WO2022082852A1 - 电子设备及其扬声器模组 - Google Patents
电子设备及其扬声器模组 Download PDFInfo
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- WO2022082852A1 WO2022082852A1 PCT/CN2020/125863 CN2020125863W WO2022082852A1 WO 2022082852 A1 WO2022082852 A1 WO 2022082852A1 CN 2020125863 W CN2020125863 W CN 2020125863W WO 2022082852 A1 WO2022082852 A1 WO 2022082852A1
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- Prior art keywords
- sound
- speaker module
- cavity
- electronic device
- sound outlet
- Prior art date
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- 238000010168 coupling process Methods 0.000 claims abstract description 52
- 238000005859 coupling reaction Methods 0.000 claims abstract description 52
- 230000008878 coupling Effects 0.000 claims abstract description 42
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000001960 triggered effect Effects 0.000 abstract description 3
- 238000005192 partition Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Definitions
- the present invention relates to the technical field of sound and electricity, in particular to an electronic device and a speaker module thereof.
- the speaker module is an indispensable electro-acoustic transducer in electronic equipment, which mainly converts electrical energy into sound energy.
- a common speaker module vibrates and emits sound, the power consumption of the whole electronic device will rise sharply, resulting in a reduction in the battery life of the whole machine, thus affecting the user's experience.
- the amplitude of the speaker module is usually monitored. When the upper limit of the amplitude protection is triggered, the output of the intelligent power amplifier is limited to protect the speaker module.
- the speaker module is in the playback frequency band of 20Hz ⁇ 20kHz, under the same voltage, the amplitude of each frequency point is not the same, so some frequency domains are very easy to trigger the amplitude protection, while some frequency domains basically do not trigger the amplitude protection , which will inhibit the performance of the speaker module.
- the purpose of the present invention is to provide an electronic device and a speaker module thereof; the speaker module can improve the low frequency sensitivity of the miniature speaker and improve the overall sound quality; it can also reduce the cost, reduce the power consumption of the whole machine, and increase the battery life of the device; The performance of the acoustic device can be exerted to a greater extent.
- a speaker module comprising:
- a housing with an accommodating cavity, the housing is provided with a first sound outlet hole and a second sound outlet hole;
- a sound-generating unit is arranged in the accommodating cavity, and the sound-generating unit divides the accommodating cavity into a sound-guiding front cavity and a coupling rear cavity, and the sound-guiding front cavity passes through the first sound outlet and the external space of the electronic device connected;
- the bass tube is arranged in the back-coupling cavity and communicated with the back-coupling cavity, and the bass tube communicates with the internal space of the electronic device through the second sound outlet.
- the first sound outlet hole and the second sound outlet hole are disposed opposite to two side walls of the housing.
- the housing includes a front cover and a rear cover
- the front cover includes a cover plate, a bottom plate and a side plate arranged around the bottom plate, and the first sound outlet hole is provided on the side plate
- the bottom plate has a receiving hole, the sounding unit is arranged in the receiving hole, the cover plate is correspondingly covered under the receiving hole, and a space between the sounding unit and the cover plate is formed.
- the sound-guiding front cavity; the rear cover is arranged on the side of the front cover away from the cover plate, and the rear cover, the side plate, the bottom plate and the sound-emitting unit are surrounded to form the coupling rear cavity.
- the bottom plate is provided with a sound guide groove at a position corresponding to the second sound outlet hole, the sound guide groove is communicated with the coupling rear cavity, and the groove wall of the sound guide groove is connected to the The back cover surrounds and forms the bass tube.
- the hole wall of the receiving hole has a first step portion extending toward the opposite side, and the bottom edge of the sound-emitting unit is connected to the first step portion.
- the hole wall of the receiving hole is provided with a groove recessed toward the side away from the receiving hole, and a gap is formed between the groove wall of the groove and the sounding unit.
- one end of the side plate of the front cover away from the cover plate has a second step portion extending inwardly, and the bottom edge of the rear cover is connected to the second step portion.
- the housing is provided with a mounting portion for mounting inside the electronic device, and the mounting portion is provided with mounting holes.
- the sound generating unit is at least one of a moving coil speaker, a MEMS speaker, a moving coil and a moving iron earphone core.
- An electronic device includes a device body and the speaker module, wherein the speaker module is arranged in the device body; the device body is provided with a sound hole, and the first sound hole of the speaker module Corresponding to the sound outlet, the sound-guiding front cavity of the speaker module is communicated with the external space of the device body through the first sound outlet and the sound outlet, and the coupling rear cavity of the speaker module It communicates with the inner space of the device body through the second sound outlet hole.
- the beneficial effect of the present invention is that a bass tube is arranged in the coupling cavity, and the bass tube is communicated with the internal space of the electronic device through the second sound outlet, so that the coupling between the coupling cavity of the speaker module and the internal space of the electronic device can be increased. It is equivalent to expanding the coupling back cavity of the speaker module, which can improve the low-frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving product performance. Since the low-frequency sensitivity of the speaker module is improved, the voltage output of the power amplifier required to emit low-frequency sound of the same sound pressure level is smaller, which can reduce the performance requirements of the power amplifier, thereby reducing the cost and reducing the power of electronic equipment. increase the battery life of electronic devices.
- the acoustic impedance of the entire speaker module can be reduced. Therefore, when the entire system has the same input signal, the acoustic impedance of the speaker module is higher. Smaller, more sound output can be obtained, which can also reduce costs, reduce power consumption of electronic devices, and increase battery life of electronic devices.
