WO2021047163A1 - 一种显示面板、显示模组以及显示装置 - Google Patents

一种显示面板、显示模组以及显示装置 Download PDF

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Publication number
WO2021047163A1
WO2021047163A1 PCT/CN2020/080199 CN2020080199W WO2021047163A1 WO 2021047163 A1 WO2021047163 A1 WO 2021047163A1 CN 2020080199 W CN2020080199 W CN 2020080199W WO 2021047163 A1 WO2021047163 A1 WO 2021047163A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
hole
layer
display panel
display
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PCT/CN2020/080199
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English (en)
French (fr)
Inventor
段艳强
宋月龙
丁才华
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/966,006 priority Critical patent/US11930692B2/en
Publication of WO2021047163A1 publication Critical patent/WO2021047163A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • This application relates to the field of display, in particular to a display panel, a display module, and a display device.
  • the current technology obtains special-shaped screens, such as flow sea screens, water drop screens, etc., by cutting the display panel in special shapes, and then disposes electronic components in the special-shaped areas.
  • this narrow frame technology needs to cut the display panel, the process is complicated, and the cut area cannot emit light.
  • the current narrow bezel technology has a technical problem that requires cutting the display panel.
  • the present application provides a display panel, a display module, and a display device to solve the technical problem of cutting the display panel in the current narrow bezel technology.
  • the present application provides a display panel, which includes:
  • the flexible substrate includes a first flexible substrate, a second flexible substrate, and an inorganic layer located between the first flexible substrate and the second flexible substrate, and the first flexible substrate Arranged on the side of the second flexible substrate away from the driving circuit layer;
  • the first flexible substrate is formed with a first through hole.
  • the first through hole extends to the inorganic layer and penetrates the inorganic layer.
  • the first through hole extends to the second flexible substrate and does not penetrate the second flexible substrate.
  • the inorganic layer is formed with a ring-shaped opening, and the outer boundary of the ring-shaped opening coincides with the boundary of the first through hole.
  • the first through hole is one of a circular shape and a square shape.
  • the material of the first flexible substrate and the second flexible substrate is polyimide.
  • the embodiment of the present application provides a display module, which includes:
  • the display panel includes a flexible substrate and a drive circuit layer and a light-emitting function layer disposed on the flexible substrate, the flexible substrate includes a first flexible substrate, a second flexible substrate, and The inorganic layer between the first flexible substrate and the second flexible substrate, the first flexible substrate is arranged on the side of the second flexible substrate away from the driving circuit layer; On the path, the first flexible substrate is formed with a first through hole;
  • the supporting film is attached to the first flexible substrate for supporting the display panel.
  • the support film is formed with a second through hole, and on the lighting path of the electronic component, the first through hole and the second through hole have an overlapping area.
  • the supporting film includes a supporting layer and an adhesive layer, and the supporting layer is attached to the first flexible substrate through the adhesive layer.
  • the material of the support layer is one of ethylene terephthalate or polyimide.
  • the material of the adhesive layer is one of pressure-sensitive adhesive or optical adhesive.
  • the first through hole and the second through hole are both circular, and the aperture of the first through hole is smaller than the aperture of the second through hole.
  • the first through hole and the second through hole are both square, and the side length of the first through hole is smaller than the side length of the second through hole.
  • An embodiment of the present application provides a display device, which includes:
  • Display module includes a display panel and a supporting film
  • Electronic components are located under the display module.
  • the supporting film is formed with a second through hole, and on the lighting path of the electronic component, the first through hole and the second through hole have an overlapping area.
  • all or part of the lighting unit of the electronic component is placed in the second through hole.
  • the supporting film includes a supporting layer and an adhesive layer, and the supporting layer is attached to the first flexible substrate through the adhesive layer.
  • the material of the support layer is one of ethylene terephthalate or polyimide.
  • the material of the adhesive layer is one of pressure-sensitive adhesive or optical adhesive.
  • the first through hole and the second through hole are both circular, and the aperture of the first through hole is smaller than the aperture of the second through hole.
  • the application provides a display panel, a display module, and a display device.
  • the display panel includes a flexible substrate, a driving circuit and a light-emitting function layer disposed on the flexible substrate, and the flexible substrate includes A first flexible substrate, a second flexible substrate, and an inorganic layer located between the first flexible substrate and the second flexible substrate, the first flexible substrate is disposed on the second flexible substrate
  • the first flexible substrate is formed with a first through hole; based on the through hole, the light transmittance of the display panel is increased, so that the camera can be
  • the electronic components are arranged under the display panel to realize a narrow frame design.
  • the display panel does not need to be cut, which solves the technical problem of cutting the display panel in the current narrow frame technology.
