WO2022173017A1 - Appareil de chauffage - Google Patents

Appareil de chauffage Download PDF

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Publication number
WO2022173017A1
WO2022173017A1 PCT/JP2022/005469 JP2022005469W WO2022173017A1 WO 2022173017 A1 WO2022173017 A1 WO 2022173017A1 JP 2022005469 W JP2022005469 W JP 2022005469W WO 2022173017 A1 WO2022173017 A1 WO 2022173017A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding material
conductor
heater
lead wire
peripheral
Prior art date
Application number
PCT/JP2022/005469
Other languages
English (en)
Japanese (ja)
Inventor
晴果 三好
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2022580693A priority Critical patent/JPWO2022173017A1/ja
Priority to CN202280013569.4A priority patent/CN116830797A/zh
Priority to EP22752839.5A priority patent/EP4294119A1/fr
Publication of WO2022173017A1 publication Critical patent/WO2022173017A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Definitions

  • the disclosed embodiments relate to heaters.
  • a heater having a heating resistor inside a ceramic body is conventionally known.
  • a configuration has been proposed in which an opening is positioned at the junction between the extraction electrode connected to the heating resistor and the lead wire positioned outside the ceramic body.
  • a heater includes a ceramic body, a heating resistor, a conductor, and a bonding material.
  • the ceramic body has recesses that open to the surface.
  • a heating resistor is located inside the ceramic body.
  • a conductor is electrically connected to the heating resistor and positioned on the bottom surface of the recess.
  • the joining material joins the lead wire located on the conductor and the conductor.
  • the bottom surface has a peripheral edge located outside the opening end of the recess in a plan view.
  • the end of the bonding material has a portion located at the peripheral edge.
  • FIG. 1 is a plan view showing a heater according to an embodiment
  • FIG. FIG. 2 is an enlarged view of area A shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 4 is a cross-sectional view taken along line CC shown in FIG.
  • FIG. 5 is a cross-sectional view showing a heater according to Modification 1 of the embodiment.
  • FIG. 6 is a cross-sectional view showing a heater according to Modification 2 of the embodiment.
  • FIG. 7 is a longitudinal sectional view showing a heater according to Modification 3 of the embodiment.
  • FIG. 8 is a cross-sectional view showing a heater according to Modification 4 of the embodiment.
  • FIG. 9 is a cross-sectional view showing a heater according to Modification 5 of the embodiment.
  • FIG. 10 is a cross-sectional view showing a heater according to Modification 6 of the embodiment.
  • FIG. 11 is a plan view showing a heater according to Modification 7 of
  • FIG. 1 is a plan view showing a heater according to an embodiment
  • the heater 1 includes a ceramic body 2, a heating resistor 4, a conductor 5, a bonding material 7, and lead wires 10.
  • a heater 1 is used, for example, for hair irons, soldering irons, and other applications.
  • FIG. 1 shows a three-dimensional orthogonal coordinate system including the Z-axis extending along the thickness direction of the heater 1 .
  • Such an orthogonal coordinate system is also shown in other drawings used in the description below.
  • the ceramic body 2 is, for example, a flat member.
  • the material of the ceramic body 2 is, for example, an insulating ceramic.
  • oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used.
  • alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, or the like can be used as the material of the ceramic body 2 .
  • the ceramic body 2 has a concave portion 3 .
  • the concave portion 3 is positioned so as to contact an end face 2a positioned at one end in the length direction of the ceramic body 2. As shown in FIG. The recess 3 opens to the surface 2b of the ceramic body 2 (see FIG. 2). Details of the concave portion 3 will be described later.
  • the heating resistor 4 is located inside the ceramic body 2 .
  • the heating resistor 4 is a member that generates heat when current flows.
  • Heating resistor 4 may include a high resistance conductor including, for example, tungsten, molybdenum, and the like.
  • the shape of the heating resistor 4 is not limited to the one shown in the figure, and can be changed as appropriate according to the heating characteristics required of the heater 1, for example.
  • the conductor 5 is electrically connected to the heating resistor 4.
  • the conductors 5 are positioned, for example, so as to be in contact with both ends of the heating resistor 4 .
  • the conductor 5 is positioned so as to overlap the recess 3 in plan view.
  • Conductor 5 may be a metallic material including, for example, tungsten, molybdenum, and the like.
  • the material of the conductor 5 may be the same as that of the heating resistor 4, or may be different.
  • the bonding material 7 is positioned inside the recess 3 .
  • the joining material 7 joins the lead wire 10 and the conductor 5 .
  • a brazing material such as solder or silver solder can be used.
  • the lead wire 10 is, for example, a wire containing a metal material such as nickel, iron, or a nickel-based heat-resistant alloy.
