WO2022134173A1 - 连接件、显示面板及显示装置 - Google Patents

连接件、显示面板及显示装置 Download PDF

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Publication number
WO2022134173A1
WO2022134173A1 PCT/CN2020/141671 CN2020141671W WO2022134173A1 WO 2022134173 A1 WO2022134173 A1 WO 2022134173A1 CN 2020141671 W CN2020141671 W CN 2020141671W WO 2022134173 A1 WO2022134173 A1 WO 2022134173A1
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WO
WIPO (PCT)
Prior art keywords
plane
film
chip
display panel
connector
Prior art date
Application number
PCT/CN2020/141671
Other languages
English (en)
French (fr)
Inventor
邓创华
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/276,160 priority Critical patent/US11908801B2/en
Publication of WO2022134173A1 publication Critical patent/WO2022134173A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • Embodiments of the present invention relate to the field of display technology, and in particular, to a connector, a display panel, and a display device.
  • sub-millimeter light-emitting diode mini-Light Emitting Diode, mini-LED
  • the spliced sub-millimeter light-emitting diode display panel developed on this basis is formed by splicing multiple sub-millimeter light-emitting diode display panels, which can meet the display requirements of different sizes according to the requirements of different application scenarios.
  • this modular splicing method can improve the production efficiency and reduce the production cost of the spliced sub-millimeter light emitting diode display panel, and also reduce its maintenance and cost. costs of transportation, etc.
  • FIG. 1 is a schematic structural diagram of a sub-millimeter light emitting diode display panel in the prior art. As shown in FIG. 1 , the sub-millimeter light emitting diode display panel includes: a substrate 210 , a backplane 220 , a chip on flex (COF) 400 and Printed Circuit Board Board, PCB) 300.
  • COF chip on flex
  • the backplane 220 is located on one side of the substrate 210 ; the surface of the substrate 210 away from the backplane 220 is divided into a display area A-A and a bonding area B-B, and the chip-on-film 400 is located on the side of the substrate 210 away from the backplane 220 and One end is electrically connected to the bonding area, and the other end is electrically connected to the printed circuit board 300 .
  • FIG. 2 is a schematic structural diagram of the bent sub-millimeter light emitting diode display panel. As shown in FIG. 2, the chip on film 400 is near the connection with the bonding area.
  • the position where the printed circuit board 300 is fixed on the backplane 220 will affect the thickness ⁇ of the raised structure.
  • Embodiments of the present invention provide a connector, a display panel, and a display device, which are used to solve the problems of poor display effect and high disconnection risk of the chip-on-film in the existing display panel spliced together.
  • an embodiment of the present invention provides a connector, the connector includes a base body, the base body includes a first outer surface, and the first outer surface at least includes a first plane and a second plane that are perpendicular to each other, so The first plane is provided with a number of first terminals, the second plane is provided with a number of second terminals, a number of the first terminals and a number of the second terminals one-to-one correspondence, each of the The first terminal is communicated with the corresponding second terminal through a wire.
  • the wire is disposed on the first outer surface and extends in a direction from the first plane to the second plane.
  • the first outer surface further includes arc surfaces, and the arc surfaces respectively connect the first plane and the second plane.
  • the material of the base body is an insulating material, and the thermal expansion coefficient of the base body ranges from 1 ⁇ 10 ⁇ 7 /K to 500 ⁇ 10 ⁇ 7 /K.
  • an embodiment of the present invention provides a display panel, where the display panel includes:
  • the first panel at least includes a substrate and a backplane, the backplane is located on one side of the substrate, and the surface of the substrate away from the backplane is divided into a display area and an adhesive area;
  • the printed circuit board is located on the side of the backplane away from the substrate;
  • a plurality of the first terminals on the first plane of the connector are electrically connected to the bonding area, and the second plane of the connector is flush with the side surface of the substrate;
  • One end of the chip-on film is electrically connected to a plurality of the second terminals on the second plane, and the other end of the chip-on film is electrically connected to the printed circuit board.
  • the wire is disposed on the first outer surface and extends in a direction from the first plane to the second plane.
  • the first outer surface further includes arc surfaces, and the arc surfaces respectively connect the first plane and the second plane.
  • the material of the base body is an insulating material, and the thermal expansion coefficient of the base body ranges from 1 ⁇ 10 ⁇ 7 /K to 500 ⁇ 10 ⁇ 7 /K.
  • the display panel further includes:
  • Light-emitting layer, protective adhesive and anisotropic conductive adhesive film ;
  • the light-emitting layer is located on the side of the substrate away from the backplane and is disposed corresponding to the display area, and the light-emitting layer includes a plurality of light-emitting units;
  • the protective adhesive is located on the side of the substrate away from the backplane, and is disposed corresponding to the display area and covers the light-emitting layer;
  • the anisotropic conductive adhesive film is respectively located between the first plane and the bonding area, between the second plane and the chip on film, and between the chip on film and the printed circuit between the boards.
  • the base further includes a second outer surface, the second outer surface is connected to the first outer surface, and the display panel further includes a fixing glue, and the fixing glue is located on the second outer surface between the surface and the bonding area.
  • the second outer surface and the first outer surface form the base body in the shape of a cuboid
  • the length of the first plane is less than or equal to the length of the bonding area
  • the second plane The height of the film is less than or equal to the height of the protective adhesive
  • the width of any one of the first plane and the second plane is greater than or equal to the width of the chip on film.
  • an embodiment of the present invention provides a display device, wherein the display device is formed by splicing a plurality of the display panels described in the second aspect.
  • the wire is disposed on the first outer surface and extends in a direction from the first plane to the second plane.
  • the first outer surface further includes arc surfaces, and the arc surfaces respectively connect the first plane and the second plane.
  • the material of the base body is an insulating material, and the thermal expansion coefficient of the base body ranges from 1 ⁇ 10 ⁇ 7 /K to 500 ⁇ 10 ⁇ 7 /K.
  • the display panel further includes:
  • Light-emitting layer, protective adhesive and anisotropic conductive adhesive film ;
  • the light-emitting layer is located on the side of the substrate away from the backplane and is disposed corresponding to the display area, and the light-emitting layer includes a plurality of light-emitting units;
  • the protective adhesive is located on the side of the substrate away from the backplane, and is disposed corresponding to the display area and covers the light-emitting layer;
  • the anisotropic conductive adhesive film is respectively located between the first plane and the bonding area, between the second plane and the chip on film, and between the chip on film and the printed circuit between the boards.
