WO2022099994A1 - 一种显示背板的检测方法及检测结构 - Google Patents

一种显示背板的检测方法及检测结构 Download PDF

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Publication number
WO2022099994A1
WO2022099994A1 PCT/CN2021/087091 CN2021087091W WO2022099994A1 WO 2022099994 A1 WO2022099994 A1 WO 2022099994A1 CN 2021087091 W CN2021087091 W CN 2021087091W WO 2022099994 A1 WO2022099994 A1 WO 2022099994A1
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WO
WIPO (PCT)
Prior art keywords
detection
display backplane
contact electrode
row
light
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PCT/CN2021/087091
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English (en)
French (fr)
Inventor
王广
徐瑞林
林建宏
Original Assignee
重庆康佳光电技术研究院有限公司
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Application filed by 重庆康佳光电技术研究院有限公司 filed Critical 重庆康佳光电技术研究院有限公司
Priority to US17/533,716 priority Critical patent/US20220148929A1/en
Publication of WO2022099994A1 publication Critical patent/WO2022099994A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Definitions

  • the present application relates to the technical field of display devices, and in particular, to a detection method and detection structure of a display backplane.
  • LED Light Emitting Diode
  • the contact electrode pair on the display backplane may have dead points during the manufacturing process, resulting in defects in the display effect of the final display panel.
  • the existing Micro LED display panel testing methods mainly detect whether the LED chips after mass transfer can be It is complicated and inconvenient to use light to judge whether there is a dead pixel, and the repeated welding of LED chips increases the difficulty of operation and also increases the time cost.
  • the purpose of the present application is to provide a detection method and a detection structure for a display backplane, which aim to quickly detect the dead pixels on the display backplane and save the time and cost of manufacturing the display backplane.
  • a detection method for a display backplane comprising: providing a display backplane on which multiple sets of contact electrode pairs are arranged, the contact electrode pairs comprising input electrodes and output electrodes; providing a display backplane A detection structure, the detection structure includes a plurality of light-emitting elements and a plurality of detection circuits, at least one of the light-emitting elements is arranged between each two of the detection circuits, and the detection circuit is used to conduct the light-emitting elements electrical signal; assemble the detection structure on the display back panel, so that a piece of the detection circuit is connected to the input electrode in one group of the contact electrode pair and the adjacent other group of the contact electrode pair at the same time The output electrode is connected to the display backplane; if the light-emitting element does not emit light, it is determined that the contact electrode pair of the group to which the input electrode connected to the detection circuit belongs is bad point.
  • the method for detecting a display backplane wherein after outputting a driving electrical signal to the display backplane, the method further comprises: if the light-emitting element emits light, determining the group to which the input electrodes connected to the detection circuit belong.
  • the contact electrode pair works normally.
  • the method for detecting a display backplane, wherein a plurality of groups of the contact electrode pairs are distributed in rows, and the outputting a driving electrical signal to the display backplane specifically includes: outputting a driving electrical signal to the contact electrode pairs row by row .
  • the method for detecting a display backplane wherein the outputting a driving electrical signal to the detecting circuit specifically includes: turning on positive electrical signals row by row to the detection circuits of odd-numbered strips, so that the detection circuits of even-numbered strips of The circuit conducts the negative electric signal row by row; conducts the positive electric signal row by row to the even-numbered detection circuits, so that the odd-numbered detection circuits conducts the negative electric signal row by row.
  • the method for detecting a display backplane wherein the assembling the detecting structure on the display backplane specifically includes: applying glue on the side where the contact electrode pair is arranged on the display backplane, forming a connection layer; covering the detection structure on the connection layer, and the connection layer adheres and fixes the detection structure on the display backplane.
  • the method for detecting a display backplane wherein the applying glue on the side where the contact electrode pair is arranged on the display backplane specifically includes: the adjacent contact electrodes on the display backplane Apply glue to the positions in between.
  • the detection method of the display backplane wherein the detection method further comprises: washing the display backplane with a cleaning agent, removing the connection layer, and removing the detection structure.
  • the detection method of the display backplane wherein the assembling the detection structure on the display backplane specifically includes: covering the detection structure on the display backplane and setting the contact electrodes The opposite side; applying pressure to the detection structure in the direction of covering and closing, so as to fix the detection structure and the display backplane.
  • the detection method of the display backplane wherein a first positioning structure is provided on the side of the detection structure facing the display backplane; a first positioning structure is provided on the display backplane opposite to the first positioning structure.
  • Two positioning structures when the first positioning structure is aligned with the second positioning structure, the detection circuit is aligned with the adjacent two sets of the contact electrode pairs; the detection circuit is aligned with the contact electrode pair Before the connection, the method further includes: moving the detection structure above the display backplane to align the first positioning structure with the second positioning structure.
  • the detection method for the display backplane wherein the contact electrode pairs are arranged side by side on the display backplane at equal intervals, and the distance between two adjacent groups of the contact electrode pairs is d; the input The widths of the electrodes and the output electrodes are both b; the width of the detection circuit is greater than d and less than or equal to 2b+d.
  • the present application also discloses a detection structure for a display backplane, which is used in any of the above-mentioned detection methods for a display backplane, wherein the detection structure includes: a substrate, a plurality of light-emitting elements, and a plurality of detection circuits; The light-emitting element is arranged on the substrate; the detection circuit is arranged on the substrate, and each two of the detection circuits is connected to one of the light-emitting elements for receiving the driving electrical signal and transmitting the driving electrical signal to the luminous pieces.
  • the detection structure of the display backplane wherein the detection circuit and the light-emitting element are respectively arranged on both sides of the substrate, the substrate is further provided with through holes, and the detection circuit passes through the through holes Connect the light-emitting element.
  • the detection structure is covered on the display backplane, and the detection circuit is connected to the contact electrode pair.
  • the detection circuits of odd columns are connected to the input electrodes on the contact electrode pairs of odd columns and the output electrodes of the contact electrode pairs of even columns;
  • the detection circuits of even columns are connected to the input electrodes of the contact electrode pairs of even columns and the contact electrodes of odd columns It directly detects whether the contact electrode pairs of odd-numbered and even-numbered columns on the display backplane have dead points by successively feeding electrical signals to the display backplane in a forward direction and a reverse direction.
  • the detection method is accurate and efficient, and The steps are simple and save time.
  • FIG. 1 is a schematic structural diagram of an LED chip in the application.
  • FIG. 2 is a schematic structural diagram of a display backplane in the present application.
  • FIG. 3 is a schematic diagram of a part of the structure of the display panel in the present application.
  • FIG. 4 is a flow chart of the detection method in the application.
  • FIG. 5 is a partial structural perspective view of the detection structure and the display backplane in the present application.
  • FIG. 6 is an enlarged view of a part of the structure at A in FIG. 5 .
  • FIG. 7 is a side view along the x-direction in FIG. 5 .
  • FIG. 8 is a side view along the y direction in FIG. 5 .