  • the cross section of the lead wire 10 may be circular, elliptical, or rectangular, for example.
  • the outer diameter of the lead wire 10, that is, the equivalent circle diameter of the lead wire 10 in cross section may be, for example, 0.5 to 2.0 mm.
  • FIG. 2 is an enlarged view of area A shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 4 is a cross-sectional view taken along line CC shown in FIG.
  • the recess 3 has a bottom surface 34.
  • the area of the bottom surface 34 is larger than the open area of the open end.
  • the opening area of the opening end means the ridgeline (opening end) of the opening of the recess 3 on the surface 2b of the ceramic body 2 when viewed from the direction perpendicular to the surface 2b of the ceramic body 2 as shown in FIG. It means the area of the region surrounded by 31 to 33 and the end face 2a of the ceramic body 2.
  • the bonding between the lead wire 10 and the conductor 5 via the bonding material 7 can be strengthened.
  • the opening area of the opening end is smaller than the area of the bottom surface 34, the ratio of the surface 2b of the ceramic body 2 functioning as a heating surface, which is the main part of the heater 1, increases, and the heater performance is improved. .
  • the bottom surface 34 has a peripheral edge portion 35 .
  • the peripheral edge portion 35 is located outside the opening end of the recess 3 when viewed in a direction perpendicular to the surface 2b of the ceramic body 2 as shown in FIG.
  • the concave portion 3 has a top surface 35a facing the peripheral portion 35 as shown in FIG. Thereby, the recessed portion 3 has a space sandwiched between the top surface 35 a and the peripheral portion 35 .
  • the end of the bonding material 7 is positioned at the peripheral edge 35 outside the opening end of the recess 3 in plan view.
  • the peripheral edge portion 35 may be provided on the entire wall surface of the recess 3 or may be provided partially.
  • a peripheral portion 35 is provided in a portion of the recess 3 where the conductor 5 is drawn out, and a peripheral portion 35 is provided in a portion of the recess 3 from which the conductor 5 is not drawn (for example, the rear end of the heater 1). may not be provided.
  • the ends of the bonding material 7 are located on both sides in the Y-axis direction as the second direction intersecting the X-axis direction as the first direction in which the lead wire 10 extends. It may have a portion positioned at one of the two ends in the Y-axis direction, and may have a portion positioned at one of the peripheral edge portions 35 . If the edge portions 35 located on both sides in the Y-axis direction have portions where the ends of the bonding material 7 are located, it is possible to further reduce deterioration in performance due to continuous use of the heater 1 .
  • the end of the bonding material 7 may be in contact with the peripheral wall 36 that continues to the peripheral edge 35 of the recess 3 facing the end surface 10 a of the lead wire 10 .
  • the bonding material 7 and the ceramic body 2 are less likely to be damaged due to the movement of the lead wire 10, so that the deterioration in performance due to continuous use of the heater 1 can be reduced.
  • stress tends to concentrate on the longitudinal end surface 10a of the lead wire 10 .
  • the end of the bonding material 7 may be in contact with the peripheral wall 36 of the recess 3 extending in the direction intersecting the bottom surface 34 . Since the edge of the bonding material 7 is in contact with the peripheral wall 36 , the bonding material 7 is surrounded by the ceramic body 2 above, below, and laterally on the peripheral wall 36 . Performance degradation can be further reduced. The end portion of the bonding material 7 may be in contact with the peripheral wall 36 over the entire circumference, or the bonding material 7 may be in contact with a portion of the peripheral wall 36 .
  • the point where stress concentrates is not the boundary between the bonding material 7 and the conductor 5, but the bonding material 7 and the ceramic. It can be used as a boundary with the body 2 . Therefore, since the end of the bonding material 7 is positioned at the peripheral edge 35, damage such as microcracks is less likely to occur at the boundary between the bonding material 7 and the conductor 5. Therefore, even if the conductor 5 is used for a long period of time, A decrease in electrical resistance is less likely to occur.
  • the heater 1 may be provided with a plating material 6 covering the surface of the conductor 5.
  • a plating material 6 for example, a plating material containing nickel, chromium, or the like can be used.
  • the bonding material 7 may be directly positioned on the bottom surface 34 of the recess 3 where the conductor 5 and the plating material 6 are not positioned. Positioning the bonding material 7 on the bottom surface 34 makes it difficult for the bonding material 7 to peel off, for example. As a result, it is possible to reduce the deterioration in performance due to the peeling of the bonding material 7 .
  • the plating material 6 may be positioned on the peripheral edge portion 35 together with the conductor 5 .