- the coupling between the coupling cavity of the speaker module and the internal space of the electronic device can be increased, thereby suppressing the speaker module in
- the amplitude at a certain frequency such as the amplitude at the resonance frequency, makes it more difficult for the frequency band to trigger the amplitude protection of the smart power amplifier, so that the smart power amplifier will not limit the overall voltage output, so that the speaker module can be used to a greater extent. performance.
- FIG. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present invention.
- FIG. 2 is an exploded view of the structure of the speaker module shown in FIG. 1;
- FIG. 3 is a schematic structural diagram of the front cover of the speaker module shown in FIG. 2;
- FIG. 4 is a top view of the speaker module shown in FIG. 1;
- FIG. 5 is a cross-sectional view of the speaker module shown in FIG. 4 along A-A;
- FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
- FIG. 7 is a schematic diagram of the internal structure of the electronic device shown in FIG. 6;
- FIG. 8 is an electro-acoustic analog diagram of a speaker module according to an embodiment of the present invention.
- FIG. 9 is an acoustic performance diagram of a speaker module according to an embodiment of the present invention.
- FIG. 2 shows an exploded view of the speaker module shown in FIG. 1
- FIG. 5 shows a cross-sectional view of the speaker module shown in FIG. 4 along A-A
- FIG. 7 shows A schematic diagram of the internal structure of the electronic device shown in FIG. 6 is shown.
- the speaker module provided by an embodiment of the present invention includes a casing 10 , a sound generating unit 20 and a bass tube 30 .
- the housing 10 has an accommodating cavity 13
- the sound generating unit 20 is arranged in the accommodating cavity 13 , and divides the accommodating cavity 13 into a sound-guiding front cavity 131 and a coupling rear cavity 132 .
- the bass tube 30 is arranged in the back-coupling cavity 132 and communicates with the back-coupling cavity 132 .
- the housing 10 is provided with a first sound outlet 14 and a second sound outlet 15.
- the first sound outlet 14 is used to communicate the sound guide front cavity 131 with the external space of the electronic device 40
- the second sound outlet 15 is used to communicate The inner space of the bass tube 30 and the electronic device 40 .
- the electronic devices may be electronic products such as mobile phones, earphones, and computers.
- the internal space of the electronic device 40 refers to the internal space of the electronic device 40 in terms of physical structure, that is, the internal space enclosed by the housing of the electronic device 40 .
- the outer space of the electronic device 40 is the outer space of the electronic device 40 on the physical structure, that is, the space where the outer surface of the electronic device 40 is in contact, such as the atmospheric environment space.
- a bass tube 30 is arranged in the coupling rear cavity 132, and the bass tube 30 is communicated with the internal space of the electronic device 40 through the second sound outlet 15, so that the coupling rear cavity 132 of the speaker module and the electronic device can be increased.
- the coupling of the internal space of 40 is equivalent to expanding the coupling rear cavity 132 of the speaker module, which can improve the low frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving product performance. Since the low-frequency sensitivity of the speaker module is improved, the voltage output of the power amplifier required to emit low-frequency sounds of the same sound pressure level is smaller, which can reduce the performance requirements of the power amplifier, thereby reducing the cost and reducing the power consumption of the electronic device 40.
- Power consumption increases the battery life of the electronic device 40 .
- the acoustic impedance of the entire speaker module can be reduced. Therefore, when the entire system has the same input signal, the acoustic impedance of the speaker module can be reduced. The smaller the impedance, the more sound output can be obtained, thereby reducing the cost, reducing the power consumption of the electronic device 40 and increasing the battery life of the electronic device 40 .
- the coupling between the rear coupling cavity 132 of the speaker module and the internal space of the electronic device 40 can be increased, In this way, the amplitude of the speaker module at a certain frequency point, such as the amplitude at the resonance frequency, is suppressed, making it more difficult to trigger the amplitude protection of the intelligent power amplifier in this frequency band, so that the intelligent power amplifier will not limit the overall voltage output, so it can be larger To maximize the performance of the speaker module.
- the bass tube 30 has a certain cross-sectional area and length.
- the cross-sectional area and length of the bass tube 30 are determined according to the size of the sound generating unit 20 and the coupling back cavity 132.
- the speaker can be The driving force shared by both ends of the module can be the largest.
- the length, width and height of the sounding unit 20 are respectively 12mm, 16mm and 2.5mm
- the size of the coupling rear cavity 132 is 0.6cc
- the length, width and height of the bass tube 30 are respectively 2mm, 3mm and 2.5mm. 9mm.
- the first sound outlet hole 14 and the second sound outlet hole 15 are respectively disposed opposite to two side walls of the housing 10 . It can be understood that the first sound outlet hole 14 and the second sound outlet hole 15 are arranged opposite to each other, for example, the first sound outlet hole 14 and the second sound outlet hole 15 are arranged opposite and staggered. In this way, the coupling between the back-coupling cavity 132 of the speaker module and the internal space of the electronic device 40 can be effectively improved, thereby effectively reducing the acoustic impedance of the entire speaker module, so that when the entire system has the same input signal, the speaker The lower the acoustic impedance of the module, the more sound output is obtained.
- the first sound outlet hole 14 and the second sound outlet hole 15 are arranged opposite and staggered.
- the housing 10 is a split structure. Specifically, the housing 10 includes a front cover 11 and a rear cover 12 , and the rear cover 12 is covered on the front cover 11 , and together with the front cover 11 is formed into an accommodating cavity 13 .
