WO2023103021A1 - 一种显示装置的制备方法、显示装置及拼接显示装置 - Google Patents

一种显示装置的制备方法、显示装置及拼接显示装置 Download PDF

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Publication number
WO2023103021A1
WO2023103021A1 PCT/CN2021/138925 CN2021138925W WO2023103021A1 WO 2023103021 A1 WO2023103021 A1 WO 2023103021A1 CN 2021138925 W CN2021138925 W CN 2021138925W WO 2023103021 A1 WO2023103021 A1 WO 2023103021A1
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WIPO (PCT)
Prior art keywords
display panel
conductive
lcd display
units
display device
Prior art date
Application number
PCT/CN2021/138925
Other languages
English (en)
French (fr)
Inventor
赵军
赵斌
肖军城
徐洪远
陆骅俊
Original Assignee
Tcl华星光电技术有限公司
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Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/622,226 priority Critical patent/US20240036375A1/en
Publication of WO2023103021A1 publication Critical patent/WO2023103021A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13336—Combining plural substrates to produce large-area displays, e.g. tiled displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/44—Arrangements combining different electro-active layers, e.g. electrochromic, liquid crystal or electroluminescent layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present application relates to the field of display technology, in particular to a method for preparing a display device, a display device and a spliced display device.
  • Mini-LEDs submillimeter light-emitting diodes
  • solder paste is printed on the LCD display panel, and then Mini-LED is prepared on the solder paste, and then the bonding between the LCD display panel and the Mini-LED is realized through reflow soldering. Since reflow soldering cannot be locally heated, it needs to be reflow soldered together with the LCD display panel. Generally, the temperature of reflow soldering is higher than 180°C, and the liquid crystal molecules of the liquid crystal layer of the LCD display panel will be irreversibly decomposed when the temperature is higher than 120°C; the polarizer of the LCD display panel will exceed 2 Minutes will cause the polarizer to fail, which will eventually affect the display effect of the LCD display panel.
  • the purpose of the present invention is to provide a preparation method of a display device, a display device and a splicing display device, which can solve the problem of high reflow soldering temperature in the existing bonding process of Mini-LED on the LCD display panel, which causes the LCD display
  • the liquid crystal layer of the panel and the polarizer fail, which affects the display effect of the LCD display panel and other problems.
  • the present invention provides a method for manufacturing a display device, which includes the following steps: providing an LCD display panel, the LCD display panel includes a display area and a frame area; Prepare a plurality of pad units spaced apart from each other in the area; prepare a plurality of conductive units spaced apart from each other on the side of the pad unit away from the LCD display panel; the conductive units are electrically connected to the pads in one-to-one correspondence unit; the material of the conductive unit is anisotropic conductive glue or solder paste; and a plurality of mutually spaced Mini LEDs are prepared on the side of the conductive unit away from the LCD display panel, and the Mini The LED is electrically connected to the pad unit.
  • the step of preparing a plurality of mutually spaced conductive units on the side of the pad unit away from the LCD display panel includes: attaching a layer of different conductive units on the side of the pad unit away from the LCD display panel.
  • a directional conductive adhesive film, the anisotropic conductive adhesive film is also covered on the LCD display panel between adjacent pad units.
  • the step of preparing a plurality of conductive units spaced apart from each other on the side of the pad unit away from the LCD display panel further includes: using a hot-pressing process to make the anisotropic conductive unit corresponding to the pad unit The adhesive film is melted to form a plurality of the conductive units that are electrically connected to the pad units in one-to-one correspondence.
  • the step of preparing a plurality of mutually spaced conductive units on the side of the pad unit far away from the LCD display panel further includes: forming a plurality of conductive units not corresponding to the pad unit. An insulating unit interlaced with the conductive unit.
  • the step of preparing a plurality of mutually spaced conductive units on the side of the pad unit away from the LCD display panel includes: using an inkjet printing process on the side of the pad unit away from the LCD display panel Printing solder paste, the solder paste is in one-to-one correspondence with the pad units.
  • the step of preparing a plurality of mutually spaced conductive units on the side of the pad unit away from the LCD display panel further includes: using a laser heating process to bond the pad unit and the Mini The solder paste between the LEDs is melted to form a plurality of conductive units electrically connected to the pad units in one-to-one correspondence.
  • the present invention provides a display device, which includes: an LCD display panel, including a display area and a frame area; a plurality of pad units, arranged at intervals in the frame area of the LCD display panel; and A plurality of conductive units are arranged at intervals on the side of the pad unit away from the LCD display panel, and are electrically connected to the pad unit in one-to-one correspondence; a plurality of Mini LEDs are arranged at intervals on the conductive unit A side away from the LCD display panel, located in the frame area, and electrically connected to the conductive unit; wherein, the material of the conductive unit is anisotropic conductive glue or solder paste.
  • the material of the conductive unit is anisotropic conductive glue; the display device further includes: a plurality of insulating units arranged alternately with the conductive unit.
  • the thickness range of the conductive unit is 30um-60um.
  • the present invention provides a spliced display device, which includes: a plurality of mutually spliced display devices according to the present invention.