  • FIG. 9 is a schematic diagram of a part of the structure of the display backplane in the present application.
  • FIG. 10 is another perspective view of a partial structure of the detection structure and the display backplane in the present application.
  • detection structure 11, substrate; 12, light-emitting element; 13, detection circuit; 20, display backplane; 21, contact electrode pair; 211, input electrode; 212, output electrode; 22, planarization layer; 23 , circuit layer; 24, lower substrate; 30, connecting layer.
  • Micro LED displays as the mainstream of new types of displays, have good stability, long life, and advantages in operating temperature, and also inherit the low power consumption, color saturation, and fast response speed of LEDs. , strong contrast and other advantages, has great application prospects.
  • Common Micro LED displays generally use flip-chip LED chips, as shown in Figure 1, wherein the first semiconductor layer 1 can be an N/P-type doped GaN layer, the light-emitting layer 2 can be a quantum well layer; the second semiconductor layer 1 can be a quantum well layer; The layer 3 may be a P/N type doped GaN layer; the first electrode 4 and the second electrode 5 are conductive materials such as metal. When an electrical signal is applied to the first electrode 4 and the second electrode 5, electrons in the N-type semiconductor and holes in the P-type semiconductor violently collide and recombine in the light-emitting layer to generate photons, which emit energy in the form of photons.
  • Materials of the first electrode 4 and the second electrode 5 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium ( Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum, titanium (Ti), tungsten (W) or copper (Cu), etc.
  • a common display backplane carrying LED chips may include a display substrate 6 , a circuit layer 7 and a planarization layer 8 .
  • the display substrate 6 may include a transparent glass material, such as silicon dioxide (SiO 2 ).
  • the display substrate 6 may also include a transparent plastic material, such as: polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene terephthalate (PEN), polyester Ethylene phthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC) or cellulose propionate (CAP) ) and other organic materials.
  • PES polyethersulfone
  • PAR polyacrylate
  • PEI polyetherimide
  • PEN polyethylene terephthalate
  • PET polyester Ethylene phthalate
  • PPS polyphenylene sulfide
  • PC cellulose triacetate
  • CAP cellulose propionate
  • the circuit layer 7 includes a driving circuit for driving the LED chip, such as a thin film transistor TFT, a gate line, a signal line, and the like.
  • a driving circuit for driving the LED chip such as a thin film transistor TFT, a gate line, a signal line, and the like.
  • the planarization layer 8 covers the circuit layer, which can eliminate the step difference on the circuit layer 7 and make it planarized.
  • the planarization layer 8 may include organic materials such as: polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives with phenolic groups, acryl-based polymers, imide-based polymers , aryl ether-based polymers, amide-based polymers, fluorine-based polymers, para-xylylene-based polymers, vinyl alcohol-based polymers, or any combination thereof.
  • PMMA polymethyl methacrylate
  • PS polystyrene
  • the driving circuit may include input electrodes and output electrodes, which may be disposed on the surface of the planarization layer 8 to pass the filling material in the through holes on the planarization layer 8 and the signal lines, gate lines (gate lines) in the circuit layer 7 .
  • the polar lines can send on/off signals to the thin film transistor TFT) connection.
  • the input electrode and the output electrode are respectively bonded with the first electrode and the second electrode on the LED chip.
  • the materials of the input electrodes, output electrodes, filling materials in the through holes, signal lines, and gate lines may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au) ), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum, titanium (Ti), tungsten (W) or copper (Cu), etc.
  • the structure of the Micro LED display panel can be refined as follows, and the circuit layer can specifically include: a buffer layer, a gate insulating layer, an interlayer insulating layer, a TFT, and a gate line contact point, etc.
  • the buffer layer is disposed above the substrate, which can provide a substantially flat surface above the substrate, and can reduce or prevent foreign matter or moisture from penetrating the substrate.
  • the buffer layer may include inorganic materials such as: silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), aluminum nitride (AlN), titanium oxide (TiO2), or nitride Titanium (TiN).
  • the buffer layer may also include organic materials such as: polyimide, polyester or acrylic.
  • the thin film transistor TFT may include an active layer, a gate electrode, a source electrode and a drain electrode.
  • the thin film transistor TFT is a top-gate thin film transistor (actually TFT may also be a bottom-gate thin film transistor).
  • the active layer may include a semiconductor material such as amorphous silicon or polysilicon.
  • the active layer may also include other materials, such as organic semiconductor materials or oxide semiconductor materials.
  • the gate/source/drain may include low resistance metal materials such as: aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni) ), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu), etc.
  • low resistance metal materials such as: aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni) ), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu), etc.
  • the gate insulating layer is used to insulate the gate and the active layer, and can include inorganic materials, such as SiO2, SiNx, SiON, Al2O3, TiO2, tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO2), etc. .
  • the interlayer insulating layer is used to insulate between the source electrode and the gate electrode and between the drain electrode and the gate electrode.
  • the interlayer insulating layer may include inorganic materials, such as: SiO2, SiNx, SiON, Al2O3, TiO2, tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO2).
  • the gate line contact point may be formed on one of a plurality of insulating films arranged under the planarization layer. It may be formed over the interlayer insulating layer/gate insulating layer.
  • the existing Micro LED display panel includes several pixel regions (SPRs), and each pixel region SPR includes red LED, blue LED, and green LED chips. As shown in FIG. 3 , during the manufacturing process of the display, three LED chips of red, green and blue need to be transferred from their respective growth substrates to the display backplane. However, if any LED chip is damaged/poor contact (the position shown by "X" in the figure), after transfer, it will show a dead point on the display panel, which will affect the imaging effect.
  • the width direction of the display backplane involved in the embodiments of the present application is the direction along the x-axis in FIG. 5
  • the length direction of the display backplane is the direction along the y-axis in FIG. 5 .
  • the light-emitting element involved in this embodiment may be an LED chip, or may be one or more of a Micro LED chip, a mini LED chip, or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) chip; in addition, , the substrate 11 is a printed circuit board (Printed Circuit Board, PCB board).
  • a printed circuit board Printed Circuit Board, PCB board
  • an embodiment of the present application discloses a detection method for a display backplane 20 , wherein the detection method includes: S100 , providing a display backplane 20 on which a plurality of sets of contacts are arranged An electrode pair 21, the contact electrode pair 21 includes an input electrode 211 and an output electrode 212; S200, a detection structure 10 is provided, the detection structure 10 includes a plurality of light-emitting elements 12, and a plurality of detection circuits 13, each of which is At least one of the light-emitting elements 12 is arranged between the detection circuits 13, and the detection circuit 13 is used to conduct electrical signals to the light-emitting elements 12; S300, assemble the detection structure 10 to the display backplane 20 on, connect one of the detection circuits 13 to the input electrodes 211 in one group of the contact electrode pairs 21 and the output electrodes 212 in the adjacent another group of the contact electrode pairs 21 at the same time; S400, Output a driving electrical signal to the display backplane 20; S500,
  • the detection structure 10 is covered on the display backplane 20, and the detection circuit 13 is connected to the contact electrode pair 21. Since the detection circuit 13 is simultaneously connected to the opposite input electrodes of the adjacent two groups of the contact electrode pairs 21 211 is connected to the output electrode 212, so the detection circuit 13 of the odd column is connected to the input electrode 211 on the contact electrode pair 21 of the odd column and the output electrode 212 of the contact electrode pair 21 of the even column; the detection circuit 13 of the even column is connected to the even column.
