WO2022114779A1 - 열가소성 수지 조성물 및 이로부터 제조된 성형품 - Google Patents
열가소성 수지 조성물 및 이로부터 제조된 성형품 Download PDFInfo
- Publication number
- WO2022114779A1 WO2022114779A1 PCT/KR2021/017409 KR2021017409W WO2022114779A1 WO 2022114779 A1 WO2022114779 A1 WO 2022114779A1 KR 2021017409 W KR2021017409 W KR 2021017409W WO 2022114779 A1 WO2022114779 A1 WO 2022114779A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyamide
- copolymer
- resin composition
- weight
- thermoplastic resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 55
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 55
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 60
- 125000003118 aryl group Chemical group 0.000 claims abstract description 44
- 229920001577 copolymer Polymers 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 23
- 229920001400 block copolymer Polymers 0.000 claims abstract description 20
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 19
- STSRVFAXSLNLLI-UHFFFAOYSA-N penta-2,4-dienenitrile Chemical compound C=CC=CC#N STSRVFAXSLNLLI-UHFFFAOYSA-N 0.000 claims abstract description 18
- CBAUAZRJDYMLAZ-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione 1-phenylpyrrole-2,5-dione Chemical compound C1(=CC=CC=C1)N1C(C=CC1=O)=O.C(=CC1=CC=CC=C1)/C/1=C/C(=O)OC1=O CBAUAZRJDYMLAZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- -1 aromatic vinyl compound Chemical class 0.000 claims description 28
- 239000004952 Polyamide Substances 0.000 claims description 17
- 229920002647 polyamide Polymers 0.000 claims description 17
- 229920001971 elastomer Polymers 0.000 claims description 16
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 229920002554 vinyl polymer Polymers 0.000 claims description 11
- 239000000654 additive Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 150000003951 lactams Chemical class 0.000 claims description 7
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 6
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims description 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 6
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920002292 Nylon 6 Polymers 0.000 claims description 5
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical group C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 238000010559 graft polymerization reaction Methods 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000004609 Impact Modifier Substances 0.000 claims description 3
- 229920000571 Nylon 11 Polymers 0.000 claims description 3
- 229920000299 Nylon 12 Polymers 0.000 claims description 3
- 229920003189 Nylon 4,6 Polymers 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 3
- 229920006152 PA1010 Polymers 0.000 claims description 3
- 229920006153 PA4T Polymers 0.000 claims description 3
- 229920006121 Polyxylylene adipamide Polymers 0.000 claims description 3
- 239000003242 anti bacterial agent Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 239000011258 core-shell material Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000012760 heat stabilizer Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000002667 nucleating agent Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 claims description 3
- 229920006396 polyamide 1012 Polymers 0.000 claims description 3
- 229920006394 polyamide 410 Polymers 0.000 claims description 3
- 239000012963 UV stabilizer Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 26
- 239000000203 mixture Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 13
- 238000010422 painting Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 2
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 2
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 2
- 241000985630 Lota lota Species 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical class CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- FNVVDDWYPIWYQN-UHFFFAOYSA-N 3-ethenylfuran-2,5-dione Chemical compound C=CC1=CC(=O)OC1=O FNVVDDWYPIWYQN-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- IDDSVMYOXWHSAK-UHFFFAOYSA-N furan-2,5-dione 5-phenylpenta-2,4-dienenitrile Chemical compound O=C1OC(=O)C=C1.N#CC=CC=CC1=CC=CC=C1 IDDSVMYOXWHSAK-UHFFFAOYSA-N 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/30—Applications used for thermoforming
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Definitions
- thermoplastic resin composition relates to a thermoplastic resin composition and a molded article prepared therefrom.
- Styrene-based resins represented by acrylonitrile-butadiene-styrene copolymer (ABS) resins, are widely used in various applications due to their excellent moldability, mechanical properties, appearance, secondary processability, and the like.
