CN201075384Y - 热处理用晶圆支持器 - Google Patents
热处理用晶圆支持器 Download PDFInfo
- Publication number
- CN201075384Y CN201075384Y CNU2007201274574U CN200720127457U CN201075384Y CN 201075384 Y CN201075384 Y CN 201075384Y CN U2007201274574 U CNU2007201274574 U CN U2007201274574U CN 200720127457 U CN200720127457 U CN 200720127457U CN 201075384 Y CN201075384 Y CN 201075384Y
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- 238000007669 thermal treatment Methods 0.000 title description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000004308 accommodation Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 4
- 230000008646 thermal stress Effects 0.000 abstract description 13
- 230000003628 erosive effect Effects 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 6
- 239000011324 bead Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 62
- 230000005611 electricity Effects 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- 238000011161 development Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201274574U CN201075384Y (zh) | 2007-08-15 | 2007-08-15 | 热处理用晶圆支持器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201274574U CN201075384Y (zh) | 2007-08-15 | 2007-08-15 | 热处理用晶圆支持器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201075384Y true CN201075384Y (zh) | 2008-06-18 |
Family
ID=39520642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007201274574U Expired - Lifetime CN201075384Y (zh) | 2007-08-15 | 2007-08-15 | 热处理用晶圆支持器 |
Country Status (1)
Country | Link |
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CN (1) | CN201075384Y (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013000420A1 (zh) * | 2011-06-28 | 2013-01-03 | 清华大学 | 一种利用弹簧夹子的晶圆夹持装置 |
KR102167687B1 (ko) * | 2020-05-11 | 2020-10-19 | 에스케이씨솔믹스 주식회사 | 반도체 소자를 제조하는 장비에 사용되는 웨이퍼 홀더 및 이를 포함하는 엣지 링 조립체 |
KR102201336B1 (ko) * | 2020-05-11 | 2021-01-08 | 에스케이씨솔믹스 주식회사 | 반도체 소자를 제조하는 장비에 사용되는 웨이퍼 홀더 및 이를 포함하는 엣지 링 조립체 |
WO2021146352A1 (en) * | 2020-01-17 | 2021-07-22 | Lam Research Corporation | Exclusion ring with flow paths for exhausting wafer edge gas |
WO2021179000A1 (en) * | 2020-03-06 | 2021-09-10 | Lam Research Corporation | Ring structure with compliant centering fingers |
CN114378751A (zh) * | 2020-10-20 | 2022-04-22 | 长鑫存储技术有限公司 | 晶圆用承载环的安装夹具 |
US11830759B2 (en) | 2020-02-11 | 2023-11-28 | Lam Research Corporation | Carrier ring designs for controlling deposition on wafer bevel/edge |
-
2007
- 2007-08-15 CN CNU2007201274574U patent/CN201075384Y/zh not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013000420A1 (zh) * | 2011-06-28 | 2013-01-03 | 清华大学 | 一种利用弹簧夹子的晶圆夹持装置 |
WO2021146352A1 (en) * | 2020-01-17 | 2021-07-22 | Lam Research Corporation | Exclusion ring with flow paths for exhausting wafer edge gas |
US11830759B2 (en) | 2020-02-11 | 2023-11-28 | Lam Research Corporation | Carrier ring designs for controlling deposition on wafer bevel/edge |
US11837495B2 (en) | 2020-02-11 | 2023-12-05 | Lam Research Corporation | Carrier ring designs for controlling deposition on wafer bevel/edge |
WO2021179000A1 (en) * | 2020-03-06 | 2021-09-10 | Lam Research Corporation | Ring structure with compliant centering fingers |
KR102167687B1 (ko) * | 2020-05-11 | 2020-10-19 | 에스케이씨솔믹스 주식회사 | 반도체 소자를 제조하는 장비에 사용되는 웨이퍼 홀더 및 이를 포함하는 엣지 링 조립체 |
KR102201336B1 (ko) * | 2020-05-11 | 2021-01-08 | 에스케이씨솔믹스 주식회사 | 반도체 소자를 제조하는 장비에 사용되는 웨이퍼 홀더 및 이를 포함하는 엣지 링 조립체 |
CN114378751A (zh) * | 2020-10-20 | 2022-04-22 | 长鑫存储技术有限公司 | 晶圆用承载环的安装夹具 |
CN114378751B (zh) * | 2020-10-20 | 2022-11-01 | 长鑫存储技术有限公司 | 晶圆用承载环的安装夹具 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WEIXIN SCIENCE AND SCIENCE CO. LTD. Free format text: FORMER OWNER: CHEN HANYANG Effective date: 20140929 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140929 Address after: Taiwan Hsinchu County Chinese jhubei City, in the light of nine Dou Lun Road No. 236 1 floor Patentee after: Weixin Science and Technology Co., Ltd. Address before: Hsinchu City, Taiwan, China Patentee before: Chen Hanyang |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20080618 |