WO2022165883A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2022165883A1
WO2022165883A1 PCT/CN2021/078015 CN2021078015W WO2022165883A1 WO 2022165883 A1 WO2022165883 A1 WO 2022165883A1 CN 2021078015 W CN2021078015 W CN 2021078015W WO 2022165883 A1 WO2022165883 A1 WO 2022165883A1
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Prior art keywords
substrate
light
layer
display panel
hole
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PCT/CN2021/078015
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English (en)
French (fr)
Inventor
张允题
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武汉华星光电半导体显示技术有限公司
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Priority to US17/283,567 priority Critical patent/US11800782B2/en
Publication of WO2022165883A1 publication Critical patent/WO2022165883A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing the same, and a display device.
  • the display panel is set with a double-layer yellow polyimide (YPI) substrate
  • the light transmittance of the camera area of the camera technology under the blind hole screen is generally 10% ⁇ 20%, resulting in insufficient photographing effect. Excellent, which limits the development of camera technology under blind hole screen.
  • a common technical solution is to replace one of the YPI substrates of the display panel with colorless and transparent PI (Colorless and transparent PI).
  • Polyimde, CPI) substrate that is, the first layer of PI substrate of the display panel still uses YPI substrate with better thermal stability, and the second layer of PI substrate is replaced by yellow PI substrate with better thermal stability to CPI substrate with better optical performance.
  • CPI substrate is replaced by yellow PI substrate with better thermal stability to CPI substrate with better optical performance.
  • the surface flatness of the remaining second-layer CPI substrate that has not been removed is not good, so that diffuse reflection occurs when light passes through, reducing the light transmittance.
  • Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device, to solve the problem of the existing display panel, using a laser process to completely remove the first layer of the YPI substrate, and partially remove the second layer of the CPI substrate, resulting in The surface flatness of the remaining second-layer CPI substrate that has not been removed is not good, so that diffuse reflection occurs when light passes through, resulting in a technical problem of reduced light transmittance.
  • the present application provides a display panel, comprising a first substrate and a second substrate disposed on the first substrate, wherein the light transmittance of the first substrate is smaller than that of the second substrate; the first substrate The substrate is provided with at least one first through hole, the second substrate is provided with at least one blind hole, and the blind hole is recessed inward from the side surface of the second substrate facing the first substrate, so The blind holes are arranged corresponding to the first through holes;
  • the display panel further includes a light-transmitting flat layer, the light-transmitting flat layer is arranged in the blind hole to flatten the bottom of the blind hole, and the material of the light-transmitting flat layer is the same as that of the second substrate. Materials are the same.
  • the display panel further includes a water-oxygen barrier layer, the water-oxygen barrier layer is located between the first substrate and the second substrate, and at least A second through hole is provided corresponding to the first through hole and the blind hole.
  • the light-transmitting flat layer partially fills the blind holes; or the light-transmitting flat layer completely fills the blind holes; or the light-transmitting flat layer completely fills the blind holes , and partially fills the second through hole; or, the light-transmitting flat layer completely fills the blind hole and the second through hole.
  • the material of the water-oxygen barrier layer is one or a combination of silicon oxide, silicon nitride and silicon oxynitride.
  • the display panel further includes an anti-reflection and anti-reflection film, and the anti-reflection and anti-reflection film is disposed on a side of the light-transmitting flat layer facing the first substrate.
  • the thickness of the anti-reflection and anti-reflection film is sub-micron.
  • the material of the first substrate is yellow polyimide
  • the material of the second substrate is colorless and transparent polyimide
  • the display panel further includes:
  • a polarizer arranged on the functional layer
  • a cover plate arranged on the polarizer
  • a backplane disposed on the side of the first substrate away from the functional layer
  • a heat dissipation layer disposed on the side of the backplane away from the functional layer
  • both the back plate and the heat dissipation layer are provided with third through holes, and the third through holes are arranged corresponding to the first through holes.
  • the present application provides a display device including a display panel
  • a photosensitive element disposed on one side of the display panel and corresponding to the first through hole
  • the display panel includes a first substrate and a second substrate disposed on the first substrate, the light transmittance of the first substrate is smaller than the light transmittance of the second substrate; the first substrate is provided with At least one first through hole, the second substrate is provided with at least one blind hole, the blind hole is formed inwardly from the side surface of the second substrate facing the first substrate, and the blind hole corresponds to the first through hole is provided;
  • the display panel further includes a light-transmitting flat layer, the light-transmitting flat layer is arranged in the blind hole to flatten the bottom of the blind hole, and the material of the light-transmitting flat layer is the same as that of the second substrate. Materials are the same.
  • the display panel further includes a water-oxygen barrier layer, the water-oxygen barrier layer is located between the first substrate and the second substrate, and the water-oxygen barrier layer is provided with at least A second through hole is provided corresponding to the first through hole and the blind hole.
  • the light-transmitting flat layer partially fills the blind hole; or the light-transmitting flat layer completely fills the blind hole; or the light-transmitting flat layer completely fills the blind hole , and partially fills the second through hole; or, the light-transmitting flat layer completely fills the blind hole and the second through hole.
  • the material of the water-oxygen barrier layer is one or a combination of silicon oxide, silicon nitride and silicon oxynitride.
  • the display panel further includes an anti-reflection and anti-reflection film, and the anti-reflection and anti-reflection film is disposed on a side of the light-transmitting flat layer facing the first substrate.
  • the thickness of the anti-reflection and anti-reflection film is sub-micron.
  • the material of the first substrate is yellow polyimide
  • the material of the second substrate is colorless and transparent polyimide
  • the display panel further includes:
  • a polarizer arranged on the functional layer
  • a cover plate arranged on the polarizer
  • a backplane disposed on the side of the first substrate away from the functional layer
  • a heat dissipation layer disposed on the side of the backplane away from the functional layer
  • both the back plate and the heat dissipation layer are provided with third through holes, and the third through holes are arranged corresponding to the first through holes.
