WO2022114777A1 - 열가소성 수지 조성물 및 이를 이용한 성형품 - Google Patents
열가소성 수지 조성물 및 이를 이용한 성형품 Download PDFInfo
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- WO2022114777A1 WO2022114777A1 PCT/KR2021/017406 KR2021017406W WO2022114777A1 WO 2022114777 A1 WO2022114777 A1 WO 2022114777A1 KR 2021017406 W KR2021017406 W KR 2021017406W WO 2022114777 A1 WO2022114777 A1 WO 2022114777A1
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- WIPO (PCT)
- Prior art keywords
- polyamide
- weight
- copolymer
- thermoplastic resin
- resin composition
- Prior art date
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 62
- 239000011342 resin composition Substances 0.000 title claims abstract description 59
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 58
- 125000003118 aryl group Chemical group 0.000 claims abstract description 57
- 229920001577 copolymer Polymers 0.000 claims abstract description 41
- -1 vinyl cyanide compound Chemical class 0.000 claims abstract description 41
- 150000003839 salts Chemical class 0.000 claims abstract description 24
- 229920001400 block copolymer Polymers 0.000 claims abstract description 22
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- STSRVFAXSLNLLI-UHFFFAOYSA-N penta-2,4-dienenitrile Chemical compound C=CC=CC#N STSRVFAXSLNLLI-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 17
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 claims abstract description 16
- 239000004952 Polyamide Substances 0.000 claims description 17
- 229920002647 polyamide Polymers 0.000 claims description 17
- 229920001971 elastomer Polymers 0.000 claims description 16
- 229920002554 vinyl polymer Polymers 0.000 claims description 15
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 150000003951 lactams Chemical class 0.000 claims description 7
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 5
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical group C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 238000010559 graft polymerization reaction Methods 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000571 Nylon 11 Polymers 0.000 claims description 3
- 229920000299 Nylon 12 Polymers 0.000 claims description 3
- 229920003189 Nylon 4,6 Polymers 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 3
- 229920006152 PA1010 Polymers 0.000 claims description 3
- 229920006153 PA4T Polymers 0.000 claims description 3
- 229920006121 Polyxylylene adipamide Polymers 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000003242 anti bacterial agent Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000011258 core-shell material Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000012760 heat stabilizer Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000002667 nucleating agent Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 claims description 3
- 229920006396 polyamide 1012 Polymers 0.000 claims description 3
- 229920006394 polyamide 410 Polymers 0.000 claims description 3
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 3
- 239000006082 mold release agent Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 3
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 3
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 3
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 3
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 3
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 3
- 241000985630 Lota lota Species 0.000 description 3
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 238000012662 bulk polymerization Methods 0.000 description 3
- 238000007720 emulsion polymerization reaction Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- LVTHXRLARFLXNR-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F LVTHXRLARFLXNR-UHFFFAOYSA-M 0.000 description 3
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 3
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 239000004953 Aliphatic polyamide Substances 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000012661 block copolymerization Methods 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- AYBSOYWZTRUFMW-UHFFFAOYSA-N furan-2,5-dione;prop-2-enenitrile;styrene Chemical compound C=CC#N.O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 AYBSOYWZTRUFMW-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical class CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229920006164 aromatic vinyl copolymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- MCVFFRWZNYZUIJ-UHFFFAOYSA-M lithium;trifluoromethanesulfonate Chemical compound [Li+].[O-]S(=O)(=O)C(F)(F)F MCVFFRWZNYZUIJ-UHFFFAOYSA-M 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/30—Applications used for thermoforming
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Definitions
- the present invention relates to a thermoplastic resin composition and a molded article using the same.
- ABS resin acrylonitrile-butadiene-styrene copolymer resin
- thermoplastic resins have little ability to absorb moisture in the air, and the generated static electricity cannot flow away and accumulate. It may cause malfunction.
- An antistatic agent may be used to secure the antistatic property of the thermoplastic resin composition, but an excessive amount of the antistatic agent is required to obtain an appropriate antistatic property.