  • the movement of the lead wire 10 is further restricted, so that the bonding material 7 and the ceramic body 2 are less likely to be damaged. For this reason, it is possible to further reduce performance degradation that accompanies continuous use of the heater 1 .
  • the conductor 5 located in the peripheral portion 35 may be entirely covered with the plating material 6 , or a part of the conductor 5 may be exposed from the plating material 6 .
  • FIG. 5 is a cross-sectional view showing a heater according to Modification 1 of the embodiment.
  • the end of the bonding material 7 may be positioned so as to be in contact with the top surface 35 a facing the peripheral edge 35 of the recess 3 . Since the end portion of the bonding material 7 is in contact with the top surface 35 a , the bonding material 7 is sandwiched between the top surface 35 a and the peripheral edge portion 35 at the peripheral edge portion 35 .
  • the bonding material 7 is less likely to peel off, for example. As a result, it is possible to reduce the deterioration in performance due to the peeling of the bonding material 7 .
  • FIG. 6 is a cross-sectional view showing a heater according to Modification 2 of the embodiment.
  • the heater 1 is different from the heater 1 shown in FIG. 5 in that it has a convex portion 35b projecting from the top surface 35a toward the bottom surface 34 side.
  • the end portion of the bonding material 7 may be positioned so as to mesh with the convex portion 35b.
  • FIG. 7 is a longitudinal sectional view showing a heater according to Modification 3 of the embodiment. As shown in FIG. 7, the end of the bonding material 7 is located away from the peripheral wall 36 facing the end surface 10a of the lead wire 10, which is different from the heater 1 shown in FIG.
  • twisting stress may be applied to the root portion of the lead wire 10 by, for example, bending the lead wire 10.
  • the ends of the bonding material 7 are positioned at the peripheral edge portions 35 positioned on both sides in the second direction intersecting the first direction in which the lead wire 10 extends, while as shown in FIG.
  • the twisting stress can be resisted. For this reason, according to the heater 1 according to this modified example, it is possible to further reduce deterioration in performance due to continuous use.
  • FIG. 8 is a cross-sectional view showing a heater according to Modification 4 of the embodiment.
  • the heater 1 may have a ceramic body 2 in which a plurality of ceramic materials are laminated.
  • the ceramic body 2 of the heater 1 shown in FIG. 8 has a first member 21, a second member 22 and a third member 23.
  • the first member 21 and the third member 23 may be plate-like members having a predetermined shape, for example.
  • the second member 22 positioned between the first member 21 and the third member 23 may be, for example, a joining material that joins the first member 21 and the third member 23 .
  • the surface of the first member 21 where the second member 22 is not located between the third member 23 and the surface functions as the bottom surface 34 .
  • the surface of the third member 23 where the second member 22 is not located between the first member 21 and the surface functions as a top surface 35a.
  • the compositions of the first member 21, the second member 22 and the third member 23 may be the same or different.
  • the laminated structure of the ceramic body 2 is not limited to the illustrated one.
  • the ceramic body 2 may be, for example, a laminate of two or four or more materials.
  • FIG. 9 is a cross-sectional view showing a heater according to Modification 5 of the embodiment.
  • the heater 1 may further have an intermediate layer 8, as shown in FIG.
  • a heater 1 shown in FIG. 9 differs from the heater 1 shown in FIG.
  • Intermediate layer 8 contains one or more metal elements contained in conductor 5 and plating material 6 .
  • the intermediate layer 8 may be, for example, an interdiffusion layer produced by reaction between the conductor 5 and the plating material 6 accompanying firing of the heater material.
  • the intermediate layer 8 may be positioned on the peripheral edge portion 35 together with the conductor 5 and the plating material 6 .
  • the plating material 6 and the conductor 5 can be firmly bonded via the intermediate layer 8 , for example, at the peripheral portion 35 .
  • damage such as microcracks is unlikely to occur in the end portion of the bonding material 7 or the conductor 5 where stress is likely to concentrate.
  • the electrical resistance of the conductor 5 is less likely to decrease. For this reason, according to the heater 1 according to this modified example, it is possible to further reduce deterioration in performance due to continuous use.
  • FIG. 10 is a cross-sectional view showing a heater according to Modification 6 of the embodiment.
  • the heater 1 may further have a resin material 40 .
  • the material of the resin material 40 may be, for example, a thermosetting resin, a photocurable resin, or other curable resin.
  • the resin material 40 is positioned inside the recess 3 so as to cover the lead wires 10 and the bonding material 7 .
  • the movement of the lead wire 10 is further restricted, so that the bonding material 7 and the ceramic body 2 are less likely to be damaged. For this reason, it is possible to further reduce performance degradation that accompanies continuous use of the heater 1 .
