WO2022083181A1 - 晶圆用承载环的安装夹具 - Google Patents

晶圆用承载环的安装夹具 Download PDF

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Publication number
WO2022083181A1
WO2022083181A1 PCT/CN2021/105755 CN2021105755W WO2022083181A1 WO 2022083181 A1 WO2022083181 A1 WO 2022083181A1 CN 2021105755 W CN2021105755 W CN 2021105755W WO 2022083181 A1 WO2022083181 A1 WO 2022083181A1
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Prior art keywords
groove portion
ring
groove
circular hole
lug
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PCT/CN2021/105755
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English (en)
French (fr)
Inventor
夏智
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长鑫存储技术有限公司
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Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/602,836 priority Critical patent/US11610803B2/en
Publication of WO2022083181A1 publication Critical patent/WO2022083181A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/02—Assembly jigs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present disclosure is based on the Chinese patent application with the application number 202011125860.X, the application date is October 20, 2020, and the application name is "Mounting Fixture for Wafer Carrier Ring", and claims the priority of the Chinese patent application, which The entire contents of the Chinese patent application are hereby incorporated by reference into the present disclosure.
  • the present disclosure relates to, but is not limited to, mounting jigs for carrier rings for wafers.
  • the wafer needs to be placed on a heated susceptor in a wafer reaction chamber for reaction growth.
  • the number of heating bases is multiple, and each heating base is placed on a carrier ring for carrying the wafer.
  • the carrier ring can move the wafer from one heating base to another heating base, thereby making the wafer.
  • the circle performs the corresponding process on each heating base.
  • the surface of the bearing ring will gradually accumulate reactive derivatives, and if there are too many reactive derivatives, the bearing ring cannot be used normally.
  • the present disclosure provides a mounting jig for a carrier ring for a wafer
  • the carrier ring includes a circular ring portion, a screw member and a plurality of fixing seats
  • the circular ring portion includes a ring body and a plurality of lugs, a plurality of the convex
  • the lugs are evenly distributed on the outer wall of the ring body;
  • the first end of the fixing seat is provided with a threaded hole, the lug is provided with a light hole, and the threaded member can be connected with the threaded hole after passing through the light hole threaded connection;
  • the fixing seat and the lug are connected, the second end of the fixing seat can face the center of the ring body and protrude from the inner wall of the ring body;
  • the first end of the plurality of fixing seats can be The two ends form a bearing surface for bearing the wafer
  • the mounting fixture includes:
  • the first clamping body has a first circular hole portion and a first groove portion; the diameter of the first circular hole portion is greater than or equal to the outer diameter of the ring body; the first groove portion extends from the first circular hole The inner wall of the ring portion extends to the outside of the first clamping body; when the ring body is located in the first circular hole portion, the first groove portion can clamp the lug;
  • the second clip body is fixedly connected to the first clip body, the second clip body has a second groove part, the second groove part penetrates the second clip body; clamped in the first groove part
  • the fixing seat can penetrate into the second groove portion from the side of the second groove portion away from the first groove portion, and the central axis of the threaded hole and the optical hole coincide , and the fixing seat can pass out from the side of the first groove part away from the second groove part.
  • the diameter of the first circular hole of the first clamping body is greater than or equal to the outer diameter of the ring body, so that the ring body of the circular ring part can be placed in the first
  • the first groove portion extends from the inner wall of the first round hole portion to the outer side of the first clip body, and when the ring body is located in the first round hole portion, the first groove portion of the first clip body can be clamped
  • the lugs of the tight annular portion, that is, the first clip body can fix the annular portion.
  • the second clip body is fixedly connected to the first clip body, the second groove part of the second clip body and the first groove part of the first clip body are arranged opposite, and when the first groove part clamps the lug, the The fixing seat can penetrate into the second groove portion from the side of the second groove portion away from the first groove portion, the central axis of the threaded hole on the fixing seat and the light hole on the lug coincide, and the fixing seat can pass from the first groove portion. Pass through the side away from the second groove.
  • the second clip body in the present disclosure can simultaneously position multiple fixing bases, thereby ensuring the safety between the second ends of the fixing bases.
  • the relative positions not only shorten the time-consuming process of assembling the bearing ring, but also improve the maintenance efficiency of the bearing ring.
  • FIG. 1 is a schematic structural diagram of a bearing ring in the related art.
  • FIG. 2 is an exploded schematic diagram of each component of the bearing ring in the related art.
  • FIG. 3 is a schematic structural diagram of a fixing seat in the related art.
  • FIG. 4 is a schematic diagram of a gap between a roller and a wafer in the related art.
  • FIG. 5 is a schematic structural diagram of an installation jig according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a first clip body according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a first clip body according to an embodiment of the present disclosure.
  • 100 bearing ring; 101, annular part; 1011, ring body; 1012, lug; 10120, light hole; 102, fixing seat; 1020, threaded hole; 1021, connecting block; 1022, bearing rod; 1023 103, threaded part; 1031, screw; 1032, wave washer; 104, bearing surface; 105, wafer; 1, first clamping body; 11, first round hole; 12, first groove; 2.
  • the annular step The annular step.
  • the carrier ring 100 is used to carry the wafer 105 .
  • the carrier ring 100 can be a ceramic ring, and the carrier ring 100 can also be made of other high temperature resistant materials, which is not described here. Special restrictions.