  • the base further includes a second outer surface, the second outer surface is connected to the first outer surface, and the display panel further includes a fixing glue, and the fixing glue is located on the second outer surface between the surface and the bonding area.
  • the second outer surface and the first outer surface form the base body in the shape of a cuboid
  • the length of the first plane is less than or equal to the length of the bonding area
  • the second plane The height of the film is less than or equal to the height of the protective adhesive
  • the width of any one of the first plane and the second plane is greater than or equal to the width of the chip on film.
  • the connector, the display panel and the display device provided by the embodiments of the present invention, since a plurality of first terminals on the first plane of the connector are electrically connected to the bonding area, a plurality of second terminals on the second plane of the connector are electrically connected to the bonding area.
  • the sides of the substrate are flush, and the two ends of the chip on film are respectively electrically connected to the second terminals on the second plane of the connector and the printed circuit board, so that the substrate can be ensured under the condition that normal signal transmission can be realized.
  • FIG. 1 is a schematic structural diagram of a sub-millimeter light emitting diode display panel in the prior art.
  • FIG. 2 is a schematic structural diagram of a bent sub-millimeter light emitting diode display panel.
  • FIG. 3 is a schematic structural diagram of a connector provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a deformed structure of a connector provided by an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
  • FIG. 6 is a flowchart of a method for fabricating a display panel according to an embodiment of the present invention.
  • the bent sub-millimeter light-emitting diode display panel is simply referred to as a display panel, and a splicing formed by splicing a plurality of bent sub-millimeter light-emitting diode display panels
  • the sub-millimeter light-emitting diode display panel is abbreviated as a display device.
  • the embodiments of the present invention first provide a connector. It should be noted that, when the connector is applied to a display panel, the risk of disconnection of the chip-on-film in the display panel can be reduced, and the risk of disconnection by multiple The display effect of the display device formed by splicing the display panels.
  • FIG. 3 is a schematic structural diagram of a connector provided by an embodiment of the present invention.
  • the connector 10 includes a base body, and the base body includes a first outer surface, and the first outer surface at least includes a first outer surface that is perpendicular to each other. plane 11 and second plane 12.
  • a plurality of first terminals are provided on the first plane 11 .
  • the number of the first terminals shown in FIG. 3 is 5, and the five first terminals are arranged at intervals and regularly arranged to form a straight line. It should be noted that the number and arrangement of the first terminals shown in FIG. 3 are only It is an example, and is not intended to limit the embodiments of the present invention.
  • a plurality of second terminals are provided on the second plane 12 .
  • the number of the second terminals shown in FIG. 3 is 5, and the 5 second terminals are arranged at intervals and regularly arranged to form a straight line. It should be noted that the number and arrangement of the second terminals shown in FIG. 3 are only It is an example, and is not intended to limit the embodiments of the present invention.
  • first terminal and the second terminal are collectively referred to as terminals, and the terminal in the embodiment of the present invention may be not only a conventional terminal, but also a very short wire.
  • the terminals shown in FIG. 3 are all extremely short wires, which are plated on the first outer surface through a coating process.
  • the terminals thus obtained are in the form of thin films.
  • the thin-film terminals have the advantage of thin thickness, which can reduce the number of connections.
  • the volume of the connector 10 makes it suitable for display panels of different sizes, and the coating process can make the bonding between the terminal and the first outer surface more firmly, and avoid the terminal falling off of the connector 10 during use. question.
  • the plurality of first terminals on the first plane 11 and the plurality of second terminals on the second plane 12 are in one-to-one correspondence, and each first terminal is communicated with the corresponding second terminal through a wire.
  • the five first terminals shown in Figure 3 are all extremely short wires, namely a1, a2, a3, a4 and a5, and the five second terminals are extremely short wires, respectively b1, b2, b3 , b4 and b5, where a1 corresponds to b1, the two are connected through wire c1, a2 corresponds to b2, and the two are connected through wire c2, a3 corresponds to b3, and the two are connected through wire c3, a4 Corresponding to b4, the two are connected through wire c4, and a5 corresponds to b5, and the two are connected through wire c5.
  • connection between the first terminal and the second terminal by the wire means that one end of the wire is electrically connected to the first terminal, and the other end of the wire is electrically connected to the second terminal, so that the connection from the first terminal is
  • the signal input from the terminal can be transmitted to the second terminal through the wire, and conversely, the signal input from the second terminal can be transmitted to the first terminal through the wire.
  • the wires can be set at any position of the base.
  • the five wires c1, c2, c3, c4 and c5 shown in FIG. 3 are respectively arranged on the first outer surface at intervals, and each wire is along the first plane 11 to the second plane 12. extension in the direction.
  • Each wire can be plated on the first outer surface through a coating process.
  • the wire thus obtained is in the form of a thin film.
  • the thin film wire has the advantage of being thin, which can reduce the volume of the connector 10 and make it suitable for different sizes of wires.
  • the display panel, and the coating process can make the wire and the first outer surface adhere more firmly, avoiding the problem of the wire falling off during the use of the connector 10 .
  • first terminal, the wire, and the second terminal may be integrally formed, or may not be integrally formed, which is not specifically limited in the embodiment of the present invention.
  • the first plane 11 is directly connected with the second plane 12, and the first outer surface formed by the two is in a right-angle shape.
  • An outer surface further includes an arc surface 13, and the arc surface 13 connects the first plane 11 and the second plane 12 respectively, so that the first outer surface formed by the first plane 11, the arc surface 13 and the second plane 12 is chamfered .
  • the chamfered first outer surface has no sharp edges and corners, thereby reducing the risk of scratches on the wires plated thereon, and improving the yield of the wires.
  • the material of the substrate is an insulating material with a small thermal expansion coefficient, and the value range of the thermal expansion coefficient is usually 1 ⁇ 10 -7 /K-500 ⁇ 10 -7 /K.
  • the material is optional as plastic. It can be understood that, since the thermal expansion coefficient of the material of the base body is small, the volume change is small when the temperature changes, so that the display panel can have a high yield under different temperature environments.
  • FIG. 4 is a schematic diagram of the deformed structure of the connector provided by the embodiment of the present invention, wherein all the connectors 10 in FIG. 4 Both have a second outer surface.
