WO2022042102A1 - 一种计算装置及汽车 - Google Patents

一种计算装置及汽车 Download PDF

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Publication number
WO2022042102A1
WO2022042102A1 PCT/CN2021/106157 CN2021106157W WO2022042102A1 WO 2022042102 A1 WO2022042102 A1 WO 2022042102A1 CN 2021106157 W CN2021106157 W CN 2021106157W WO 2022042102 A1 WO2022042102 A1 WO 2022042102A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
computing device
pcb board
target pcb
soc
Prior art date
Application number
PCT/CN2021/106157
Other languages
English (en)
French (fr)
Inventor
项能武
贾晓林
潘顺成
刘品强
尹建强
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21859942.1A priority Critical patent/EP4198679A4/en
Publication of WO2022042102A1 publication Critical patent/WO2022042102A1/zh
Priority to US18/169,888 priority patent/US20230200028A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of hardware structures, and in particular, to a computing device and an automobile.
  • Autonomous driving is the key technology for realizing smart cars and intelligent transportation, and it is also an inevitable trend of future automotive development. From the perspective of industrial development, autonomous driving will become An important engine for the development of many industries in the future will drive the rapid development of intelligent manufacturing and new-generation information technology.
  • the computing device is the brain of the entire automatic driving system. With the continuous improvement of the automatic driving level, the demand for the computing power of the in-vehicle computing device continues to increase, which leads to the increasing power consumption of the devices on the main board 203, and the layout on the main board 203 is increasing. more and more devices.
  • the current vehicle-mounted computing device includes a mainboard 203.
  • all devices including a system-on-chip (SOC)
  • SOC system-on-chip
  • mainboard 203 As the devices to be arranged become more and more As more and more, the required area of the motherboard 203 continues to increase, which leads to an increase in the size and weight of the computing module.
  • SOC system-on-chip
  • This application does not need to develop different system motherboards. It only needs to select the target PCB board with the required SOC, and it can be detachably installed on the heat dissipation component. On the premise that the system motherboard remains unchanged, it is only necessary to replace and set The target PCB board of the SOC of different types or suppliers is sufficient.
  • the present application provides an in-vehicle computing device, comprising: a main board, a heat dissipation component, and a target printed circuit board (PCB) board, where the target PCB board is provided with a system-on-chip SOC and a connection component one side of the motherboard is attached to the heat dissipation assembly; the target PCB board is located on the side of the heat dissipation assembly facing away from the motherboard, and is detachably connected to the heat dissipation assembly through the connection assembly.
  • PCB printed circuit board
  • the mainboard can also be called a system mainboard.
  • the mainboard can be a rectangular circuit board. Capacitors, resistors, inductors, diodes, transistors, SOC or peripheral circuits can be arranged on the mainboard.
  • the SOC originally located on the main board is arranged on another PCB board (referred to as a target PCB board in this embodiment) independent of the main board.
  • the computing device may include
  • the target PCB board 202, the target PCB board 202 and the main board 203 are two independent PCB boards, the target PCB board 202 can be provided with the SOC 205 and the connection component 206, and the target PCB board 202 can pass through the connection component 206 and the computing device.
  • the heat dissipation component 201 is detachably connected. If you need to configure different SOCs in the computing device, you do not need to develop different system motherboards.
  • the main board since a large number of devices need to be arranged on the main board, the main board has a large area. Since the main board is usually a rectangular plate, in the plane where the main board is located, the existing main board occupies a large area. The area is huge.
  • the SOC is arranged on another target PCB board independent of the main board, and the heat dissipation component is arranged between the main board and the target PCB board 202, which is equivalent to arranging a part of the main board in a space perpendicular to the space where the main board is located. In this way, the space required by the computing device on the plane where the motherboard is located is reduced.
  • the projection of the target PCB board 202 along the normal direction of the plane where the main board 203 is located partially or completely overlaps with the region where the main board 203 is located.
  • the projection of the target PCB board along the normal direction of the plane where the motherboard is located is in the area where the motherboard is located.
  • the target PCB board 202 including the SOC 205 is independently set.
  • the layout rule of the target PCB board 202 if the target PCB board 202 is set on the same plane as the main board 203, the plane on which the main board 203 is located On the other hand, the area occupied by the target PCB board 202 and the main board 203 does not change much from the area occupied by the existing main board 203.