  • the present application provides a preparation method of a display panel, comprising the following steps:
  • At least one first through hole is formed on the first substrate by a laser process, and at least one blind hole is formed on the second substrate, wherein the blind hole is directed from the second substrate to the first substrate.
  • a surface of one side is recessed inward, and the blind hole is disposed corresponding to the first through hole;
  • a light-transmitting flat layer is formed by coating in the blind hole to flatten the bottom of the blind hole, wherein the material of the light-transmitting flat layer is the same as that of the second substrate.
  • a chemical vapor deposition process is used to form an anti-reflection and anti-reflection film on the side of the light-transmitting flat layer close to the first substrate.
  • the method further includes the following steps:
  • a heat dissipation layer is formed on the side of the backplane facing away from the functional layer.
  • the material of the first substrate is yellow polyimide
  • the material of the second substrate is colorless and transparent polyimide
  • a light-transmitting flat layer is arranged in the blind hole to flatten the bottom of the blind hole, so that the unevenness of the second substrate that has not been removed is eliminated.
  • the surface is filled and leveled, so that a relatively flat film surface can be obtained, the diffuse reflection caused by the uneven surface is avoided, and the transmittance of the second substrate is improved; since the material of the light-transmitting flat layer is the same as that of the second substrate, The interface reflection between the light-transmitting flat layer and the unremoved second substrate can be reduced, and the light transmittance of the second substrate can be further improved.
  • FIG. 1 is a schematic top-view structure diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a first cross-sectional structure of a display panel provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a second cross-sectional structure of a display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a third cross-sectional structure of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a fourth cross-sectional structure of a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a fifth cross-sectional structure of a display panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional structure diagram of a functional layer of the display panel in FIG. 6;
  • FIG. 8 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application.
  • FIGS. 8A to 8D are schematic structural diagrams of the process flow of a method for fabricating a display panel provided by an embodiment of the present application.
  • First substrate 12.
  • Second substrate 13.
  • Light-transmitting flat layer 14.
  • Anti-reflection and anti-reflection film 15.
  • Water and oxygen barrier layer 16.
  • Functional layer , backplane; 20, heat dissipation layer; 21, optical glue;
  • FIG. 1 is a schematic top-view structure diagram of a display panel provided by an embodiment of the present application.
  • the display panel has a display area 100, the display area 100 has an under-screen light-transmitting area 200, the display area 100 is used for normal display, and the under-screen light-transmitting area 200 is used for displaying images and can transmit through light so that the light-sensitive element located on one side of the display panel and corresponding to the light-transmitting area 200 under the screen receives the light signal, wherein the light-sensitive element can be a camera, an optical touch component, a fingerprint recognition sensor, etc., So that the display panel can realize functions such as photographing function, optical touch function and optical fingerprint recognition.
  • the shape of the under-screen light-transmitting area 200 may be a circle, a rectangle, a rounded rectangle or an irregular polygon, and the display panel may include a plurality of the under-screen light-transmitting areas 200 .
  • the photosensitive element is a camera as an example for description.
  • FIG. 2 is a schematic diagram of a first cross-sectional structure of a display panel according to an embodiment of the present application.
  • the display panel includes a first substrate 11 and a second substrate 12 disposed on the first substrate 11.
  • the light-transmitting area of the first substrate 11 ratio is smaller than the transmittance of the second substrate 12 .
  • display panels usually use flexible materials as substrates. Due to the high limit elongation of low transmittance flexible materials, but poor optical transmittance performance, it is easy to cause incomplete collection of viewing information for the camera under the screen.
  • High transmittance flexible materials have high optical transmittance properties, but poor ultimate tensile properties, which are prone to breakage during peeling. Therefore, a flexible material with low light transmittance is usually used as the first substrate 11 , and a flexible material with high light transmittance is used as the second substrate 12 , and the first substrate 11 and the second substrate 12 are stacked to form a display panel.
  • the advantages of the first substrate 11 and the second substrate 12 are complementary to each other, which not only ensures that the substrate has good mechanical properties, avoids breaking during peeling, but also meets the light transmission area under the screen. 200 high light transmittance requirements to avoid yellowing of the shooting effect.
  • At least one first through hole 111 is formed on the first substrate 11 by a laser process, and at least one blind hole 121 is formed on the second substrate 12 , and the blind hole 121 faces the second substrate 12 from the second substrate 12
  • One surface of the first substrate 11 is recessed inward, and the blind holes 121 are disposed corresponding to the first through holes 111 .
  • the first through holes 111 and the blind holes 121 are both disposed corresponding to the under-screen light-transmitting area 200 . Since the positions of the second substrate 12 corresponding to the blind holes 121 are not completely removed, the surface flatness of the remaining second substrate 12 that is not removed is not good, so that diffuse reflection occurs when light passes through , the light transmittance decreases.
  • the display panel provided by the embodiment of the present application further includes a light-transmitting flat layer 13, and the light-transmitting flat layer 13 is disposed in the blind hole 121 to flatten the bottom of the blind hole 121, so that no The removed uneven surface of the second substrate 12 is filled and leveled to obtain a relatively flat surface of the film layer, thereby avoiding diffuse reflection caused by the uneven surface and improving the transmittance of the second substrate 12 .
  • the material of the light-transmitting flat layer 13 is the same as the material of the second substrate 12, because the material of the light-transmitting flat layer 13 and the material of the second substrate 12 have the same chemical composition, The interface reflection between the light-transmitting flat layer 13 and the unremoved second substrate 12 can be reduced, and the uneven surface can be more easily flattened without reducing the light transmittance of the second substrate 12 .
  • the thickness of the light-transmitting flat layer 13 is not particularly limited, as long as the uneven surface of the bottom of the blind hole 121 can be flattened.