  • the display device of the present invention prepares a plurality of Mini LEDs on the frame area of the LCD display panel, so that the frame area of the LCD display panel that does not emit light can be displayed through the Mini LED, thereby increasing the screen ratio of the display device, thereby eliminating splicing display
  • the splicing seam between the display areas of two adjacent LCD display panels of the device improves the product competitiveness of the spliced display device.
  • a layer of anisotropic conductive adhesive film is pasted on the pad unit, and then Mini LED is prepared on the anisotropic conductive adhesive film, and then the anisotropic LED corresponding to the pad unit is transformed by hot pressing process.
  • the conductive adhesive film is melted to form a plurality of conductive units arranged at intervals. Since the hot pressing process can be locally heated, it is not necessary to heat the entire LCD display panel together, thereby avoiding the phenomenon of solder paste ghosting in the printing solder paste in the prior art. In the prior art, the display effect of the LCD display panel is affected by the reflow soldering process.
  • solder paste is printed on the pad unit by an inkjet printing process, and then Mini LED is prepared on the solder paste, and then the solder paste between the pad unit and the Mini LED is melted by a laser heating process to form
  • a plurality of conductive units arranged at intervals can be locally heated by the laser heating process, so that the entire LCD display panel does not need to be heated together, thereby avoiding the phenomenon of solder paste ghosting in the printing solder paste in the prior art, and avoiding the use in the prior art The phenomenon that the reflow soldering process affects the display effect of the LCD display panel.
  • FIG. 1 is a schematic plan view of a spliced display device of the present invention
  • FIG. 2 is a schematic structural view of the display device of Embodiment 1;
  • Fig. 3 is a diagram of the preparation steps of the display device of Example 1;
  • Fig. 4 is a structural schematic diagram of preparing pad units on the LCD display panel in the frame area
  • FIG. 5 is a schematic structural view of attaching an anisotropic conductive adhesive film on the pad unit in Embodiment 1;
  • Fig. 6 is a schematic structural view of preparing a Mini LED on an anisotropic conductive adhesive film in Example 1;
  • Fig. 7 is a schematic structural diagram of melting the anisotropic conductive adhesive film between the pad unit and the Mini LED to form a conductive unit in Example 1;
  • FIG. 8 is a schematic structural view of a display device in Embodiment 2.
  • Fig. 9 is a diagram of the preparation steps of the display device of Example 2.
  • FIG. 10 is a schematic structural view of inkjet printing solder paste on pad units in Embodiment 2;
  • Fig. 11 is a schematic structural diagram of preparing a Mini LED on solder paste in Example 2.
  • Fig. 12 is a schematic structural view of the embodiment 2 in which the solder paste between the pad unit and the Mini LED is melted to form a conductive unit by using a laser heating process.
  • Insulation unit 6. Anisotropic conductive film;
  • Liquid crystal layer 14.
  • the first polarizer 16.
  • the second polarizer 16. Frame glue.
  • the present invention provides a spliced display device 100 .
  • the spliced display device 100 includes a plurality of display devices 200 spliced with each other.
  • the display device 200 of this embodiment includes: an LCD display panel 1 , a plurality of pad units 2 , a plurality of conductive units 3 , a plurality of Mini LEDs 4 and a plurality of insulating units 5 .
  • a plurality of Mini LEDs 4 are prepared on the frame area 102 of the LCD display panel 1, so that the frame area 102 of the LCD display panel 1 that does not emit light can be displayed by the Mini LED 4, and the performance of the display device 200 is improved. screen ratio, thereby eliminating the splicing seam between the display areas 101 of two adjacent LCD display panels 1 of the spliced display device 100 , and improving the product competitiveness of the spliced display device 100 .
  • the LCD display panel 1 is divided into a display area 101 and a frame area 102 .
  • the LCD display panel 1 includes: an array substrate 11 , a color filter substrate 12 , a liquid crystal layer 13 , a first polarizer 14 , a second polarizer 15 and a sealant 16 .
  • the array substrate 11 is disposed in the display area 101 and the frame area 102 .
  • the array substrate 11 includes film layer structures such as a first substrate, a thin film transistor layer, and a first electrode.
  • the color filter substrate 12 is disposed opposite to the array substrate 11 , and the color filter substrate 12 is disposed in the display area 101 and the frame area 102 .
  • the color filter substrate 12 includes film layer structures such as a second substrate, a color filter, a black matrix, and a second electrode.
  • the liquid crystal layer 13 is disposed between the array substrate 11 and the color filter substrate 12 and is located in the display area 101 .
  • the first polarizer 14 is disposed on the side of the array substrate 11 away from the color filter substrate 12 , and is located in the display area 101 and the frame area 102 .
  • the structure of the first polarizer 14 includes: two layers of TAC (triacetyl cellulose) and PVA (polyvinyl alcohol) between the two layers of TAC.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the PVA layer plays a polarizing role, but PVA is very easy to hydrolyze.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the second polarizer 15 is disposed on the side of the color filter substrate 12 away from the array substrate 11 and located in the display area 101 .
  • the structure of the second polarizer 15 includes: two layers of TAC (triacetyl cellulose) and PVA (polyvinyl alcohol) between the two layers of TAC.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the PVA layer plays a polarizing role, but PVA is very easy to hydrolyze.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the sealant 16 is disposed between the array substrate 11 and the color filter substrate 12 , surrounds the liquid crystal layer 13 , and is located in the frame area 102 .
