WO2022042091A1 - 一种散热组件及汽车 - Google Patents

一种散热组件及汽车 Download PDF

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Publication number
WO2022042091A1
WO2022042091A1 PCT/CN2021/105884 CN2021105884W WO2022042091A1 WO 2022042091 A1 WO2022042091 A1 WO 2022042091A1 CN 2021105884 W CN2021105884 W CN 2021105884W WO 2022042091 A1 WO2022042091 A1 WO 2022042091A1
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WO
WIPO (PCT)
Prior art keywords
heat
fixing plate
pcb board
heating device
conducting component
Prior art date
Application number
PCT/CN2021/105884
Other languages
English (en)
French (fr)
Inventor
贾晖
胡真明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2023513840A priority Critical patent/JP2023539319A/ja
Priority to EP21859931.4A priority patent/EP4199668A4/en
Publication of WO2022042091A1 publication Critical patent/WO2022042091A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings

Definitions

  • the present application relates to the technical field of hardware structures, and in particular, to a heat dissipation component and an automobile.
  • AI artificial intelligence
  • MDC mobile data center
  • the existing heat dissipation component is composed of a cold plate with a boss, a thermally conductive gel, a PCB board, and a heating device (such as a chip); wherein the heating device is on a printed circuit board (printed circuit board, PCB), and its surface is connected to the cold plate.
  • Heat conduction is achieved with thermally conductive gel.
  • the thermally conductive gel has a large temperature rise due to its large filling thickness.
  • the present application provides a heat dissipation assembly, comprising: a first heat conduction assembly and a first fixing plate; the first fixing plate is fixedly connected to a PCB board, and a first heating device is provided on one side of the PCB board , the first fixing plate is located on the side of the first heating device facing away from the PCB board; the first fixing plate is provided with a first through hole, and the first heat conducting component penetrates through the first through hole , and one side of the first heat-conducting component is attached to the first heating device.
  • the first fixing plate can be a plate-shaped metal plate made of aluminum or aluminum alloy, and the first fixing plate and the PCB board can be fixed at a parallel or near-parallel angle.
  • the PCB board can be a main board or a PCB board with other functions, on which one or more heating devices can be arranged.
  • the heating device can be a SOC chip, a local area network switch LAN SW or a microcontroller unit (MCU).
  • the heat-generating device is one of one or more heat-generating devices arranged on the PCB board.
  • the PCB board has two sides, and heat-generating devices can be arranged on both sides.
  • the first heating device is arranged on the surface of the PCB board facing the first fixing plate.
  • a high-power heating device is arranged on one of the two sides of the PCB board, and a low-power heating device is arranged on the other side, and the first heating device can be arranged on the surface of the PCB board where the high-power heating device is arranged, and The first heating device may be a high-power heating chip.
  • the first fixing plate is provided with a first through hole, the first heat-conducting component penetrates the first through-hole, and one side of the first heat-conducting component is attached to the first heating device.
  • one side of the first heat-conducting component can be directly contacted with the first heating device to achieve bonding, and can also be bonded indirectly with the first heating device by applying silicone grease.
  • the first heat-generating device is attached to the first heat-conducting component, and the first heat-conducting component can take away the heat on the first heat-generating device.
  • the size of the first heat-conducting component can be adapted to the size setting of the through hole, compared with the prior art
  • the size and weight of the first heat-conducting component in this embodiment are relatively small, and in terms of thickness, since the first heat-conducting component penetrates through the through hole of the first fixing member, the fixing plate is separated from the liquid-cooling plate. In this embodiment, the thickness of the heat dissipation component is relatively small.
  • a second heat-generating device is further provided on one side of the PCB board, and the heat-dissipating component further includes: a second heat-conducting component and a flexible connector; the first heat-conducting component and the second heat-conducting component The heat-conducting component is connected by the flexible connector; the first fixing plate is further provided with a second through hole, the second heat-conducting component penetrates the second through-hole, and one side of the second heat-conducting component is connected to the second through hole.
  • the second heating element is attached.
  • the first heat-conducting assembly and the second heat-conducting assembly are connected by a flexible connector to form a whole, and the flexible pipeline enables the first heat-conducting assembly and the second heat-conducting assembly to move up and down a certain amount along the direction perpendicular to the plane of the first fixing plate.
  • the first heat-generating device and the second heat-generating device are not on the same plane, because the first heat-conducting component and the second heat-conducting component can move up and down a certain distance along the direction perpendicular to the plane of the first fixing plate , so that the first heat-conducting component and the second heat-conducting component can be closely attached to the corresponding heating device.
  • the first heat conducting component is a water cooling head.
  • the first heat-conducting component may also be other components with heat-conducting capability, such as a liquid cooling plate.
  • it further includes: a heat conduction pipe; the heat conduction pipe is connected to the first heat conduction component, a groove is provided on the side of the first fixing plate facing the PCB board, and the heat conduction pipe fit with the inner wall of the groove. If the power of the device that needs to be dissipated on the PCB board is too high to be naturally dissipated, if the power of the device that needs to be dissipated on the PCB board is very high, the heat pipe can be attached to the inner wall of the groove on the first fixing plate, so that the The heat generated by the components that need to be dissipated on the PCB board is transferred to the fixing board.
  • the heat transfer pipe is a metal pipe.
  • the heat pipe can also be a rigid pipe such as a plastic pipe with better thermal conductivity.
  • a third heating device is further arranged on one side of the PCB board, a boss is arranged on the side of the first fixing plate facing the PCB board, and the third heating device faces all the One side of the first fixing plate is attached to the boss.
  • the first heat-conducting component is floatingly connected to the PCB, so that one side of the first heat-conducting component is attached to the first heating device.
  • the heat-conducting component can be installed and matched with the first fixing plate, wherein the first heat-conducting component can directly pass through the first through hole of the first fixing plate, and fix and lock the spring screw and the single-board bracket with the first heating device (
  • the single-board bracket may be, but is not limited to, disposed on the bottom case), so that the first heat-conducting component can be floatingly connected to the PCB board, so that the first heat-conducting component can be attached to the first heat-generating device.