  • the overall thickness of the second substrate 12 is too high, the overall mechanical properties of the second substrate 12 will be poor. Therefore, the light-transmitting flat layer 13 is close to the side of the first substrate 11 .
  • the surface is not higher than the surface of the side of the first substrate 11 close to the second substrate 12 , that is, the bottom surface of the light-transmitting flat layer 13 should not exceed the top surface of the second substrate 12 .
  • the surface of the light-transmitting flat layer 13 close to the first substrate 11 is flush with the surface of the first substrate 11 close to the second substrate 12 , so that the surface of the second substrate 12 is flush.
  • the thickness is the same as the thickness when the blind hole 121 is not opened, so as to avoid step difference.
  • the thickness of the remaining second substrate 12 that has not been removed may be less than half of the original thickness of the second substrate 12 .
  • the display panel further includes a water and oxygen barrier layer 15, the water and oxygen barrier layer 15 is located between the first substrate 11 and the second substrate 12, on the one hand for blocking water and oxygen, on the other hand for preventing The laser lift-off causes damage to the first substrate 11 and the second substrate 12 .
  • At least one second through hole 151 is formed on the water and oxygen barrier layer 15 , and the second through hole 151 is disposed corresponding to the first through hole 111 and the blind hole 121 .
  • the material of the water-oxygen barrier layer 15 may be an inorganic layer, such as one or a combination of silicon oxide, silicon nitride, and silicon oxynitride.
  • the side surface of the light-transmitting flat layer 13 close to the first substrate 11 is located in the second through hole 151 , and the thickness of the light-transmitting flat layer 13 has various conditions, which are listed as follows. should be based on the actual situation.
  • the light-transmitting flat layer 13 fills part of the blind holes 121 .
  • the sum of the thicknesses is small, so that the light transmittance of the second substrate 12 is relatively high.
  • the light-transmitting flat layer 13 can completely fill the blind holes 121 .
  • the sum of the thickness of 12 and the thickness of the light-transmitting flat layer 13 is equal to the thickness of the second substrate 12 when the blind holes are not opened.
  • the second substrate 12 remains as it is.
  • the light-transmitting flat layer 13 fills the blind holes 121 and partially fills the second through holes 151 . Since the remaining second substrate 12 and the second substrate 12 are not removed. The larger sum of thicknesses of the light-transmitting flat layer 13 makes the mechanical properties of the second substrate 12 better than the first case.
  • the light-transmitting flat layer 13 can completely fill the blind hole 121 and the second through hole 151 .
  • the material of the first substrate 11 may be yellow polyimide
  • the material of the second substrate 12 may be colorless and transparent polyimide.
  • the limit elongation rate of the yellow polyimide material is about twice that of the colorless transparent polyimide material
  • the colorless transparent polyimide has high optical transmittance, which can meet the light-transmitting area 200 under the screen. light transmission requirements.
  • an anti-reflection and anti-reflection film 14 is provided on the side of the light-transmitting flat layer 13 close to the first substrate 11 , which can further reduce the thickness of the light-transmitting flat layer 13 and the second substrate 12 that has not been removed.
  • the interface reflection improves the transmittance of the light-transmitting area 200 under the screen, and obtains an excellent shooting effect.
  • the thickness of the anti-reflection and anti-reflection film 14 is sub-micron.
  • the material of the anti-reflection and anti-reflection film 14 may be resin.
  • the display panel further includes structures such as a functional layer 16 , a polarizer 17 , a cover plate 18 , a back plate 19 and a heat dissipation layer 20 .
  • the functional layer 16 is disposed on the second substrate 12
  • the polarizer 17 is disposed on the functional layer 16
  • an optical glue 21 is disposed between the cover plate 18 and the polarizer 17 .
  • the back plate 19 is disposed on the side of the first substrate 11 away from the second substrate 12 to support the display panel.
  • the heat dissipation layer 20 is disposed on the side of the back plate 19 away from the first substrate 11 for dissipating heat from the display panel.
  • the material of the heat dissipation layer 20 may be SCF composite material.
  • the back plate 19 and the heat dissipation layer 20 are both provided with third through holes 191 , the third through holes 191 and the first through holes 111 , the second through holes 151 and the blind holes 121 corresponding settings.
  • the functional layer 16 includes a thin film transistor array layer 161 , an organic light emitting layer 162 , an encapsulation layer 163 and a touch layer 164 .
  • the thin film transistor array layer 161 is disposed on the second substrate 12.
  • the thin film transistor array layer 161 includes a plurality of thin film transistors, and the thin film transistors may be low temperature polysilicon thin film transistors.
  • the thin film transistor array layer It includes a film layer structure such as a first metal layer, a gate insulating layer, an active layer, a second metal layer and a passivation layer.
  • the organic light-emitting layer 162 is disposed on the thin film transistor array layer 161 for emitting light of various colors.
  • the organic light-emitting layer 162 may include a red light-emitting layer, a green light-emitting layer, a blue light-emitting layer, and the like.
  • the encapsulation layer 163 is disposed on the organic light-emitting layer 162 to prevent the organic light-emitting layer 162 from being eroded by external water and oxygen, resulting in failure.
  • the encapsulation layer 163 can be encapsulated by a thin film.
  • the touch layer 164 is disposed on the encapsulation layer 163, and a direct on-cell touch (DOT) touch solution may be adopted to realize the touch function.
  • DOT direct on-cell touch
  • FIG. 8 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application
  • FIGS. 8A to 8D are schematic flowcharts of a manufacturing method for a display panel provided by an embodiment of the present application.
  • the preparation method of the display panel includes the following steps:
  • a water and oxygen barrier layer 15 is further disposed between the first substrate 11 and the second substrate 12 , and the material of the water and oxygen barrier layer 15 may be an inorganic layer, such as silicon oxide, One or a combination of silicon nitride and silicon oxynitride.