- the front cover 11 includes a cover plate 111 , a bottom plate 112 and a side plate 113 disposed around the bottom plate 112 .
- the first sound outlet 14 and the second sound outlet 15 are provided on the side plate 113 .
- the bottom plate 112 has a receiving hole 1121 , the sounding unit 20 is arranged in the receiving hole 1121 , the cover plate 111 is correspondingly covered under the receiving hole 1121 , and the sound guiding front cavity 131 is formed between the sounding unit 20 and the cover plate 111 at intervals.
- the rear cover 12 is covered on the side of the front cover 11 away from the cover plate 111 .
- the rear cover 12 , the side plate 113 , the bottom plate 112 and the sounding unit 20 are surrounded to form the above-mentioned coupling rear cavity 132 .
- the housing 10 may also be a one-piece structure.
- the bottom plate 112 is provided with a sound guide groove at the position corresponding to the second sound outlet 15 , the sound guide groove is communicated with the coupling rear cavity 132 , and the groove wall of the sound guide groove is surrounded by the rear cover 12 to form a sound guide groove. Bass tube 30. In this way, there is no need to set additional components, the structure is simple, and the production and processing are convenient.
- the hole wall of the receiving hole 1121 has a first step portion 1122 extending toward the opposite side.
- the size of the first step portion 1122 may be set according to the size of the sound generating unit 20, which is not specifically limited herein.
- the first step portion 1122 can support the sound generating unit 20, which facilitates the installation of the sound generating unit 20 in the housing 10 and realizes the assembly of the speaker module quickly.
- the bottom edge of the sounding unit 20 is connected to the first step portion 1122 by ultrasonic welding, or the bottom edge of the sounding unit 20 is connected to the first step portion 1122 by gluing, so that the sounding unit 20 can be connected to the first step portion 1122.
- 20 is sealed and fixed in the casing 10, so as to separate the accommodating cavity 13 of the casing 10 into a sound-guiding front cavity 131 and a coupling rear cavity 132 which are not communicated with each other.
- the bottom edge of the sound generating unit 20 may also be connected to the first step portion 1122 in other manners, which is not limited thereto.
- the hole wall of the receiving hole 1121 is provided with a groove 1123 recessed away from the receiving hole 1121 , and a groove 1123 is formed between the groove wall of the groove 1123 and the sounding unit 20 . interval.
- fingers can be inserted into the grooves 1123, so that the sounding unit 20 can be easily taken out from the receiving hole 1121, the structure is simple, and the use is convenient.
- the number of the grooves 1123 can be set according to the usage requirements, for example, there are one or more than two grooves 1123 .
- the location of the groove 1123 can also be set according to usage requirements.
- the groove 1123 can be set on a side of the receiving hole 1121 , or the groove 1123 can be set at a corner of the receiving hole 1121 .
- the side wall of the groove 1123 is arc-shaped. In this way, on the basis of not hurting fingers, it is convenient to take out the sounding unit 20 from the receiving hole 1121 of the casing 10 .
- the sidewalls of the grooves 1123 may also have other shapes.
- the receiving hole 1121 is square.
- the side walls of the grooves 1123 are arc-shaped; and there are four grooves 1123 , and the four grooves 1123 are respectively set at the four corners of the square receiving hole 1121 . In this way, it is convenient to take out the sounding unit 20 from the receiving hole 1121 .
- one end of the side plate 113 of the front cover 11 away from the cover plate 111 has a second step portion 1131 extending inward.
- the second step portion 1131 can support the rear cover 12, which facilitates the installation of the rear cover 12 on the front cover 11 and realizes the assembly of the speaker module quickly.
- the bottom edge of the back cover 12 is connected to the second step portion 1131 by ultrasonic welding, or the bottom edge of the back cover 12 is connected to the second step portion 1131 by gluing, so that the back cover can be connected to the second step portion 1131.
- 12 is sealed and fixed on the front cover 11 to form the above-mentioned accommodating cavity 13 .
- the bottom edge of the back cover 12 may also be connected to the second step portion 1131 in other manners, which is not limited thereto.
- the housing 10 is provided with a mounting portion 16 for mounting inside the electronic device 40 , and the mounting portion 16 is provided with a mounting hole 161 .
- the mounting portion 16 is protruded from the side plate 113 of the front cover 11 .
- the speaker module is placed in the electronic device 40 , and fasteners such as screws are inserted into the installation holes 161 , so that the speaker module can be installed and fixed in the electronic device 40 .
- the mounting portion 16 of the speaker module can also be welded into the electronic device 40 , or the speaker module can be glued into the electronic device 40 .
- the first sound outlet 14 of the speaker module can be arranged close to the sound outlet 411 of the electronic device 40, so that the sound producing unit 20 can quickly reach the electronic device through the first sound outlet 14 and the sound outlet 411.
- the sound is radiated externally, reducing the coupling between the sound-guiding front cavity 131 of the speaker and the internal space of the electronic device 40, thereby ensuring the sound quality effect; on the other hand, the speaker module can be firmly installed in the electronic device 40 to ensure that the speaker module is installed properly stability.
- FIG. 3 , FIG. 5 and FIG. 7 six mounting parts 16 are provided, and two mounting parts 16 are provided at intervals on the side wall of the casing 10 opposite to the first sound outlet hole 14 , The other two mounting portions 16 are arranged at intervals on the left side wall of the side wall where the first sound outlet 14 is located, and the other two mounting portions 16 are arranged at intervals on the right side wall of the side wall where the first sound outlet hole 14 is located.