- ABS acrylonitrile-butadiene-styrene copolymer
- a molded article manufactured using a styrene-based resin may be widely applied to various products requiring painting/unpainted, for example, various interior/exterior materials of automobiles and/or electronic devices, and the like.
- a painting operation is performed on a molded article manufactured using a styrene-based resin as a method for imparting an aesthetic effect to various interior/exterior materials.
- the method of painting is not particularly limited, but electrostatic painting is generally used as a widely used painting method.
- electrostatic painting is a method of applying electrical conductivity to the surface of the molded product and then painting.
- the molded article itself has electrical conductivity above a certain level by further including various conductive materials (eg, carbon nanotubes, etc.) and/or conductivity expression additives in the styrene-based resin. A way to do this has been proposed.
- various conductive materials eg, carbon nanotubes, etc.
- thermoplastic resin composition capable of maintaining excellent electrical conductivity and a balance of various physical properties.
- thermoplastic resin composition excellent in conductivity, impact resistance, paint adhesion and water resistance reliability.
- Another embodiment provides a molded article prepared from the thermoplastic resin.
- PMI-SM-MAH N-phenyl maleimide-styrene-maleic anhydride
- the (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer includes a core made of a butadiene-based rubber polymer, and a shell formed by graft polymerization of an aromatic vinyl compound and a vinyl cyanide compound to the core-shell can be a structure.
- the butadiene-based rubbery polymer may have an average particle diameter of 0.2 to 1.0 ⁇ m.
- the (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer (g-ABS).
- the (A2) aromatic vinyl-vinyl cyanide copolymer may contain 55 to 80 wt% of a component derived from an aromatic vinyl compound and 20 to 45 wt% of a component derived from a vinyl cyanide compound based on 100 wt%.
- the (A2) aromatic vinyl-vinyl cyanide copolymer may have a weight average molecular weight of 80,000 to 300,000 g/mol.
- the (A2) aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile copolymer.
- the (B) polyamide resin is polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6I, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or combinations thereof.
- the (C) N-phenyl maleimide-styrene-maleic anhydride (PMI-SM-MAH) copolymer may contain 20 to 55 wt% of a component derived from N-phenyl maleimide based on 100 wt% have.
- the (C) N-phenyl maleimide-styrene-maleic anhydride (PMI-SM-MAH) copolymer may have a glass transition temperature (Tg) of 150 to 200°C.
- the polyether-ester-amide block copolymer is an aminocarboxylic acid, lactam, or diamine-dicarboxylic acid salt having 6 or more carbon atoms; polyalkylene glycol; and a dicarboxylic acid having 4 to 20 carbon atoms.
- the thermoplastic resin composition is at least one additive selected from a flame retardant, a nucleating agent, a coupling agent, a filler, a plasticizer, an impact modifier, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, a UV stabilizer, a pigment, and a dye. may further include.
- thermoplastic resin composition a molded article prepared from the above-described thermoplastic resin composition.
- thermoplastic resin composition excellent in electrical conductivity, impact resistance, paint adhesion and water resistance reliability, and a molded article using the same.
- thermoplastic resin composition according to an embodiment and a molded article using the same exhibit excellent electrical conductivity and balance of various properties, and thus can be widely applied to molding various products used for painting and non-coating, and in particular, electrostatic painting is required. It can be usefully applied to molded articles for painting.
- copolymerization means block copolymerization, random copolymerization, and graft copolymerization
- copolymer means block copolymer, random copolymer, and graft copolymer.
- the average particle diameter of the rubbery polymer is the volume average diameter, and means the Z-average particle diameter measured using a dynamic light scattering analysis device.
- the weight average molecular weight is measured by dissolving a powder sample in tetrahydrofuran (THF) and then using Agilent Technologies' 1200 series Gel Permeation Chromatography (GPC) (column is Shodex). Company LF-804, standard sample is Shodex polystyrene).
