WO2021147601A1 - 背光源及其制备方法 - Google Patents

背光源及其制备方法 Download PDF

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Publication number
WO2021147601A1
WO2021147601A1 PCT/CN2020/138532 CN2020138532W WO2021147601A1 WO 2021147601 A1 WO2021147601 A1 WO 2021147601A1 CN 2020138532 W CN2020138532 W CN 2020138532W WO 2021147601 A1 WO2021147601 A1 WO 2021147601A1
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WO
WIPO (PCT)
Prior art keywords
substrate
driving circuit
layer
conductive line
circuit layer
Prior art date
Application number
PCT/CN2020/138532
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English (en)
French (fr)
Inventor
张鑫
丘永元
付琳琳
程希
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Filing date
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/419,787 priority Critical patent/US11829028B2/en
Publication of WO2021147601A1 publication Critical patent/WO2021147601A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

Definitions

  • This application relates to the field of display technology, in particular to a backlight source and a preparation method thereof.
  • liquid crystal displays have become a major display type in the current flat display field.
  • a liquid crystal display needs a backlight module as a light source.
  • Direct type and side type are the two mainstream backlight forms in the current market.
  • Mini-LED is small in size and is used to realize ultra-thin and multi-zone, which is the current industry development technology direction.
  • the industry uses Mini-LED as a backlight source with a liquid crystal display (LCD) panel to achieve ultra-thin, high-brightness, and multiple partitions.
  • LCD liquid crystal display
  • an active matrix driving (Active Matrix, AM) method has been proposed, and the active matrix driving is realized by using a TFT structure formed on a glass substrate with a scanning method.
  • the AM TFT design structure is adopted, the traditional bonding process is adopted, and the COF bonding process is adopted to connect the flexible circuit board (PCB) and the glass substrate, where the driver IC/Tcon IC is provided on the PCB board.
  • PCB flexible circuit board
  • AM mini-LED light board adopts the glass process, it will inevitably have the problem of fragility compared with the traditional PCB board.
  • COF The PCB structure formed by the bonding process is not easy to place, which affects the overall structure design, especially when meeting the design requirements of an all-in-one machine.
  • the maximum size of an SMT machine (Surface Mount Technology) or a bonding machine is 500*650 mm, so large-size display products are limited by the size of the SMT machine or bonding machine. Therefore, the adjacent AM mini-LED light boards must be spliced design.
  • the splicing distance between the two light boards is relatively wide, resulting in the light sources on the two adjacent light boards being far apart, while the AM
  • the limited luminous efficiency of mini-LEDs easily leads to weaker brightness at the joint of the two light panels, which is not conducive to the design of the backlight and affects the uniformity of the brightness of the display panel.
  • the purpose of the present invention is to provide a backlight source and a preparation method thereof, so as to solve the problem that the glass substrate in the prior art is easy to be broken, and the length of the PCB board is likely to cause uneven light source distribution between two adjacent spliced lamp boards, which affect The technical problem of the uniformity of the brightness of the display panel.
  • the present invention provides a backlight source, including a first substrate, a light source, a driving circuit layer and a conductive line, the light source is distributed on the upper surface of the first substrate; the second substrate and the first substrate The substrates are arranged oppositely; the driving circuit layer is arranged on the surface of the second substrate on one side away from the first substrate; one end of the conductive line is connected to the light source, and the other end is bent and bound to the Drive circuit layer.
  • the backlight source further includes: a protective layer correspondingly disposed on the sides of the first substrate and the second substrate and covering the conductive line.
  • the backlight source further includes: a via hole that penetrates the first substrate and the second substrate and is close to one end of the first substrate and the second substrate; wherein, the conductive line Bending and binding to the driving circuit layer through the via hole.
  • the backlight source further includes: an adhesive layer disposed between the first substrate and the second substrate.
  • the thickness of the adhesive layer is 200um-2mm.
  • the driving circuit layer includes: a circuit board, a connector, and a driving device.
  • the connector is provided on one side surface of the circuit board and is close to the sides of the first substrate and the second substrate
  • the driving device is arranged on one side surface of the circuit board, and is arranged on the same layer as the connector.