- thermoplastic resin composition having excellent antistatic properties, impact resistance, and heat resistance.
- thermoplastic resin composition having excellent antistatic properties, impact resistance, heat resistance, and the like.
- Another embodiment provides a molded article prepared from the thermoplastic resin.
- the (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer includes a core made of a butadiene-based rubber polymer, and a shell formed by graft polymerization of an aromatic vinyl compound and a vinyl cyanide compound to the core-shell can be a structure.
- the butadiene-based rubbery polymer may have an average particle diameter of 0.2 to 1.0 ⁇ m.
- the (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer (g-ABS).
- the (A2) aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile copolymer (SAN).
- the (A2) aromatic vinyl-vinyl cyanide copolymer may have a weight average molecular weight of 80,000 to 300,000 g/mol.
- the (B) polyamide resin is polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6I, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or combinations thereof.
- the (C) aromatic vinyl-vinyl cyanide-maleic anhydride copolymer contains 50 to 90% by weight of a component derived from an aromatic vinyl compound, 5 to 40% by weight of a component derived from a vinyl cyanide compound, and 0.5% by weight of a component derived from maleic anhydride to 30% by weight of the copolymer.
- the (C) aromatic vinyl-vinyl cyanide-maleic anhydride copolymer may be a styrene-acrylonitrile-maleic anhydride (SAN-MAH) copolymer.
- SAN-MAH styrene-acrylonitrile-maleic anhydride
- the polyether-ester-amide block copolymer is a salt of aminocarboxylic acid, lactam, or diamine-dicarboxylic acid having 6 or more carbon atoms; polyalkylene glycol; and a dicarboxylic acid having 4 to 20 carbon atoms.
- the weight ratio of (D) polyether-ester-amide block copolymer and (E) trifluoromethane sulfonate metal salt may be 1:0.01 to 1:1.5.
- the thermoplastic resin composition further comprises at least one additive selected from a flame retardant, a nucleating agent, a coupling agent, a filler, a plasticizer, a lubricant, an antibacterial agent, a release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, and a dye can do.
- thermoplastic resin composition a molded article prepared from the above-described thermoplastic resin composition.
- thermoplastic resin composition excellent in all of antistatic properties, impact resistance and heat resistance, and a molded article manufactured therefrom.
- copolymerization means block copolymerization, random copolymerization, and graft copolymerization
- copolymer means block copolymer, random copolymer, and graft copolymer.
- the average particle diameter of the rubbery polymer is the volume average diameter, and means the Z-average particle diameter measured using a dynamic light scattering analysis device.
- the weight average molecular weight is measured by dissolving a powder sample in tetrahydrofuran (THF) and then using Agilent Technologies' 1200 series Gel Permeation Chromatography (GPC) (column is Shodex). Company LF-804, standard sample is Shodex polystyrene).
- the thermoplastic resin composition includes (A1) 20 to 40 wt% of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer; (A2) 45 to 65 wt% of an aromatic vinyl-vinyl cyanide copolymer having a content derived from a vinyl cyanide compound of 30 to 40 wt%; and (B) 1 to 10 parts by weight of an aromatic vinyl-vinyl cyanide-maleic anhydride copolymer based on 100 parts by weight of the base resin comprising 5 to 25% by weight of the polyamide resin; (D) 1 to 15 parts by weight of a polyether-ester-amide block copolymer; and (E) 0.1 to 5 parts by weight of a trifluoromethane sulfonate metal salt.
- A1 20 to 40 wt% of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer
- A2 45 to 65 wt%
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer provides excellent impact resistance to the thermoplastic resin composition.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer is a butadiene-based rubbery polymer component with a central portion (core), and an aromatic vinyl compound and a vinyl cyanide compound in the central portion thereof by graft polymerization reaction It may have a core-shell structure in which a shell is formed.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be prepared by adding an aromatic vinyl compound and a vinyl cyanide compound to a butadiene-based rubber polymer, and graft polymerization through conventional polymerization methods such as emulsion polymerization and bulk polymerization. .
