WO2022156635A1 - 一种高性能氮化硅陶瓷基片的批量化烧结方法 - Google Patents

一种高性能氮化硅陶瓷基片的批量化烧结方法 Download PDF

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WO2022156635A1
WO2022156635A1 PCT/CN2022/072351 CN2022072351W WO2022156635A1 WO 2022156635 A1 WO2022156635 A1 WO 2022156635A1 CN 2022072351 W CN2022072351 W CN 2022072351W WO 2022156635 A1 WO2022156635 A1 WO 2022156635A1
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silicon nitride
powder
vacuuming
sintering method
ceramic substrate
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French (fr)
Chinese (zh)
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张辉
刘学建
蒋金弟
姚秀敏
黄政仁
陈忠明
黄健
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Shanghai Institute of Ceramics of CAS
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Shanghai Institute of Ceramics of CAS
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Priority to EP22742114.6A priority Critical patent/EP4282844A4/en
Priority to JP2023543223A priority patent/JP7627769B2/ja
Priority to US18/261,180 priority patent/US12466772B2/en
Publication of WO2022156635A1 publication Critical patent/WO2022156635A1/zh
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Definitions

  • the invention relates to a batch sintering method for high-performance silicon nitride ceramic substrates, belonging to the field of ceramic material preparation.
  • semiconductor devices have developed rapidly along the direction of high power, high frequency and integration.
  • the heat generated by the operation of the semiconductor device is a key factor that causes the failure of the semiconductor device, and the thermal conductivity of the insulating substrate is the key to affecting the heat dissipation of the overall semiconductor device.
  • semiconductor devices often face complex mechanical environments such as bumps and vibrations during use, which imposes strict requirements on the mechanical reliability of the materials used.
  • High-performance silicon nitride (Si 3 N 4 ) ceramics have excellent mechanical and thermal properties. Excellent mechanical properties and good high thermal conductivity make silicon nitride ceramics promising to make up for the deficiencies of existing substrate materials such as alumina and aluminum nitride. , has great market prospects in the application of high-end semiconductor devices, especially high-power semiconductor device substrates.
  • the main sintering processes of silicon nitride ceramic materials are: reaction sintering, hot pressing sintering, pressureless sintering, and gas pressure sintering.
  • Reaction sintered silicon nitride uses high-purity Si powder (or introduces a small amount of Si 3 N 4 powder) as the main raw material.
  • nitriding treatment is carried out at 1300-1500 °C to convert Si into Si 3 N 4 , and then the temperature is raised to 1750-1850 °C to further form Si 3 N 4 dense ceramics; the shrinkage rate of this process is small (below 5%), and it is suitable for preparing workpieces with complex shapes, but it is prone to problems such as incomplete nitridation, a small amount of residual free Si, and low material properties. .
  • Hot-pressed sintered silicon nitride is based on Si 3 N 4 powder as the main raw material, by introducing a small amount of sintering aids (usually rare earth oxides and metal oxides), under the protective atmosphere of 1atm nitrogen, at 1750 ⁇ 1850 °C through the liquid phase sintering mechanism and mechanical pressure to form Si 3 N 4 dense ceramics; materials prepared by this process generally have excellent properties, but this process requires external mechanical pressure, so it is only suitable for preparing workpieces with simple shapes, and requires subsequent mechanical processing, the production efficiency is low, and it is not suitable for mass production.
  • sintering aids usually rare earth oxides and metal oxides
  • Pressureless sintering (or normal pressure sintering) of silicon nitride is based on Si 3 N 4 powder as the main raw material.
  • Si 3 N 4 powder as the main raw material.
  • sintering aids dense Si is formed by liquid phase sintering mechanism at 1750-1850 °C under 1atm nitrogen protective atmosphere.
  • 3 N 4 ceramics this process has high production efficiency and is suitable for mass production, but Si 3 N 4 powder is prone to decomposition reactions at high temperatures (about 1800 ° C or above), resulting in relatively low material properties.