  • a plurality of pad units 2 are arranged at intervals in the frame area 102 of the LCD display panel 1 .
  • the pad units 2 are arranged at a distance from each other on the side of the color filter substrate 12 away from the array substrate 11 .
  • a plurality of conductive units 3 are arranged at intervals on the side of the pad unit 2 away from the LCD display panel 1 .
  • the conductive units 3 are arranged at a distance from each other on the side of the pad unit 2 away from the color filter substrate 12 .
  • the conductive units 3 are electrically connected to the pad units 2 in one-to-one correspondence.
  • the material of the conductive unit 3 is anisotropic conductive glue (ACF).
  • ACF anisotropic conductive glue
  • the thickness of the conductive unit 3 ranges from 30 um to 60 um. Therefore, the electrical connection between the pad unit 2 and the Mini LED 4 can be well realized.
  • a plurality of Mini LEDs 4 are arranged at intervals on the side of the conductive unit 3 away from the LCD display panel 1 .
  • Each Mini LED 4 includes two connection terminals 41 .
  • the connection terminals 42 are electrically connected to the conductive units 3 in one-to-one correspondence.
  • the insulation unit 5 is made of the same material as the conductive unit 3 .
  • this embodiment also provides a manufacturing method of the display device of this embodiment, which includes the following steps: S1, providing an LCD display panel 1, the LCD display panel 1 includes a display area 101 and Frame area 102 ; S2 , preparing a plurality of pad units 22 spaced apart from each other in the frame area 102 of the LCD display panel 1 .
  • the manufacturing method of the display device of this embodiment further includes: S3, attaching a layer of anisotropic conductive adhesive film on the side of the pad unit 2 away from the LCD display panel 1 6.
  • the anisotropic conductive adhesive film 6 also covers the LCD display panel 1 between adjacent pad units 2 .
  • the manufacturing method of the display device of this embodiment further includes: S4, arranging a plurality of mutually spaced Mini LEDs 4 on the side of the anisotropic conductive adhesive film 6 away from the LCD display panel 1 , each of the Mini The LEDs 4 are arranged corresponding to two adjacent pad units 2 .
  • the manufacturing method of the display device of this embodiment further includes: S5, using a hot pressing process to melt the anisotropic conductive adhesive film 6 corresponding to the pad unit 2 to form multiple
  • the conductive units 3 are arranged at intervals, and the anisotropic conductive adhesive film 6 not corresponding to the pad unit 2 forms a plurality of insulating units 5 arranged alternately with the conductive units 3 .
  • the conductive units 3 are in one-to-one correspondence with the pad units 2 .
  • the anisotropic conductive adhesive film 6 is heated by the mold 7, so that the anisotropic conductive adhesive film 6 is melted, and the Mini LED 4 and the pad unit 2 are extruded by the mold 7, so that the Mini LED 4 and the pad unit 2 Closely combined, after the anisotropic conductive adhesive film 6 corresponding to the pad unit 2 undergoes a hot-pressing process, the insulating shell of the anisotropic conductive adhesive film 6 will be crushed, exposing the internal metal conductive particles to achieve electrical conduction and realize The electrical connection between the pad unit 2 and the Mini LED 4; the anisotropic conductive adhesive film 6 corresponding to the pad unit 2 has not been squeezed, and the insulating shell of the anisotropic conductive adhesive film 6 has not been broken, so it cannot conduct electricity and form an insulating unit 5 .
  • the entire LCD display panel 1 does not need to be heated together, thereby avoiding the phenomenon of solder paste ghosting in the printing solder paste in the prior art, and avoiding the LCD display panel 1 caused by the reflow process in the prior art.
  • the failure of the liquid crystal layer 13 , the first polarizer 14 and the second polarizer 15 ultimately avoids affecting the display effect of the LCD display panel 1 .
  • the display device 200 of this embodiment includes: an LCD display panel 1 , a plurality of pad units 2 , a plurality of conductive units 3 and a plurality of Mini LEDs 4 . .
  • a plurality of Mini LEDs 4 are prepared on the frame area 102 of the LCD display panel 1, so that the frame area 102 of the LCD display panel 1 that does not emit light can be displayed by the Mini LED 4, and the performance of the display device 200 is improved. screen ratio, thereby eliminating the splicing seam between the display areas 101 of two adjacent LCD display panels 1 of the spliced display device 100 , and improving the product competitiveness of the spliced display device 100 .
  • the LCD display panel 1 is divided into a display area 101 and a frame area 102 .
  • the LCD display panel 1 includes: an array substrate 11 , a color filter substrate 12 , a liquid crystal layer 13 , a first polarizer 14 , a second polarizer 15 and a sealant 16 .
  • the array substrate 11 is disposed in the display area 101 and the frame area 102 .
  • the array substrate 11 includes film layer structures such as a first substrate, a thin film transistor layer, and a first electrode.
  • the color filter substrate 12 is disposed opposite to the array substrate 11 , and the color filter substrate 12 is disposed in the display area 101 and the frame area 102 .