- the butadiene-based rubbery polymer may be selected from the group consisting of butadiene rubbery polymers, butadiene-styrene rubbery polymers, butadiene-acrylonitrile rubbery polymers, butadiene-acrylate rubbery polymers, and mixtures thereof.
- the aromatic vinyl compound may be selected from the group consisting of styrene, ⁇ -methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and mixtures thereof.
- the vinyl cyanide compound may be selected from the group consisting of acrylonitrile, methacrylonitrile, fumaronitrile, and mixtures thereof.
- the butadiene-based rubbery polymer forming the core of the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may have an average particle diameter of 0.2 to 1.0 ⁇ m.
- the average particle diameter of the butadiene-based rubber polymer is 0.2 ⁇ m or more, 0.3 ⁇ m or more, 0.4 ⁇ m or more, 0.5 ⁇ m or more, 0.6 ⁇ m or more, 0.7 ⁇ m or more, 0.8 ⁇ m or more, or 0.9 ⁇ m or more, and 1.0 ⁇ m or less, 0.9 ⁇ m or less, 0.8 ⁇ m or less, 0.7 ⁇ m or less, 0.6 ⁇ m or less, 0.5 ⁇ m or less, 0.4 ⁇ m or less, or 0.3 ⁇ m or less.
- the thermoplastic resin composition according to the exemplary embodiment may exhibit excellent impact resistance and appearance characteristics.
- the butadiene-based rubbery polymer may be included in an amount of 40 to 70 wt%.
- the weight ratio of the aromatic vinyl compound and the vinyl cyanide compound, which is graft-polymerized in the center made of the butadiene-based rubbery polymer component may be 6:4 to 8:2.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer is 20 to 40 wt% based on 100 wt% of the base resin, for example, 20 wt% or more, 25 wt% or more, 30 wt% or more, or 35 wt% or more, and 40 wt% or less, 35 wt% or less, 30 wt% or less, or 25 wt% or less.
- a thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent impact resistance and heat resistance.
- the aromatic vinyl-vinyl cyanide copolymer may improve the fluidity of the thermoplastic resin composition and maintain compatibility between components at a certain level.
- the aromatic vinyl-vinyl cyanide copolymer may have a weight average molecular weight of 80,000 to 300,000 g/mol, for example, 80,000 to 200,000 g/mol, for example, 80,000 to 150,000 g/mol, for example.
- 80,000 g/mol or more 85,000 g/mol or more, 90,000 g/mol or more, 100,000 g/mol or more, 120,000 g/mol or more, 150,000 g/mol or more, 200,000 g/mol or more, or 250,000 g/mol or more; and 300,000 g/mol or less, 250,000 g/mol or less, 200,000 g/mol or less, 150,000 g/mol or less, or 100,000 g/mol or less.
- the aromatic vinyl-vinyl cyanide copolymer may be prepared through conventional polymerization methods such as emulsion polymerization, suspension polymerization, solution polymerization, and bulk polymerization of a monomer mixture including an aromatic vinyl compound and a vinyl cyanide compound.
- the aromatic vinyl compound may be selected from the group consisting of styrene, ⁇ -methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and mixtures thereof.
- the vinyl cyanide compound may be selected from the group consisting of acrylonitrile, methacrylonitrile, fumaronitrile, and mixtures thereof.
- the aromatic vinyl-vinyl cyanide copolymer contains 30 to 40% by weight of a component derived from the vinyl cyanide compound based on 100% by weight, for example, 30% by weight or more, 32% by weight or more, 34% by weight or more, 36 wt% or more, or 38 wt% or more, and 40 wt% or less, 38 wt% or less, 36 wt% or less, 34 wt% or less, or 32 wt% or less.
- the aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile copolymer (SAN).
- SAN styrene-acrylonitrile copolymer
- the aromatic vinyl-vinyl cyanide copolymer is 45 to 65% by weight, for example, 45% by weight or more, 50% by weight or more, 55% by weight or more, or 60% by weight or more based on 100% by weight of the base resin. , and 65 wt% or less, 60 wt% or less, 55 wt% or less, or 50 wt% or less.