  • the second outer surface is the third plane 14
  • the third plane 14 is vertically connected to the first plane 11 and disposed opposite to the second plane 12 .
  • the second outer surface may further include other planes, so as to form a closed structure together with the first outer surface and the third plane 14 , which is not specifically limited in this embodiment of the present invention.
  • the second outer surface is a fourth plane 15 and a fifth plane 16 that are perpendicularly connected to each other, wherein the fourth plane 15 is perpendicularly connected to the first plane 11 , and the fifth plane 16 is perpendicularly connected to the second plane 12 .
  • the second outer surface may further include other planes, so as to form a closed structure together with the first outer surface, the fourth plane 15 and the fifth plane 16 , which is not made in this embodiment of the present invention. Specific restrictions.
  • the second outer surface is the sixth plane 17, which connects the first plane 11 and the second plane 12, respectively. It should be noted that, in other embodiments, the second outer surface may further include other planes, so as to form a closed structure together with the first outer surface and the sixth plane 17 , which is not specifically limited in this embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a display panel provided by an embodiment of the present invention. As shown in FIG. 5 , the display panel includes:
  • the first panel, the printed circuit board 30 , the chip on film 40 and the connector 10 provided in the above embodiments.
  • the chip on film 40 is an integrated circuit (Integrated Circuit, IC) is a die soft film fixed on a flexible circuit board, and the chip on film 40 is mostly used in many display panels such as liquid crystal display panels and organic light emitting diode display panels.
  • the chip-on-chip 40 is usually used for scan driving or data driving, that is, to receive the scan signal or data signal sent by the printed circuit board 30, and transmit the received scan signal or data signal to the corresponding scan line or data in the display panel Wire.
  • the chip-on-chip film 40 is used as a data driver in this embodiment of the present invention, that is, the chip-on-chip film 40 is only used to receive data signals sent by the printed circuit board 30 and transmit the received data signals to the display panel Corresponding data line in .
  • the first panel includes at least a base plate and a back plate.
  • the substrate may be a rigid substrate, such as a glass substrate, or a flexible substrate, such as a polyimide (PI) substrate.
  • PI polyimide
  • the backplane is located on one side of the substrate, the surface of the substrate away from the backplane is divided into a display area and a bonding area, and the printed circuit board 30 is located on the side of the backplane away from the substrate .
  • the connector 10 includes a base body, the base body includes a first outer surface, and the first outer surface includes at least a first plane 11 and a second plane 12 that are perpendicular to each other. It should be noted that the first outer surface of the connector 10 shown in FIG. 5 also includes an arc surface 13 connecting the first plane 11 and the second plane 12 .
  • the first plane 11 is provided with a number of first terminals (not shown in FIG. 5 , please refer to FIG. 3 ), and the second plane 12 is provided with a number of second terminals (not shown in FIG. 5 , please refer to FIG.
  • a plurality of the first terminals are in one-to-one correspondence with a plurality of the second terminals, and each of the first terminals and the corresponding second terminals are communicated with each other through a wire.
  • the first terminal and the second terminal shown in FIG. 5 are both extremely short wires, and the wires connecting the first terminal and the second terminal (not shown in FIG. 5, please refer to FIG. 3) are arranged on the first outer surface and is integrally formed with the first terminal and the second terminal.
  • first terminals on the first plane 11 of the connector 10 are electrically connected to the bonding area, and the second plane 12 of the connector 10 is flush with the side surface of the substrate.
  • a plurality of data lines in the display area all extend into the bonding area, and a plurality of first terminals on the first plane 11 of the connector 10 correspond to a plurality of data lines in the bonding area one-to-one
  • the second plane 12 of the connector 10 is flush with the side surface of the substrate.
  • One end of the chip on film 40 is electrically connected to a plurality of the second terminals on the second plane 12 , and the other end of the chip on film 40 is electrically connected with the printed circuit board 30 . Since both ends of the chip on film 40 are electrically connected to the printed circuit board 30 and the plurality of second terminals on the second plane 12 of the connector 10 respectively, the chip on film 40 can receive the data signal sent by the printed circuit board 30 , and transmit the data signal to a plurality of second terminals on the second plane 12 of the connector 10, and then the second terminals are transmitted to the first terminals through the wires electrically connected to them, and then transmitted to the first terminals. connected data cable.
  • the display panel further includes a light-emitting layer 23 , a protective adhesive 24 and an anisotropic conductive adhesive film (not shown in FIG. 5 ).
  • the light-emitting layer 23 is located on the side of the substrate away from the backplane and is disposed corresponding to the display area, and the light-emitting layer 23 includes a plurality of light-emitting units. The light-emitting units included in the light-emitting layer 23 shown in FIG.
  • mini-LEDs are mini-LEDs, a plurality of mini-LEDs are arranged at intervals, and each mini-LED is a component that can emit light of a specific color, and the specific color can be red, green or Blue, which is not specifically limited in the embodiments of the present invention.
  • the protective adhesive 24 is located on the side of the substrate away from the backplane, and is disposed corresponding to the display area and covers the light-emitting layer 23 . It should be noted that the protective glue 24 and the light-emitting layer 23 are located on the same side of the substrate, the multiple mini-LEDs in the light-emitting layer 23 are arranged at intervals, and the protective glue 24 covers the multiple mini-LEDs and fills the spaces between different mini-LEDs The thickness of the protective glue 24 is greater than the thickness of the mini-LED, so as to protect the mini-LED from being damaged by the outside world and improve the overall strength of the light-emitting layer 23. The embodiment of the present invention does not limit the specific material of the protective glue 24.
  • the anisotropic conductive adhesive film is respectively located between the first plane 11 and the bonding area, between the second plane 12 and the chip on film 40 , and between the chip on film 40 and the between the printed circuit boards 30 .
  • the anisotropic conductive adhesive film has anisotropic conductive properties, disposing the anisotropic conductive adhesive film between the first plane 11 of the connector 10 and the bonding area can make the first plane 11
  • Each first terminal of the connector can be electrically connected to the corresponding data line in the bonding area
  • an anisotropic conductive adhesive film is arranged between the second plane 12 of the connector 10 and the chip-on-chip film 40, so that the second plane can be
  • Each second terminal on 12 can be electrically connected to the corresponding wire on the chip on film 40
  • an anisotropic conductive adhesive film is arranged between the chip on film 40 and the printed circuit board 30, so that the chip on film 40 and the printed circuit board 30 are arranged.