  • one detection circuit 13 covers the two sets of contact electrode pairs 21 at the same time, so the width is relatively large, which is more convenient to complete in the manufacturing process, reduces the manufacturing difficulty of the detection structure 10, and at the same time the detection circuit 13 has a larger width , which can be used to detect the display backplane 20 with smaller pixel size, and has wider application prospects.
  • the method further includes: if the light-emitting element 12 emits light, determining that the detection circuit 13 is connected to the The contact electrode pair 21 of the group to which the input electrode 211 belongs works normally.
  • a plurality of groups of the contact electrode pairs 21 are distributed in a row, and the outputting a driving electrical signal to the display backplane 20 specifically includes: row by row to the contact electrodes The pair 21 outputs a driving electric signal.
  • the contact electrode pair 21 on a single row first output the driving electrical signal in the forward direction, check whether the contact electrode pair 21 in the odd-numbered column of the row is working normally, and then output the driving electrical signal in the reverse direction to detect whether the contact electrode pair 21 in the even-numbered column of the row is normal. In this way, the contact electrode pairs 21 are detected row by row, the detection accuracy is high, and it is convenient to quickly find the exact position of the damaged part.
  • the outputting driving electrical signals to the detection circuits 13 specifically includes: turning on the positive electrical signals row by row to the detection circuits 13 of the odd-numbered strips to make the even-numbered detection circuits 13 turn on the positive electrical signals row by row.
  • the detection circuits 13 of the strips conduct negative electric signals row by row; the detection circuits 13 of the even-numbered strips conduct positive electric signals row by row, so that the detection circuits 13 of the odd-numbered strips conduct the negative electric signals row by row.
  • the detection circuits 13 are simultaneously connected to the opposite input electrodes 211 and output electrodes 212 in the adjacent two groups of the contact electrode pairs 21 , the detection circuits 13 in odd columns are connected to the input electrodes 211 and the phase electrodes on the contact electrode pairs 21 in odd columns.
  • the output electrode 212 works normally as the output end of the light-emitting element 12 , while the input electrode 211 on the contact electrode pair 21 in the even-numbered row receives a negative electrical signal and is in an open-circuit state, and the detection structure 10 only detects whether the contact electrode pair 21 in the odd-numbered row is damaged.
  • the detection structure 10 can detect whether the contact electrode pairs 21 in the even-numbered rows have dead points. Through the forward and reverse detections, it is convenient and quick to directly detect whether the row of contact electrode pairs 21 on the display backplane 20 has a dead point, and the operation is simple. In addition, the detection structure 10 can be quickly removed to directly perform maintenance on the display backplane 20, thereby shortening the maintenance process.
  • the assembly of the detection structure 10 on the display backplane 20 specifically includes: disposing the detection structure 10 on the display backplane 20 .
  • One side of the contact electrode pair 21 is glued to form a connection layer 30; the detection structure 10 is covered on the connection layer 30, and the connection layer 30 adheres and fixes the detection structure 10 on the display backplane 20 on.
  • connection layer 30 is provided to fix the detection structure 10; if it is inclined or In order to prevent the display back plate 20 vertically, the connection layer 30 is required to fix the detection structure 10 , so that the detection work can be performed stably and effectively, and the detection accuracy can be improved.
  • the connection layer 30 can be set as a photoresist layer, which has a good connection effect, and is convenient for subsequent cleaning by a developing solution without residue.
  • applying glue on the side where the contact electrode pair 21 is arranged on the display backplane 20 specifically includes: applying glue on the display backplane 20 .
  • Glue is applied to the positions between the adjacent pairs of contact electrodes 21 on the 20 .
  • the plurality of groups of contact electrode pairs 21 are all protruding from the display backplane 20, so when they are in contact with the detection structure 10, the contact surface is easily deformed, so that the connection between the detection circuit 13 and the contact electrode pairs 21 is not stable enough. In the vicinity of the contact electrode pair 21 , the influence of this deformation is greatly reduced, and the stability of the connection between the detection structure 10 and the display backplane 20 is further increased.
  • connection layer 30 is provided between the detection circuit 13 and the display backplane 20, which can save materials to a greater extent; and is provided between the adjacent contact electrode pairs 21.
  • the connection layer 30 makes the connection between the contact electrode pair 21 of each group and the detection circuit 13 relatively tight, reduces the possibility of loose connection, and makes the transmission of electrical signals in the detection process more accurate and smooth.
  • the detection method further includes: washing the display backplane 20 with a cleaning agent, removing the connection layer 30 , and removing the detection structure 10 .
  • connection layer 30 is a photoresist layer
  • a cleaning agent can be selected as a developing solution, and the photoresist layer is completely cleaned by the developing solution without damaging the display backplane 20 or the detection structure 10, which is convenient for display
  • the backplane 20 undergoes subsequent manufacturing steps, and the detection structure 10 can also continue to perform the next detection.
  • the assembling of the detection structure 10 on the display backplane 20 specifically includes: covering the detection structure 10 on the display backplane One side of the contact electrode pair 21 is arranged on the 20 ; pressure is applied to the detection structure 10 in the direction of closing to fix the detection structure 10 and the display backplane 20 .
  • the detection structure 10 and the display backplane 20 are fixed by applying pressure, which is simple, direct, and easy to control. After the detection is completed, the pressure can be quickly removed, and the detection structure 10 and the display backplane 20 can be quickly separated, which is convenient for timely maintenance, or made in the next step. step.
  • a first positioning structure is provided on the side of the detection structure 10 facing the display backplane 20; the display backplane 20 is connected to the first positioning structure
  • a second positioning structure is provided at a position opposite to the structure.
  • the first positioning structure and the second positioning structure preferably, can be arranged on the side of the detection structure 10 and the display backplane 20, so that the detection circuit 13 and the contact electrode pair 21 can be determined by observing the first positioning structure and the second positioning structure. Whether it is aligned or not, it is convenient for subsequent detection work to be carried out smoothly and accurately.
  • the contact electrode pairs 21 are arranged side by side on the display backplane 20 at equal intervals, and the distance between adjacent two groups of the contact electrode pairs 21 is disclosed. is d; the widths of the input electrodes 211 and the output electrodes 212 are both b; the width of the detection circuit 13 is greater than d and less than or equal to 2b+d.