  • the projection of the normal direction of the plane where the motherboard 203 is located partially or completely overlaps with the area where the target PCB board 202 is located, then in the plane direction where the motherboard 203 is located, the area occupied by the target PCB board 202 and the motherboard 203 is smaller than the existing
  • the area occupied by the main board 203 is used to arrange the target PCB board 202 by using the dimension in the height direction (the direction perpendicular to the plane on which the main board is located) inside the computing device. Further, the projection of the target PCB board 202 along the normal direction of the plane where the motherboard 203 is located is in the area where the motherboard 203 is located, so that the motherboard 203 occupies the area along the normal direction of the plane where the motherboard 203 is located. area is minimized.
  • the included angle between the plane where the main board is located and the plane where the target PCB board is located is smaller than a preset value.
  • the main board and the target PCB board are arranged close to parallel, which can reduce the space occupation in the direction perpendicular to the main board.
  • the surface of the target PCB on which the SOC is disposed faces the heat dissipation component.
  • the surface of the target PCB on which the SOC is disposed faces the heat dissipation component, so that the heat generated by the SOC can be transferred to the heat dissipation component.
  • a first vapor chamber is provided between the SOC and the heat dissipation component.
  • a first vapor chamber is arranged between the SOC and the heat dissipation component, and the heat emitted by the SOC can be transferred to the first vapor chamber, and then transferred from the first vapor chamber to the heat dissipation component, which is equivalent to The heat dissipation area of the SOC is enlarged by the first vapor chamber.
  • a thermally conductive material is filled between the first vapor chamber and the SOC, wherein the thermally conductive material may be, but is not limited to, thermally conductive silicone grease, thermally conductive gel, thermally conductive pad, and phase-change thermally conductive material etc., or other thermally conductive materials with thermal conductivity close to the above-mentioned materials.
  • a thermally conductive material is filled between the first vapor chamber and the SOC, which can expand the heat dissipation area of the SOC and reduce the contact thermal resistance of the SOC heat dissipation.
  • the in-vehicle computing device may further include: a device casing; the mainboard 203 and/or the heat dissipation component 201 are fixed on the device casing.
  • the target PCB board in this embodiment may be detachably fixed on the heat dissipation component, and as the structural basis for fixing the target PCB board, the heat dissipation component may be fixed on the device casing of the computing device, or the heat dissipation component may be connected to the main board, and the main board Secured to the device housing of the computing device, or both the heat sink assembly and the motherboard are secured to the device housing.
  • a fixing plate is attached to the side of the target PCB that faces away from the heat dissipation component, and the fixing plate is fixed on the device casing.
  • the fixing plate can be used to enhance the strength of the target PCB and ensure that the During the insertion and removal of the target PCB board, the target PCB board is not deformed.
  • a heating device is provided on the side of the mainboard facing away from the heat dissipation assembly; a second temperature equalizing plate is attached to the heating device, and the edge of the second temperature equalizing plate is in contact with all the heat dissipation components. Connect the cooling components described above.
  • the backside devices on the motherboard and the inner surface of the lower casing of the computing device are dissipated by heat-conducting materials, mainly through natural convection heat dissipation between the lower casing and the external environment, and the heat dissipation capacity is limited, so only low-power devices can be arranged.
  • a second temperature equalizing plate is attached to the heating device arranged on the back side of the main board, and the edge of the second temperature equalizing plate is connected to the heat dissipation component, so that the heat generated by the heating device can be reduced. It can be transmitted to the heat dissipation assembly through the second vapor chamber.
  • the heating device can be a capacitor, a resistor, an inductor, a diode, a triode, a chip or a peripheral circuit, and so on.
  • a thermally conductive material is filled between the heating device and the second vapor chamber, wherein the thermally conductive material may be, but not limited to, thermally conductive silicone grease, thermally conductive gel, thermally conductive pad, phase-change thermally conductive materials, etc., or other thermally conductive materials whose thermal conductivity is close to the above-mentioned materials.
  • the heat dissipation component is a liquid cooling plate, and a liquid cooling pipe is provided in an area of the liquid cooling plate facing the SOC.
  • the heat dissipation component is an air-cooled radiator
  • the SOC is located in an air-cooled heat dissipation area of the air-cooled radiator.
  • the heat-dissipating component may use a liquid-cooled plate. Air-cooled radiator.
