WO2022089232A1 - 引线框架表面粗糙度的制造设备及制造方法 - Google Patents

引线框架表面粗糙度的制造设备及制造方法 Download PDF

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Publication number
WO2022089232A1
WO2022089232A1 PCT/CN2021/124340 CN2021124340W WO2022089232A1 WO 2022089232 A1 WO2022089232 A1 WO 2022089232A1 CN 2021124340 W CN2021124340 W CN 2021124340W WO 2022089232 A1 WO2022089232 A1 WO 2022089232A1
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Prior art keywords
lead frame
pulse
surface roughness
electrolytic copper
reverse
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PCT/CN2021/124340
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English (en)
French (fr)
Chinese (zh)
Inventor
门松明珠
周爱和
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昆山一鼎工业科技有限公司
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Priority to JP2022519585A priority Critical patent/JP2022547336A/ja
Publication of WO2022089232A1 publication Critical patent/WO2022089232A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Definitions

  • the invention belongs to the technical field of continuous lead frame surface treatment and manufacture, and in particular relates to a manufacturing equipment and a manufacturing method for the surface roughness of a lead frame.
  • Precision integrated circuits encapsulated by high-precision chips and lead frames are important core electronic products in the modern electronic information industry.
  • the important role of the lead frame is to support the chip, protect the internal components, and connect the external circuit, which is the key material in the integrated circuit.
  • lead frame materials are being developed in the direction of miniaturization and high density of lead pitches. This not only puts forward higher requirements on the strength and conductivity of the lead frame material, but also puts forward higher requirements on the processing performance of the material.
  • lead frame materials should not allow defects such as scratches, peeling, oxidation, water marks and uneven color appearance.
  • the lead frame material manufacturing method for semiconductor integrated circuits has become the mainstream by using the photosensitive dry film hot pressing process on the surface of the lead frame material.
  • the requirements for the surface quality of lead frame materials have become higher and higher. That is to say, the surface roughness of the lead frame material is an important factor affecting the dry film hot pressing process, and it is also a key factor for the packaging process to be closely combined with the packaging material. Therefore, research and development of cleaning and production equipment for the surface of lead frame materials has become a very important issue, and in particular, research and development of manufacturing methods and manufacturing equipment for the surface roughness of lead frame materials has become an urgent issue to be solved.
  • Patent Document 1 (CN 101864586 B): It is described that after the metal material is pre-treated by degreasing and pickling and dried, the upper and lower sides of the metal material are subjected to hot pressing with photosensitive films, and ultraviolet light is used to pass through a special lead wire.
  • the frame pattern mold exposes the lead frame attached with the photosensitive film, and then treats it with a developing solution, and then performs etching and electroplating treatment to prepare the lead frame material.
  • this method has the defect that the photosensitive film and the surface of the metal material are not firmly bonded, so that the electroplating solution is immersed in the gap between the photosensitive film and the metal to be plated and a small part of the etched area is not etched or completely removed by etching. The problem.
  • Patent Document 2 JP 6406711 B2: describes a method for manufacturing a chip lead frame, the first plating step includes forming Ni plating, Pd plating and Au plating in sequence at predetermined positions on the front and back surfaces of the metal plate.
  • the second plating layer is preferably a method of forming an Ag plating layer.
  • the manufacturing method is a sheet-type production process, which has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of the metal material.
  • Patent Document 3 JP 4431860 B2 Describes a method for roughening the surface of copper and copper alloy materials to provide lead frame materials by surface roughening agent hydrogen peroxide and sulfuric acid system.
  • the requirements for the thermal compression bonding strength between the metal material surface and the photosensitive dry film are getting higher and higher, and the bonding strength of the metal surface provided by the surface roughening agent method is insufficient.
  • the copper surface roughened by this method has defects that are very easy to oxidize.
  • Patent Document 4 JP 1997-298265 A: A technique is proposed to form multiple layers of nickel plating layers with different densities on the surface of the lead frame to improve the bonding strength with the packaging material.
  • the lower layer using the multi-layer nickel plating layer is formed of a nickel plating layer that forms a smooth and dense layer
  • the upper layer is formed of a pulsed nickel plating layer that prioritizes crystal growth in the vertical direction.
  • this multi-plating technique sufficient surface roughness of the upper nickel plating layer cannot be obtained, so that the bonding force with the packaging material is weak. Therefore, this technology has the disadvantage of insufficient bonding strength with the packaging material.
  • Patent Document 5 Provides a technique of forming a variety of different metal plating layers on the surface of the lead frame to improve the bonding strength with the packaging material.