  • the detection circuit 13 Because the detection structure 10 is not moved during detection, the detection circuit 13 needs to be able to contact the adjacent contact electrode pairs 21 at the same time, so the width of the detection circuit 13 needs to be greater than d to ensure that two adjacent contact electrode pairs 21 can be in contact; However, the input electrodes 211 and the output electrodes 212 of a group of contact electrode pairs 21 need to be independent of each other. If the detection circuit 13 conducts the input electrodes 211 and output electrodes 212 of a group of contact electrode pairs 21, it will cause the contact The electrode pair 21 is short-circuited, which directly causes damage, so the width of the detection circuit 13 is set to be less than or equal to 2b+d.
  • the detection method disclosed in this embodiment can quickly determine whether there is a dead pixel on the display backplane 20 by separately detecting the working state of the contact electrode pairs 21 in odd columns and the working state of the contact electrode pairs 21 in even columns.
  • the electric signal is turned on to the display backplane 20 in the row direction, and the contact electrode pairs 21 of the odd-numbered columns of the row are detected when the forward conduction is conducted, and the contact electrode pairs 21 of the even-numbered columns of the row are detected during the reverse conduction, and the light-emitting elements 12F1, F2, F3, For the light-emitting conditions of F4 and F5, for example, when the light-emitting element 12F3 does not light up in the forward conduction of row a in FIG.
  • the contact electrode pair 21 at the “ ⁇ ” in the corresponding figure is a dead pixel; the detection method disclosed in this embodiment The method does not need to wait until the LED chip is welded and then inspected, which reduces the steps of removing the LED chip after inspection, which is more convenient to operate, and saves inspection and maintenance time.
  • the present application also discloses a detection structure 10 of a display backplane 20, which is used for the detection method of a display backplane 20 as described above, wherein the detection structure 10 includes: a substrate 11, a plurality of light-emitting elements 12 and A plurality of detection circuits 13; the light-emitting elements 12 are arranged on the substrate 11; the detection circuits 13 are arranged on the substrate 11, and every two detection circuits 13 are connected to one of the light-emitting elements 12, for receiving the driving electrical signal and transmitting the driving electrical signal to the light-emitting element 12 .
  • the substrate 11 is covered on the display backplane 20 , and the detection circuit 13 is connected to the contact electrode pair 21 to directly detect the display backplane 20 .
  • two side detection circuits 13 are respectively provided at both ends of the detection structure 10 .
  • the two side detection circuits 13 are respectively connected to the input electrode 211 on the outermost contact electrode pair 21 at one end and the output electrode 212 on the outermost contact electrode pair 21 at the other end, so that the detection At the same time, the outermost contact electrode pair 21 at both ends can also form a circuit loop to complete the detection.
  • the display backplane 20 includes a lower substrate 24 , a circuit layer 23 and a planarization layer 22 , and the detection circuit 13 and the The light-emitting elements 12 are respectively disposed on both sides of the substrate 11 , the substrate 11 is further provided with through holes, and the detection circuit 13 is connected to the light-emitting elements 12 through the through holes.