- the thermoplastic resin composition includes (A1) 20 to 40 wt% of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer; (A2) 20 to 50% by weight of an aromatic vinyl-vinyl cyanide copolymer; (B) 5 to 25% by weight of a polyamide resin; And (C) N-phenyl maleimide-styrene-maleic anhydride (PMI-SM-MAH) to 100 parts by weight of the base resin comprising 10 to 30% by weight of the copolymer, (D) polyether-ester-amide ( 1 to 15 parts by weight of polyether-ester-amide) block copolymer.
- A1 20 to 40 wt% of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer
- A2 20 to 50% by weight of an aromatic vinyl-vinyl cyanide copolymer
- B 5 to 25% by weight of a polyamide resin
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer imparts excellent impact resistance to the thermoplastic resin composition.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer is a core (core) made of a butadiene-based rubbery polymer component and an aromatic vinyl compound and a vinyl cyanide compound in the center by graft polymerization reaction to form a shell It may have a core-shell structure in which a shell is formed.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be prepared by adding an aromatic vinyl compound and a vinyl cyanide compound to a butadiene-based rubber polymer, and graft polymerization through conventional polymerization methods such as emulsion polymerization and bulk polymerization. .
- the butadiene-based rubbery polymer may be selected from the group consisting of butadiene rubbery polymers, butadiene-styrene rubbery polymers, butadiene-acrylonitrile rubbery polymers, butadiene-acrylate rubbery polymers, and mixtures thereof.
- the aromatic vinyl compound may be selected from the group consisting of styrene, ⁇ -methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and mixtures thereof.
- the vinyl cyanide compound may be selected from the group consisting of acrylonitrile, methacrylonitrile, fumaronitrile, and mixtures thereof.
- the butadiene-based rubbery polymer forming the core of the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may have an average particle diameter of 0.2 to 1.0 ⁇ m.
- the average particle diameter of the butadiene-based rubber polymer is 0.2 ⁇ m or more, 0.3 ⁇ m or more, 0.4 ⁇ m or more, 0.5 ⁇ m or more, 0.6 ⁇ m or more, 0.7 ⁇ m or more, 0.8 ⁇ m or more, or 0.9 ⁇ m or more, and 1.0 ⁇ m or less, 0.9 ⁇ m or less, 0.8 ⁇ m or less, 0.7 ⁇ m or less, 0.6 ⁇ m or less, 0.5 ⁇ m or less, 0.4 ⁇ m or less, or 0.3 ⁇ m or less.
- the thermoplastic resin composition according to the exemplary embodiment may exhibit excellent impact resistance and appearance characteristics.
- the butadiene-based rubbery polymer may be included in an amount of 40 to 70 wt%.
- the weight ratio of the aromatic vinyl compound and the vinyl cyanide compound, which is graft-polymerized in the center made of the butadiene-based rubbery polymer component may be 6:4 to 8:2.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer.
- the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer is 20 to 40 wt% based on 100 wt% of the base resin, for example, 20 wt% or more, 25 wt% or more, 30 wt% or more, or 35 wt% or more, and 40 wt% or less, 35 wt% or less, 30 wt% or less, or 25 wt% or less.
- a thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent impact resistance and water resistance reliability.
- the aromatic vinyl-vinyl cyanide copolymer may improve the flowability of the thermoplastic resin composition and maintain compatibility between components at a certain level.
- the aromatic vinyl-vinyl cyanide copolymer has a weight average molecular weight of 80,000 to 300,000 g/mol, for example, 80,000 g/mol or more, 85,000 g/mol or more, or 90,000 g/mol or more, and 300,000 g/mol or less, 250,000 g/mol or less, or 200,000 g/mol or less.
- the aromatic vinyl-vinyl cyanide copolymer may be prepared through conventional polymerization methods such as emulsion polymerization, suspension polymerization, solution polymerization, and bulk polymerization of a monomer mixture including an aromatic vinyl compound and a vinyl cyanide compound.
- the aromatic vinyl compound may be selected from the group consisting of styrene, ⁇ -methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and mixtures thereof.