  • PCB printed circuit board
  • the present application provides a method for assembling an in-vehicle computing device, comprising:
  • the edge area of the second temperature chamber is fixed to the heat dissipation component, and the main board is located between the central area of the second temperature chamber and the heat dissipation component, and the heating device on the other side of the motherboard 203 is connected to the heat dissipation component.
  • the second temperature equalizing plate is attached;
  • the upper cover and the bottom cover are fixed to the heat dissipation assembly to seal the mainboard 203 .
  • the method further includes:
  • the first vapor chamber is installed between the target PCB board and the heat dissipation assembly, so that the first vapor chamber is in contact with the other side of the target PCB board and the heat dissipation assembly.
  • the method further includes:
  • the fixing plate is fixed on the side of the target PCB that faces away from the heat dissipation component.
  • the present application provides a vehicle, including a vehicle body, and the computing device according to any one of the above-mentioned first aspects disposed in the vehicle body.
  • the embodiment of the present application provides an in-vehicle computing device, including: a main board, a heat dissipation component and a target PCB board, the target PCB board is provided with a system-on-chip SOC and a connection component; one side of the main board is connected to the heat dissipation component The target PCB board is located on the side of the heat dissipation assembly facing away from the main board, and is detachably connected to the heat dissipation assembly through the connection assembly.
  • the computing device may include a target PCB board, the target PCB board and the main board are two independent PCB boards, the target PCB board may be provided with an SOC and a connection component, and the target PCB board may pass through the connection component and the computing device.
  • the fixed components in the device can be detachably connected. If you need to configure different SOCs in the computing device, you do not need to develop different system motherboards. You only need to select the target PCB board with the required SOC, and it can be detachably installed on the heat dissipation component. Yes, on the premise that the system motherboard remains unchanged, it is only necessary to replace the target PCB board with SOCs of different types or suppliers.
  • Fig. 1 is the structural representation of a kind of automobile
  • FIG. 2 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 3 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 4 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 5 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 6 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 7a is a schematic exploded diagram of a computing device according to an embodiment of the present application.
  • FIG. 7b is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 8 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 9 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 10 is a schematic exploded diagram of a computing device provided by an embodiment of the present application.
  • FIG. 11 is a schematic exploded diagram of a computing device according to an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of an automobile according to an embodiment of the application.
  • the computing device provided by the present application may be, for example, a vehicle-mounted computing device, a memory, a mobile phone, a server, and the like.
  • the following content is illustrated by taking the computing device as an in-vehicle computing device as an example (the computing device in the following can be considered as an in-vehicle computing device).
  • the in-vehicle computing device can be applied to the automatic driving of smart cars, wherein Smart cars include support for unmanned driving (unmanned driving), assisted driving (driver assistance/ADAS), intelligent driving (intelligent driving), connected driving (connected driving), intelligent network driving (intelligent network driving) and car sharing (car sharing) electric cars or gasoline-powered cars.
  • the in-vehicle computing device is used to control and monitor the driving state of the smart car, including but not limited to the in-vehicle mobile data center (MDC), and the hardware monitor interface (HMI) that realizes the function of the human-computer interaction controller.
  • MDC in-vehicle mobile data center
  • HMI hardware monitor interface
  • IVI In-vehicle infotainment
  • BCM body control module
  • VCU vehicle control unit
  • the in-vehicle computing device may specifically have a chip with computing and processing capabilities, or may be a collection of multiple devices such as processors and memories integrated in a printed circuit board (PCB), where the processor includes but is not limited to the central Processor (central processing unit, CPU), general-purpose processor, digital signal processor (digital signal processing, DSP), application-specific integrated circuit (application-specific integrated circuit, ASIC), field-programmable gate array (field-programmable gate array) , FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, graphics processing unit (GPU), artificial intelligence (AI) chips.
  • a general purpose processor may be a microprocessor or any conventional processor or the like.
  • the in-vehicle computing device 1201 can be installed in the center console or in a suitable position near the liquid-cooling pump of the vehicle, through various types of sensors installed on the vehicle body (such as the millimeter-wave radar 106 , the lidar 105 , etc.). , camera 102, etc.), detect the environment where the car is located, and then feed it back to the built-in chip of the in-vehicle computing device 1201 for real-time reasoning operations, and finally the in-vehicle computing device 1201 issues operation commands to the vehicle control unit (VCU) 104. Control the motor vehicle (braking, decelerating, etc.) through the VCU 104 to realize various levels of automatic driving functions.