  • FIG. 1 is a schematic diagram of the first structure of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of a second structure of a display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a third structure of a display panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a fourth structure of a display panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a fifth structure of a display panel provided by an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • FIG. 7 to 14 are schematic diagrams of assembling the display device provided by the embodiments of the application.
  • the present application addresses the technical problem of cutting the display panel in the current narrow frame technology, which can be alleviated by the embodiments of the present application.
  • an embodiment of the present application provides a display panel, and the display panel 10 includes:
  • the flexible substrate 11 includes a first flexible substrate 111, a second flexible substrate 112, and an inorganic layer 113 located between the first flexible substrate 111 and the second flexible substrate 112.
  • the first flexible substrate 111 is disposed on a side of the second flexible substrate 112 away from the driving circuit layer 12;
  • the first flexible substrate 111 is formed with a first through hole 114.
  • This embodiment provides a display panel that includes a flexible substrate, a driving circuit and a light-emitting function layer disposed on the flexible substrate, and the flexible substrate includes a first flexible substrate, a second flexible substrate, And an inorganic layer located between the first flexible substrate and the second flexible substrate, the first flexible substrate is disposed on the side of the second flexible substrate away from the driving circuit layer, On the lighting path of the electronic component, the first flexible substrate is formed with a first through hole; based on the through hole, the light transmittance of the display panel is increased, so that the electronic components such as the camera can be placed under the display panel to achieve The narrow frame design, based on the second flexible substrate, does not need to cut the display panel, and solves the technical problem of cutting the display panel in the current narrow frame technology.
  • the center of the lighting path coincides with the center of the first through hole 114, so that the area of the first through hole 114 can be reduced.
  • the first through hole 114 extends to the inorganic layer 113, and does not penetrate the inorganic layer 113; based on this structure, on the lighting path of the electronic component, the inorganic layer 113 Being thinner reduces the light blocking of the inorganic layer 113.
  • the first through hole 114 extends to the inorganic layer 113 and penetrates the inorganic layer 113; based on this structure, the lighting path of the electronic component There is no inorganic layer 113 on it, which prevents the inorganic layer 113 from blocking light.
  • the first through hole 114 extends to the second flexible substrate 112, and does not penetrate the second flexible substrate 114, based on laser processing, etc. Process, the required shape can be obtained, and the film layer is flat; based on this structure, in the lighting path of the electronic component, the second flexible substrate 112 is thinner, which reduces the light barrier of the second flexible substrate 112 and improves the electronic components. The working effect of the component.
  • the first through hole 114 extends to one-third to two-thirds of the thickness of the second flexible substrate 112.
  • the inorganic layer 113 is formed with an annular opening 115, and the outer boundary of the annular opening 115 coincides with the boundary of the first through hole 114.
  • the shape of the first through hole 113 is one of a circle and a square.
  • the material of the first flexible substrate and the second flexible substrate is one of organic materials such as polyimide or ethylene terephthalate to reduce costs and enhance flexibility.
  • the cross section of the first through hole 114 is stepped, which reduces the process difficulty.
  • the flexible display panel 10 provided in this embodiment includes:
  • the flexible substrate 11 includes a first flexible substrate 111, a second flexible substrate 112, and an inorganic layer 113 located between the first flexible substrate 111 and the second flexible substrate 112.
  • the flexible substrate 111 is disposed on a side of the second flexible substrate 112 away from the driving circuit layer 12;
  • the driving circuit layer 12 includes a buffer layer, an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, a source and drain metal layer, and a passivation layer;
  • the light-emitting function layer 13 includes an anode metal layer, a pixel definition layer, an OLED light-emitting layer, and an encapsulation layer;
  • a via hole is formed on the interlayer insulating layer, and the source and drain metal layers are communicated with the active layer through the via hole.
  • the material of the pixel definition layer is a high Young's modulus high molecular organic polymer.
  • the high molecular organic polymer is polydimethylsiloxane; polydimethylsiloxane has a high Young's modulus and can support the flexible display device well. It can effectively protect the flexible display panel by dispersing applied stress (compression/bending stress).
  • the pixel definition layer further includes a black dye; the black dye is used to form the pixel definition layer in black, and the black pixel definition layer is beneficial to block lateral light leakage between adjacent sub-pixels. , To improve the contrast of the flexible display panel.
  • the pixel definition layer is prepared by nano transfer printing.
  • the via hole penetrates the interlayer insulating layer and ends at the active layer; the via hole is formed on the interlayer insulating layer mainly to make the source and drain metal The layer communicates with the active layer.
  • the OLED light-emitting layer includes a red sub-pixel light-emitting layer, a green sub-pixel light-emitting layer, and a blue sub-pixel light-emitting layer.
