JP7627769B2 - 高性能窒化ケイ素セラミック基板のバッチ焼結方法 - Google Patents

高性能窒化ケイ素セラミック基板のバッチ焼結方法 Download PDF

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JP7627769B2
JP7627769B2 JP2023543223A JP2023543223A JP7627769B2 JP 7627769 B2 JP7627769 B2 JP 7627769B2 JP 2023543223 A JP2023543223 A JP 2023543223A JP 2023543223 A JP2023543223 A JP 2023543223A JP 7627769 B2 JP7627769 B2 JP 7627769B2
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silicon nitride
evacuation
sintering
substrate
atmosphere
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輝 張
学建 劉
金弟 蒋
秀敏 姚
政仁 黄
忠明 陳
健 黄
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Shanghai Institute of Ceramics of CAS
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JP2023543223A 2021-01-20 2022-01-17 高性能窒化ケイ素セラミック基板のバッチ焼結方法 Active JP7627769B2 (ja)

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CN202110075093.4A CN112811912B (zh) 2021-01-20 2021-01-20 一种高性能氮化硅陶瓷基片的批量化烧结方法
CN202110075093.4 2021-01-20
PCT/CN2022/072351 WO2022156635A1 (zh) 2021-01-20 2022-01-17 一种高性能氮化硅陶瓷基片的批量化烧结方法

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CN112811912B (zh) * 2021-01-20 2021-11-02 中国科学院上海硅酸盐研究所 一种高性能氮化硅陶瓷基片的批量化烧结方法
CN113463198A (zh) * 2021-06-17 2021-10-01 江苏富乐德半导体科技有限公司 一种氮化硅陶瓷制备方法
CN113620716B (zh) * 2021-09-02 2022-11-29 北京中材人工晶体研究院有限公司 一种氮化硅陶瓷基板及其制备方法
CN114044682A (zh) * 2021-11-29 2022-02-15 上海材料研究所 一种水基浆料凝胶注模成型制备高导热氮化硅陶瓷的方法
CN114951653A (zh) * 2022-05-26 2022-08-30 南京泉峰汽车精密技术股份有限公司 薄片螺旋结构mim件脱脂烧结工艺
CN115611637B (zh) * 2022-08-19 2023-10-27 江苏方达正塬电子材料科技有限公司 一种隔离粉及其制备方法
CN115259864A (zh) * 2022-09-26 2022-11-01 江苏富乐华功率半导体研究院有限公司 一种电子陶瓷坯体的排胶方法
CN115569610B (zh) * 2022-09-27 2025-11-18 南昌大学共青城光氢储技术研究院 一种超长定向α相氮化硅纤维阵列的生产装置及其制备方法
CN115321993A (zh) * 2022-10-17 2022-11-11 江苏富乐华功率半导体研究院有限公司 一种陶瓷坯体快速排pvb胶的方法
CN116063084A (zh) * 2023-04-04 2023-05-05 江苏富乐华功率半导体研究院有限公司 一种氮化硼印刷浆料的制备方法
CN118405908A (zh) * 2024-03-11 2024-07-30 武汉理工大学 一种高温陶瓷及其批量热压制备方法
CN118530034B (zh) * 2024-05-13 2025-05-16 广东先导元创精密科技有限公司 一种陶瓷坯体的排胶方法
CN118930319A (zh) * 2024-07-24 2024-11-12 江苏富乐华功率半导体研究院有限公司 一种提高氮化硅瓷片热导的浆料制备方法
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