WO2022113639A1 - 基板、モータ、及び軸流ファン - Google Patents

基板、モータ、及び軸流ファン Download PDF

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Publication number
WO2022113639A1
WO2022113639A1 PCT/JP2021/039877 JP2021039877W WO2022113639A1 WO 2022113639 A1 WO2022113639 A1 WO 2022113639A1 JP 2021039877 W JP2021039877 W JP 2021039877W WO 2022113639 A1 WO2022113639 A1 WO 2022113639A1
Authority
WO
WIPO (PCT)
Prior art keywords
land
substrate
lead
electronic component
substrate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/039877
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English (en)
French (fr)
Japanese (ja)
Inventor
秀哲 伊藤
太郎 旦野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advanced Motor Corp
Original Assignee
Nidec Servo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Servo Corp filed Critical Nidec Servo Corp
Priority to CN202180079314.3A priority Critical patent/CN116508399A/zh
Priority to JP2022565156A priority patent/JPWO2022113639A1/ja
Publication of WO2022113639A1 publication Critical patent/WO2022113639A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a substrate, a motor, and an axial flow fan.
  • the conventional board has no feature in the land on the board, and there is a problem that there is a possibility that a mounting error of the electronic component may occur such that a plurality of electronic components are connected to the same land.
  • An object of the present invention is to provide a substrate in which mounting errors of components are unlikely to occur.
  • the first exemplary invention of the present application is a substrate having a land and wiring electrically connected to the land, and electronic components having two soldering portions are mounted on the substrate so as to be mountable. It has one land and the other land, the other land has a first land on the other side and a second land on the other side adjacent to the first land on the other side, and the area of the one land is The area of the other side land is smaller than the area of the other side land, and the other side first land and the other side second land are adjacent to each other with a constricted portion narrower than the width in which the one side land and the other side land face each other. do.
  • FIG. 5 it is a top view of the substrate 100 which shows the connection of the lead with and without the reverse connection protection function.
  • the substrate 120 which shows the connection of the lead with and without the reverse connection protection function.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Y-axis direction is a direction orthogonal to the mounting surface 100a of the substrate 100 shown in FIG. 1 (A).
  • the X-axis direction is the left-right direction in FIG. 1A among the directions orthogonal to the Y-axis direction.
  • the Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction.
  • the side pointed by the arrow in the figure is the + side
  • the opposite side is the-side.
  • the positive side (+ Y side) in the Y-axis direction is referred to as “one side”
  • the negative side (-Y side) in the Y-axis direction is referred to as “the other side”.
  • one side and the other side are names used only for explanation, and do not limit the actual positional relationship and direction.
  • extending in the Z-axis direction includes not only the case of extending strictly in the Z-axis direction but also the case of extending in a direction inclined in a range of less than 45 ° with respect to the Z-axis direction. .. The same applies to the X-axis direction and the Y-axis direction.
  • orthogonal includes not only the case where the angle is strictly orthogonal but also the case where the angles formed by each other are tilted within a range of less than 45 °.
  • parallel includes not only the case where they are strictly parallel but also the case where the angles formed by each other are tilted within a range of less than 45 °.
  • FIG. 1 is a diagram showing a configuration of a substrate according to the first embodiment of the present invention.
  • FIG. 1A is a plan view showing lands and wiring on a substrate.
  • FIG. 1B is a side view of an electronic component mounted on the substrate 100 of FIG. 1A.
  • the board 100 is an example of a board on which a circuit for driving a motor unit (hereinafter referred to as "motor drive circuit") is mounted.
  • the motor unit includes, for example, a rotor that rotates along a central axis extending in the axial direction, and a stator that faces the rotor.
  • the motor unit and the substrate 100 constitute a motor.
  • This motor is, for example, a motor that rotates a fan.
  • the motor and fan constitute an axial flow fan.
  • the surface 100a of the substrate 100 includes a circuit pattern formed of copper foil.
  • the circuit pattern may be made of a conductor other than copper foil.
  • the surface 100a on which the circuit pattern of the substrate 100 is formed includes a portion covered with the solder resist and a portion not covered with the solder resist.
  • the portion to which the electronic components and leads are soldered is a land.