  • the method further includes: a sealing cover; the sealing cover is fixed on the side of the first fixing plate facing away from the PCB board, so as to seal the first through hole.
  • the sealing cover in order to seal the through holes opened on the first fixing plate, the sealing cover can be fixed on the side of the first fixing plate facing away from the PCB board, so as to seal the first fixing plate. through hole.
  • a sealing cover may be provided on the first fixing plate, the sealing cover may be locked in a local area near the heat-conducting component (the first heat-conducting component or the second heat-conducting component), and the sealing cover may be locked on the heat-conducting component (the first heat-conducting component).
  • the sealing cover can also be locked on the surrounding outer edge of the entire first fixing plate, and all joints are fixed by sealing rings and screws to achieve air tightness.
  • the present application provides an installation method for an in-vehicle computing device, including:
  • One side of the first fixing board is fixedly connected to the PCB board, one side of the PCB board is provided with a first heating device, and the first fixing board is located on the side of the first heating device facing away from the PCB board.
  • one side, and the first fixing plate is provided with a first through hole;
  • the sealing cover is fixed on the side of the first fixing plate facing away from the PCB board, so as to seal the first through hole.
  • the present application provides an automobile, which is characterized by comprising a vehicle body, and the heat dissipation assembly according to any one of the above-mentioned first aspects disposed in the vehicle body.
  • the present application can further combine to provide more designs.
  • the embodiment of the present application provides a heat dissipation assembly, including: a first heat conduction assembly and a first fixing plate; the first fixing plate is fixedly connected to a PCB board, and a first heating device is arranged on one side of the PCB board, so The first fixing plate is located on the side of the first heating device facing away from the PCB board; the first fixing plate is provided with a first through hole, the first heat conducting component penetrates through the first through hole, and One side of the first heat-conducting component is attached to the first heating device.
  • the first heat-generating device is attached to the first heat-conducting component, and the first heat-conducting component can take away the heat on the first heat-generating device.
  • the size of the first heat-conducting component can be adapted to the size setting of the through hole, compared with the prior art
  • the size and weight of the first heat-conducting component in this embodiment are relatively small, and in terms of thickness, since the first heat-conducting component penetrates through the through hole of the first fixing member, the fixing plate is separated from the liquid-cooling plate.
  • the thickness of the heat dissipation component is relatively small.
  • FIG. 1a provides a schematic structural diagram of a vehicle according to an embodiment of the application
  • FIG. 1b is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • the heat dissipation components provided in this application can be applied to automobiles, for example, in-vehicle computing devices in automobiles.
  • smart cars include support for unmanned driving (unmanned driving), assisted driving (driver assistance/ADAS), intelligent driving (intelligent driving), connected driving (connected driving), intelligent network driving (intelligent network driving) Electric cars or gasoline-powered cars with car sharing.
  • the on-board computing device is used to control and monitor the driving status of the smart car, including but not limited to the on-board mobile data center (MDC), and the hardware monitor interface (HMI) that realizes the function of the human-computer interaction controller.
  • MDC on-board mobile data center
  • HMI hardware monitor interface
  • In-vehicle infotainment (IVI) controller body control module (BCM), vehicle control unit (VCU).
  • the in-vehicle computing device can specifically be a chip with computing and processing capabilities, or can be a collection of multiple devices such as processors and memories integrated in a printed circuit board (PCB), where the processor includes but is not limited to the central Processor (central processing unit, CPU), general-purpose processor, digital signal processor (digital signal processing, DSP), application-specific integrated circuit (application-specific integrated circuit, ASIC), field-programmable gate array (field-programmable gate array) , FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, graphics processing unit (GPU), artificial intelligence (artificial intelligence, AI) chips.
  • CPU central processing unit
  • DSP digital signal processor
  • ASIC application-specific integrated circuit
  • FPGA field-programmable gate array
  • FPGA field-programmable gate array
  • a general purpose processor may be a microprocessor or any conventional processor or the like. It can be seen from the above description that the in-vehicle computing device is provided with a chip with a large amount of calculation, so when it is used, it requires higher requirements for heat dissipation. Therefore, the present application provides a heat dissipation component to improve the heat dissipation effect on the chip.
  • the in-vehicle computing device 201 can be installed in the center console or in a suitable position near the liquid cooling pump of the vehicle. , camera 202, etc.), detect the environment where the car is located, and then feed it back to the built-in chip of the on-board computing device 201 for real-time reasoning operations, and finally the on-board computing device 201 issues an operation command to the vehicle controller (Vehicle control unit, VCU) 204 , controlling the motor vehicle (braking, decelerating, etc.) through the VCU 204 to realize various levels of automatic driving functions.
  • VCU vehicle control unit
  • the in-vehicle computing device 201 can also upload data to the back-end cloud data center through a T-BOX (telematics BOX) 203 .
  • the in-vehicle computing device 201 may transmit with the camera 202 through a multimedia serial link (MSL); with the lidar 205 through an in-vehicle Ethernet link; with the VCU 204 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX203 through the vehicle Ethernet link.
  • MSL multimedia serial link
  • the lidar 205 through an in-vehicle Ethernet link
  • the VCU 204 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX203 through the vehicle Ethernet link.
  • controller area network Network controller area network, CAN
  • the in-vehicle computing device 201 in the present application may include a heat dissipation component for providing heat dissipation for the heat-dissipating device in the in-vehicle computing device 201 .
  • FIG. 1b provides a schematic exploded view of the structure of a heat dissipation assembly according to an embodiment of the present application. As shown in FIG. 1b,
  • the first fixing plate 102 is fixedly connected to the PCB board 103, a first heating device 104 is disposed on one side of the PCB board 103, and the first fixing plate 102 is located on the first heating device 104 is facing away from the side of the PCB board 103 .
  • the first fixing plate 102 may be a plate-shaped metal plate made of aluminum or aluminum alloy material, and the first fixing plate 102 and the PCB board 103 may be fixed at a parallel or near-parallel angle.
  • the PCB board 103 can be a main board or a PCB board 103 with other functions, on which one or more heating devices can be provided, and the heating devices can be devices such as SOC chips, local area network switches LAN SW, or microcontroller units (MCUs), etc.
