WO2022078129A1 - Module d'emballage, procédé d'emballage et dispositif électronique - Google Patents

Module d'emballage, procédé d'emballage et dispositif électronique Download PDF

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Publication number
WO2022078129A1
WO2022078129A1 PCT/CN2021/117560 CN2021117560W WO2022078129A1 WO 2022078129 A1 WO2022078129 A1 WO 2022078129A1 CN 2021117560 W CN2021117560 W CN 2021117560W WO 2022078129 A1 WO2022078129 A1 WO 2022078129A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
electromagnetic shielding
plastic sealing
circuit board
colloid
Prior art date
Application number
PCT/CN2021/117560
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English (en)
Chinese (zh)
Inventor
孔繁鑫
郭学平
李得亮
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华为技术有限公司
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Publication of WO2022078129A1 publication Critical patent/WO2022078129A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to the technical field of electronic equipment, and in particular, to a packaging module, a packaging method and electronic equipment.
  • SIP System-in-a-Package
  • SIP System-in-a-Package
  • the electronic devices inside the package also interfere with each other, so electromagnetic isolation is also required inside the package.
  • a laser is usually used to form a groove on the plastic package body of the system-in-package, and the groove is connected to the exposed copper area provided on the system-in-package circuit board.
  • the trenches are filled with electromagnetic shielding material that is connected to the conformal shielding layer on the surface of the system-in-package to isolate the electronic devices within the system-in-package.
  • the trenches opened by the laser are usually inverted trapezoidal structures, and the structural reliability of the system-in-package is low.
  • the exposed copper area of the circuit board is exposed by laser grooving, the groove depth is relatively deep, and the unit hourly productivity (Units Per Hour, UPH) of the packaged module is low, and efficiency needs to be improved urgently.
  • the embodiments of the present application provide a packaging module, a packaging method, and an electronic device, which can realize electromagnetic shielding between electronic devices inside the system-in-package module and electromagnetic shielding between the packaging module and external electronic devices.
  • the width of the surface of the circuit board is greater than the gap away from the surface of the circuit board, reducing the depth of laser grooving or eliminating the need to use laser grooving, improving operational UPH and mechanical reliability of the system-in-package module.
  • the colloid part since the colloid part does not need laser treatment, it will not touch the exposed copper area or need to use laser grooving during laser grooving, which can protect the exposed copper area of the circuit board from being damaged.
  • the present application provides a package module, comprising: a first circuit board, a first plastic packaging body, a second plastic packaging body, an electromagnetic shielding body, an electromagnetic shielding layer, a first electronic device and a second electronic device.
  • the first plastic sealing body, the second plastic sealing body and the electromagnetic shielding body are arranged on the first surface of the first circuit board.
  • the first surface of the first circuit board is provided with a first exposed copper area, the first exposed copper area is electrically connected to the ground signal of the first circuit board, and at least part of the bottom surface of the electromagnetic shielding body is connected to at least a part of the first exposed copper area.
  • the electromagnetic shielding body is embedded between the first plastic sealing body and the second plastic sealing body.
  • the electromagnetic shielding layer is disposed at least on the outer surface of the first plastic sealing body, the outer surface of the second plastic sealing body and the outer surface of the electromagnetic shielding body.
  • the first electronic device and the second electronic device are arranged on the first surface of the first circuit board.
  • the first plastic sealing body covers the first electronic device, and the second plastic sealing body covers the second electronic device.
  • the first section of the electromagnetic shielding body includes a first side and a second side, the first side is in contact with the electromagnetic shielding layer, the second side is in contact with the circuit board, the length of the first side is not greater than the length of the second side, and the first section is located
  • the plane of the circuit board is perpendicular to the plane of the circuit board, and the plane of the first section is perpendicular to the length extension direction of the electromagnetic shielding body.
  • the first exposed copper area is electrically connected to the ground signal of the first circuit board
  • the electromagnetic shielding body is thus electrically connected to the ground signal of the first circuit board through the first exposed copper area
  • the electromagnetic shielding layer is electrically connected to the ground signal of the first circuit board through the electromagnetic shielding body.
  • the ground signal of the first circuit board is electrically connected, so as to realize electromagnetic shielding between the first electronic device and the second electronic device inside the package module, and electromagnetic shielding between the inside of the package module and the circuit outside the package module.
  • the contact width of the electromagnetic shielding body and the electromagnetic shielding layer is not greater than the contact width of the electromagnetic shielding body and the circuit board, which optimizes the stress distribution of the packaged module and improves the mechanical reliability of the packaged module.
  • the length of the first side is not greater than 1 mm.
  • the contact width between the electromagnetic shielding body and the electromagnetic shielding layer is reduced, the stress on the electromagnetic shielding body can be reduced, and the mechanical reliability of the packaged module is improved.
  • the electromagnetic shielding layer is disposed on the surface of the plastic packaging material, the overall height of the packaging module is reduced, and the weight of the packaging module is reduced.
  • the components of the first plastic sealing body and the second plastic sealing body are at least insoluble in water or insoluble in an acid-base solution.
  • the components of the first molding body and the second molding body may include epoxy resin and the like.