- the thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent moldability and mechanical properties.
- the polyamide resin enables the thermoplastic resin composition to implement excellent electrical conductivity.
- the polyamide resin is included even if it does not contain an excess of (D) polyether-ester-amide block copolymer to be described later, which is included to impart electrical conductivity to the thermoplastic resin composition.
- the thermoplastic resin composition according to an embodiment may have excellent electrical conductivity.
- polyamide resin various polyamide resins known in the art, for example, an aromatic polyamide resin, an aliphatic polyamide resin, or a mixture thereof may be used, but is not particularly limited.
- the aromatic polyamide resin is a polyamide including an aromatic group in a main chain, and may be a wholly aromatic polyamide, a semi-aromatic polyamide, or a mixture thereof.
- Wholly aromatic polyamide means a polymer of an aromatic diamine and an aromatic dicarboxylic acid, wherein the semi-aromatic polyamide includes at least one aromatic unit and at least one non-aromatic unit together between amide bonds.
- the semi-aromatic polyamide may be a polymer of an aromatic diamine and an aliphatic dicarboxylic acid, or a polymer of an aliphatic diamine and an aromatic dicarboxylic acid.
- aliphatic polyamide is meant a polymer of an aliphatic diamine and an aliphatic dicarboxylic acid.
- aromatic diamine examples include, but are not limited to, p-xylenediamine and m-xylenediamine. In addition, these may be used alone or in mixture of two or more.
- aromatic dicarboxylic acid examples include, but are not limited to, phthalic acid, isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, and (1,3-phenylenedioxy)diacetic acid. . In addition, these may be used alone or in mixture of two or more.
- aliphatic diamine examples include, but are not limited to, ethylenediamine, trimethylenediamine, hexamethylenediamine, dodecamethylenediamine, piperazine, and the like. In addition, these may be used alone or in mixture of two or more.
- aliphatic dicarboxylic acid examples include adipic acid, sebacic acid, succinic acid, glutaric acid, azelaic acid, dodecanedioic acid, dimer acid, cyclohexanedicarboxylic acid, etc., but are limited thereto not. In addition, these may be used alone or in mixture of two or more.
- the polyamide resin is polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6I, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or combinations thereof.
- the polyamide resin may include at least polyamide 6.
- the polyamide resin is 5 to 25% by weight, for example 5 to 20% by weight, for example 5 to 15% by weight, for example 5 to 20% by weight based on 100% by weight of the base resin, For example, it may be included in an amount of 10 to 25% by weight.
- thermoplastic resin composition including the polyamide resin and a molded article prepared therefrom may exhibit excellent mechanical properties and electrical conductivity.
- thermoplastic resin composition when the aromatic vinyl-vinyl cyanide-maleic anhydride copolymer is included in the thermoplastic resin composition, the thermoplastic resin composition may have excellent impact resistance.
- the aromatic vinyl-vinyl cyanide-maleic anhydride copolymer is a monomer mixture comprising an aromatic vinyl compound, a vinyl cyanide compound, and maleic anhydride, which is subjected to conventional emulsion polymerization, suspension polymerization, solution polymerization, bulk polymerization, etc. It can be prepared through a polymerization method.
- the copolymerization form of the aromatic vinyl-vinyl cyanide-maleic anhydride copolymer is not particularly limited, and a component derived from an aromatic vinyl compound, a component derived from a vinyl cyanide compound, and a component derived from maleic anhydride are alternately copolymerized, random Copolymerization or block copolymerization may be carried out, and a component derived from maleic anhydride may be graft copolymerized onto a main chain in which a component derived from an aromatic vinyl compound and a component derived from a vinyl cyanide compound are copolymerized.
- the aromatic vinyl-vinyl cyanide-maleic anhydride copolymer is prepared from 50 to 90% by weight of the component derived from the aromatic vinyl compound, 5 to 40% by weight of the component derived from the vinyl cyanide compound and maleic anhydride based on 100% by weight. It may contain 0.5 to 30% by weight of the derived component. When the above range is satisfied, the thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent impact resistance.