  • the first heating device 104 is one of one or more heating devices arranged on the PCB board 103.
  • the PCB board 103 has two sides, and heating devices can be arranged on both sides.
  • the first heating device 104 is disposed on the surface of the PCB board 103 facing the first fixing board 102 .
  • one of the two surfaces of the PCB board 103 is arranged with a high-power heating device, and the other surface is arranged with a low-power heating device.
  • the first heating device 104 can be arranged on the surface of the PCB board 103 where the high-power heating device is arranged. above, and the first heating device 104 may be a high-power heating chip.
  • the first fixing plate 102 defines a first through hole 105
  • the first thermal conductive component 101 penetrates through the first through hole 105
  • one side of the first thermal conductive component 101 is connected to the first through hole 105 .
  • the first heating device 104 is attached.
  • One side of the first heat-conducting component 101 can be attached to the first heating device 104 through direct contact, or indirectly contacted with the first heating device 104 by applying silicone grease.
  • FIG. 2 is a schematic structural diagram of a fixing plate in an embodiment of the present application.
  • a first through hole 105 may be formed in the first fixing plate 102 .
  • the first fixing plate 102 and the PCB board 103 are disposed opposite to each other, and the first fixing plate 102 may have a first through hole 105 at a position opposite to the first heating device 104 , and the first heat conducting component 101 may be It penetrates through the first through hole 105 and is attached to the first heating element 104 .
  • the first fixing plate 102 may be provided with a first through hole 105, and the first through hole 105 may be provided with a first heat conducting component 101.
  • the first fixing plate 102 may be Move to the PCB board 103 , and make the first heat-conducting component 101 fit with the first heating device 104 .
  • the first heat-conducting component 101 is a water-cooled head, the inside of the water-cooled head may include flow channels and fins, the flow channels may be filled with liquid, and then the heat can be taken away by the flow of the liquid, and the liquid may be water or fins. Other refrigerants.
  • the first heat-conducting component 101 may also be other components with better heat dissipation performance, such as a liquid cooling plate.
  • a second heat-generating device 106 may also be provided on one side of the PCB board 103 , and the heat-dissipating component further includes: a second heat-conducting component 107 and a flexible connector 108 ; the first heat-conducting component 101 and the The second heat-conducting component 107 is connected by the flexible connecting member 108; the first fixing plate 102 further defines a second through hole 111, the second heat-conducting component 107 penetrates through the second through hole 111, and all the One side of the second heat-conducting component 107 is attached to the second heating device 106 .
  • a second heat-generating device 106 may also be arranged on the side of the PCB board 103 on which the first heat-generating device 104 is arranged, and the second heat-generating device 106 is one arranged on the PCB board 103 .
  • the PCB board 103 has two sides, and heating devices can be arranged on both sides, the first fixing plate 102 is located on the side of the second heating device 106 facing away from the PCB board 103, and the second heating device 102 The heating device 106 is arranged on the surface of the PCB board 103 facing the first fixing board 102 .
  • the first fixing plate 102 and the PCB board 103 are disposed opposite to each other, and the first fixing plate 102 may be provided with a second through hole 111 at a position opposite to the second heating device 106 , and the second heat conducting component 107 may penetrate through the second through hole 111 and adhere to the second heat generating device 106 .
  • the first heat-conducting component 101 and the second heat-conducting component 107 are connected by a flexible connector 108 to form a whole, and the flexible pipeline enables the first heat-conducting component 101 and the second heat-conducting component 107 to be perpendicular to the first fixing plate 102
  • the direction of the plane is displaced up and down by a certain distance.
  • the first heating device 104 and the second heating device 106 are not on the same plane.
  • the direction of the plane of the fixing plate 102 is displaced up and down by a certain distance, so that the first heat-conducting component 101 and the second heat-conducting component 107 can be closely attached to the corresponding heating devices.
  • the above-mentioned flexible connector 108 may be a flexible tube, or a combination of a flexible tube and a rigid tube (eg, a metal tube).
  • FIG. 3 is a schematic structural diagram of a thermally conductive assembly provided by an embodiment of the present application.
  • the first thermally conductive assembly 101 and the second thermally conductive assembly 107 are connected by a flexible connector 108 , and the first thermally conductive assembly 101 and the second thermally conductive assembly 107
  • the first heat-conducting component 101 and the second heat-conducting component 107 are water-cooled heads, the flexible connector 108 can be set to be hollow, and the empty chamber in the middle can be used as a liquid flow channel.
  • the heat-dissipating component can also include: It is connected to the first heat conduction assembly 101, and the heat conduction pipe 109 is connected to the second heat conduction assembly 107.
  • the heat conduction pipe 109 can be set to be hollow, and the empty chamber in the middle can be used as a liquid flow channel.
  • the heat conduction pipe 109 can be It is a metal tube, a plastic tube with good thermal conductivity, etc.
  • FIG. 4 is a schematic diagram of the structure of the heat dissipation assembly provided by the embodiment of the application. As shown in FIG. 4, along the line of sight toward the PCB board 103, it can be seen that the first heat conduction assembly 101 is located in the first through hole 105, The second heat conducting component 107 is located in the second through hole 111 .
  • a third heating device is further arranged on one side of the PCB board 103 , a boss 112 is arranged on the side of the first fixing board 102 facing the PCB board 103 , and the third heating element is arranged on the side of the first fixing board 102 facing the PCB board 103 The side of the heating element facing the first fixing plate 102 is attached to the boss 112 .
  • the side of the first fixing plate 102 facing the PCB board 103 may also be provided with a boss 112, which corresponds to the third heating device on the PCB board 103.
  • FIG. 5 The structure of the board is schematically shown.
  • the side of the first fixing board 102 facing the PCB board 103 can be provided with a plurality of bosses 112 in addition to the first through holes 105 and the second through holes 111.
  • Each boss 112 corresponds to other heat-generating devices on the PCB board 103 (heat-generating devices other than the first heat-generating device 104 and the second heat-generating device 106 ).