  • the components of the first molded body and the second molded body may be epoxy resins that are at least insoluble in water or insoluble in acid-base solutions.
  • the components of the electromagnetic shielding body and the electromagnetic shielding layer include conductive materials.
  • the conductive material includes at least one or more of aluminum, copper, gold or silver. The electromagnetic shielding effect can be improved by using a metal material with good electrical conductivity.
  • the first electronic device and the second electronic device include at least one or more of a radio frequency circuit, a power amplifier circuit, a baseband circuit, an audio circuit, and a memory circuit.
  • Devices are different.
  • the first electronic device and the second electronic device may be electronic devices of different functional circuits, for example, the first electronic device is an electronic device of a radio frequency circuit, the second electronic device is an electronic device of an audio circuit; or the first electronic device is a baseband circuit
  • the electronic device, the second electronic device is the electronic device of the power amplifier circuit.
  • the first electronic device and the second electronic device may also be electronic devices of radio frequency circuits with different working frequency bands.
  • the first electronic device is an electronic device of a Bluetooth circuit
  • the second electronic device is an electronic device of a radio frequency circuit whose working frequency is different from that of the Bluetooth circuit. electronic devices.
  • two different electronic devices are respectively arranged in different electromagnetic shielding cavities to shield the electromagnetic interference between the first electronic device and the second electronic device.
  • the first electronic device is disposed in the electromagnetic shielding body and the electromagnetic shielding cavity surrounded by the electromagnetic shielding layer disposed on the outer surface of the first plastic sealing body
  • the second electronic device is disposed in the electromagnetic shielding body and the outer surface of the second plastic sealing body.
  • the electromagnetic shielding cavity surrounded by the electromagnetic shielding layer on the surface.
  • a gap is set between the first exposed copper region and the first electronic device, a gap is set between the electromagnetic shield and the first electronic device, and a gap is set between the first exposed copper region and the second electronic device.
  • a gap is provided between the electromagnetic shielding body and the second electronic device, so as to ensure that the electronic device is not short-circuited with the ground signal of the circuit board.
  • At least part of the side surface of the first circuit board is connected to at least part of the electromagnetic shielding layer.
  • the first electronic device is arranged on the electromagnetic shielding body, the electromagnetic shielding layer arranged on the outer surface of the first plastic package and the electromagnetic shielding cavity surrounded by at least part of the side surface of the first circuit board, and the second electronic device is arranged on the electromagnetic shielding body and arranged on the electromagnetic shielding cavity.
  • the electromagnetic shielding layer on the outer surface of the second plastic package and the electromagnetic shielding cavity surrounding at least part of the side surface of the first circuit board. The shielding performance of the two electromagnetic shielding cavities is further improved.
  • the electromagnetic shielding body is connected to the first exposed copper area, and the electromagnetic shielding body is further electrically connected to the ground signal of the first circuit board through the first exposed copper area.
  • the electromagnetic shielding body and the electromagnetic shielding layer disposed on the outer surface of the first plastic package enclose a first shielding cavity, and the first electronic device is located in the first shielding cavity.
  • the electromagnetic shielding body and the electromagnetic shielding layer disposed on the outer surface of the second plastic package are enclosed to form a second shielding cavity, and the second electronic device is located in the second shielding cavity.
  • the electromagnetic shielding layer is electrically connected to the first circuit board through the electromagnetic shielding body, thereby realizing electromagnetic shielding of the packaged module.
  • the electromagnetic shielding layer and the electromagnetic shielding body jointly realize the electromagnetic shielding between the first electronic device and the second electronic device, and the electromagnetic shielding between the package module and the external electronic device.
  • the electromagnetic shielding body includes at least a first side surface, the first side surface is located on the side surface of the package module, the first side surface is connected to the electromagnetic shielding layer, and at least one side surface of the electromagnetic shielding body is located at the edge of the system-in-package module.
  • the electromagnetic shielding body and the edge of the package module together enclose an electronic device; or, the electromagnetic shielding body is a ring structure, and an electronic device is enclosed in the ring.
  • the edge of the packaged module can be used to plan the shortest possible grounding path, so that the electromagnetic shielding body has a better electromagnetic shielding effect, and at the same time, the size of the packaged module is reduced as much as possible, saving energy Material and workmanship costs.
  • the present application provides a packaging method, comprising: dispensing glue on a first exposed copper area disposed on a first circuit board to form a glue.
  • the first surface of the first circuit board is also provided with a first electronic device and a second electronic device, the first exposed copper area is electrically connected to the ground signal of the first circuit board, and the first exposed copper area is located between the first electronic device and the second electronic device. between electronic devices.
  • a gap is set between the first exposed copper region and the first electronic device, and a gap is set between the first exposed copper region and the second electronic device; a gap is set between the colloid and the first electronic device, and the colloid and the second electronic device There is a gap between them.
  • a plastic sealing body is formed on the first surface of the first circuit board, and the plastic sealing body covers the first electronic device, the second electronic device, and at least part of the colloid.
  • the colloid is removed to obtain voids, and the voids separate the plastic sealing body to obtain the first plastic sealing body and the second plastic sealing body.