  • the end of the resin material 40 may be positioned at the peripheral edge 35 and may face the peripheral wall 36 .
  • the movement of the lead wire 10 is further restricted, so that the bonding material 7 and the ceramic body 2 are less likely to be damaged. For this reason, it is possible to further reduce performance degradation that accompanies continuous use of the heater 1 .
  • FIG. 11 is a plan view showing a heater according to Modification 7 of the embodiment.
  • the concave portion 3 of the heater 1 shown in FIG. 11 has a first portion 37, a second portion 38, and a third portion 39 in order from the end face 2a side of the ceramic body 2. As shown in FIG. Compared to the second portion 38 positioned between the first portion 37 and the third portion 39, the first portion 37 and the third portion 39 have smaller dimensions in the Y-axis direction. By using the ceramic body 2 having such recesses 3, for example, the assembly accuracy of the lead wires 10 is improved. In addition, the shape of the recessed part 3 is not restricted to what was illustrated. For example, the recess 3 may have the first portion 37 and the second portion 38 or may have the second portion 38 and the third portion 39 .
  • the present disclosure is not limited to the above embodiments and modifications, and various modifications are possible without departing from the gist thereof.
  • the intermediate layer 8 shown in FIG. 9 and/or the resin material 40 shown in FIG. 10 may be applied to the heater 1 according to other modifications.
  • other configurations of the above-described embodiment and modifications can be appropriately combined within a range that does not cause contradiction.
  • the heater 1 includes the ceramic body 2, the heating resistor 4, the conductor 5, and the bonding material 7.
  • the ceramic body 2 has a recess 3 that opens to the surface 2b.
  • the heating resistor 4 is positioned inside the ceramic body 2 .
  • the conductor 5 is electrically connected to the heating resistor 4 and positioned on the bottom surface 34 of the recess 3 .
  • the joining material 7 joins the lead wire 10 located on the conductor 5 and the conductor 5 .
  • the bottom surface 34 has a peripheral edge portion 35 located outside the opening end of the recess 3 in plan view.
  • the end of the bonding material 7 has a portion located at the peripheral edge 35 . This makes it possible to reduce the deterioration in performance that accompanies continuous use.
  • the heater 1 includes a plating material 6 that covers the surface of the conductor 5 .
  • Conductor 5 and plating material 6 are located at peripheral edge portion 35 . This can further reduce the performance degradation that accompanies continuous use.
  • the heater 1 also includes an intermediate layer 8 located between the conductor 5 and the plating material 6 and containing one or more metal elements contained in the conductor 5 and the plating material 6 .
  • the intermediate layer 8 is located at the peripheral portion 35 . This can further reduce the performance degradation that accompanies continuous use.
  • the end portion of the bonding material 7 according to the embodiment is in contact with the peripheral wall 36 that continues to the peripheral edge portion 35 . This can further reduce the performance degradation that accompanies continuous use.
  • the end portion of the bonding material 7 continues to the peripheral wall 36 that continues to the peripheral edge portion 35 and is in contact with the top surface 35 a that faces the peripheral edge portion 35 . This can further reduce the performance degradation that accompanies continuous use.
  • the end portion of the bonding material 7 according to the embodiment is positioned at the peripheral edge portion 35 positioned in the second direction intersecting the first direction in which the lead wire 10 extends. This makes it possible to reduce the deterioration in performance that accompanies continuous use.
  • the ends of the bonding material 7 according to the embodiment are located at the peripheral edges 35 located on both sides in the second direction intersecting the first direction in which the lead wire 10 extends. This can further reduce the performance degradation that accompanies continuous use.
  • the end portion of the bonding material 7 faces the end surface 10 a of the lead wire 10 and is in contact with the peripheral wall 36 that continues to the peripheral edge portion 35 . This makes it possible to reduce the deterioration in performance that accompanies continuous use.
  • the end portions of the bonding material 7 according to the embodiment are located at the peripheral edge portions 35 located on both sides in the second direction intersecting the first direction in which the lead wire 10 extends, and face the end surface 10a of the lead wire 10. , at a distance from the peripheral wall 36 which continues to the peripheral edge 35 .
  • the heater 1 further includes a resin material 40 that covers the lead wires 10 and the bonding material 7 .
  • the end portion of the resin material 40 is positioned at the peripheral edge portion 35 . This can further reduce the performance degradation that accompanies continuous use.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)