  • Two nickel plating layers with different thicknesses are successively plated through two different nickel plating conditions to make the total thickness of 1.0 ⁇ m, and then a 0.03 ⁇ m palladium plating layer is performed thereon, and a 0.01 ⁇ m gold plating layer is further performed on the palladium plating layer.
  • the pulse reverse electrolysis technology is used to obtain a lead frame with suitable surface roughness, and the bonding strength with the packaging material can meet the requirements of various product specifications.
  • the gold electrolytically desorbed from the surface is a precious metal with extremely high chemical stability, which will not cause oxidation to roughen the surface, thus reducing the bonding performance with the packaging material; at the same time, the production process requirements of lead frames with various metal coatings High, the precious metals used are expensive, and the product cost increases, which is difficult to achieve in actual production.
  • Patent Documents 1 to 5 provide a variety of production and processing methods for lead frames.
  • Document 1 has the defect that the photosensitive dry film and the surface of the lead frame material are not firmly bonded, resulting in the plating solution immersed in the gap between the photosensitive film and the metal and is Electroplating and lead to the problem that a small part of the etched area is not etched or not removed at all;
  • Document 2 has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of metal materials;
  • the bonding strength of the metal surface provided by the surface roughening method with chemical solution is insufficient, and in addition, the roughened surface of the lead frame material has the defect that it is very easy to oxidize.
  • the above-mentioned problems are major issues to be solved urgently in the lead frame surface treatment production line manufacturing industry.
  • the bandwidth of lead frame materials is generally more than 100mm, or even 300-400mm, while the bandwidth of terminal materials is generally less than 20mm. It is more difficult to ensure uniform film thickness for surface treatment of lead frame materials with higher widths.
  • the combination is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4) The surface roughness of the lead frame material should meet the hot-pressing combination with the packaging material. At the same time, the surface of the lead frame material should be The thickness of the electrolytic copper film also needs to be homogenized; 5) It is necessary to solve the defects that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
  • the present invention aims to solve at least one of the technical problems existing in the prior art.
  • the present invention proposes a manufacturing equipment for the surface roughness of a wire frame, which improves the uniformity of the electrolytic copper film thickness of the lead frame material produced by the manufacturing equipment for the surface roughness of the wire frame, and enhances the surface of the lead frame material and the photosensitive dryness.
  • the bonding strength of the film not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also guarantees product quality.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • the present invention also proposes a method for manufacturing the surface roughness of the wire frame, which has the advantages of high product quality and high production efficiency.
  • a discharging device from front to back in the production process sequence, there are: a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and the discharging device can The lead frame material on the tray is discharged; the cleaning device can clean the lead frame material to remove surface impurities; the receiving device can rewind the processed lead frame material; the electrolytic copper device The surface roughness of the lead frame material can be regulated by the pulse reverse electrolysis technology.
  • the electrolytic copper device includes: a pulse reverse power supply, which can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper Process tank, the number of the electrolytic copper process tanks is multiple, the lead frame material can pass through the multiple electrolytic copper process tanks, and the lead frame material continuously moves forward to form a moving path; the electrolytic copper potion, The electrolytic copper potion is arranged in the electrolytic copper process tank, and the lead frame material can be immersed in the electrolytic copper potion.
  • the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention is mainly composed of a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and a clean lead frame material can be obtained through the cleaning device.
  • the pulse reverse electrolysis technology to adjust and control the surface roughness of the lead frame material can not only increase the grain size and surface roughness of the Cu plating layer, but also produce a strong bonding effect between the lead frame material and the packaging material. There are few defects such as pinholes in the desorption layer, and it has good corrosion resistance.
  • the uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • each of the electrolytic copper process tanks is provided with two electrode plates, the two electrode plates are oppositely arranged on both sides of the lead frame material, and the moving path is located in the two electrode plates. between the electrode plates.
  • the ratio of the surface area of the electrode plate to the surface area of the lead frame material immersed in each electrolytic copper process tank is 5:1.
  • the shape of the electrode plate is formed as one-sided, mesh or special shape, and the two electrode plates in each of the electrolytic copper process tanks are of the same shape or a combination of different shapes.
  • the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technology, and it is characterized in that, it includes the following steps:
  • Electrolytic copper plating section According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and forward and reverse pulse time output by the pulse reverse power supply;
  • the surface roughness of the electrolytic copper the surface roughness of the lead frame material required for the product ⁇ the surface roughness of the lead frame material.