  • Fill the gap with conductive material the conductive material forms an electromagnetic shielding body, at least part of the bottom surface of the electromagnetic shielding body is connected to at least a part of the first exposed copper area, a gap is set between the electromagnetic shielding body and the first electronic device, and the electromagnetic shielding body is connected to the first electronic device.
  • a gap is provided between the second electronic devices.
  • Electromagnetic shielding layers are provided on at least part of the outer surface of the first plastic sealing body, at least part of the outer surface of the second plastic sealing body, and at least part of the outer surface of the electromagnetic shielding body.
  • the first section of the electromagnetic shielding body includes a first side and a second side, the first side is in contact with the electromagnetic shielding layer, the second side is in contact with the circuit board, the length of the first side is not greater than the length of the second side, and the first section is located
  • the plane of the circuit board is perpendicular to the plane of the circuit board, and the plane of the first section is perpendicular to the length extension direction of the electromagnetic shielding body.
  • the first exposed copper area is electrically connected to the ground signal of the first circuit board
  • the electromagnetic shielding body is thus electrically connected to the ground signal of the first circuit board through the first exposed copper area
  • the electromagnetic shielding layer is electrically connected to the ground signal of the first circuit board through the electromagnetic shielding body.
  • the ground signal of the first circuit board is electrically connected, so as to realize electromagnetic shielding between the first electronic device and the second electronic device inside the package module, and electromagnetic shielding between the inside of the package module and the circuit outside the package module.
  • a gap is formed by dispensing glue and removing colloid, and an electromagnetic shielding body is formed in the gap, so that the contact width between the electromagnetic shielding body and the electromagnetic shielding layer is not greater than the contact width between the electromagnetic shielding body and the circuit board, and the stress distribution of the packaged module is optimized. Since the gap is formed by dispensing and removing the colloid, the electronic shield is formed in the gap, and the colloid part does not need to be processed by laser. Compared with the prior art, the productivity of the packaged module and the mechanical reliability of the packaged module are improved.
  • washing off at least a part of the colloid includes: washing off at least part of the colloid through one or more of water or an acid-base solution. Partial colloid.
  • the voids are obtained by washing with water, and compared with the prior art, laser grooving improves the capacity and production efficiency of the packaged module.
  • washing off at least part of the colloid includes: washing off at least part of the colloid through one or more of water or an acid-base solution.
  • removing part of the plastic sealing material of the plastic sealing body includes removing part of the plastic sealing material of the plastic sealing body by laser or grinding.
  • the second void is obtained by removing the part of the plastic sealing material of the plastic sealing body by the laser.
  • the void is the first void.
  • a second void is obtained by removing part of the plastic sealing material of the plastic sealing body by laser, and the void is a combination of the first void and the second void.
  • the colloid part does not require laser treatment; compared with the prior art, the depth of laser grooving is reduced or the use of laser grooving is not required, which improves the operation UPH and the mechanism of the system-in-package module. reliability.
  • the exposed copper area will not be touched during laser grooving or the laser grooving does not need to be used, which can protect the exposed copper area from being damaged.
  • the components of the colloid are at least soluble in water or in an acid-base solution.
  • the components of the colloid may include epoxy resins and the like.
  • the length of the first side is not greater than 1 mm.
  • the components of the first plastic sealing body and the second plastic sealing body are at least insoluble in water or insoluble in an acid-base solution.
  • the components of the first molding body and the second molding body may include epoxy resin, etc.
  • the components of the electromagnetic shielding body and the electromagnetic shielding layer include conductive materials.
  • the conductive material includes at least one or more of aluminum, copper, gold or silver, and the electromagnetic shielding effect can be improved by using a metal material with good conductivity.
  • the first electronic device and the second electronic device include at least one or more of a radio frequency circuit, a power amplifier circuit, a baseband circuit, an audio circuit, and a memory circuit.
  • Devices are different.
  • the first electronic device and the second electronic device may be electronic devices of different functional circuits, for example, the first electronic device is an electronic device of a radio frequency circuit, the second electronic device is an electronic device of an audio circuit; or the first electronic device is a baseband circuit
  • the electronic device, the second electronic device is the electronic device of the power amplifier circuit.
  • the first electronic device and the second electronic device may also be electronic devices of radio frequency circuits with different working frequency bands.
  • the first electronic device is an electronic device of a Bluetooth circuit
  • the second electronic device is an electronic device of a radio frequency circuit whose working frequency is different from that of the Bluetooth circuit. electronic devices.
  • two different electronic devices are respectively arranged in different electromagnetic shielding cavities to shield the electromagnetic interference between the first electronic device and the second electronic device.
  • the first electronic device is disposed in the electromagnetic shielding body and the electromagnetic shielding cavity surrounded by the electromagnetic shielding layer disposed on the outer surface of the first plastic sealing body
  • the second electronic device is disposed in the electromagnetic shielding body and the outer surface of the second plastic sealing body.
  • the electromagnetic shielding cavity surrounded by the electromagnetic shielding layer on the surface.