  • the material of the buffer layer is one or two of silicon nitride or silicon oxide, and the thickness of the buffer layer is 2000 to 3000 angstroms.
  • the material of the gate insulating layer is silicon nitride or silicon oxide, and the thickness of the gate insulating layer is 800 to 1000 angstroms.
  • the thickness of the interlayer insulating layer is 2000 to 3000 angstroms.
  • the material of the source and drain metal layers is titanium or titanium aluminum alloy.
  • the material of the gate metal layer is molybdenum or the like.
  • the material of the anode metal layer is indium tin oxide or the like.
  • the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer that are stacked; the material of the first inorganic encapsulation layer is silicon nitride and silicon dioxide. , Aluminum oxide, titanium dioxide, and zirconium dioxide, or a combination of any two or more, and the material of the second inorganic encapsulation layer is the same as the material of the first inorganic encapsulation layer.
  • the driving circuit 12 and the light-emitting function layer 13 form a third through hole, and the first inorganic encapsulation layer is formed on the second flexible substrate 112 to further enhance light transmission. effect.
  • an embodiment of the present application provides a display module, and the display module 60 includes:
  • the display panel 10 includes a flexible substrate 11 and a driving circuit layer 12 and a light-emitting function layer 13 disposed on the flexible substrate 11.
  • the flexible substrate 11 includes a first flexible substrate 111 and a first flexible substrate 111.
  • the supporting film 20 is attached to the first flexible substrate 111 for supporting the display panel 10.
  • the display panel in the display module includes a flexible substrate, a driving circuit and a light-emitting function layer disposed on the flexible substrate, and the flexible substrate includes a first flexible substrate, A second flexible substrate, and an inorganic layer located between the first flexible substrate and the second flexible substrate, the first flexible substrate is disposed on the second flexible substrate away from the driving circuit
  • the first flexible substrate is formed with a first through hole; based on the through hole, the light transmittance of the display panel is increased, so that electronic components such as a camera can be placed on the display Below the panel, a narrow frame design is realized, and at the same time, based on the second flexible substrate, there is no need to cut the display panel.
  • the supporting film 20 includes a supporting layer 21 and an adhesive layer 22, and the supporting layer 21 is attached to the first flexible substrate 111 through the adhesive layer 22.
  • the supporting film 20 is formed with a second through hole 23.
  • the first through hole 114 is connected to the second through hole.
  • the holes 23 have overlapping areas to further enhance the lighting effect of the electronic components.
  • the material of the support layer 21 is one of ethylene terephthalate or polyimide.
  • the material of the adhesive layer 22 is one of pressure-sensitive adhesive or optical adhesive.
  • the first through hole 114 and the second through hole 23 are both circular, and the diameter of the first through hole 114 is smaller than that of the second through hole. 23 of the aperture.
  • first through hole and the second through hole are both square, and the side length of the first through hole is smaller than the side length of the second through hole.
  • the first through hole 114 is located in the setting area of the second through hole 23.
  • the display module 70 further includes a polarizer, a touch panel, etc., which are disposed on the display panel 10, so as to realize a complete touch and display function.
  • the present application provides a display device.
  • the display device 70 includes:
  • the display module 60 includes a display panel 10 and a supporting film 20;
  • the electronic component 30 is located below the display module.
  • the supporting film 20 is formed with a second through hole 23.
  • the first through hole 114 and the second through hole 23 There are overlapping areas.
  • the lighting unit of the electronic component 30 is entirely or partially placed in the second through hole to further reduce the thickness of the display device.
  • the electronic component 30 is a camera module, and the lighting unit of the camera module is a lens, and the lens is wholly or partially placed in the second through hole.
  • the present application provides a display device assembly method, including the following steps:
  • Step 1 Provide a display module.
  • the display module includes a display panel and a supporting film; the display panel includes: a flexible substrate; a driving circuit and a light-emitting function layer disposed on the flexible substrate; wherein, the flexible substrate It includes a first flexible substrate, a second flexible substrate, and an inorganic layer located between the first flexible substrate and the second flexible substrate.
  • the first flexible substrate is disposed on the second flexible substrate. The side of the substrate away from the driving circuit layer; on the lighting path of the electronic component, the first flexible substrate is formed with a first through hole; the support film is formed with a second through hole, and the electronic component On the daylighting path of, there is an overlap area between the first through hole and the second through hole.
  • Step 2 Assemble electronic components and display modules.
  • the electronic component is a camera module
  • the lighting unit of the camera module is a lens
  • the lens is wholly or partially placed in the second through hole.
  • the step of providing a display module includes the following steps:
  • Step a1 As shown in FIG. 7, the supporting film 20 is attached to the display panel 10 and placed upside down on the machine table.