  • the arithmetic mean of the surface roughness of the electrolytic copper ranges from 0.05 ⁇ m to 5.0 ⁇ m.
  • the pulse forward current range output by the pulse reverse power supply is 5A ⁇ 500A, and the reverse current range output by the pulse reverse power supply is 20A ⁇ 1000A.
  • the time range of the pulse forward pulse output by the pulse reverse power supply is 5ms-100ms; the pulse reverse pulse time range of the pulse reverse power supply is 1ms-30ms.
  • the electrolytic copper process tank is provided with an electrolytic copper potion, and the electrolytic copper potion needs to meet the usage range of the pulse forward and reverse current density output by the pulse reverse power supply.
  • the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2
  • the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2 .
  • FIG. 1 is a flow chart of steps of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • Fig. 2 is the overall process flow chart of lead frame surface treatment
  • FIG. 3 is an output waveform diagram of a pulse reverse power supply of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 4 is an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 5 is an implementation 1 continuous lead frame material of a method of manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 6 is a diagram of an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 7 is a drawing of the implementation 2 continuous lead frame material of the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention.
  • FIG. 8 is a structural diagram of a manufacturing equipment for the surface roughness of a chip lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 9 is a material structure diagram of a chip lead frame in implementation 3 of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • Pulse reverse power supply 300 Pulse reverse power supply 300; Pulse reverse power supply 310-370;
  • the discharging device 10 the discharging guide wheel 11; the cathode conduction 13a at the inlet; the cathode conduction 13b at the outlet;
  • Electrolytic copper process tank 30 electrolytic copper process tank 30a-30g;
  • electrode plate 40 upper anode plate 40a; lower anode plate 40b;
  • Receiving guide wheel 50 Receiving device 51.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the manufacturing equipment for the surface roughness of the lead frame includes: a discharging device 10 , a cleaning device, an electrolytic copper device and a receiving device 51 .
  • the discharging device 10 can discharge the lead frame material on the tray; the cleaning device can clean the lead frame material to remove surface impurities;
  • the copper device can control the surface roughness of the lead frame material through the pulse reverse electrolysis technology, including: the pulse reverse power supply 300, the pulse reverse power supply 300 can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper process tank 30 , the number of electrolytic copper process tanks 30 is multiple, the lead frame material can pass through multiple electrolytic copper process tanks 30, and the lead frame material moves forward continuously to form a moving path; electrolytic copper syrup, electrolytic copper syrup is set in the electrolytic copper process Inside the tank 30, the lead frame material can be immersed in the electrolytic copper potion.
  • the rewinding device 51 can rewind the processed lead frame material.
  • each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 .
  • the electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple.
  • the electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out.
  • the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material.
  • the surface of the lead frame material can precipitate copper or strip copper.
  • the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1.
  • the electrode plate 40 is the anode plate
  • the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
  • the shape of the electrode plates 40 is formed in one-sided, mesh or different shapes, and the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes.
  • the electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40.
  • the electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements.
  • the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination.
  • the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
  • the lead frame material is transported horizontally through the electrolytic copper process tank, because the bandwidth of the lead frame material is much larger than that of the terminal material, and vertical transport cannot ensure the smoothness of the lead frame material during operation. properties, which in turn affects the treatment of surface roughness.
  • the horizontal conveying method is more stable, which is convenient for surface roughness treatment.
  • the manufacturing equipment for the surface roughness of the lead frame is mainly composed of a discharging device 10, a cleaning device, an electrolytic copper device and a receiving device 51.
  • the cleaning device can obtain clean lead frame material.
  • the electrolytic copper device the pulse reverse electrolysis technology is used to adjust and control the roughness of the surface of the lead frame material.
  • the uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • the electrode plate 40 is also an anode plate, and the anode plate includes an upper anode plate 40a and a lower anode plate 40b.
  • the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technique, including the following steps:
  • Electrolytic copper plating section According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300;
  • the optimal combination of the pulse forward and reverse currents and the forward and reverse pulse times output by the pulse reverse power supply 300 can be determined.
  • the lead frame material After the lead frame material is led out from the discharge 10 and passed through the discharge guide wheel 11, it enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and oxide on the surface of the metal material.
  • lead frame material Then enter the electrolytic copper plating section, in the electrolytic copper process tank 30, the electrode plate 40 is the anode, the lead frame material in the electrolytic copper syrup is the cathode, and electrolysis occurs under the action of the pulse reverse power supply 300, and the surface roughness of the lead frame material changes happened. Specifically, the applied forward and reverse pulse currents and the forward and reverse pulse times are different, and the electrolysis on the surface of the lead frame material is also different.