  • At least part of the side surface of the first circuit board is connected to at least part of the electromagnetic shielding layer.
  • the first electronic device is arranged on the electromagnetic shielding body, the electromagnetic shielding layer arranged on the outer surface of the first plastic package and the electromagnetic shielding cavity surrounded by at least part of the side surface of the first circuit board, and the second electronic device is arranged on the electromagnetic shielding body and arranged on the electromagnetic shielding cavity.
  • the electromagnetic shielding layer on the outer surface of the second plastic package and the electromagnetic shielding cavity surrounding at least part of the side surface of the first circuit board. The shielding performance of the two electromagnetic shielding cavities is further improved.
  • the electromagnetic shielding body is electrically connected to the first exposed copper area, and the electromagnetic shielding body is further electrically connected to the ground signal of the first circuit board through the first exposed copper area.
  • the electromagnetic shielding body and the electromagnetic shielding layer disposed on the outer surface of the first plastic package enclose a first shielding cavity, and the first electronic device is located in the first shielding cavity.
  • the electromagnetic shielding body and the electromagnetic shielding layer disposed on the outer surface of the second plastic package are enclosed to form a second shielding cavity, and the second electronic device is located in the second shielding cavity.
  • the electromagnetic shielding layer is electrically connected to the first circuit board through the electromagnetic shielding body, thereby realizing electromagnetic shielding of the packaged module.
  • the electromagnetic shielding layer and the electromagnetic shielding body jointly realize the electromagnetic shielding between the first electronic device and the second electronic device, and the electromagnetic shielding between the package module and the external electronic device.
  • the electromagnetic shielding body includes at least a first side surface, the first side surface is located on the side surface of the package module, the first side surface is connected to the electromagnetic shielding layer, and at least one side surface of the electromagnetic shielding body is located at the edge of the system-in-package module.
  • the electromagnetic shielding body and the edge of the package module together enclose an electronic device; or, the electromagnetic shielding body is a ring structure, and an electronic device is enclosed in the ring.
  • the edge of the packaged module can be used to plan a grounding path as short as possible, so that the electromagnetic shielding body has a better electromagnetic shielding effect, and at the same time, the size of the packaged module is reduced as much as possible, saving energy Material and workmanship costs.
  • the present application provides an electronic device, including: a second circuit board.
  • the second circuit board is provided with the package module provided in the aforementioned first aspect and its possible implementations. Since the electromagnetic shielding layer of the encapsulation module is disposed on the surface of the plastic encapsulation material, the overall height of the encapsulation module is reduced, the space of the electronic device is saved, the space utilization rate of the electronic device is optimized, and the light and thin electronic device is facilitated.
  • the second circuit board is further provided with a third electronic device and a metal shield, and the metal shield is provided with the third electronic device.
  • the encapsulation module can realize electromagnetic shielding between electronic devices inside the encapsulation module, and can also realize electromagnetic shielding between the encapsulation module and the third electronic device.
  • the electromagnetic shielding layer is arranged on the outer surface of the packaged module, which takes up less space and saves design space compared to using a metal shielding case.
  • FIG. 1 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional structural diagram of the circuit board shown in FIG. 1 along the A-A direction;
  • FIG. 3 is a schematic structural diagram of a system-in-package module provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a packaged whole board provided by an embodiment of the present application.
  • FIG. 5 is a flowchart of an implementation of a system-level packaging module provided by an embodiment of the present application.
  • 6a is a structural diagram of a veneer provided by an embodiment of the present application after dispensing glue on the entire board;
  • 6b is a structural diagram of a single board after plastic sealing on the whole board provided by an embodiment of the present application.
  • FIG. 6c is a structural diagram of a single board provided by an embodiment of the present application after the entire board is grooved;
  • FIG. 6d is a structural diagram of a veneer after grinding on the entire board provided by an embodiment of the present application.
  • FIG. 6e is a structural diagram of a veneer provided by an embodiment of the present application after colloid is removed from the entire board;
  • Fig. 6f is another veneer structure diagram after colloid is removed from the whole board provided by the embodiment of the present application.
  • FIG. 6g is a structural diagram of a single board after filling the entire board with shielding material according to an embodiment of the present application.
  • FIG. 6h is a single-module structure diagram after the whole board is divided according to an embodiment of the present application.
  • 7a is another structural diagram of a single board after plastic sealing on the whole board provided by the embodiment of the present application.
  • Fig. 7b is another veneer structure diagram after colloid is removed from the whole board provided by the embodiment of the present application.
  • FIG. 8 is a schematic top view of a system-in-package module provided by an embodiment of the present application.
  • FIG. 9 is a schematic top view of another system-in-package module provided by an embodiment of the present application.
  • FIG. 10 is a schematic top view of another system-in-package module provided by an embodiment of the present application.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • Electromagnetic shielding is formed on the surface of the plastic package, and the shielding layer and the plastic package are fused together to achieve the shielding of the entire plastic package;
  • Compartment Shielding The interior of the plastic package is isolated by electromagnetic shielding materials to achieve shielding between the cavities inside the plastic package;
  • SIP System-in-Package
  • SOC System on Chip
  • Electromagnetic interference Electromagnetic interference (Electromagnetic interference, EMI): The work of electronic products will cause interference to other surrounding electronic products.