- the aromatic vinyl compound may be selected from the group consisting of styrene, ⁇ -methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and mixtures thereof.
- the vinyl cyanide compound may be selected from the group consisting of acrylonitrile, methacrylonitrile, fumaronitrile, and mixtures thereof.
- the aromatic vinyl-cyanide-maleic anhydride copolymer may be a styrene-acrylonitrile-maleic anhydride copolymer.
- the aromatic vinyl-vinyl cyanide-maleic anhydride copolymer is 1 to 10 parts by weight, for example, 1 part by weight or more, 3 parts by weight or more, 5 parts by weight or more, based on 100 parts by weight of the base resin; 7 parts by weight or more, or 9 parts by weight or more, and 10 parts by weight or less, 8 parts by weight or less, 6 parts by weight or less, 4 parts by weight or less, or 2 parts by weight or less.
- the thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent impact resistance.
- the polyether-ester-amide block copolymer may allow a thermoplastic resin composition and a molded article prepared therefrom to exhibit excellent electrical conductivity.
- a polyether-ester-amide block copolymer for example, an aminocarboxylic acid having 6 or more carbon atoms, a lactam, or a salt of a diamine-dicarboxylic acid; polyalkylene glycol; and a reaction mixture of a dicarboxylic acid having 4 to 20 carbon atoms.
- salt of the aminocarboxylic acid lactam, or diamine-dicarboxylic acid having 6 or more carbon atoms, ⁇ -aminocaproic acid, ⁇ -aminoenanthoic acid, ⁇ -aminocaprylic acid, ⁇ - aminocarboxylic acids such as aminopelargonic acid, ⁇ -aminocapric acid, 11-aminoundecanoic acid and 12-aminododecanoic acid; lactams such as ⁇ -caprolactam, enanthlactam, caprylactam, laurolactam and the like; and diamine-dicarboxylic acid salts such as a salt of hexamethylenediamine-adipic acid, a salt of hexamethylenediamine-isophthalic acid, and the like.
- salts of 12-aminododecanoic acid, ⁇ -caprolactam, hexamethylenediamine-adipic acid salts of 12-aminod
- polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyhexamethylene glycol, block or random copolymer of ethylene glycol and propylene glycol, ethylene glycol and tetrahydrofuran synthesis and the like can be exemplified.
- polyethylene glycol, a copolymer of ethylene glycol and propylene glycol, etc. can be used.
- examples of the dicarboxylic acid having 4 to 20 carbon atoms include terephthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, adipic acid, and dodecanedioic acid.
- the bond between the salt of the aminocarboxylic acid having 6 or more carbon atoms, lactam, or diamine-dicarboxylic acid and the polyalkylene glycol may be an ester bond
- the aminocarboxylic acid having 6 or more carbon atoms, lactam , or a diamine-dicarboxylic acid salt and the C4 to C20 dicarboxylic acid bond may be an amide bond
- the polyalkylene glycol and the C4 to C20 dicarboxylic acid bond may be It may be an ester bond.
- the polyether-ester-amide block copolymer may be prepared by a known synthesis method, for example, the synthesis method disclosed in Japanese Patent Publication No. 56-045419 and Japanese Patent Publication No. 55-133424. can be manufactured according to
- the polyether-ester-amide block copolymer may include 10 to 95% by weight of the polyether-ester block.
- the thermoplastic resin composition according to the exemplary embodiment and the molded article manufactured therefrom may have excellent electrical conductivity and heat resistance.
- the polyether-ester-amide block copolymer is 1 to 15 parts by weight, for example, 1 part by weight or more, 5 parts by weight or more, or 10 parts by weight or more, based on 100 parts by weight of the base resin; And, 15 parts by weight or less, 10 parts by weight or less, or 5 parts by weight or less may be included.
- the thermoplastic resin composition and a molded article prepared therefrom may exhibit excellent electrical conductivity while maintaining excellent impact resistance.
