WO2022113639A1 - 基板、モータ、及び軸流ファン - Google Patents
基板、モータ、及び軸流ファン Download PDFInfo
- Publication number
- WO2022113639A1 WO2022113639A1 PCT/JP2021/039877 JP2021039877W WO2022113639A1 WO 2022113639 A1 WO2022113639 A1 WO 2022113639A1 JP 2021039877 W JP2021039877 W JP 2021039877W WO 2022113639 A1 WO2022113639 A1 WO 2022113639A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- land
- substrate
- lead
- electronic component
- substrate according
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 229910000679 solder Inorganic materials 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 12
- 239000006071 cream Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Definitions
- the present invention relates to a substrate, a motor, and an axial flow fan.
- the conventional board has no feature in the land on the board, and there is a problem that there is a possibility that a mounting error of the electronic component may occur such that a plurality of electronic components are connected to the same land.
- An object of the present invention is to provide a substrate in which mounting errors of components are unlikely to occur.
- the first exemplary invention of the present application is a substrate having a land and wiring electrically connected to the land, and electronic components having two soldering portions are mounted on the substrate so as to be mountable. It has one land and the other land, the other land has a first land on the other side and a second land on the other side adjacent to the first land on the other side, and the area of the one land is The area of the other side land is smaller than the area of the other side land, and the other side first land and the other side second land are adjacent to each other with a constricted portion narrower than the width in which the one side land and the other side land face each other. do.
- FIG. 5 it is a top view of the substrate 100 which shows the connection of the lead with and without the reverse connection protection function.
- the substrate 120 which shows the connection of the lead with and without the reverse connection protection function.
- the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
- the Y-axis direction is a direction orthogonal to the mounting surface 100a of the substrate 100 shown in FIG. 1 (A).
- the X-axis direction is the left-right direction in FIG. 1A among the directions orthogonal to the Y-axis direction.
- the Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction.
- the side pointed by the arrow in the figure is the + side
- the opposite side is the-side.
- the positive side (+ Y side) in the Y-axis direction is referred to as “one side”
- the negative side (-Y side) in the Y-axis direction is referred to as “the other side”.
- one side and the other side are names used only for explanation, and do not limit the actual positional relationship and direction.
- extending in the Z-axis direction includes not only the case of extending strictly in the Z-axis direction but also the case of extending in a direction inclined in a range of less than 45 ° with respect to the Z-axis direction. .. The same applies to the X-axis direction and the Y-axis direction.
- orthogonal includes not only the case where the angle is strictly orthogonal but also the case where the angles formed by each other are tilted within a range of less than 45 °.
- parallel includes not only the case where they are strictly parallel but also the case where the angles formed by each other are tilted within a range of less than 45 °.
- FIG. 1 is a diagram showing a configuration of a substrate according to the first embodiment of the present invention.
- FIG. 1A is a plan view showing lands and wiring on a substrate.
- FIG. 1B is a side view of an electronic component mounted on the substrate 100 of FIG. 1A.
- the board 100 is an example of a board on which a circuit for driving a motor unit (hereinafter referred to as "motor drive circuit") is mounted.
- the motor unit includes, for example, a rotor that rotates along a central axis extending in the axial direction, and a stator that faces the rotor.
- the motor unit and the substrate 100 constitute a motor.
- This motor is, for example, a motor that rotates a fan.
- the motor and fan constitute an axial flow fan.
- the surface 100a of the substrate 100 includes a circuit pattern formed of copper foil.
- the circuit pattern may be made of a conductor other than copper foil.
- the surface 100a on which the circuit pattern of the substrate 100 is formed includes a portion covered with the solder resist and a portion not covered with the solder resist.
- the portion to which the electronic components and leads are soldered is a land.
- the portion where the electronic components and leads are not soldered is wiring. There may be a portion of the copper foil on the surface 100a of the substrate 100 that is covered with the solder resist. Any known method may be used for forming the land, wiring, and resist on the substrate 100.