- the speaker module can be firmly installed in the electronic device 40 to ensure the stability of the installation of the speaker module.
- the sound generating unit 20 is at least one of a moving coil speaker, a MEMS (Micro-Electro-Mechanical System) speaker, a moving coil and a moving iron earphone core. It should be noted that the sound generating unit 20 may be one of the above-mentioned types, but is not limited to the speaker types listed above, and the sound generating unit 20 only needs to be capable of generating sound.
- MEMS Micro-Electro-Mechanical System
- the sound generating unit 20 of the speaker module is a moving coil type micro-speaker
- the sound generating unit 20 is square
- the length, width and height of the square sound generating unit 20 are respectively 12mm, 16mm and 2.5mm.
- the sounding unit 20 can also be in other shapes, such as a circle, etc., and the size of the sounding unit 20 can be set according to actual needs, which is not limited thereto.
- the electronic device provided by the present invention includes a device body 41 and the speaker module of any of the above-mentioned embodiments, and the speaker module is arranged in the device body 41 .
- the device body 41 is provided with a sound outlet 411
- the first sound outlet 14 of the speaker module is correspondingly arranged with the sound outlet 411
- the sound guide front cavity 131 of the speaker module passes through the first sound outlet 14 and the sound outlet 411 and
- the external space of the device body 41 is communicated
- the coupling rear cavity 132 of the speaker module is communicated with the internal space of the device body 41 through the second sound outlet 15 .
- the sound guiding front cavity 131 of the speaker module communicates with the external space of the electronic device 40 through the first sound outlet 14 and the sound outlet 411, and the bass tube 30 passes through the first sound outlet 14 and the sound outlet 411.
- the two sound holes 15 communicate with the inner space of the electronic device 40 , and the inner space and the outer space of the electronic device 40 are isolated by the device body 41 .
- a bass tube 30 is arranged in the coupling rear cavity 132, and the bass pipe 30 is communicated with the internal space of the electronic equipment 40 through the second sound outlet 15, so that the coupling rear cavity 132 of the speaker module and the electronic equipment can be increased.
- the coupling of the internal space of 40 is equivalent to expanding the coupling rear cavity 132 of the speaker module, which can improve the low frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving product performance. Since the low-frequency sensitivity of the speaker module is improved, the voltage output of the power amplifier required to emit low-frequency sounds of the same sound pressure level is smaller, which can reduce the performance requirements of the power amplifier, thereby reducing the cost and reducing the power consumption of the electronic device 40.
- Power consumption increases the battery life of the electronic device 40 .
- the acoustic impedance of the entire speaker module can be reduced. Therefore, when the entire system has the same input signal, the acoustic impedance of the speaker module can be reduced. The smaller the impedance, the more sound output can be obtained, thereby reducing the cost, reducing the power consumption of the electronic device 40 and increasing the battery life of the electronic device 40 .
- the coupling between the rear coupling cavity 132 of the speaker module and the internal space of the electronic device 40 can be increased, In this way, the amplitude of the speaker module at a certain frequency point, such as the amplitude at the resonance frequency, is suppressed, making it more difficult to trigger the amplitude protection of the intelligent power amplifier in this frequency band, so that the intelligent power amplifier will not limit the overall voltage output, so it can be larger To maximize the performance of the speaker module.
- the electronic device 40 is a mobile phone.
- the device body 41 is a mobile phone casing, and the mobile phone casing is provided with a sound outlet 411 .
- the speaker module of any of the above-mentioned embodiments is installed in the casing of the mobile phone, and the first sound outlet 14 of the speaker module is arranged corresponding to the sound outlet 411 of the casing of the mobile phone, so that the sound-guiding front cavity 131 of the speaker module passes through the first sound hole 131 of the mobile phone casing.
- the sound outlet 14 and the sound outlet 411 communicate with the outer space of the mobile phone case.
- the electronic device 40 can also be a product such as an earphone, a computer, or the like.
- FIG. 9 shows the acoustic performance diagram of the speaker module of the present invention.
- the acoustic performance graph is a comparison of the frequency response curves at a distance of 10 cm from the sound outlet 411 under the same input voltage conditions. Without the bass tube 30, the bass sensitivity of the speaker module is low, and the amplitude protection of the intelligent power amplifier is easily triggered at the resonance frequency, resulting in a decrease in the overall volume.
- the low-frequency sensitivity of the speaker module is significantly improved, and the predetermined working amplitude and output sound pressure level can be achieved even at a lower voltage, saving energy consumption; and at the resonance frequency, suppressing the The amplitude of the miniature speaker module makes it more difficult to trigger the amplitude protection of the intelligent power amplifier in this frequency band, and maximizes the performance of the acoustic device.
- first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with “first”, “second” may expressly or implicitly include at least one of that feature.
- plurality means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.
- the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit.
- installed may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit.
- a first feature "on” or “under” a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch.