  • Gas pressure sintered silicon nitride takes Si 3 N 4 powder as the main raw material, and by introducing an appropriate amount of sintering aids, under a certain pressure nitrogen protective atmosphere, at 1800 ⁇ 2000 °C through the liquid phase sintering mechanism to form dense Si 3 N 4 ceramics;
  • the process is a preparation process developed for the high temperature decomposition problem of pressureless sintering silicon nitride.
  • the nitrogen pressure is generally 0.1 ⁇ 10MPa, and the sintering temperature can be increased to 1800 ⁇ 2000°C; this process utilizes the inhibition effect of the high pressure nitrogen atmosphere to solve the problem.
  • the high temperature decomposition problem of Si 3 N 4 further increases the sintering temperature, ensures the performance of the prepared materials, and at the same time retains the characteristics of high production efficiency, which is suitable for mass production and is recognized as the best method for preparing high-performance silicon nitride ceramic materials. best method.
  • gas pressure sintering is also considered to be the most promising and potential process method, but there are still the following main Disadvantages: (1) There is a carbon-rich atmosphere in the sintering furnace constructed of a graphite heating element and a graphite heat shield, the latter will pollute the substrate material to varying degrees, resulting in a decrease in the insulation performance of the silicon nitride ceramic substrate, and the breakdown field (2)
  • the production-type sintering furnace generally has a large furnace space, and it mainly relies on radiation heat transfer under the high temperature condition of 1800-2000 ° C.
  • the heating elements of the sintering furnace are generally arranged around the furnace. In this way, the furnace There must be a certain degree of deviation between the actual temperatures at different positions in the interior, which will affect the consistency of material properties; especially to increase the product throughput, it is necessary to set up multi-layer grids inside the furnace, but this is bound to further aggravate the different positions inside the furnace. temperature inhomogeneity between.
  • the inventor developed its gas pressure sintering batch preparation process, through the stacking design and control of multiple substrate blanks, and the design of crucibles and kiln tools.
  • Design and control, design and control of debonding and sintering processes finally provide a batch sintering method of high-performance silicon nitride ceramic substrates, including: (1) stacking silicon nitride ceramic substrate blanks on In the boron nitride crucible, a layer of boron nitride powder is applied between the adjacent silicon nitride ceramic substrate blanks; (2) after vacuuming in steps, in a nitrogen atmosphere or a reducing atmosphere, 500 ⁇ Debonding is carried out at 900 ° C; the step-by-step vacuuming is at least two-step vacuuming or at least three-step vacuuming; when two-step vacuuming, the step-by-step vacuuming parameters include: vacuuming 20 ⁇ 30 minutes to make the vacuum degree reach 20-30kPa, and then vacuumize for 10-20 minutes to make the vacuum degree less than 10Pa; or, when vacuuming in three steps, the parameters of the step-by-step vacuuming include: vacuuming for 10-15 minutes first The vacuum degree reaches 60 ⁇ 80kPa
  • the introduction of metal impurity ions and the introduction of carbon atmosphere during sintering are avoided, which is beneficial to ensure the thermal conductivity and breakdown field strength of the substrate material.
  • the high-temperature chemical stability of boron nitride powder is also used to realize the stacking of multiple substrates by coating a layer of high-purity boron nitride powder between the substrate blanks to prevent adjacent substrates from adhering to each other.
  • the stacking quantity of the silicon nitride ceramic substrate green sheets is 5-50 pieces.
  • the O content in the boron nitride powder is not more than 1%, the C content is not more than 0.01%, and the metal impurity ion content is not more than 0.02%; the average particle size of the boron nitride powder is 1 ⁇ m to 5 ⁇ m, Preferably it is 2 micrometers - 5 micrometers.
  • the purity of the boron nitride powder O content, C content, metal impurity ion content, etc.
  • the contamination of the silicon nitride ceramic material is avoided, thereby ensuring the thermal conductivity and breakdown of the ceramic substrate. Field strength and other properties.
  • the surface quality (flatness, roughness, etc.) of the prepared silicon nitride ceramic substrate is ensured mainly by controlling the particle size of the boron nitride powder.