  • the portion where the electronic components and leads are not soldered is wiring. There may be a portion of the copper foil on the surface 100a of the substrate 100 that is covered with the solder resist. Any known method may be used for forming the land, wiring, and resist on the substrate 100.
  • FIG. 1A shows an example of a circuit pattern on the substrate 100.
  • the surface 100a of the substrate 100 includes lands 23, lands 22, and lands 32 in this order from one side in the X-axis direction to the other side in the X-axis direction.
  • the surface 100a of the substrate 100 includes wiring 21 and wiring 31.
  • the land 23 is electrically connected to the wiring 21.
  • the land 22 is electrically connected to the wiring 21.
  • the land 32 is electrically connected to the wiring 31.
  • the wiring 31 is electrically connected to the motor drive circuit.
  • the land 32 has a constricted portion 323, a land 321 and a land 322 adjacent to the land 321.
  • the land 321 and the land 322 are adjacent to each other with a constricted portion 323 narrower than the width at which the land 22 and the land 32 face each other.
  • the land 321 may be located on one side in the X-axis direction with respect to the land 322.
  • the land 322 is electrically connected to the wiring 31 on the other side in the X-axis direction.
  • the width at which the land 22 and the land 32 face each other is the width W2 shown in FIG. 1 (A).
  • the width of the constricted portion 323 is the width W1 shown in FIG. 1 (A).
  • the width W1 and the width W2 are widths in the Z-axis direction.
  • the width W1 is narrower than the width W2.
  • the copper foil of the land 32 has a constricted portion 323.
  • the area of the land 321 is equal to or smaller than the area of the land 22.
  • the area of land 322 is larger than the area of land 22.
  • Land 23 is an example of a lead land.
  • the wiring 21 is an example of one-sided wiring.
  • Land 22 is an example of a one-sided land.
  • Land 32 is an example of a land on the other side.
  • the land 321 is an example of the first land on the other side.
  • Land 322 is an example of the second land on the other side.
  • the circuit pattern shown in FIG. 1A is a circuit pattern in which the + pole of the power supply is electrically connected to the motor drive circuit.
  • connecting simply means “electrically connecting”.
  • a reverse connection protection function may be provided so that the motor drive circuit can be protected even if such a lead connection error occurs.
  • the reverse connection protection function is realized by connecting a protection element between the land to which the positive pole lead should be connected and the motor drive circuit.
  • a diode is an example of a protective element. According to the reverse connection protection function, a voltage of opposite polarity is applied to the motor drive circuit by connecting the anode of the diode to the land to which the positive pole lead should be connected and connecting the motor drive circuit to the cathode of the diode. You can prevent that.
  • the substrate 100 of the present embodiment can correspond to the presence or absence of the reverse connection protection function with the same circuit pattern, and realizes cost reduction.
  • the substrate 100 can mount the electronic component 41 shown in FIG. 1 (B).
  • the electronic component 41 has a terminal 411 and a terminal 412 on one surface in the Y-axis direction.
  • the terminal 411 is a terminal arranged at one end of the electronic component 41 in the X-axis direction.
  • the terminal 412 is a terminal arranged at the other end of the electronic component 41 in the X-axis direction.
  • the electronic component 41 is mounted by soldering the terminals 411 and 412 to the substrate 100.
  • the terminal 411 and the terminal 412 are examples of the soldered portion.
  • the electronic component 41 is a surface mount component.
  • the electronic component 41 is a diode.
  • Terminal 411 is the anode.
  • Terminal 412 is a cathode.
  • FIG. 2 is a diagram of a substrate 100 showing a lead connection when a reverse connection protection function is provided.
  • FIG. 2A is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided.
  • FIG. 2B is a side view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided.
  • the lead 51 is connected to the substrate 100 and the electronic component 41 is mounted on the substrate 100.
  • the lead 51 is covered with a coating 512.
  • the lead 51 is stripped of the coating 512 at the other end in the X-axis direction.
  • the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 100.
  • the area of land 23 is equal to or larger than the area of land 322.
  • the electronic component 41 is soldered to the land 22 and the land 321.
  • Cream solder is applied to the lands 22 and 321.
  • the terminal 411 is placed on the land 22 coated with the cream solder.