  • the current applied to the lead frame output by the pulse reverse power supply 300 changes periodically.
  • the pulse reverse power supply 300 applies a forward pulse current
  • copper is electrolytically dissociated on the surface of the lead frame, showing a pulse forward waveform
  • the pulse reverse power supply 300 applies a reverse pulse current
  • the surface of the lead frame material is electrolytically stripped of copper, showing a pulse reverse waveform.
  • copper is continuously precipitated and stripped on the surface of the lead frame material.
  • the forward pulse time when the forward pulse time is long, more copper is precipitated on the surface of the lead frame material, and the thickness of the copper film is relatively thick.
  • the reverse pulse time when the reverse pulse time is long, the surface of the lead frame material peels off more copper. , the copper film thickness will be thinner. Not only can the thickness of the Cu plating layer be uniform, but also the surface roughness of the lead frame material can be varied according to different requirements.
  • the copper is electrolytically stripped by the reverse pulse current, the hydrogen atoms absorbed in the Cu plating layer on the surface of the lead frame can be removed, the brittleness of the Cu plating layer caused by the hydrogen atoms contained in the copper layer is eliminated, and the workability such as bending is improved. .
  • the pulsed reverse power supply 300 electrolytic copper process when the pulsed reverse power supply 300 electrolytic copper process is performed, the metal copper is precipitated faster in the epitaxial growth of the crystal than in the generation of the crystal nucleus, which increases the grain size and surface roughness of the Cu coating. Due to this irregularly shaped, rough surface morphology, a strong adhesive effect is produced between the lead frame material and the encapsulation material, and the encapsulation material obtained has strong adhesive properties.
  • the current waveform of the reverse polarity is applied alternately and repeatedly, the strain in the copper layer due to hydrogen absorption and the mixing ratio of impurities are electrolytically desorbed in the copper layer. There is less mixing of strain and impurities.
  • the electrolytic copper process is implemented by the pulse reverse electrolysis technology, which can not only increase the grain size and surface roughness of the Cu plating layer, but also make the lead frame material and packaging material. There is a strong adhesion effect between them, and there are few defects such as pinholes in the electro-desorption layer, which has good corrosion resistance.
  • the method can replace the chemical potion roughening process, can greatly improve the production efficiency of the surface treatment of the lead frame, the uniformity of the electrolytic copper film is improved, and the product quality is guaranteed.
  • the surface roughness Ra1 of the electrolytic copper the surface roughness Ra2 of the lead frame material required for the product - the surface roughness Ra of the lead frame material.
  • the setting and adjustment of the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300 are closely related to the distribution of the surface roughness of the electrolytic copper and the arithmetic mean value of the surface roughness of the electrolytic copper. It is determined that the control of the surface roughness of the lead frame by the pulse reverse electrolysis technology plays a great role.
  • the arithmetic mean ranges of the surface roughness of the electrolytic copper, the surface roughness of the lead frame material required for the product, and the surface roughness of the lead frame material are all in the range of 0.05 ⁇ m to 5.0 ⁇ m.
  • the pulse forward current output by the pulse reverse power supply 300 ranges from 5A to 500A, and the reverse current output from the pulse reverse power supply 300 ranges from 20A to 1000A.
  • the optional range of the pulse forward pulse time output by the pulse reverse power supply 300 is 5ms ⁇ 100ms; the pulse reverse pulse time range output by the pulse reverse power supply 300 is 1ms ⁇ 30ms.
  • the electrolytic copper process tank 30 is provided with electrolytic copper syrup, and the electrolytic copper syrup needs to meet the pulse forward and reverse current density usage ranges output by the pulse reverse power supply 300 .
  • the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2
  • the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2
  • Pulse reverse power supply 300 output current A electrolytic copper potion current density A/dm 2 ⁇ material surface area dm 2
  • pulse forward current density preferably ranges from 5A/dm 2 to 60A/dm 2 , and more preferably ranges from 10A/dm 2 to 50A/ dm 2
  • the pulse reverse current density preferably ranges from 10A/dm 2 to 160A/dm 2 , and more preferably ranges from 20A/dm 2 to 150A/dm 2 .
  • each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 .
  • the electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple.
  • the electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out.
  • the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material.
  • the surface of the lead frame material can precipitate copper or strip copper.
  • the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1.