- FIG. 1A shows an example of a circuit pattern on the substrate 100.
- the surface 100a of the substrate 100 includes lands 23, lands 22, and lands 32 in this order from one side in the X-axis direction to the other side in the X-axis direction.
- the surface 100a of the substrate 100 includes wiring 21 and wiring 31.
- the land 23 is electrically connected to the wiring 21.
- the land 22 is electrically connected to the wiring 21.
- the land 32 is electrically connected to the wiring 31.
- the wiring 31 is electrically connected to the motor drive circuit.
- the land 32 has a constricted portion 323, a land 321 and a land 322 adjacent to the land 321.
- the land 321 and the land 322 are adjacent to each other with a constricted portion 323 narrower than the width at which the land 22 and the land 32 face each other.
- the land 321 may be located on one side in the X-axis direction with respect to the land 322.
- the land 322 is electrically connected to the wiring 31 on the other side in the X-axis direction.
- the width at which the land 22 and the land 32 face each other is the width W2 shown in FIG. 1 (A).
- the width of the constricted portion 323 is the width W1 shown in FIG. 1 (A).
- the width W1 and the width W2 are widths in the Z-axis direction.
- the width W1 is narrower than the width W2.
- the copper foil of the land 32 has a constricted portion 323.
- the area of the land 321 is equal to or smaller than the area of the land 22.
- the area of land 322 is larger than the area of land 22.
- Land 23 is an example of a lead land.
- the wiring 21 is an example of one-sided wiring.
- Land 22 is an example of a one-sided land.
- Land 32 is an example of a land on the other side.
- the land 321 is an example of the first land on the other side.
- Land 322 is an example of the second land on the other side.
- the circuit pattern shown in FIG. 1A is a circuit pattern in which the + pole of the power supply is electrically connected to the motor drive circuit.
- connecting simply means “electrically connecting”.
- a reverse connection protection function may be provided so that the motor drive circuit can be protected even if such a lead connection error occurs.
- the reverse connection protection function is realized by connecting a protection element between the land to which the positive pole lead should be connected and the motor drive circuit.
- a diode is an example of a protective element. According to the reverse connection protection function, a voltage of opposite polarity is applied to the motor drive circuit by connecting the anode of the diode to the land to which the positive pole lead should be connected and connecting the motor drive circuit to the cathode of the diode. You can prevent that.
- the substrate 100 of the present embodiment can correspond to the presence or absence of the reverse connection protection function with the same circuit pattern, and realizes cost reduction.
- the substrate 100 can mount the electronic component 41 shown in FIG. 1 (B).
- the electronic component 41 has a terminal 411 and a terminal 412 on one surface in the Y-axis direction.
- the terminal 411 is a terminal arranged at one end of the electronic component 41 in the X-axis direction.
- the terminal 412 is a terminal arranged at the other end of the electronic component 41 in the X-axis direction.
- the electronic component 41 is mounted by soldering the terminals 411 and 412 to the substrate 100.
- the terminal 411 and the terminal 412 are examples of the soldered portion.
- the electronic component 41 is a surface mount component.
- the electronic component 41 is a diode.
- Terminal 411 is the anode.
- Terminal 412 is a cathode.
- FIG. 2 is a diagram of a substrate 100 showing a lead connection when a reverse connection protection function is provided.
- FIG. 2A is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided.
- FIG. 2B is a side view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided.
- the lead 51 is connected to the substrate 100 and the electronic component 41 is mounted on the substrate 100.
- the lead 51 is covered with a coating 512.
- the lead 51 is stripped of the coating 512 at the other end in the X-axis direction.
- the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 100.
- the area of land 23 is equal to or larger than the area of land 322.
- the electronic component 41 is soldered to the land 22 and the land 321.
- Cream solder is applied to the lands 22 and 321.
- the terminal 411 is placed on the land 22 coated with the cream solder.
- the terminal 412 is placed on the land 321 coated with the cream solder. When heated in this state, the cream solder liquefies.