  • the terminal 412 is placed on the land 321 coated with the cream solder. When heated in this state, the cream solder liquefies.
  • the electronic component 41 is surface-mounted at a position determined on the substrate 100 by the balance between the shape of the land 22 and the surface tension of the liquefied cream solder.
  • the distance from the land 22 to the land 321 is shorter than the distance from the land 22 to the land 322, and the electronic component 41 can be mounted on the land 22 and the land 321.
  • the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
  • the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
  • the width W1 of the constricted portion 323 is narrower than the width W3 which is the width of the electronic component 41 in the Z-axis direction.
  • the width W3 of the electronic component 41 is the width of the terminals 411 and 412 in the Z-axis direction. Therefore, at the time of surface mounting, it is possible to stop the electronic component 41 from being displaced in the X-axis direction due to surface tension at the constricted portion 323, and it is possible to suppress the displacement of the electronic component 41.
  • FIG. 3 is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
  • FIG. 3B is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
  • FIG. 3B is a side view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
  • the electronic component 41 is not soldered to the land 321 so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
  • FIG. 4 is a plan view of the substrate 100 showing an example different from that of FIG. 1 of the land 32.
  • FIG. 4A is a plan view of the substrate 100 showing the copper foil of the land 32 before forming the constricted portion 323.
  • FIG. 4B is a plan view of the substrate 100 showing the land 32 after forming the constricted portion 323.
  • the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • the copper foil of the land 32 has a shape having no constricted portion 323 as shown in FIG. 4 (A).
  • the constricted portion 323 is formed by covering a part of the copper foil of the land 32 with the solder resist 324a and the solder resist 324b as shown in FIG. 4 (B).
  • the solder resist 324a is a solder resist that covers the copper foil on the other side in the Z-axis direction of the constricted portion 323.
  • the solder resist 324b is a solder resist that covers the copper foil on one side in the Z-axis direction of the constricted portion 323.
  • the constricted portion 323 may have the configuration shown in FIG.
  • FIG. 5 is a plan view of the substrate 100 showing an example different from FIGS. 1 and 4 of the land 32.
  • the copper foil of the land 32 has a constricted shape, and the constricted portion 323 is exposed without being covered with the solder resist.
  • the copper foil of the land 32 has a constricted shape, and the constricted portion 323 is covered with the solder resist 325 and is not exposed.
  • the copper foil of the land 32 has a shape without constriction as shown in FIG. 4A, and is covered with the solder resist 325 at a position corresponding to the constricted portion 323 and is not exposed. It may be a configuration.
  • the solder resist 325 separates the land 321 and the land 322 in the land 32.
  • FIG. 6 is a plan view of the substrate 100 showing another example of the land 32 of FIG.
  • the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • FIG. 7A is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided in the example of FIG.
  • FIG. 7B is a plan view of the substrate 100 showing the connection of leads in the example of FIG. 6 when the reverse connection protection function is not provided.
  • the land 321, the land 322, and the constricted portion 323 are provided, and the land 321 and the land 322 are adjacent to each other with the constricted portion 323 in between.
  • the land 322 is located on one side in the X-axis direction from the land 321 and on the other side in the X-axis direction from the land 22.
  • the land 321 is connected to the wiring 31 on the other side in the X-axis direction.
  • the lead 51 is connected to the substrate 100 and the electronic component 41 is mounted.
  • the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 100.
  • the electronic component 41 is soldered to the land 22 and the land 321.
  • the distance from the land 22 to the land 322 is shorter than the distance from the land 22 to the land 321.
  • the electronic component 41 can be mounted on the land 22 and the land 321.
  • the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
  • the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
  • the lead 51 when the reverse connection protection function is not provided, the lead 51 is connected to the substrate 100, and the electronic component 41 is not mounted.
  • the other end of the lead 51 in the X-axis direction is soldered to the land 322 of the substrate 100.
  • the lands 22 are located between the leads 51 and the substrate 100.
  • the reverse connection protection function is not provided, the electronic component 41 is not soldered to the land 22, so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
  • FIG. 8 is a diagram showing a configuration of a substrate according to a second embodiment of the present invention.
  • FIG. 8 is a plan view showing lands and wiring on the substrate.