- the vinyl cyanide compound may be selected from the group consisting of acrylonitrile, methacrylonitrile, fumaronitrile, and mixtures thereof.
- the aromatic vinyl-vinyl cyanide copolymer contains 55 to 80% by weight of a component derived from the aromatic vinyl compound based on 100% by weight, for example, 55% by weight or more, 60% by weight or more, 65% by weight or more, 70% by weight or more. % or more or 75 wt% or more, and 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, or 60 wt% or less.
- the aromatic vinyl-vinyl cyanide copolymer contains 20 to 45% by weight of a component derived from the vinyl cyanide compound based on 100% by weight, for example, 20% by weight or more, 25% by weight or more, 30% by weight or more, 35% by weight or more, or 40% by weight or more, and 45% by weight or less, 40% by weight or less, 35% by weight or less, 30% by weight or less, or 25% by weight or less.
- the aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile copolymer (SAN).
- SAN styrene-acrylonitrile copolymer
- the aromatic vinyl-vinyl cyanide copolymer is 20 to 50% by weight based on 100% by weight of the base resin, for example, 20% by weight or more, 25% by weight or more, 30% by weight or more, 35% by weight or more, 40 wt% or more, or 45 wt% or more, and 50 wt% or less, 45 wt% or less, 40 wt% or less, 35 wt% or less, 30 wt% or less, or 25 wt% or less.
- the thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent moldability and mechanical properties.
- the polyamide resin enables the thermoplastic resin composition to implement excellent electrical conductivity.
- the polyamide resin is included even if it does not contain an excess of (D) polyether-ester-amide block copolymer to be described later, which is included to impart electrical conductivity to the thermoplastic resin composition.
- the thermoplastic resin composition according to an embodiment may have excellent electrical conductivity.
- polyamide resin various polyamide resins known in the art, for example, an aromatic polyamide resin, an aliphatic polyamide resin, or a mixture thereof may be used, but is not particularly limited.
- the aromatic polyamide resin is a polyamide including an aromatic group in a main chain, and may be a wholly aromatic polyamide, a semi-aromatic polyamide, or a mixture thereof.
- the wholly aromatic polyamide refers to a polymer of an aromatic diamine and an aromatic dicarboxylic acid
- the semi-aromatic polyamide refers to a polymer comprising at least one aromatic unit and at least one non-aromatic unit together between amide bonds.
- the semi-aromatic polyamide may be a polymer of an aromatic diamine and an aliphatic dicarboxylic acid, or a polymer of an aliphatic diamine and an aromatic dicarboxylic acid.
- the aliphatic polyamide refers to a polymer of an aliphatic diamine and an aliphatic dicarboxylic acid.
- aromatic diamine examples include, but are not limited to, p-xylenediamine and m-xylenediamine. In addition, these may be used alone or in mixture of two or more.
- aromatic dicarboxylic acid examples include, but are not limited to, phthalic acid, isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, and (1,3-phenylenedioxy)diacetic acid. . In addition, these may be used alone or in mixture of two or more.
- aliphatic diamine examples include, but are not limited to, ethylenediamine, trimethylenediamine, hexamethylenediamine, dodecamethylenediamine, piperazine, and the like. In addition, these may be used alone or in mixture of two or more.
- aliphatic dicarboxylic acid examples include adipic acid, sebacic acid, succinic acid, glutaric acid, azelaic acid, dodecanedioic acid, dimer acid, cyclohexanedicarboxylic acid, etc., but are limited thereto not. In addition, these may be used alone or in mixture of two or more.
- the polyamide resin is polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6I, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or combinations thereof.
- the polyamide resin may include at least polyamide 6.
- the polyamide resin is 5 to 40% by weight, for example 5 to 35% by weight, for example 5 to 30% by weight, for example 5 to 25% by weight based on 100% by weight of the base resin, For example, it may be included in 5 to 20% by weight.
- thermoplastic resin composition including the polyamide resin and a molded article prepared therefrom may exhibit excellent mechanical properties and electrical conductivity due to the polyamide resin.