- the electronic component 41 is surface-mounted at a position determined on the substrate 100 by the balance between the shape of the land 22 and the surface tension of the liquefied cream solder.
- the distance from the land 22 to the land 321 is shorter than the distance from the land 22 to the land 322, and the electronic component 41 can be mounted on the land 22 and the land 321.
- the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
- the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
- the width W1 of the constricted portion 323 is narrower than the width W3 which is the width of the electronic component 41 in the Z-axis direction.
- the width W3 of the electronic component 41 is the width of the terminals 411 and 412 in the Z-axis direction. Therefore, at the time of surface mounting, it is possible to stop the electronic component 41 from being displaced in the X-axis direction due to surface tension at the constricted portion 323, and it is possible to suppress the displacement of the electronic component 41.
- FIG. 3 is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
- FIG. 3B is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
- FIG. 3B is a side view of the substrate 100 showing the connection of leads when the reverse connection protection function is not provided.
- the electronic component 41 is not soldered to the land 321 so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
- FIG. 4 is a plan view of the substrate 100 showing an example different from that of FIG. 1 of the land 32.
- FIG. 4A is a plan view of the substrate 100 showing the copper foil of the land 32 before forming the constricted portion 323.
- FIG. 4B is a plan view of the substrate 100 showing the land 32 after forming the constricted portion 323.
- the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
- the copper foil of the land 32 has a shape having no constricted portion 323 as shown in FIG. 4 (A).
- the constricted portion 323 is formed by covering a part of the copper foil of the land 32 with the solder resist 324a and the solder resist 324b as shown in FIG. 4 (B).
- the solder resist 324a is a solder resist that covers the copper foil on the other side in the Z-axis direction of the constricted portion 323.
- the solder resist 324b is a solder resist that covers the copper foil on one side in the Z-axis direction of the constricted portion 323.
- the constricted portion 323 may have the configuration shown in FIG.
- FIG. 5 is a plan view of the substrate 100 showing an example different from FIGS. 1 and 4 of the land 32.
- the copper foil of the land 32 has a constricted shape, and the constricted portion 323 is exposed without being covered with the solder resist.
- the copper foil of the land 32 has a constricted shape, and the constricted portion 323 is covered with the solder resist 325 and is not exposed.
- the copper foil of the land 32 has a shape without constriction as shown in FIG. 4A, and is covered with the solder resist 325 at a position corresponding to the constricted portion 323 and is not exposed. It may be a configuration.
- the solder resist 325 separates the land 321 and the land 322 in the land 32.
- FIG. 6 is a plan view of the substrate 100 showing another example of the land 32 of FIG.
- the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
- FIG. 7A is a plan view of the substrate 100 showing the connection of leads when the reverse connection protection function is provided in the example of FIG.
- FIG. 7B is a plan view of the substrate 100 showing the connection of leads in the example of FIG. 6 when the reverse connection protection function is not provided.
- the land 321, the land 322, and the constricted portion 323 are provided, and the land 321 and the land 322 are adjacent to each other with the constricted portion 323 in between.
- the land 322 is located on one side in the X-axis direction from the land 321 and on the other side in the X-axis direction from the land 22.
- the land 321 is connected to the wiring 31 on the other side in the X-axis direction.
- the lead 51 is connected to the substrate 100 and the electronic component 41 is mounted.
- the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 100.
- the electronic component 41 is soldered to the land 22 and the land 321.
- the distance from the land 22 to the land 322 is shorter than the distance from the land 22 to the land 321.
- the electronic component 41 can be mounted on the land 22 and the land 321.
- the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
- the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
- the lead 51 when the reverse connection protection function is not provided, the lead 51 is connected to the substrate 100, and the electronic component 41 is not mounted.
- the other end of the lead 51 in the X-axis direction is soldered to the land 322 of the substrate 100.
- the lands 22 are located between the leads 51 and the substrate 100.
