WO2022060022A1 - 광원용 기판 어레이 및 그 제조방법 - Google Patents

광원용 기판 어레이 및 그 제조방법 Download PDF

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Publication number
WO2022060022A1
WO2022060022A1 PCT/KR2021/012383 KR2021012383W WO2022060022A1 WO 2022060022 A1 WO2022060022 A1 WO 2022060022A1 KR 2021012383 W KR2021012383 W KR 2021012383W WO 2022060022 A1 WO2022060022 A1 WO 2022060022A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
lower plate
substrate array
adhesive
substrate
Prior art date
Application number
PCT/KR2021/012383
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
이대일
Original Assignee
대성앤텍 주식회사
이대일
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대성앤텍 주식회사, 이대일 filed Critical 대성앤텍 주식회사
Publication of WO2022060022A1 publication Critical patent/WO2022060022A1/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Definitions

  • the present invention relates to a substrate array for a light source and a method for manufacturing the same.
  • FIG. 14 is a view showing a conventional substrate for a light source.
  • a plurality of metal frames 1410 and 1430 are attached to each other by an adhesive 1420 .
  • the metal frame and the adhesive have a shape before being cut, and have a shape up to a solid line portion and a dotted line portion in FIG. 14 .
  • each of the metal frames 1410 and 1430 has a step 1440 , a reflective surface 1444 , and an upper surface (+y-axis direction) of the metal frame and the adhesives 1410 to 1430 so that a light source or an electrode can be disposed.
  • the cutting is performed so that a rough surface 1448 is formed.
  • a conventional substrate 1400 for a light source is manufactured by cutting.
  • An embodiment of the present invention aims to provide a lower plate of a substrate array for a light source, a method for manufacturing the same, and a substrate array for a light source, which can be inexpensively and quickly manufactured.
  • a lower plate including two metal plates and an adhesive positioned between both metal plates and an upper plate and a lower plate disposed on the lower plate, the upper plate and the lower plate including a step difference and a reflective surface formed under the step difference It provides a substrate for a light source comprising an adhesive for bonding the upper surface of the upper surface and the lower surface of the upper piece.
  • the upper plate is implemented with two components having corresponding shapes, and each component is located on each metal plate of the lower plate.
  • the adhesive is characterized in that any one of PSR (Photo Solder Resist), EMC (Epoxy Molding Compound), and SMC (Silicon Molding Compound).
  • the lower plate of a substrate array for a light source in the lower plate of a substrate array for a light source to be manufactured as a plurality of substrates for a light source, the lower plate of the substrate array for a light source, which is implemented with metal and has through-holes into which an adhesive is injected at predetermined intervals.
  • the lower plate of the substrate array for the light source includes a plating layer plated with a predetermined metal on the opposite surface of the surface in contact with the upper plate of the substrate array for the light source.
  • the predetermined metal is characterized in that it includes some or all of nickel and silver.
  • the plating layer is characterized in that it is formed in the remaining portion except for the through hole.
  • the through hole is characterized in that it has a preset width and a preset length.
  • an arrangement process of disposing a frame to be manufactured as a lower plate of the substrate array for a light source on a die plate comprising a pressing process of pressing the frame with a punch having a preset width and a preset length.
  • an adhesive film is applied to the surface in contact with the upper plate of the substrate array for the light source among the frames subjected to the pressing process, and the substrate array for the light source in the frame that has been subjected to the pressing process. It characterized in that it further comprises a forming process of forming a plating layer on the opposite surface in contact with the upper plate.
  • the method of manufacturing the lower plate of the substrate array for the light source further comprises an injection process of injecting an adhesive into the through hole formed through the pressing process.
  • the adhesive is injected in a direction in which the plating layer is formed in the frame.
  • the lower plate in a substrate array for a light source to be manufactured as a plurality of substrates for a light source, is made of metal and is provided with a through hole through which an adhesive is to be injected at predetermined intervals, and is disposed on the lower plate, It provides a substrate array for a light source, comprising a top plate having a step difference and a reflective surface formed under the step at a predetermined interval at a position not overlapping the position of the through hole.
  • 1 and 2 are an upper perspective view and a lower perspective view of a substrate array for a light source according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a substrate for a light source according to an embodiment of the present invention.
  • FIGS. 4 to 7 are views illustrating a process of manufacturing a lower plate of a substrate array for a light source according to an embodiment of the present invention.
  • FIG. 8 is a view illustrating a lower plate of a substrate array for a light source manufactured according to an embodiment of the present invention.
  • 9 to 13 are views illustrating a process of manufacturing a top plate of a substrate array for a light source according to an embodiment of the present invention.
  • first, second, A, and B may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.
  • each configuration, process, process, or method included in each embodiment of the present invention may be shared within a range that does not technically contradict each other.
  • FIG. 1 and 2 are upper and lower perspective views of a substrate array for a light source according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a substrate for a light source according to an embodiment of the present invention.
  • the substrate for a light source includes an upper plate 110 and a lower plate 120 .
  • the light source substrate shown in FIG. 3 corresponds to a cross section taken along line A-A' in FIG. 1 .
  • a plurality of components having the same or corresponding shape of the upper plate 110 are arranged at regular intervals.
  • Each component of the upper plate 110 is disposed at a predetermined interval and includes the step 310 so that a cover (not shown) having a size of a predetermined interval can be seated on the step 310 .
  • the light source is seated on the upper surface of the lower plate 120 , and a cover for protecting the light source from external force must be disposed.
  • each component of the upper plate 110 is spaced apart (by the length of the cover).
  • Each component of the upper plate 110 has a reflective surface 320 to completely output light irradiated from a light source (not shown) to be disposed on the substrate to the outside.
  • Each configuration of the upper plate 110 includes a reflective surface 320 formed following the end of the step 310 .
  • the reflective surface 320 has an inclined surface in a direction to reflect light toward the upper portion (the direction from the lower plate to the upper plate), so that the light irradiated from the light source (not shown) is output to the upper part.
  • the lower plate 120 includes two metal plates and an adhesive 340 positioned between the metal plates.
  • the adhesive 340 includes a component having an insulating function.
  • the adhesive 340 is injected between the metal plates and then cured, thereby preventing conduction between the metal plates and bonding them.
  • the adhesive 340 may be implemented with any one of a photo solder resist (PSR), an epoxy molding compound (EMC), or a silicon mold compound (SMC).
  • the top plate 110 of the substrate array for the light source has a shape having a step difference and an inclined surface to be formed as a reflective surface at preset intervals.
  • through holes through which the adhesive 340 can be injected are formed at the same interval as the upper plate 110 .