- the N-phenyl maleimide-styrene-maleic anhydride copolymer has excellent appearance because the surface resistance is lowered and no air bubbles are generated when the thermoplastic resin composition comprising the same is applied to electrostatic painting, and the coating adhesion is also excellent. can keep it
- the N-phenyl maleimide-styrene-maleic anhydride copolymer is obtained by polymerizing a mixture of N-phenyl maleimide, styrene, and maleic anhydride, or by imidation of a styrene and maleic anhydride copolymer. It can be prepared through a reaction.
- the N-phenyl maleimide-styrene-maleic anhydride copolymer is 10 to 55% by weight, for example 15 to 55% by weight, or 15 to 50% by weight of a component derived from N-phenyl maleimide and 40 to 80% by weight of a component derived from styrene, and 1 to 10% by weight of a component derived from maleic anhydride.
- thermoplastic resin composition including the N-phenyl maleimide-styrene-maleic anhydride copolymer and a molded article prepared therefrom may exhibit excellent electrical conductivity and water resistance reliability.
- the N-phenyl maleimide-styrene-maleic anhydride copolymer may have a glass transition temperature (Tg) of 145 to 200 °C, for example, 155 to 200 °C, for example, 165 to 200 °C, but is not limited thereto. .
- Tg glass transition temperature
- the N-substituted maleimide-styrene-maleic anhydride copolymer may have a weight average molecular weight (Mw) of 10,000 to 300,000 g/mol, for example, 15,000 to 150,000 g/mol.
- Mw weight average molecular weight
- the thermoplastic resin composition comprising the same and a molded article prepared therefrom can maintain an excellent balance of physical properties and exhibit excellent electrical conductivity.
- the N-phenyl maleimide-styrene-maleic anhydride copolymer is 10 to 30% by weight, for example, 10% by weight or more, 15% by weight or more, 20% by weight or more based on 100% by weight of the base resin. , or 25 wt% or more, and 30 wt% or less, 25 wt% or less, 20 wt% or less, or 15 wt% or less.
- a thermoplastic resin composition including the same and a molded article prepared therefrom may exhibit excellent electrical conductivity and water resistance reliability.
- the polyether-ester-amide block copolymer can exhibit a predetermined electrical conductivity in the thermoplastic resin composition and molded articles prepared therefrom.
- polyether-ester-amide block copolymer may allow the thermoplastic resin composition and a molded article prepared therefrom to exhibit the above-described electrical conductivity while maintaining excellent water resistance reliability.
- a polyether-ester-amide block copolymer for example, an aminocarboxylic acid having 6 or more carbon atoms, a lactam, or a salt of a diamine-dicarboxylic acid; polyalkylene glycol; and a reaction mixture of a dicarboxylic acid having 4 to 20 carbon atoms.
- salt of the aminocarboxylic acid lactam, or diamine-dicarboxylic acid having 6 or more carbon atoms, ⁇ -aminocaproic acid, ⁇ -aminoenanthoic acid, ⁇ -aminocaprylic acid, ⁇ - aminocarboxylic acids such as aminopelargonic acid, ⁇ -aminocapric acid, 11-aminoundecanoic acid and 12-aminododecanoic acid; lactams such as ⁇ -caprolactam, enanthlactam, caprylactam, laurolactam and the like; and diamine-dicarboxylic acid salts such as a salt of hexamethylenediamine-adipic acid, a salt of hexamethylenediamine-isophthalic acid, and the like.
- salts of 12-aminododecanoic acid, ⁇ -caprolactam, hexamethylenediamine-adipic acid salts of 12-aminod
- polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyhexamethylene glycol, a block or random copolymer of ethylene glycol and propylene glycol, a copolymer of ethylene glycol and tetrahydrofuran synthesis and the like can be exemplified.
- polyethylene glycol, a copolymer of ethylene glycol and propylene glycol, etc. can be used.
- examples of the dicarboxylic acid having 4 to 20 carbon atoms include terephthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, adipic acid, and dodecanedioic acid.