- the first feature being “above”, “over” and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
- the first feature being “below”, “below” and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
Abstract
本发明提供了电子设备及其扬声器模组。扬声器模组包括壳体、发声单元及低音管。壳体具有容纳腔，壳体设有第一出声孔及第二出声孔。发声单元设于容纳腔，并将容纳腔分隔为导声前腔及耦合后腔，导声前腔通过第一出声孔与电子设备的外部空间连通。低音管设于耦合后腔内，低音管通过第二出声孔与电子设备的内部空间连通。如此，可提高扬声器模组的低频灵敏度，进而提升整体音质。并且，还可减小发声单元工作在最大振幅下所需的工作电压，降低对功率放大器的性能需求，减小电子设备的功耗，增加电子设备的续航时间。此外，在共振频率处，能够抑制扬声器模组的振幅，使该频段不容易触发智能功放的振幅保护，更好地发挥声学器件的性能。
Description
本发明涉及声电技术领域，特别是涉及一种电子设备及其扬声器模组。
随着移动互联网时代的到来，智能移动设备的数量不断上升。在众多移动设备中，智能手机已成为人们生活中必不可少的电子设备，但是智能手机的声音重放一直无法达到令用户满意的声学体验。
扬声器模组是电子设备中的必不可少的电声换能器件，其主要将电能转换为声能。常见的扬声器模组在振动发声的过程中，电子设备整机的功耗会急剧上升，导致整机的续航时间减少，从而影响用户的体验。另外，使用智能功放时，通常会对扬声器模组的振幅进行监控。当触发到振幅保护的上限时，对智能功放的输出进行限制，以此保护扬声器模组。但是，由于扬声器模组在20Hz~20kHz的重放频带内，同电压下，每个频点的振幅并不相同，导致有些频域非常容易触发振幅保护，而有些频域基本不会触发振幅保护，这样会抑制扬声器模组的性能发挥。
本发明的目的在于提供一种电子设备及其扬声器模组；扬声器模组能够提高微型扬声器的低频灵敏度，提升整体音质；还能够降低成本减小整机功耗，增加设备续航时间；同时，还能够更大程度的发挥声学器件的性能。
本发明的技术方案如下：
一种扬声器模组，包括：
壳体，具有容纳腔，所述壳体设有第一出声孔及第二出声孔；
发声单元，设于所述容纳腔，所述发声单元将所述容纳腔分隔为导声前腔及耦合后腔，所述导声前腔通过所述第一出声孔与电子设备的外部空间连通；及
低音管，设于所述耦合后腔内，并与所述耦合后腔连通，所述低音管通过所述第二出声孔与电子设备的内部空间连通。
下面进一步对技术方案进行说明：
在其中一个实施例中，所述第一出声孔与所述第二出声孔相对设于所述壳体的两个侧壁。
在其中一个实施例中，所述壳体包括前盖及后盖，所述前盖包括盖板、底板及围绕所述底板设置的侧板，所述第一出声孔设于所述侧板；所述底板具有收容孔，所述发声单元设于所述收容孔，所述盖板对应盖设于所述收容孔的下方，且所述发声单元与所述盖板之间间隔形成有所述导声前腔；所述后盖盖设于所述前盖远离所述盖板的一侧，所述后盖、侧板、底板及发声单元围设形成所述耦合后腔。
在其中一个实施例中，所述底板对应所述第二出声孔的位置设有导音槽，所述导音槽与所述耦合后腔连通，所述导音槽的槽壁与所述后盖围设形成所述低音管。
在其中一个实施例中，所述收容孔的孔壁具有朝向对侧延伸的第一台阶部，所述发声单元的底部边缘连接于所述第一台阶部。
在其中一个实施例中，所述收容孔的孔壁设有向远离所述收容孔一侧凹陷的凹槽，且所述凹槽的槽壁与所述发声单元之间形成有间隔。
在其中一个实施例中，所述前盖的侧板远离所述盖板的一端具有向内侧延伸的第二台阶部，所述后盖的底部边缘连接于所述第二台阶部。
在其中一个实施例中，所述壳体设有用于安装在电子设备内部的安装部，所述安装部设有安装孔。
在其中一个实施例中，所述安装部设有至少两个，其中两个所述安装部相对设置，且所述安装部位于第一出声孔相邻的两个侧壁。
在其中一个实施例中，所述发声单元为动圈式扬声器、MEMS扬声器、动圈及动铁式耳机芯中的至少一种。
一种电子设备，包括设备本体及所述的扬声器模组，所述扬声器模组设于所述设备本体内；所述设备本体设有出音孔，所述扬声器模组的第一出声孔与所述出音孔对应设置，所述扬声器模组的导声前腔通过所述第一出声孔及出音孔与所述设备本体的外部空间连通，所述扬声器模组的耦合后腔通过所述第二出声孔与所述设备本体的内部空间连通。
本发明的有益效果在于：在耦合后腔内设置低音管，且低音管通过第二出声孔与电子设备的内部空间连通，这样可增加扬声器模组的耦合后腔与电子设备内部空间的耦合性，相当于扩大了扬声器模组的耦合后腔，如此可提高扬声器模组的低频灵敏度，进而提升整体音质，从而提升产品性能。由于扬声器模组的低频灵敏度提高，则发出相同声压级的低频声音时所需要的功率放大器电压输出就越小，如此可降低对功率放大器的性能需求，从而降低成本，减小电子设备的功耗，增加电子设备的续航时间。并且，增加扬声器模组的耦合后腔与电子设备内部空间的耦合性后，可降低整个扬声器模组的声学阻抗，因此在整个系统具有相同输入信号的情况下，该扬声器模组的声学阻抗更小，得到的声音的输出就更多，从而也可降低成本，减小电子设备的功耗，增加电子设备的续航时间。此外，通过设置低音管，并使低音管通过第二出声孔与电子设备的内部空间连通，这样可以增加扬声器模组的耦合后腔与电子设备内部空间的耦合性，从而抑制扬声器模组在某个频点下的振幅，例如共振频率下的振幅，使得该频段更不容易触发智能功放的振幅保护，这样智能功放也不会限制整体的电压输出，如此可更大程度的发挥扬声器模组的性能。