  • the present invention also provides a method for preparing a backlight, including the following steps: providing a first substrate and a second substrate, the second substrate is arranged opposite to the first substrate; The upper surface of the first substrate; a driving circuit layer on the lower surface of the second substrate, close to the sides of the first substrate and the second substrate; and forming a conductive line, one end of which is connected to the light source, The other end is bent and bound to the driving circuit layer.
  • the method for preparing the backlight source further includes: forming a protective layer on the sides of the first substrate and the second substrate and covering the conductive lines.
  • the method for preparing the backlight further includes: forming a via hole, which penetrates through one end of the first substrate and the second substrate and is close to One end of the first substrate and the second substrate; wherein the conductive line passes through the via hole and is bent and bound to the driving circuit layer.
  • the upper surface of the second substrate is bonded to the lower surface of the first substrate through an adhesive layer.
  • the technical effect of the present invention is to provide a backlight source and a preparation method thereof, replacing the structure of a single-layer glass substrate in the prior art with a structure of a double-layer glass substrate to reduce the problem of fragility of the glass substrate;
  • a protective layer is provided at one end or a via is formed, and the protective layer protects the conduction line to prevent the conduction line from being damaged.
  • the invention avoids traditional COF
  • the bonding structure facilitates structural assembly and appearance design.
  • FIG. 1 is a schematic diagram of the structure of the backlight source described in Embodiment 1.
  • FIG. 1 is a schematic diagram of the structure of the backlight source described in Embodiment 1.
  • FIG. 2 is a flow chart of the method for preparing the backlight source described in Example 1.
  • FIG. 2 is a flow chart of the method for preparing the backlight source described in Example 1.
  • FIG. 3 is a schematic diagram of the structure of the conductive line forming step described in Embodiment 1.
  • FIG. 3 is a schematic diagram of the structure of the conductive line forming step described in Embodiment 1.
  • FIG. 4 is a schematic diagram of the structure of the protective layer forming step described in Embodiment 1.
  • FIG. 4 is a schematic diagram of the structure of the protective layer forming step described in Embodiment 1.
  • FIG. 5 is a schematic diagram of the structure of the backlight according to the second embodiment.
  • FIG. 6 is a flow chart of the method for preparing the backlight source described in Example 2.
  • FIG. 7 is a schematic diagram of the structure of the via forming step described in Embodiment 2.
  • FIG. 7 is a schematic diagram of the structure of the via forming step described in Embodiment 2.
  • FIG. 8 is a schematic diagram of the structure of the conductive line forming step according to the second embodiment.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.
  • an intermediate medium it can be the internal communication of two components or the interaction of two components relation.
  • the "on" or “under” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • this embodiment provides a backlight source 100 for providing a light source for a display panel.
  • the backlight source 100 includes a first substrate 1, a light source 2, a second substrate 3, a driving circuit layer 4, a conductive line 5, Adhesive layer 6 and protective layer 7.
  • the first substrate 1 is a glass substrate.
  • the light sources 2 are evenly distributed on the upper surface of the first substrate 1, and the light sources 2 are Mini-LEDs. Wherein, the first substrate 1 and the lamp source 2 are assembled to form a lamp board.
  • the second substrate 3 is also a glass substrate, and is arranged opposite to the first substrate 1.
  • the material of the second substrate 3 may be a PCB board material, such as a metal core printed circuit board (Metal Core PCB, MCPCB), FR-4 epoxy glass cloth laminate, CEM-3 composite substrate, and the like.
  • FR-4 epoxy glass cloth laminate has the characteristics of stable electrical insulation, good flatness, smooth surface, and no pits. It is suitable for products requiring high-performance electronic insulation;
  • CEM-3 is a glass cloth prepreg and The glass fiber paper prepreg laminated with copper foil is formed by curing.
  • the driving circuit layer 4 is provided on the lower surface of the second substrate 3.
  • the driving circuit layer 4 includes a circuit board 41, a connector 42 and a driving device 43.
  • the circuit board 41 is a flexible circuit board (PCB).
  • a connector 42 (connector) is provided on the lower surface of the circuit board 41, located at one end of the first substrate 1 and the second substrate 3, and is close to the right side of the first substrate 1 and the second substrate 3, for external wiring.
  • the driving device 43 is arranged on the lower surface of the circuit board 41 and is arranged on the same layer as the connector 42 to drive the lamp source 2 to emit light.