  • the carrier ring 100 may include a circular ring portion 101, a plurality of fixing seats 102 and a screw member 103, wherein,
  • the annular portion 101 may include a ring body 1011 and a lug 1012, wherein the number of the lugs 1012 is multiple, for example, the number of the lugs 1012 may be three, four or five, and the plurality of convex lugs 1012
  • the lugs 1012 can be evenly distributed on the outer wall of the ring body 1011 ; at the same time, the lugs 1012 can be provided with light holes 10120 , the diameter of the light holes 10120 is larger than the outer diameter of the threaded part of the threaded member 103 and smaller than the head of the threaded member 103 , so that the screw 103 can be placed through the lug 1012;
  • the first end of the fixing seat 102 may be provided with a threaded hole 1020, and the specification of the threaded hole 1020 is the same as that of the threaded portion of the threaded member 103, so that the threaded member 103 can be threaded with the threaded hole 1020 after passing through the optical hole 10120. connection, so as to realize the assembly of the annular part 101 , the fixing seat 102 and the screw 103 .
  • the fixing base 102 may include a connecting block 1021 and a bearing rod 1022, wherein the connecting block 1021 is provided with a threaded hole 1020, which can be connected to the lug 1012; one end of the bearing rod 1022 is connected to the connecting block 1021, and the other end is provided with a roller 1023; at the same time, when the connecting block 1021 is connected to the lug 1012, the end of the bearing rod 1022 provided with the roller 1023 can face the center of the ring body 1011 and protrude from the inner wall of the ring body 1011 to form a bearing surface 104, the bearing surface 104 Used to carry the wafer 105 .
  • rollers 1023 can guide the wafer 105 placed on the support bar 1022, so that the wafer 105 can be placed on the support surface 104 in a regular manner, which will not be described in detail here.
  • the screw 103 may include a screw 1031 and a wave washer 1032, wherein the screw 1031 includes the aforementioned threaded portion and head, which will not be repeated here; the wave washer 1032 may be provided on the head and lugs of the screw 1031 Between the top surfaces of 1012, it is used to prevent loosening of screws 1031 due to external force and other reasons after tightening.
  • 0.006 inches is to ensure that the wafer 105 can be placed on the carrier rod 1022 well; 0.012 inches is to ensure that the wafer 105 will not have too much deflection when it falls on the heating base, thereby preventing the wafer 105 from reacting to the long film When an eccentric circle occurs, the yield of the wafer 105 is ensured.
  • the operation process is to fasten one fixing seat 102 and then another fixing seat 102.
  • the operator needs to remove the fixing base 102 from the annular portion 101 and install it again until the gap G is within the above-mentioned standard range.
  • the maintenance of the bearing ring 100 requires repeated assembly three times on average, which takes a long time, thereby reducing the maintenance efficiency of the bearing ring 100 .
  • the screw 1031 is repeatedly disassembled and installed, which naturally increases the risk of the screw 1031 chipping.
  • Embodiments of the present disclosure provide a mounting fixture for a wafer carrier ring.
  • the mounting fixture may include a first clamping body 1 and a second clamping body 2 , wherein,
  • the first clip body 1 may have a first circular hole portion 11 and a first groove portion 12; the diameter of the first circular hole portion 11 may be greater than or equal to the outer diameter of the ring body 1011;
  • the inner wall of 11 extends to the outside of the first clamp body 1, and when the ring body 1011 is located in the first circular hole portion 11, the first groove portion 12 can clamp the lug 1012, that is, the first clamp body 1 can be opposed to the circular ring.
  • the part 101 is fixed.
  • the second clip body 2 can be fixedly connected to the first clip body 1 , and the second clip body 2 can have a second groove portion 21 , and the second groove portion 21 penetrates the second clip body 2 ; 1012, the fixing seat 102 can penetrate into the second groove portion 21 from the side of the second groove portion 21 away from the first groove portion 12, the central axes of the threaded hole 1020 and the optical hole 10120 are coincident, and the fixing seat 102 can pass from the first groove portion The side of the part 12 away from the second groove part 21 protrudes out.
  • the operator only needs to pass the threaded member 103 through the optical hole 10120 and screw it with the threaded hole 1020 to assemble the annular portion 101, the threaded member 103 and the fixing seat 102, and then take it out of the installation fixture.
  • the entire assembly process can be completed by taking out the carrier ring 100 .
  • the second clip body 2 in the present disclosure can simultaneously position the multiple fixing bases 102 , ensuring the first position of each fixing base 102 .
  • the relative positions between the two ends are such that the gap G between each roller 1023 and the wafer 105 is within the above-mentioned standard range.
  • the installation jig of the embodiment of the present disclosure can successfully assemble the plurality of fixing seats 102 at one time, thereby shortening the assembling time of the carrier ring 100 and improving the maintenance efficiency of the carrier ring 100 .
  • the first clip body 1 is used to fix the annular portion 101 , wherein the first clip body 1 may have a first round hole portion 11 and a first groove portion 12 , wherein,
  • the diameter of the first round hole portion 11 may be greater than or equal to the outer diameter of the ring body 1011, so that the ring body 1011 can be placed in the first round hole portion 11, which is not particularly limited here;
  • the diameter of a circular hole portion 11 can be equal to the outer diameter of the ring body 1011 . In this case, not only the smoothness of the assembly can be ensured, but also the assembly error can be reduced.