  • VCU vehicle control unit
  • the in-vehicle computing device 1201 can also upload data to the back-end cloud data center through the T-BOX (telematics BOX) 103 .
  • the in-vehicle computing device 1201 can transmit with the camera 102 through a multimedia serial link (MSL); with the lidar 105 through an in-vehicle Ethernet link; with the VCU 104 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX 103 through the vehicle Ethernet link.
  • MSL multimedia serial link
  • the lidar 105 through an in-vehicle Ethernet link
  • the VCU 104 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX 103 through the vehicle Ethernet link.
  • controller area network Network controller area network, CAN
  • FIG. 2 is a schematic exploded diagram of a vehicle-mounted computing device provided by an embodiment of the application, wherein the vehicle-mounted computing device may be the vehicle-mounted computing device described in FIG. 1 and related embodiments. It should be understood that, in order to simplify the description, The in-vehicle computing device in the following embodiments may also be referred to as a computing device. As shown in FIG. 2 , the in-vehicle computing device provided in this embodiment of the present application may include:
  • the main board 203, the heat dissipation component 201 and the target PCB board 202, the target PCB board 202 is provided with the SOC 205 and the connection component 206.
  • the main board 203 can also be called a system main board, the main board 203 can be a rectangular circuit board, and the main board 203 can be arranged with capacitors, resistors, inductors, diodes, transistors, SOC or peripheral circuits and so on.
  • all the devices (including the SOC) in the computing device are arranged on one motherboard.
  • the required area of the motherboard continues to increase, which in turn leads to an increase in the size of the computing module. Large, heavy, and for computing devices that require different computing power and different driving levels, different system motherboards need to be developed.
  • the SOC originally located on the main board is arranged on another PCB board (referred to as the target PCB board in this embodiment) independent of the main board.
  • the computing device may Including the target PCB board 202, the target PCB board 202 and the main board 203 are two independent PCB boards, the target PCB board 202 can be provided with the SOC 205 and the connection component 206, and the target PCB board 202 can pass through the connection component 206 and the computing device.
  • the heat dissipation assembly 201 is detachably connected.
  • the heat dissipation component can be used as a detachable and fixed object of the target PCB board, that is, the target PCB board can use the heat dissipation component as a mechanically fixed object, and can be detachably installed on the heat dissipation component during installation, and when the target PCB needs to be replaced , the target PCB board can be removed from the heat sink assembly.
  • connection component 206 may be a protrusion on the target PCB 202 or a structure of other shapes, and the heat dissipation component 201 may be provided with a structure matched with the connection component 206, and the connection component 206 may be detachably fixed
  • the structure matched with the connection component 206 on the heat dissipation component 201 further realizes the detachable connection between the target PCB board and the heat dissipation component 201 .
  • connection component 206 may be a protrusion on the target PCB board 202, the protrusion may have a snap, the heat dissipation component 201 may have a fixed portion corresponding to the protrusion, and the snap on the protrusion during installation
  • the fixing part can be buckled on the heat dissipation component 201, and the buckle on the convex part can be detached from the fixing part on the heat dissipation component 201, so as to realize the detachable connection between the target PCB board 202 and the fixing part.
  • the connection component 206 may also be a wire harness or a flexible circuit board, which is not limited in the present application.
  • the device on the target PCB board can also be configured. and the circuit line of the device on the main board, taking the connecting assembly 206 as the protrusion on the target PCB board 202 in the above-mentioned embodiment as an example, the protrusion can be a protrusion with a cavity, and the cavity can be provided with a circuit
  • the SOC 205 or other devices on the target PCB board 202 can be electrically connected to the devices on the main board 203 through the circuit lines in the cavity.
  • the target PCB board in this embodiment may be detachably fixed on the heat dissipation component, and as the structural basis for fixing the target PCB board, the heat dissipation component may be fixed on the device casing of the computing device, or the heat dissipation component may be connected with the main board. Connected, the main board is fixed to the device housing of the computing device, or the heat sink assembly and the main board are both fixed to the device housing.