- the reverse connection protection function is not provided, the electronic component 41 is not soldered to the land 22, so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
- FIG. 8 is a diagram showing a configuration of a substrate according to a second embodiment of the present invention.
- FIG. 8 is a plan view showing lands and wiring on the substrate.
- the substrate 120 corresponding to the substrate 100 of the first embodiment will be described.
- the surface 120a of the substrate 120 comprises a circuit pattern formed of copper foil. Since the application of the substrate 120 is the same as that of the substrate 100, detailed description thereof will be omitted. Further, the same components as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
- the electronic component 41 when the electronic component 41 is mounted on the substrate 120, the electronic component 41 is oriented so that the terminal 411 is located on the other side in the Z-axis direction and the terminal 412 is located on the other side in the Z-axis direction. Orient it.
- the land 321, the land 322, and the constricted portion 323 are provided, and the land 321 and the land 322 are adjacent to each other with the constricted portion 323 interposed therebetween.
- the land 321 faces the land 22 in the Z-axis direction on one side in the X-axis direction with respect to the land 322.
- the land 322 is connected to the wiring 31 on the other side in the X-axis direction.
- the land 22 is connected to the land 23 on one side in the X-axis direction by wiring 21.
- FIG. 9A is a plan view of the substrate 120 showing the connection of leads when the reverse connection protection function is provided in the example of FIG.
- the lead 51 is connected to the substrate 120 and the electronic component 41 is mounted on the substrate 120.
- the other end of the lead 51 in the X-axis direction is soldered to the land 23 of the substrate 120.
- the electronic component 41 is soldered to the land 22 and the land 321.
- the direction in which the lead 51 extends (one side in the X-axis direction) does not overlap with the electronic component 41. Is.
- the area of land 22 is smaller than the area of land 32. Therefore, the position where the terminal 411 is placed and the position where the terminal 412403 is placed can be distinguished, and it is possible to suppress an error in the orientation of the parts at the time of mounting.
- FIG. 9 (B) is a plan view of the substrate 120 showing the connection of leads in the example of FIG. 8 when the reverse connection protection function is not provided.
- the lead 51 is connected to the substrate 120, and the electronic component 41 is not mounted.
- the other end of the lead 51 in the X-axis direction is soldered to the land 322 of the substrate 120.
- the leads 51 are soldered to the lands 322, the lands 22 and 321 are located between the leads 51 and the substrate 120.
- the reverse connection protection function is not provided, the electronic component 41 is not soldered to the land 22, so that the electronic component 41 does not get in the way when soldering the lead 51 to the land 322. Therefore, the lead connection can be reliably performed when the electronic component 41 is not mounted. Further, in the state where the lead 51 is soldered to the land 322, the lead 51 becomes an obstacle and the electronic component 41 cannot be mounted on the land 22 and the land 321, and erroneous connection can be suppressed.
- the substrate has a land and wiring electrically connected to the land, and an electronic component having two soldering portions is mounted on the substrate so as to be mountable. It has one land and the other land, the other land has a first land on the other side and a second land on the other side adjacent to the first land on the other side, and the area of the one land is The area of the other side land is smaller than the area of the other side land, and the other side first land and the other side second land are adjacent to each other with a constricted portion narrower than the width in which the one side land and the other side land face each other. do.
- the area of the land on one side and the area of the land on the other side are different, it is possible to suppress an error in the orientation of the component at the time of mounting the component on the board. Therefore, it is possible to provide a substrate in which mounting errors of components are unlikely to occur. Further, it is possible to prevent the electronic components mounted straddling the one-side land and the other-side land from being likely to be displaced due to surface tension at the constricted portion, and it is possible to suppress the displacement of the electronic components.
- constricted portion was formed by covering a part of the copper foil constituting the other side land with a solder resist. Therefore, the constricted portion can suppress the displacement of the electronic component.
- constricted portion is covered with a solder resist. Therefore, since the shape of the constricted portion can be freely formed, the work of mounting the component on the board can be easily performed.