  • the flexible display panel 10 provided in this step has not yet formed a first through hole, and the flexible support film 20 has not yet formed a second through hole.
  • Step a2 as shown in Figure 8, laser cutting the support film 20, the cutting method is to use a laser to cut a circle, the cutting depth is the total thickness of the support film 20, and then tear off the support film 20 in the cutting area to form Second through hole 23.
  • Step a3 as shown in FIG. 9, perform a first laser processing on the first flexible substrate, and the purpose of the processing is to separate the first flexible substrate from the second flexible substrate.
  • Step a4 As shown in FIG. 10, perform a second laser processing on the first flexible substrate, the processing method is cutting, the cutting shape is a ring shape, and the cutting depth is the sum of the thicknesses of the first flexible substrate 111 and the inorganic layer 112 After the cutting is completed, the first flexible substrate 111 is torn off to form the first through hole 114.
  • the advantage of using a laser process to process the flexible substrate to form the first through hole 114 is that the bottom of the groove formed by the first through hole and the second flexible substrate is flat, which can effectively reduce the haze of the flexible substrate. Effectively improve the visible light transmittance.
  • the opening area of the second through hole 23 is larger than the opening area of the first through hole 114, which facilitates laser processing and material tearing of the first through hole 114.
  • the processing area of the second laser processing is larger than the processing area of the first laser processing, so that the ring-shaped opening 115 can be formed on the 113, which can prevent the first flexible substrate from being in the first through hole 114. It is separated from the inorganic layer; the width of the ring-shaped opening 115 meets the requirements of the tearing process of the first flexible substrate, for example, the width may be 50 nanometers to 1000 nanometers.
  • the step of providing a display module includes the following steps:
  • Step b1 place the display panel upside down on the machine table, and perform the first laser processing on the first flexible substrate.
  • the purpose of the processing is to separate the first flexible substrate from the second flexible substrate.