- the trifluoromethane sulfonate metal salt may improve antistatic properties of the thermoplastic resin composition together with the (D) polyether-ester-amide block copolymer.
- potassium perfluorobutane sulfonate and the like have been used in the thermoplastic resin composition to improve antistatic properties of the thermoplastic resin composition.
- the potassium perfluorobutane sulfonate is expected to have difficulties in using it in the future because there is an issue regarding the toxicity in Europe and the like.
- trifluoromethane sulfonate metal salt can achieve an effect comparable to or superior to potassium perfluorobutane sulfonate without being harmful.
- thermoplastic resin composition excellent in antistatic property without harmfulness and a molded article using the same can be manufactured.
- the metal of the (E) trifluoromethane sulfonate metal salt sodium, lithium, or a combination thereof may be used.
- the (E) trifluoromethane sulfonate metal salt is 0.1 to 5 parts by weight, for example, 0.1 to 4 parts by weight, 0.1 to 3.5 parts by weight, 0.1 to 3 parts by weight, 0.1 to 5 parts by weight based on 100 parts by weight of the base resin. It may be included in an amount of 2.5 parts by weight, 0.1 to 2 parts by weight, 0.1 to 1.5 parts by weight, 0.1 to 1 parts by weight, 0.1 to 0.5 parts by weight, or 0.2 to 0.5 parts by weight.
- a thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent antistatic properties.
- the weight ratio ((D):(E)) of the (D) polyether-ester-amide block copolymer and the (E) trifluoromethane sulfonate metal salt is 1:0.01 to 1:1.5 days can
- (D):(E) may be 1:0.01 to 1:1, 1:0.01 to 1:0.5, or 1:0.01 to 1:0.1.
- the thermoplastic resin composition and a molded article prepared therefrom may exhibit excellent antistatic properties and impact resistance, and the like.
- thermoplastic resin composition in addition to the components (A1) to (E), can exhibit excellent antistatic properties, impact resistance, and heat resistance while maintaining a balance between the respective physical properties without deterioration of other properties. It may further include one or more additives necessary for the purpose or according to the end use of the thermoplastic resin composition.
- a flame retardant a nucleating agent, a coupling agent, a filler, a plasticizer, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, a dye, etc.
- a flame retardant a nucleating agent, a coupling agent, a filler, a plasticizer, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, a dye, etc.
- thermoplastic resin composition may be appropriately included within a range that does not impair the physical properties of the thermoplastic resin composition, and specifically, may be included in an amount of 20 parts by weight or less based on 100 parts by weight of the base resin, but is not limited thereto.
- thermoplastic resin composition according to the present invention may be prepared by a known method for preparing a thermoplastic resin composition.
- thermoplastic resin composition according to the present invention may be prepared in the form of pellets by mixing the components of the present invention and other additives at the same time and then melt-kneading in an extruder.
- another embodiment provides a molded article manufactured using the thermoplastic resin composition according to the embodiment.
- the molded article may be manufactured by various methods known in the art, such as injection molding and extrusion molding, using the thermoplastic resin composition.
- the molded article has excellent antistatic properties, impact resistance, and heat resistance, and thus can be advantageously used in various electrical and electronic parts, building materials, sports goods, and automobile interior/exterior parts.
- thermoplastic resin compositions of Examples 1 to 2 and Comparative Examples 1 to 4 were prepared according to the component content ratios described in Table 1 below, respectively.
- thermoplastic resin composition in pellet form. Then, after drying the pelletized thermoplastic resin composition at about 80° C. for about 2 hours, a 6 oz injection molding machine having a cylinder temperature of about 240° C. and a mold temperature of about 60° C. was used to prepare specimens for evaluation of physical properties, respectively.
- Styrene and acrylonitrile (styrene/acrylonitrile weight ratio: about 75/25) to about 45 wt% of a core (average particle diameter: about 0.31 ⁇ m) made of butadiene rubbery polymer, including a shell formed by graft polymerization on the core
- a core average particle diameter: about 0.31 ⁇ m
- An acrylonitrile-butadiene-styrene graft copolymer (Lotte Chemical) was used.