  • Both plates 110 and 120 are aligned in corresponding positions and adhered by an adhesive 330, and are diced for each shape to be manufactured as a light source substrate shown in FIG. 3 .
  • the adhesive 330 like the adhesive 340, also includes a component having an insulating function.
  • FIGS. 4 to 7 are views illustrating a process of manufacturing a lower plate of a substrate array for a light source according to an embodiment of the present invention.
  • a metal frame 120 to be manufactured as a lower plate of a substrate array for a light source is disposed on a die plate 420 .
  • the metal frame 120 is made of metal, for example, aluminum, and constitutes the lower plate of the substrate array for the light source.
  • the die plate 420 supports the metal frame 120 and has a gap corresponding to the width (w, length in the x-axis direction) and length (l, the length in the y-axis direction) of the through hole to be formed on the metal frame 120 . do.
  • a punch 410 having a width and a length of a through hole to be formed on the metal frame 120 presses the metal frame 120 .
  • a punch holder or a punch guide 430 on both sides (width direction) of the punch 410 is disposed and can move together with the punch 410 .
  • the width of the punch 410 should have about 50% of the height of the metal frame 120 , and the length of the punch 410 is preferably about 20 times the height of the metal frame 120 . If out of the above range, even if the punch holders or the punch guide 430 is disposed on both sides of the punch 410, it is difficult to press the punch 410 to form a through hole of a complete shape in the metal frame 120. .
  • the punch 410 has a preset width and length, and is formed at preset intervals to form through-holes at preset intervals in the metal frame 120 .
  • the punch 410 may be formed by all the number of through holes to be formed in the lower plate of the substrate array for the light source, or may be formed by some number to form all the through holes by pressing a plurality of times, one punch 410 . may form any number of through holes.
  • the punch 410 presses the metal frame 120 , it moves away from the metal frame 120 .
  • the punch 410 moves away, and a through hole 125 having a preset width and a preset length is formed in the metal frame 120 .
  • an adhesive tape 610 is attached to the upper surface (+y-axis direction, the surface in contact with the upper plate of the light source substrate array) of the metal frame 120 in which the through hole 125 is formed, and the metal frame (
  • a plating layer 620 is formed on the lower surface of the 120 (-y-axis direction, the opposite surface in contact with the upper plate of the light source substrate array).
  • the plating layer 620 is formed to include some or all of nickel (Ni) and silver (Ag), and is formed in the remaining portion except for the portion where the through hole 125 is formed.
  • the adhesive 340 is injected into the through hole 125 in the direction in which the plating layer 620 is formed. As shown in Fig. 7(a), the adhesive 340 may be injected as much as the width (length in the x-axis direction) of the through-hole 125, and as shown in Fig. 7(b), the through-hole 125 It may be injected by a width wider than the width of . Since the adhesive tape 610 is attached in a direction opposite to the direction in which the plating layer 620 is formed, the adhesive 340 may be completely injected into the through hole 125 . The adhesive 340 is injected into the through hole 125 and then cured.
  • the lower plate is not formed by cutting after the metal frame and the adhesive are adhered as in the prior art, but the metal frame is pressed and the adhesive is injected to produce the lower plate, it is possible to manufacture quickly and inexpensively. In addition, since only the lower plate is cut by pressing and the adhesive is only injected, there is no difficulty in cutting. Accordingly, the lower plate 120 of the substrate array for the light source can be manufactured quickly and simply.
  • FIG. 8 is a view illustrating a lower plate of a substrate array for a light source manufactured according to an embodiment of the present invention.
  • the through hole 125 is formed by pressing the punch 410 having a preset width and a preset length.
  • the adhesive-injected through-holes 340 are formed at preset intervals, and no through-holes are formed between the through-holes and the through-holes.
  • a blank 810 is present. Dicing is performed with the blank 810 portions, and the substrate array 100 for a light source is made of substrates for a light source.
  • 9 to 13 are views illustrating a process of manufacturing a top plate of a substrate array for a light source according to an embodiment of the present invention.
  • the metal frame 110 to be manufactured as the upper plate is also disposed on the die plate 920 .
  • the metal frame 110 may be embodied in the same way as that of the lower plate, made of metal, for example, aluminum.
  • the die plate 920 supports the metal frame 110 and has a space corresponding to the width of the through hole 1010 to be formed on the metal frame 110 .
  • the punch 910 creates a through hole 1010 by pressing the metal frame 110 supported on the die plate 920 .
  • punch holders or punch guides 930 are disposed on both sides (width direction) of the punch 910 to move together with the punch 910 . there is.
  • the through hole 1010 formed in the metal frame 110 does not have a width equal to the gap 115 between the step and the step in the finally manufactured upper fan 101 or the distance between the reflective surface and the reflective surface, but much more than that. have a narrow width.
  • a significant pressure must be applied to the metal frame and the punch.
  • the metal frame and the punch can be performed with relatively much less pressure in machining the same shape as the upper plate 110 of the light source substrate. .
  • the through-hole 1010 having a narrower width than the step and the gap 115 between the steps is primarily formed in the metal frame 110 .
  • An additional marker may be formed in the metal frame 110 together with the through hole 1010 .
  • a sawing marker 1020 indicating a dicing point of the manufactured substrate array for a light source
  • a cathode marker (not shown) or a column indicating a position where a cathode electrode will be disposed later
  • a heat outlet mark (not shown) indicating a position where the outlet is to be formed may be formed in the metal frame 110 together with the through hole 1010 .
  • the metal frame 110 in which the through hole 1010 is formed is machined by a punch 1110 having a shape complementary to that of the upper plate 110 of the light source substrate.
  • the punch 1110 descends and presses the metal frame 110, whereby the metal frame 110 is spaced apart by a predetermined interval 115, the step 310 and the reflective surface 320 can be formed.
  • machining is performed so that the step 310 and the reflective surface 320 are formed. can be manufactured with
  • an adhesive 330 for contacting the lower plate of the substrate array for the light source is applied to the lower surface of the metal frame 110 (the surface in contact with the lower plate of the substrate array for the light source).
  • the adhesive tape 610 attached to the lower plate of the light source substrate array manufactured through the process of FIGS. 4 to 7 is removed, and the upper plate of the light source substrate array and the lower plate of the light source substrate array are adhered with the adhesive 330 . . After the two plates are adhered, heat or ultrasonic waves are applied to complete the bonding, or a certain pressure is applied to complete the bonding.
  • Precise cutting does not have to be performed on both the upper and lower plates of the substrate array for the light source according to an embodiment of the present invention, nor is the cutting performed on materials having different components (metal and insulating material) at the same time, so it is inexpensive and fast In time, the substrate array 100 for the light source can be manufactured.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/KR2021/012383 2020-09-16 2021-09-10 광원용 기판 어레이 및 그 제조방법 WO2022060022A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200118993A KR102272672B1 (ko) 2020-09-16 2020-09-16 광원용 기판 어레이 및 그 제조방법
KR10-2020-0118993 2020-09-16