  • the dosage of the boron nitride powder is 1.0-2.5 mg/cm 2 , preferably 1.5-2.5 mg/cm 2 .
  • the uniform shrinkage and good isolation effect of the silicon nitride ceramic substrate are ensured by controlling the coating amount of boron nitride powder per unit area of the substrate green body.
  • the pressure of the nitrogen atmosphere or reducing atmosphere is 0.05-0.2 MPa, preferably 0.1-0.2 MPa, and the pressure range is a slight positive pressure, which is conducive to improving the product qualification rate;
  • the The reducing atmosphere is a nitrogen/hydrogen mixed atmosphere with a hydrogen content not higher than 5%;
  • the debonding time is 1-3 hours.
  • the nitrogen atmosphere pressure in the gas pressure sintering is 0.5-10 MPa; the gas pressure sintering time is 4-12 hours.
  • a plurality of boron nitride crucibles are evenly arranged in the graphite kiln furniture for gas pressure sintering; preferably, the graphite kiln furniture has a multi-layer grid structure.
  • the present invention further homogenizes the internal temperature field of the sintering furnace by using a high heat capacity graphite kiln tooling with a multi-layer grid structure, thereby ensuring the high-performance consistency of batch pressure sintering of silicon nitride ceramic substrates.
  • the silicon nitride ceramic substrate green body is prepared by slurry tape casting or powder pressing.
  • the step of slurry tape casting includes: (1) at least one of silicon nitride powder and silicon powder is used as original powder, sintering aid, dispersant, defoamer, binder and plasticizer in the process; After mixing in a protective atmosphere, vacuum degassing is performed to obtain a mixed slurry; (2) tape casting and drying are performed in a nitrogen atmosphere to obtain a first green body; (3) the obtained first green body is subjected to shaping pretreatment , to obtain a silicon nitride ceramic substrate green body; preferably, when the original powder contains silicon powder, the quality of the silicon powder is not less than 75% of the original powder mass, wherein the original powder quality is silicon nitride powder and The mass sum of the silicon nitride generated after the silicon powder is completely nitrided; more preferably, before the gas pressure sintering, the debonded silicon nitride ceramic substrate green body is subject
  • the present invention also provides a high-performance silicon nitride ceramic substrate prepared according to the above batch sintering method, the qualified rate of the high-performance silicon nitride ceramic substrate is ⁇ 60%, preferably not low 70%, more preferably, the pass rate is not less than 80%, and most preferably, the pass rate is not less than 90%.
  • One of the remarkable features of the present invention is that, by using high-purity boron nitride powder and crucible, the introduction of impurity ions is avoided, which is beneficial to ensure the thermal conductivity and breakdown field strength of the substrate.
  • Another notable feature of the present invention is that batch sintering of high-performance silicon nitride ceramic substrates can be achieved by adopting measures such as stacking, kiln tooling design, and vacuuming process control, thereby improving production efficiency and reducing production costs.
  • FIG. 1 is a schematic diagram of a silicon nitride substrate green body.
  • FIG. 2 is a schematic diagram of a silicon nitride substrate green body coated with boron nitride powder on its surface.
  • FIG. 3 is a schematic view of stacking 20 silicon nitride substrate green sheets coated with boron nitride powder on their surfaces.
  • Figure 4 is a schematic diagram of 20 stacked silicon nitride substrate blanks placed in a boron nitride crucible.
  • FIG. 5 is a schematic diagram of orderly placing a boron nitride crucible with a silicon nitride substrate blank to be sintered inside on a graphite kiln tool (single layer).
  • Fig. 6 is a schematic diagram of orderly placing a boron nitride crucible with a silicon nitride substrate green body to be sintered on the graphite kiln tool (multi-layer stacking).
  • FIG. 7 is a physical view of the silicon nitride ceramic substrate prepared in Example 1.
  • FIG. 7 is a physical view of the silicon nitride ceramic substrate prepared in Example 1.
  • Table 1 in FIG. 8 shows the performance parameters of the BN powders used in the examples and comparative examples of the present invention.