- a styrene-acrylonitrile copolymer (Lotte Chemical) having a weight average molecular weight of about 100,000 g/mol obtained by copolymerizing a monomer mixture containing 65 wt% of styrene and 35 wt% of acrylonitrile was used.
- a styrene-acrylonitrile copolymer (Lotte Chemical) having a weight average molecular weight of about 105,000 g/mol, obtained by copolymerizing a monomer mixture containing 75% by weight of styrene and 25% by weight of acrylonitrile was used.
- Polyamide 6 resin (KP Chemtech, EN300) was used.
- a styrene-acrylonitrile-maleic anhydride copolymer (Fine Blend Polymer, SAM-010) was used.
- a polyamide 6-polyethylene oxide block copolymer (Sanyo, PELECTRON AS) was used.
- Lithium trifluoromethane sulfonate (Sigma-Aldrich) was used.
- Antistatic properties (unit: ⁇ /sq): 100 mm x 100 mm x 2 mm specimens were measured with a surface resistance measuring device (SIMCO-ION, Worksurface Tester ST-4) according to ASTM D257 standard. It was judged that the antistatic property was excellent, so that the surface resistance was low.
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Abstract
Description
구분 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | 비교예 4 | |
(A1) | 중량% | 30 | 30 | 30 | 30 | 30 | 30 |
(A2) | 중량% | 55 | 55 | 55 | 55 | - | 55 |
(A2') | 중량% | - | - | - | - | 55 | - |
(B) | 중량% | 15 | 15 | 15 | 15 | 15 | 15 |
(C) | 중량부 | 4 | 4 | 4 | 4 | 4 | - |
(D) | 중량부 | 6 | 8 | 6 | 8 | 8 | 8 |
(E) | 중량부 | 0.5 | 1.0 | - | - | 1.0 | - |
물성 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | 비교예 4 |
표면 저항 | 1010.2 | 109.9 | 1011.0 | 1010.6 | 1010.2 | 1010.6 |
Izod충격강도 | 52 | 51 | 54 | 51 | 42 | 35 |
VST | 95 | 96 | 95 | 95 | 94 | 95 |
Claims (13)
- (A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체 20 내지 40 중량%;(A2) 시안화 비닐 화합물 유래 성분 함량이 30 내지 40 중량%인 방향족 비닐-시안화 비닐 공중합체 45 내지 65 중량%; 및(B) 폴리아미드 수지 5 내지 25 중량%를 포함하는 기초수지 100 중량부에 대해,(C) 방향족 비닐-시안화 비닐-말레산 무수물 공중합체 1 내지 10 중량부;(D) 폴리에테르-에스테르-아미드(polyether-ester-amide) 블록 공중합체 1 내지 15 중량부; 및(E) 트리플루오로메탄 술포네이트 금속 염(trifluoromethane sulfonate metal salt) 0.1 내지 5 중량부를 포함하는, 열가소성 수지 조성물.
- 제1항에서,상기 (A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체는 부타디엔계 고무질 중합체로 이루어진 코어, 및 방향족 비닐 화합물과 시안화 비닐 화합물이 상기 코어에 그라프트 중합되어 형성된 쉘을 포함하는 코어-쉘 구조인, 열가소성 수지 조성물.
- 제2항에서,상기 부타디엔계 고무질 중합체는 평균 입경이 0.2 내지 1.0 ㎛인, 열가소성 수지 조성물.
- 제1항 내지 제3항 중 어느 한 항에서,(A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체는 아크릴로니트릴-부타디엔-스티렌 그라프트 공중합체(g-ABS)인, 열가소성 수지 조성물.
- 제1항 내지 제4항 중 어느 한 항에서,(A2) 방향족 비닐-시안화 비닐 공중합체는 스티렌-아크릴로니트릴 공중합체(SAN)인, 열가소성 수지 조성물.
- 제1항 내지 제5항 중 어느 한 항에서,(A2) 방향족 비닐-시안화 비닐 공중합체는 중량평균분자량이 80,000 내지 300,000 g/mol인, 열가소성 수지 조성물.