  • the color filter substrate 12 includes film layer structures such as a second substrate, a color filter, a black matrix, and a second electrode.
  • the liquid crystal layer 13 is disposed between the array substrate 11 and the color filter substrate 12 and is located in the display area 101 .
  • the first polarizer 14 is disposed on the side of the array substrate 11 away from the color filter substrate 12 , and is located in the display area 101 and the frame area 102 .
  • the structure of the first polarizer 14 includes: two layers of TAC (triacetyl cellulose) and PVA (polyvinyl alcohol) between the two layers of TAC.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the PVA layer plays a polarizing role, but PVA is very easy to hydrolyze.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the second polarizer 15 is disposed on the side of the color filter substrate 12 away from the array substrate 11 and located in the display area 101 .
  • the structure of the second polarizer 15 includes: two layers of TAC (triacetyl cellulose) and PVA (polyvinyl alcohol) between the two layers of TAC.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the PVA layer plays a polarizing role, but PVA is very easy to hydrolyze.
  • TAC triacetyl cellulose
  • PVA polyvinyl alcohol
  • the sealant 16 is disposed between the array substrate 11 and the color filter substrate 12 , surrounds the liquid crystal layer 13 , and is located in the frame area 102 .
  • a plurality of pad units 2 are arranged at intervals on the frame area 102 of the LCD display panel 1 .
  • the pad units 2 are arranged at a distance from each other on the side of the color filter substrate 12 away from the array substrate 11 .
  • a plurality of conductive units 3 are arranged at intervals on the side of the pad unit 2 away from the LCD display panel 1 .
  • the conductive units 3 are arranged at a distance from each other on the side of the pad unit 2 away from the color filter substrate 12 .
  • the conductive units 3 are electrically connected to the pad units 2 in one-to-one correspondence.
  • the material of the conductive unit 3 is solder paste.
  • the thickness of the conductive unit 3 ranges from 30 um to 60 um. Therefore, the electrical connection between the pad unit 2 and the Mini LED 4 can be well realized.
  • a plurality of Mini LEDs 4 are arranged at intervals on the side of the conductive unit 3 away from the LCD display panel 1 .
  • Each Mini LED 4 includes two connection terminals 41 .
  • the connection terminals 42 are electrically connected to the conductive units 3 in one-to-one correspondence.
  • this embodiment also provides a manufacturing method of the display device of this embodiment, which includes the following steps: S1, providing an LCD display panel 1, and the LCD display panel 1 includes a display area 101 and Frame area 102 ; S2 , preparing a plurality of pad units 2 spaced apart from each other in the frame area 102 of the LCD display panel 1 .
  • the manufacturing method of the display device of this embodiment further includes: S3, printing solder paste 8 on the side of the pad unit 2 away from the LCD display panel 1 by using an inkjet printing process,
  • the solder paste 8 is in one-to-one correspondence with the pad units 2 .
  • the preparation method of the display device of this embodiment further includes: S4, a plurality of mutually spaced Mini LEDs 4 are arranged on the side of the solder paste 8 away from the LCD display panel 1, each Said Mini The LEDs 4 are arranged corresponding to two adjacent pad units 2 .
  • the manufacturing method of the display device of this embodiment further includes: S5, using a laser heating process to melt the solder paste 8 between the pad unit 2 and the Mini LED 4 to form A plurality of conductive units 3 arranged at intervals.
  • the entire LCD display panel does not need to be heated together, thereby avoiding the phenomenon of solder paste ghosting in the printing solder paste in the prior art, and avoiding the LCD display panel 1 caused by the reflow process in the prior art.
  • the failure of the liquid crystal layer 13 , the first polarizer 14 and the second polarizer 15 will ultimately avoid affecting the display effect of the LCD display panel 1 .