  • the computing device may include a device housing
  • the device housing may include a top cover 212 and a bottom cover 213
  • the top cover 212 and the bottom cover 213 are located outside the computing device, and the top cover 212 and the bottom cover 213 are connected to form a hollow area
  • the main board 203 , the heat dissipation component 201 and the target PCB board 202 are located in the hollow area, and the device casing can serve as a structural basis for fixing between the main board 203 , the heat dissipation component 201 and the target PCB board 202 .
  • the main board since a large number of devices need to be arranged on the main board, the main board has a large area.
  • the existing main board occupies a large area in the plane where the main board is located.
  • the SOC is arranged on another target PCB board independent of the main board, and the heat dissipation component is arranged between the main board and the target PCB board 202, which is equivalent to arranging a part of the main board in a space perpendicular to the space where the main board is located. In this way, the space required by the computing device on the plane where the motherboard is located is reduced.
  • the heat dissipation component 201 is located between the main board 203 and the target PCB board 202, and the projection of the target PCB board 202 along the normal direction of the plane where the main board 203 is located is the same as that of the target PCB board 202.
  • the main board 203 is overlapped.
  • the target PCB board 202 including the SOC 205 is independently set.
  • the layout rule of the target PCB board 202 if the target PCB board 202 is set on the same plane as the main board 203, the plane on which the main board 203 is located On the other hand, the area occupied by the target PCB board 202 and the main board 203 does not change much from the area occupied by the existing main board 203.
  • the projection of the normal direction of the plane where the motherboard 203 is located partially or completely overlaps with the area where the target PCB board 202 is located, then in the plane direction where the motherboard 203 is located, the area occupied by the target PCB board 202 and the motherboard 203 is smaller than the existing
  • the area occupied by the main board 203 is used to arrange the target PCB board 202 by using the dimension in the height direction (the direction perpendicular to the plane on which the main board is located) inside the computing device. Further, the projection of the target PCB board 202 along the normal direction of the plane where the motherboard 203 is located is in the area where the motherboard 203 is located, so that the motherboard 203 occupies the area along the normal direction of the plane where the motherboard 203 is located. area is minimized.
  • the included angle between the plane where the main board 203 is located and the plane where the target PCB board 202 is located is smaller than a preset value.
  • the preset value can be an angle within 10 degrees.
  • the angle between the plane where the main board 203 is located and the plane where the target PCB board 202 is located can be set.
  • the space occupation in the direction perpendicular to the main board 203 can be further reduced on the premise of reducing the space occupation in the plane direction of the main board.
  • the heat dissipation component in order to provide heat dissipation for the target PCB board and/or the heating device on the main board, the heat dissipation component may be arranged between the main board and the target PCB board, and the target PCB board and/or the heating device on the main board may be The heat generated by the heat-generating components on the target PCB board and/or the main board is transferred to the heat-dissipating component by being attached to the heat-dissipating component, for example, by direct contact or through a heat-conducting medium.
  • the target PCB 202 of the heat dissipation component 201 on which the SOC 205 is disposed faces the heat dissipation component 201 , so that the heat generated by the SOC 205 can be transferred to the heat dissipation component 201 .
  • the SOC 205 can transfer the generated heat to the heat dissipation component 201 through a heat transfer medium
  • the heat dissipation component 201 can be a liquid cooling plate, and the area of the liquid cooling plate facing the SOC 205 is provided with
  • the liquid cooling pipe for example, the liquid cooling plate may have a water inlet and a water outlet, and form a complete liquid cooling system with the liquid cooling kit on the vehicle, so as to realize heat dissipation of the whole system.
  • the heat dissipation component 201 can also be an air-cooled radiator, the SOC 205 is located in the air-cooled heat dissipation area of the air-cooled radiator, and the SOC 205 can transfer the generated heat to the air-cooled air-cooled radiator of the air-cooled radiator through a heat-conducting medium. heat dissipation area.
  • a first vapor chamber 208 is disposed between the SOC 205 and the heat dissipation component 201, and a thermally conductive material is filled between the first vapor chamber 208 and the SOC 205.
  • the first vapor chamber 208 may be fixed on the target PCB board 202 by screws or other means.
  • the first vapor chamber 208 may be a vapor chamber (vapor chambers, VC) heat sink
  • the thermally conductive material may be, but not limited to, thermally conductive silicone grease, and thermally conductive silicone grease is passed between the heat dissipation component 201 and the SOC 205 Filling can expand the heat dissipation area of SOC 205 and reduce the contact thermal resistance of SOC 205 heat dissipation.