  • the electrode plate 40 is the anode plate
  • the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
  • the shape of the electrode plate 40 is formed in one-sided, meshed or irregular shape.
  • the electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40 .
  • the electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements.
  • the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes. That is to say, the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination. Through the adjustment of the size and shape of the anode, the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
  • production by the method for producing the surface roughness of the lead frame can meet the following requirements: 1) the bonding between the surface of the lead frame material and the photosensitive dry film must be firm; 2) the surface roughness of the lead frame material must meet the thermal resistance of the packaging material.
  • the pressure bonding is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4)
  • the surface roughness of the lead frame material should meet the requirements of the thermal compression bonding with the packaging material.
  • the lead frame material The thickness of the electrolytic copper film on the surface also needs to be uniform; 5) It is necessary to solve the problem that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
  • pulse reverse electrolysis technology based on pulse reverse power supply 300, selective metal anode, adjustment of anode size and shape, and copper potion for pulse electrolysis, it is realized to provide high-quality and high-performance lead frame materials for the integrated circuit industry. And continue to challenge the important foundation of high-end lead frame manufacturing technology. It can not only improve the uniformity of the electrolytic copper film thickness on the surface of the lead frame material, but also have excellent corrosion resistance and excellent adhesion to the packaging material, but also ensure the product quality and improve the production efficiency of the lead frame surface treatment production line.
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc or copper, nickel, cobalt, Alloys composed of any two or more selected from phosphorus, tungsten, arsenic, molybdenum, chromium and zinc; also can be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips , can also be continuous lead frame material.
  • any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
  • the optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm; the optional range of arithmetic mean of surface roughness of metal materials is 0.06 ⁇ m to 2.0 ⁇ m
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material.
  • any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
  • the optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm;
  • the arithmetic mean value of the surface roughness of the metal material can be selected in the range of 0.1 ⁇ m to 10.0 ⁇ m.
  • the surface of the photosensitive dry film and the surface of the metal material are subjected to hot pressing to obtain a film-coated metal material with firm adhesion and uniform surface quality.
  • Optional range of thickness of photosensitive dry film raw material 20 ⁇ 60 ⁇ m; optional range of surface roughness of photosensitive dry film raw material: 0.75 ⁇ 1.87 ⁇ m; optional range of material thickness after lamination of metal material and photosensitive dry film: 0.05 ⁇ 0.36mm ; Optional range of one side roughness of photosensitive dry film: 0.85 ⁇ 2.35 ⁇ m;
  • the electrolytic copper potion used should be able to meet the following requirements: the forward current density can be selected from 2A/dm 2 to 70A/dm 2 ; the reverse current density can be selected from 5A/dm 2 to 170A/dm 2 ; The special requirements for the electrolytic stripping of copper on the surface of the lead frame material under the current condition and the electrolytic stripping of the copper on the surface of the lead frame material under the reverse current condition.
  • the raw material copper tape C19400 has a width of 350mm and a thickness of 0.12mm.
  • the roughness Ra is 0.08-0.15 ⁇ m by the shape measuring and testing instrument VK-X series, and the average value calculated from multiple sets of data is 0.11 ⁇ m.
  • the surface roughness Ra of the metal material is 1.3-1.5 ⁇ m.
  • the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper area to the seventh copper plating area is the same as the connection manner of the first electrolytic copper area. As shown in Figure 1 and Figure 4.
  • the width of the raw material copper tape is 350mm, the surface area is large, and the surface roughness of the lead frame material required by the product is Ra 1.30 ⁇ 1.50 ⁇ m and the raw material roughness Ra 0.08 ⁇ 0.15 ⁇ m is relatively large, preferably 7 units
  • the electrolytic copper process is used to process the surface roughness; the total surface roughness of the lead frame manufactured by the seven pulse reverse power supplies 310 to 370 is set to 21 equal parts, and the surface roughness of each equal part is 0.06-0.07 ⁇ m;
  • the surface roughness range Ra 0.92 ⁇ 1.07 ⁇ m needs to be achieved after treatment, and the six pulse reverse power supplies 300 of the pulse reverse power supply 320 to 370 each occupy 1 part. After the pulse reverse power supply 300 is processed, the surface roughness of the material must meet Ra 0.06 ⁇ 0.07 ⁇ m.
  • the operating speed of the lead frame material surface roughness manufacturing line is preferably 1.5 m/min.