  • Table 2 in FIG. 9 shows the preparation process of the silicon nitride ceramic substrate in the present invention.
  • Table 3 in FIG. 10 shows the performance parameters of the silicon nitride ceramic substrate in the present invention.
  • the mass sintering of high-performance silicon nitride ceramic substrates is realized by a gas pressure sintering process, which specifically includes the following steps: stacking design and control of a plurality of substrate blanks, design and control of crucibles and kiln tools. Design and control of control, debonding and sintering processes to achieve batch sintering of high performance silicon nitride ceramic substrates.
  • the batch sintering method for high-performance silicon nitride ceramic substrates is exemplified below.
  • the silicon nitride ceramic substrate green body is prepared through processes such as slurry preparation, vacuum degassing, tape casting, green body drying, and green body shaping in the tape casting preparation process.
  • the purpose of reducing or eliminating bubbles in the slurry and reducing agglomeration in the slurry is achieved by fully ball-milling and mixing under a protective atmosphere during the preparation of the casting slurry, combined with low-vacuum and long-time degassing treatment.
  • the preparation of high-quality, defect-free cast films and their uniform thickness are achieved by the precise control of the cylindrical doctor blade and its height during the casting process, and the continuous hot N2 atmosphere with increasing temperature to dry the cast film blanks. precise control of sex.
  • the secondary oxidation of the silicon nitride powder raw material is suppressed by measures such as ball-milling mixing and N 2 protective atmosphere in the process of tape casting, so as to ensure that the prepared silicon nitride ceramic substrate has the characteristics of high thermal conductivity.
  • measures such as ball-milling mixing and N 2 protective atmosphere in the process of tape casting, so as to ensure that the prepared silicon nitride ceramic substrate has the characteristics of high thermal conductivity.
  • Preparation of agglomeration-free, bubble-free slurries At least one of silicon nitride powder and silicon powder is used as raw powder, sintering aid, dispersant, defoamer, binder and plasticizer in a protective atmosphere (such as N2 atmosphere, the pressure can be 0.1MPa)
  • a protective atmosphere such as N2 atmosphere, the pressure can be 0.1MPa
  • vacuum degassing is carried out to prepare mixed slurry without agglomeration and bubbles.
  • silicon nitride ceramic grinding balls are used, and anhydrous ethanol is used as the ball milling medium.
  • the sintering aids may be rare earth oxides and alkaline earth metal oxides, accounting for 4-5 wt% of the total mass of silicon nitride and sintering aids formed by complete nitridation of silicon nitride powder or/and silicon powder.
  • the rare earth oxide contains at least Y 2 O 3 .
  • the alkaline earth metal oxide contains at least MgO.
  • the molar ratio between the rare earth oxide and the alkaline earth metal oxide may be (1.0 ⁇ 1.4):(2.5 ⁇ 2.9). Wherein, when silicon powder is contained, the content of the silicon powder accounts for 75-100wt% of the total mass of silicon nitride formed by complete nitridation of silicon nitride powder or/and silicon powder.
  • the prepared slurry is vacuumed to remove air bubbles, the vacuum degree can be -0.1 ⁇ -10kPa, and the degassing time can be 6 ⁇ 24h.
  • the dispersant is selected from at least one of polyethylene glycol (PEG) and triethyl phosphate (TEP), and the added amount is the total of silicon nitride powder, silicon nitride formed by complete nitridation of silicon powder and sintering aid. 0.2 to 1.0 wt % of the mass.
  • the defoaming agent is oleic acid, and the added amount is 0.2-1.0 wt % of the total mass of silicon nitride powder, silicon nitride formed by complete nitridation of silicon powder and sintering aid.
  • the binder is polyvinyl butyral (PVB), and the added amount is 5-9 wt % of the total mass of silicon nitride powder, silicon nitride formed by complete nitridation of silicon powder and sintering aid.
  • the plasticizer is selected from at least one of diethyl phthalate (DEP), dibutyl phthalate (DBP) and polyethylene glycol (PEG), and the addition amount is silicon nitride powder,
  • the total mass of the silicon nitride formed by the complete nitridation of the silicon powder and the sintering aid is 2 to 6 wt %.