  • the material of the first substrate 11 may be yellow polyimide
  • the material of the second substrate 12 may be colorless and transparent polyimide.
  • the limit elongation of the yellow polyimide material is about twice that of the colorless and transparent polyimide material, and the colorless and transparent polyimide has high optical transmittance, which can meet the requirements of the light-transmitting area under the screen. light transmission requirements.
  • the under-screen light-transmitting area of the first substrate 11 is irradiated with laser light, and the part of the first substrate 11 located in the under-screen light-transmitting area is completely removed to form the first pass-through area.
  • the hole 111 , the part of the second substrate 12 located in the light-transmitting area under the screen is not completely removed to form the blind hole 121 , and the blind hole 121 is disposed corresponding to the first through hole 111 .
  • the remaining thickness of the second substrate 12 that has not been removed may be less than half of the original thickness of the second substrate 12 .
  • the water-oxygen barrier layer 15 is irradiated by the same laser process to form second through holes 151 on the water-oxygen barrier layer, and the second through holes 151 are arranged corresponding to the first through holes 111 .
  • the material of the light-transmitting flat layer 13 is also colorless and transparent subpolyamide. Since the material of the light-transmitting flat layer 13 and the second substrate 12 have the same chemical composition, the reflection of the interface between the light-transmitting flat layer 13 and the second substrate 12 that has not been removed can be reduced, and it is easier to be flattened The uneven surface will not reduce the light transmittance of the second substrate 12 .
  • the following step is further included: adopting a chemical vapor deposition process to place the light-transmitting flat layer 13 close to the first substrate 11
  • the anti-reflection and anti-reflection film 14 is formed by evaporation on one side.
  • the thickness of the anti-reflection and anti-reflection film 14 is sub-micron, and the material of the anti-reflection and anti-reflection film 14 can be resin, which can further reduce the thickness of the light-transmitting flat layer 13 and the unremoved first
  • the interface reflection of the two substrates 12 improves the transmittance of the light-transmitting area under the screen, and obtains an excellent photographing effect.
  • the following steps are further included: forming a functional layer on the second substrate 12; providing a polarizer , attached to the functional layer; a cover plate is provided, attached to the polarizer; a back plate is formed on the side of the first substrate 11 away from the functional layer; A heat dissipation layer is formed on one side of the functional layer.
