为实现上述目的,本实用新型提供了一种电子产品,包括扬声器箱和发热元件,还包括连接在所述扬声器箱与所述发热元件之间的导热件,所述扬声器箱包括具有出声孔的壳体、收容于所述壳体内的扬声器单体以及嵌设于所述壳体上的金属嵌件,所述壳体围成收容所述扬声器单体的收容空间,所述扬声器单体包括振膜,所述振膜将所述收容空间分隔成前腔与后腔,所述前腔经所述出声孔与外界连通,所述壳体开设有与所述前腔连通的第一通孔、以及与所述后腔连通的第二通孔;
所述金属嵌件包括嵌设于所述壳体并对应覆盖所述第一通孔的第一加强板以及自所述第一加强板延伸并覆盖所述第二通孔的第二加强板,所述金属嵌件的边缘均嵌设于所述壳体;
所述导热件的一端与所述第二加强板连接、另一端与所述发热元件连接,所述导热件将所述发热元件产生的热量传递至所述金属嵌件,所述金属嵌件将所述热量传导至所述前腔并由所述前腔内的空气传递至所述出声孔外。
作为一种改进,所述壳体包括与所述振膜正对且间隔设置的顶壁、与所述顶壁相对的底壁以及自所述顶壁边缘朝所述底壁弯折延伸的侧壁,所述第一通孔与所述第二通孔间隔开设于所述顶壁。
作为一种改进,所述壳体还包括自所述顶壁延伸至所述收容空间内的支撑壁,所述扬声器单体与所述支撑壁固定并与所述顶壁间隔设置,所述支撑壁间隔设置在所述前腔与所述后腔之间。
作为一种改进,所述出声孔形成在所述侧壁,所述振膜与正对所述振膜的所述顶壁之间间隔形成前声腔、所述壳体形成连通所述前声腔与所述出声孔的导声通道,所述前腔包括所述前声腔与所述导声通道。
作为一种改进,所述壳体还包括间隔所述导声通道与所述后腔的分隔壁,所述分隔壁自所述扬声器单体靠近所述出声孔的一侧朝所述侧壁延伸,所述分隔壁、所述顶壁及所述侧壁围成所述导声通道。
作为一种改进,所述第一加强板包括与所述振膜正对的主体部以及自所述主体部边缘朝所述底壁方向弯折并嵌设于所述壳体的弯折部,所述第二加强板自所述弯折部弯折延伸。
作为一种改进,至少部分所述弯折部嵌设于所述支撑壁。
作为一种改进,所述主体部与所述第二加强板均为平板状,所述金属嵌件一体成型。
作为一种改进,还包括固定所述扬声器箱与所述发热元件的机壳,所述侧壁与所述机壳对应贴合固定,所述机壳上贯穿设有与所述出声孔相对应连通的若干发声孔。
作为一种改进,所述金属嵌件呈片状并与所述壳体注塑成型为一体。
作为一种改进,所述导热件为实心的导热体。
作为一种改进,所述导热件为内置有冷却液的导热管。
作为一种改进,所述导热件包括叠设于所述第二加强板上的接触部和自所述接触部一侧延伸并与所述发热元件相连接的连接部。
作为一种改进,所述接触部的宽度大于所述连接部。
作为一种改进,所述接触部在所述第二加强板上的正投影覆盖所述第二加强板表面的2/3以上。
有益效果
本实用新型的有益效果是:本实用新型中导热件紧贴在扬声器箱的金属嵌件表面,导热件将发热元件产生的热量传递至金属嵌件的第一加强板上,金属嵌件将热量传导至前腔内,再通过振膜的振动,在前腔区域内产生高速气流,直接将前腔内空气传递至出声孔外与外部气体进行对流交换,将前腔内的热量快速导出到外部空气中,对机壳材料没有要求,散热效率高,能进行远距离散热。
附图说明
图1为本实用新型实施例提供的电子产品的立体图;
图2为图1的爆炸示意图;
图3为本实用新型实施例提供的扬声器箱的俯视图;
图4为图3中A-A处的剖面示意图;
图5为图3中B-B处的剖面示意图;
图6为本实用新型实施例提供的扬声器箱的爆炸图;
图7为本实用新型实施例提供的金属嵌件的立体图。
图中:10、机壳;11、发声孔; 20、扬声器箱;21、壳体;211、出声孔;212、第一通孔;213、第二通孔;214、顶壁;215、底壁;216、侧壁;217、支撑壁;218、分隔壁;22、收容空间;23、前腔;231、前声腔;232、导声通道;24、后腔; 25、扬声器单体;251、振膜;26、金属嵌件;261、第一加强板;262、第二加强板;263、主体部;264、弯折部;30、发热元件;40、导热件;41、接触部;42、连接部。
本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
需要说明的是,本实用新型实施例中所有方向性指示(诸如上、下、内、外、顶部、底部……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。
还需要说明的是,当元件被称为“固定于”或“设置于”另一个元件上时,该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件,它可以是直接连接另一个元件或者可能同时存在居中元件。