  • Preparation of cast film blanks with uniform thickness and no bubbles on the surface Cast molding under N2 atmosphere (0.1-0.2MPa). Drying is carried out in a flowing hot N2 atmosphere (flow rate of 10-1000 liters/min) to achieve the preparation of a cast film green body with uniform thickness and no bubbles on the surface.
  • a cylindrical doctor blade is used for tape casting under N 2 atmosphere, and the thickness of the cast film green body can be adjusted by controlling the height of the doctor blade.
  • the casting film green body is dried by a flowing hot N 2 atmosphere with increasing temperature, the temperature range of the hot N 2 atmosphere is 40-85° C., and the atmosphere pressure is 0.1-0.2 MPa.
  • the number of passing temperature stages is 2, including: the temperature of the first stage is 40-65°C, the drying time is 15-30 minutes, the temperature range of the second stage is 60-85°C, and the drying time is 15-30 minutes , and the temperature of the first stage ⁇ the temperature of the second stage.
  • the number of passing temperature stages is 3, including: the temperature of the first stage is 40-60°C, the drying time is 5-20 minutes, the temperature range of the second stage is 55-70°C, and the drying time is 5-20 minutes , the temperature range of the third stage is 65-85°C, the drying time is 5-20 minutes, and the temperature of the first stage ⁇ the temperature of the second stage ⁇ the temperature of the third stage.
  • Shaping pretreatment of cast film green body (first green body). Under a certain pressure (40-200MPa), cold isostatic pressing pretreatment is performed on the cut cast film blank (substrate blank) to improve the thickness uniformity and flatness of the cast film, and obtain nitriding. Silicon ceramic substrate green. Wherein, the time of shaping pretreatment may be 2-10 minutes.
  • the stacking quantity of the substrate green sheets can be 5 to 50 pieces, which is favorable for stacking sintering. If the number of stacked substrates is less than 5, the production efficiency will be affected; if the number of stacked substrates is more than 50, the difference between the stress states of the upper and lower substrates will be too large, which will affect the consistency between the substrates. Moreover, the adhesion phenomenon between the underlying substrates is easy to occur.
  • the O content is not more than 1%
  • the C content is not more than 0.01%
  • the metal impurity ion content is not more than 0.02%. If the content of O, C and metal impurity ions in the boron nitride powder is too high, the properties such as thermal conductivity and breakdown field strength of the substrate will be reduced to some extent.
  • the high-purity average particle size may be 1 to 5 ⁇ m.
  • boron nitride paste can be used for coating by screen printing, wherein the amount of boron nitride powder is preferably 1.0-2.5 mg/cm 2 .
  • the amount of boron nitride powder used is too small, adhesion between the prepared substrates will easily occur; if the amount of boron nitride powder used is too large, it will hinder the high temperature shrinkage of the substrates to a certain extent. , the size of the prepared substrate is relatively large, the flatness is reduced, and the surface roughness is increased under the same conditions.
  • Debonding of batch substrate blanks Put the laminated substrate green body into a high-purity boron nitride crucible, and put it into a heat treatment furnace, and vacuumize in steps to avoid the displacement of the boron nitride powder between the layers. Then, heat treatment (debonding treatment) is performed on the substrate green body under a certain temperature in a slightly positive nitrogen atmosphere or a reducing atmosphere.
  • the step-by-step evacuation rate is controlled by the vacuum valve opening, evacuation time and vacuum degree.
  • the step-by-step vacuuming can be carried out in at least three stages, including: firstly vacuuming for 10-15 minutes to make the vacuum degree reach 60-80kPa, continuing to vacuumize for 10-15min to make the vacuum degree reach 10-30kPa, and then vacuuming for 10 minutes ⁇ 15min, the vacuum degree is less than 5Pa.
  • the debonding treatment includes: generating a slight positive pressure by introducing a reducing nitrogen mixed atmosphere with a hydrogen content of not more than 5%, the atmosphere pressure can be 0.1-0.2MPa, the processing temperature can be 500-900 °C, and the processing time can be 1 to 3 hours.