  • forming a functional layer on the second substrate 12 includes the following steps: forming a thin film transistor array layer on the second substrate 12; forming an organic light-emitting layer on the thin film transistor array layer; An encapsulation layer is formed on the organic light-emitting layer; and a touch layer is formed on the encapsulation layer. Since this is the prior art, it will not be described in detail here.
  • An embodiment of the present application further provides a display device, the display device includes the above-mentioned display panel and a photosensitive element, and the photosensitive element is disposed on one side of the display panel and is disposed corresponding to the light-transmitting area under the screen.
  • the photosensitive element can be a camera
  • the display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
  • a light-transmitting flat layer is arranged in the blind hole to flatten the bottom of the blind hole, so that the uneven surface of the second substrate that has not been removed It can be filled and leveled, so that a relatively flat film surface can be obtained, the diffuse reflection caused by the uneven surface can be avoided, and the transmittance of the second substrate can be improved;
  • the interface reflection between the light-transmitting flat layer and the unremoved second substrate is reduced, and the light transmittance of the second substrate is further improved.

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Abstract

本申请公开了一种显示面板及其制备方法、显示装置，显示面板包括第一基板、第二基板和透光平坦层，第一基板的透光率小于第二基板的透光率；第一基板上设有至少一个第一通孔，第二基板上设有至少一个盲孔，盲孔对应第一通孔设置；透光平坦层设于盲孔内，用以平坦盲孔的底部，能够获得较为平整的膜层表面。

Description

显示面板及其制备方法、显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及其制备方法、显示装置。
 背景技术
目前，因显示面板采用双层黄色聚酰亚胺（Yellow Polyimide，YPI）基板设置的方式，盲孔屏下摄像头技术的摄像头区域光透过率一般为10%~20%级别，导致拍照效果欠佳，限制了盲孔屏下摄像头技术的发展。
为了增加盲孔屏下摄像头技术的摄像头区域光透过率，常用的技术方案是将显示面板的其中一层YPI基板替换为无色透明PI（Colorless Polyimde，CPI）基板，即显示面板的第一层PI基板仍然采用热稳定性较好的YPI基板，第二层PI基板由热稳定性较好的黄色PI基板替换为光学性能佳的CPI基板。然而，采用如此结构的显示面板在其与其他模组材料贴合以形成显示模组后，需要利用激光工艺将摄像头区域的第一层YPI基板全部去除，并将第二层CPI基板部分去除，由此导致留下的未被去除的第二层CPI基板表面平整度欠佳，使得光线透过时会发生漫反射，降低光线透过率。
综上，亟需提供一种新的显示面板及其制备方法、显示装置，来解决上述技术问题。
 技术问题
本申请实施例提供一种显示面板及其制备方法、显示装置，以解决现有的显示面板，利用激光工艺将第一层YPI基板全部去除，并将第二层CPI基板部分去除，由此导致留下的未被去除的第二层CPI基板表面平整度欠佳，使得光线透过时会发生漫反射，从而导致光线透过率降低的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，包括第一基板和设置于所述第一基板上的第二基板，所述第一基板的透光率小于所述第二基板的透光率；所述第一基板上开设有至少一个第一通孔，所述第二基板上设有至少一个盲孔，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；
所述显示面板还包括透光平坦层，所述透光平坦层设于所述盲孔内，用以平坦所述盲孔的底部，所述透光平坦层的材料与所述第二基板的材料相同。
根据本申请提供的显示面板，所述显示面板还包括水氧阻隔层，所述水氧阻隔层位于所述第一基板和所述第二基板之间，所述水氧阻隔层上开设有至少一个第二通孔，所述第二通孔对应所述第一通孔和所述盲孔设置。
根据本申请提供的显示面板，所述透光平坦层填充部分所述盲孔；或，所述透光平坦层完全填充所述盲孔；或，所述透光平坦层完全填充所述盲孔，并部分填充所述第二通孔；或，所述透光平坦层完全填充所述盲孔和所述第二通孔。
根据本申请提供的显示面板，所述水氧阻隔层的材料为氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。
根据本申请提供的显示面板，所述显示面板还包括增透降反膜，所述增透降反膜设置于所述透光平坦层朝向所述第一基板的一侧。
根据本申请提供的显示面板，所述增透降反膜的厚度为亚微米级。
根据本申请提供的显示面板，所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
根据本申请提供的显示面板，所述显示面板还包括：
功能层，设置于所述第二基板上；
偏光片，设置于所述功能层上；
盖板，设置于所述偏光片上；
背板，设置于所述第一基板背离所述功能层的一侧；以及
散热层，设置于所述背板背离所述功能层的一侧；
其中，所述背板和所述散热层均开设有第三通孔，所述第三通孔与所述第一通孔对应设置。
本申请提供一种显示装置，包括显示面板；以及
感光元件，设置于所述显示面板的一侧且对应所述第一通孔设置；
所述显示面板包括第一基板和设置于所述第一基板上的第二基板，所述第一基板的透光率小于所述第二基板的透光率；所述第一基板上开设有至少一个第一通孔，所述第二基板上设有至少一个盲孔，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；