  • a groove 113 may be further provided on the side of the first fixing plate 102 facing the PCB board 103 , and the heat conduction pipe 109 is attached to the inner wall of the groove 113 .
  • the pipeline of the heat pipe 109 and the first fixing plate 102 may or may not be in contact, depending on whether the power of the device that needs to be dissipated by the PCB board 103 is too high to be solved by natural heat dissipation. If the heat transfer pipe 109 is high, the heat pipe 109 can be attached to the inner wall of the groove 113 on the first fixing plate 102, so that the heat generated by the device that needs to be dissipated on the PCB board 103 can be transferred to the fixing plate.
  • FIG. 6 is a schematic view of the structure of a fixing plate provided by an embodiment of the present application. As shown in FIG. 6 , a groove 113 may be provided on the side of the first fixing plate 102 facing the PCB board 103 .
  • the first heat-conducting component 101 may be floatingly connected to the PCB board 103, so that one side of the first heat-conducting component 101 is attached to the first heating device 104.
  • FIG. 7 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • the first heat conducting assembly 101 can be installed and cooperated with the first fixing plate 102 , wherein the first The heat-conducting component 101 can directly pass through the first through hole 105 of the first fixing plate 102 to fix and lock the spring screw and the single-board bracket 115 with the first heating device 104 (the single-board bracket 115 can be, but is not limited to, set on the bottom case 114 ), so that the first heat-conducting component 101 can be floatingly connected to the PCB board 103 , so that the first heat-conducting component 101 can be attached to the first heating device 104 .
  • the surface of the PCB board 103 facing away from the first fixing plate 102 may be arranged with a heating device, which is contacted by the long bosses 112 on the bottom case 114, and the contact interface may be filled with thermally conductive pads or thermally conductive gels ;
  • the bottom case 114 can be a pure metal plate, can also be a whole cavity type water cooling plate, can also be the same heat dissipation structure as the above-mentioned first fixing plate 102 and the heat conducting component, which is not limited here.
  • the sealing cover 110 in order to seal the through holes opened on the first fixing plate 102, the sealing cover 110 may be fixed on the side of the first fixing plate 102 facing away from the PCB board 103, so as to seal the first through hole 105 .
  • a sealing cover 110 may be disposed on the first fixing plate 102 .
  • the sealing cover 110 may be locked in a local area near the thermally conductive component (the first thermally conductive component 101 or the second thermally conductive component 107 ), such as
  • the sealing cover 110 can be locked on a local area near the thermally conductive components (the first thermally conductive component 101 and the second thermally conductive component 107 ).
  • the sealing cover 110 can also be locked on the entire first fixing plate 102 All the joints are fixed by sealing rings and screws to meet the requirements of airtightness.
  • Figure 11 is a schematic diagram of the installed on-board computing device.
  • the first heat-generating device 104 is attached to the first heat-conducting component 101 , and the first heat-conducting component 101 can take away the heat on the first heat-generating device 104 .
  • the size of the first thermally conductive component 101 can be adapted to the size setting of the through hole, compared to the existing Technical liquid cooling plate, the size and weight of the first heat-conducting component 101 in this embodiment are smaller, and in terms of thickness, since the first heat-conducting component 101 penetrates through the through hole of the first fixing member, compared with the fixing plate and the The liquid cooling plates are arranged separately, and the thickness of the heat dissipation assembly in this embodiment is relatively small.
  • the device embodiments described above are only schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be A physical unit, which can be located in one place or distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.
  • the technical solutions of the present application can be embodied in the form of software products in essence or the parts that make contributions to the prior art, and the computer software products are stored in a readable storage medium, such as a floppy disk of a computer , U disk, mobile hard disk, ROM, RAM, magnetic disk or optical disk, etc., including several instructions to enable a computer device (which may be a personal computer, training device, or network device, etc.) to execute the various embodiments of the application. method.
  • a readable storage medium such as a floppy disk of a computer , U disk, mobile hard disk, ROM, RAM, magnetic disk or optical disk, etc.
  • the computer program product includes one or more computer instructions.
  • the computer may be a general purpose computer, special purpose computer, computer network, or other programmable device.
  • the computer instructions may be stored in or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be retrieved from a website, computer, training device, or data Transmission from the center to another website site, computer, training facility or data center via wired (eg coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (eg infrared, wireless, microwave, etc.) means.
  • wired eg coaxial cable, fiber optic, digital subscriber line (DSL)
  • wireless eg infrared, wireless, microwave, etc.
  • the computer-readable storage medium may be any available medium that can be stored by a computer, or a data storage device such as a training device, a data center, or the like that includes an integration of one or more available media.