  • Step b2 perform a second laser processing on the first flexible substrate, the processing method is cutting, the cutting shape is annular, and the cutting depth is the sum of the thickness of the first flexible substrate 111 and the inorganic layer 112 After the cutting is completed, the first flexible substrate 111 is torn off to form the first through hole 114.
  • Step b3 as shown in Figure 13, provide a supporting film.
  • the supporting film 20 formed with the second through hole is directly provided, that is, the supporting film 20 with holes is used to reduce one laser processing.
  • Step b4 attach the support film 20 to the display panel 10.
  • the embodiments of the present application provide a display panel, a display module, and a display device.
  • the display panel includes a flexible substrate, a driving circuit and a light-emitting function layer disposed on the flexible substrate, and the flexible substrate includes a first flexible substrate.

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Abstract

提供了一种显示面板（10）、显示模组（60）以及显示装置。显示面板的柔性衬底（11）包括第一柔性衬底（111）、无机层（113）、第二柔性衬底（112）；在电子元件（30）的采光路径上，第一柔性衬底形成有第一通孔（114）；基于通孔，增大了显示面板透光率，这样就可以把摄像头等电子元件设置在显示面板的下方，实现了窄边框设计。

Description

一种显示面板、显示模组以及显示装置 技术领域
本申请涉及显示领域，尤其是一种显示面板、显示模组以及显示装置。
 背景技术
随着终端显示技术发展，用户对手机等显示装置的窄边框要求越来越高，因此，将摄像头等电子元件设置在边框的方式，已经不能满足用户需求。
当前技术为了实现窄边框要求，通过对显示面板进行异形切割得到异形屏，例如流海屏、水滴屏等，然后将电子元件设置在异形区域。但是，这种窄边框技术需要对显示面板进行切割，工艺复杂，且切割区无法发光。
即当前窄边框技术存在需要切割显示面板的技术问题。
 技术问题
本申请提供一种显示面板、显示模组以及显示装置，以解决当前窄边框技术存在的需要切割显示面板的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，其包括：
柔性衬底；
设置在所述柔性衬底上的驱动电路及发光功能层；
其中，所述柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧；
在电子元件的采光路径上，所述第一柔性衬底形成有第一通孔。
在本申请实施例提供的显示面板中，所述第一通孔延伸到所述无机层，且贯穿所述无机层。
在本申请实施例提供的显示面板中，所述第一通孔延至所述第二柔性衬底，且未贯穿所述第二柔性衬底。
在本申请实施例提供的显示面板中，所述无机层形成有环状开口，所述环形开口的外边界与所述第一通孔边界重合。
在本申请实施例提供的显示面板中，所述第一通孔为圆形、方形中的一种。
在本申请实施例提供的显示面板中，所述第一柔性衬底及所述第二柔性衬底的材料为聚酰亚胺。
本申请实施例提供一种显示模组，其包括：
显示面板；所述显示面板包括柔性衬底以及设置在所述柔性衬底上的驱动电路层及发光功能层，所述柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层一侧；在电子元件的采光路径上，所述第一柔性衬底形成有第一通孔；
支撑膜，与所述第一柔性衬底贴合，用于支撑所述显示面板。
在本申请实施例提供的显示模组中，所述支撑膜形成有第二通孔，在所述电子元件的采光路径上，所述第一通孔与所述第二通孔存在重叠区。
在本申请实施例提供的显示模组中，所述支撑膜包括支撑层和粘合层，所述支撑层通过所述粘合层与所述第一柔性衬底贴合。
在本申请实施例提供的显示模组中，所述支撑层的材料为对苯二甲酸乙二醇酯或聚酰亚胺中的一种。
在本申请实施例提供的显示模组中，所述粘合层的材料为压敏胶或光学胶中的一种。
在本申请实施例提供的显示模组中，所述第一通孔与所述第二通孔均为圆形，且所述第一通孔的孔径小于所述第二通孔的孔径。
在本申请实施例提供的显示模组中，所述第一通孔与所述第二通孔均为正方形，且所述第一通孔的边长小于第二通孔的边长。
本申请实施例提供一种显示装置，其包括：