  • the conductive line 5 has one end connected to the light source 2 and the other end is bent and bound to the driving circuit layer 4. Specifically, the conductive line 5 is bent along the right side of the first substrate 1 and the second substrate 3 to below the second substrate 3.
  • the conductive line 5 has a first bending portion 51 and a second bending portion 52.
  • the first bending portion 51 is located at the upper right corner of the first substrate 1, and the second bending portion 52 is located at the lower right corner of the second substrate 52.
  • the splicing pitch between the two lamp panels can be shortened, so that the splicing pitch
  • the distance between the two light sources 2 on a light board is the same. Therefore, the brightness of any two adjacent light sources is consistent, which is beneficial to the design of the backlight source, so that the brightness of any position on the display panel is consistent.
  • the adhesive layer 6 is arranged between the first substrate 1 and the second substrate 3, and the first substrate 1 and the second substrate 3 are closely adhered together by adopting a full-bonding and or a frame-bonding method.
  • the adhesive layer 5 is a transparent colloid with high viscosity, and its thickness is 200um-2mm, preferably 400um, 550um, 580um, 680um, 780um, 800um, 1mm, 1.5mm.
  • the protective layer 7 is correspondingly disposed on the sides of the first substrate 1 and the second substrate 3 and covers the conductive line 5. Specifically, the protective layer 7 is provided on the right side of the first substrate 1 and the second substrate 3.
  • the material of the protective layer 7 is at least one of silica gel, silicone resin, and epoxy resin.
  • the conductive line 5 has a first bending portion 51 and a second bending portion 52, and the protective layer 7 completely covers the outer side wall of the first bending portion 51, so that the first bending portion 51 is wrapped. It is used to protect the conductive circuit 5 and prevent the conductive circuit 5 from being damaged when the driving circuit layer 4 is pulled, such as disconnection, which affects the conduction between the lamp source 2 and the driving circuit layer 4.
  • this embodiment also provides a method for preparing a backlight source, including the following steps S11)-S15).
  • a first substrate and a second substrate are provided, and the second substrate is disposed opposite to the first substrate.
  • a colloid is coated on the upper surface of the second substrate, the first substrate and the second substrate are aligned, and the colloid is cured to form an adhesive layer, so that the first substrate The upper surface of the two substrates is closely attached to the lower surface of the first substrate.
  • a frame attachment method may also be used, so that the first substrate and the second substrate are closely attached together.
  • the first substrate and the second substrate are both glass substrates
  • the material of the second substrate may be a PCB board material, such as a metal core printed circuit board (Metal Core PCB, MCPCB), FR-4 epoxy glass cloth laminate, CEM-3 composite substrate, etc.
  • PCB board material such as a metal core printed circuit board (Metal Core PCB, MCPCB), FR-4 epoxy glass cloth laminate, CEM-3 composite substrate, etc.
  • the light sources are evenly distributed on the first substrate.
  • the light source is Mini-LED.
  • the first substrate and the light source are assembled to form a light board.
  • a driving circuit layer is placed on the lower surface of the second substrate, and is close to the sides of the first substrate and the second substrate. Specifically, the drive circuit layer is arranged at the lower right of the second substrate, and the drive circuit layer is attached to the lower surface of the second substrate.
  • the driving circuit layer 4 includes a circuit board 41, a connector 42 and a driving device 43.
  • the circuit board 41 is a flexible circuit board (PCB).
  • a connector 42 (connector) is provided on the lower surface of the circuit board 41, located at one end of the first substrate 1 and the second substrate 3, and is close to the right side of the first substrate 1 and the second substrate 3, for external wiring.
  • the driving device 43 is arranged on the lower surface of the circuit board 41 and is arranged on the same layer as the connector 42 to drive the lamp source 2 to emit light.
  • a conductive line is formed, one end of which is connected to the light source, and the other end is bent and bound to the driving circuit layer.
  • a conductive line 5 is formed on the right side of the first substrate 1 and the second substrate 3 by the side line printing method, and the conductive line 5 is bent along the right side of the first substrate 1 and the second substrate 3. Folded to the bottom of the second substrate 3, the driving circuit layer 4 is electrically connected to the light source through the conductive line 5, refer to FIG. 3.