  • the first circular hole portion 11 may pass through the first clamping body 1, that is, the first circular hole portion 11 may be a through hole; for example, the first circular hole portion 11 may also be a blind hole, correspondingly, the first circular hole portion 11 may be a blind hole.
  • the height of the portion 11 is smaller than the height of the first clip body 1 , which is not particularly limited here.
  • the first groove portion 12 extends from the inner wall of the first round hole portion 11 to the outer side of the first clip body 1 , that is, the first groove portion 12 and the first round hole portion 11 penetrate through, so that the ring body 1011 is located in the ring body 1011 .
  • the lug 1012 can be inserted into the first groove portion 12 , and the first groove portion 12 can clamp the lug 1012 , thereby realizing the fixing of the circular ring portion 101 in the first clamping body 1 .
  • the left and right inner walls of the first groove portion 12 may be arranged at an acute angle, so that the inner walls of the first groove portion 12 can abut against the lugs 1012 .
  • the inner wall of the first groove portion 12 and the outer wall of the lug 1012 are completely fitted, that is, the first groove portion 12 and the lug are completely fitted
  • the shape and size of the 1012 are exactly the same, thereby not only ensuring the smoothness of the assembly, but also reducing the assembly error.
  • the outer edge of the first clip body 1 may be round, square or triangular, etc., which will not be listed here.
  • the thickness of the first clip body 1 may be greater than or equal to the thickness of the ring body 1011.
  • the thickness of the first clip body 1 is equal to the thickness of the ring body 1011.
  • the first circular hole portion 11 is a through hole, so as to ensure ease of assembly.
  • the second clip body 2 is fixedly connected to the first clip body 1 , and the connection method can be welding, clipping or welding, etc., which will not be listed here.
  • the first clip body 1 and the second clip body 2 can also be integrally formed, which not only ensures the positional accuracy of the first clip body 1 and the second clip body 2, but also reduces the processing difficulty of the installation fixture. .
  • the second clip body 2 is used to position the fixing base 102 .
  • the second clip body 2 may have a second groove portion 21 , and the second groove portion 21 may penetrate through the second clip body 2 , as shown in FIGS. 1 and 2 .
  • the width of the fixing seat 102 is smaller than the width of the lug 1012 , correspondingly, the width of the first groove portion 12 is greater than the width of the second groove portion 21 , which will not be described in detail here.
  • the fixing seat 102 can penetrate into the second groove portion 21 from the side of the second groove portion 21 away from the first groove portion 12, and the thread of the fixing seat 102
  • the central axis of the hole 1020 and the light hole 10120 of the lug 1012 are coincident.
  • the operator then passes the screw 1031 through the optical hole 10120 and then screw it into the threaded hole 1020, that is, the ring portion 101, the screw 103 and the fixing seat 102 can be assembled, and the rollers 1023 can be placed between the wafers 105.
  • the gap G meets the above standard range at one time.
  • the fixing seat 102 when the fixing seat 102 penetrates into the second groove portion 21, the inner wall of the second groove portion 21 and the outer wall of the fixing seat 102 are completely abutted.
  • the central axes of the holes 10120 are coincident.
  • it can also ensure that the fixing seat 102 is pulled out from the side of the first groove portion 12 away from the second groove portion 21, thereby completing the entire operation process.
  • the installation jig of the embodiment of the present disclosure can not only shorten the assembly time of the bearing ring 100, thereby improving the maintenance efficiency of the bearing ring 100, but also reduce the need for repeated dismantling of the installation screws 1031, and naturally reduce the number of ceramic screws 1031. Wear, prolong the service life of the screw 1031, and reduce the risk of tooth chipping of the screw 1031.
  • the second clamping body 2 may also have a second circular hole portion 22 , and the central axis of the second circular hole portion 22 is coincident with the central axis of the first circular hole portion 11 , that is, the second circular hole portion 22 It is arranged opposite to the first round hole portion 11, and the second groove portion 21 extends from the inner wall of the second round hole portion 22 to the outside of the second clamping body 2, that is, the second groove portion 21 and the second round hole portion 21.
  • the part 22 penetrates through, and will not be described in detail here.
  • the fixing base 102 includes the connecting block 1021 and the bearing rod 1022.
  • the projection of the connecting block 1021 on the lug 1012 is located inside the lug 1012, and the bearing rod 1022 is provided with One end of the roller 1023 protrudes from the inner wall of the ring body 1011 .
  • the inner wall of the second groove portion 21 and the outer wall of the connecting block 1021 are completely abutted, thereby ensuring that the central axes of the threaded hole 1020 and the optical hole 10120 are coincident, which will not be described in detail here.
  • the connecting block 1021 can pass through the second groove portion 21 and then pass out of the first groove portion 12 , and at the same time, the bearing rod 1022 can also pass through the second round hole portion 22 and the first round hole portion 11 in sequence. Therefore, after the assembly of the annular portion 101 , the screw member 103 and the fixing seat 102 is completed, the operator can directly pull out the carrier ring 100 from the installation fixture, thereby completing the entire operation process.
  • the diameter of the second round hole portion 22 may be equal to or smaller than the diameter of the first round hole portion 11 , which will be introduced in the following cases:
  • the second round hole portion 22 and the first round hole portion 11 form a light hole, as shown in FIG. 2 and FIG. 3 , due to the convex
  • the lugs 1012 protrude from the connecting block 1021 , and correspondingly, the depth of the first groove portion 12 is greater than the depth of the second groove portion 21 , thereby ensuring the connection between the connecting block 1021 and the lug 1012 , which will not be described in detail here.