  • the seven pulse reverse power supplies 300 use the condition No. 7 in Table 1, the roughness of the electrolytic copper layer for the seven times is in the range of 0.18-0.21 ⁇ m, that is, the forward and reverse pulse currents set by the seven pulse reverse power supplies 300 and The forward and reverse pulse time conditions are the same, the obtained surface roughness and density from the bottom layer to the surface layer have little difference, and the surface characteristics of the lead frame material are uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current.
  • the obtained electrolytic copper has a large roughness and a poor density
  • the set conditions of the subsequent six pulse reverse power supplies 320 to 370 are compared with the condition No. 7, which is a smaller forward pulse current and a longer forward pulse time, and the set value of the reverse pulse current is slightly larger than that of the condition No.7, and the reverse pulse time is much shorter than that of No.7; therefore, the obtained surface roughness meets the product specification and is similar to the condition No. 7. .7 is better than the surface density.
  • the surface roughness of the lead frame material meets the requirements, and the density range is between the conditions No. 1 and No. 7.
  • the six pulse reverse power supplies 310 to 360 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper layer has less roughness and better density.
  • the setting conditions of the last pulse reverse power supply 370 are larger forward pulse current and longer forward pulse time, and set larger reverse pulse current and shorter reverse pulse time, so the obtained While reaching the product specification, the surface roughness is inferior to that of Condition No. 7.
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 7 and No. 13.
  • the surface roughness of the lead frame is analyzed and tested with the shape measuring instrument VK-X series.
  • the lead frame blister copper material is used as the raw material for subsequent silver plating, and it must be able to form a dense and strong bonding layer with the silver plating layer, which is the standard for judging the surface specifications of the lead frame.
  • the shape measuring instrument VK-X series After selecting the brand and model of the photosensitive dry film, use the shape measuring instrument VK-X series to analyze and test the roughness Ra of 1.3 ⁇ 1.85 ⁇ m, and the average value of multiple sets of data Ra is 1.58 ⁇ m;
  • the surface roughness specification range of the film machine after hot pressing is 1.57-1.93 ⁇ m. With this specification range as the inspection standard, the metal materials produced under the above conditions and the photosensitive dry film autoclaved products are tested by the shape measuring detector VK-X, which can determine the best manufacturing method for the surface roughness of metal materials and the optimal pulse reverse power supply 300 setting conditions.
  • the roll lead frame has a width of 115mm and a thickness of 0.15mm, and the metal raw material is C14410.
  • the roughness Ra is 0.12-0.21 ⁇ m, and the average value calculated from multiple sets of data is 0.17 ⁇ m.
  • the surface roughness of the lead frame needs to be in the range of 2.5 to 3.7 ⁇ m
  • the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 6 .
  • the width of the rolled lead frame material is 115mm, and the surface area is less than one-third of that of Example 1.
  • the 6-unit electrolytic copper process is used for surface roughness treatment; the surface roughness of the material required by the product is Ra2 .38 ⁇ 3.49 ⁇ m; the total surface roughness of the manufactured metal of the six pulse reverse power sources 310 to 360 is set to 18 equal parts, and the surface roughness of each equal part is 0.132 ⁇ 0.193 ⁇ m; for example, the experimental condition No.1
  • the pulse reverse power supply 310 accounts for 11 parts, the surface roughness range that needs to be reached after treatment is Ra 1.454 ⁇ 2.132 ⁇ m, the pulse reverse power supply 320 occupies 3 parts, and the surface roughness range that needs to be achieved after processing Ra 0.396 ⁇ 0.581 ⁇ m, the pulse reverse power supply 4 sets of pulse reverse power supply 300 from 320 to 360 each account for one part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.132 ⁇ 0.193 ⁇ m.
  • the running speed of the production line for the surface roughness of the lead frame material is preferably 2.0m/min; when the condition No. 9 in Table 2 is used for 6 sets of pulse reverse power supplies 300, the roughness of the 6 times electrolytic copper layer is in the range of 0.396 ⁇ 0.581 ⁇ m , that is, the forward and reverse pulse currents and the forward and reverse pulse time conditions set by the 6 pulse reverse power supplies 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the surface characteristics of the lead frame material are very small. uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current.
  • the obtained electrolytic copper has large roughness and poor density
  • the conditions required for the pulse reverse power supply 320 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9, and then the four pulse reverse power supplies 330
  • the setting conditions to 360 are smaller forward pulse current and longer forward pulse time compared with condition No.9, while the setting value of reverse pulse current is slightly larger than that of condition No.9, reverse The pulse time is much shorter than that of No. 9; therefore, the surface roughness of the obtained electrolytic copper meets the requirements of product specifications, and the surface density is better than that of Condition No. 9.