  • the substrate 120 corresponding to the substrate 100 of the first embodiment will be described.
  • the surface 120a of the substrate 120 comprises a circuit pattern formed of copper foil. Since the application of the substrate 120 is the same as that of the substrate 100, detailed description thereof will be omitted. Further, the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • the electronic component 41 when the electronic component 41 is mounted on the substrate 120, the electronic component 41 is oriented so that the terminal 411 is located on the other side in the Z-axis direction and the terminal 412 is located on the other side in the Z-axis direction. Orient it.
  • the land 321, the land 322, and the constricted portion 323 are provided, and the land 321 and the land 322 are adjacent to each other with the constricted portion 323 interposed therebetween.
  • the land 321 faces the land 22 in the Z-axis direction on one side in the X-axis direction with respect to the land 322.
  • the land 322 is connected to the wiring 31 on the other side in the X-axis direction.
  • the land 22 is connected to the land 23 on one side in the X-axis direction by wiring 21.
  • FIG. 9A is a plan view of the substrate 120 showing the connection of leads when the reverse connection protection function is provided in the example of FIG.
  • the lead 51 is connected to the substrate 120 and the electronic component 41 is mounted on the substrate 120.
  • the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 120.
  • the electronic component 41 is soldered to the land 22 and the land 321.
  • the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
  • the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412403 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
  • FIG. 9 (B) is a plan view of the substrate 120 showing the connection of leads in the example of FIG. 8 when the reverse connection protection function is not provided.
  • the lead 51 is connected to the substrate 120, and the electronic component 41 is not mounted.
  • the other end of the lead 51 in the X-axis direction is soldered to the land 322 of the substrate 120.
  • the leads 51 are soldered to the lands 322, the lands 22 and 321 are located between the leads 51 and the substrate 120.
  • the reverse connection protection function is not provided, the electronic component 41 is not soldered to the land 22, so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
  • the substrate has a land and wiring electrically connected to the land, and an electronic component having two soldering portions is mounted on the substrate so as to be mountable. It has one land and the other land, the other land has a first land on the other side and a second land on the other side adjacent to the first land on the other side, and the area of the one land is The area of the other side land is smaller than the area of the other side land, and the other side first land and the other side second land are adjacent to each other with a constricted portion narrower than the width in which the one side land and the other side land face each other. do.
  • the area of the land on one side and the area of the land on the other side are different, it is possible to suppress an error in the orientation of the component at the time of mounting the component on the board. Therefore, it is possible to provide a substrate in which mounting errors of components are unlikely to occur. Further, it is possible to prevent the electronic components mounted straddling the one-side land and the other-side land from being likely to be displaced due to surface tension at the constricted portion, and it is possible to suppress the displacement of the electronic components.
  • constricted portion was formed by covering a part of the copper foil constituting the other side land with a solder resist. Therefore, the constricted portion can suppress the displacement of the electronic component.
  • constricted portion is covered with a solder resist. Therefore, since the shape of the constricted portion can be freely formed, the work of mounting the component on the board can be easily performed.
  • the width of the constricted portion is narrower than the width of the one-side land and the electronic component mounted on the other-side land. Therefore, it is possible to prevent the electronic components mounted straddling the one-side land and the other-side land from being likely to be displaced due to surface tension at the constricted portion, and it is possible to suppress the displacement of the electronic components.
  • the area of the first land on the other side is the same as or smaller than the area of the land on the other side. Therefore, it is easy to mount the surface mount component.
  • the area of the second land on the other side is larger than the area of the land on the other side. Therefore, a component larger than the surface mount component can be soldered to the second land on the other side.
  • the distance from the one-side land to the other-side first land is shorter than the distance from the one-side land to the other-side second land, and the electronic component is the one-side land and the other-side first land. It can be mounted by connecting two lands. Therefore, the distance from the one-side land to the other-side second land can be set as the length of the electronic component, and the area required for the one-side land and the other-side land can be reduced.
  • the distance from the one-side land to the other-side first land is longer than the distance from the one-side land to the other-side second land, and the electronic component is the one-side land and the other-side first land. It can be mounted by connecting one land. Therefore, since the second land on the other side is not hidden by the electronic component, the state of the second land on the other side can be visually confirmed.