  • the printed circuit board 30 makes electrical connections. It can be understood that the electrical connection between
  • the base further includes a second outer surface, please refer to FIG. 4 for details, and the second outer surface is connected to the first outer surface.
  • the display panel further includes a fixing glue 50, and the fixing glue 50 is located between the second outer surface and the bonding area.
  • the material of the fixing glue 50 may be epoxy adhesive, phenolic adhesive or organic silica gel adhesive, which is not specifically limited in the embodiment of the present invention.
  • the fixing glue 50 can further ensure that the connector 10 is firmly fixed on the substrate 21 , and can ensure that a sufficient tensile force can be applied to tighten the chip on film 40 when the printed circuit board 30 is fixed on the backplane. , to prevent the chip on film 40 from shaking greatly.
  • the base formed by the second outer surface and the first outer surface of the base of the connector 10 is in the shape of a cuboid, as shown in FIG. 5 .
  • the length L of the first plane 11 is less than or equal to the length of the bonding area
  • the height H of the second plane 12 is less than or equal to the height of the protective glue 24, so that the connection after installation Piece 10 will not stick out.
  • the width W of any one of the first plane 11 and the second plane 12 is greater than or equal to the width of the chip on film 40 .
  • FIG. 6 is a flowchart of a method for fabricating a display panel according to an embodiment of the present invention. The method includes:
  • Step S1 providing a first panel, a printed circuit board, a chip-on-film and the connector provided by the above embodiment; wherein, the first panel at least includes a substrate and a backplane, and the backplane is located at one of the substrates. On the side, the surface of the substrate away from the back plate is divided into a display area and a bonding area.
  • Step S2 electrically connect a plurality of the first terminals on the first plane of the connector to the bonding area, and connect the second plane of the connector to the side surface of the substrate To be flush, one end of the chip-on film is electrically connected to a plurality of the second terminals on the second plane, and the other end of the chip-on film is electrically connected to the printed circuit board.
  • Step S3 bending the chip on film in a direction toward the backplane, so as to fix the printed circuit board on the backplane.
  • the base of the connector further includes a second outer surface, the second outer surface is connected to the first outer surface, and the method further includes:
  • Step S4 filling the fixing glue between the second outer surface of the connector and the bonding area.
  • step S4 may be performed before step S3, and may also be performed after step S3, which is not specifically limited in this embodiment of the present invention.
  • the structure of the display panel fabricated by the above method is shown in FIG. 5 , since several first terminals on the first plane of the connector are electrically connected to the bonding area, The plurality of second terminals are flush with the side of the substrate, and the two ends of the chip on film are respectively electrically connected to the plurality of second terminals on the second plane of the connector and the printed circuit board, so that normal signal transmission can be achieved. It can also ensure that there is no cavity area on the side of the substrate, so that the thickness ⁇ of the protruding structure is minimized. In this way, not only the display effect of the display device formed by splicing multiple display panels can be improved, but also the risk of disconnection of the display chip-on-film can be reduced.