显示模组；所述显示模组包括显示面板及支撑膜；
电子元件，位于所述显示模组下方。
在本申请实施例提供的显示装置中，所述支撑膜形成有第二通孔，在所述电子元件的采光路径上，第一通孔与所述第二通孔存在重叠区。
在本申请实施例提供的显示装置中，所述电子元件的采光单元全部或部分放置在所述第二通孔内。
在本申请实施例提供的显示装置中，所述支撑膜包括支撑层和粘合层，所述支撑层通过所述粘合层与所述第一柔性衬底贴合。
在本申请实施例提供的显示装置中，所述支撑层的材料为对苯二甲酸乙二醇酯或聚酰亚胺中的一种。
在本申请实施例提供的显示装置中，所述粘合层的材料为压敏胶或光学胶中的一种。
在本申请实施例提供的显示装置中，所述第一通孔与所述第二通孔均为圆形，且所述第一通孔的孔径小于所述第二通孔的孔径。
 有益效果
本申请的有益效果：本申请提供一种显示面板、显示模组以及显示装置，该显示面板包括柔性衬底、设置在所述柔性衬底上的驱动电路及发光功能层，其柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧，在电子元件的采光路径上，第一柔性衬底形成有第一通孔；基于该通孔，增大了显示面板透光率，这样就可以把摄像头等电子元件设置在显示面板的下方，实现了窄边框设计，同时基于第二柔性衬底，不需要对显示面板进行切割，解决当前窄边框技术存在的需要切割显示面板的技术问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的第一种结构示意图。
图2为本申请实施例提供的显示面板的第二种结构示意图。
图3为本申请实施例提供的显示面板的第三种结构示意图。
图4为本申请实施例提供的显示面板的第四种结构示意图。
图5为本申请实施例提供的显示面板的第五种结构示意图。
图6为本申请实施例提供的显示装置的结构示意图。
图7至图14为本申请实施例提供的显示装置的组装示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对当前窄边框技术存在需要切割显示面板的技术问题，本申请实施例可以缓解。
如图1所示，本申请实施例提供一种显示面板，该显示面板10包括：
柔性衬底11；
设置在所述柔性衬底11上的驱动电路12及发光功能层13；
其中，所述柔性衬底11包括第一柔性衬底111、第二柔性衬底112、以及位于所述第一柔性衬底111和所述第二柔性衬底112之间的无机层113，所述第一柔性衬底111设置在所述第二柔性衬底112远离所述驱动电路层12的一侧；
在电子元件30的采光路径上，所述第一柔性衬底111形成有第一通孔114。
本实施例提供一种显示面板，该显示面板包括柔性衬底、设置在所述柔性衬底上的驱动电路及发光功能层，其柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧，在电子元件的采光路径上，第一柔性衬底形成有第一通孔；基于该通孔，增大了显示面板透光率，这样就可以把摄像头等电子元件设置在显示面板的下方，实现了窄边框设计，同时基于第二柔性衬底，不需要对显示面板进行切割，解决当前窄边框技术存在的需要切割显示面板的技术问题。
在一种实施例中，采光路径的中心与第一通孔114的中心重合，可以减小第一通孔114的面积。
在一种实施例中，为了增强透光效果，第一通孔114延伸到所述无机层113，且未贯穿所述无机层113；基于该结构，在电子元件的采光路径上，无机层113较薄，降低了无机层113对光线的阻隔。
在一种实施例中，为了增强透光效果，如图2所示，第一通孔114延伸到所述无机层113，且贯穿所述无机层113；基于该结构，在电子元件的采光路径上不存在无机层113，避免了无机层113对光线的阻隔。
在一种实施例中，为了增强透光效果，如图3所示，第一通孔114延至所述第二柔性衬底112，且未贯穿所述第二柔性衬底114，基于激光加工等工艺，可以得到需要的形状，并且膜层平整；基于该结构，在电子元件的采光路径上，第二柔性衬底112较薄，降低了第二柔性衬底112对光线的阻隔，提高了电子元件的工作效果。
在一种实施例中，第一通孔114延至所述第二柔性衬底112厚度的三分之一至三分之二。
在一种实施例中，为了降低工艺要求，如图4所示，无机层113形成有环状开口115，所述环形开口115的外边界与所述第一通孔114边界重合。
在一种实施例中，为了降低加工难度，第一通孔113的形状为圆形、方形中的一种。
在一种实施例中，第一柔性衬底及所述第二柔性衬底的材料为聚酰亚胺或者对苯二甲酸乙二醇酯等有机材料中的一种，以降低成本，增强柔性。
在一种实施例中，如图5所示，第一通孔114的截面为台阶状，降低工艺难度。
在一种实施例中，本实施例提供的柔性显示面板10包括：
柔性衬底11，包括第一柔性衬底111、第二柔性衬底112、以及位于所述第一柔性衬底111和所述第二柔性衬底112之间的无机层113，所述第一柔性衬底111设置在所述第二柔性衬底112远离所述驱动电路层12的一侧；
驱动电路层12，包括缓冲层、有源层、栅极绝缘层、栅极金属层、层间绝缘层、源漏极金属层以及钝化层；
发光功能层13，包括阳极金属层、像素定义层、OLED发光层以及封装层；
所述层间绝缘层上形成有过孔，所述源漏极金属层通过所述过孔与所述有源层相连通。
在一种实施例中，所述像素定义层的材质为高杨氏模量的高分子有机聚合物。
在一种实施例中，所述高分子有机聚合物为聚二甲基硅氧烷；聚二甲基硅氧烷具有高杨氏模量，能对所述柔性显示装置起到很好的支撑作用，分散外加施加应力(压/弯曲应力)，能够很好的保护所述柔性显示面板。
在一种实施例中，所述像素定义层还包括黑色染料;所述黑色染料用以形成黑色的所述像素定义层，黑色的像素定义层有利于阻断相邻子像素之间的横向漏光，提升所述柔性显示面板的对比度。