- the width of the constricted portion is narrower than the width of the one-side land and the electronic component mounted on the other-side land. Therefore, it is possible to prevent the electronic components mounted straddling the one-side land and the other-side land from being likely to be displaced due to surface tension at the constricted portion, and it is possible to suppress the displacement of the electronic components.
- the area of the first land on the other side is the same as or smaller than the area of the land on the other side. Therefore, it is easy to mount the surface mount component.
- the area of the second land on the other side is larger than the area of the land on the other side. Therefore, a component larger than the surface mount component can be soldered to the second land on the other side.
- the distance from the one-side land to the other-side first land is shorter than the distance from the one-side land to the other-side second land, and the electronic component is the one-side land and the other-side first land. It can be mounted by connecting two lands. Therefore, the distance from the one-side land to the other-side second land can be set as the length of the electronic component, and the area required for the one-side land and the other-side land can be reduced.
- the distance from the one-side land to the other-side first land is longer than the distance from the one-side land to the other-side second land, and the electronic component is the one-side land and the other-side first land. It can be mounted by connecting one land. Therefore, since the second land on the other side is not hidden by the electronic component, the state of the second land on the other side can be visually confirmed.
- the one-side land is connected to the lead land via the one-side wiring.
- the area of the lead land is the same as or larger than the area of the second land on the other side.
- the same lead is soldered to the lead land and the second land on the other side.
- the constricted portion and the other side first land can also be used for soldering the leads, so that the other side second land may be smaller than the lead land. Therefore, the lead land may be larger.
- a lead is soldered to the lead land, an electronic component is soldered to the one-side land and the other-side first land, and the direction in which the lead extends overlaps with the electronic component. It is a direction that does not become. Therefore, even when the electronic component is soldered to the one-side land and the other-side land, it does not interfere with the soldering of the lead to the lead land, and the electronic component is mounted. Lead connection can be made reliably.
- the electronic component is a diode. Therefore, when mounting the diode on the board, it is possible to suppress an error in the orientation of the diode.
- the lead is soldered to the second land on the other side, and has the first land on the other side between the lead and the substrate. Since the electronic component is not soldered to the first land on the other side, the electronic component does not get in the way when soldering the lead to the second land on the other side, and the lead connection when the electronic component is not mounted can be used. You can do it with certainty.
- the lead is soldered to the second land on the other side, and has the one-side land between the lead and the substrate. Since the electronic components are not soldered to the land on one side, the electronic components do not get in the way when soldering the leads to the first land on the other side, ensuring the lead connection when the electronic components are not mounted. Can be done.
- a motor unit including a rotor that rotates along a central axis extending in the axial direction, a stator facing the rotor, and a substrate thereof is provided, and the substrate is the motor portion of the motor unit.
- the motor also rotates the fan. Therefore, in the fan motor, when mounting the component on the board, it is possible to suppress an error in the orientation of the component at the time of mounting.
- it is an axial flow fan and includes the motor and the fan. Therefore, in the axial flow fan, when mounting the component on the board, it is possible to suppress an error in the orientation of the component at the time of mounting.