  • the first terminal and the second terminal are both extremely short wires, and the wire connecting the first terminal and the second terminal is provided on the first outer surface, and is connected with the first terminal and the second terminal.
  • the terminals are integrally formed.
  • Step S2 is specifically: disposing an anisotropic conductive adhesive film between the first plane of the connector and the bonding area, so that a plurality of the first terminals on the first plane of the connector It is electrically connected to the bonding area, and the second plane of the connector is flush with the side surface of the substrate, and a different plane is arranged between the second plane of the connector and the chip on film.
  • anisotropic conductive adhesive film one end of the chip-on-chip film is electrically connected with a plurality of the second terminals on the second plane, and an anisotropic conductive adhesive film is arranged between the chip-on-chip film and the printed circuit board, The other end of the chip-on-chip film is electrically connected to the printed circuit board.
  • Embodiments of the present invention also provide a display device, wherein the display device is formed by splicing a plurality of display panels provided in the above-mentioned embodiments.
  • the two ends are respectively electrically connected to a plurality of second terminals on the second plane of the connector and the printed circuit board, so that under the condition of normal signal transmission, it can also ensure that there is no cavity area on the side of the substrate, so that the convex
  • the thickness ⁇ of the starting structure is the smallest. In this way, not only the display effect of the display device formed by splicing multiple display panels can be improved, but also the risk of disconnection of the display chip-on-film can be reduced.

Abstract

一种连接件（10）、显示面板及显示装置。连接件（10）包括相互垂直的第一平面（11）和第二平面（12），第一平面（11）设有若干第一接线端（a1-a5），第二平面（12）设有与若干第一接线端（a1-a5）一一对应的若干第二接线端（b1-b5），每个第一接线端（a1-a5）与对应的第二接线端（b1-b5）之间通过导线（c1-c5）连通，连接件（10）能够提高显示面板拼接而成的显示装置的显示效果，降低覆晶薄膜（40）的断线风险。

Description

连接件、显示面板及显示装置 技术领域
本发明实施例涉及显示技术领域，尤其涉及一种连接件、显示面板及显示装置。
 背景技术
目前，亚毫米发光二极管（mini- Light Emitting Diode，mini-LED）显示面板已在广电、会议和工程等应用场景得到了应用，其市场潜力巨大。在此基础上发展起来的拼接式亚毫米发光二极管显示面板是由多个亚毫米发光二极管显示面板拼接而成，其可根据不同的应用场景需求实现不同尺寸的显示需求。由于亚毫米发光二极管显示面板易于生产且其生产成本较低，因此这种模块化的拼接方式能够提高拼接式亚毫米发光二极管显示面板的生产效率并降低其生产成本，同时还能降低其维修和运输等方面的成本。
图1为现有技术中亚毫米发光二极管显示面板的结构示意图，如图1所示，亚毫米发光二极管显示面板包括：基板210、背板220、覆晶薄膜（Chip On Flex，COF）400和印制电路板（Printed Circuit Board，PCB）300。其中，背板220位于基板210的一侧；将基板210远离背板220的表面划分为显示区A-A和粘接（Bonding）区B-B，覆晶薄膜400位于基板210远离背板220的一侧且其一端与粘接区电连接，另一端与印制电路板300电连接。
为了实现多个亚毫米发光二极管显示面板的拼接，需要对每个亚毫米发光二极管显示面板进行弯折处理，具体为将覆晶薄膜400沿朝向背板220的方向弯折，以使印制电路板300固定于背板220远离基板210的一侧，图2为弯折后的亚毫米发光二极管显示面板的结构示意图，如图2所示，覆晶薄膜400在与粘接区的连接处附近将会产生较大的弯曲变形，并在基板210的侧面出现一个厚度为δ的凸起结构，其中，δ=δ1+δ2，δ1为覆晶薄膜400的厚度，δ2为覆晶薄膜400与基板210的侧面之间所形成的空腔区域的厚度。
由图2可知，印制电路板300固定于背板220上的位置会影响凸起结构的厚度δ，具体而言，印制电路板300越靠左，则印制电路板300对覆晶薄膜400的拉力越小，导致凸起结构的厚度δ越大，从而使得拼接而成的拼接式亚毫米发光二极管显示面板的显示效果越差；印制电路板300越靠右，则印制电路板300对覆晶薄膜400的拉力越大，导致覆晶薄膜400的弯曲变形加剧，从而使得覆晶薄膜400的断线风险增大。并且，由于该结构中始终存在空腔区域，若拼接时用力过大或拼接次数增多，则拼接时发生的碰撞容易导致覆晶薄膜400弯折变形加剧，从而使得覆晶薄膜400的断线风险增大。