- the bond between the salt of the aminocarboxylic acid having 6 or more carbon atoms, lactam, or diamine-dicarboxylic acid and the polyalkylene glycol may be an ester bond
- the bond between the diamine-dicarboxylic acid salt and the dicarboxylic acid having 4 to 20 carbon atoms may be an amide bond
- the bond between the polyalkylene glycol and the dicarboxylic acid having 4 to 20 carbon atoms is an ester may be a combination.
- the polyether-ester-amide block copolymer may be prepared by a known synthesis method, for example, the synthesis method disclosed in Japanese Patent Publication No. 56-045419 and Japanese Patent Publication No. 55-133424. can be manufactured according to
- the polyether-ester-amide block copolymer may include 10 to 95% by weight of the polyetherester block.
- the thermoplastic resin composition according to the exemplary embodiment may have excellent electrical conductivity and heat resistance.
- the polyether-ester-amide block copolymer is 1 to 15 parts by weight, for example, 1 part by weight or more, 5 parts by weight or more, or 10 parts by weight or more, based on 100 parts by weight of the base resin; And, 15 parts by weight or less, 10 parts by weight or less, or 5 parts by weight or less may be included.
- the thermoplastic resin composition and a molded article prepared therefrom may exhibit excellent electrical conductivity while maintaining excellent water resistance reliability.
- thermoplastic resin composition may exhibit excellent flame retardancy, antibacterial properties, antistatic properties, weather resistance, light resistance, impact resistance, heat resistance, and appearance characteristics while reducing other physical properties
- One or more additives may be further included in order to balance the respective physical properties without generating , or according to the end use of the thermoplastic resin composition.
- a flame retardant a nucleating agent, a coupling agent, a filler, a plasticizer, an impact modifier, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, a dye, etc.
- a flame retardant a nucleating agent, a coupling agent, a filler, a plasticizer, an impact modifier, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, a dye, etc.
- a flame retardant e.g., a nucleating agent, a coupling agent, a filler, a plasticizer, an impact modifier, a lubricant, an antibacterial agent, a mold release agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a pigment, a dye, etc.
- thermoplastic resin composition may be appropriately included within a range that does not impair the physical properties of the thermoplastic resin composition, and specifically, may be included in an amount of 20 parts by weight or less based on 100 parts by weight of the base resin, but is not limited thereto.
- thermoplastic resin composition according to the present invention may be prepared by a known method for preparing a thermoplastic resin composition.
- thermoplastic resin composition according to the present invention may be prepared in the form of pellets by mixing the components of the present invention and other additives at the same time and then melt-kneading in an extruder.
- another embodiment provides a molded article manufactured using the thermoplastic resin composition according to the embodiment.
- the molded article may be manufactured by various methods known in the art, such as injection molding and extrusion molding, using the thermoplastic resin composition.
- the molded article has excellent electrical conductivity, impact resistance, paint adhesion and water resistance reliability, and thus can be advantageously used in various electrical and electronic parts, building materials, sporting goods, and automobile interior/exterior parts.
- thermoplastic resin compositions of Examples 1 to 2 and Comparative Examples 1 to 5 were prepared according to the component content ratios shown in Table 1, respectively.
- thermoplastic resin composition in pellet form. Then, after drying the pelletized thermoplastic resin composition at about 80° C. for about 2 hours, a 6 oz injection molding machine having a cylinder temperature of about 250° C. and a mold temperature of about 60° C. was used to prepare specimens for evaluation of physical properties, respectively.