  • one side of the first vapor chamber 208 can be fixed on the target PCB board 202 by screws or other means, and the other side of the first vapor chamber 208 can be floatingly connected to the heat dissipation component 201 by spring screws 209 superior.
  • the SOC 205 may also transfer heat to the heat dissipation component 201 through other intermediate heat conducting medium, which is not limited in the embodiment of the present application.
  • a fixing plate 207 is attached to the surface of the target PCB board 202 facing away from the heat dissipation component 201 .
  • the fixing plate 207 can be used to enhance the strength of the target PCB board 202 to ensure that the target PCB board 202 is not deformed during the insertion and removal of the target PCB board 202 .
  • the fixing plate 207 can be a backplane bracket, and the backplane bracket can be fixed on the side of the target PCB facing away from the heat dissipation component 201 by means of screws or the like.
  • one side of the motherboard 203 can be fixed to the heat dissipation assembly 201. As shown in FIG. 3, one side of the motherboard 203 can be fixed to the heat dissipation assembly 201, and the heating device 211 on one side of the motherboard 203 can be close to the heat dissipation assembly 201, The heat generated by the heating device 211 can be conducted to the heat dissipation component 201 , and the heat dissipation component 201 can take the heat away.
  • a heating device 211 is provided with a heating device 211 on the side of the motherboard 203 facing away from the heat dissipation assembly 201;
  • the edge of the second vapor chamber 210 is connected to the heat dissipation assembly 201 , so that the heat generated by the heat generating device 211 can be transferred to the heat dissipation assembly 201 through the second vapor chamber 210 .
  • the backside devices on the motherboard 203 and the inner surface of the lower casing of the computing device are dissipated by the heat-conducting material, and the heat is mainly dissipated by natural convection between the lower casing and the external environment, and the heat dissipation capacity is limited, so only low power consumption can be arranged.
  • the device operates in a high temperature environment for a long time, and the long-term reliability of the device is low.
  • the heating device 211 arranged on the back side of the main board 203 is attached with the second temperature equalizing plate 210 , and the edge of the second temperature equalizing plate 210 is connected to the heat dissipation component 201 connected, so that the heat generated by the heat-generating device 211 of the heat-generating device 211 can be transferred to the heat-dissipating component 201 through the second temperature equalizing plate 210 .
  • the second temperature equalizing plate 210 can be fixed on the heat dissipation assembly 201 , all the heating devices 211 on the back of the main board 203 are closely attached to the second temperature equalizing plate 210 , and the generated heat is conducted to the second temperature equalizing plate 210 ;
  • the second temperature equalizing plate 210 and the heat dissipation assembly 201 can be fastened by screws or other connection methods.
  • the heat on the second temperature equalizing plate 210 can be transferred to the heat dissipation assembly 201.
  • a thermally conductive material may be filled between the heating device 211 and the heating device 211 and the second temperature equalizing plate 210 .
  • the second vapor chamber 210 may be a cover-like structure with raised portions on the edges.
  • the second vapor chamber 210 may be The raised portion of the heat sink is fixed on the heat dissipation assembly 201 , and the main board 203 is disposed between the heat dissipation assembly 201 and the second temperature equalizing plate 210 .
  • FIG. 2 In more detail, referring to FIG.
  • the main board 203 can be attached to one side of the heat dissipation assembly 201 , while a certain gap is left on the edge side of the heat dissipation assembly 201 , and the edge protrusion of the second temperature equalizing plate 210 can be fixed to the heat dissipation assembly 201 .
  • the edge protrusion of the second temperature equalizing plate 210 can be fixed to the space left by the edge side of the heat dissipation assembly 201 through fixing screws 214 .
  • the side of the second vapor chamber 210 facing the main board 203 is attached to the heating device 211 arranged on the main board 203 (as shown in FIG. 5 ).
  • the top cover 212 and the bottom cover 213 may be fixed to the heat dissipation assembly 201 , wherein a second cover is disposed between the bottom cover 213 and the heat dissipation assembly 201 .
  • a target PCB board 202 is disposed between the temperature equalizing plate 210 and the main board 203 , and the top cover 212 and the heat dissipation component 201 , thereby sealing the internal main board 203 and the target PCB board 202 .