  • the usable media may be magnetic media (eg, floppy disks, hard disks, magnetic tapes), optical media (eg, DVD), or semiconductor media (eg, Solid State Disk (SSD)), and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本申请实施例提供了一种散热组件，包括：第一导热组件以及第一固定板；所述第一固定板与PCB板固定连接，所述PCB板的一侧设置有第一发热器件，所述第一固定板位于所述第一发热器件背向所述PCB板的一侧；所述第一固定板开设有第一通孔，所述第一导热组件贯穿所述第一通孔，且所述第一导热组件的一侧与所述第一发热器件贴合。本申请提供的计算装置可以应用在自动驾驶汽车、智能汽车、网联汽车、新能汽车上，本申请中第一发热器件与第一导热组件贴合，第一导热组件可以将第一发热器件上的热量带走。本申请在保证散热性能的同时，降低了散热组件的尺寸。

Description

一种散热组件及汽车
本申请要求于2020年08月31日提交中国专利局、申请号为202010901492.7、发明名称为“一种散热组件及汽车”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到硬件结构技术领域，尤其涉及一种散热组件及汽车。
背景技术
自动驾驶逐渐成为一个新的市场，其中的关键部件之一是自动驾驶的人工智能(artificial intelligence，AI)控制芯片及其PCB板。随着算力需求的增加，高级驾驶辅助系统(advanced driver assistance system，ADAS)/移动数据中心(mobile data center，MDC)的功率越来越高，风冷已无法解决散热问题，于是需要液冷技术。
现有散热组件由带凸台的冷板、导热凝胶、PCB板、发热器件(例如芯片)组成；其中发热器件在印制电路板(printed circuit board，PCB)之上，其表面与冷板采用导热凝胶实现导热。然而导热凝胶由于填充厚度大，导致产生很大的温升。
发明内容
第一方面，本申请提供了一种散热组件，包括：第一导热组件以及第一固定板；所述第一固定板与PCB板固定连接，所述PCB板的一侧设置有第一发热器件，所述第一固定板位于所述第一发热器件背向所述PCB板的一侧；所述第一固定板开设有第一通孔，所述第一导热组件贯穿所述第一通孔，且所述第一导热组件的一侧与所述第一发热器件贴合。第一固定板可以为板状的铝或铝合金等材料的金属板，第一固定板和PCB板可以以平行或接近于平行的角度固定。PCB板可以为主板或其他功能的PCB板，其上可以设置有一个或多个发热器件，发热器件可以为SOC芯片、局域网交换机LAN SW或微控制单元(microcontroller unit，MCU)等器件，第一发热器件为PCB板上布置的一个或多个发热器件中的一个，PCB板具有两个面，可以均布置有发热器件，由于第一固定板位于所述第一发热器件背向所述PCB板的一侧，则第一发热器件设置在PCB板上朝向第一固定板的面上。可选的，PCB板的两个面中一个面布置大功率的发热器件，一个面布置小功率的发热器件，第一发热器件可以布置在PCB板上布置大功率的发热器件的面上，且第一发热器件可以为大功率发热芯片。所述第一固定板开设有第一通孔，所述第一导热组件贯穿所述第一通孔，且所述第一导热组件的一侧与所述第一发热器件贴合。其中，第一导热组件的一侧可以与所述第一发热器件通过直接接触实现贴合，也可以通过涂硅脂与该第一发热器件间接接触实现贴合。
本申请实施例中，第一发热器件与第一导热组件贴合，第一导热组件可以将第一发热器件上的热量带走。一方面，从导热组件的大小来看，由于第一导热组件穿透过第一固定件的通孔，第一导热组件的大小可以适配于通孔的大小设置，相比于现有技术的液冷板，本实施例中的第一导热组件的尺寸和重量较小，且从厚度方面，由于第一导热组件穿透过第一固定件的通孔，相比固定板与液冷板分离设置，本实施例中散热组件的厚度较小。
在一种可能的实现中，所述PCB板的一侧还设置有第二发热器件，所述散热组件还包括：第二导热组件和柔性连接件；所述第一导热组件与所述第二导热组件通过所述柔性连接件连接；所述第一固定板还开设有第二通孔，所述第二导热组件贯穿所述第二通孔，且所述第二导热组件的一侧与所述第二发热器件贴合。
其中，第一导热组件和第二导热组件通过柔性连接件连接，构成一个整体，该柔性管路使得第一导热组件和第二导热组件可以沿着垂直于第一固定板平面的方向上下位移一定的距离，在一些场景中，第一发热器件和第二发热器件不在同一个平面上，由于第一导热组件和第二导热组件可以沿着垂直于第一固定板平面的方向上下位移一定的距离，进而可以使得第一导热组件和第二导热组件可以紧密地与对应的发热器件良好贴合。
在一种可能的实现中，所述第一导热组件为水冷头。第一导热组件还可以为液冷板等其他具有导热能力的组件。
在一种可能的实现中，还包括：导热管；所述导热管与所述第一导热组件连接，所述第一固定板朝向所述PCB板的一侧设置有凹槽，所述导热管与所述凹槽的内壁贴合。若该PCB板需要散热的器件是否功率高到无法自然散热解决，若PCB板需要散热的器件的功率很高，则导热管可以与第一固定板上的凹槽的内壁贴合，以便可以将该PCB板上需要散热的器件产生的热量传递至固定板。
在一种可能的实现中，所述导热管为金属管。导热管还可以为导热性能较好的塑料管等刚性管。
在一种可能的实现中，所述PCB板的一侧还设置有第三发热器件，所述第一固定板朝向所述PCB板的一侧布置有凸台，所述第三发热器件朝向所述第一固定板的一侧与所述凸台贴合。
在一种可能的实现中，所述第一导热组件与所述PCB板浮动连接，以便所述第一导热组件的一侧与所述第一发热器件贴合。导热组件可以与第一固定板进行安装配合，其中第一导热组件可以直接透过第一固定板的第一通孔，与第一发热器件进行弹簧螺钉和单板托架的固定和锁紧(单板托架可以但不限于设置在底壳上)，使得第一导热组件可以与所述PCB板浮动连接，进而使得第一导热组件可以与所述第一发热器件贴合。
在一种可能的实现中，还包括：密封盖；所述密封盖固定于所述第一固定板背向所述PCB板的一侧，以便密封所述第一通孔。本申请实施例中，为了对第一固定板上开设的通孔进行密封，可以将所述密封盖固定于所述第一固定板背向所述PCB板的一侧，以便密封所述第一通孔。具体的，第一固定板之上可以设置有密封盖，密封盖可以锁在导热组件(第一导热组件或第二导热组件)附近的局部区域，密封盖可以锁在导热组件(第一导热组件和第二导热组件)附近的局部区域，密封盖也可以锁在整个第一固定板的四周外缘，所有的结合处通过密封圈和螺钉进行固定，达成气密的需求。