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Abstract
Description
<全体構成>
図1は、本発明の第1実施形態に係る基板の構成を示す図である。図1(A)は、基板上のランド及び配線を示す平面図である。図1(B)は、図1(A)の基板100に実装される電子部品の側面図である。
図8は、本発明の第2実施形態に係る基板の構成を示す図である。図8は、基板上のランド及び配線を示す平面図である。本実施形態では、第1実施形態の基板100に相当する基板120について説明する。基板120の面120aは、銅箔によって形成された回路パターンを備える。基板120の用途については、基板100と同様であるので詳しい説明は省略する。また、図1と同じ構成には同じ符号を付して詳しい説明を省略する。
できる。
次に、基板100及び120の作用・効果について説明する。
一方側ランドの面積と他方側ランドの面積とが異なることで、基板に部品を実装する際に、実装時の部品の向きの間違いを抑制することが出来る。
このため、部品の実装誤りが生じにくい基板を提供することが出来る。 また、一方側ランドと他方側ランドに跨って実装される電子部品が、表面張力によってずれそうになるのを括れ部で止めることが出来、電子部品のずれを抑制することが出来る。
このため、括れ部により、電子部品のずれを抑制することが出来る。
このため、括れ部の形状を自由に出来るので、基板に部品を実装する作業が容易に出来る。
このため、一方側ランドと他方側ランドに跨って実装される電子部品が、表面張力によってずれそうになるのを括れ部で止めることが出来、電子部品のずれを抑制することが出来る。
このため、面実装部品の実装が容易である。
このため、他方側第2ランドに面実装部品よりも大きな部品を半田付けすることが出来る。
このため、一方側ランドから他方側第2ランドまでの距離を、電子部品の長さとすることが出来、一方側ランド及び他方側ランドに必要な領域が少なくて済む。
このため、他方側第2ランドが電子部品で隠れないので、他方側第2ランドの状態を目視することが出来る。
リード用ランドにリードを半田付けすることで、電子部品を実装する場合のリード接続を確実に行うことが出来る。
リード用ランドと、他方側第2ランドには、同じリードが半田付けされる。他方側ランドでは他方側第2ランドに加えて括れ部と他方側第1ランドもリードの半田付けに使用することが出来るので、他方側第2ランドはリード用ランドよりも小さくても良い。従って、リード用ランドの方が大きくなる場合がある。
このため、一方側ランド及び他方側ランドに電子部品が半田付けされている場合であっても、リード用ランドにリードを半田付けする際の邪魔になることがなく、電子部品を実装する場合のリード接続を確実に行うことが出来る。
このため、基板にダイオードを実装する際に、ダイオードの向きの間違いを抑制することが出来る。
他方側第1ランドに電子部品が半田付けされていないことで、他方側第2ランドにリードを半田付けする際に電子部品が邪魔になることがなく、電子部品を実装しない場合のリード接続を確実に行うことが出来る。
一方側ランドに電子部品が半田付けされていないことで、他方側第1ランドにリードを半田付けする際に電子部品が邪魔になることがなく、電子部品を実装しない場合のリード接続を確実に行うことが出来る。
このため、モータにおいて、基板に部品を実装する際に、実装時の部品の向きの間違いを抑制することが出来る。
このため、ファンモータにおいて、基板に部品を実装する際に、実装時の部品の向きの間違いを抑制することが出来る。
このため、軸流ファンにおいて、基板に部品を実装する際に、実装時の部品の向きの間違いを抑制することが出来る。
100 後部フレーム
101 カバー
200 モータ部
300 前部フレーム
Claims (17)
- ランド及び前記ランドに電気的に接続される配線を有する基板であって、
前記基板上に、半田付け部を2カ所有する電子部品を実装可能に配置された一方側ランドと他方側ランドを有し、
前記他方側ランドは、他方側第1ランドと前記他方側第1ランドに隣接する他方側第2ランドとを有し、
前記一方側ランドの面積は、前記他方側ランドの面積よりも小さく、
前記他方側第1ランドと前記他方側第2ランドは、前記一方側ランドと前記他方側ランドが対向する幅よりも幅狭く括れた括れ部を挟んで隣接する、
基板。 - 前記括れ部は、前記他方側ランドを構成する銅箔の一部が半田レジストで覆われることで形成された、
請求項1に記載の基板。 - 前記括れ部は半田レジストで覆われている、
請求項1又は2に記載の基板。 - 前記括れ部の幅は、前記一方側ランド及び前記他方側ランドに実装される電子部品の幅よりも狭い、
請求項1から3のいずれか1項に記載の基板。 - 前記他方側第1ランドの面積は、前記一方側ランドの面積と同じか、それ以下である、
請求項1から4のいずれか1項に記載の基板。 - 前記他方側第2ランドの面積は、前記一方側ランドの面積よりも大きい、
請求項1から5のいずれか1項に記載の基板。 - 前記一方側ランドから前記他方側第1ランドまでの距離は、前記一方側ランドから前記他方側第2ランドまでの距離よりも短く、
前記電子部品は、前記一方側ランドと前記他方側第1ランドを繋いで実装可能である、
請求項1から6のいずれか1項に記載の基板。 - 前記一方側ランドから前記他方側第1ランドまでの距離は、前記一方側ランドから前記他方側第2ランドまでの距離よりも長く、
前記電子部品は、前記一方側ランドと前記他方側第1ランドを繋いで実装可能である、