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Abstract

一种显示装置（200）的制备方法、显示装置（200）及拼接显示装置（100）。显示装置（200）包括LCD显示面板（1）、多个焊盘单元（2）、多个导电单元（3）以及多个Mini LED（4）。在LCD显示面板（1）的边框区（102）上制备多个Mini LED（4），使得原本不发光显示的LCD显示面板（1）的边框区（102）可以通过Mini LED（4）进行显示，提升显示装置（200）的屏占比，提升拼接显示装置（100）的产品竞争力。

Description

一种显示装置的制备方法、显示装置及拼接显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种显示装置的制备方法、显示装置及拼接显示装置。
 背景技术
目前，拼接显示装置的市场规模成逐年增长趋势。在LED（英文全称：light-emitting diode，发光二极管）显示面板的拼接显示装置中，相邻的LED显示面板的显示区之间的拼接缝较小，占领了高端拼接显示装置市场。在LCD（英文全称：Liquid Crystal Display，液晶显示器）显示面板的拼接显示装置中，相邻的LCD显示面板的显示区之间的拼接缝较大，因此只能凭借LCD显示面板的价格优势占领中低端拼接显示装置市场。因此，需要减小LCD显示面板的拼接显示装置中的相邻的LCD显示面板的显示区之间的拼接缝，甚至于消除拼接缝，以拓展至大尺寸LCD显示面板的无边框领域，以提升LCD显示面板的拼接显示装置的产品竞争力，即以价格及小拼接缝的优势抢占LED显示面板的拼接显示装置的高端市场，如广电传媒、大数据中心等。
 技术问题
目前大多采用大尺寸LCD显示面板与Mini-LED（次毫米发光二极管）混拼的方式消除相邻的LCD显示面板的显示区之间的拼接缝。
一般在LCD显示面板上印刷锡膏，然后在锡膏上制备Mini-LED，然后经过回流焊实现LCD显示面板与Mini-LED的bonding。由于回流焊无法局部加热，需要连同LCD显示面板一起回流焊。一般回流焊的温度大于180℃，而LCD显示面板的液晶层的液晶分子在温度大于120℃时，液晶分子会发生不可逆的分解；LCD显示面板的偏光片在温度大于120℃的环境下超过2分钟，会导致偏光片失效，最终影响LCD显示面板的显示效果。而且，在大尺寸LCD显示面板上印刷锡膏时，需要增大钢网的尺寸。钢网的尺寸越大，由于自重影响，钢网会发生弯曲，导致无法控制锡膏的量，印刷的锡膏发生偏移，进而导致印刷的锡膏发生NG（重影）现象。
 技术解决方案
本发明的目的是提供一种显示装置的制备方法、显示装置及拼接显示装置，其能够解决现有的在LCD显示面板上进行Mini-LED的bonding的工艺中存在的回流焊温度高导致LCD显示面板的液晶层以及偏光片失效，影响LCD显示面板的显示效果等问题。
为了解决上述问题，本发明提供了一种显示装置的制备方法，其包括以下步骤：提供一LCD显示面板，所述LCD显示面板包括显示区和边框区；在所述LCD显示面板的所述边框区内制备多个相互间隔的焊盘单元；在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元；所述导电单元一一对应电连接至所述焊盘单元；所述导电单元的材质为异方性导电胶或锡膏；以及在所述导电单元远离所述LCD显示面板的一侧制备多个相互间隔的Mini LED，所述Mini LED电连接至所述焊盘单元。
进一步的，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤包括：在所述焊盘单元远离所述LCD显示面板的一侧贴附一层异方性导电胶膜，所述异方性导电胶膜还覆盖于相邻的所述焊盘单元之间的所述LCD显示面板上。
进一步的，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：采用热压工艺将与所述焊盘单元对应的所述异方性导电胶膜熔融形成多个一一对应电连接至所述焊盘单元的所述导电单元。
进一步的，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：未与所述焊盘单元对应的所述异方性导电胶膜形成多个与所述导电单元相互交错设置的绝缘单元。
进一步的，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤包括：采用喷墨打印工艺在所述焊盘单元远离所述LCD显示面板的一侧打印锡膏，所述锡膏与所述焊盘单元一一对应。
进一步的，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：采用激光加热工艺将所述焊盘单元和所述Mini LED之间的所述锡膏熔融形成多个一一对应电连接至所述焊盘单元的所述导电单元。
为了解决上述问题，本发明提供了一种显示装置，其包括：LCD显示面板，包括显示区及边框区；多个焊盘单元，相互间隔设置于所述LCD显示面板的所述边框区；以及多个导电单元，相互间隔设置于所述焊盘单元远离所述LCD显示面板的一侧，且一一对应电连接至所述焊盘单元；多个Mini LED，相互间隔设置于所述导电单元远离所述LCD显示面板的一侧，且位于所述边框区，且电连接至所述导电单元；其中，所述导电单元的材质为异方性导电胶或锡膏。
进一步的，所述导电单元的材质为异方性导电胶；所述显示装置还包括：多个绝缘单元，与所述导电单元相互交错设置。
进一步的，所述导电单元的厚度范围为30um -60um。