  • the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
  • the four pulse reverse power supplies 310 to 340 need to set a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse Pulse time; the resulting copper layer has less roughness and better density.
  • the conditions for the pulse reverse power supply 350 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9.
  • the setting conditions for the last pulse reverse power supply 360 are a larger forward pulse current and a longer pulse reverse current.
  • the forward pulse time is set, and the reverse pulse current is larger and the reverse pulse time is shorter. Therefore, the obtained surface roughness meets the product specification and the surface density is lower than that of Condition No. 9. .
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
  • the chip lead frame has a width of 105mm and a thickness of 0.20mm, and the metal raw material is C14410.
  • the roughness Ra is 0.15-0.23 ⁇ m, and the average value Ra of multiple sets of data is 0.19 ⁇ m.
  • the surface roughness requirements of the lead frame are in the range of Ra of 3.5 to 4.9 ⁇ m.
  • the lead frame material is led out from the discharge 10 through the discharge guide wheel 11, then enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and stains on the surface of the metal material. oxides, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 3 and FIG. 8 .
  • the chip lead frame has a width of 105mm, and its surface area is less than one-third of that of Example 1. It is preferable to use a 5-unit electrolytic copper process for surface roughness treatment; the surface roughness of the material required by the product is Ra3 .35 ⁇ 4.67 ⁇ m; the total surface roughness of the metal produced by the five pulse reverse power sources 310 to 350 is set to 20 equal parts, and the surface roughness of each equal part is 0.167 ⁇ 0.233 ⁇ m; for example, the experimental condition No.1
  • the pulse reverse power supply 310 accounts for 15 parts, the surface roughness range to be achieved after treatment is Ra 2.512 ⁇ 3.503 ⁇ m, the pulse reverse power supply 320 occupies 2 parts, the surface roughness range to be achieved after treatment is Ra 0.335 ⁇ 0.467 ⁇ m, the pulse reverse power supply 3 sets of pulse reverse power supply 300 from 320 to 350 each account for 1 part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.167 ⁇ 0.233 ⁇ m.
  • the running speed of the production line for the surface roughness of the chip lead frame material is preferably 1.5m/min; when the five pulse reverse power supplies 300 use the condition No. 9 in Table 3, the roughness of the five electrolytic copper layers is in the range of 0.670 ⁇ 0.934 ⁇ m, that is, the forward and reverse pulse current and the forward and reverse pulse time conditions set by the 6 sets of pulse reverse power supply 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the lead frame material The surface properties are uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current. Short; the obtained electrolytic copper has large roughness and poor density; the conditions required for the pulse reverse power supply 320 to be set are different from those used by the five pulse reverse power supplies 300 of No.
  • the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
  • the three pulse reverse power supplies 310 to 330 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper coating
  • the roughness is less and the density is better.
  • the conditions required for the pulse reverse power supply 340 to be set are different from the conditions used by the 5 pulse reverse power supply 300 in No. 9. It adopts a smaller forward pulse current and a longer forward pulse time, while the reverse pulse
  • the setting value of current is slightly larger than that of condition No.9, and the reverse pulse time is much shorter than that of No.9; the setting conditions of the last pulse reverse power supply 350 are larger forward pulse current and longer pulse duration.
  • the forward pulse time is longer, and a larger reverse pulse current and a shorter reverse pulse time are set. Therefore, the obtained surface roughness meets the product specification and the surface density is worse than that of Condition No. 9. .
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
  • Table 1, Table 2, and Table 3 are respectively the allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply 300, the allocation quota of lead frame surface roughness corresponding to 6 sets of pulse reverse power supply 300, and the allocation quota of lead frame surface roughness corresponding to 5 sets of pulse reverse power supply 300, respectively.
  • the assigned amount of the corresponding lead frame surface roughness It includes the assigned number of each pulse reverse power supply 300 and the specific surface roughness range.
  • Table 1 Allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply unit: ⁇ m
  • Table 2 Allocation quota of lead frame surface roughness corresponding to 6 pulse reverse power supplies Unit: ⁇ m
  • the output current of the optional pulse reverse power supply 300 of each unit of adjustment and control is different, and at the same time, the output pulse time of the optional pulse reverse power supply 300 of each unit of adjustment and control is also different.
  • the electrolytic copper process for adjusting and controlling the surface roughness of the lead frame material can be selected in the range of 3 units to 12 units, preferably in the range of 4 units to 11 units, and more preferably in the range of 5 units to 10 units.