图1为本发明中一实施例的扬声器模组的结构示意图；
图2为图1所示的扬声器模组的结构分解图；
图3为图2所示的扬声器模组的前盖的结构示意图；
图4为图1所示的扬声器模组的俯视图；
图5为图4所示的扬声器模组沿A-A的剖视图；
图6为本发明中一实施例的电子设备的结构示意图；
图7为图6所示的电子设备的内部结构示意图；
图8为本发明中一实施例的扬声器模组的电力声类比图；
图9为本发明中一实施例的扬声器模组的声学性能图。
附图标记说明：
10、壳体；11、前盖；111、盖板；112、底板；1121、收容孔；1122、第一台阶部；1123、凹槽；113、侧板；1131、第二台阶部；12、后盖；13、容纳腔；131、导声前腔；132、耦合后腔；14、第一出声孔；15、第二出声孔；16、安装部；161、安装孔；20、发声单元；30、低音管；40、电子设备；41、设备本体；411、出音孔。
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。
参阅图2、图5和图7，图2示出了图1所示的扬声器模组的结构分解图，图5示出了图4所示的扬声器模组沿A-A的剖视图，图7示出了图6所示的电子设备的内部结构示意图。本发明一实施例提供的扬声器模组，包括壳体10、发声单元20及低音管30。壳体10具有容纳腔13，发声单元20设于容纳腔13，并将容纳腔13分隔为导声前腔131及耦合后腔132。低音管30设于耦合后腔132内，并与耦合后腔132连通。壳体10设有第一出声孔14及第二出声孔15，第一出声孔14用于连通导声前腔131与电子设备40的外部空间，第二出声孔15用于连通低音管30与电子设备40的内部空间。
需要说明的是，电子设备可以是手机、耳机、电脑等电子产品。电子设备40的内部空间是指电子设备40在物理结构上的内部空间，即电子设备40的壳体围成的内部空间。电子设备40的外部空间是电子设备40在物理结构上的外部空间，即电子设备40外表面所接触的空间，例如大气环境空间。
上述扬声器模组，在耦合后腔132内设置低音管30，且低音管30通过第二出声孔15与电子设备40的内部空间连通，这样可增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性，相当于扩大了扬声器模组的耦合后腔132，如此可提高扬声器模组的低频灵敏度，进而提升整体音质，从而提升产品性能。由于扬声器模组的低频灵敏度提高，则发出相同声压级的低频声音时所需要的功率放大器电压输出就越小，如此可降低对功率放大器的性能需求，从而降低成本，减小电子设备40的功耗，增加电子设备40的续航时间。并且，增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性后，可降低整个扬声器模组的声学阻抗，因此在整个系统具有相同输入信号的情况下，该扬声器模组的声学阻抗更小，得到的声音的输出就更多，从而也可降低成本，减小电子设备40的功耗，增加电子设备40的续航时间。此外，通过设置低音管30，并使低音管30通过第二出声孔15与电子设备40的内部空间连通，这样可以增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性，从而抑制扬声器模组在某个频点下的振幅，例如共振频率下的振幅，使得该频段更不容易触发智能功放的振幅保护，这样智能功放也不会限制整体的电压输出，如此可更大程度的发挥扬声器模组的性能。
需要说明的是，参阅图3、图4和图5，低音管30具有一定截面积和长度。并且，低音管30的截面积及长度是根据发声单元20及耦合后腔132的大小来确定的，具体可参照图8中的扬声器模组的电力声类比图，通过设计不同的参数，使得扬声器模组两端分得的驱动力最大即可。
具体到本实施例中，发声单元20的长度、宽度及高度分别为12mm、16mm和2.5mm，耦合后腔132的大小为0.6cc，低音管30的长度、宽度及高度分别为2mm、3mm和9mm。
在一个实施例中，参阅图1、图3和图5，第一出声孔14与第二出声孔15分别相对设于壳体10的两个侧壁。可以理解的是，第一出声孔14与第二出声孔15相对设置，例如第一出声孔14与第二出声孔15相对且错开设置。如此，可有效地提高扬声器模组的耦合后腔132与电子设备40内部空间的耦合性，从而有效地降低整个扬声器模组的声学阻抗，使得在整个系统具有相同输入信号的情况下，该扬声器模组的声学阻抗更小，得到的声音的输出就更多。
具体到本实施例中，第一出声孔14与第二出声孔15相对且错开设置。
在一个实施例中，参阅图2、图3和图5，壳体10为分体式结构。具体地，壳体10包括前盖11及后盖12，后盖12盖设在前盖11，并与前盖11共同围设成容纳腔13。前盖11包括盖板111、底板112及围绕底板112设置的侧板113，第一出声孔14及第二出声孔15设于侧板113。底板112具有收容孔1121，发声单元20设于收容孔1121，盖板111对应盖设于收容孔1121的下方，且发声单元20与盖板111之间间隔形成有上述的导声前腔131。后盖12盖设于前盖11远离盖板111的一侧，后盖12、侧板113、底板112及发声单元20围设形成上述的耦合后腔132。如此，可形成上述的扬声器模组，结构简单，便于生产加工。当然，在其它实施例中，壳体10也可为一体式结构。