請求項1から6のいずれか1項に記載の基板。 - 前記一方側ランドは一方側配線を介してリード用ランドと接続されている、
請求項1から8のいずれか1項に記載の基板。 - 前記リード用ランドの面積は、前記他方側第2ランドの面積と同じか、それよりも大きい、
請求項9に記載の基板。 - 前記リード用ランドにはリードが半田付けされており、
前記一方側ランド及び前記他方側第1ランドには電子部品が半田付けされており、
前記リードが延びる方向は、前記電子部品と重ならない方向である、
請求項9又は10に記載の基板。 - 前記電子部品はダイオードである、
請求項1から11のいずれか1項に記載の基板。 - 前記リードは前記他方側第2ランドに半田付けされており、前記リードと前記基板の間に、前記他方側第1ランドを有する、
請求項1から12のいずれか1項に記載の基板。 - 前記リードは前記他方側第2ランドに半田付けされており、前記リードと前記基板の間に、前記一方側ランドを有する、
請求項1から12のいずれか1項に記載の基板。 - 軸方向に延びる中心軸に沿って回転するロータと、前記ロータと対向するステータと、
を備えるモータ部と、
請求項1から14のいずれか1項に記載の前記基板と、
を備え、
前記基板は、前記モータ部の駆動を行う回路を実装する、
モータ。 - 前記モータは、ファンを回転させる、
請求項15に記載のモータ。 - 請求項16に記載の前記モータと、前記ファンと
を備える、
軸流ファン。
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Citations (9)
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JPS5365973A (en) * | 1976-11-25 | 1978-06-12 | Mitsubishi Electric Corp | Method of producing hyb ic |
JPH01158793A (ja) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | チップ部品取付装置 |
JPH024278U (ja) * | 1988-06-22 | 1990-01-11 | ||
JPH033770U (ja) * | 1989-05-31 | 1991-01-16 | ||
JPH05102648A (ja) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | プリント基板 |
JPH06350243A (ja) * | 1993-06-07 | 1994-12-22 | Nippondenso Co Ltd | 印刷配線基板 |
JP2004153143A (ja) * | 2002-10-31 | 2004-05-27 | Kubota Corp | 電子回路基板 |
WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
JP2019204863A (ja) * | 2018-05-23 | 2019-11-28 | ミネベアミツミ株式会社 | 回路基板、モータユニット、およびファン |
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- 2021-10-28 CN CN202180079314.3A patent/CN116508399A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039877 patent/WO2022113639A1/ja active Application Filing
- 2021-10-28 JP JP2022565156A patent/JPWO2022113639A1/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5365973A (en) * | 1976-11-25 | 1978-06-12 | Mitsubishi Electric Corp | Method of producing hyb ic |
JPH01158793A (ja) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | チップ部品取付装置 |
JPH024278U (ja) * | 1988-06-22 | 1990-01-11 | ||
JPH033770U (ja) * | 1989-05-31 | 1991-01-16 | ||
JPH05102648A (ja) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | プリント基板 |
JPH06350243A (ja) * | 1993-06-07 | 1994-12-22 | Nippondenso Co Ltd | 印刷配線基板 |
JP2004153143A (ja) * | 2002-10-31 | 2004-05-27 | Kubota Corp | 電子回路基板 |
WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
JP2019204863A (ja) * | 2018-05-23 | 2019-11-28 | ミネベアミツミ株式会社 | 回路基板、モータユニット、およびファン |
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