CN112331566A - 引线框架表面粗糙度的制造设备及制造方法 - Google Patents

引线框架表面粗糙度的制造设备及制造方法 Download PDF

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Publication number
CN112331566A
CN112331566A CN202011204117.3A CN202011204117A CN112331566A CN 112331566 A CN112331566 A CN 112331566A CN 202011204117 A CN202011204117 A CN 202011204117A CN 112331566 A CN112331566 A CN 112331566A
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CN
China
Prior art keywords
lead frame
pulse
surface roughness
electrolytic copper
reverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202011204117.3A
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English (en)
Chinese (zh)
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CN112331566B (zh
Inventor
门松明珠
周爱和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan A Tripod Plating Equipment Co ltd
Original Assignee
Kunshan A Tripod Plating Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan A Tripod Plating Equipment Co ltd filed Critical Kunshan A Tripod Plating Equipment Co ltd
Priority to CN202011204117.3A priority Critical patent/CN112331566B/zh
Publication of CN112331566A publication Critical patent/CN112331566A/zh
Priority to JP2022519585A priority patent/JP2022547336A/ja
Priority to PCT/CN2021/124340 priority patent/WO2022089232A1/zh
Application granted granted Critical
Publication of CN112331566B publication Critical patent/CN112331566B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN202011204117.3A 2020-11-02 2020-11-02 引线框架表面粗糙度的制造设备及制造方法 Active CN112331566B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202011204117.3A CN112331566B (zh) 2020-11-02 2020-11-02 引线框架表面粗糙度的制造设备及制造方法
JP2022519585A JP2022547336A (ja) 2020-11-02 2021-10-18 リードフレーム表面粗化度の製造設備及び製造方法
PCT/CN2021/124340 WO2022089232A1 (zh) 2020-11-02 2021-10-18 引线框架表面粗糙度的制造设备及制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011204117.3A CN112331566B (zh) 2020-11-02 2020-11-02 引线框架表面粗糙度的制造设备及制造方法

Publications (2)

Publication Number Publication Date
CN112331566A true CN112331566A (zh) 2021-02-05
CN112331566B CN112331566B (zh) 2024-09-27

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CN202011204117.3A Active CN112331566B (zh) 2020-11-02 2020-11-02 引线框架表面粗糙度的制造设备及制造方法

Country Status (3)

Country Link
JP (1) JP2022547336A (ja)
CN (1) CN112331566B (ja)
WO (1) WO2022089232A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114171487A (zh) * 2021-12-06 2022-03-11 天水华洋电子科技股份有限公司 一种用于集成电路引线框架表面处理装置
WO2022089232A1 (zh) * 2020-11-02 2022-05-05 昆山一鼎工业科技有限公司 引线框架表面粗糙度的制造设备及制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832005A (ja) * 1994-07-12 1996-02-02 Sony Corp リードフレームのめっき装置
US20060189037A1 (en) * 2005-02-18 2006-08-24 Texas Instruments Incorporated Low cost method to produce high volume lead frames
CN109468670A (zh) * 2018-11-16 2019-03-15 中山品高电子材料有限公司 引线框架电镀铜层的方法
CN109989083A (zh) * 2019-04-28 2019-07-09 天水华洋电子科技股份有限公司 一种超粗化引线框架电镀预处理工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6558231B1 (en) * 2000-10-17 2003-05-06 Faraday Technology Marketing Goup, Llc Sequential electromachining and electropolishing of metals and the like using modulated electric fields
JP4981488B2 (ja) * 2007-03-09 2012-07-18 古河電気工業株式会社 粗化圧延銅板およびその製造方法
JP6093646B2 (ja) * 2013-05-14 2017-03-08 新光電気工業株式会社 めっき膜の製造方法
JP7119574B2 (ja) * 2018-05-25 2022-08-17 三菱マテリアル株式会社 リードフレーム及びその製造方法
CN111304700A (zh) * 2020-03-26 2020-06-19 深圳市惟华电子科技有限公司 一种逆向铜箔的制备方法
CN112331566B (zh) * 2020-11-02 2024-09-27 昆山一鼎工业科技有限公司 引线框架表面粗糙度的制造设备及制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832005A (ja) * 1994-07-12 1996-02-02 Sony Corp リードフレームのめっき装置
US20060189037A1 (en) * 2005-02-18 2006-08-24 Texas Instruments Incorporated Low cost method to produce high volume lead frames
CN109468670A (zh) * 2018-11-16 2019-03-15 中山品高电子材料有限公司 引线框架电镀铜层的方法
CN109989083A (zh) * 2019-04-28 2019-07-09 天水华洋电子科技股份有限公司 一种超粗化引线框架电镀预处理工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022089232A1 (zh) * 2020-11-02 2022-05-05 昆山一鼎工业科技有限公司 引线框架表面粗糙度的制造设备及制造方法
CN114171487A (zh) * 2021-12-06 2022-03-11 天水华洋电子科技股份有限公司 一种用于集成电路引线框架表面处理装置

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CN112331566B (zh) 2024-09-27
WO2022089232A1 (zh) 2022-05-05
JP2022547336A (ja) 2022-11-11

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