  • the light-emitting element 12 is disposed on the side away from the display backplane 20.
  • the detection structure 10 When the detection structure 10 is covered first, the light-emitting element 12 will not touch the display backplane 20 to prevent bumping; the planarization layer 22 has The insulating properties can also prevent the detection circuit from contacting the circuit layer 23 on the lower substrate 24.
  • the display backplane 20 when the display backplane 20 is placed upward, the detection structure 10 is covered on the display backplane 20, and the light-emitting element 12 emits light upwards, which is convenient for human beings. By eye observation, it is convenient to judge whether the light-emitting element 12 emits light, and the accuracy of judgment is improved.
  • Electrode pair 21 a piece of the detection circuit 13 is respectively connected to the input electrode 211 in one row of the contact electrode pair 21 and the output electrode 212 in another adjacent row of the contact electrode pair 21 .
  • one detection circuit 13 connects a plurality of input electrodes 211 and a plurality of output electrodes 212.
  • inputting electrical signals row by row can use two adjacent detection circuits 13 to detect the contact of the entire column.
  • the working state of the electrode pair 21 reduces the wiring on the detection structure 10, which is convenient for support, and it is very convenient during detection, and there is no need to adjust the connection point of the detection circuit 13 many times; In this way, the entire row of contact electrode pairs 21 can be detected, the number of light-emitting elements 12 can be saved, and the cost of the detection structure 10 can be reduced.

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Abstract

本申请公开了一种显示背板的检测方法及检测结构，其中，提供一显示背板，所述显示背板上设置多组接触电极对，所述接触电极对包括输入电极和输出电极；提供一检测结构，所述检测结构包括多个发光件，以及多条检测电路，每两条所述检测电路之间设有至少一个所述发光件，所述检测电路用于给所述发光件导通电信号；将所述检测结构装配到所述显示背板上，使一条所述检测电路同时与一组所述接触电极对中的所述输入电极和相邻的另一组所述接触电极对中的所述输出电极连接；向所述显示背板输出驱动电信号；若所述发光件不发光，则确定所述检测电路连接的所述输入电极所属的该组所述接触电极对为坏点。

Description

一种显示背板的检测方法及检测结构
本申请要求于2020年11月11日提交中国专利局、申请号为202011257074.5、申请名称为“一种显示背板的检测方法及检测结构”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及显示设备技术领域，特别是涉及一种显示背板的检测方法及检测结构。
 背景技术
目前，人们日常生活中电子产品的使用极其普遍，电子显示屏的技术也不断被研发创新，发光二极管（Light Emitting Diode，LED）技术的成熟更推进了显示面板的使用，特别是Micro LED显示器的使用逐渐占领市场。现有技术中都是在显示背板上制成接触电极对，并在接触电极对上焊接LED芯片从而制成显示面板的。
但是，显示背板上接触电极对在制成过程中可能出现坏点，致使最终显示面板的显示效果出现缺陷，现有的Micro LED显示面板检测方法主要通过检测巨量转移之后的LED芯片能否发光来判断是否有坏点，操作复杂不方便，而且反复焊接LED芯片增加操作难度，还增加时间成本。
因此，现有技术还有待于改进和发展。
 技术问题
鉴于上述现有技术的不足，本申请的目的在于提供一种显示背板的检测方法及检测结构，旨在迅速检测出显示背板上的坏点，节约制造显示背板的时间成本。
 技术解决方案
本申请的技术方案如下。
一种显示背板的检测方法，其中，所述检测方法包括：提供一显示背板，所述显示背板上设置多组接触电极对，所述接触电极对包括输入电极和输出电极；提供一检测结构，所述检测结构包括多个发光件，以及多条检测电路，每两条所述检测电路之间设有至少一个所述发光件，所述检测电路用于给所述发光件导通电信号；将所述检测结构装配到所述显示背板上，使一条所述检测电路同时与一组所述接触电极对中的所述输入电极和相邻的另一组所述接触电极对中的所述输出电极连接；向所述显示背板输出驱动电信号；若所述发光件不发光，则确定所述检测电路连接的所述输入电极所属的该组所述接触电极对为坏点。
所述的显示背板的检测方法，其中，所述向所述显示背板输出驱动电信号之后，还包括：若所述发光件发光，则确定检测电路连接的所述输入电极所属的该组所述接触电极对工作正常。
所述的显示背板的检测方法，其中，多组所述接触电极对成行分布，所述向所述显示背板输出驱动电信号，具体包括：逐行向所述接触电极对输出驱动电信号。
所述的显示背板的检测方法，其中，所述向所述检测电路输出驱动电信号，具体包括：向奇数条的所述检测电路逐行导通正电信号，使偶数条的所述检测电路逐行导通负电信号；向偶数条的所述检测电路逐行导通正电信号，使奇数条的所述检测电路逐行导通负电信号。
所述的显示背板的检测方法，其中，所述将所述检测结构装配到所述显示背板上，具体包括：在所述显示背板上设置所述接触电极对的一侧涂胶，形成连接层；将所述检测结构盖设在所述连接层上，所述连接层将所述检测结构粘连固定在所述显示背板上。
所述的显示背板的检测方法，其中，所述在所述显示背板上设置所述接触电极对的一侧涂胶，具体包括：在所述显示背板上相邻的所述接触电极对之间的位置涂胶。
所述的显示背板的检测方法，其中，所述检测方法还包括：使用清洗剂冲洗所述显示背板，去除所述连接层，取下所述检测结构。