为了解决上述问题，本发明提供了一种拼接显示装置，其包括：多个相互拼接的本发明涉及的显示装置。
 有益效果
本发明的显示装置在LCD显示面板的边框区上制备多个Mini LED ，使得原本不发光显示的LCD显示面板的边框区可以通过Mini LED进行显示，提升显示装置的屏占比，进而消除拼接显示装置的相邻两个LCD显示面板的显示区之间的拼接缝，提升拼接显示装置的产品竞争力。
本发明在焊盘单元上贴附一层异方性导电胶膜，然后在异方性导电胶膜上制备Mini LED，然后采用热压工艺将与所述焊盘单元对应的所述异方性导电胶膜熔融形成多个相互间隔设置的导电单元，由于热压工艺可以局部加热，所以不需要整个LCD显示面板一起加热，进而可以避免现有技术中印刷锡膏出现锡膏重影现象，避免现有技术中采用回流焊工艺影响LCD显示面板的显示效果的现象。
本发明通过喷墨打印工艺在焊盘单元上打印锡膏，然后在锡膏上制备Mini LED，然后采用激光加热工艺将所述焊盘单元和所述Mini LED之间的所述锡膏熔融形成多个相互间隔设置的导电单元，由于激光加热工艺可以局部加热，进而不需要整个LCD显示面板一起加热，进而可以避免现有技术中印刷锡膏出现锡膏重影现象，避免现有技术中采用回流焊工艺影响LCD显示面板的显示效果的现象。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明的拼接显示装置的平面示意图；
图2是实施例1的显示装置的结构示意图；
图3是实施例1的显示装置的制备步骤图；
图4是在边框区的LCD显示面板上制备焊盘单元的结构示意图；
图5是实施例1的在焊盘单元上贴附异方性导电胶膜的结构示意图；
图6是实施例1的在异方性导电胶膜上制备Mini LED的结构示意图；
图7是实施例1的采用热压工艺将焊盘单元和Mini LED之间的异方性导电胶膜熔融形成导电单元的结构示意图；
图8是实施例2的显示装置的结构示意图；
图9是实施例2的显示装置的制备步骤图；
图10是实施例2的在焊盘单元上喷墨打印锡膏的结构示意图；
图11是实施例2的在锡膏上制备Mini LED的结构示意图；
图12是实施例2的采用激光加热工艺将焊盘单元和Mini LED之间的锡膏熔融形成导电单元的结构示意图。
附图标记说明：
100、拼接显示装置；                 200、显示装置；
1、LCD显示面板；                   2、焊盘单元；
3、导电单元；                       4、Mini LED；
5、绝缘单元；                       6、异方性导电胶膜；
7、模具；                           8、锡膏；
101、显示区；                       102、边框区；
11、阵列基板；                       12、彩膜基板；
13、液晶层；                         14、第一偏光片；
15、第二偏光片；                     16、框胶。
 本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
如图1所示，本发明提供了一种拼接显示装置100。拼接显示装置100包括多个相互拼接的显示装置200。
实施例1
如图2所示，本实施例的显示装置200包括：LCD显示面板1、多个焊盘单元2、多个导电单元3、多个Mini LED 4以及多个绝缘单元5。
本实施例的显示装置在LCD显示面板1的边框区102上制备多个Mini LED 4，使得原本不发光显示的LCD显示面板1的边框区102可以通过Mini LED 4进行显示，提升显示装置200的屏占比，进而消除拼接显示装置100的相邻两个LCD显示面板1的显示区101之间的拼接缝，提升拼接显示装置100的产品竞争力。
如图2所示，LCD显示面板1分为显示区101及边框区102。
其中，LCD显示面板1包括：阵列基板11、彩膜基板12、液晶层13、第一偏光片14、第二偏光片15以及框胶16。
其中，阵列基板11设置于显示区101及边框区102。阵列基板11包括第一衬底、薄膜晶体管层、第一电极等膜层结构。
其中，彩膜基板12与所述阵列基板11相对设置，彩膜基板12设置于显示区101及边框区102。彩膜基板12包括第二衬底、彩色滤光片、黑色矩阵、第二电极等膜层结构。
其中，液晶层13设置于所述阵列基板11与所述彩膜基板12之间，且位于所述显示区101。
其中，第一偏光片14设置于所述阵列基板11远离所述彩膜基板12的一侧，且位于所述显示区101及边框区102。第一偏光片14的结构包括：两层TAC（三醋酸纤维素）以及位于两层TAC中间的PVA（聚乙烯醇）。其中，起到偏振作用的是PVA层，但是PVA极易水解，为了保护偏光膜的物理特性，因此需要在PVA的两侧各复合一层具有高光透过率、耐水性好又有一定机械强度的(TAC)薄膜进行防护。
其中，第二偏光片15设置于所述彩膜基板12远离所述阵列基板11的一侧，且位于所述显示区101。第二偏光片15的结构包括：两层TAC（三醋酸纤维素）以及位于两层TAC中间的PVA（聚乙烯醇）。其中，起到偏振作用的是PVA层，但是PVA极易水解，为了保护偏光膜的物理特性，因此需要在PVA的两侧各复合一层具有高光透过率、耐水性好又有一定机械强度的(TAC)薄膜进行防护。
其中，框胶16设置于所述阵列基板11与所述彩膜基板12之间，且包围所述液晶层13，且位于所述边框区102。
其中，多个焊盘单元2相互间隔设置于所述LCD显示面板1的所述边框区102。本实施例中，所述焊盘单元2相互间隔设置于所述彩膜基板12远离所述阵列基板11的一侧。