- 제1항 내지 제6항 중 어느 한 항에서,(B) 폴리아미드 수지는 폴리아미드 6, 폴리아미드 66, 폴리아미드 46, 폴리아미드 11, 폴리아미드 12, 폴리아미드 610, 폴리아미드 612, 폴리아미드 6I, 폴리아미드 6T, 폴리아미드 4T, 폴리아미드 410, 폴리아미드 510, 폴리아미드 1010, 폴리아미드 1012, 폴리아미드 10T, 폴리아미드 1212, 폴리아미드 12T, 폴리아미드 MXD6, 또는 이들의 조합을 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제7항 중 어느 한 항에서,(C) 방향족 비닐-시안화 비닐-말레산 무수물 공중합체는 방향족 비닐 화합물로부터 유래한 성분 50 내지 90 중량%, 시안화 비닐 화합물로부터 유래한 성분 5 내지 40 중량%, 말레산무수물로부터 유래한 성분 0.5 내지 30 중량%를 포함하는 공중합체인, 열가소성 수지 조성물.
- 제1항 내지 제8항 중 어느 한 항에서,(C) 방향족 비닐-시안화 비닐-말레산 무수물 공중합체는 스티렌-아크릴로니트릴-말레산 무수물 공중합체인, 열가소성 수지 조성물.
- 제1항 내지 제9항 중 어느 한 항에서,(D) 폴리에테르-에스테르-아미드 블록 공중합체는 탄소수 6 이상의 아미노카르복실산, 락탐, 또는 디아민-디카르복실산의 염; 폴리알킬렌글리콜; 및 탄소수 4 내지 20의 디카르복실산의 반응 혼합물인, 열가소성 수지 조성물.
- 제1항 내지 제10항 중 어느 한 항에서,(D) 폴리에테르-에스테르-아미드 블록 공중합체 및 (E) 트리플루오로메탄 술포네이트 금속 염의 중량비는 1:0.01 내지 1:1.5인, 열가소성 수지 조성물.
- 제1항 내지 제11항 중 어느 한 항에서,난연제, 핵제, 커플링제, 충전제, 가소제, 활제, 항균제, 이형제, 열 안정제, 산화 방지제, 자외선 안정제, 안료, 염료 중에서 선택되는 적어도 하나의 첨가제를 더 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제12항 중 어느 한 항에 따른 열가소성 수지 조성물로부터 제조된 성형품.
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KR20030030420A (ko) * | 2001-10-11 | 2003-04-18 | 제일모직주식회사 | 열가소성 수지조성물 |
US20060208232A1 (en) * | 2000-04-12 | 2006-09-21 | Noriaki Fujihana | Antistatic composition |
KR101197943B1 (ko) * | 2004-01-27 | 2012-11-05 | 바스프 에스이 | 스티롤 공중합체 및 폴리아미드로부터 제조된 열가소성성형물 |
KR101972232B1 (ko) * | 2017-10-16 | 2019-04-24 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 형성된 성형품 |
KR20190126911A (ko) * | 2017-03-22 | 2019-11-12 | 이네오스 스티롤루션 그룹 게엠베하 | 낮은 수축율을 갖는 스티렌계 코폴리머 배합물 |
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US20060208232A1 (en) * | 2000-04-12 | 2006-09-21 | Noriaki Fujihana | Antistatic composition |
KR20030030420A (ko) * | 2001-10-11 | 2003-04-18 | 제일모직주식회사 | 열가소성 수지조성물 |
KR101197943B1 (ko) * | 2004-01-27 | 2012-11-05 | 바스프 에스이 | 스티롤 공중합체 및 폴리아미드로부터 제조된 열가소성성형물 |
KR20190126911A (ko) * | 2017-03-22 | 2019-11-12 | 이네오스 스티롤루션 그룹 게엠베하 | 낮은 수축율을 갖는 스티렌계 코폴리머 배합물 |
KR101972232B1 (ko) * | 2017-10-16 | 2019-04-24 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 형성된 성형품 |
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