  • the one-side land is connected to the lead land via the one-side wiring.
  • the area of the lead land is the same as or larger than the area of the second land on the other side.
  • the same lead is soldered to the lead land and the second land on the other side.
  • the constricted portion and the other side first land can also be used for soldering the leads, so that the other side second land may be smaller than the lead land. Therefore, the lead land may be larger.
  • a lead is soldered to the lead land, an electronic component is soldered to the one-side land and the other-side first land, and the direction in which the lead extends overlaps with the electronic component. It is a direction that does not become. Therefore, even when the electronic component is soldered to the one-side land and the other-side land, it does not interfere with the soldering of the lead to the lead land, and the electronic component is mounted. Lead connection can be made reliably.
  • the electronic component is a diode. Therefore, when mounting the diode on the board, it is possible to suppress an error in the orientation of the diode.
  • the lead is soldered to the second land on the other side, and has the first land on the other side between the lead and the substrate. Since the electronic component is not soldered to the first land on the other side, the electronic component does not get in the way when soldering the lead to the second land on the other side, and the lead connection when the electronic component is not mounted can be used. You can do it with certainty.
  • the lead is soldered to the second land on the other side, and has the one-side land between the lead and the substrate. Since the electronic components are not soldered to the land on one side, the electronic components do not get in the way when soldering the leads to the first land on the other side, ensuring the lead connection when the electronic components are not mounted. Can be done.
  • a motor unit including a rotor that rotates along a central axis extending in the axial direction, a stator facing the rotor, and a substrate thereof is provided, and the substrate is the motor portion of the motor unit.
  • the motor also rotates the fan. Therefore, in the fan motor, when mounting the component on the board, it is possible to suppress an error in the orientation of the component at the time of mounting.
  • it is an axial flow fan and includes the motor and the fan. Therefore, in the axial flow fan, when mounting the component on the board, it is possible to suppress an error in the orientation of the component at the time of mounting.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PCT/JP2021/039877 2020-11-26 2021-10-28 基板、モータ、及び軸流ファン Ceased WO2022113639A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180079314.3A CN116508399A (zh) 2020-11-26 2021-10-28 基板、马达及轴流风扇
JP2022565156A JPWO2022113639A1 (https=) 2020-11-26 2021-10-28

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JP2020196179 2020-11-26
JP2020-196179 2020-11-26

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365973A (en) * 1976-11-25 1978-06-12 Mitsubishi Electric Corp Method of producing hyb ic
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH024278U (https=) * 1988-06-22 1990-01-11
JPH033770U (https=) * 1989-05-31 1991-01-16
JPH05102648A (ja) * 1991-10-04 1993-04-23 Hitachi Ltd プリント基板
JPH06350243A (ja) * 1993-06-07 1994-12-22 Nippondenso Co Ltd 印刷配線基板
JP2004153143A (ja) * 2002-10-31 2004-05-27 Kubota Corp 電子回路基板
WO2011040480A1 (ja) * 2009-09-30 2011-04-07 株式会社村田製作所 回路基板
JP2019204863A (ja) * 2018-05-23 2019-11-28 ミネベアミツミ株式会社 回路基板、モータユニット、およびファン

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196376U (https=) * 1986-06-04 1987-12-14
JPH0446572U (https=) * 1990-08-23 1992-04-21

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365973A (en) * 1976-11-25 1978-06-12 Mitsubishi Electric Corp Method of producing hyb ic
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH024278U (https=) * 1988-06-22 1990-01-11
JPH033770U (https=) * 1989-05-31 1991-01-16
JPH05102648A (ja) * 1991-10-04 1993-04-23 Hitachi Ltd プリント基板
JPH06350243A (ja) * 1993-06-07 1994-12-22 Nippondenso Co Ltd 印刷配線基板
JP2004153143A (ja) * 2002-10-31 2004-05-27 Kubota Corp 電子回路基板
WO2011040480A1 (ja) * 2009-09-30 2011-04-07 株式会社村田製作所 回路基板
JP2019204863A (ja) * 2018-05-23 2019-11-28 ミネベアミツミ株式会社 回路基板、モータユニット、およびファン

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JPWO2022113639A1 (https=) 2022-06-02

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