  • the conductive line 5 has a first bending portion 51 and a second bending portion 52. The first bending portion 51 is located at the upper right corner of the first substrate 1, and the second bending portion 52 is located at the lower right corner of the second substrate 52.
  • a protective layer is formed on the sides of the first substrate and the second substrate and covers the conductive lines.
  • a protective layer 7 is formed on the right side of the first substrate 1 and the second substrate 3.
  • the material of the protective layer is at least one of silica gel, silicone resin, and epoxy resin.
  • the protective layer completely covers the outer side wall of the first bending portion, so that the first bending portion is wrapped to protect the conductive line and prevent the driving circuit layer from being pulled.
  • the phenomenon of damage to the conduction line such as a disconnection, which affects the conduction between the lamp source and the driving circuit layer.
  • This embodiment provides a backlight source and a preparation method thereof.
  • a double-layer glass substrate is used to replace the structure of a single-layer glass substrate in the prior art to reduce the problem of fragility of the glass substrate; a protective layer is provided at one end of the double-layer glass substrate, Protect the conduction line to prevent damage to the conduction line.
  • This embodiment avoids traditional COF
  • the bonding structure facilitates structural assembly and appearance design.
  • This embodiment provides a backlight source and a preparation method thereof, including most of the technical solutions of embodiment 1.
  • the difference is that the protective layer in embodiment 1 is removed, and the backlight source provided in this embodiment includes a via hole.
  • the via hole penetrates the first substrate and the second substrate.
  • this embodiment provides a backlight source including a first substrate 1, a light source 2, a second substrate 3, a driving circuit layer 4, a conductive line 5, an adhesive layer 6 and a via 8.
  • the via 8 penetrates the first substrate 1 and the second substrate 3 and is close to one end of the first substrate 1 and the second substrate 3; wherein, the conductive line 5 passes through the via 8 and is bent and bound to the driving circuit layer 4.
  • this embodiment provides a method for preparing a backlight, including the following steps S21) to S25).
  • a first substrate and a second substrate are provided, and the second substrate is disposed opposite to the first substrate.
  • a colloid is coated on the upper surface of the second substrate, the first substrate and the second substrate are aligned, and the colloid is cured to form an adhesive layer, so that the first substrate The upper surface of the two substrates is closely attached to the lower surface of the first substrate.
  • a frame attachment method may also be used, so that the first substrate and the second substrate are closely attached together.
  • the first substrate and the second substrate are both glass substrates
  • the material of the second substrate may be a PCB board material, such as a metal core printed circuit board (Metal Core PCB, MCPCB), FR-4 epoxy glass cloth laminate, CEM-3 composite substrate, etc.
  • PCB board material such as a metal core printed circuit board (Metal Core PCB, MCPCB), FR-4 epoxy glass cloth laminate, CEM-3 composite substrate, etc.
  • the light sources are evenly distributed on the first substrate.
  • the light source is Mini-LED.
  • the first substrate and the light source are assembled to form a light board.
  • a driving circuit layer is placed on the lower surface of the second substrate, and is close to the sides of the first substrate and the second substrate. Specifically, the drive circuit layer is arranged at the lower right of the second substrate, and the drive circuit layer is attached to the lower surface of the second substrate.
  • a conductive line is formed, one end of which is connected to the light source, and the other end is bent and bound to the driving circuit layer.
  • the through hole 8 is filled with tin material by wave soldering, so that one end of the conductive line 5 is connected to the light source 2, and the other end is connected to the driving circuit layer 4, thereby ensuring that the driving circuit layer 4 passes through
  • the conducting line 5 is electrically connected to the light source 2.
  • the conductive line fills the via hole to prevent damage to the conductive line when the driving circuit layer is pulled, such as disconnection, which will affect the lamp source Conduction with the driving circuit layer.
  • This embodiment provides a backlight source and a preparation method thereof.
  • a double-layer glass substrate is used to replace the structure of a single-layer glass substrate in the prior art to reduce the problem of fragility of the glass substrate; a via hole is provided at one end of the double-layer glass substrate , So that the conductive line passes through the via to ensure that it is not damaged.
  • the solution of this embodiment avoids the traditional COF
  • the bonding structure facilitates structural assembly and appearance design.