  • a plurality of bosses may be provided on the inner wall of the second round hole portion 22 for supporting the ring body 1011 .
  • the plurality of bosses may be evenly distributed, and the plurality of bosses may be arranged to avoid the second groove portion 21 , which will not be described in detail here.
  • the depth of the second groove portion 21 determines the gap G between each roller 1023 and the wafer 105 . Therefore, when processing the mounting jig, the depth value of the second groove portion 21 can be determined to ensure the gap G.
  • the standard range of the gap G is 0.006 inches to 0.012 inches. Therefore, the specific value of the gap G can be set as 0.009 inches, and the depth of the second groove portion 21 can be calculated according to the various dimensions of the installation fixture, so as to ensure that the plurality of fixing seats 102 can be assembled successfully at one time.
  • the specific value of the gap G can also be set as 0.007 inches, 0.008 inches, 0.010 inches, 0.011 inches, etc., which are not specially limited here.
  • the diameter of the second round hole portion 22 When the diameter of the second round hole portion 22 is smaller than the diameter of the first round hole portion 11, at this time, the diameter of the second round hole portion 22 must be larger than the inner diameter of the ring body 1011, so that the wafer 105 can be placed in multiple on the bearing surface 104 formed by each of the bearing rods 1022 .
  • the second circular hole portion 22 and the first circular hole portion 11 may form an annular step 3 , and the annular step 3 can support the ring body 1011 , thereby facilitating the transfer of the wafer 105 by the carrier ring 100 . .
  • the threaded member 103 is passed through the light hole 10120 of the lug 1012, and is threadedly connected with the threaded hole 1020 of the fixing base 102, so that the assembly of the annular portion 101, the threaded member 103 and the fixing base 102 can be realized;
  • the carrier ring 100 is pulled out from the installation fixture to complete the entire operation process of the carrier ring 100 .
  • the diameter of the first circular hole of the first clamping body is greater than or equal to the outer diameter of the ring body, so that the ring body of the circular ring part can be placed in the first
  • the first groove portion extends from the inner wall of the first round hole portion to the outer side of the first clip body, and when the ring body is located in the first round hole portion, the first groove portion of the first clip body can be clamped