  • the types of electromagnetic interference include conducted interference and radiation interference.
  • FIG. 1 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • the circuit board 300 is provided with a system-in-package module 100 and a metal shield 400 .
  • the system-in-package module 100 includes an electromagnetic shielding layer 170, and the system-in-package module 100 is shielded by the electromagnetic shielding layer 170, and the electromagnetic shielding layer 170 isolates the electromagnetic interference between the system-in-package module 100 and external circuits.
  • FIG. 2 is a schematic cross-sectional structural diagram of the circuit board shown in FIG. 1 along the A-A direction.
  • the circuit board 300 is further provided with an electronic device 200 , and the metal shield 400 covers the electronic device 200 .
  • the electromagnetic shielding layer 170 is disposed on the outer surface of the system-in-package module 100 , and the electromagnetic shielding layer 170 occupies a small space. There is a gap between the shielding case 400 and the electronic device 200 , which occupies more design space than the system-in-package module 100 .
  • the present embodiment takes the number of the system-in-package module 100 , the electronic device 200 and the metal shielding case 400 as an example for illustrative illustration.
  • the number of the system-in-package module 100 , the electronic device 200 and the metal shielding case 400 may also be plural. This application does not limit the number of system-in-package modules, electronic devices, and metal shields.
  • the system-in-package module 100 may include a radio frequency power amplifier circuit, a Bluetooth circuit, a Wi-Fi circuit, an audio circuit, a memory circuit, a power supply circuit, and the like, and the electronic device 200 may include circuits such as radio frequency, Bluetooth, and navigation.
  • FIG. 3 is a schematic structural diagram of a system-in-package module provided by an embodiment of the present application.
  • the system-in-package module 100 provided by this embodiment of the present application includes: a carrier board 110 , an electronic device 120 and an electronic device 121 , a plastic packaging body 130 , a tank body 140 , an electromagnetic shielding body 150 , an exposed copper area 160 and Electromagnetic shielding layer 170 .
  • the electronic device 120 and the electronic device 121 are disposed on the first surface of the carrier board 110 , for example, the electronic device 120 and the electronic device 121 are soldered to the first surface of the carrier board 110 .
  • the tank body 140 is disposed between the electronic device 120 and the electronic device 121 . At least a part of the bottom surface of the groove body 140 is connected to at least a part of the exposed copper region 160 .
  • the plastic sealing body 130 covers at least a part of the first surface of the carrier board 110 , and the plastic sealing body 130 also covers the electronic device 120 and the electronic device 121 .
  • the electromagnetic shielding material is filled in the groove body 140 to form the electromagnetic shielding body 150 .
  • the outer surface of the plastic package 130 is provided with an electromagnetic shielding layer 170 .
  • the electromagnetic shielding layer 170 is connected to the electromagnetic shielding body 150 , and the electromagnetic shielding layer 170 is connected to the exposed copper area 160 on the carrier board 110 through the electromagnetic shielding body 150 , and the electromagnetic shielding layer 170 is further electrically connected to the ground signal of the carrier board 110 , thereby realizing
  • the top and bottom of the system-in-package module 100 are electrically connected.
  • the electromagnetic shielding layer 170 and the electromagnetic shielding body 150 jointly realize the cavity-division shielding between the electronic device 120 and the electronic device 121 in the system-in-package module 100 and the conformal shielding between the system-in-package module 100 and the electronic device 200 .
  • the width of the cross section of the groove body 140 away from the carrier plate 110 is the first width W1
  • the width of the cross section of the groove body 140 close to the carrier plate 110 is the second width W2
  • the first width W1 is not greater than the second width W2 .
  • FIG. 4 is a schematic structural diagram of a packaged whole board.
  • a plurality of single boards distributed in a matrix are distributed on the entire board 500 . Since the structures of the multiple boards are the same, the processing steps are the same.
  • the single board 510 located on the entire board is taken as an example for illustrative illustration.
  • the carrier board 110 of the single board 510 is provided with solder joints for arranging electronic devices, and the electronic devices may include electronic devices 120 and 121 . More electronic devices may be disposed on the carrier board 110 .
  • the embodiment of the present application is exemplified by two electronic devices (electronic device 120 and electronic device 121 ) provided on the carrier board. The embodiment of the present application does not limit the number of electronic devices disposed on the carrier board.
  • the carrier board 110 is generally a printed circuit board (Printed Circuit Board, PCB).
  • the thickness of the carrier plate 110 is about 0.4 mm, and the carrier plate may adopt a laminated sheet structure. It should be noted that the exemplary description of the type, thickness and structure of the carrier plate is for easier understanding of the embodiments of the present application, and should not be regarded as a limitation on the protection scope required by the embodiments of the present application.
  • the electronic device 120 and/or the electronic device 121 may be a radio frequency power amplifier circuit, a memory, a Bluetooth circuit, a Wi-Fi circuit, an audio circuit, or the like.