  • step-by-step vacuuming it is difficult to completely avoid the displacement of the boron nitride powder used for isolation between the substrate blanks because the vacuuming speed is too fast and the vacuum pumping force is too large, which will lead to the subsequent high temperature of the adjacent substrates. Most of the blocking occurs during sintering.
  • the substrate green body is nitrided in a hydrogen/nitrogen mixed atmosphere with a hydrogen content of not more than 5% and a certain temperature.
  • the atmosphere pressure can be 0.1-0.2MPa
  • the nitriding temperature can be 1350-1450°C
  • the nitriding time can be 3-6 hours.
  • the high heat capacity graphite kiln furniture is used to further homogenize the internal temperature field of the sintering furnace, and the densification of batch substrates is realized by air pressure sintering at a certain temperature.
  • the parameters of gas pressure sintering under high nitrogen pressure include: the atmospheric pressure can be 0.5-10MPa, the sintering temperature can be 1800-2000°C, and the holding time can be 4-12h.
  • the high-heat-capacity graphite kiln furniture has a multi-layer grid structure, and the boron nitride crucible containing the substrate green body is evenly arranged on the graphite kiln furniture.
  • batch sintering of high-performance silicon nitride ceramic substrates is realized.
  • the thermal conductivity of the silicon nitride ceramic substrate material obtained is greater than 80W ⁇ m -1 ⁇ K -1 measured by a laser thermal conductivity meter.
  • the breakdown field strength of the obtained silicon nitride ceramic substrate material was tested by a breakdown voltage strength tester greater than 25KV/mm.
  • the thickness deviation of the silicon nitride ceramic substrate material obtained by testing with a micrometer can be ⁇ 0.04mm.
  • the flatness of the silicon nitride ceramic substrate material obtained by testing with a profilometer can range from 0 to 0.002 mm/mm.
  • the surface roughness of the obtained silicon nitride ceramic substrate material measured by a profiler can be 0.3-0.8 ⁇ m.
  • the obtained silicon nitride ceramic substrate material can be regarded as a qualified product while meeting the above parameters, and the qualified rate of the obtained silicon nitride ceramic substrate is not less than 60%, preferably not less than 70%, more Preferably, the pass rate is not less than 80%, and most preferably, the pass rate is not less than 90%.
  • the original powder silicon nitride powder and/or silicon powder
  • sintering aids Y 2 O 3 and MgO
  • dispersant defoaming agent
  • binder plasticizer
  • anhydrous ethanol anhydrous ethanol
  • atmosphere such as N2 atmosphere, pressure 0.1MPa
  • ball mill mixing (30 ⁇ 100rpm, 6 ⁇ 24h) in a closed container
  • vacuum degassing (-0.1 ⁇ -10kPa, 6 ⁇ 24h), to prepare a non-ferrous material. Agglomerated, bubble-free mixed slurry.
  • tape casting is performed in a N2 atmosphere (0.1-0.2MPa), and drying is performed in a flowing hot N2 atmosphere (temperature range 40-85°C, atmospheric pressure 0.1-0.2MPa, flow rate 10-1000 liters/min) , to achieve the preparation of cast film blanks with uniform thickness and no bubbles on the surface.
  • cold isostatic pressing shaping pretreatment 40-200MPa, 2-10 minutes is performed on the cut cast film green body (substrate green body) to obtain a silicon nitride ceramic substrate green body.
  • a silicon nitride ceramic substrate green body with a thickness of 0.4 mm was prepared by wet mixing, vacuum degassing, tape casting, etc.; Boron slurry, after the slurry is dried, it is cut into 88mm ⁇ 73mm samples, and 20 samples of the same specifications are stacked and placed in a high-purity boron nitride crucible with an internal space of 100mm ⁇ 100mm ⁇ 30mm;
  • the silicon nitride ceramic substrate prepared in Example 1 is shown in Figure 1.