请参阅图1至图7,本实用新型的实施例提供了一种电子产品,电子产品包括机壳10、扬声器箱20、发热元件30以及连接在扬声器箱20与发热元件30之间的导热件40,扬声器箱20、发热元件30以及导热件40都安装于机壳10内,发热元件30内产生的热量可由导热件40导入至扬声器箱20内,再由扬声器箱20将热量不断排出机壳10外,本实施例中的发热元件30可以为手机CPU或者电池或者是手机中任意有散热需求的零部件。
具体地,请参阅图3至图6,扬声器箱20包括具有出声孔211的壳体21、收容于壳体21内的扬声器单体25以及嵌设于壳体21上的金属嵌件26,壳体21围合形成一个用于收容扬声器单体25的收容空间22,出声孔211贯穿开设于壳体21,扬声器单体25包括振膜251,振膜251将收容空间22分隔成前腔23与后腔24,在导热时,导热件40将发热元件30产生的热量传递至金属嵌件26上,振膜251在工作时可在前腔23的区域内产生高速气流,形成风冷效果,以使得金属嵌件26将热量不断传导至前腔23内。机壳10上贯穿设有与出声孔211相对应连通的若干发声孔11,前腔23经出声孔211与外界连通。
请进一步参阅图1和图2,壳体21上开设有与前腔23连通的第一通孔212以及与后腔24连通的第二通孔213,金属嵌件26包括嵌设于壳体21并对应覆盖第一通孔212的第一加强板261以及自第一加强板261延伸并覆盖第二通孔213的第二加强板262,金属嵌件26的边缘均嵌设于壳体21上,优选地,金属嵌件26呈片状并与壳体21注塑成型为一体,导热件40直接贴合到金属嵌件26的第二加强板262上。
本实施例中导热件40的一端与第二加强板262连接,导热件40的另一端与发热元件30连接,导热件40将发热元件30产生的热量传递至金属嵌件26,金属嵌件26将热量传导至前腔23,扬声器单体25上的振膜251可将前腔23内的热空气经出声孔211和发声孔11传递至出声孔211外,以与外部空气进行对流换热。
本实施例中的扬声器单体25在执行散热工作时,可输入较低频(低于1000Hz)的脉冲信号,驱动扬声器单体25中振膜251振动,推动前腔23空气流动以形成风冷效果。在扬声器箱20不执行音乐播放任务时可单独播放该脉冲信号;在执行音乐播放任务时可将该脉冲信号叠加进音乐信号中。该信号是超低频的脉冲信号,将不会被人耳听到,不影响正常听音效果。
本实施例中,壳体21包括与振膜251正对且间隔设置的顶壁214、与顶壁214相对的底壁215、自顶壁214边缘朝底壁215弯折延伸的侧壁216以及自顶壁214延伸至收容空间22内的支撑壁217,顶壁214、侧壁216和底壁215围成收容空间22,第一通孔212与第二通孔213间隔开设于顶壁214,支撑壁217间隔设置在前腔23与后腔24之间,扬声器单体25与支撑壁217固定并与顶壁214间隔设置,振膜251位于扬声器单体25顶部并与顶壁214相对设置。
作为优选地实施方式,前腔23包括前声腔231与导声通道232,出声孔211形成在侧壁216,振膜251与正对振膜251的顶壁214之间间隔形成前声腔231,壳体21形成连通前声腔231与出声孔211的导声通道232,壳体21的侧壁216与机壳10对应贴合固定,前声腔231、导声通道232、出声孔211以及发声孔11依次连通。
作为优选地实施方式,壳体21还包括间隔导声通道232与后腔24的分隔壁218,分隔壁218自扬声器单体25靠近出声孔211的一侧朝侧壁216延伸,分隔壁218、顶壁214及侧壁216围合形成导声通道232。
作为优选地实施方式,第一加强板261包括与振膜251正对的主体部263以及自主体部263边缘朝底壁215方向弯折并嵌设于壳体21的弯折部264,第二加强板262自弯折部264弯折延伸,至少部分弯折部264嵌设于支撑壁217,以便于支撑金属嵌件26。主体部263与第二加强板262均为平板状,金属嵌件26上的主体部263、弯折部264及第二加强板262一体成型,以降低扬声器箱20的生产成本。
本实施例中导热件40可以为实心的导热体,在导热件40和金属嵌件26之间可采用焊接或者胶粘将二者进行固定连接;当然,导热件40也可以为内置有冷却液的导热管,此时,在导热件40和金属嵌件26之间可采用焊接将二者进行固定连接。
本实用新型中,导热件40包括叠设于第二加强板262上的接触部41和自接触部41一侧延伸并与发热元件30相连接的连接部42,接触部41的宽度大于连接部42,以便于增大导热件40的散热性。具体地,接触部41在第二加强板262上的正投影覆盖第二加强板262表面的2/3以上。