Abstract

Un dispositif de chauffage selon la présente invention comprend un corps en céramique, une résistance chauffante, un conducteur et un matériau de liaison. Le corps en céramique présente un évidement qui s'ouvre à la surface de celui-ci. La résistance chauffante est positionnée à l'intérieur du corps en céramique. Le conducteur est électriquement connecté à la résistance chauffante et est positionné sur la face inférieure de l'évidement. Le matériau de liaison lie le conducteur et un fil conducteur positionné sur le dessus du conducteur. La face inférieure comprend une section périphérique positionnée davantage vers l'extérieur que le bord d'ouverture de l'évidement dans une vue en plan. La section de bord du matériau de liaison comprend une partie positionnée au niveau de la section périphérique.
PCT/JP2022/005469 2021-02-12 2022-02-10 Appareil de chauffage WO2022173017A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022580693A JPWO2022173017A1 (fr) 2021-02-12 2022-02-10
CN202280013569.4A CN116830797A (zh) 2021-02-12 2022-02-10 加热器
EP22752839.5A EP4294119A1 (fr) 2021-02-12 2022-02-10 Appareil de chauffage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-021220 2021-02-12
JP2021021220 2021-02-12

Publications (1)

Publication Number Publication Date
WO2022173017A1 true WO2022173017A1 (fr) 2022-08-18

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ID=82838340

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/005469 WO2022173017A1 (fr) 2021-02-12 2022-02-10 Appareil de chauffage

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Country Link
EP (1) EP4294119A1 (fr)
JP (1) JPWO2022173017A1 (fr)
CN (1) CN116830797A (fr)
WO (1) WO2022173017A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04112476A (ja) * 1990-08-31 1992-04-14 Noritz Corp セラミックヒータ
JPH11219774A (ja) * 1998-01-30 1999-08-10 Kyocera Corp 窒化アルミニウム質セラミックヒータ
JP2007022908A (ja) * 2005-06-16 2007-02-01 Ngk Spark Plug Co Ltd セラミック接合体及びセラミックヒータ
JP2011034979A (ja) 2004-05-27 2011-02-17 Kyocera Corp セラミックヒータ及びそれを用いたヘアアイロン
JP2018018671A (ja) * 2016-07-27 2018-02-01 京セラ株式会社 ヒータ
JP2018101470A (ja) * 2016-12-19 2018-06-28 京セラ株式会社 ヒータ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04112476A (ja) * 1990-08-31 1992-04-14 Noritz Corp セラミックヒータ
JPH11219774A (ja) * 1998-01-30 1999-08-10 Kyocera Corp 窒化アルミニウム質セラミックヒータ
JP2011034979A (ja) 2004-05-27 2011-02-17 Kyocera Corp セラミックヒータ及びそれを用いたヘアアイロン
JP2007022908A (ja) * 2005-06-16 2007-02-01 Ngk Spark Plug Co Ltd セラミック接合体及びセラミックヒータ
JP2018018671A (ja) * 2016-07-27 2018-02-01 京セラ株式会社 ヒータ
JP2018101470A (ja) * 2016-12-19 2018-06-28 京セラ株式会社 ヒータ

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Publication number Publication date
JPWO2022173017A1 (fr) 2022-08-18
CN116830797A (zh) 2023-09-29
EP4294119A1 (fr) 2023-12-20

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