  • the thermal conductivity of the material is 93W/(m ⁇ K), and the breakdown field strength is 42KV/mm; the substrate size is 70mm ⁇ 58mm, and the thickness is 0.32 ⁇ 0.02mm.
  • the flatness is 0.03mm and the surface roughness is 0.4 ⁇ m; there is no adhesion between the substrates and it is easy to peel off; there is no obvious difference between different substrates in the same crucible, and there is no obvious difference between different substrates in different crucibles in the same furnace difference.
  • Green size characteristics of boron nitride powder for substrate green isolation (impurity content, average particle size, coating amount), number of substrate green stacks, vacuuming process, graphite grid structure, debonding process,
  • the specific parameters such as the sintering process are shown in Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3.
  • Example 1 The specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Due to the small average particle size of the boron nitride powder used, partial adhesion occurs between the prepared substrates. The product qualification rate is lower than that of Example 1.
  • Example 1 The specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the amount of boron nitride powder used is relatively small, partial adhesion occurs between the prepared substrates. The product qualification rate is lower than that of Example 1.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3.
  • Take two-step control vacuuming measures first vacuumize for 20min, make the vacuum degree reach 20 ⁇ 30kPa, then vacuumize for 15min, make the vacuum degree reach 1 ⁇ 2Pa), although the measures to control the vacuum pumping rate in steps have been adopted, but only The vacuum pumping process is divided into two steps.
  • the vacuum pumping rate is still too fast and the vacuum pumping force is still too large, so that the boron nitride powder between the substrate blanks is partially displaced or even extracted, which cannot be fully guaranteed.
  • the complete isolation between the substrates results in partial adhesion between the prepared substrates.
  • the product qualification rate is lower than that of Example 1.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the micro-positive pressure reducing atmosphere debonding process is not used (instead, a low-pressure nitrogen atmosphere, that is, a 0.05MPa N 2 atmosphere), the thermal conductivity and breakdown field strength of the material are reduced, and some samples have microcracks. The product qualification rate is lower than that of Example 1.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the micro-positive pressure reducing atmosphere debonding process is not used (but a micro-positive pressure nitrogen atmosphere, that is, a 0.15MPa N 2 atmosphere), the thermal conductivity and breakdown field strength of the material are reduced.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the high heat capacity graphite material is not used to make the multi-layer grid structure kiln furniture (playing the dual role of the setter plate and the temperature zone control), there is a certain temperature difference between different positions inside the sintering furnace, which eventually leads to the prepared substrate. The consistency of material properties and surface quality (substrate size, flatness, surface roughness, etc.) is low, and the product qualification rate is lower than that of Example 1.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Due to the excessive amount of boron nitride powder used, the high temperature shrinkage of the substrate is hindered to a certain extent, the size of the prepared substrate is too large, the flatness is reduced, and the surface roughness is significantly increased.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3.
  • Step-by-step, slow-speed vacuuming measures are not taken (the opening of the vacuum valve is not controlled, and the vacuum is directly pumped for 30 minutes to make the vacuum reach 1-2Pa). Vacuum, the vacuum pumping force is too large, so that the boron nitride powder between the substrate blanks is obviously displaced or even pulled out, and the sufficient isolation between the substrates cannot be guaranteed, resulting in serious adhesion between the prepared substrates. .
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the 0.5-10MPa high-pressure nitrogen atmosphere sintering process is not used (but the normal pressure nitrogen atmosphere, that is, 0.1MPa N2 atmosphere), the thermal conductivity and breakdown field strength of the prepared substrate material are significantly reduced, and the The surface roughness is obviously increased, and the qualified rate of the product is reduced.
  • the specific process parameters are in accordance with Table 1 and Table 2, the process process refers to Example 1, and the properties of the prepared substrate materials are shown in Table 3. Because the 0.5-10MPa high-pressure nitrogen atmosphere sintering process is not used (instead, 0.3MPa N2 atmosphere), the thermal conductivity and breakdown field strength of the prepared substrate material are reduced, and the surface roughness of the substrate is somewhat reduced. increased, the product qualification rate decreased.

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