所述的显示背板的检测方法，其中，所述将所述检测结构装配到所述显示背板上，具体包括：将所述检测结构盖设在所述显示背板上设置所述接触电极对的一侧；沿盖合的方向向所述检测结构施加压力，以固定所述检测结构和所述显示背板。
所述的显示背板的检测方法，其中，所述检测结构上朝向所述显示背板的一侧设置第一定位结构；所述显示背板上与所述第一定位结构相对的位置设置第二定位结构，所述第一定位结构与所述第二定位结构对齐时，所述检测电路与相邻的两组所述接触电极对对齐；所述将所述检测电路与所述接触电极对连接之前，还包括：将所述检测结构移动到所述显示背板上方，使所述第一定位结构与所述第二定位结构对齐。
所述的显示背板的检测方法，其中，所述接触电极对等间距地并列排布在所述显示背板上，相邻两组所述接触电极对之间的间距为d；所述输入电极和所述输出电极的宽度均为b；所述检测电路的宽度大于d，并且小于或者等于2b+d。
本申请还公开了一种显示背板的检测结构，用于如上任一所述的显示背板的检测方法，其中，所述检测结构包括：基板、多个发光件和多条检测电路；所述发光件设于所述基板上；所述检测电路设于所述基板上，每两条所述检测电路与一个所述发光件连接，用于接收驱动电信号，并将驱动电信号传输给发光件。
所述的显示背板的检测结构，其中，所述检测电路与所述发光件分别设置于所述基板两侧，所述基板上还设有通孔，所述检测电路穿过所述通孔连接所述发光件。
 有益效果
本申请公开的检测方法通过将检测结构盖设到显示背板上，检测电路连接接触电极对，由于检测电路同时与相邻两组所述接触电极对中相对的输入电极和输出电极连接，所以奇数列的检测电路连接奇数列的接触电极对上的输入电极和偶数列的接触电极对上的输出电极；偶数列的检测电路连接偶数列的接触电极对上的输入电极和奇数列的接触电极对上的输出电极；通过依次向显示背板正向通入电信号和逆向通入电信号直接检测显示背板上奇数列和偶数列的接触电极对是否有坏点，检测方式准确高效，而且步骤简单，更加节约时间。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请中LED芯片的结构示意图。
图2为本申请中显示背板的结构示意图。
图3为本申请中显示面板的部分结构示意图。
图4为本申请中检测方法的流程图。
图5为本申请中检测结构和显示背板的部分结构透视图。
图6为图5中A处的局部结构放大图。
图7沿图5中x方向的侧视图。
图8为沿图5中y方向的侧视图。
图9为本申请中显示背板的部分结构示意图。
图10为本申请中检测结构和显示背板的部分结构另一透视图。
其中，10、检测结构；11、基板；12、发光件；13、检测电路；20、显示背板；21、接触电极对；211、输入电极；212、输出电极；22、平坦化层；23、电路层；24、下基板；30、连接层。
 本发明的实施方式
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
现有技术中，Micro LED显示器作为现在新型显示器的主流，具有良好的稳定性，较长的寿命，以及运行温度上的优势，同时也承继了LED的低功耗、色彩饱和度、反应速度快、对比度强等优点，具有极大的应用前景。
常见的Micro LED显示器一般采用倒装型的LED芯片，如图1所示，其中，第一半导体层1可以是N/P型掺杂GaN层，发光层2可以是量子阱层；第二半导体层3可以是P/N型掺杂GaN层；第一电极4和第二电极5为金属等导电材料。向第一电极4和第二电极5施加电信号时，N型半导体内的电子与P型半导体内的空穴在发光层剧烈地碰撞复合产生光子，以光子的形式发出能量。第一电极4和第二电极5的材料可包括铝（Al）、铂（Pt）、钯（Pd）、银（Ag）、镁（Mg）、金（Au）、镍（Ni）、钕（Nd）、铱（Ir）、铬（Cr）、锂（Li）、钙（Ca）、钼、钛（Ti）、钨（W）或铜（Cu）等。
如图2所示，常见的承载LED芯片的显示背板可以包括显示基板6、电路层7和平坦化层8。其中，显示基板6可以包括透明玻璃材料，如：二氧化硅（SiO2）。显示基板6也可以包括透明塑料材料，如：聚醚砜（PES）、聚丙烯酸酯（PAR）、聚醚酰亚胺（PEI）、聚对苯二甲酸乙二醇酯（PEN）、聚对苯二甲酸乙二醇酯（PET）、聚苯硫醚（PPS）、聚芳酯、聚酰亚胺、聚碳酸酯（PC）、三醋酸纤维素（TAC）或丙酸纤维素酯（CAP）等有机材料。
其中，电路层7包括有用于驱动LED芯片的驱动电路，比如：薄膜晶体管TFT、栅极线、信号线等。
其中，平坦化层8覆盖电路层，可以消除电路层7上的阶跃差，使之平坦化。平坦化层8可以包括有机材料，如：聚甲基丙烯酸甲酯（PMMA）或聚苯乙烯（PS），具有酚基基团的聚合物衍生物，丙烯基聚合物，酰亚胺基聚合物，芳醚基聚合物，酰胺基聚合物，氟基聚合物，对二甲苯基聚合物，乙烯醇基聚合物，或其任何组合。
其中，驱动电路中可包括输入电极和输出电极，可以设置于平坦化层8表面，用于通过平坦化层8上通孔内的填充材料与电路层7中的信号线、栅极线（栅极线可以向薄膜晶体管TFT发送开/关信号）连结。输入电极和输出电极，分别与LED芯片上的第一电极、第二电极键合。输入电极、输出电极、通孔内填充材料、信号线、栅极线的材料可包括铝（Al）、铂（Pt）、钯（Pd）、银（Ag）、镁（Mg）、金（Au）、镍（Ni）、钕（Nd）、铱（Ir）、铬（Cr）、锂（Li）、钙（Ca）、钼、钛（Ti）、钨（W）或铜（Cu）等。
具体来说，Micro LED显示面板的结构可以细化如下，电路层可具体包括：缓冲层、栅极绝缘层、层间绝缘层、TFT以及栅极线接触点等。
其中，缓冲层设置在基板上方，可在基板上方提供基本平坦的表面，可以减少或防止异物或湿气穿透基板。缓冲层可以包括无机材料，如：氧化硅（SiO2）、氮化硅（SiNx）、氮氧化硅（SiON）、氧化铝（Al2O3）、氮化铝（AlN）、氧化钛（TiO2）或氮化钛（TiN）。缓冲层也可以包括有机材料，如：聚酰亚胺、聚酯或丙烯。
其中，薄膜晶体管TFT可以包括有源层、栅极、源极和漏极。图中，薄膜晶体管TFT是顶栅型薄膜晶体管（实际上TFT也可以是底栅型薄膜晶体管）。有源层可以包括半导体材料，如非晶硅或多晶硅。有源层也可以包括其他材料，如：有机半导体材料或氧化物半导体材料。
栅极/源极/漏极可以包括低电阻金属材料，如：铝（Al）、铂（Pt）、钯（Pd）、银（Ag）、镁（Mg）、金（Au）、镍（Ni）、钕（Nd）、铱（Ir）、铬（Cr）、锂（Li）、钙（Ca）、钼（Mo）、钛（Ti）、钨（W）或铜（Cu）等。
其中，栅极绝缘层用于绝缘栅极和有源层，可以包括无机材料，例如SiO2、SiNx、SiON、Al2O3、TiO2、氧化钽（Ta2O5）、氧化铪（HfO2）或氧化锌（ZnO2）等。
其中，层间绝缘层用于绝缘源电极与栅极电极之间以及漏极与栅极电极之间。层间绝缘层可以包括无机材料，如：SiO2、SiNx、SiON、Al2O3、TiO2、氧化钽（Ta2O5）、氧化铪（HfO2）或氧化锌（ZnO2）等。
其中，栅极线接触点可以形成在布置在平坦化层下方的多个绝缘膜中的一个上面。可以形成在层间绝缘层/栅极绝缘层之上。
现有的Micro LED显示面板上包括了若干像素区域(SPR)，每个像素区域SPR包括红光LED、蓝光LED、绿光LED芯片。如图3所示，在显示器的制作过程中，需要将红绿蓝三种LED芯片从各自的生长基板转移到显示背板上。但是，如果任一LED芯片出现损坏/接触不良的情况（如图中“×”所示位置），经转移后，将会在显示面板上呈现一个坏点，影响成像效果。
需要说明的是本申请的实施例中涉及的显示背板的宽度方向为图5中沿x轴的方向，显示背板的长度方向为图5中沿y轴的方向。
需要说明的是，本实施例涉及的发光件可以为LED芯片，也可以是Micro LED芯片、mini LED芯片或者有机发光二极管（Organic Light-Emitting Diode，OLED）芯片中的一种或多种；另外，所述基板11为印制电路板（Printed Circuit Board，PCB板）。
参阅图4，本申请的一实施例公开了一种显示背板20的检测方法，其中，所述检测方法包括：S100、提供一显示背板20，所述显示背板20上设置多组接触电极对21，所述接触电极对21包括输入电极211和输出电极212；S200、提供一检测结构10，所述检测结构10包括多个发光件12，以及多条检测电路13，每两条所述检测电路13之间设有至少一个所述发光件12，所述检测电路13用于给所述发光件12导通电信号；S300、将所述检测结构10装配到所述显示背板20上，使一条所述检测电路13同时与一组所述接触电极对21中的所述输入电极211和相邻的另一组所述接触电极对21中的所述输出电极212连接；S400、向所述显示背板20输出驱动电信号；S500、若所述发光件12不发光，则确定所述检测电路13连接的所述输入电极211所属的该组所述接触电极对21为坏点。