  • the lead frame material can be electrolytically processed into the surface roughness required for the product.
  • the continuous lead frame materials 200, 500 and 700 are surface treated by pulsed reverse electrolysis techniques and preferably electrolytic copper potions.
  • the production and processing conditions of the surface roughness of the lead frame material can be determined by designing a test plan for the required range of surface roughness, and optimizing the experimental results to optimize the manufacturing method of the best material surface roughness, which has continuous production and processing efficiency. High, increase the bonding strength between the surface of the lead frame material and the photosensitive dry film and the bonding strength with the packaging material, and improve the quality of the lead frame product.
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material.
  • any material with metal foil attached to the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness. For example, materials with metal films attached to one or both sides of various plastic films can produce the required surface roughness materials.
  • the thickness of the lead frame material can be selected in the range of 0.03mm to 0.80mm, preferably in the range of 0.05mm to 0.55mm, and more preferably in the range of 0.07mm to 0.35mm; the width of the metal material can be selected in the range of 50mm to 1000mm, preferably in the range of 80mm to 700mm , the more preferred range is 100mm to 500mm.
  • the surface of the photosensitive dry film and the surface of the lead frame material should be subjected to hot pressing treatment to obtain a film lead frame material with strong bonding and uniform surface thickness.
  • the thickness of the photosensitive dry film raw material can be selected in the range of 20-100 ⁇ m, preferably in the range of 20-80 ⁇ m, and more preferably in the range of 20-80 ⁇ m.
  • the surface roughness of the photosensitive dry film raw material can be selected in the range of 0.65-2.17 ⁇ m, preferably in the range of 0.55-2.07 ⁇ m, and more preferably in the range of 0.50-1.97 ⁇ m.
  • the optional range of one side roughness of the photosensitive dry film after the photosensitive dry film and the lead frame material are thermocompressed is 1.05-2.65 ⁇ m, preferably 0.95-2.50 ⁇ m, and more preferably 0.85-2.30 ⁇ m.
  • the pulse reverse electrolysis technology is composed of the forward pulse waveform and reverse pulse waveform outputted by the pulse reverse power supply 300, which are transmitted to the surface of the lead frame material through the anode plate and the electrolytic copper solution, and the forward pulse time and the reverse pulse time.
  • the double-pulse forward current output by the pulse reverse power supply 300 can be selected in the range of 5A-500A, preferably in the range of 10A-450A, and more preferably in the range of 20A-430A;
  • the reverse current output by the double-pulse rectifier can be selected in the range of 20A-1000A, preferably The range is 30A ⁇ 900A, and the more preferred range is 50A ⁇ 850A;
  • the double-pulse forward pulse time output by the pulse reverse power supply 300 can be selected in the range of 5ms ⁇ 100ms, preferably in the range of 7ms ⁇ 70ms, more preferably in the range of 10ms ⁇ 50ms;
  • the reverse pulse time can be selected in the range of 1ms-30ms, preferably in the range of 3ms-20ms, and more preferably in the range of 5ms-10ms.
  • the forward current density of the electrolytic copper potion can be selected in the range of 2A/dm 2 -70A/dm 2 , preferably in the range of 5A/dm 2 -60A/dm 2 , and more preferably in the range of 10A/dm 2 -50A/dm 2 ;
  • the reverse current density of the liquid medicine can be selected in the range of 5A/dm 2 -170A/dm 2 , preferably in the range of 10A/dm 2 -160A/dm 2 , and more preferably in the range of 20A/dm 2 -150A/dm 2 .
  • the ratio of the surface area of the anode plate to the surface area of the lead frame material immersed in each electrolytic copper bath can be selected as 5:1, preferably 3:1, more preferably 2:1; and the anode plate can be made of soluble metal and insoluble metals, the method of electrolyzing precious metals on the surface of insoluble anode plates can also be used; the shape of the anode can be sheet-shaped, mesh-shaped, or special-shaped, for example, the flat plate is bent into an arc shape, or the mesh is bent into an arc Another example is various combinations of different sizes and distributions of holes on the flat plate according to different positions. A combination of more than one species.
  • the optional range of the arithmetic mean value of the surface roughness of the lead frame is 0.05 ⁇ m to 5.0 ⁇ m, preferably 0.07 ⁇ m to 4.5 ⁇ m, and more preferably 0.09 ⁇ m to 3.9 ⁇ m.

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CN114171487B (zh) * 2021-12-06 2022-07-12 天水华洋电子科技股份有限公司 一种用于集成电路引线框架表面处理装置

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