第二方面，本申请提供了一种车载计算装置的安装方法，包括：
将所述第一固定板的一侧与PCB板固定连接，所述PCB板的一侧设置有第一发热器件，所述第一固定板位于所述第一发热器件背向所述PCB板的一侧，且所述第一固定板开设有 第一通孔；
将第一导热组件贯穿所述第一通孔，并使得所述第一导热组件的一侧与所述第一发热器件贴合；
将密封盖固定于所述第一固定板背向所述PCB板的一侧，以便密封所述第一通孔。
第三方面，本申请提供了一种汽车，其特征在于，包括车体，以及设置在所述车体内的如上述第一方面任一项所述的散热组件。
本申请在上述各方面提供的设计的基础上，还可以进行进一步组合以提供更多设计。
本申请实施例提供了一种散热组件，包括：第一导热组件以及第一固定板；所述第一固定板与PCB板固定连接，所述PCB板的一侧设置有第一发热器件，所述第一固定板位于所述第一发热器件背向所述PCB板的一侧；所述第一固定板开设有第一通孔，所述第一导热组件贯穿所述第一通孔，且所述第一导热组件的一侧与所述第一发热器件贴合。本申请实施例中，第一发热器件与第一导热组件贴合，第一导热组件可以将第一发热器件上的热量带走。一方面，从导热组件的大小来看，由于第一导热组件穿透过第一固定件的通孔，第一导热组件的大小可以适配于通孔的大小设置，相比于现有技术的液冷板，本实施例中的第一导热组件的尺寸和重量较小，且从厚度方面，由于第一导热组件穿透过第一固定件的通孔，相比固定板与液冷板分离设置，本实施例中散热组件的厚度较小。
附图说明
图1a为本申请实施例提供一种车辆的结构示意；
图1b为本申请实施例提供的一种散热组件的结构示意；
图2为本申请实施例提供的一种散热组件的结构示意；
图3为本申请实施例提供的一种散热组件的结构示意；
图4为本申请实施例提供的一种散热组件的结构示意；
图5为本申请实施例提供的一种散热组件的结构示意；
图6为本申请实施例提供的一种散热组件的结构示意；
图7为本申请实施例提供的一种散热组件的结构示意；
图8为本申请实施例提供的一种散热组件的结构示意；
图9为本申请实施例提供的一种散热组件的结构示意；
图10为本申请实施例提供的一种散热组件的结构示意；
图11为本申请实施例提供的一种散热组件的结构示意。
具体实施方式
下面结合本发明实施例中的附图对本发明实施例进行描述。本发明的实施方式部分使用的术语仅用于对本发明的具体实施例进行解释，而非旨在限定本发明。
下面结合附图，对本申请的实施例进行描述。本领域普通技术人员可知，随着技术的发展和新场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的术语在适当情况下可以互换，这仅仅是描述本申请的实施例中对相同属性的对象在描述时所采用的区分方式。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，以便包含一系列单元的过程、方法、系统、产品或设备不必限于那些单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它单元。
首先，介绍本申请提供的散热组件的应用场景，本申请提供散热组件可以应用于汽车中，例如，可以应用在汽车内的车载计算装置中，车载计算装置应用于智能汽车的自动驾驶(automated driving)中，其中，智能汽车包括支持无人驾驶(unmanned driving)、辅助驾驶(driver assistance/ADAS)、智能驾驶(intelligent driving)、网联驾驶(connected driving)、智能网联驾驶(intelligent network driving)和汽车共享(car sharing)的电动汽车或者汽油驱动的汽车。车载计算装置用于对智能汽车进行行驶状态控制和状态监控，包括但不限于车载移动数据中心(mobile data center，MDC)、实现人机交互控制器功能的硬件监视器(hardware monitor interface，HMI)、车载娱乐(in-vehicle infotainment，IVI)控制器，车身控制器(body control module，BCM)、整车控制器(vehicle control unit,VCU)。车载计算装置具体可以具有计算和处理能力的芯片，也可以是集成在印制电路板(printed circuit board，PCB)中处理器、存储器等多个器件的集合，其中，处理器包括但不限于中央处理器(central processing unit，CPU)，通用处理器、数字信号处理器(digital signal processing，DSP)、专用集成电路(application-specific integrated circuit，ASIC)、现场可编程门阵列(field-programmable gate array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件、图形处理器单元(graphics processing unit，GPU)、人工智能(artificial intelligence，AI)芯片。通用处理器可以是微处理器或者是任何常规的处理器等。由上述描述可以看出，车载计算装置设置有计算量较大的芯片，因此其在使用时，散热需要较高的要求，为此本申请提供了一种散热组件来改善对芯片的散热效果。
示例性的，如图1a所示，车载计算装置201可以安装在中控台或靠近整车液冷泵等合适位置，通过安装在车身上的各类传感器(例如毫米波雷达206、激光雷达205、摄像头202等等)，探测汽车所处环境，然后反馈给车载计算装置201内置的芯片等进行实时推理运算，最后车载计算装置201下发操作命令给整车控制器(vehicle control unit，VCU)204，通过VCU204控制机动车辆(刹车、减速等)，实现各种级别的自动驾驶功能。车载计算装置201还可通过T-BOX(telematics BOX)203将数据上传到后端的云数据中心。可选的，车载计算装置201可以与摄像头202之间通过多媒体串行链路(multimedia serial link，MSL)传输；与激光雷达205之间通过车载以太链路传输；与VCU204之间通过控制器局域网络(controller area network，CAN)总线传输；与毫米波雷达106之间通过CAN总线传输；与T-BOX203之间通过车载以太链路传输。
本申请中的车载计算装置201可以包括散热组件，用于为车载计算装置201中的散热器件提供散热。
参照图1b，图1b为本申请实施例提供一种散热组件的结构爆炸示意，如图1b所示，本申请实施例提供的散热组件，包括：第一导热组件101以及第一固定板102。