  • the lugs of the tight annular portion, that is, the first clip body can fix the annular portion.
  • the second clip body is fixedly connected to the first clip body, the second groove part of the second clip body and the first groove part of the first clip body are arranged opposite, and when the first groove part clamps the lug, the The fixing seat can penetrate into the second groove portion from the side of the second groove portion away from the first groove portion, the central axis of the threaded hole on the fixing seat and the light hole on the lug coincide, and the fixing seat can pass from the first groove portion. Pass through the side away from the second groove.
  • the second clip body in the present disclosure can simultaneously position multiple fixing bases, thereby ensuring the safety between the second ends of the fixing bases.
  • the relative positions not only shorten the time-consuming process of assembling the bearing ring, but also improve the maintenance efficiency of the bearing ring.

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  • General Physics & Mathematics (AREA)
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Abstract

晶圆(105)用承载环(100)的安装夹具，承载环包括圆环部(101)、螺纹件(103)和多个固定座(102)，其中，圆环部包括环体(1011)和多个设有光孔(10120)的凸耳(1012)；固定座设有螺纹孔(1020)，螺纹件穿过光孔后能够与螺纹孔螺纹连接；该安装夹具包括第一夹体(1)和第二夹体(2)，其中，第一夹体具有第一圆孔部(11)和第一槽部(12)；第一圆孔部的直径大于或等于环体的外直径；第一槽部从第一圆孔部的内壁向第一夹体的外侧延伸；在环体位于第一圆孔部时，第一槽部能够卡紧凸耳；第二夹体具有贯穿第二夹体的第二槽部(21)；在第一槽部卡紧凸耳时，固定座能够穿入第二槽部，螺纹孔和光孔的中轴线重合，且固定座能够从第一槽部穿出。

Description

晶圆用承载环的安装夹具
本公开基于申请号为202011125860.X，申请日为2020年10月20日，申请名称为“晶圆用承载环的安装夹具”的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本公开作为参考。
技术领域
本公开涉及但不限于晶圆用承载环的安装夹具。
背景技术
在半导体器件的加工过程中，需要将晶圆放置在晶圆反应腔中的加热基座上进行反应长膜。加热基座的个数为多个，每个加热基座上都放置一个用来承载晶圆的承载环，承载环能够将晶圆从一个加热基座移动到另一个加热基座，进而使得晶圆在各个加热基座进行相应的工艺。在实际过程中，承载环的表面会逐渐积累反应衍生物，而在反应衍生物过多会导致承载环无法正常使用。
因此，在对晶圆反应腔进行保养时，同样需要对承载环进行处理，具体而言，将承载环上的多个固定座和螺纹件从承载环的圆环部上拆卸下来，并对各个部件进行清洗擦拭，再将固定座、螺纹件和圆环部重新组装到一起。
目前，承载环的组装过程耗时较长，进而严重降低了承载环的保养效率。
发明内容
以下是对本公开详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开提供一种晶圆用承载环的安装夹具，所述承载环包括圆环部、螺纹件和多个固定座，所述圆环部包括环体和多个凸耳，多个所述凸耳均匀分布于所述环体的外壁；所述固定座的第一端设有螺纹孔，所 述凸耳设有光孔，所述螺纹件穿过所述光孔后能够与所述螺纹孔螺纹连接；在所述固定座和所述凸耳连接时，所述固定座的第二端能够朝向所述环体的中心、并突出所述环体的内壁；多个所述固定座的第二端形成一用于承载晶圆的承载面，所述安装夹具包括：
第一夹体，具有第一圆孔部和第一槽部；所述第一圆孔部的直径大于或等于所述环体的外直径；所述第一槽部从所述第一圆孔部的内壁向所述第一夹体的外侧延伸；在所述环体位于所述第一圆孔部时，所述第一槽部能够卡紧所述凸耳；
第二夹体，固定连接于所述第一夹体，所述第二夹体具有第二槽部，所述第二槽部贯穿所述第二夹体；在所述第一槽部卡紧所述凸耳时，所述固定座能够从所述第二槽部远离所述第一槽部的一侧穿入所述第二槽部，所述螺纹孔和所述光孔的中轴线重合，且所述固定座能够从所述第一槽部远离所述第二槽部的一侧穿出。
本公开实施例所提供的晶圆用承载环的安装夹具，第一夹体的第一圆孔部的直径大于或等于环体的外直径，从而使得圆环部的环体能够放进第一圆孔部；同时，第一槽部从第一圆孔部的内壁向第一夹体的外侧延伸，且在环体位于第一圆孔部时，第一夹体的第一槽部能够卡紧圆环部的凸耳，即：第一夹体能够对圆环部进行固定。
另外，第二夹体固定连接于第一夹体，第二夹体的第二槽部和第一夹体的的第一槽部正对设置，且在第一槽部卡紧凸耳时，固定座能够从第二槽部远离第一槽部的一侧穿入第二槽部，固定座上的螺纹孔和凸耳上的光孔的中轴线重合，且固定座能够从第一槽部远离第二槽部的一侧穿出。