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  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

一种背光源（100）及其制备方法，背光源（100）包括第一基板（1）、光源（2）、第二基板（3）、驱动电路层（4）以及导通线路（5），光源（2）分布于第一基板（1）上表面；第二基板（3）与第一基板（1）相对设置；驱动电路层（4）设于第二基板（3）远离第一基板（1）的一侧表面；导通线路（5）的一端连接光源（2），另一端被弯折绑定至驱动电路层（4）。

Description

背光源及其制备方法 技术领域
本申请涉及显示技术领域，尤其涉及一种背光源及其制备方法。
 背景技术
近年来，随着平板显示技术的发展，液晶显示器成为目前平面显示领域一种主要的显示器类型。液晶显示器作为非自主发光显示器件，需要背光模块作为光源，直下式和侧入式是当前市场上两种主流的背光形式。
Mini-LED尺寸小，用于实现超薄多分区，是当前业者开发技术方向。目前，业界将Mini-LED作为背光源搭配液晶显示面板（Liquid Crystal Display，LCD），实现超薄，高亮，多分区。随着分区数量的增加，分区的需求也增加。因而，有源矩阵驱动（Active Matrix，AM）方式被提出，通过采用玻璃基板成型的TFT结构搭配扫描的方式以实现有源矩阵驱动。然而，采用AM TFT设计结构时，采用传统绑定（bonding）制程，采用COF bonding工艺使得柔性电路板（PCB）与玻璃基板连接，其中，驱动IC/Tcon IC设于PCB板上。
AM mini-LED灯板因采用玻璃制程，相较于传统PCB板必然存在易碎问题。同时，在背光源组装过程中，COF bonding工艺形成的PCB结构不易放置，从而影响整体结构设计，特别是要满足一体机设计需求时。现有技术中，SMT机台（Surface Mount Technology）或者bonding机台的最大尺寸为500*650mm，因而大尺寸的显示产品受SMT机台或bonding机台的尺寸限制。因此，相邻的AM mini-LED的灯板必须进行拼接设计。在拼接的过程中，由于PCB板自身的长度，导致了两灯板之间的拼接距离较宽，导致了相邻两灯板上的光源相距较远，而AM mini-LED的发光效率有限，容易导致两灯板的拼接处的亮度较弱，不利于背光源的设计，影响了显示面板亮度的均一性。
 技术问题
本发明的目的在于，提供一种背光源及其制备方法，以解决现有技术中存在的玻璃基板容易破碎，PCB板的长度容易导致相邻两拼接灯板之间的光源分布不均匀，影响显示面板亮度的均一性的技术问题。
 技术解决方案
为实现上述目的，本发明提供一种背光源，包括第一基板、光源、驱动电路层以及导通线路，所述光源分布所述第一基板上表面；所述第二基板与所述第一基板相对设置；所述驱动电路层设于所述第二基板远离所述第一基板的一侧表面；所述导通线路的一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。
进一步地，所述的背光源还包括：保护层，对应设置于所述第一基板和所述第二基板的侧边且覆盖所述导通线路。
进一步地，所述的背光源还包括：过孔，贯穿所述第一基板及所述第二基板，且靠近所述第一基板及所述第二基板的一端；其中，所述导通线路穿过所述过孔弯折绑定至所述驱动电路层。
进一步地，所述的背光源还包括：粘合层，设于所述第一基板与所述第二基板之间。
进一步地，所述粘合层的厚度为200um-2mm。
进一步地，所述驱动电路层包括：电路板、连接器以及驱动装置，所述连接器设于所述电路板的一侧表面，且靠近所述第一基板和所述第二基板的侧边；所述驱动装置设于所述电路板的一侧表面，且与所述连接器同层设置。
为实现上述目的，本发明还提供一种背光源的制备方法，包括如下步骤：提供第一基板及第二基板，所述第二基板与所述第一基板相对设置；设置灯源于所述第一基板上表面；在第二基板的下表面一驱动电路层，且靠近所述第一基板及所述第二基板的侧边；以及形成一导通线路，其一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。