  • the electronic device 120 and the electronic device 121 may belong to devices of different functional circuits, for example, the electronic device 120 is a device of a baseband circuit, and the electronic device 121 is a device of a radio frequency circuit.
  • the electronic device 120 and the electronic device 121 may also be devices of different frequency band modules of the same functional circuit.
  • the electronic device 120 may be a device of a 3G radio frequency circuit
  • the electronic device 121 may be a device of a 4G radio frequency circuit.
  • the height of the electronic device 120 and/or the electronic device 121 may be 0.3 ⁇ 1.3 mm.
  • An exposed copper area 160 is also provided on the carrier board 110 .
  • the exposed copper region 160 is electrically connected to the ground signal of the carrier board 110 .
  • the exposed copper region 160 is disposed between the electronic device 120 and the electronic device 121 .
  • the exposed copper region 160 may be a ground copper foil disposed on the carrier board 110 .
  • a certain gap is maintained between the exposed copper region 160 and the electronic device 120 and the electronic device 121 to prevent short circuit between the electronic device and the exposed copper region 160 .
  • the width of the exposed copper area may be 0.1 mm, and the distance between the exposed copper area and the electronic device may be 0.25 mm.
  • FIG. 5 is an implementation flowchart of a system-in-package module provided by an embodiment of the present application
  • FIGS. 6 a to 6 h are schematic diagrams of single-board structures of embodiments corresponding to steps S101 to S106 in FIG. 5 .
  • the material of the colloid may be an epoxy resin soluble in water or an acid-base solution, such as a hydrosol.
  • Figure 6a shows a structural diagram of a single board after dispensing glue on the entire board.
  • the lengthwise extending direction of the colloid 180 may be the same as the lengthwise extending direction of the exposed copper region 160 . At least a portion of the bottom surface of the gel 180 is connected to at least a portion of the exposed copper region 160 .
  • the height of the colloid 180 may be higher than at least any one of the electronic device 120 or the electronic device 121 .
  • the height of the colloid 180 may also be lower than at least any one of the electronic device 120 or the electronic device 121 .
  • the width of the cross section of the gel 180 close to the carrier plate 110 is greater than the width away from the carrier plate 110 .
  • the width of the exposed copper region 160 may be 0.1 mm
  • the width of the lower surface of the gel 180 may be 0.08-0.12 mm
  • the distance between the bottom of the gel 180 and the electronic device may be 0.25 mm.
  • the exemplary descriptions of the width of the pad, the width of the colloid, and the distance between the colloid and the electronic device are for the purpose of making the embodiments of the present application easier to understand, and should not be regarded as required for the embodiments of the present application. Limitation of the scope of protection.
  • FIG. 6b shows a structural diagram of a single board after plastic sealing on the whole board.
  • the plastic sealing body 130 can cover the glue 180 and at least two electronic devices including the electronic device 120 and the electronic device 121 provided on the carrier board 110 in the plastic sealing body 130 .
  • the height of the plastic package 130 is greater than the heights of the electronic device 120 and the electronic device 121 .
  • the height of the molding body 130 may be greater than the height of the colloid 180 .
  • the shape of the plastic sealing body 130 may be a rectangular parallelepiped, a hemisphere, or other irregular three-dimensional shapes.
  • the height of the plastic sealing body 130 may be 0.4-1.4 mm, and the plastic sealing body 130 may be 0.1 mm higher than the tallest electronic device.
  • the molding body 130 may cover the entire first surface of the carrier board 110 .
  • the plastic package 130 may also cover a part of the first surface of the carrier board 110 and be connected to the exposed copper area on the carrier board 110 .
  • the plastic package 130 can not only protect the electronic device, but also improve the heat dissipation performance of the system-in-package module 100 .
  • the material of the molding body 130 may be epoxy resin that is insoluble in water, insoluble in acid-base solution, and the like.
  • the plastic encapsulation body 130 may be processed by laser grooving to remove part of the plastic encapsulation material of the plastic encapsulation body 130 to form a laser groove 141 , exposing at least part of the colloid 180 . .
  • FIG. 6c shows a structural diagram of a single board after the entire board is grooved.
  • the laser groove 141 is located above at least part of the colloid 180, and the laser groove 141 communicates at least part of the colloid 180 with the external space.
  • the laser will be refracted and scattered in the plastic sealing body 130 when the laser is grooving.
  • the cross-sectional shape of the formed laser groove 141 may be an inverted trapezoid.
  • the maximum width of the cross section of the laser groove 141 is the first width W1
  • the maximum width of the cross section of the colloid 180 is the second width W2
  • the first width W1 is not greater than the second width W2.
  • the groove depth H1 of the laser groove 141 is not greater than the height H2 of the plastic package 130 .
  • the surface width W1 of the cross section of the laser groove 141 away from the carrier is 0.2 mm
  • the width of the surface close to the carrier is 0.15 mm
  • the groove depth H1 is 0.5 mm.
  • the length extending direction of the laser groove 141 may be the same as the length extending direction of the colloid 180 , or the length extending direction of the laser groove 141 may be the same as the length extending direction of the exposed copper region 160 . Since the slotting depth H1 of the laser slot 141 is smaller than the height H2 of the plastic package 130 , the exposed copper area 160 will not be touched during the laser slotting process, which can protect the exposed copper area 160 from being damaged.