本申请实施例中，所述第一固定板102与PCB板103固定连接，所述PCB板103的一侧设置有第一发热器件104，所述第一固定板102位于所述第一发热器件104背向所述PCB板103的一侧。
其中，第一固定板102可以为板状的铝或铝合金等材料的金属板，第一固定板102和PCB板103可以以平行或接近于平行的角度固定。PCB板103可以为主板或其他功能的PCB板103，其上可以设置有一个或多个发热器件，发热器件可以为SOC芯片、局域网交换机LAN SW或微控制单元(microcontroller unit，MCU)等器件，第一发热器件104为PCB板103上布置的一个或多个发热器件中的一个，PCB板103具有两个面，可以均布置有发热器件，由于第一固定板102位于所述第一发热器件104背向所述PCB板103的一侧，则第一发热器件104设置在PCB板103上朝向第一固定板102的面上。可选的，PCB板103的两个面中一个面布置大功率的发热器件，一个面布置小功率的发热器件，第一发热器件104可以布置在PCB板103上布置大功率的发热器件的面上，且第一发热器件104可以为大功率发热芯片。
本申请实施例中，所述第一固定板102开设有第一通孔105，所述第一导热组件101贯穿所述第一通孔105，且所述第一导热组件101的一侧与所述第一发热器件104贴合。其中，第一导热组件101的一侧可以与所述第一发热器件104通过直接接触实现贴合，也可以通过涂硅脂与该第一发热器件104间接接触实现贴合。
参照图2，图2为本申请实施例中一种固定板的结构示意，如图2所示，第一固定板102可以开设有第一通孔105。本申请实施例中，第一固定板102和PCB板103相对设置，且第一固定板102可以在和第一发热器件104相对的位置上开设有第一通孔105，第一导热组件101可以贯穿第一通孔105，并与所述第一发热器件104贴合。
具体的，可以如图1b所示，第一固定板102上可以开设有第一通孔105，第一通孔105中设置有第一导热组件101，在安装时，可以将第一固定板102向PCB板103移动，并使得第一导热组件101与第一发热器件104贴合。
在一种可选的实现中，第一导热组件101为水冷头，水冷头内部可以包括流道和翅片，流道中可以填充液体，进而通过液体的流动将热量带走，液体可以为水或其它制冷工质。第一导热组件101还可以为液冷板等其他散热性能较好的组件。
本申请实施例中，所述PCB板103的一侧还可以设置有第二发热器件106，所述散热组件还包括：第二导热组件107和柔性连接件108；所述第一导热组件101与所述第二导热组件107通过所述柔性连接件108连接；所述第一固定板102还开设有第二通孔111，所述第二导热组件107贯穿所述第二通孔111，且所述第二导热组件107的一侧与所述第二发热器件106贴合。
本申请实施例中，与第一发热器件104类似，PCB板103上设置有第一发热器件104的一面还可以布置有第二发热器件106，第二发热器件106为PCB板103上布置的一个或多个发热器件中的一个，PCB板103具有两个面，可以均布置有发热器件，第一固定板102位于所述 第二发热器件106背向所述PCB板103的一侧，第二发热器件106设置在PCB板103上朝向第一固定板102的面上。与第一通孔105类似，第一固定板102和PCB板103相对设置，且第一固定板102可以在和第二发热器件106相对的位置上开设有第二通孔111，第二导热组件107可以贯穿第二通孔111，并与所述第二发热器件106贴合。
其中，第一导热组件101和第二导热组件107通过柔性连接件108连接，构成一个整体，该柔性管路使得第一导热组件101和第二导热组件107可以沿着垂直于第一固定板102平面的方向上下位移一定的距离，在一些场景中，第一发热器件104和第二发热器件106不在同一个平面上，由于第一导热组件101和第二导热组件107可以沿着垂直于第一固定板102平面的方向上下位移一定的距离，进而可以使得第一导热组件101和第二导热组件107可以紧密地与对应的发热器件良好贴合。应理解，上述柔性连接件108可以是柔性管，或者是柔性管和刚性管(例如金属管)的结合。
具体的，可以参照图3，图3为本申请实施例提供的一种导热组件的结构示意，如图3所示，第一导热组件101和第二导热组件107通过柔性连接件108连接，第一导热组件101和第二导热组件107为水冷头，柔性连接件108可以设置为中空，中间的空仓可以作为液体的流道，此外，散热组件还可以包括：导热管109；所述导热管109与所述第一导热组件101连接，且导热管109与所述第二导热组件107连接，导热管109可以设置为中空，中间的空仓可以作为液体的流道，可选的，导热管109可以为金属管、导热性能较好的塑料管等等。
参照图4，图4为本申请实施例提供的散热组件的结构示意，如图4所示，沿着朝向PCB板103的视线，可以看到第一导热组件101位于第一通孔105内，第二导热组件107位于第二通孔111内。
在一种可能的实现中，所述PCB板103的一侧还设置有第三发热器件，所述第一固定板102朝向所述PCB板103的一侧布置有凸台112，所述第三发热器件朝向所述第一固定板102的一侧与所述凸台112贴合。
可选的，第一固定板102朝向PCB板103的一侧还可以设置有凸台112，对应于PCB板103上的第三发热器件，参照图5，图5为本申请实施例提供的固定板的结构示意，如图5所示，第一固定板102朝向PCB板103的一侧除了开设有第一通孔105、第二通孔111之外，还可以设置有多个凸台112，每个凸台112对应于PCB板103上的其他发热器件(除第一发热器件104和第二发热器件106之外的发热器件)。
本申请实施例中，所述第一固定板102朝向所述PCB板103的一侧还可以设置有凹槽113，所述导热管109与所述凹槽113的内壁贴合。导热管109的管路与第一固定板102可以接触，也可以不接触，取决于该PCB板103需要散热的器件是否功率高到无法自然散热解决，若PCB板103需要散热的器件的功率很高，则导热管109可以与第一固定板102上的凹槽113的内壁贴合，以便可以将该PCB板103上需要散热的器件产生的热量传递至固定板，贴合之处可以但不限于涂有具有一定热接触材料，例如环氧树脂。参照图6，图6为本申请实施例提供的固定板的结构示意，如图6所示，第一固定板102朝向所述PCB板103的一侧可以设置有凹槽113。
本申请实施例中，所述第一导热组件101可以与所述PCB板103浮动连接，以便所述第 一导热组件101的一侧与所述第一发热器件104贴合。