由此，操作人员只需将螺纹件穿过凸耳的光孔、并与固定座的螺纹孔螺纹连接，即可以将圆环部、螺纹件和固定座组装起来，再从安装夹具中拿出承载环即可完成整个操作过程。
因此，相较于现有技术中需要反复调整固定座的位置的技术方案，本公开中第二夹体能够同时对多个固定座进行定位，从而保证了各个固定座的第二端之间的相对位置，不但使承载环的组装过程耗时较短，也 提高了承载环的保养效率。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
并入到说明书中并且构成说明书的一部分的附图示出了本公开的实施例，并且与描述一起用于解释本公开实施例的原理。在这些附图中，类似的附图标记用于表示类似的要素。下面描述中的附图是本公开的一些实施例，而不是全部实施例。对于本领域技术人员来讲，在不付出创造性劳动的前提下，可以根据这些附图获得其他的附图。
图1是相关技术中承载环的结构示意图。
图2是相关技术中承载环的各个零部件的爆炸示意图。
图3是相关技术中固定座的结构示意图。
图4是相关技术中滚轮和晶圆之间的间隙的示意图。
图5是本公开实施方式安装夹具的结构示意图。
图6是本公开实施方式第一夹体的结构示意图。
图7是本公开实施方式第一夹体的结构示意图。
图中：100、承载环；101、圆环部；1011、环体；1012、凸耳；10120、光孔；102、固定座；1020、螺纹孔；1021、连接块；1022、承载杆；1023、滚轮；103、螺纹件；1031、螺钉；1032、波形垫片；104、承载面；105、晶圆；1、第一夹体；11、第一圆孔部；12、第一槽部；2、第二夹体；21、第二槽部；22、第二圆孔部；3、环形台阶。
具体实施方式
下面将结合本公开实施例中的附图，对公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。
如图1～图4所示，承载环100用来将承载晶圆105，举例而言，该承载 环100可以为陶瓷环，该承载环100也可以采用其他耐高温材料制成，此处不作特殊限定。
该承载环100可以包括圆环部101、多个固定座102和螺纹件103，其中，
圆环部101可以包括环体1011和凸耳1012，其中，凸耳1012的数量为多个，举例而言，凸耳1012的数量可以为三个、四个或五个等，且多个凸耳1012可以均匀分布于环体1011的外壁；同时，凸耳1012上可以设有光孔10120，该光孔10120的直径大于螺纹件103的螺纹部的外直径、且小于螺纹件103的头部的外直径，从而使得螺纹件103能够穿过凸耳1012设置；
固定座102的第一端可以设有螺纹孔1020，且该螺纹孔1020的规格和螺纹件103的螺纹部的规格相同，从而使得螺纹件103能够在穿过光孔10120后与螺纹孔1020螺纹连接，进而实现圆环部101、固定座102和螺纹件103的组装。
该固定座102可以包括连接块1021和承载杆1022，其中，连接块1021上设有螺纹孔1020，能够连接于凸耳1012；承载杆1022的一端连接于连接块1021、另一端上设有滚轮1023；同时，在连接块1021连接于凸耳1012时，承载杆1022设有滚轮1023的一端能够朝向环体1011的中心、并突出环体1011的内壁，形成一承载面104，该承载面104用来承载晶圆105。
需要注意的是，滚轮1023能够对放置在承载杆1022上的晶圆105进行导正，从而使得晶圆105能够规正的放在承载面104上，此处不再详细描述。
螺纹件103可以包括螺钉1031和波形垫片1032，其中，螺钉1031包括如前所述的螺纹部和头部，此处不再赘述；波形垫片1032可以设于螺钉1031的头部和凸耳1012的顶面之间，用于防止螺钉1031紧固后因外力等原因产生松动。
如图4所示，在实际使用过程中，滚轮1023和晶圆105之间存在微小的间隙G，该间隙G的标准范围为0.006英寸～0.012英寸，其中，
0.006英寸是为了保证晶圆105能够完好地放在承载杆1022上；0.012英寸是为了保证晶105在下落至加热基座上时不会有过多的偏移，从而避免晶圆105反应长膜时出现偏心圆的情况，进而保证了晶圆105的良品率。
目前，操作过程是将一个固定座102紧固之后再紧固另一个固定座102，而由于圆环部101、固定座102和螺纹件103本身就存在微小的加工误差，且操作人员在对准螺纹孔1020和光孔10120的过程中也存在一定的安装偏差，导致多个固定座102组装后的误差被放大，进而使得滚轮1023和晶圆105之间的间隙G超出上述标准范围。
因此，操作人员需要从圆环部101上拆下固定座102、并重新进行安装，直到间隙G位于上述标准范围之内。根据统计数据，保养承载环100平均要反复组装3次，耗时较长，进而降低了承载环100的保养效率。而且，螺钉1031被反复拆卸安装，自然也增加了螺钉1031崩牙的风险。
本公开实施方式中提供一种晶圆用承载环的安装夹具，如图5～图7所示，该安装夹具可以包括第一夹体1和第二夹体2，其中，
第一夹体1可以具有第一圆孔部11和第一槽部12；第一圆孔部11的直径可以大于或等于环体1011的外直径；第一槽部12从第一圆孔部11的内壁向第一夹体1的外侧延伸，且在环体1011位于第一圆孔部11时，第一槽部12能够卡紧凸耳1012，即：第一夹体1能够对圆环部101进行固定。
第二夹体2可以固定连接于第一夹体1，第二夹体2可以具有第二槽部21，第二槽部21贯穿第二夹体2；在第一槽部12卡紧凸耳1012时，固定座102能够从第二槽部21远离第一槽部12的一侧穿入第二槽部21，螺纹孔1020和光孔10120的中轴线重合，且固定座102能够从第一槽部12远离第二槽部21的一侧穿出。
由此，操作人员只需将螺纹件103穿过光孔10120、并与螺纹孔1020螺纹连接，即可以将圆环部101、螺纹件103和固定座102组装起来，然后再从安装夹具中拿出承载环100即可完成整个组装过程。
因此，相较于现有技术中需要反复拆卸并调整固定座102的位置的技术方案，本公开中第二夹体2能够同时对多个固定座102进行定位，保证了各个固定座102的第二端之间的相对位置，并使得各个滚轮1023和晶圆105之间的间隙G位于上述标准范围之内。