  • the height of the plastic encapsulation body 130 may be reduced by grinding first. Wherein, the height of the plastic package 130 after grinding is greater than the height of the electronic device. Then, the plastic encapsulation body 130 is processed by a laser grooving method to remove part of the plastic encapsulation material of the plastic encapsulation body 130 to form a laser groove 141 , exposing at least part of the colloid 180 .
  • the height of the plastic encapsulation body 130 may be reduced by grinding to expose at least part of the colloid 180 .
  • FIG. 6d shows a structural diagram of a single board after grinding on the whole board.
  • the top of the colloid 180 is flush with the top of the plastic package 130 , and at least part of the colloid 180 communicates with the external space. Since there is no need to perform laser grooving on the plastic package 130, the risk of damage to the exposed copper area 160 is further reduced.
  • the plastic encapsulation body 130 may be processed by laser grooving to remove part of the plastic encapsulation material of the plastic encapsulation body 130 to form the laser groove 141 , exposing at least Part of the colloid 180.
  • the height of the plastic encapsulation body 130 may also be reduced by grinding first. Wherein, the height of the plastic package 130 after grinding is greater than the height of the electronic device. Then, the plastic encapsulation body 130 is processed by a laser grooving method to remove part of the plastic encapsulation material of the plastic encapsulation body 130 to form a laser groove 141 , exposing at least part of the colloid 180 .
  • the groove body 140 may be a gap.
  • the material of the colloid 180 when the material of the colloid 180 is a water-soluble epoxy resin, it can be removed by high-pressure water washing; or, when the material of the colloid 180 is an epoxy resin soluble in an acid-base solution, an organic solution can be used. Remove by cleaning.
  • the laser groove 141 and the hollow groove 142 formed by removing the colloid 180 together form the groove body 140.
  • FIG. 6e shows a structural diagram of a single board after removing the colloid from the entire board.
  • the formed hollow groove 142 and the laser groove 141 are connected to form a groove body 140 together.
  • the groove body 140 is located between two adjacent electronic devices 120 and 121 , and penetrates through the upper and lower surfaces of the plastic sealing body 130 .
  • the tank body 140 may divide the system-in-package module 100 into a plurality of cavities.
  • the exposed copper area 160 communicates with the external space, and at least part of the exposed copper area 160 is located at the bottom of the tank body 140 .
  • FIG. 6f shows another structural diagram of a single board after removing the colloid from the whole board.
  • the groove body 140 is directly formed, and the first width W1 of the cross section of the groove body 140 away from the carrier is not greater than the second width W2 near the carrier.
  • the groove body 140 is located between two adjacent electronic devices 120 and 121 , and penetrates through the upper and lower surfaces of the plastic sealing body 130 .
  • the tank body 140 may divide the system-in-package module 100 into a plurality of cavities.
  • the exposed copper area 160 communicates with the external space, and the exposed copper area 160 is located at the bottom of the tank body 140 .
  • S105 Filling the electromagnetic shielding material in the groove body 140 to form the electromagnetic shielding body 150 .
  • the electromagnetic shielding material may be conductive silver paste or conductive copper paste or the like.
  • the electromagnetic shielding material After filling the shielding material, it can be placed in a vacuum environment for exhaust. Then, it is placed in a high temperature environment to cure the conductive silver paste or the conductive copper paste. After curing at high temperature, the volume of the electromagnetic shielding body 150 is reduced, so that the height of the electromagnetic shielding body 150 after curing is smaller than the height of the plastic sealing body 130 .
  • FIG. 6g shows a structural diagram of a single board after filling the entire board with shielding material.
  • the electromagnetic shielding body 150 is connected to the exposed copper area 160 at the bottom of the tank body 140 , and the electromagnetic shielding body 150 is further connected to the ground signal of the carrier through the exposed copper area 160 . At least a part of the bottom surface of the electromagnetic shielding body 150 is connected to at least a part of the exposed copper area 160 , and it is ensured that the electromagnetic shielding body 150 is in good contact with the exposed copper area 160 .
  • laser splitting or milling cutter splitting can be used.
  • FIG. 6h shows a single-module structure diagram after the whole board is divided.
  • a single module 520 is formed.
  • the side of the carrier board 110 is provided with a conductive layer 111 connected to the ground signal of the single board.
  • the material of the conductive layer may be a metal, such as aluminum, copper, gold, silver, and the like.
  • the electromagnetic shielding layer 170 may be formed on the outer surface of the plastic package 130 by a spraying process using a spray machine;
  • the material of the electromagnetic shielding layer may be metal, for example, aluminum, copper, gold, silver, and the like.
  • the thickness of the electromagnetic shielding layer 170 is 0.01 mm.
  • the electromagnetic shielding layer 170 is disposed on the outer surface of the plastic package 130, which reduces the design space occupied by the system-in-package module 100.