所述显示面板还包括透光平坦层，所述透光平坦层设于所述盲孔内，用以平坦所述盲孔的底部，所述透光平坦层的材料与所述第二基板的材料相同。
根据本申请提供的显示装置，所述显示面板还包括水氧阻隔层，所述水氧阻隔层位于所述第一基板和所述第二基板之间，所述水氧阻隔层上开设有至少一个第二通孔，所述第二通孔对应所述第一通孔和所述盲孔设置。
根据本申请提供的显示装置，所述透光平坦层填充部分所述盲孔；或，所述透光平坦层完全填充所述盲孔；或，所述透光平坦层完全填充所述盲孔，并部分填充所述第二通孔；或，所述透光平坦层完全填充所述盲孔和所述第二通孔。
根据本申请提供的显示装置，所述水氧阻隔层的材料为氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。
根据本申请提供的显示装置，所述显示面板还包括增透降反膜，所述增透降反膜设置于所述透光平坦层朝向所述第一基板的一侧。
根据本申请提供的显示装置，所述增透降反膜的厚度为亚微米级。
根据本申请提供的显示装置，所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
根据本申请提供的显示装置，所述显示面板还包括：
功能层，设置于所述第二基板上；
偏光片，设置于所述功能层上；
盖板，设置于所述偏光片上；
背板，设置于所述第一基板背离所述功能层的一侧；以及
散热层，设置于所述背板背离所述功能层的一侧；
其中，所述背板和所述散热层均开设有第三通孔，所述第三通孔与所述第一通孔对应设置。
本申请提供一种显示面板的制备方法，包括以下步骤：
提供第一基板和位于所述第一基板上的第二基板，其中，所述第二基板的透光率大于所述第一基板的透光率；
采用激光工艺在所述第一基板上形成至少一个第一通孔，在所述第二基板上形成至少一个盲孔，其中，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；以及
在所述盲孔内涂布形成透光平坦层以平坦所述盲孔的底部，其中，所述透光平坦层的材料与所述第二基板的材料相同。
根据本申请提供的显示面板的制备方法，在所述盲孔内涂布形成透光平坦层之后，还包括以下步骤：
采用化学气相沉积工艺在所述透光平坦层靠近所述第一基板的一侧蒸镀形成增透降反膜。
根据本申请提供的显示面板的制备方法，在所述采用激光工艺在所述第一基板上形成至少一个第一通孔之前，还包括以下步骤：
在所述第二基板上形成功能层；
提供一偏光片，贴附于所述功能层上；
提供一盖板，贴附于所述偏光片上；
在所述第一基板背离所述功能层的一侧形成背板；以及
在所述背板背离所述功能层的一侧形成散热层。
根据本申请提供的显示面板的制备方法，所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
 有益效果
本申请的有益效果为：本申请提供的显示面板及其制备方法，通过在盲孔内设置透光平坦层，用以平坦盲孔的底部，使得未被去除的所述第二基板的不平整表面被填平，从而能够获得较为平整的膜层表面，避免不平整表面所造成的漫反射，提升了第二基板的透过率；由于透光平坦层的材料与第二基板的材料相同，可降低透光平坦层与未被去除的第二基板的界面反射，进一步提升了第二基板的透光率。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的俯视结构示意图；
图2为本申请实施例提供的显示面板的第一种截面结构示意图；
图3为本申请实施例提供的显示面板的第二种截面结构示意图；
图4为本申请实施例提供的显示面板的第三种截面结构示意图；
图5为本申请实施例提供的显示面板的第四种截面结构示意图；
图6为本申请实施例提供的显示面板的第五种截面结构示意图；
图7为图6中的显示面板的功能层的截面结构示意图；
图8为本申请实施例提供的显示面板的制备方法的流程示意图；
图8A~图8D为本申请实施例提供的显示面板的制备方法的流程结构示意图。
附图标记说明：
100、显示区；200、屏下透光区；
11、第一基板；12、第二基板；13、透光平坦层；14、增透降反膜；15、水氧阻隔层；16、功能层；17、偏光片；18、盖板；19、背板；20、散热层；21、光学胶；
111、第一通孔；121、盲孔；151、第二通孔；191、第三通孔；
161、薄膜晶体管阵列层；162、有机发光层；163、封装层；164、触控层。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
请参照图1，图1为本申请实施例提供的显示面板的俯视结构示意图。所述显示面板具有显示区100，所述显示区100具有屏下透光区200，所述显示区100用于正常显示，所述屏下透光区200用于显示图像的同时，可以透过光线以使位于所述显示面板的一侧且对应所述屏下透光区200设置的感光元件接收到光信号，其中，所述感光元件可为摄像头、光学触控组件和指纹识别传感器等，以使所述显示面板能够实现例如拍照功能、光学触控功能以及光学指纹识别等功能。所述屏下透光区200的形状可以为圆形、矩形、圆角矩形或不规则多边形，所述显示面板可以包括多个所述屏下透光区200。需要说明的是，本申请实施例以所述感光元件为摄像头为例进行阐述说明。
请参照图2，图2为本申请实施例提供的显示面板的第一种截面结构示意图。所述显示面板包括第一基板11和设置于所述第一基板11上的第二基板12，为了增加所述屏下透光区200的光透过率，所述第一基板11的透光率小于所述第二基板12的透光率。可以理解的是，显示面板通常采用柔性材料作为基板，由于低透过率柔性材料的极限延伸率较高，但光学透过性能差，易造成屏下摄像头取景信息采集不全。高透过率柔性材料的光学透过性能较高，但极限拉伸性能差，容易造成剥离时拉断。因此，通常采用低透光率柔性材料作为所述第一基板11，高透光率柔性材料作为所述第二基板12，所述第一基板11和所述第二基板12堆叠设置构成显示面板的衬底，所述第一基板11和所述第二基板12的优势互补，既保证了所述衬底具有良好的力学性能，避免剥离时拉断，又能够满足所述屏下透光区200高透光率的需求，避免拍摄效果发黄。
采用激光工艺在所述第一基板11上开设至少一个第一通孔111，在所述第二基板12上开设至少一个盲孔121，所述盲孔121自所述第二基板12朝向所述第一基板11的一侧表面向内凹陷形成，所述盲孔121对应所述第一通孔111设置。可以理解的是，所述第一通孔111和所述盲孔121均与所述屏下透光区200对应设置。由于所述第二基板12与所述盲孔121对应的位置未被完全去除，导致留下的未被去除的所述第二基板12的表面平整度欠佳，使得光线透过时会发生漫反射，光线透过率降低。
为克服上述缺陷，本申请实施例提供的显示面板还包括透光平坦层13，所述透光平坦层13设于所述盲孔121内，用以平坦所述盲孔121的底部，使得未被去除的所述第二基板12的不平整表面被填平，获得较为平整的膜层表面，从而可避免不平整表面所造成的漫反射，提升了所述第二基板12的透过率。在本申请实施例中，所述透光平坦层13的材料与所述第二基板12的材料相同，由于所述透光平坦层13与所述第二基板12的材料具有相同的化学成分，可降低所述透光平坦层13与未被去除的所述第二基板12的界面反射，且更易平坦不平整表面，不会降低所述第二基板12的透光率。