进一步地，所述的背光源的制备方法还包括：形成一保护层于所述第一基板和所述第二基板的侧边且覆盖所述导通线路。
进一步地，所述的背光源的制备方法，在形成一导通线路步骤之前，还包括：形成一过孔，所述过孔贯穿所述第一基板及所述第二基板的一端，且靠近所述第一基板及所述第二基板的一端；其中，所述导通线路穿过所述过孔弯折绑定至所述驱动电路层。
进一步地，在提供第一基板及第二基板步骤中，所述第二基板的上表面通过一粘合层贴合至所述第一基板的下表面。
 有益效果
本发明的技术效果在于，提供一种背光源及其制备方法，用双层玻璃基板的结构代替现有技术单层玻璃基板的结构，以降低玻璃基板易碎的问题；在双层玻璃基板的一端设置保护层或者形成一过孔，该保护层对导通线路进行保护处理，以防止导通线路损伤。本发明避免了传统COF bonding结构，便于结构组装和外观设计。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为实施例1所述背光源的结构示意图。
图2为实施例1所述背光源的制备方法的流程图。
图3为实施例1所述导通线路形成步骤的结构示意图。
图4为实施例1所述保护层形成步骤的结构示意图。
图5为实施例2所述背光源的结构示意图。
图6为实施例2所述背光源的制备方法的流程图。
图7为实施例2所述过孔形成步骤的结构示意图。
图8为实施例2所述导通线路形成步骤的结构示意图。
附图部件标识如下：
100背光源；
1第一基板；            2光源；
3第二基板；            4驱动电路层；
5导通线路；            6粘合层；
7保护层；
41电路板；             42连接器；
43驱动装置；
51第一弯折部；          52第二弯折部。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
实施例1
如图1所示，本实施例提一种背光源100，用以为显示面板提供光源，背光源100包括第一基板1、光源2、第二基板3、驱动电路层4、导通线路5、粘合层6以及保护层7。
第一基板1为玻璃基板。灯源2均匀地分布于第一基板1上表面，灯源2为Mini-LED。其中，第一基板1与灯源2组装形成一灯板。
第二基板3也为玻璃基板，与第一基板1相对设置。第二基板3的材质可以为PCB板材料，如金属基印刷电路板（Metal Core PCB，MCPCB）、FR-4环氧玻璃布层压板，CEM-3复合型基材等。其中，FR-4环氧玻璃布层压板具有电绝缘性能稳定、平整度好、表面光滑、无凹坑等特点，适合应用于高性能电子绝缘要求的产品；CEM-3是以玻璃布半固化片与玻纤纸半固化片层压铜箔达到固化形成的。
驱动电路层4设于第二基板3的下表面。驱动电路层4包括电路板41、连接器42以及驱动装置43。电路板41为柔性电路板（PCB）。连接器42（connector）设于电路板41的下表面，位于第一基板1和第二基板3的一端，且靠近第一基板1和第二基板3的右侧边，用以外接线路。驱动装置43设于电路板41的下表面，且与连接器42同层设置，用以驱动灯源2发光。
导通线路5，其一端连接灯源2，另一端被弯折绑定至驱动电路层4。具体地，导通线路5沿着第一基板1和第二基板3的右侧边弯折至第二基板3的下方。导通线路5具有第一弯折部51和第二弯折部52，第一弯折部51位于第一基板1的右上角，第二弯折部52位于第二基板52的右下角。
当两灯板进行拼接处理时，通过将导通线路5进行弯折处理，并且驱动电路层4贴附于第二基板3下表面，可以缩短两灯板之间的拼接间距，使得该拼接间距与一灯板上两灯源2相距的间距相同，因此，任意相邻两灯源的光亮度是一致的，有利于背光源的设计，从而使得显示面板任意位置的亮度保持一致。
粘合层6设于第一基板1与第二基板3之间，采用全贴和或者框贴方式使得第一基板1与第二基板3紧密地粘合在一起。粘合层5为透明胶体，具有高粘性，其厚度为200um-2mm，优选为400um，550um，580um，680um，780um，800um，1mm，1.5mm。
保护层7对应设置于第一基板1和第二基板3的侧边且覆盖导通线路5。具体地，保护层7设于第一基板1和第二基板3的右侧边。保护层7材质为硅胶、硅树脂、环氧树脂中的至少一种。