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WO2022060022A1 true WO2022060022A1 (ko) 2022-03-24

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KR (2) KR102272672B1 (zh)
TW (1) TWI785795B (zh)
WO (1) WO2022060022A1 (zh)

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Publication number Priority date Publication date Assignee Title
KR102272672B1 (ko) * 2020-09-16 2021-07-05 대성앤텍 주식회사 광원용 기판 어레이 및 그 제조방법

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KR20090067180A (ko) * 2006-10-17 2009-06-24 씨. 아이. 카세이 가부시기가이샤 상하전극형 발광 다이오드용 패키지 집합체와 그것을 이용한 발광장치의 제조방법
JP2011035264A (ja) * 2009-08-04 2011-02-17 Zeniya Sangyo Kk 発光素子用パッケージ及び発光素子の製造方法
KR20110054411A (ko) * 2009-11-17 2011-05-25 엘지이노텍 주식회사 발광소자 패키지
KR20120014416A (ko) * 2010-08-09 2012-02-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR101373352B1 (ko) * 2012-09-24 2014-03-13 창 와 테크놀러지 컴퍼니 리미티드 발광다이오드 패킹 전 제조 공정 및 그 구조
KR102272672B1 (ko) * 2020-09-16 2021-07-05 대성앤텍 주식회사 광원용 기판 어레이 및 그 제조방법

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Publication number Publication date
TWI785795B (zh) 2022-12-01
KR20220036845A (ko) 2022-03-23
TW202229766A (zh) 2022-08-01
KR102272672B1 (ko) 2021-07-05

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