本申请公开的检测方法通过将检测结构10盖设到显示背板20上，检测电路13连接接触电极对21，由于检测电路13同时与相邻两组所述接触电极对21中相对的输入电极211和输出电极212连接，所以奇数列的检测电路13连接奇数列的接触电极对21上的输入电极211和偶数列的接触电极对21上的输出电极212；偶数列的检测电路13连接偶数列的接触电极对21上的输入电极211和奇数列的接触电极对21上的输出电极212；通过依次向显示背板20正向通入电信号和逆向通入电信号直接检测显示背板20上奇数列和偶数列的接触电极对21是否有坏点，检测方式准确高效，而且步骤简单，更加节约时间。
另外，本实施例中一条检测电路13同时覆盖到两组接触电极对21上，所以宽度较大，在制造工艺中比较方便完成，降低检测结构10的制作难度，同时检测电路13的宽度较大，可用于检测像素尺寸较小的显示背板20，具有更广泛的应用前景。
具体的，作为本实施例的一种实现方式，公开了所述向所述显示背板20输出驱动电信号之后，还包括：若所述发光件12发光，则确定检测电路13连接的所述输入电极211所属的该组所述接触电极对21工作正常。
具体的，作为本实施例的一种实现方式，公开了多组所述接触电极对21成行分布，所述向所述显示背板20输出驱动电信号，具体包括：逐行向所述接触电极对21输出驱动电信号。
对单行上的接触电极对21先正向输出驱动电信号，检测该行奇数列的接触电极对21是否正常工作，然后再逆向输出驱动电信号，检测该行偶数列的接触电极对21是否正常工作，这样逐行检测接触电极对21，检测准确率高，便于快速找出损坏处的准确位置。
具体的，作为本实施例的一种实现方式，公开了所述向所述检测电路13输出驱动电信号，具体包括：向奇数条的所述检测电路13逐行导通正电信号，使偶数条的所述检测电路13逐行导通负电信号；向偶数条的所述检测电路13逐行导通正电信号，使奇数条的所述检测电路13逐行导通负电信号。
由于检测电路13同时与相邻两组所述接触电极对21中相对的输入电极211和输出电极212连接，所以奇数列的检测电路13连接奇数列的接触电极对21上的输入电极211和相邻偶数列的接触电极对21上的输出电极212；偶数列的检测电路13连接偶数列的接触电极对21上的输入电极211和相邻奇数列的接触电极对21上的输出电极212；当给显示背板20正向通入电信号时，奇数条的所述检测电路13逐行导通正电信号，奇数列的接触电极对21上的输入电极211作为发光件12的输入端通电，输出电极212作为发光件12的输出端正常工作，而偶数列的接触电极对21上的输入电极211收到负电信号呈断路状态，检测结构10只会检测奇数列的接触电极对21是否有坏点；当给显示背板20逆向通入电信号时，情况相反，向偶数条的所述检测电路13逐行导通正电信号，偶数列的接触电极对21正常接收电信号，而奇数列的接触电极对21呈断路状态，检测结构10可以检测偶数列的接触电极对21是否有坏点。通过正向和逆向的检测，可以方便快捷地直接检测显示背板20上该行接触电极对21是否有坏点，操作简单。另外，检测结构10可以迅速取下后直接对显示背板20进行维修，缩短检修流程。
如图5所示，作为本实施例的一种实现方式，公开了所述将所述检测结构10装配到所述显示背板20上，具体包括：在所述显示背板20上设置所述接触电极对21的一侧涂胶，形成连接层30；将所述检测结构10盖设在所述连接层30上，所述连接层30将所述检测结构10粘连固定在所述显示背板20上。
检测结构10工作时，显示背板20可能是平放的，但是也要防止晃动或震动造成检测电路13与接触电极对21的接触不良，所以设置连接层30固定检测结构10；如果是倾斜或者竖直防止显示背板20，更需要连接层30将检测结构10固定，方便检测工作稳定有效进行，提高检测准确率。本实施例中，可以设置所述连接层30为光刻胶层，连接效果好，而且方便后续通过显影液清洗干净，无残留。
如图6所示，作为本实施例的一种实现方式，公开了所述在所述显示背板20上设置所述接触电极对21的一侧涂胶，具体包括：在所述显示背板20上相邻的所述接触电极对21之间的位置涂胶。
多组接触电极对21都是凸出于显示背板20的，所以与检测结构10接触时，接触面容易变形，使检测电路13与接触电极对21的连接不够稳定，将连接层30设置在接触电极对21附近，较大程度地减少这种形变带来的影响，进一步增加检测结构10与显示背板20连接的稳定性。另外，检测结构10盖设在显示背板20上时，只有突出的检测电路13与接触电极对21接触，所以检测结构10与显示背板20之间必然会有空隙，空隙之间最近的距离即检测电路13到显示背板20表面的距离，将连接层30设置在检测电路13与显示背板20之间，可以更大程度地节省材料；并且在相邻的接触电极对21之间设置连接层30使每组的接触电极对21与检测电路13的连接都比较紧固，减少连接松动的可能，使检测过程电信号的传输更加准确顺畅。
具体的，作为本实施例的一种实现方式，公开了所述检测方法还包括：使用清洗剂冲洗所述显示背板20，去除所述连接层30，取下所述检测结构10。
本实施例中，如果连接层30为光刻胶层时，可选择清洗剂为显影液，通过显影液完全洗净光刻胶层，同时不会损伤显示背板20或者检测结构10，方便显示背板20进行后续制成步骤，检测结构10也可以继续进行下次检测。
具体的，作为本实施例的一种实现方式，公开了所述将所述检测结构10装配到所述显示背板20上，具体包括：将所述检测结构10盖设在所述显示背板20上设置所述接触电极对21的一侧；沿盖合的方向向所述检测结构10施加压力，以固定所述检测结构10和所述显示背板20。
通过施加压力固定检测结构10和显示背板20，简单直接，而且容易控制，检测完成之后可以迅速撤除压力，快速将检测结构10与显示背板20分离，方便及时进行维修，或下一步制成步骤。
具体的，作为本实施例的一种实现方式，公开了所述检测结构10上朝向所述显示背板20的一侧设置第一定位结构；所述显示背板20上与所述第一定位结构相对的位置设置第二定位结构，所述第一定位结构与所述第二定位结构对齐时，所述检测电路13与相邻的两组所述接触电极对21对齐；所述将所述检测电路13与所述接触电极对21连接之前，还包括：将所述检测结构10移动到所述显示背板20上方，使所述第一定位结构与所述第二定位结构对齐。
检测结构10盖设到显示背板20上时，检测电路13是朝向显示背板20的，所以装配过程中，人眼很难观察到检测电路13与接触电极对21的接触是否准确，预先设置第一定位结构和第二定位结构，优选的，可以设置在检测结构10和显示背板20的侧面，这样通过观察第一定位结构和第二定位结构就可以判断检测电路13与接触电极对21是否对准，进而方便后续的检测工作顺利准确地进行。
具体的，作为本实施例的一种实现方式，公开了所述接触电极对21等间距地并列排布在所述显示背板20上，相邻两组所述接触电极对21之间的间距为d；所述输入电极211和所述输出电极212的宽度均为b；所述检测电路13的宽度大于d，并且小于或者等于2b+d。因为检测时不移动检测结构10，所以检测电路13需要同时能够接触到相邻接触电极对21，所以检测电路13的宽度需要大于d，保证相邻的两个接触电极对21都能接触到；而一组接触电极对21的输入电极211和输出电极212之间又需要相互独立，如果检测电路13将一组接触电极对21上的输入电极211和输出电极212导通了，会导致该接触电极对21短接，直接造成损坏，所以设置检测电路13的宽度小于或者等于2b+d。
本实施例公开的检测方法通过分开检测奇数列接触电极对21的工作状态和偶列接触电极对21的工作状态，迅速判断出显示背板20上是否有坏点，如图10所示，逐行向显示背板20导通电信号，正向导通时检测该行奇数列的接触电极对21，逆向导通时检测该行偶数列的接触电极对21，观察发光件12F1、F2、F3、F4和F5的发光情况，比如图10中第a行正向导通时，发光件12F3不亮，则确定对应的图中“×”处的接触电极对21为坏点；本实施例公开的检测方法不用等到焊接完LED芯片再检测，减少了检测后又拆除LED芯片的步骤，更加方便操作，节约检测和维修时间。