 技术问题
本发明实施例提供一种连接件、显示面板及显示装置，用以解决现有的显示面板拼接而成的显示装置的显示效果差且显示面板中的覆晶薄膜的断线风险高的问题。
 技术解决方案
第一方面，本发明实施例提供一种连接件，所述连接件包括基体，所述基体包括第一外表面，所述第一外表面至少包括相互垂直的第一平面和第二平面，所述第一平面上设有若干第一接线端，所述第二平面上设有若干第二接线端，若干所述第一接线端与若干所述第二接线端一一对应，每个所述第一接线端与对应的所述第二接线端之间通过导线连通。
在一些实施例中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
在一些实施例中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
在一些实施例中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
第二方面，本发明实施例提供一种显示面板，所述显示面板包括：
第一面板、印制电路板、覆晶薄膜和第一方面所述的连接件；
所述第一面板至少包括基板和背板，所述背板位于所述基板的一侧，所述基板远离所述背板的表面划分为显示区和粘接区；
所述印制电路板位于所述背板远离所述基板的一侧；
所述连接件的所述第一平面上的若干所述第一接线端与所述粘接区电连接，所述连接件的所述第二平面与所述基板的侧面平齐；
所述覆晶薄膜的一端与所述第二平面上的若干所述第二接线端电连接，所述覆晶薄膜的另一端与所述印制电路板电连接。
在一些实施例中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
在一些实施例中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
在一些实施例中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
在一些实施例中，所述显示面板还包括：
发光层、保护胶和异方性导电胶膜；
所述发光层位于所述基板远离所述背板的一侧且对应所述显示区设置，所述发光层包括多个发光单元；
所述保护胶位于所述基板远离所述背板的一侧，对应所述显示区设置且覆盖所述发光层；
所述异方性导电胶膜分别位于所述第一平面与所述粘接区之间，所述第二平面与所述覆晶薄膜之间，以及所述覆晶薄膜与所述印制电路板之间。
在一些实施例中，所述基体还包括第二外表面，所述第二外表面与所述第一外表面连接，所述显示面板还包括固定胶，所述固定胶位于所述第二外表面与所述粘接区之间。
在一些实施例中，所述第二外表面与所述第一外表面构成长方体状的所述基体，所述第一平面的长度小于或等于所述粘接区的长度，所述第二平面的高度小于或等于所述保护胶的高度，所述第一平面和所述第二平面中的任意一个的宽度均大于或等于所述覆晶薄膜的宽度。
第三方面，本发明实施例提供一种显示装置，所述显示装置由多个第二方面所述的显示面板拼接而成。
在一些实施例中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
在一些实施例中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
在一些实施例中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
在一些实施例中，所述显示面板还包括：
发光层、保护胶和异方性导电胶膜；
所述发光层位于所述基板远离所述背板的一侧且对应所述显示区设置，所述发光层包括多个发光单元；
所述保护胶位于所述基板远离所述背板的一侧，对应所述显示区设置且覆盖所述发光层；
所述异方性导电胶膜分别位于所述第一平面与所述粘接区之间，所述第二平面与所述覆晶薄膜之间，以及所述覆晶薄膜与所述印制电路板之间。
在一些实施例中，所述基体还包括第二外表面，所述第二外表面与所述第一外表面连接，所述显示面板还包括固定胶，所述固定胶位于所述第二外表面与所述粘接区之间。
在一些实施例中，所述第二外表面与所述第一外表面构成长方体状的所述基体，所述第一平面的长度小于或等于所述粘接区的长度，所述第二平面的高度小于或等于所述保护胶的高度，所述第一平面和所述第二平面中的任意一个的宽度均大于或等于所述覆晶薄膜的宽度。
 有益效果
本发明实施例提供的连接件、显示面板及显示装置，由于连接件的第一平面上的若干第一接线端与粘接区电连接，连接件的第二平面上的若干第二接线端与基板的侧面平齐，覆晶薄膜的两端分别与连接件的第二平面上的若干第二接线端和印制电路板电连接，如此在能够实现正常信号传输的情况下，还能保证基板侧面不存在空腔区域，从而使凸起结构的厚度δ最小。由此，不仅能够提高由多个显示面板拼接而成的显示装置的显示效果，还能降低显示覆晶薄膜的断线风险。
 附图说明
图1为现有技术中亚毫米发光二极管显示面板的结构示意图。
图2为弯折后的亚毫米发光二极管显示面板的结构示意图。
图3为本发明实施例提供的连接件的结构示意图。
图4为本发明实施例提供的连接件的变形结构示意图。
图5为本发明实施例提供的显示面板的结构示意图。
图6为本发明实施例提供的显示面板的制作方法流程图。
 本发明的实施方式
为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
需要说明的是，为了便于描述，在本发明实施例中，将弯折后的亚毫米发光二极管显示面板简称为显示面板，将由多个弯折后的亚毫米发光二极管显示面板拼接而成的拼接式亚毫米发光二极管显示面板简称为显示装置。
为了解决上述技术问题，本发明实施例首先提供一种连接件，需要说明的是，该连接件应用于显示面板中，能够降低显示面板中覆晶薄膜的断线风险，并能够提高由多个显示面板拼接而成的显示装置的显示效果。
图3为本发明实施例提供的连接件的结构示意图，如图3所示，该连接件10包括基体，所述基体包括第一外表面，所述第一外表面至少包括相互垂直的第一平面11和第二平面12。
所述第一平面11上设有若干第一接线端。图3所示的第一接线端的个数为5个，5个第一接线端间隔设置且规则排列形成一条直线，需要说明的是，图3所示的第一接线端的个数和排列方式仅为一种示例，并不作为对本发明实施例的限制。
所述第二平面12上设有若干第二接线端。图3所示的第二接线端的个数为5个，5个第二接线端间隔设置且规则排列形成一条直线，需要说明的是，图3所示的第二接线端的个数和排列方式仅为一种示例，并不作为对本发明实施例的限制。
需要说明的是，将第一接线端和第二接线端统称为接线端，本发明实施例中的接线端不仅可以是传统意义上的接线端子，还可以是一条极短的导线。图3所示的接线端均为极短的导线，其通过镀膜工艺镀于第一外表面上，如此得到的接线端呈薄膜状，薄膜状的接线端具有厚度薄的优点，能够减小连接件10的体积，使其能够适用于不同尺寸的显示面板，并且，镀膜工艺能够使接线端与第一外表面之间粘接得更加牢固，避免了连接件10在使用过程中接线端脱落的问题。
所述第一平面11上的若干第一接线端和所述第二平面12上的若干第二接线端一一对应，每个第一接线端与对应的第二接线端之间通过导线连通。图3所示的5个第一接线端均为极短的导线，分别为a1、a2、a3、a4和a5，5个第二接线端均为极短的导线，分别为b1、b2、b3、b4和b5，其中，a1与b1对应，两者之间通过导线c1连通，a2与b2对应，两者之间通过导线c2连通，a3与b3对应，两者之间通过导线c3连通，a4与b4对应，两者之间通过导线c4连通，a5与b5对应，两者之间通过导线c5连通。
需要说明的是，导线将第一接线端与第二接线端连通指的是，导线的一端与第一接线端电连接，导线的另一端与第二接线端电连接，从而使得从第一接线端输入的信号可以经过导线传输到第二接线端，反之，从第二接线端输入的信号可以经过导线传输到第一接线端。