本申请实施例对于所述透光平坦层13的厚度并无特别限制，仅需满足能够平坦所述盲孔121的底部的不平整表面即可。但，由于所述第二基板12整体厚度过高，则将会导致所述第二基板12的整体力学性能较差，因此，所述透光平坦层13靠近所述第一基板11的一侧表面不高于所述第一基板11靠近所述第二基板12的一侧表面，也就是说，所述透光平坦层13的底表面不应超出所述第二基板12的顶表面。优选地，所述透光平坦层13靠近所述第一基板11的一侧表面与所述第一基板11靠近所述第二基板12的一侧表面平齐，使得所述第二基板12的厚度与未开设所述盲孔121时的厚度一致，避免出现段差。具体地，为了达到上述目的，本申请实施例可以使保留的未被去除的所述第二基板12的厚度小于原本所述第二基板12的厚度的二分之一。
所述显示面板还包括水氧阻隔层15，所述水氧阻隔层15位于所述第一基板11和所述第二基板12之间，一方面用于阻隔水氧，另一方面用于防止激光剥离对所述第一基板11和所述第二基板12造成损伤。所述水氧阻隔层15上开设有至少一个第二通孔151，所述第二通孔151对应所述第一通孔111和所述盲孔121设置。具体地，所述水氧阻隔层15的材料可以为无机层，例如氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。
所述透光平坦层13靠近所述第一基板11的一侧表面位于所述第二通孔151内，所述透光平坦13的厚度有多种情况，列举如下，具体选取哪种情况，应根据实际情况。
第一种情况，请参照图3，所述透光平坦层13填充部分所述盲孔121，此时，由于保留的未被去除的所述第二基板12与所述透光平坦层13的厚度之和较小，使得所述第二基板12的透光率相对较高。
第二种情况，请再次参照图2，在第一种情况的基础上，所述透光平坦层13可以完全填充所述盲孔121，此时由于保留的未被去除的所述第二基板12与所述透光平坦层13的厚度之和等于未开设所述盲孔时的所述第二基板12的厚度，在避免不平整表面所带来的透光率降低的情况下，能够使所述第二基板12保持原样。
第三种情况，请参照图4，所述透光平坦层13填充满所述盲孔121，并部分填充所述第二通孔151，由于保留的未被去除的所述第二基板12与所述透光平坦层13的厚度之和较大，则使得所述第二基板12的力学性能相较于第一种情况较好。
第四种情况，请参照图5，在第三种情况的基础上，所述透光平坦层13可以完全填充所述盲孔121和所述第二通孔151。
具体地，所述第一基板11的材料可以为黄色聚酰亚胺，所述第二基板12的材料为可以为无色透明聚酰亚胺。其中，黄色聚酰亚胺材料的极限延伸率约为无色透明聚酰亚胺材料的两倍，无色透明聚酰亚胺的光学透过性高，可以满足所述屏下透光区200的透光需求。
进一步地，所述透光平坦层13靠近所述第一基板11的一侧设置有增透降反膜14，可以进一步降低所述透光平坦层13与未被去除的所述第二基板12的界面反射，提升了所述屏下透光区200的透过率，获得优良的拍摄效果。具体地，所述增透降反膜14的厚度为亚微米级。所述增透降反膜14的材料可以为树脂。
需要说明的是，请参照图6，所述显示面板还包括功能层16、偏光片17、盖板18、背板19和散热层20等结构。所述功能层16设置于所述第二基板12上，所述偏光片17设置于所述功能层16上，所述盖板18和所述偏光片17之间设置有光学胶21。所述背板19设置于所述第一基板11背离所述第二基板12的一侧，起到支撑所述显示面板的作用。所述散热层20设置于所述背板19背离所述第一基板11的一侧，用于对所述显示面板进行散热。所述散热层20的材料可以为SCF复合材料。所述背板19和所述散热层20上均开设有第三通孔191，所述第三通孔191和所述第一通孔111、所述第二通孔151和所述盲孔121对应设置。
具体地，请参照图7，所述功能层16包括薄膜晶体管阵列层161、有机发光层162、封装层163和触控层164。所述薄膜晶体管阵列层161设置于所述第二基板12上，具体地，所述薄膜晶体管阵列层161包括多个薄膜晶体管，所述薄膜晶体管可以为低温多晶硅薄膜晶体管，所述薄膜晶体管阵列层包括第一金属层、栅极绝缘层、有源层、第二金属层和钝化层等膜层结构。所述有机发光层162设置于所述薄膜晶体管阵列层161上，用于发射多种颜色的光线，所述有机发光层162可以包括红色发光层、绿色发光层和蓝色发光层等。所述封装层163设置于所述有机发光层162上，用于防止外界水氧对所述有机发光层162造成侵蚀而导致失效。所述封装层163可采用薄膜封装。所述触控层164设置于所述封装层163上，可采用直接将触控层制作于薄膜封装层之上（Direct on-cell touch，DOT）触控方案，以实现触控功能。
请参照图8，图8为本申请实施例提供的显示面板的制备方法的流程示意图，图8A至图8D为本申请实施例提供的显示面板的制备方法的流程结构示意图。所述显示面板的制备方法包括以下步骤：
S10：提供第一基板11和位于所述第一基板11上的第二基板12，其中，所述第二基板12的透光率大于所述第一基板11的透光率。
具体地，请参考图8A，所述第一基板11和所述第二基板12之间还设置有水氧阻隔层15，所述水氧阻隔层15的材料可以为无机层，例如氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。所述第一基板11的材料可以为黄色聚酰亚胺，所述第二基板12的材料为可以为无色透明聚酰亚胺。其中，黄色聚酰亚胺材料的极限延伸率约为无色透明聚酰亚胺材料的两倍，无色透明聚酰亚胺的光学透过性高，可以满足所述屏下透光区的透光需求。
S20：采用激光工艺在所述第一基板11上形成至少一个第一通孔111，在所述第二基板12上形成至少一个盲孔121，所述盲孔121自所述第二基板12朝向所述第一基板11的一侧表面向内凹陷形成，所述盲孔121对应所述第一通孔111设置。
具体地，请参照图8B，采用激光照射所述第一基板11的屏下透光区，所述第一基板11位于所述屏下透光区的部分被全部去除以形成所述第一通孔111，所述第二基板12位于所述屏下透光区的部分未被完全去除以形成所述盲孔121，所述盲孔121对应所述第一通孔111设置。本申请实施例可以使保留的未被去除的所述第二基板12的厚度小于原本所述第二基板12的厚度的二分之一。
进一步地，采用同一道激光工艺对所述水氧阻隔层15进行照射以在水氧阻隔层上形成第二通孔151，所述第二通孔151与所述第一通孔111对应设置。
S30：在所述盲孔121内涂布形成透光平坦层13，其中，所述透光平坦层13的材料与所述第二基板12的材料相同。
具体地，请参照图8C，在本申请实施例中，所述透光平坦层13的材料也为无色透明亚聚酰胺。由于所述透光平坦层13与所述第二基板12的材料具有相同的化学成分，可降低所述透光平坦层13与未被去除的所述第二基板12的界面反射，且更易平坦不平整表面，不会降低所述第二基板12的透光率。
进一步地，请参照图8D，在所述盲孔121内涂布形成透光平坦层13之后，还包括以下步骤：采用化学气相沉积工艺在所述透光平坦层13靠近所述第一基板11的一侧蒸镀形成增透降反膜14。具体地，所述增透降反膜14的厚度为亚微米级，所述增透降反膜14的材料可以为树脂，可以进一步降低所述透光平坦层13与未被去除的所述第二基板12的界面反射，提升了所述屏下透光区的透过率，获得优良的拍摄效果。