本实施例中，导通线路5具有第一弯折部51和第二弯折部52，保护层7将第一弯折部51的外侧壁完全覆盖，使得第一弯折部51被包裹，用以保护导通线路5，防止驱动电路层4被拉扯时，导通线路5发生损伤的现象，如断线，影响灯源2与驱动电路层4的导通。
如图2所示，本实施例还提供一种背光源的制备方法，包括如下步骤S11）-S15）。
S11）提供第一基板及第二基板，所述第二基板与所述第一基板相对设置。具体地，在所述第二基板上表面涂覆胶体，将所述第一基板与所述第二基板进行对位处理，并对所述胶体进行固化处理形成一粘合层，使得所述第二基板的上表面与所述第一基板的下表面紧密地贴合在一起。在其他实施例中，还可以采用框贴的方式，使得所述第一基板与所述第二基板紧密地贴合在一起。
本实施例中，所述第一基板与所述第二基板均为玻璃基板，其中，所述第二基板的材质可以为PCB板材料，如金属基印刷电路板（Metal Core PCB，MCPCB）、FR-4环氧玻璃布层压板，CEM-3复合型基材等。
S12）设置灯源于所述第一基板上表面。具体地，所述灯源均匀地分布于第一基板。所述灯源为Mini-LED。其中，所述第一基板与所述灯源组装形成一灯板。
S13）在第二基板的下表面一驱动电路层，且靠近所述第一基板及所述第二基板的侧边。具体地，在所述第二基板的右下方设置所述驱动电路层，所述驱动电路层贴附于所述第二基板的下表面。如图3所示，驱动电路层4包括电路板41、连接器42以及驱动装置43。电路板41为柔性电路板（PCB）。连接器42（connector）设于电路板41的下表面，位于第一基板1和第二基板3的一端，且靠近第一基板1和第二基板3的右侧边，用以外接线路。驱动装置43设于电路板41的下表面，且与连接器42同层设置，用以驱动灯源2发光。
S14）形成一导通线路，其一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。具体地，采用侧边线路印刷方式在第一基板1及第二基板3的右侧边，形成导通线路5，导通线路5沿着第一基板1和第二基板3的右侧边弯折至第二基板3的下方，驱动电路层4通过导通线路5电连接至所述灯源，参照图3。导通线路5具有第一弯折部51和第二弯折部52，第一弯折部51位于第一基板1的右上角，第二弯折部52位于第二基板52的右下角。
S15形成一保护层于所述第一基板和所述第二基板的侧边且覆盖所述导通线路。如图4所示，在第一基板1及第二基板3的右侧边形成保护层7。所述保护层材质为硅胶、硅树脂、环氧树脂中的至少一种。所述保护层将所述第一弯折部的外侧壁完全覆盖，使得所述第一弯折部被包裹，用以保护所述导通线路，防止所述驱动电路层被拉扯时，所述导通线路发生损伤的现象，如断线，该断线影响所述灯源与所述驱动电路层的导通。
本实施例提供一种背光源及其制备方法，用双层的玻璃基板代替现有技术单层玻璃基板的结构，以降低玻璃基板易碎的问题；在双层玻璃基板的一端设置保护层，对导通线路进行保护处理，以防止导通线路损伤。本实施例避免了传统COF bonding结构，便于结构组装和外观设计。
实施例2
本实施例提一种背光源及其制备方法，包括了实施例1的大部分技术方案，其区别在于，去除了实施例1中的保护层，本实施例提供的背光源包括一过孔，该过孔贯穿所述第一基板和所述第二基板。
如图5所示，本实施例提供一种背光源包括第一基板1、光源2、第二基板3、驱动电路层4、导通线路5、粘合层6以及过孔8。
过孔8贯穿第一基板1及第二基板3，且靠近第一基板1及第二基板3的一端；其中，导通线路5穿过过孔8弯折绑定至驱动电路层4。
如图6所示，本实施例提供一种背光源的制备方法，包括如下步骤S21）~S25）。
S21）提供第一基板及第二基板，所述第二基板与所述第一基板相对设置。具体地，在所述第二基板上表面涂覆胶体，将所述第一基板与所述第二基板进行对位处理，并对所述胶体进行固化处理形成一粘合层，使得所述第二基板的上表面与所述第一基板的下表面紧密地贴合在一起。在其他实施例中，还可以采用框贴的方式，使得所述第一基板与所述第二基板紧密地贴合在一起。
本实施例中，所述第一基板与所述第二基板均为玻璃基板，其中，所述第二基板的材质可以为PCB板材料，如金属基印刷电路板（Metal Core PCB，MCPCB）、FR-4环氧玻璃布层压板，CEM-3复合型基材等。