  • the bottom cover 213 can be fixed to the heat dissipation assembly 201
  • FIG. 7 a shows a schematic structural diagram after the bottom cover 213 is fixed to the heat dissipation assembly 201 .
  • the heat dissipation component 201 may use a liquid cooling plate. Lower, the heat dissipation component 201 can use an air-cooled radiator. 7b, wherein the air-cooled heat sink may include a fan module 217 and a fan module 218, and an air-cooled heat dissipation area may be between the fan module 217 and the fan module 218.
  • the main board 203 can be fixed to the liquid cooling plate first, so that the heating device on the front of the main board 203 is close to the back of the liquid cooling plate, and the heat generated by the heating device can be conducted to the liquid cooling plate, and the heat is carried by the liquid circulation. to the outside world.
  • the second temperature equalizing plate can then be fixed to the liquid cooling plate, the heating element on the back of the main board 203 is close to the second heating element, and the heat generated by the heating element on the back of the main board 203 is conducted to the second heating element.
  • the second vapor chamber and the liquid cooling plate can be filled with thermal conductive silicone grease, and at the same time, they are fastened and connected by screws.
  • the heat on the second vapor chamber can be transferred to the liquid cooling plate, and then the liquid cooling plate circulates the liquid.
  • FIG. 5 the schematic diagram of the second temperature equalizing plate and the liquid cooling plate after the assembly is completed can be shown in FIG. 5 .
  • the bottom cover can then be fixed to the liquid cooling plate to seal the internal system mainboard 203 to prevent external dust and water from entering the system mainboard 203.
  • the schematic diagram can be as follows shown in Figure 7a.
  • the SOC mezzanine module (including the target PCB board 202 ) can then be fixed to the liquid-cooling board.
  • the SOC mezzanine module can be connected to the liquid-cooling board through a connecting component, and the assembled vehicle-mounted computing device A schematic diagram can be shown in FIG. 10 .
  • the upper cover can then be fixed to the liquid cooling plate to seal the internal system motherboard 203 to prevent external dust and water from entering the system motherboard 203 .
  • the schematic diagram after assembly can be shown in FIG. 11 .
  • the embodiment of the present application provides an in-vehicle computing device, including: a main board, a heat dissipation component and a target PCB board, the target PCB board is provided with a system-on-chip SOC and a connection component; one side of the main board is connected to the heat dissipation component The target PCB board is located on the side of the heat dissipation assembly facing away from the main board, and is detachably connected to the heat dissipation assembly through the connection assembly.
  • the computing device may include a target PCB board, the target PCB board and the main board are two independent PCB boards, the target PCB board may be provided with an SOC and a connection component, and the target PCB board may pass through the connection component and the computing device.
  • the fixed components in the device can be detachably connected. If you need to configure different SOCs in the in-vehicle computing device, you do not need to develop different system motherboards. You only need to select the target PCB board with the required SOC, and it can be detachably installed on the heat dissipation component. That is, on the premise that the system motherboard remains unchanged, it is only necessary to replace the target PCB board provided with SOCs of different types or suppliers.
  • FIG. 12 is a schematic diagram of an automobile provided by the application.
  • the automobile includes a vehicle body 1200 and an on-board computing device 1201 disposed on the device body.
  • the in-vehicle computing device 1201 may be the in-vehicle computing device described in any of the embodiments described in FIG. 2 to FIG. 11 .
  • the location of the in-vehicle computing device may be located at the front or the body of the vehicle, which is not limited in this application.
  • the embodiments of the present application can also be applied to other types of systems, for example, edge cell devices, servers, and storage devices.
  • edge cell devices for example, edge cell devices, servers, and storage devices.
  • the device embodiments described above are only schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be A physical unit, which can be located in one place or distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.
  • the computer program product includes one or more computer instructions.
  • the computer may be a general purpose computer, special purpose computer, computer network, or other programmable device.
  • the computer instructions may be stored in or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be retrieved from a website, computer, training device, or data Transmission from the center to another website site, computer, training facility or data center via wired (eg coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (eg infrared, wireless, microwave, etc.) means.
  • wired eg coaxial cable, fiber optic, digital subscriber line (DSL)
  • wireless eg infrared, wireless, microwave, etc.
  • the computer-readable storage medium may be any available medium that can be stored by a computer, or a data storage device such as a training device, a data center, or the like that includes an integration of one or more available media.