其中，多个导电单元3相互间隔设置于所述焊盘单元2远离所述LCD显示面板1的一侧。本实施例中，所述导电单元3相互间隔设置于所述焊盘单元2远离所述彩膜基板12的一侧。所述导电单元3一一对应电连接至所述焊盘单元2。本实施例中，所述导电单元3的材质为异方性导电胶（ACF）。所述导电单元3的厚度范围为30 um -60um。由此可以良好的实现焊盘单元2与Mini LED 4的电连接。
其中，多个Mini LED 4相互间隔设置于所述导电单元3远离所述LCD显示面板1的一侧。每一所述Mini LED 4均包括两个连接端子41。所述连接端子42一一对应电连接至所述导电单元3。
其中，多个绝缘单元5与所述导电单元3相互交错设置。本实施例中，所述绝缘单元5与所述导电单元3的材质相同。
如图3、图4所示，本实施例还提供了本实施例的显示装置的制备方法，其包括以下步骤：S1，提供一LCD显示面板1，所述LCD显示面板1包括显示区101和边框区102；S2，在所述LCD显示面板1的所述边框区102制备多个相互间隔的焊盘单元22。
如图3、图5所示，本实施例的显示装置的制备方法还包括：S3，在所述焊盘单元2远离所述LCD显示面板1的一侧贴附一层异方性导电胶膜6，所述异方性导电胶膜6还覆盖于相邻的所述焊盘单元2之间的所述LCD显示面板1上。
如图3、图6所示，本实施例的显示装置的制备方法还包括：S4，在异方性导电胶膜6远离所述LCD显示面板1的一侧设置多个相互间隔的Mini LED 4，每一所述Mini LED 4均与两个相邻的所述焊盘单元2对应设置。
如图3、图7所示，本实施例的显示装置的制备方法还包括：S5，采用热压工艺将与所述焊盘单元2对应的的所述异方性导电胶膜6熔融形成多个相互间隔设置的导电单元3，未与所述焊盘单元2对应的所述异方性导电胶膜6形成多个与所述导电单元3交错设置的绝缘单元5。所述导电单元3与所述焊盘单元2一一对应。
具体的，通过模具7对异方性导电胶膜6进行加热，使得异方性导电胶膜6熔融，利用模具7挤压Mini LED 4和焊盘单元2，使得Mini LED 4和焊盘单元2紧密结合，与所述焊盘单元2对应的异方性导电胶膜6经过热压工艺后，异方性导电胶膜6的绝缘外壳会挤破，露出内部的金属导电颗粒，实现导电，实现焊盘单元2与Mini LED 4的电连接；没有与所述焊盘单元2对应的异方性导电胶膜6没有经过挤压，异方性导电胶膜6的绝缘外壳没有被挤破，无法导电，形成绝缘单元5。
由于热压工艺可以局部加热，进而不需要整个LCD显示面板1一起加热，进而可以避免现有技术中印刷锡膏出现锡膏重影现象，避免现有技术中采用回流焊工艺导致LCD显示面板1的液晶层13、第一偏光片14以及第二偏光片15失效，最终避免影响LCD显示面板1的显示效果。
实施例2
如图8所示，本实施例的显示装置200包括：LCD显示面板1、多个焊盘单元2、多个导电单元3以及多个Mini LED 4。。
本实施例的显示装置在LCD显示面板1的边框区102上制备多个Mini LED 4，使得原本不发光显示的LCD显示面板1的边框区102可以通过Mini LED 4进行显示，提升显示装置200的屏占比，进而消除拼接显示装置100的相邻两个LCD显示面板1的显示区101之间的拼接缝，提升拼接显示装置100的产品竞争力。
如图8所示，LCD显示面板1分为显示区101及边框区102。
其中，LCD显示面板1包括：阵列基板11、彩膜基板12、液晶层13、第一偏光片14、第二偏光片15以及框胶16。
其中，阵列基板11设置于显示区101及边框区102。阵列基板11包括第一衬底、薄膜晶体管层、第一电极等膜层结构。
其中，彩膜基板12与所述阵列基板11相对设置，彩膜基板12设置于显示区101及边框区102。彩膜基板12包括第二衬底、彩色滤光片、黑色矩阵、第二电极等膜层结构。
其中，液晶层13设置于所述阵列基板11与所述彩膜基板12之间，且位于所述显示区101。
其中，第一偏光片14设置于所述阵列基板11远离所述彩膜基板12的一侧，且位于所述显示区101及边框区102。第一偏光片14的结构包括：两层TAC（三醋酸纤维素）以及位于两层TAC中间的PVA（聚乙烯醇）。其中，起到偏振作用的是PVA层，但是PVA极易水解，为了保护偏光膜的物理特性，因此需要在PVA的两侧各复合一层具有高光透过率、耐水性好又有一定机械强度的(TAC)薄膜进行防护。
其中，第二偏光片15设置于所述彩膜基板12远离所述阵列基板11的一侧，且位于所述显示区101。第二偏光片15的结构包括：两层TAC（三醋酸纤维素）以及位于两层TAC中间的PVA（聚乙烯醇）。其中，起到偏振作用的是PVA层，但是PVA极易水解，为了保护偏光膜的物理特性，因此需要在PVA的两侧各复合一层具有高光透过率、耐水性好又有一定机械强度的(TAC)薄膜进行防护。
其中，框胶16设置于所述阵列基板11与所述彩膜基板12之间，且包围所述液晶层13，且位于所述边框区102。
其中，多个焊盘单元2相互间隔设置于所述LCD显示面板1的所述边框区102上。本实施例中，所述焊盘单元2相互间隔设置于所述彩膜基板12远离所述阵列基板11的一侧。
其中，多个导电单元3相互间隔设置于所述焊盘单元2远离所述LCD显示面板1的一侧。本实施例中，所述导电单元3相互间隔设置于所述焊盘单元2远离所述彩膜基板12的一侧。所述导电单元3一一对应电连接至所述焊盘单元2。本实施例中，所述导电单元3的材质为锡膏。所述导电单元3的厚度范围为30 um -60um。由此可以良好的实现焊盘单元2与Mini LED 4的电连接。