S22）设置灯源于所述第一基板上表面。具体地，所述灯源均匀地分布于第一基板。所述灯源为Mini-LED。其中，所述第一基板与所述灯源组装形成一灯板。
S23）在第二基板的下表面一驱动电路层，且靠近所述第一基板及所述第二基板的侧边。具体地，在所述第二基板的右下方设置所述驱动电路层，所述驱动电路层贴附于所述第二基板的下表面。
S24）形成一过孔，所述过孔贯穿所述第一基板及所述第二基板的一端，且靠近所述第一基板及所述第二基板的一端。如图7所示，在第一基板1及第二基板3的右端进行挖孔处理，形成过孔8。
S25）形成一导通线路，其一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。如图8所示，采用波峰焊接方式在过孔8内，填充满锡材料，使得导通线路5的一端连接灯源2，另一端被连接至驱动电路层4，从而保证驱动电路层4通过导通线路5电连接至灯源2。本实施例中，所述导通线路将所述过孔填满，以防止驱动电路层被拉扯时，所述导通线路发生损伤的现象，如断线，该断线会影响所述灯源与所述驱动电路层的导通。
本实施例提供一种背光源及其制备方法，用双层的玻璃基板代替现有技术单层玻璃基板的结构，以降低玻璃基板易碎的问题；在双层玻璃基板的一端设置一过孔，使得导通线路穿过该过孔，保证其不受损伤，本实施例的方案避免了传统COF bonding结构，便于结构组装和外观设计。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种背光源及其制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (10)

  1. 一种背光源，其中，包括：
    第一基板；
    光源，分布所述第一基板上表面；
    第二基板，与所述第一基板相对设置；
    驱动电路层，设于所述第二基板远离所述第一基板的一侧表面；以及
    导通线路，其一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。
  2. 根据权利要求1所述的背光源，其中，还包括：
    保护层，对应设置于所述第一基板和所述第二基板的侧边且覆盖所述导通线路。
  3. 根据权利要求1所述的背光源，其中，还包括：
    过孔，贯穿所述第一基板及所述第二基板，且靠近所述第一基板及所述第二基板的一端；
    其中，所述导通线路穿过所述过孔弯折绑定至所述驱动电路层。
  4. 根据权利要求1所述的背光源，其中，还包括：
    粘合层，设于所述第一基板与所述第二基板之间。
  5. 根据权利要求4所述的背光源，其中，
    所述粘合层的厚度为200um-2mm。
  6. 根据权利要求1所述的背光源，其中，
    所述驱动电路层包括：
    电路板；
    连接器，设于所述电路板的一侧表面，且靠近所述第一基板和所述第二基板的侧边；以及
    驱动装置，设于所述电路板的一侧表面，且与所述连接器同层设置。
  7. 一种背光源的制备方法，其中，包括如下步骤：
    提供第一基板及第二基板，所述第二基板与所述第一基板相对设置；
    设置灯源于所述第一基板上表面；
    在第二基板的下表面一驱动电路层，且靠近所述第一基板及所述第二基板的侧边；以及
    形成一导通线路，其一端连接所述灯源，另一端被弯折绑定至所述驱动电路层。
  8. 根据权利要求7所述的背光源的制备方法，其中，还包括：
    形成一保护层于所述第一基板和所述第二基板的侧边且覆盖所述导通线路。
  9. 根据权利要求7所述的背光源的制备方法，其中，
    在形成一导通线路步骤之前，还包括：
    形成一过孔，所述过孔贯穿所述第一基板及所述第二基板的一端，且靠近所述第一基板及所述第二基板的一端；
    其中，所述导通线路穿过所述过孔弯折绑定至所述驱动电路层。
  10. 根据权利要求7所述的背光源的制备方法，其中，
    在提供第一基板及第二基板步骤中，
    所述第二基板的上表面通过一粘合层贴合至所述第一基板的下表面。
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