在一种实施例中，所述像素定义层通过纳米转印方式制备。
在一种实施例中，所述过孔贯穿所述层间绝缘层并止于所述有源层；在所述层间绝缘层上形成所述过孔主要是为了使所述源漏极金属层与所述有源层相连通。
在一种实施例中，所述OLED发光层包括红色子像素发光层、绿色子像素发光层以及蓝色子像素发光层。
在一种实施例中，所述缓冲层的材料为氮化硅或氧化硅其中的一种或两种，所述缓冲层的厚度为2000至3000埃米。
在一种实施例中，所述栅极绝缘层的材料为氮化硅或氧化硅，所述栅极绝缘层的厚度为800至1000埃米。
在一种实施例中，所述层间绝缘层的厚度为2000至3000埃米。
在一种实施例中，所述源漏极金属层的材料为钛或钛铝合金等。
在一种实施例中，所述栅极金属层的材料为钼等。
在一种实施例中，所述阳极金属层的材料为氧化铟锡等。
在一种实施例中，所述封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层；所述第一无机封装层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆以上一种或任意二种以上的组合，所述第二无机封装层的材料与所述第一无机封装层的材料相同。
在一种实施例中，在电子元件30的采光路径上，驱动电路12及发光功能层13形成第三通孔，第一无机封装层形成在第二柔性衬底112上，以进一步增强透光效果。
如图6所示，本申请实施例提供一种显示模组，该显示模组60包括：
显示面板10；所述显示面板10包括柔性衬底11以及设置在所述柔性衬底11上的驱动电路层12及发光功能层13，所述柔性衬底11包括第一柔性衬底111、第二柔性衬底112、以及位于所述第一柔性衬底111和所述第二柔性衬底112之间的无机层113，所述第一柔性衬底111设置在所述第二柔性衬底112远离所述驱动电路层12的一侧；在电子元件30的采光路径上，所述第一柔性衬底111形成有第一通孔114；
支撑膜20，与所述第一柔性衬底111贴合，用于支撑所述显示面板10。
本实施例提供一种显示模组，该显示模组内的显示面板包括柔性衬底、设置在所述柔性衬底上的驱动电路及发光功能层，其柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧，在电子元件的采光路径上，第一柔性衬底形成有第一通孔；基于该通孔，增大了显示面板透光率，这样就可以把摄像头等电子元件设置在显示面板的下方，实现了窄边框设计，同时基于第二柔性衬底，不需要对显示面板进行切割。
在一种实施例中，如图6所示，支撑膜20包括支撑层21和粘合层22，所述支撑层21通过所述粘合层22与所述第一柔性衬底111贴合。
在一种实施例中，如图6所示，所述支撑膜20形成有第二通孔23，在所述电子元件30的采光路径上，所述第一通孔114与所述第二通孔23存在重叠区，以进一步增强电子元件的采光效果。
在一种实施例中，所述支撑层21的材料为对苯二甲酸乙二醇酯或聚酰亚胺中的一种。
在一种实施例中，所述粘合层22的材料为压敏胶或光学胶中的一种。
在一种实施例中，如图6所示，所述第一通孔114与所述第二通孔23均为圆形，且所述第一通孔114的孔径小于所述第二通孔23的孔径。
在一种实施例中，所述第一通孔与所述第二通孔均为正方形，且所述第一通孔的边长小于第二通孔的边长。
在一种实施例中，如图6所示，所述第一通孔114位于所述第二通孔23的设置区域内。
在一种实施例中，显示模组70还包括设置在显示面板10之上的偏光片、触控面板等，以实现完整的触控及显示功能。
在一种实施例中，本申请提供一种显示装置，如图6所示，显示装置70包括：
显示模组60；所述显示模组60包括显示面板10及支撑膜20；
电子元件30，位于所述显示模组下方。
在一种实施例中，如图6所示，所述支撑膜20形成有第二通孔23，在所述电子元件30的采光路径上，第一通孔114与所述第二通孔23存在重叠区。
在一种实施例中，所述电子元件30的采光单元全部或部分放置在所述第二通孔内，以进一步减小显示装置的厚度。
在一种实施例中，所述电子元件30为摄像头模组，摄像头模组的采光单元为镜头，镜头全部或部分放置在所述第二通孔内。
同时，在一种实施例中，本申请提供了一种显示装置组装方法，包括以下步骤：
步骤1、提供显示模组。
在一种实施例中，所述显示模组包括显示面板及支撑膜；显示面板包括：柔性衬底；设置在所述柔性衬底上的驱动电路及发光功能层；其中，所述柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧；在电子元件的采光路径上，所述第一柔性衬底形成有第一通孔；所述支撑膜形成有第二通孔，在所述电子元件的采光路径上，第一通孔与所述第二通孔存在重叠区。
步骤2、组装电子元件与显示模组。
在一种实施例中，电子元件为摄像头模组，摄像头模组的采光单元为镜头，镜头全部或部分放置在所述第二通孔内。
在一种实施例中，如图7至图10所示，提供显示模组的步骤包括以下步骤：
步骤a1、如图7所示，将支撑膜20与显示面板10进行贴合，并倒放在机台上。
本步骤提供的柔性显示面板10尚没有形成第一通孔，柔性支撑膜20尚没有形成第二通孔。
步骤a2、如图8所示，对支撑膜20进行激光切割，切割方式为使用激光切割出一个圆形，切割深度为支撑膜20的总厚度，然后撕除切割区内的支撑膜20，形成第二通孔23。
步骤a3、如图9所示，对第一柔性衬底进行第一次激光加工，加工的目的为使得第一柔性衬底和第二柔性衬底分离。