在一种实现中，参照图7，图7为本申请实施例提供的散热组件的结构示意，如图7所示，第一导热组件101可以与第一固定板102进行安装配合，其中第一导热组件101可以直接透过第一固定板102的第一通孔105，与第一发热器件104进行弹簧螺钉和单板托架115的固定和锁紧(单板托架115可以但不限于设置在底壳114上)，使得第一导热组件101可以与所述PCB板103浮动连接，进而使得第一导热组件101可以与所述第一发热器件104贴合。
本申请实施例中，PCB板103上背向第一固定板102的面可以布置有发热器件，通过底壳114上的长凸台112与之接触，接触的界面可以填充导热垫或者导热凝胶；其中，底壳114可以是一块纯金属板，也可以是一整块腔体式水冷板，也可以是和上述第一固定板102以及导热组件相同的散热结构，这里并不限定。
本申请实施例中，为了对第一固定板102上开设的通孔进行密封，可以将所述密封盖110固定于所述第一固定板102背向所述PCB板103的一侧，以便密封所述第一通孔105。具体的，第一固定板102之上可以设置有密封盖110，如图8所示，密封盖110可以锁在导热组件(第一导热组件101或第二导热组件107)附近的局部区域，如图9所示，密封盖110可以锁在导热组件(第一导热组件101和第二导热组件107)附近的局部区域，如图10所示，密封盖110也可以锁在整个第一固定板102的四周外缘，所有的结合处通过密封圈和螺钉进行固定，达成气密的需求，图11为安装后的车载计算装置的示意。
本申请实施例中，第一发热器件104与第一导热组件101贴合，第一导热组件101可以将第一发热器件104上的热量带走。一方面，从导热组件的大小来看，由于第一导热组件101穿透过第一固定件的通孔，第一导热组件101的大小可以适配于通孔的大小设置，相比于现有技术的液冷板，本实施例中的第一导热组件101的尺寸和重量较小，且从厚度方面，由于第一导热组件101穿透过第一固定件的通孔，相比固定板与液冷板分离设置，本实施例中散热组件的厚度较小。
另外需说明的是，以上所描述的装置实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。另外，本申请提供的装置实施例附图中，模块之间的连接关系表示它们之间具有通信连接，具体可以实现为一条或多条通信总线或信号线。
通过以上的实施方式的描述，所属领域的技术人员可以清楚地了解到本申请可借助软件加必需的通用硬件的方式来实现，当然也可以通过专用硬件包括专用集成电路、专用CPU、专用存储器、专用元器件等来实现。一般情况下，凡由计算机程序完成的功能都可以很容易地用相应的硬件来实现，而且，用来实现同一功能的具体硬件结构也可以是多种多样的，例如模拟电路、数字电路或专用电路等。但是，对本申请而言更多情况下软件程序实现是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在可读取的存储介质中， 如计算机的软盘、U盘、移动硬盘、ROM、RAM、磁碟或者光盘等，包括若干指令用以使得一台计算机设备(可以是个人计算机，训练设备，或者网络设备等)执行本申请各个实施例所述的方法。
在上述实施例中，可以全部或部分地通过软件、硬件、固件或者其任意组合来实现。当使用软件实现时，可以全部或部分地以计算机程序产品的形式实现。
所述计算机程序产品包括一个或多个计算机指令。在计算机上加载和执行所述计算机程序指令时，全部或部分地产生按照本申请实施例所述的流程或功能。所述计算机可以是通用计算机、专用计算机、计算机网络、或者其他可编程装置。所述计算机指令可以存储在计算机可读存储介质中，或者从一个计算机可读存储介质向另一计算机可读存储介质传输，例如，所述计算机指令可以从一个网站站点、计算机、训练设备或数据中心通过有线(例如同轴电缆、光纤、数字用户线(DSL))或无线(例如红外、无线、微波等)方式向另一个网站站点、计算机、训练设备或数据中心进行传输。所述计算机可读存储介质可以是计算机能够存储的任何可用介质或者是包含一个或多个可用介质集成的训练设备、数据中心等数据存储设备。所述可用介质可以是磁性介质，(例如，软盘、硬盘、磁带)、光介质(例如，DVD)、或者半导体介质(例如固态硬盘(Solid State Disk，SSD))等。

Claims (9)

  1. 一种散热组件，其特征在于，包括：第一导热组件(101)以及第一固定板(102)；
    所述第一固定板(102)与PCB板(103)固定连接，所述PCB板(103)的一侧设置有第一发热器件(104)，所述第一固定板(102)位于所述第一发热器件(104)背向所述PCB板(103)的一侧；
    所述第一固定板(102)开设有第一通孔(105)，所述第一导热组件(101)贯穿所述第一通孔(105)，且所述第一导热组件(101)的一侧与所述第一发热器件(104)贴合。
  2. 根据权利要求1所述的散热组件，其特征在于，所述PCB板(103)的一侧还设置有第二发热器件(106)，所述散热组件还包括：第二导热组件(107)和柔性连接件(108)；
    所述第一导热组件(101)与所述第二导热组件(107)通过所述柔性连接件(108)连接；
    所述第一固定板(102)还开设有第二通孔(111)，所述第二导热组件(107)贯穿所述第二通孔(111)，且所述第二导热组件(107)的一侧与所述第二发热器件(106)贴合。
  3. 根据权利要求1或2所述的散热组件，其特征在于，所述第一导热组件(101)为水冷头。
  4. 根据权利要求1至3任一所述的散热组件，其特征在于，还包括：导热管(109)；
    所述导热管(109)与所述第一导热组件(101)连接，所述第一固定板(102)朝向所述PCB板(103)的一侧设置有凹槽113，所述导热管(109)与所述凹槽113的内壁贴合。
  5. 根据权利要求4所述的散热组件，其特征在于，所述导热管(109)为金属管。
  6. 根据权利要求1至5任一所述的散热组件，其特征在于，所述PCB板(103)的一侧还设置有第三发热器件，所述第一固定板(102)朝向所述PCB板(103)的一侧布置有凸台112，所述第三发热器件朝向所述第一固定板(102)的一侧与所述凸台112贴合。
  7. 根据权利要求1至6任一所述的散热组件，其特征在于，所述第一导热组件(101)与所述PCB板(103)浮动连接，以便所述第一导热组件(101)的一侧与所述第一发热器件(104)贴合。
  8. 根据权利要求1至7任一所述的散热组件，其特征在于，还包括：密封盖(110)；
    所述密封盖(110)固定于所述第一固定板(102)背向所述PCB板(103)的一侧，以便密封所述第一通孔(105)。
  9. 一种汽车，其特征在于，包括车体，以及设置在所述车体内的如所述权利要求1至8 任一项所述的散热组件。
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