导线可以设于基体的任何位置，图3所示的5条导线c1、c2、c3、c4和c5分别间隔设置于第一外表面上，每条导线均沿第一平面11到第二平面12的方向延伸。每条导线可通过镀膜工艺镀于第一外表面上，如此得到的导线呈薄膜状，薄膜状的导线具有厚度薄的优点，能够减小连接件10的体积，使其能够适用于不同尺寸的显示面板，并且，镀膜工艺能够使导线与第一外表面之间粘接得更加牢固，避免了连接件10在使用过程中导线脱落的问题。
需要说明的是，第一接线端、导线和第二接线端三者可一体成型设置，也可非一体成型设置，本发明实施例对此不作具体限定。
基于上述实施例，在一些实施例中，第一平面11直接与第二平面12连接，两者形成的第一外表面呈直角状，在其他实施例中，如图3所示，所述第一外表面还包括弧面13，所述弧面13分别连接第一平面11和第二平面12，使得第一平面11、弧面13和第二平面12形成的第一外表面呈倒角状。相较于呈直角状的第一外表面，呈倒角状的第一外表面由于无锋利的棱角，因此降低了其上所镀的导线被刮伤的风险，提高了导线的良率。
基于上述实施例，在一些实施例中，基体的材料为热膨胀系数较小的绝缘材料，其热膨胀系数的取值范围通常为1×10 -7/K-500×10 -7/K，该基体的材料可选作为塑料。可以理解的是，由于基体的材料的热膨胀系数较小，因此其在温度变化时体积改变较小，从而能够使显示面板在不同的温度环境下均具有较高的良率。
基于上述实施例，本发明实施例提供图3所示的连接件10的多种变形结构，图4为本发明实施例提供的连接件的变形结构示意图，其中，图4中的所有连接件10均具有第二外表面。
具体而言，在（a）中，第二外表面为第三平面14，第三平面14与第一平面11垂直连接且与第二平面12相对设置。需要说明的是，在其他实施例中，第二外表面还可包括其他平面，以与第一外表面和第三平面14共同形成封闭的结构，本发明实施例对此不作具体限定。
在（b）中，第二外表面为相互垂直连接的第四平面15和第五平面16，其中，第四平面15与第一平面11垂直连接，第五平面16与第二平面12垂直连接。需要说明的是，在其他实施例中，第二外表面还可包括其他平面，以与第一外表面、第四平面15和第五平面16共同形成封闭的结构，本发明实施例对此不作具体限定。
在（c）中，第二外表面为第六平面17，第六平面17分别连接第一平面11和第二平面12。需要说明的是，在其他实施例中，第二外表面还可包括其他平面，以与第一外表面和第六平面17共同形成封闭的结构，本发明实施例对此不作具体限定。
上述连接件10应用于显示面板中，以下将对包含该连接件10的显示面板进行详细说明。图5为本发明实施例提供的显示面板的结构示意图，如图5所示，该显示面板包括：
第一面板、印制电路板30、覆晶薄膜40和上述实施例所提供的连接件10。
其中，覆晶薄膜40是将集成电路（Integrated Circuit，IC）固定在柔性线路板上的晶粒软膜，在众多显示面板例如液晶显示面板和有机发光二极管显示面板中大多用到了覆晶薄膜40。覆晶薄膜40通常用作扫描驱动或数据驱动，即，接收印制电路板30发送的扫描信号或数据信号，并将接收到的扫描信号或数据信号传输给显示面板中对应的扫描线或数据线。为了便于描述，本发明实施例将覆晶薄膜40用作数据驱动，即，该覆晶薄膜40仅用于接收印制电路板30发送的数据信号，并将接收到的数据信号传输给显示面板中对应的数据线。
所述第一面板至少包括基板和背板。其中，所述基板可以是刚性基板，例如玻璃基板，还可以是柔性基板，例如聚酰亚胺（PI）基板。所述背板位于所述基板的一侧，所述基板远离所述背板的表面划分为显示区和粘接区，所述印制电路板30位于所述背板远离所述基板的一侧。
所述连接件10包括基体，所述基体包括第一外表面，所述第一外表面至少包括相互垂直的第一平面11和第二平面12。需要说明的是，图5所示的连接件10的第一外表面还包括连接第一平面11和第二平面12的弧面13。所述第一平面11上设有若干第一接线端（图5未示出，请参阅图3），所述第二平面12上设有若干第二接线端（图5未示出，请参阅图3），若干所述第一接线端与若干所述第二接线端一一对应，每一所述第一接线端与对应的所述第二接线端之间通过导线连通。图5所示的第一接线端和第二接线端均为极短的导线，连通第一接线端和第二接线端的导线（图5未示出，请参阅图3）设于第一外表面上，且与第一接线端和第二接线端一体成型。
所述连接件10的第一平面11上的若干所述第一接线端与所述粘接区电连接，所述连接件10的所述第二平面12与所述基板的侧面平齐。具体而言，所述显示区内的若干数据线均延伸到了粘接区内，所述连接件10的第一平面11上的若干第一接线端与粘接区内的若干数据线一一对应电连接，所述连接件10的第二平面12与基板的侧面平齐。
所述覆晶薄膜40的一端与所述第二平面12上的若干所述第二接线端电连接，所述覆晶薄膜40的另一端与所述印制电路板30电连接。由于覆晶薄膜40的两端分别与印制电路板30和连接件10的第二平面12上的若干第二接线端电连接，因此覆晶薄膜40可以接收印制电路板30发送的数据信号，并将数据信号传输给连接件10的第二平面12上的若干第二接线端，进而由第二接线端经与其电连接的导线传递给第一接线端，进而传输给第一接线端电连接的数据线。
由图5可以看出，将连接件10应用于显示面板中，使连接件10的第一平面11上的若干第一接线端与粘接区电连接，使连接件10的第二平面12上的若干第二接线端与基板的侧面平齐，将覆晶薄膜40的两端分别与连接件10的第二平面12上的若干第二接线端和印制电路板30电连接，如此在能够实现正常信号传输的情况下，还能保证基板侧面不存在空腔区域，从而使凸起结构的厚度δ最小。由此，不仅能够提高由多个显示面板拼接而成的显示装置的显示效果，还能降低显示覆晶薄膜40的断线风险。
基于上述实施例，在一些实施例中，如图5所示，所述显示面板还包括发光层23、保护胶24和异方性导电胶膜（图5未示出）。其中，所述发光层23位于所述基板远离所述背板的一侧且对应所述显示区设置，所述发光层23包括多个发光单元。图5所示的发光层23所包括的发光单元为mini-LED，多个mini-LED间隔设置，每个mini-LED为可以发出特定颜色的光的元器件，特定颜色可以为红色、绿色或蓝色，本发明实施例对其不作具体限定。
所述保护胶24位于所述基板远离所述背板的一侧，对应所述显示区设置且覆盖所述发光层23。需要说明的是，保护胶24与发光层23均位于基板的同一侧，发光层23中的多个mini-LED间隔设置，保护胶24覆盖多个mini-LED且填充不同的mini-LED之间的间隙，保护胶24的厚度大于mini-LED的厚度，用以保护mini-LED不受外界的碰伤，提高发光层23的整体强度，本发明实施例不对保护胶24的具体材料进行限定。
所述异方性导电胶膜分别位于所述第一平面11与所述粘接区之间，所述第二平面12与所述覆晶薄膜40之间，以及所述覆晶薄膜40与所述印制电路板30之间。具体而言，由于异方性导电胶膜具有各向异性导电的性质，因此在连接件10的第一平面11与粘接区之间设置异方性导电胶膜，能够使第一平面11上的每个第一接线端能够与粘接区内对应的数据线实现电连接；在连接件10的第二平面12与覆晶薄膜40之间设置异方性导电胶膜，能够使第二平面12上的每个第二接线端能够与覆晶薄膜40上的对应导线电连接；在覆晶薄膜40与印制电路板30之间设置异方性导电胶膜，能够使覆晶薄膜40与印制电路板30实现电连接。可以理解的是，通过异方性导电胶膜实现不同物体之间的电连接，具有简单方便的优点。
基于上述实施例，在一些实施例中，所述基体还包括第二外表面，具体请参阅图4，所述第二外表面与所述第一外表面连接。所述显示面板还包括固定胶50，所述固定胶50位于所述第二外表面与所述粘接区之间。所述固定胶50的材料可以为环氧粘接剂、酚醛类粘接剂或有机硅胶粘接剂，本发明实施例对此不作具体限定。
可以理解的是，固定胶50可以进一步确保连接件10牢靠固定于基板21上，并可以确保在将印制电路板30固定于背板上时能够施加足够大的拉力以绷紧覆晶薄膜40，防止覆晶薄膜40产生大幅度的晃动。