定义导热件40的两端分别为输入端和冷凝端,本实用新型的电子产品在具体使用时,可将手机中导热件40的输入端紧贴CPU等发热元件30上,冷凝端紧贴扬声器箱20的金属嵌件26表面,热量从输入端进入,当导热件40为内置有冷却液的导热管时,输入端的冷却液受到加热蒸发,从中空的导热管穿过,在温度更低的冷凝端逐渐冷却,由蒸汽重新变成液体,再由导热管向输入端回流,不断重复这个过程,以便于将发热元件30产生的热量快速传递给金属嵌件26,金属嵌件26再将热量传导至前腔23内,利用扬声器单体25的风冷效果将导热件40中的热量快速导出到外部空气中,以达到液冷和风冷相结合的效果,其散热效率更高,能快速有效的散热。
以上所述的仅是本实用新型的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。

Claims (15)

  1. 一种电子产品,包括扬声器箱和发热元件,其特征在于:还包括连接在所述扬声器箱与所述发热元件之间的导热件,所述扬声器箱包括具有出声孔的壳体、收容于所述壳体内的扬声器单体以及嵌设于所述壳体上的金属嵌件,所述壳体围成收容所述扬声器单体的收容空间,所述扬声器单体包括振膜,所述振膜将所述收容空间分隔成前腔与后腔,所述前腔经所述出声孔与外界连通,所述壳体开设有与所述前腔连通的第一通孔、以及与所述后腔连通的第二通孔;
    所述金属嵌件包括嵌设于所述壳体并对应覆盖所述第一通孔的第一加强板以及自所述第一加强板延伸并覆盖所述第二通孔的第二加强板,所述金属嵌件的边缘均嵌设于所述壳体;
    所述导热件的一端与所述第二加强板连接、另一端与所述发热元件连接,所述导热件将所述发热元件产生的热量传递至所述金属嵌件,所述金属嵌件将所述热量传导至所述前腔并由所述前腔内的空气传递至所述出声孔外。
  2. 根据权利要求1所述的电子产品,其特征在于,所述壳体包括与所述振膜正对且间隔设置的顶壁、与所述顶壁相对的底壁以及自所述顶壁边缘朝所述底壁弯折延伸的侧壁,所述第一通孔与所述第二通孔间隔开设于所述顶壁。
  3. 根据权利要求2所述的电子产品,其特征在于,所述壳体还包括自所述顶壁延伸至所述收容空间内的支撑壁,所述扬声器单体与所述支撑壁固定并与所述顶壁间隔设置,所述支撑壁间隔设置在所述前腔与所述后腔之间。
  4. 根据权利要求3所述的电子产品,其特征在于,所述出声孔形成在所述侧壁,所述振膜与正对所述振膜的所述顶壁之间间隔形成前声腔、所述壳体形成连通所述前声腔与所述出声孔的导声通道,所述前腔包括所述前声腔与所述导声通道。
  5. 根据权利要求4所述的电子产品,其特征在于,所述壳体还包括间隔所述导声通道与所述后腔的分隔壁,所述分隔壁自所述扬声器单体靠近所述出声孔的一侧朝所述侧壁延伸,所述分隔壁、所述顶壁及所述侧壁围成所述导声通道。
  6. 根据权利要求5所述的电子产品,其特征在于,所述第一加强板包括与所述振膜正对的主体部以及自所述主体部边缘朝所述底壁方向弯折并嵌设于所述壳体的弯折部,所述第二加强板自所述弯折部弯折延伸。
  7. 根据权利要求6所述的电子产品,其特征在于,至少部分所述弯折部嵌设于所述支撑壁。
  8. 根据权利要求7所述的电子产品,其特征在于,所述主体部与所述第二加强板均为平板状,所述金属嵌件一体成型。
  9. 根据权利要求4所述的电子产品,其特征在于,还包括固定所述扬声器箱与所述发热元件的机壳,所述侧壁与所述机壳对应贴合固定,所述机壳上贯穿设有与所述出声孔相对应连通的若干发声孔。
  10. 根据权利要求1-9任一项所述的电子产品,其特征在于,所述金属嵌件呈片状并与所述壳体注塑成型为一体。
  11. 根据权利要求1-9任一项所述的电子产品,其特征在于,所述导热件为实心的导热体。
  12. 根据权利要求1-9任一项所述的电子产品,其特征在于,所述导热件为内置有冷却液的导热管。
  13. 根据权利要求1-9任一项所述的电子产品,其特征在于,所述导热件包括叠设于所述第二加强板上的接触部和自所述接触部一侧延伸并与所述发热元件相连接的连接部。
  14. 根据权利要求13所述的电子产品,其特征在于,所述接触部的宽度大于所述连接部。
  15. 根据权利要求14所述的电子产品,其特征在于,所述接触部在所述第二加强板上的正投影覆盖所述第二加强板表面的2/3以上。
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