也就是说，本公开实施方式的安装夹具能够使得多个固定座102一次性组装成功，从而缩短了承载环100的组装时间，进而提高了承载环100的保养效率。
而且，由于不再需要反复拆卸安装螺钉1031，自然也减少了陶瓷材质的螺钉1031的磨损，延长了螺钉1031的使用寿命，并降低了螺钉1031出现崩牙的风险。
下面结合附图对本公开实施方式的安装夹具进行详细说明：
如图5和图6所示，第一夹体1用来对圆环部101进行固定，其中，第一夹体1可以具有第一圆孔部11和第一槽部12，其中，
第一圆孔部11的直径可以大于或等于环体1011的外直径，从而使得环体1011可以放置在第一圆孔部11中，此处不作特殊限定；在一些示例性实施方式中，第一圆孔部11的直径可以等于环体1011的外直径，此时，不但可以保证组装的顺畅度，也可降低组装的误差。
第一圆孔部11可以贯通第一夹体1，也就是说，第一圆孔部11可以为通孔；例如，第一圆孔部11也可以为盲孔，相应地，第一圆孔部11的高度小于第一夹体1的高度，此处不作特殊限定。
第一槽部12从第一圆孔部11的内壁向第一夹体1的外侧延伸，也就是说，第一槽部12和第一圆孔部11贯通，由此，在环体1011位于第一圆孔部11时，凸耳1012能够放进第一槽部12，且第一槽部12能够卡紧凸耳1012，进而实现圆环部101在第一夹体1中的固定。
在一些示例性实施方式中，第一槽部12的左右内壁可以呈锐角设置，从而使得第一槽部12的内壁能够顶抵凸耳1012。
在一些示例性实施方式中，在环体1011位于第一圆孔部11时，第一槽部12的内壁和凸耳1012的外壁完全贴合，也就是说，第一槽部12和凸耳1012的形状和尺寸完全相同，由此，不但可以保证组装的顺畅度，而且可降低组装误差。
在一些示例性实施方式中，第一夹体1的外边缘可以呈圆形、方形或是三角形等，此处不再一一列举。另外，第一夹体1的厚度可以大于或等于环体1011的厚度，例如，第一夹体1的厚度等于环体1011的厚度，此时，第一圆孔部11为通孔，从而保证了组装的顺畅度。
如图5和图7所示，第二夹体2固定连接于第一夹体1，连接的方式可以为焊接、卡接或焊接等，此处不再一一列举。在一些示例性实施方式中，第一夹体1和第二夹体2也可以一体成型，不但能够保证第一夹体1和第二 夹体2的位置精度，也降低了安装夹具的加工难度。
第二夹体2用来对固定座102进行定位，例如，第二夹体2可以具有第二槽部21，第二槽部21可以贯穿第二夹体2，如图1和图2所示，由于固定座102的宽度小于凸耳1012的宽度，相应地，第一槽部12宽度大于第二槽部21宽度，此处不再详细描述。
由此，在第一槽部12卡紧凸耳1012时，固定座102能够从第二槽部21远离第一槽部12的一侧穿入第二槽部21，而且，固定座102的螺纹孔1020和凸耳1012的光孔10120的中轴线重合。
相应地，操作人员接将螺钉1031穿过光孔10120后拧入螺纹孔1020，即可以将圆环部101、螺纹件103和固定座102组装起来，并使得各个滚轮1023到晶圆105之间的间隙G一次性满足上述标准范围。
在一些示例性实施例中，在固定座102穿入第二槽部21时，第二槽部21的内壁和固定座102的外壁完全贴合，由此，一方面，能够保证螺纹孔1020和光孔10120的中轴线重合，另一方面，也能保证固定座102从第一槽部12远离第二槽部21的一侧拔出，进而完成整个操作过程。
因此，本公开实施方式的安装夹具不但能够缩短承载环100的组装时间，进而提高承载环100的保养效率，而且，由于不再需要反复拆卸安装螺钉1031，自然也减少了陶瓷材质的螺钉1031的磨损，延长了螺钉1031的使用寿命，并降低了螺钉1031出现崩牙的风险。
如图7所示，第二夹体2还可以具有第二圆孔部22，第二圆孔部22的中轴线和第一圆孔部11的中轴线重合，即：第二圆孔部22和第一圆孔部11正对设置，且第二槽部21从第二圆孔部22的内壁向第二夹体2的外侧延伸，也就是说，第二槽部21和第二圆孔部22贯通，此处不再详细描述。
如前所述，固定座102包括连接块1021和承载杆1022，在固定座102连接在凸耳1012上时，连接块1021在凸耳1012的投影位于凸耳1012之内，承载杆1022设有滚轮1023的一端突出环体1011的内壁。相应地，第二槽部21的内壁和连接块1021的外壁完全贴合，进而保证螺纹孔1020和光孔10120的中轴线重合，此处不再详细描述。
因此，连接块1021可以从第二槽部21穿入后再从第一槽部12穿出，同时，承载杆1022也可以依次从第二圆孔部22和第一圆孔部11穿过。由此， 在圆环部101、螺纹件103和固定座102组装完成后，操作人员可以直接从安装夹具中抽出承载环100，进而完成整个操作过程。
另外，第二圆孔部22的直径可以等于或小于第一圆孔部11的直径，下面分情况进行介绍：
①在第二圆孔部22的直径等于第一圆孔部11的直径时，第二圆孔部22和第一圆孔部11形成一光孔，如图2和图3所示，由于凸耳1012突出连接块1021，相应地，第一槽部12的深度大于第二槽部21的深度，从而保证了连接块1021和凸耳1012的连接，此处不再详细描述。
在一些示例性实施方式中，可以在第二圆孔部22的内壁上设置多个凸台，用来对对环体1011起支撑作用。例如，多个凸台可以均匀分布，且多个凸台避开第二槽部21设置，此处不再详细描述。
第二槽部21的深度决定了各个滚轮1023和晶圆105之间的间隙G，因此，在对安装夹具进行加工时，可以通过确定第二槽部21的深度值来保证间隙G。
如前所述，该间隙G的标准范围为0.006英寸～0.012英寸。因此，可以将间隙G的具体值定为0.009英寸，并结合安装夹具的各个尺寸计算出第二槽部21的深度，从而保证多个固定座102能够一次性组装成功。
在一些示例性实施方式中，也可以将间隙G的具体值定为0.007英寸、0.008英寸、0.010英寸、0.011英寸等，此处不作特殊限定。
②在第二圆孔部22的直径小于第一圆孔部11的直径时，此时，第二圆孔部22的直径须大于环体1011的内直径，从而使得晶圆105能够放置于多个承载杆1022形成的承载面104上。
如图5所示，第二圆孔部22和第一圆孔部11可以形成一环形台阶3，该环形台阶3能够对环体1011起到支撑的作用，进而便于承载环100转运晶圆105。