- Polyamide 6 resin having a melting point (Tm) of about 223°C and a relative viscosity of about 2.3 (KP Chemtech, EN-300)
- N-phenyl maleimide-styrene-maleic anhydride copolymer having a glass transition temperature (Tg) of about 196° C. and an N-phenyl maleimide-derived component content of about 49% by weight (Denka, MS-NB)
- Polyamide 6-polyethylene oxide block copolymer (PA6-b-PE0) (Sanyo, PELECTRON AS)
- Coating adhesion (unit: grade): According to ASTM D3359, grid-shaped cuts are made on the electrostatically coated 100 mm x 100 mm x 2 mm specimens at 1 mm intervals, and tape is attached thereon and then peeled off the tape. After peeling, the grade was evaluated according to the surface condition of the specimen. As the tape for evaluation, a JIS Z 1522 standard Nichiban CT-24 tape was used.
- thermoplastic resin composition From Tables 1 and 2, as in Examples 1 and 2, butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, aromatic vinyl-vinyl cyanide copolymer, polyamide resin, maleic anhydride-aromatic vinyl-maleic anhydride And by using the polyether-ester-amide block copolymer in an amount to form the thermoplastic resin composition according to one embodiment, the thermoplastic resin composition showing superior electrical conductivity, impact resistance, water-resistance reliability and paint adhesion compared to Comparative Examples and the same It can be confirmed that the used molded article can be provided.
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Abstract
Description
구분 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | 비교예 4 | 비교예 5 | |
(A1) | 중량% | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
(A2) | 중량% | 40 | 35 | 55 | 50 | 20 | 35 | 35 |
(B) | 중량% | 15 | 15 | 15 | 15 | 15 | 15 | 15 |
(C) | 중량% | 15 | 20 | - | 5 | 35 | 20 | - |
(C') | 중량% | - | - | - | - | - | - | 20 |
(D) | 중량부 | 8 | 8 | 8 | 8 | 8 | - | 8 |
구분 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | 비교예 4 | 비교예 5 |
표면저항 | 1010.5 | 1010.5 | 109.9 | 1010.2 | 1011.8 | 1013.5 | 1010.6 |
충격강도 | 20.4 | 19.5 | 15.5 | 22.6 | 16.2 | 10.3 | 17.8 |
기포 발생 여부 | X | X | ○ | ◎ | ○ | ○ | ○ |
도장 부착력 | 5B | 5B | 0B | 0B | 3B | 1B | 4B |
Claims (13)
- (A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체 20 내지 40 중량%; (A2) 방향족 비닐-시안화 비닐 공중합체 20 내지 50 중량%; (B) 폴리아미드 수지 5 내지 25 중량%; 및 (C) N-페닐 말레이미드-스티렌-말레산 무수물(PMI-SM-MAH) 공중합체 10 내지 30 중량%를 포함하는 기초수지 100 중량부에 대해, (D) 폴리에테르-에스테르-아미드(polyether-ester-amide) 블록 공중합체 1 내지 15 중량부를 포함하는, 열가소성 수지 조성물.
- 제1항에서,상기 (A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체는 부타디엔계 고무질 중합체로 이루어진 코어, 및 방향족 비닐 화합물과 시안화 비닐 화합물이 상기 코어에 그라프트 중합되어 형성된 쉘을 포함하는 코어-쉘 구조인, 열가소성 수지 조성물.
- 제1항 또는 제2항에서,상기 부타디엔계 고무질 중합체는 평균 입경이 0.2 내지 1.0 ㎛인, 열가소성 수지 조성물.
- 제1항 내지 제3항 중 어느 한 항에서,상기 (A1) 부타디엔계 고무변성 방향족 비닐-시안화 비닐 그라프트 공중합체는 아크릴로니트릴-부타디엔-스티렌 그라프트 공중합체(g-ABS)인, 열가소성 수지 조성물.
- 제1항 내지 제4항 중 어느 한 항에서,상기 (A2) 방향족 비닐-시안화 비닐 공중합체는 100 중량%를 기준으로 방향족 비닐 화합물로부터 유래한 성분 55 내지 80 중량% 및 시안화 비닐 화합물로부터 유래한 성분 20 내지 45 중량%를 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제5항 중 어느 한 항에서,상기 (A2) 방향족 비닐-시안화 비닐 공중합체는 중량평균분자량이 80,000 내지 300,000 g/mol인, 열가소성 수지 조성물.