基于上述实施例，在一些实施例中，所述连接件10的基体的第二外表面与第一外表面构成的基体呈长方体状，具体如图5所示。其中，请参阅图3，第一平面11的长度L小于或等于所述粘接区的长度，所述第二平面12的高度H小于或等于所述保护胶24的高度，以便安装后该连接件10不会突出。所述第一平面11和所述第二平面12中的任意一个的宽度W均大于或等于所述覆晶薄膜40的宽度。
请参阅图6，图6为本发明实施例提供的显示面板的制作方法流程图，该方法包括：
步骤S1，提供第一面板、印制电路板、覆晶薄膜和上述实施例所提供的连接件；其中，所述第一面板至少包括基板和背板，所述背板位于所述基板的一侧，所述基板远离所述背板的表面划分为显示区和粘接区。
步骤S2，将所述连接件的所述第一平面上的若干所述第一接线端与所述粘接区电连接，并使所述连接件的所述第二平面与所述基板的侧面平齐，将所述覆晶薄膜的一端与所述第二平面上的若干所述第二接线端电连接，将所述覆晶薄膜的另一端与所述印制电路板电连接。
步骤S3，将所述覆晶薄膜沿朝向所述背板的方向弯折，以将所述印制电路板固定于所述背板上。
基于上述实施例，在一些实施例中，所述连接件的基体还包括第二外表面，所述第二外表面与所述第一外表面连接，该方法还包括：
步骤S4，在连接件的第二外表面与粘接区之间填充固定胶。
需要说明的是，步骤S4可在步骤S3之前执行，还可在步骤S3之后执行，本发明实施例对此不作具体限定。
需要说明的是，通过上述方法制作得到的显示面板的结构如图5所示，由于连接件的第一平面上的若干第一接线端与粘接区电连接，连接件的第二平面上的若干第二接线端与基板的侧面平齐，覆晶薄膜的两端分别与连接件的第二平面上的若干第二接线端和印制电路板电连接，如此在能够实现正常信号传输的情况下，还能保证基板侧面不存在空腔区域，从而使凸起结构的厚度δ最小。由此，不仅能够提高由多个显示面板拼接而成的显示装置的显示效果，还能降低显示覆晶薄膜的断线风险。
在一些实施例中，第一接线端和第二接线端均为极短的导线，连通第一接线端和第二接线端的导线设于第一外表面上，且与第一接线端和第二接线端一体成型。步骤S2具体为：在连接件的所述第一平面与所述粘接区之间设置异方性导电胶膜，使所述连接件的所述第一平面上的若干所述第一接线端与所述粘接区电连接，并使所述连接件的所述第二平面与所述基板的侧面平齐，在连接件的所述第二平面与所述覆晶薄膜之间设置异方性导电胶膜，使所述覆晶薄膜的一端与所述第二平面上的若干所述第二接线端电连接，在覆晶薄膜与印制电路板之间设置异方性导电胶膜，使所述覆晶薄膜的另一端与所述印制电路板电连接。
本发明实施例提供还提供一种显示装置，所述显示装置由多个上述实施例所提供的显示面板拼接而成。
需要说明的是，由于连接件的第一平面上的若干第一接线端与粘接区电连接，连接件的第二平面上的若干第二接线端与基板的侧面平齐，覆晶薄膜的两端分别与连接件的第二平面上的若干第二接线端和印制电路板电连接，如此在能够实现正常信号传输的情况下，还能保证基板侧面不存在空腔区域，从而使凸起结构的厚度δ最小。由此，不仅能够提高由多个显示面板拼接而成的显示装置的显示效果，还能降低显示覆晶薄膜的断线风险。
可以理解的是，对本领域普通技术人员来说，可以根据本发明的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本发明所附的权利要求的保护范围。

Claims (18)

  1. 一种连接件，其中，所述连接件包括基体，所述基体包括第一外表面，所述第一外表面至少包括相互垂直的第一平面和第二平面，所述第一平面上设有若干第一接线端，所述第二平面上设有若干第二接线端，若干所述第一接线端与若干所述第二接线端一一对应，每个所述第一接线端与对应的所述第二接线端之间通过导线连通。
  2. 根据权利要求1所述的连接件，其中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
  3. 根据权利要求1所述的连接件，其中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
  4. 根据权利要求1所述的连接件，其中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
  5. 一种显示面板，其中，所述显示面板包括：
    第一面板、印制电路板、覆晶薄膜和权利要求1所述的连接件；
    所述第一面板至少包括基板和背板，所述背板位于所述基板的一侧，所述基板远离所述背板的表面划分为显示区和粘接区；
    所述印制电路板位于所述背板远离所述基板的一侧；
    所述连接件的所述第一平面上的若干所述第一接线端与所述粘接区电连接，所述连接件的所述第二平面与所述基板的侧面平齐；
    所述覆晶薄膜的一端与所述第二平面上的若干所述第二接线端电连接，所述覆晶薄膜的另一端与所述印制电路板电连接。
  6. 根据权利要求5所述的显示面板，其中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
  7. 根据权利要求5所述的显示面板，其中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
  8. 根据权利要求5所述的显示面板，其中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
  9. 根据权利要求5-8中任意一项所述的显示面板，其中，所述显示面板还包括：
    发光层、保护胶和异方性导电胶膜；
    所述发光层位于所述基板远离所述背板的一侧且对应所述显示区设置，所述发光层包括多个发光单元；
    所述保护胶位于所述基板远离所述背板的一侧，对应所述显示区设置且覆盖所述发光层；
    所述异方性导电胶膜分别位于所述第一平面与所述粘接区之间，所述第二平面与所述覆晶薄膜之间，以及所述覆晶薄膜与所述印制电路板之间。
  10. 根据权利要求9所述的显示面板，其中，所述基体还包括第二外表面，所述第二外表面与所述第一外表面连接，所述显示面板还包括固定胶，所述固定胶位于所述第二外表面与所述粘接区之间。
  11. 根据权利要求10所述的显示面板，其中，所述第二外表面与所述第一外表面构成长方体状的所述基体，所述第一平面的长度小于或等于所述粘接区的长度，所述第二平面的高度小于或等于所述保护胶的高度，所述第一平面和所述第二平面中的任意一个的宽度均大于或等于所述覆晶薄膜的宽度。
  12. 一种显示装置，其中，所述显示装置由多个权利要求5所述的显示面板拼接而成。
  13. 根据权利要求12所述的显示装置，其中，所述导线设于所述第一外表面上，且沿所述第一平面到所述第二平面的方向延伸。
  14. 根据权利要求12所述的显示装置，其中，所述第一外表面还包括弧面，所述弧面分别连接所述第一平面和所述第二平面。
  15. 根据权利要求12所述的显示装置，其中，所述基体的材料为绝缘材料，所述基体的热膨胀系数的取值范围为1×10 -7/K-500×10 -7/K。
  16. 根据权利要求12-15中任意一项所述的显示装置，其中，所述显示面板还包括：
    发光层、保护胶和异方性导电胶膜；
    所述发光层位于所述基板远离所述背板的一侧且对应所述显示区设置，所述发光层包括多个发光单元；
    所述保护胶位于所述基板远离所述背板的一侧，对应所述显示区设置且覆盖所述发光层；
    所述异方性导电胶膜分别位于所述第一平面与所述粘接区之间，所述第二平面与所述覆晶薄膜之间，以及所述覆晶薄膜与所述印制电路板之间。
  17. 根据权利要求16所述的显示装置，其中，所述基体还包括第二外表面，所述第二外表面与所述第一外表面连接，所述显示面板还包括固定胶，所述固定胶位于所述第二外表面与所述粘接区之间。
  18. 根据权利要求17所述的显示装置，其中，所述第二外表面与所述第一外表面构成长方体状的所述基体，所述第一平面的长度小于或等于所述粘接区的长度，所述第二平面的高度小于或等于所述保护胶的高度，所述第一平面和所述第二平面中的任意一个的宽度均大于或等于所述覆晶薄膜的宽度。
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