需要说明的是，在所述采用激光工艺在所述第一基板11上形成至少一个第一通孔111之前，还包括以下步骤：在所述第二基板12上形成功能层；提供一偏光片，贴附于所述功能层上；提供一盖板，贴附于所述偏光片上；在所述第一基板11背离所述功能层的一侧形成背板；以及在所述背板背离所述功能层的一侧形成散热层。具体地，在所述第二基板12上形成功能层，具体包括以下步骤：在所述第二基板12上形成薄膜晶体管阵列层；在所述薄膜晶体管阵列层上形成有机发光层；在所述有机发光层上形成封装层；以及在所述封装层上形成触控层。由于此为现有技术，在此不再详述。
本申请实施例还提供一种显示装置，所述显示装置包括上述显示面板以及感光元件，所述感光元件设置于所述显示面板的一侧且对应所述屏下透光区设置。具体地，所述感光元件可以为摄像头，所述显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
有益效果为：本申请实施例提供的显示面板及其制备方法，通过在盲孔内设置透光平坦层，用以平坦盲孔的底部，使得未被去除的所述第二基板的不平整表面被填平，从而能够获得较为平整的膜层表面，避免不平整表面所造成的漫反射，提升了第二基板的透过率；由于透光平坦层的材料与第二基板的材料相同，可降低透光平坦层与未被去除的第二基板的界面反射，进一步提升了第二基板的透光率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，包括第一基板和设置于所述第一基板上的第二基板，所述第一基板的透光率小于所述第二基板的透光率；所述第一基板上开设有至少一个第一通孔，所述第二基板上设有至少一个盲孔，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；
    所述显示面板还包括透光平坦层，所述透光平坦层设于所述盲孔内，用以平坦所述盲孔的底部，所述透光平坦层的材料与所述第二基板的材料相同。
  2. 根据权利要求1所述的显示面板，其中所述显示面板还包括水氧阻隔层，所述水氧阻隔层位于所述第一基板和所述第二基板之间，所述水氧阻隔层上开设有至少一个第二通孔，所述第二通孔对应所述第一通孔和所述盲孔设置。
  3. 根据权利要求2所述的显示面板，其中所述透光平坦层填充部分所述盲孔；或，所述透光平坦层完全填充所述盲孔；或，所述透光平坦层完全填充所述盲孔，并部分填充所述第二通孔；或，所述透光平坦层完全填充所述盲孔和所述第二通孔。
  4. 根据权利要求2所述的显示面板，其中所述水氧阻隔层的材料为氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。
  5. 根据权利要求1所述的显示面板，其中所述显示面板还包括增透降反膜，所述增透降反膜设置于所述透光平坦层朝向所述第一基板的一侧。
  6. 根据权利要求5所述的显示面板，其中所述增透降反膜的厚度为亚微米级。
  7. 根据权利要求1所述的显示面板，其中所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
  8. 根据权利要求1所述的显示面板，所述显示面板还包括：
    功能层，设置于所述第二基板上；
    偏光片，设置于所述功能层上；
    盖板，设置于所述偏光片上；
    背板，设置于所述第一基板背离所述功能层的一侧；以及
    散热层，设置于所述背板背离所述功能层的一侧；
    其中，所述背板和所述散热层均开设有第三通孔，所述第三通孔与所述第一通孔对应设置。
  9. 一种显示装置，包括显示面板；以及
    感光元件，设置于所述显示面板的一侧且对应所述第一通孔设置；
    所述显示面板包括第一基板和设置于所述第一基板上的第二基板，所述第一基板的透光率小于所述第二基板的透光率；所述第一基板上开设有至少一个第一通孔，所述第二基板上设有至少一个盲孔，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；
    所述显示面板还包括透光平坦层，所述透光平坦层设于所述盲孔内，用以平坦所述盲孔的底部，所述透光平坦层的材料与所述第二基板的材料相同。
  10. 根据权利要求9所述的显示装置，其中所述显示面板还包括水氧阻隔层，所述水氧阻隔层位于所述第一基板和所述第二基板之间，所述水氧阻隔层上开设有至少一个第二通孔，所述第二通孔对应所述第一通孔和所述盲孔设置。
  11. 根据权利要求10所述的显示装置，其中所述透光平坦层填充部分所述盲孔；或，所述透光平坦层完全填充所述盲孔；或，所述透光平坦层完全填充所述盲孔，并部分填充所述第二通孔；或，所述透光平坦层完全填充所述盲孔和所述第二通孔。
  12. 根据权利要求10所述的显示装置，其中所述水氧阻隔层的材料为氧化硅、氮化硅以及氮氧化硅中的一种或几种的组合。
  13. 根据权利要求9所述的显示装置，其中所述显示面板还包括增透降反膜，所述增透降反膜设置于所述透光平坦层朝向所述第一基板的一侧。
  14. 根据权利要求13所述的显示装置，其中所述增透降反膜的厚度为亚微米级。
  15. 根据权利要求9所述的显示装置，其中所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
  16. 根据权利要求9所述的显示装置，其中所述显示面板还包括：
    功能层，设置于所述第二基板上；
    偏光片，设置于所述功能层上；
    盖板，设置于所述偏光片上；
    背板，设置于所述第一基板背离所述功能层的一侧；以及
    散热层，设置于所述背板背离所述功能层的一侧；
    其中，所述背板和所述散热层均开设有第三通孔，所述第三通孔与所述第一通孔对应设置。
  17. 一种如权利要求1所述的显示面板的制备方法，包括以下步骤：
    提供第一基板和位于所述第一基板上的第二基板，其中，所述第二基板的透光率大于所述第一基板的透光率；
    采用激光工艺在所述第一基板上形成至少一个第一通孔，在所述第二基板上形成至少一个盲孔，其中，所述盲孔自所述第二基板朝向所述第一基板的一侧表面向内凹陷形成，所述盲孔对应所述第一通孔设置；以及
    在所述盲孔内涂布形成透光平坦层以平坦所述盲孔的底部，其中，所述透光平坦层的材料与所述第二基板的材料相同。
  18. 根据权利要求17所述的显示面板的制备方法，其中在所述盲孔内涂布形成透光平坦层之后，还包括以下步骤：
    采用化学气相沉积工艺在所述透光平坦层靠近所述第一基板的一侧蒸镀形成增透降反膜。
  19. 根据权利要求17所述的显示面板的制备方法，其中在所述采用激光工艺在所述第一基板上形成至少一个第一通孔之前，还包括以下步骤：
    在所述第二基板上形成功能层；
    提供一偏光片，贴附于所述功能层上；
    提供一盖板，贴附于所述偏光片上；
    在所述第一基板背离所述功能层的一侧形成背板；以及
    在所述背板背离所述功能层的一侧形成散热层。
  20. 根据权利要求17所述的显示面板的制备方法，其中所述第一基板的材料为黄色聚酰亚胺，所述第二基板的材料为无色透明聚酰亚胺。
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