步骤a4、如图10所示，对第一柔性衬底进行第二次激光加工，加工方式为切割，切割形状为环状，切割深度为第一柔性衬底111和无机层112的厚度之和，切割完成后，撕除第一柔性衬底111，以形成第一通孔114。
在本实施例中，使用激光工艺加工柔性衬底形成第一通孔114的优点为第一通孔与第二柔性衬底所形成的凹槽底部平坦，可有效降低柔性衬底雾度，可有效提升可见光透过率。
在一种实施例中，第二通孔23的开孔面积大于第一通孔114的开孔面积，便于第一通孔114的激光加工以及材料撕除。
在一种实施例中，第二次激光加工的加工面积大于第一次激光加工的加工面积，这样就可以使得113形成有环状开口115，可以防止第一柔性衬底在第一通孔114处与无机层分离；环状开口115的宽度满足第一柔性衬底的撕除工艺要求即可，例如宽度可以为50纳米至1000纳米。
在一种实施例中，如图11至图14所示，提供显示模组的步骤包括以下步骤：
步骤b1、如图11所示，将显示面板倒放在机台上，对第一柔性衬底进行第一次激光加工，加工的目的为使得第一柔性衬底和第二柔性衬底分离。
步骤b2、如图12所示，对第一柔性衬底进行第二次激光加工，加工方式为切割，切割形状为环状，切割深度为第一柔性衬底111和无机层112的厚度之和，切割完成后，撕除第一柔性衬底111，以形成第一通孔114。
步骤b3、如图13所示，提供支撑膜。
如图13所示，直接提供形成有第二通孔的支撑膜20，即采用来料带孔的支撑膜20，减少一次激光加工。
步骤b4、如图14所示，将支撑膜20与显示面板10进行贴合。
根据以上实施例可知：
本申请实施例提供一种显示面板、显示模组以及显示装置，该显示面板包括柔性衬底、设置在所述柔性衬底上的驱动电路及发光功能层，其柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧，在电子元件的采光路径上，第一柔性衬底形成有第一通孔；基于该通孔，增大了显示面板透光率，这样就可以把摄像头等电子元件设置在显示面板的下方，实现了窄边框设计，同时基于第二柔性衬底，不需要对显示面板进行切割，解决当前窄边框技术存在的需要切割显示面板的技术问题。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，其包括：
    柔性衬底；
    设置在所述柔性衬底上的驱动电路及发光功能层；
    其中，所述柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层的一侧；
    在电子元件的采光路径上，所述第一柔性衬底形成有第一通孔。
  2. 根据权利要求1所述的显示面板，其中，所述第一通孔延伸到所述无机层，且贯穿所述无机层。
  3. 根据权利要求2所述的显示面板，其中，所述第一通孔延至所述第二柔性衬底，且未贯穿所述第二柔性衬底。
  4. 根据权利要求1所述的显示面板，其中，所述无机层形成有环状开口，所述环形开口的外边界与所述第一通孔边界重合。
  5. 根据权利要求2所述的显示面板，其中，所述第一通孔为圆形、方形中的一种。
  6. 根据权利要求1所述的显示面板，其中，所述第一柔性衬底及所述第二柔性衬底的材料为聚酰亚胺。
  7. 一种显示模组，其包括：
    如权利要求1所述的显示面板；所述显示面板包括柔性衬底以及设置在所述柔性衬底上的驱动电路层及发光功能层，所述柔性衬底包括第一柔性衬底、第二柔性衬底、以及位于所述第一柔性衬底和所述第二柔性衬底之间的无机层，所述第一柔性衬底设置在所述第二柔性衬底远离所述驱动电路层一侧；在电子元件的采光路径上，所述第一柔性衬底形成有第一通孔；
    支撑膜，与所述第一柔性衬底贴合，用于支撑所述显示面板。
  8. 根据权利要求7所述的显示模组，所述支撑膜形成有第二通孔，在所述电子元件的采光路径上，所述第一通孔与所述第二通孔存在重叠区。
  9. 根据权利要求8所述的显示模组，其中，所述支撑膜包括支撑层和粘合层，所述支撑层通过所述粘合层与所述第一柔性衬底贴合。
  10.     根据权利要求9所述的显示模组，其中，所述支撑层的材料为对苯二甲酸乙二醇酯或聚酰亚胺中的一种。
  11.      根据权利要求9所述的显示模组，其中，所述粘合层的材料为压敏胶或光学胶中的一种。
  12.     根据权利要求8所述的显示模组，其中，所述第一通孔与所述第二通孔均为圆形，且所述第一通孔的孔径小于所述第二通孔的孔径。
  13.     根据权利要求8所述的显示模组，其中，所述第一通孔与所述第二通孔均为正方形，且所述第一通孔的边长小于第二通孔的边长。
  14.     一种显示装置，其包括：
    如权利要求7所述的显示模组；所述显示模组包括显示面板及支撑膜；
    电子元件，位于所述显示模组下方。
  15.     根据权利要求14所述的显示装置，其中，所述支撑膜形成有第二通孔，在所述电子元件的采光路径上，第一通孔与所述第二通孔存在重叠区。
  16.     根据权利要求15所述的显示装置，其中，所述电子元件的采光单元全部或部分放置在所述第二通孔内。
  17.     根据权利要求14所述的显示装置，其中，所述支撑膜包括支撑层和粘合层，所述支撑层通过所述粘合层与所述第一柔性衬底贴合。
  18.     根据权利要求14所述的显示装置，其中，所述支撑层的材料为对苯二甲酸乙二醇酯或聚酰亚胺中的一种。
  19.     根据权利要求14所述的显示装置，其中，所述粘合层的材料为压敏胶或光学胶中的一种。
  20.     根据权利要求14所述的显示装置，其中，所述第一通孔与所述第二通孔均为圆形，且所述第一通孔的孔径小于所述第二通孔的孔径。
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