其中，多个Mini LED 4相互间隔设置于所述导电单元3远离所述LCD显示面板1的一侧。每一所述Mini LED 4均包括两个连接端子41。所述连接端子42一一对应电连接至所述导电单元3。
如图4、图9所示，本实施例还提供了本实施例的显示装置的制备方法，其包括以下步骤：S1，提供一LCD显示面板1，所述LCD显示面板1包括显示区101和边框区102；S2，在所述LCD显示面板1的所述边框区102制备多个相互间隔的焊盘单元2。
如图9、图10所示，本实施例的显示装置的制备方法还包括：S3，采用喷墨打印工艺在所述焊盘单元2远离所述LCD显示面板1的一侧打印锡膏8，所述锡膏8与所述焊盘单元2一一对应。
如图9、图11所示，本实施例的显示装置的制备方法还包括：S4，在锡膏8远离所述LCD显示面板1的一侧设置多个相互间隔的Mini LED 4，每一所述Mini LED 4均与两个相邻的所述焊盘单元2对应设置。
如图9、图12所示，本实施例的显示装置的制备方法还包括：S5，采用激光加热工艺将所述焊盘单元2和所述Mini LED 4之间的所述锡膏8熔融形成多个相互间隔设置的导电单元3。
由于激光加热工艺可以局部加热，进而不需要整个LCD显示面板一起加热，进而可以避免现有技术中印刷锡膏出现锡膏重影现象，避免现有技术中采用回流焊工艺导致LCD显示面板1的液晶层13、第一偏光片14以及第二偏光片15失效，最终避免影响LCD显示面板1的显示效果。
以上对本申请所提供的一种显示装置的制备方法、显示装置及拼接显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (12)

  1. 一种显示装置的制备方法，包括以下步骤：
    提供一LCD显示面板，所述LCD显示面板包括显示区和边框区；
    在所述LCD显示面板的所述边框区内制备多个相互间隔的焊盘单元；
    在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元；所述导电单元一一对应电连接至所述焊盘单元；所述导电单元的材质为异方性导电胶或锡膏；以及
    在所述导电单元远离所述LCD显示面板的一侧制备多个相互间隔的Mini LED，所述Mini LED电连接至所述焊盘单元。
  2. 根据权利要求1所述的显示装置的制备方法，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤包括：
    在所述焊盘单元远离所述LCD显示面板的一侧贴附一层异方性导电胶膜，所述异方性导电胶膜还覆盖于相邻的所述焊盘单元之间的所述LCD显示面板上。
  3. 根据权利要求2所述的显示装置的制备方法，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：
    采用热压工艺将与所述焊盘单元对应的所述异方性导电胶膜熔融形成多个一一对应电连接至所述焊盘单元的所述导电单元。
  4. 根据权利要求3所述的显示装置的制备方法，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：
    未与所述焊盘单元对应的所述异方性导电胶膜形成多个与所述导电单元相互交错设置的绝缘单元。
  5. 根据权利要求1所述的显示装置的制备方法，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤包括：
    采用喷墨打印工艺在所述焊盘单元远离所述LCD显示面板的一侧打印锡膏，所述锡膏与所述焊盘单元一一对应。
  6. 根据权利要求5所述的显示装置的制备方法，在所述焊盘单元远离所述LCD显示面板的一侧制备多个相互间隔的导电单元的步骤还包括：
    采用激光加热工艺将所述焊盘单元和所述Mini LED之间的所述锡膏熔融形成多个一一对应电连接至所述焊盘单元的所述导电单元。
  7. 一种显示装置，包括：
    LCD显示面板，包括显示区及边框区；
    多个焊盘单元，相互间隔设置于所述LCD显示面板的所述边框区；以及
    多个导电单元，相互间隔设置于所述焊盘单元远离所述LCD显示面板的一侧，且一一对应电连接至所述焊盘单元；
    多个Mini LED，相互间隔设置于所述导电单元远离所述LCD显示面板的一侧，且位于所述边框区，且电连接至所述导电单元；
    其中，所述导电单元的材质为异方性导电胶或锡膏。
  8. 根据权利要求7所述的显示装置，所述导电单元的材质为异方性导电胶；
    所述显示装置还包括：
    多个绝缘单元，与所述导电单元相互交错设置。
  9. 根据权利要求7所述的显示装置，所述导电单元的厚度范围为30um -60um。
  10. 一种拼接显示装置，包括：多个相互拼接的显示装置；
    所述显示装置包括：
    LCD显示面板，包括显示区及边框区；
    多个焊盘单元，相互间隔设置于所述LCD显示面板的所述边框区；以及
    多个导电单元，相互间隔设置于所述焊盘单元远离所述LCD显示面板的一侧，且一一对应电连接至所述焊盘单元；
    多个Mini LED，相互间隔设置于所述导电单元远离所述LCD显示面板的一侧，且位于所述边框区，且电连接至所述导电单元；
    其中，所述导电单元的材质为异方性导电胶或锡膏。
  11. 根据权利要求10所述的拼接显示装置，所述导电单元的材质为异方性导电胶；
    所述显示装置还包括：
    多个绝缘单元，与所述导电单元相互交错设置。
  12. 根据权利要求10所述的拼接显示装置，所述导电单元的厚度范围为30um -60um。
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