本申请还公开了一种显示背板20的检测结构10，用于如上任一所述的显示背板20的检测方法，其中，所述检测结构10包括：基板11、多个发光件12和多条检测电路13；所述发光件12设于所述基板11上；所述检测电路13设于所述基板11上，每两条所述检测电路13与一个所述发光件12连接，用于接收驱动电信号，并将驱动电信号传输给发光件12。
本申请公开的检测结构10使用时基板11盖设到显示背板20上，检测电路13连接接触电极对21，直接检测显示背板20，操作方便，节省反复焊接发光件12的步骤。
具体的，作为本实施例的一种实现方式，公开了在所述检测结构10两端还分别设有两条侧边检测电路13，当所述检测结构10盖设在所述显示背板20上时，两条所述侧边检测电路13分别与一端最外侧的所述接触电极对21上的输入电极211和另一端最外侧的所述接触电极对21上的输出电极212连接，使检测时两端最外侧的接触电极对21同样可以形成电路回路，完成检测。
如图7和图8所示，作为本实施例的一种实现方式，公开了所述显示背板20上包括下基板24、电路层23以及平坦化层22，所述检测电路13与所述发光件12分别设置于所述基板11两侧，所述基板11上还设有通孔，所述检测电路13穿过所述通孔连接所述发光件12。本实施例中将发光件12设置在背离显示背板20的一侧，首先盖设检测结构10时，发光件12就不会碰到显示背板20，防止磕碰；所述平坦化层22具有绝缘性能，也能防止检测电路接触到下基板24上的电路层23，其次，显示背板20朝上放置时，检测结构10盖在显示背板20上，发光件12向上方发光，便于人眼观察，方便判断发光件12是否发光，提高判断的准确度。
如图5和图9所示，作为本实施例的一种实现方式，公开了至少两组所述接触电极对21呈矩形阵列排布在所述显示背板20上，形成多列所述接触电极对21；一条所述检测电路13分别与一列所述接触电极对21中的所述输入电极211和相邻的另一列所述接触电极对21中的所述输出电极212连接。当接触电极对21矩形阵列时，一条检测电路13连接多个输入电极211和多个输出电极212，当检测的时候逐行输入电信号即可使用两条相邻的检测电路13检测整列的接触电极对21的工作状态，减少检测结构10上的走线，方便支撑，检测时非常方便，不用多次调整检测电路13的连接点；同时本方案只需要在检测电路13上设置一个发光件12就可以检测整列接触电极对21，节省发光件12的数量，进而降低检测结构10的成本。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。
以上所述仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (15)

  1. 一种显示背板的检测方法，其特征在于，所述检测方法包括：
    提供一显示背板，所述显示背板上设置多组接触电极对，所述接触电极对包括输入电极和输出电极；
    提供一检测结构，所述检测结构包括多个发光件，以及多条检测电路，每两条所述检测电路之间设有至少一个所述发光件，所述检测电路用于给所述发光件导通电信号；
    将所述检测结构装配到所述显示背板上，使一条所述检测电路同时与一组所述接触电极对中的所述输入电极和相邻的另一组所述接触电极对中的所述输出电极连接；
    向所述显示背板输出驱动电信号；
    若所述发光件不发光，则确定所述检测电路连接的所述输入电极所属的该组所述接触电极对为坏点。
  2. 根据权利要求1所述的显示背板的检测方法，其特征在于，所述向所述显示背板输出驱动电信号之后，还包括：
    若所述发光件发光，则确定检测电路连接的所述输入电极所属的该组所述接触电极对工作正常。
  3. 根据权利要求1所述的显示背板的检测方法，其特征在于，多组所述接触电极对成行分布，所述向所述显示背板输出驱动电信号，具体包括：
    逐行向所述接触电极对输出驱动电信号。
  4. 根据权利要求3所述的显示背板的检测方法，其特征在于，所述向所述检测电路输出驱动电信号，具体包括：
    向奇数条的所述检测电路逐行导通正电信号，使偶数条的所述检测电路逐行导通负电信号；
    向偶数条的所述检测电路逐行导通正电信号，使奇数条的所述检测电路逐行导通负电信号。
  5. 根据权利要求1所述的显示背板的检测方法，其特征在于，所述将所述检测结构装配到所述显示背板上，具体包括：
    在所述显示背板上设置所述接触电极对的一侧涂胶，形成连接层；
    将所述检测结构盖设在所述连接层上，所述连接层将所述检测结构粘连固定在所述显示背板上。
  6. 根据权利要求5所述的显示背板的检测方法，其特征在于，所述在所述显示背板上设置所述接触电极对的一侧涂胶，具体包括：
    在所述显示背板上相邻的所述接触电极对之间的位置涂胶。
  7. 根据权利要求5所述的显示背板的检测方法，其特征在于，所述检测方法还包括：
    使用清洗剂冲洗所述显示背板，去除所述连接层，取下所述检测结构。
  8. 根据权利要求1所述的显示背板的检测方法，其特征在于，所述将所述检测结构装配到所述显示背板上，具体包括：
    将所述检测结构盖设在所述显示背板上设置所述接触电极对的一侧；
    沿盖合的方向向所述检测结构施加压力，以固定所述检测结构和所述显示背板。
  9. 根据权利要求1所述的显示背板的检测方法，其特征在于，所述检测结构上朝向所述显示背板的一侧设置第一定位结构；所述显示背板上与所述第一定位结构相对的位置设置第二定位结构，所述第一定位结构与所述第二定位结构对齐时，所述检测电路与相邻的两组所述接触电极对对齐；
    所述将所述检测电路与所述接触电极对连接之前，还包括：
    将所述检测结构移动到所述显示背板上方，使所述第一定位结构与所述第二定位结构对齐。
  10. 根据权利要求1所述的显示背板的检测方法，其特征在于，所述接触电极对等间距地并列排布在所述显示背板上，相邻两组所述接触电极对之间的间距为d；所述输入电极和所述输出电极的宽度均为b；所述检测电路的宽度大于d，并且小于或者等于2b+d。
  11. 一种显示背板的检测结构，用于如权利要求1所述的显示背板的检测方法，其特征在于，所述检测结构包括：
    基板；
    多个发光件，所述发光件设于所述基板上；以及
    多条检测电路，设于所述基板上，每两条所述检测电路与一个所述发光件连接，用于接收驱动电信号，并将驱动电信号传输给发光件。
  12. 根据权利要求11所述的显示背板的检测结构，其特征在于，所述检测电路与所述发光件分别设置于所述基板两侧，所述基板上还设有通孔，所述检测电路穿过所述通孔连接所述发光件。
  13. 一种显示背板的检测方法，其特征在于，所述检测方法包括：
    提供一显示背板，所述显示背板上设置多组接触电极对，所述接触电极对包括输入电极和输出电极；
    提供一检测结构，所述检测结构包括多个发光件，以及多条检测电路，每两条所述检测电路之间设有至少一个所述发光件，所述检测电路用于给所述发光件导通电信号；
    将所述检测结构装配到所述显示背板上，使一条所述检测电路同时与一组所述接触电极对中的所述输入电极和相邻的另一组所述接触电极对中的所述输出电极连接；
    逐行向所述显示背板输出驱动电信号；对单行上的接触电极对先正向输出驱动电信号，检测该行奇数列的接触电极对是否正常工作，然后再逆向输出驱动电信号，检测该行偶数列的接触电极对是否正常工作；
    若所述发光件不发光，则确定所述检测电路连接的所述输入电极所属的该组所述接触电极对为坏点。
  14. 根据权利要求13所述的显示背板的检测方法，其特征在于，所述向所述检测电路输出驱动电信号，具体包括：
    向奇数条的所述检测电路逐行导通正电信号，使偶数条的所述检测电路逐行导通负电信号；
    向偶数条的所述检测电路逐行导通正电信号，使奇数条的所述检测电路逐行导通负电信号。
  15. 根据权利要求13所述的显示背板的检测方法，其特征在于，所述检测结构上朝向所述显示背板的一侧设置第一定位结构；所述显示背板上与所述第一定位结构相对的位置设置第二定位结构，所述第一定位结构与所述第二定位结构对齐时，所述检测电路与相邻的两组所述接触电极对对齐；
    所述将所述检测电路与所述接触电极对连接之前，还包括：
    将所述检测结构移动到所述显示背板上方，使所述第一定位结构与所述第二定位结构对齐。
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