进一步地，参阅图2和图5，底板112对应第二出声孔15的位置设有导音槽，导音槽与耦合后腔132连通，导音槽的槽壁与后盖12围设形成低音管30。如此，无需设置额外的部件，结构简单，便于生产加工。
在一个实施例中，参阅图2、图3和图5，收容孔1121的孔壁具有朝向对侧延伸的第一台阶部1122。具体地，第一台阶部1122的尺寸可以根据发声单元20的尺寸进行设置，在此不进行具体限定。通过设置第一台阶部1122，第一台阶部1122能够支撑发声单元20，这样便于将发声单元20安装在壳体10内，快速地实现扬声器模组的装配。
进一步地，通过超声波焊接的方式将发声单元20的底部边缘连接在第一台阶部1122，或者采用打胶的方式将发声单元20的底部边缘连接在第一台阶部1122，这样便可将发声单元20密封固定在壳体10内，从而将壳体10的容纳腔13分隔为互不连通的导声前腔131及耦合后腔132。当然，在其它实施例中，也可采用其它的方式将发声单元20的底部边缘连接在第一台阶部1122，不以此为限。
在一个实施例中，参阅图2、图3和图5，收容孔1121的孔壁设有向远离收容孔1121凹陷的凹槽1123，且凹槽1123的槽壁与发声单元20之间形成有间隔。如此，手指可插入凹槽1123内，便于从收容孔1121处取出发声单元20，结构简单，使用便捷。
需要说明的是，参阅图3，凹槽1123的数量可根据使用需求进行设置，例如凹槽1123设有一个、两个以上。并且，凹槽1123的设置位置也可根据使用需求进行设置，例如凹槽1123可设于收容孔1121的某条边，或者凹槽1123设于收容孔1121的边角处。
进一步地，参阅图3和图5，凹槽1123的侧壁为弧形。如此，在不伤害手指的基础上，便于从壳体10的收容孔1121处取出发声单元20。当然，在其它实施例中，凹槽1123的侧壁也可为其它形状。
具体到本实施例中，收容孔1121为方形。凹槽1123的侧壁为弧形；且凹槽1123设有四个，四个凹槽1123分别设于方形收容孔1121的四角处。如此，便于从收容孔1121处取出发声单元20。
在一个实施例中，参阅图2、图3和图5，前盖11的侧板113远离盖板111的一端具有向内侧延伸的第二台阶部1131。通过设置第二台阶部1131，第二台阶部1131能够支撑后盖12，这样便于将后盖12安装在前盖11上，快速地实现扬声器模组的装配。
进一步地，通过超声波焊接的方式将后盖12的底部边缘连接在第二台阶部1131，或者采用打胶的方式将后盖12的底部边缘连接在第二台阶部1131，这样便可将后盖12密封固定在前盖11上，形成上述的容纳腔13。当然，在其它实施例中，也可采用其它的方式将后盖12的底部边缘连接在第二台阶部1131，不以此为限。
在一个实施例中，参阅图1和图7，壳体10设有用于安装在电子设备40内部的安装部16，安装部16设有安装孔161。具体地，安装部16凸设于前盖11的侧板113。安装时，将该扬声器模组放置于电子设备40内，并将螺钉等紧固件穿设在安装孔161内，这样便可将扬声器模组安装固定在电子设备40内。当然，在其它实施例中，也可将扬声器模组的安装部16焊接在电子设备40内，或者将扬声器模组胶粘接在电子设备40内。
进一步地，参阅图3、图5和图7，安装部16设有至少两个，其中两个安装部16相对设置，且安装部16位于第一出声孔14相邻的两个侧部。如此，一方面，使得扬声器模组的第一出声孔14能够靠近电子设备40的出音孔411设置，这样发声单元20可通过第一出声孔14及出音孔411快速地向电子设备外辐射声音，减少扬声器的导声前腔131与电子设备40内部空间的耦合，从而保证音质效果；另一方面，可将扬声器模组牢固地安装在电子设备40内，保证扬声器模组安装的稳定性。
具体到本实施例中，参阅图3、图5和图7，安装部16设有六个，其中两个安装部16间隔地设于壳体10与第一出声孔14相对的侧壁，其中另外两个安装部16间隔地设于第一出声孔14所在侧壁的左侧壁，另外两个安装部16间隔地设于第一出声孔14所在侧壁的右侧壁。如此，便可将扬声器模组牢固地安装在电子设备40内，保证扬声器模组安装的稳定性。
在一个实施例中，发声单元20为动圈式扬声器、MEMS（微机电系统，Micro-Electro-Mechanical System）扬声器、动圈及动铁式耳机芯中的至少一种。需要说明的是，发声单元20可为上述的其中一种，但也不限于上述列举的扬声器类型，发声单元20只要能够发出声音即可。
具体到本实施例中，扬声器模组的发声单元20为动圈式微型扬声器，发声单元20为方形，方形发声单元20的长度、宽度及高度分别为12mm、16mm和2.5mm。当然，发声单元20也可为其它形状，例如圆形等，并且发声单元20的尺寸可根据实际需求进行设置，不以此为限。
参阅图2、图5、图6和图7，本发明提供的电子设备，包括设备本体41及上述任一实施例的扬声器模组，扬声器模组设于设备本体41内。设备本体41设有出音孔411，扬声器模组的第一出声孔14与出音孔411对应设置，扬声器模组的导声前腔131通过第一出声孔14及出音孔411与设备本体41的外部空间连通，扬声器模组的耦合后腔132通过第二出声孔15与设备本体41的内部空间连通。