- 제1항 내지 제6항 중 어느 한 항에서,상기 (A2) 방향족 비닐-시안화 비닐 공중합체는 스티렌-아크릴로니트릴 공중합체인, 열가소성 수지 조성물.
- 제1항 내지 제7항 중 어느 한 항에서,상기 (B) 폴리아미드 수지는 폴리아미드 6, 폴리아미드 66, 폴리아미드 46, 폴리아미드 11, 폴리아미드 12, 폴리아미드 610, 폴리아미드 612, 폴리아미드 6I, 폴리아미드 6T, 폴리아미드 4T, 폴리아미드 410, 폴리아미드 510, 폴리아미드 1010, 폴리아미드 1012, 폴리아미드 10T, 폴리아미드 1212, 폴리아미드 12T, 폴리아미드 MXD6, 또는 이들의 조합을 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제8항 중 어느 한 항에서,(C) N-페닐 말레이미드-스티렌-말레산 무수물(PMI-SM-MAH) 공중합체는 100 중량%를 기준으로, N-페닐 말레이미드로부터 유래한 성분 20 내지 55 중량%를 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제9항 중 어느 한 항에서,상기 (C) N-페닐 말레이미드-스티렌-말레산 무수물(PMI-SM-MAH) 공중합체는 유리전이온도(Tg)가 150 내지 200℃인, 열가소성 수지 조성물.
- 제1항 내지 제10항 중 어느 한 항에서,상기 (D) 폴리에테르-에스테르-아미드 블록 공중합체는 탄소수 6 이상의 아미노카르복실산, 락탐, 또는 디아민-디카르복실산 염; 폴리알킬렌글리콜; 및 탄소수 4 내지 20의 디카르복실산의 반응 혼합물인, 열가소성 수지 조성물.
- 제1항 내지 제11항 중 어느 한 항에서,난연제, 핵제, 커플링제, 충전제, 가소제, 충격보강제, 활제, 항균제, 이형제, 열 안정제, 산화 방지제, 자외선 안정제, 안료, 염료 중에서 선택되는 적어도 하나의 첨가제를 더 포함하는, 열가소성 수지 조성물.
- 제1항 내지 제12항 중 어느 한 항의 열가소성 수지 조성물로부터 제조된 성형품.
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KR950013363A (ko) * | 1993-11-30 | 1995-06-15 | 류이찌 오무라 | 가이드 부착 진출간의 간끝 보호커버 |
KR20140117459A (ko) * | 2012-01-11 | 2014-10-07 | 스티롤루션 유럽 게엠베하 | 스티렌 공중합체 및 폴리아미드를 기재로 한 향상된 인성을 갖는 내후성 열가소성 성형 배합물 |
KR20180136793A (ko) * | 2017-06-15 | 2018-12-26 | 금호석유화학 주식회사 | 내화학성이 향상된 열가소성 수지 조성물 |
KR101972232B1 (ko) * | 2017-10-16 | 2019-04-24 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 형성된 성형품 |
KR20190082074A (ko) * | 2017-12-29 | 2019-07-09 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이를 이용한 성형품 |
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KR950013363A (ko) * | 1993-11-30 | 1995-06-15 | 류이찌 오무라 | 가이드 부착 진출간의 간끝 보호커버 |
KR20140117459A (ko) * | 2012-01-11 | 2014-10-07 | 스티롤루션 유럽 게엠베하 | 스티렌 공중합체 및 폴리아미드를 기재로 한 향상된 인성을 갖는 내후성 열가소성 성형 배합물 |
KR20180136793A (ko) * | 2017-06-15 | 2018-12-26 | 금호석유화학 주식회사 | 내화학성이 향상된 열가소성 수지 조성물 |
KR101972232B1 (ko) * | 2017-10-16 | 2019-04-24 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 형성된 성형품 |
KR20190082074A (ko) * | 2017-12-29 | 2019-07-09 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이를 이용한 성형품 |
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