下面再对本公开实施方式的安装夹具的使用过程进行完整地介绍：
首先，将固定座102的连接块1021卡入第二夹体2的第二槽部21中；
其次，将圆环部101的环体1011放入第一夹体1的第一圆孔部11中，此时，圆环部101的凸耳1012和第一夹体1的第一槽部12卡紧，且固定座102的螺纹孔1020的中轴线和凸耳1012的光孔10120的中轴线重合；
随后，将螺纹件103穿过凸耳1012的光孔10120、并与固定座102的螺纹孔1020螺纹连接，即可实现圆环部101、螺纹件103和固定座102的组装；
最后，将承载环100从安装夹具中抽出，即可完成承载环100的整个操作过程。
本说明书中各实施例或实施方式采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分相互参见即可。
在本说明书的描述中，参考术语“实施例”、“示例性的实施例”、“一些实施方式”、“示意性实施方式”、“示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。
在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
在本公开的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
可以理解的是，本公开所使用的术语“第一”、“第二”等可在本公开中用于描述各种结构，但这些结构不受这些术语的限制。这些术语仅用于将第一个结构与另一个结构区分。
在一个或多个附图中，相同的元件采用类似的附图标记来表示。为了清楚起见，附图中的多个部分没有按比例绘制。此外，可能未示出某些公知的部分。为了简明起见，可以在一幅图中描述经过数个步骤后获得的结构。在下文中描述了本公开的许多特定的细节，例如器件的结构、材料、尺寸、处理工艺和技术，以便更清楚地理解本公开。但正如本领域技术人员能够理解的那样，可以不按照这些特定的细节来实现本公开。
最后应说明的是：以上各实施例仅用以说明本公开的技术方案，而非对 其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。
工业实用性
本公开实施例所提供的晶圆用承载环的安装夹具，第一夹体的第一圆孔部的直径大于或等于环体的外直径，从而使得圆环部的环体能够放进第一圆孔部；同时，第一槽部从第一圆孔部的内壁向第一夹体的外侧延伸，且在环体位于第一圆孔部时，第一夹体的第一槽部能够卡紧圆环部的凸耳，即：第一夹体能够对圆环部进行固定。另外，第二夹体固定连接于第一夹体，第二夹体的第二槽部和第一夹体的的第一槽部正对设置，且在第一槽部卡紧凸耳时，固定座能够从第二槽部远离第一槽部的一侧穿入第二槽部，固定座上的螺纹孔和凸耳上的光孔的中轴线重合，且固定座能够从第一槽部远离第二槽部的一侧穿出。由此，操作人员只需将螺纹件穿过凸耳的光孔、并与固定座的螺纹孔螺纹连接，即可将圆环部、螺纹件和固定座组装起来，再从安装夹具中拿出承载环即可完成整个操作过程。因此，相较于现有技术中需要反复调整固定座的位置的技术方案，本公开中第二夹体能够同时对多个固定座进行定位，从而保证了各个固定座的第二端之间的相对位置，不但使承载环的组装过程耗时较短，也提高了承载环的保养效率。

Claims (10)

  1. 一种晶圆用承载环的安装夹具，所述承载环包括圆环部、螺纹件和多个固定座，所述圆环部包括环体和多个凸耳，多个所述凸耳均匀分布于所述环体的外壁；所述固定座的第一端设有螺纹孔，所述凸耳设有光孔，所述螺纹件穿过所述光孔后能够与所述螺纹孔螺纹连接；在所述固定座和所述凸耳连接时，所述固定座的第二端能够朝向所述环体的中心、并突出所述环体的内壁；多个所述固定座的第二端形成一用于承载晶圆的承载面，所述安装夹具包括：
    第一夹体，具有第一圆孔部和第一槽部；所述第一圆孔部的直径大于或等于所述环体的外直径；所述第一槽部从所述第一圆孔部的内壁向所述第一夹体的外侧延伸；在所述环体位于所述第一圆孔部时，所述第一槽部能够卡紧所述凸耳；
    第二夹体，固定连接于所述第一夹体，所述第二夹体具有第二槽部，所述第二槽部贯穿所述第二夹体；在所述第一槽部卡紧所述凸耳时，所述固定座能够从所述第二槽部远离所述第一槽部的一侧穿入所述第二槽部，所述螺纹孔和所述光孔的中轴线重合，且所述固定座能够从所述第一槽部远离所述第二槽部的一侧穿出。
  2. 根据权利要求1所述的安装夹具，其中，在所述环体位于所述第一圆孔部时，所述第一槽部的内壁和所述凸耳的外壁完全贴合，以使所述第一槽部能够卡紧所述凸耳。
  3. 根据权利要求1所述的安装夹具，其中，所述第一圆孔部贯通所述第一夹体。
  4. 根据权利要求2所述的安装夹具，其中，所述第一夹体的厚度大于或等于所述环体的厚度。
  5. 根据权利要求1所述的安装夹具，其中，所述第二槽部的宽度小于所述第一槽部的宽度，在所述固定座从所述第二槽部远离所述第一槽部的一侧穿入所述第二槽部时，所述第二槽部的内壁和所述固定座的外壁完全贴 合，且所述螺纹孔和所述光孔的中轴线重合。
  6. 根据权利要求1所述的安装夹具，所述第二夹体还具有第二圆孔部；所述第二圆孔部的中轴线和所述第一圆孔部的中轴线重合；
    其中，所述第二槽部从所述第二圆孔部的内壁向所述第二夹体的外侧延伸；所述第二槽部的宽度小于所述第一槽部的宽度，在所述第一槽部卡紧所述凸耳时，所述固定座能够从所述第二槽部远离所述第一槽部的一侧穿入所述第二槽部，且所述螺纹孔和所述光孔的中轴线重合。
  7. 根据权利要求6所述的安装夹具，其中，所述第二圆孔部的直径等于所述第一圆孔部的直径，且所述第一槽部的深度大于所述第二槽部的深度。
  8. 根据权利要求7所述的安装夹具，其中，所述第二圆孔部的内壁上设有多个均匀分布的凸台，且多个所述凸台避开所述第二槽部设置。
  9. 根据权利要求6所述的安装夹具，其中，所述第二圆孔部的直径小于所述第一圆孔部的直径、所述第二圆孔部的直径大于所述环体的内直径，所述第二圆孔部和所述第一圆孔部形成一环形台阶。
  10. 根据权利要求1所述的安装夹具，其中，所述第一夹体和所述第二夹体一体成型。
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