需要说明的是，当电子设备40使用外放功能时，扬声器模组的导声前腔131通过第一出声孔14及出音孔411与电子设备40的外部空间连通，低音管30通过第二出声孔15与电子设备40的内部空间连通，并且电子设备40的内部空间和外部空间通过设备本体41进行隔离。
上述的电子设备，在耦合后腔132内设置低音管30，且低音管30通过第二出声孔15与电子设备40的内部空间连通，这样可增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性，相当于扩大了扬声器模组的耦合后腔132，如此可提高扬声器模组的低频灵敏度，进而提升整体音质，从而提升产品性能。由于扬声器模组的低频灵敏度提高，则发出相同声压级的低频声音时所需要的功率放大器电压输出就越小，如此可降低对功率放大器的性能需求，从而降低成本，减小电子设备40的功耗，增加电子设备40的续航时间。并且，增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性后，可降低整个扬声器模组的声学阻抗，因此在整个系统具有相同输入信号的情况下，该扬声器模组的声学阻抗更小，得到的声音的输出就更多，从而也可降低成本，减小电子设备40的功耗，增加电子设备40的续航时间。此外，通过设置低音管30，并使低音管30通过第二出声孔15与电子设备40的内部空间连通，这样可以增加扬声器模组的耦合后腔132与电子设备40内部空间的耦合性，从而抑制扬声器模组在某个频点下的振幅，例如共振频率下的振幅，使得该频段更不容易触发智能功放的振幅保护，这样智能功放也不会限制整体的电压输出，如此可更大程度的发挥扬声器模组的性能。
在一个实施例中，该电子设备40为手机。具体地，设备本体41为手机外壳，手机外壳设有出音孔411。上述任一实施例的扬声器模组安装在手机外壳内，且扬声器模组的第一出声孔14与手机外壳的出音孔411对应设置，使扬声器模组的导声前腔131通过第一出声孔14及出音孔411与手机外壳的外部空间连通。当然，在其它实施例中，电子设备40也可为耳机、电脑等产品。
参阅图9，图9示出了本发明扬声器模组的声学性能图。该声学性能曲线图是在同等输入电压条件下，出音孔411距离10cm处的频率响应曲线对比。在没有低音管30的条件下，扬声器模组的低音灵敏度较低、并且在共振频率的地方容易触发智能功放的振幅保护，导致整体音量降低。在有低音管30的条件下，扬声器模组的低频灵敏度显著提高，在较低电压的情况下也可以达到预定的工作振幅和输出声压级，节约能耗；并且在共振频率处，抑制了微型扬声器模组的振幅，使得该频段更不容易触发智能功放的振幅保护，更大程度的发挥声学器件的性能。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。
Claims (11)
- 一种扬声器模组，其特征在于，包括：壳体，具有容纳腔，所述壳体设有第一出声孔及第二出声孔；发声单元，设于所述容纳腔，所述发声单元将所述容纳腔分隔为导声前腔及耦合后腔，所述导声前腔通过所述第一出声孔与电子设备的外部空间连通；及低音管，设于所述耦合后腔内，并与所述耦合后腔连通，所述低音管通过所述第二出声孔与电子设备的内部空间连通。
- 根据权利要求1所述的扬声器模组，其特征在于，所述第一出声孔与所述第二出声孔相对设于所述壳体的两个侧壁。
- 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括前盖及后盖，所述前盖包括盖板、底板及围绕所述底板设置的侧板，所述第一出声孔设于所述侧板；所述底板具有收容孔，所述发声单元设于所述收容孔，所述盖板对应盖设于所述收容孔的下方，且所述发声单元与所述盖板之间间隔形成有所述导声前腔；所述后盖盖设于所述前盖远离所述盖板的一侧，所述后盖、侧板、底板及发声单元围设形成所述耦合后腔。
- 根据权利要求3所述的扬声器模组，其特征在于，所述底板对应所述第二出声孔的位置设有导音槽，所述导音槽与所述耦合后腔连通，所述导音槽的槽壁与所述后盖围设形成所述低音管。
- 根据权利要求3所述的扬声器模组，其特征在于，所述收容孔的孔壁具有朝向对侧延伸的第一台阶部，所述发声单元的底部边缘连接于所述第一台阶部。
- 根据权利要求3所述的扬声器模组，其特征在于，所述收容孔的孔壁设有向远离所述收容孔一侧凹陷的凹槽，且所述凹槽的槽壁与所述发声单元之间形成有间隔。
- 根据权利要求3所述的扬声器模组，其特征在于，所述前盖的侧板远离所述盖板的一端具有向内侧延伸的第二台阶部，所述后盖的底部边缘连接于所述第二台阶部。
- 根据权利要求1所述的扬声器模组，其特征在于，所述壳体设有用于安装在电子设备内部的安装部，所述安装部设有安装孔。
- 根据权利要求8所述的扬声器模组，其特征在于，所述安装部设有至少两个，其中两个所述安装部相对设置，且所述安装部位于第一出声孔相邻的两个侧壁。
- 根据权利要求1至9任一项所述的扬声器模组，其特征在于，所述发声单元为动圈式扬声器、MEMS扬声器、动圈及动铁式耳机芯中的至少一种。
- 一种电子设备，其特征在于，包括设备本体及如权利要求1至9任一项所述的扬声器模组，所述扬声器模组设于所述设备本体内；所述设备本体设有出音孔，所述扬声器模组的第一出声孔与所述出音孔对应设置，所述扬声器模组的导声前腔通过所述第一出声孔及出音孔与所述设备本体的外部空间连通，所述扬声器模组的耦合后腔通过所述第二出声孔与所述设备本体的内部空间连通。
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