JP1700777S - - Google Patents

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Publication number
JP1700777S
JP1700777S JPD2021-5258F JP2021005258F JP1700777S JP 1700777 S JP1700777 S JP 1700777S JP 2021005258 F JP2021005258 F JP 2021005258F JP 1700777 S JP1700777 S JP 1700777S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-5258F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2021-5258F priority Critical patent/JP1700777S/ja
Priority to TW110304575F priority patent/TWD225035S/zh
Priority to US29/807,738 priority patent/USD981971S1/en
Application granted granted Critical
Publication of JP1700777S publication Critical patent/JP1700777S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-5258F 2021-03-15 2021-03-15 Active JP1700777S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2021-5258F JP1700777S (zh) 2021-03-15 2021-03-15
TW110304575F TWD225035S (zh) 2021-03-15 2021-08-31 基板處理裝置用晶舟之部分
US29/807,738 USD981971S1 (en) 2021-03-15 2021-09-14 Boat of substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2021-5258F JP1700777S (zh) 2021-03-15 2021-03-15

Publications (1)

Publication Number Publication Date
JP1700777S true JP1700777S (zh) 2021-11-29

Family

ID=78766340

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-5258F Active JP1700777S (zh) 2021-03-15 2021-03-15

Country Status (3)

Country Link
US (1) USD981971S1 (zh)
JP (1) JP1700777S (zh)
TW (1) TWD225035S (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1731674S (zh) * 2022-05-30 2022-12-08
JP1731673S (zh) * 2022-05-30 2022-12-08
JP1731675S (zh) * 2022-05-30 2022-12-08

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD302382S (en) * 1987-08-19 1989-07-25 Bleakley David M Pin for locking or stopping a sliding window sash
EP1006562A3 (en) * 1998-12-01 2005-01-19 Greene, Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US6455395B1 (en) * 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
ATE535015T1 (de) * 2004-09-01 2011-12-15 Nikon Corp Substrathalter, bühnenvorrichtung und belichtungsvorrichtung
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
US9153466B2 (en) 2012-04-26 2015-10-06 Asm Ip Holding B.V. Wafer boat
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
US9343304B2 (en) * 2014-09-26 2016-05-17 Asm Ip Holding B.V. Method for depositing films on semiconductor wafers
CN107533996B (zh) * 2015-04-10 2021-02-23 Ev 集团 E·索尔纳有限责任公司 衬底固持器和用于接合两个衬底的方法
CN111128814A (zh) * 2018-10-31 2020-05-08 长鑫存储技术有限公司 晶舟
KR102406942B1 (ko) * 2019-09-16 2022-06-10 에이피시스템 주식회사 엣지 링 및 이를 포함하는 열처리 장치
JP1665228S (zh) * 2019-11-28 2020-08-03
CN114378751B (zh) * 2020-10-20 2022-11-01 长鑫存储技术有限公司 晶圆用承载环的安装夹具
CN114628291A (zh) * 2022-04-01 2022-06-14 合肥真萍电子科技有限公司 一种晶圆烘烤用石英舟结构

Also Published As

Publication number Publication date
USD981971S1 (en) 2023-03-28
TWD225035S (zh) 2023-05-01

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