  • the electromagnetic shielding layer 170 covers the conductive layer on the side of the carrier board 110 , and the electromagnetic shielding layer 170 communicates with the conductive layer, the electromagnetic shielding body 150 and the exposed copper area 160 , and surrounds the electronic device 120 and the electronic device 121 in the In different electromagnetic shielding cavities, the electromagnetic interference between the electronic device 120 and the electronic device 121 in the system-in-package module 100 can be isolated, and the electromagnetic interference between the system-in-package module 100 and the electronic device 200 can be isolated.
  • the height of the colloid 180 formed by the above step S101 is higher than that of the electronic device 120 and the electronic device 121 .
  • the height of the plastic package formed by the above step S102 may be lower than the height of the colloid 180 , and the height of the plastic package is greater than that of the electronic device 120 and the electronic device 121 .
  • FIG. 7a shows another structural diagram of a single board after plastic sealing on the whole board.
  • the plastic package 130 is located on the carrier board and covers at least a part of the first surface of the carrier board, at least two electronic devices 120 and electronic devices 121 are encapsulated in the plastic package 130, and the gel 180 is not completely encapsulated in Inside the plastic package 130 .
  • the height of the colloid 180 is greater than the height of the plastic sealing body 130 , and the height of the plastic sealing body 130 is greater than the height of the electronic device.
  • FIG. 7b shows another single-board structure diagram after removing the colloid from the whole board.
  • the colloid 180 is directly removed to form the groove body 140 . Since the height of the colloid 180 is higher than that of the plastic sealing body 130 , the plastic sealing body 130 does not need to be ground or laser grooved, thereby reducing the probability of damage to the exposed copper region 160 .
  • FIG. 8 is a schematic top view of a system-in-package module provided by an embodiment of the present application
  • FIGS. 9 and 10 are top-view schematic diagrams of another system-in-package module provided by an embodiment of the present application.
  • the shape and quantity of the groove body 140 which are related to the shape and quantity of the electronic devices to be shielded in the system-in-package module.
  • At least one side surface of the groove body 140 is located at the edge of the system-in-package module; or, the groove body 140 is an annular groove, and the electronic device is located in the annular groove.
  • the groove body 140 penetrates the upper and lower surfaces of the plastic sealing body 130 and is located between adjacent electronic devices, so as to separate adjacent electronic devices.
  • the slot body can be straight, and the straight slot body 140 and the edge of the system-in-package module together separate the adjacent electronic devices 120 and 121 to reduce electromagnetic interference between them.
  • the tank body may be T-shaped, and the tank body 140 and the edge of the system-in-package module together separate the electronic device 120 , the electronic device 121 and the electronic device 122 to reduce electromagnetic interference between them.
  • the groove body may be in a ring shape, and the groove body 140 surrounds the electronic device 121 , so as to separate the electronic device 120 and the electronic device 121 and reduce the electromagnetic interference between them.
  • a system-in-package module is generally distributed with a plurality of electronic devices, and the sizes and positions of the electronic devices are different, in order to make the tank body 140 play a better role of isolation, and at the same time reduce the overall size of the system-in-package module as much as possible , when setting the shape of the groove body 140 , according to the position of the electronic device, use the edge of the system-in-package module to plan a short groove body route to save material and process costs.
  • the depth of laser grooving is reduced or the need for laser grooving is reduced.
  • Using laser grooving improves mechanical reliability of operational UPH and system-in-package modules.
  • the colloid part does not need laser treatment, the exposed copper area will not be touched or laser grooving is not required during laser grooving, which can protect the exposed copper area from being damaged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Est divulgué dans la présente invention un module d'emballage, comprenant : une carte de circuit imprimé, une couche de blindage électromagnétique, un premier dispositif électronique et un second dispositif électronique, ainsi qu'un premier corps d'emballage en plastique, un second corps d'emballage en plastique et un corps de blindage électromagnétique disposé sur la carte de circuit imprimé. Le corps de blindage électromagnétique est électriquement connecté à un signal de masse de la carte de circuit imprimé ; le corps de blindage électromagnétique est intégré entre le premier corps d'emballage en plastique et le second corps d'emballage en plastique ; la couche de blindage électromagnétique est disposée sur la surface extérieure du premier corps d'emballage en plastique, la surface extérieure du second corps d'emballage en plastique, et la surface extérieure du corps de blindage électromagnétique ; la carte de circuit imprimé est en outre pourvue du premier dispositif électronique et du second dispositif électronique ; le premier corps d'emballage en plastique recouvre le premier dispositif électronique ; le second corps d'emballage en plastique recouvre le second dispositif électronique. La largeur de la partie de contact entre le corps de blindage électromagnétique et la couche de blindage électromagnétique n'est pas supérieure à la largeur de la partie de contact entre le corps de blindage électromagnétique et la carte de circuit imprimé. De plus, la distribution de contrainte du module d'emballage est améliorée, et la fiabilité mécanique du module d'emballage est améliorée.
PCT/CN2021/117560 2020-10-14 2021-09-10 Module d'emballage, procédé d'emballage et dispositif électronique WO2022078129A1 (fr)

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CN202011098463.8A CN114375111B (zh) 2020-10-14 2020-10-14 一种封装模块、封装方法及电子设备

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