  • the usable media may be magnetic media (eg, floppy disks, hard disks, magnetic tapes), optical media (eg, DVD), or semiconductor media (eg, Solid State Disk (SSD)), and the like.

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Abstract

本申请公开了一种车载计算装置，包括：主板、散热组件以及目标印制电路板(printed circuit board，PCB)板，所述目标PCB板202上设置有系统级芯片SOC和连接组件；所述主板的一侧与所述散热组件贴合；所述目标PCB板202位于所述散热组件背向所述主板的一侧，并通过所述连接组件与所述散热组件可拆卸连接。本申请提供的车载计算装置可以应用在自动驾驶汽车、智能汽车、网联汽车、新能汽车上，对于不同算力或/和不同驾驶等级计算装置的需求，不需要开发不同的系统主板，只需要针对需要的SOC，选择不同的目标PCB板202，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。

Description

一种计算装置及汽车
本申请要求于2020年08月31日提交中国专利局、申请号为202010899465.0、发明名称为“一种计算装置及汽车”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到硬件结构技术领域，尤其涉及到一种计算装置及汽车。
背景技术
自动驾驶是实现智能汽车和智能交通的关键技术，也是未来汽车发展的必然趋势，从产业发展来看，自动驾驶通过与物联网、云计算、人工智能(artificial intelligence，AI)的融合，将成为未来诸多产业发展的重要引擎，将带动智能制造和新一代信息技术的快速发展。
计算装置是整个自动驾驶系统的大脑，随着自动驾驶等级的不断提升，对车载计算装置算力的需求不断提升，带来主板203上的器件的功耗越来越大，且主板203上布置的器件越来越多。
当前车载的计算装置，包含主板203，在现有的实现中，计算装置中所有的器件(包含系统级芯片(system on chip，SOC))布置在一块主板203上，随着需要布置的器件越来越多，所需的主板203面积不断增大，进而导致计算模块的尺寸增大、重量增加，且对于需要不同算力，不同驾驶等级的计算装置，需要开发不同的系统主板203。
发明内容
本申请不需要开发不同的系统主板，只需要选择设置有需要的SOC的目标PCB板，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。
第一方面，本申请提供了一种车载计算装置，包括：主板、散热组件以及目标印制电路板(printed circuit board，PCB)板，所述目标PCB板上设置有系统级芯片SOC和连接组件；所述主板的一侧与所述散热组件贴合；所述目标PCB板位于所述散热组件背向所述主板的一侧，并通过所述连接组件与所述散热组件可拆卸连接。
主板还可以称之系统主板，主板可以为矩形电路板，主板上可以布置有电容、电阻、电感、二极管、三极管、SOC或外围电路等等。
本实施例中，将原本位于主板上的SOC设置在与主板相独立的另一块PCB板(本实施例中称之为目标PCB板)上，具体的，本申请实施例中，计算装置可以包括目标PCB板202，目标PCB板202与主板203为独立的两块PCB板，目标PCB板202上可以设置有SOC 205和连接组件206，且目标PCB板202可以通过连接组件206和计算装置中的散热组件201可拆卸连接，若需要在计算装置中配置不同的SOC，不需要开发不同的系统主板，只需要选择设置有需要的SOC的目标PCB板，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。
另一方面，在现有的实现中，由于主板上需要布置大量的器件，因此主板的面积很大， 由于主板通常是矩形板状，因此在主板所在的平面内，现有的主板所占据的面积很大。本实施例中，将SOC设置在与主板相独立的另一块目标PCB板上，且将散热组件设置于主板和目标PCB板202之间，相当于将主板的一部分设置于垂直于主板所在的空间内，通过这种方式来减少计算装置在主板所在的平面的所需要的空间占用。
在一种可能的实现中，所述目标PCB板202沿所述主板203所在平面的法线方向的投影与所述主板203所在的区域部分或全部重叠。
在一种可能的实现中，所述目标PCB板的沿所述主板所在平面的法线方向的投影在所述主板所在的区域内。
本申请实施例中独立设置了包括SOC 205的目标PCB板202，在目标PCB板202的布置规则上，若将目标PCB板202设置于和主板203同一个平面上，则在主板203所在的平面上，目标PCB板202和主板203所占的面积和现有的主板203所占的面积变化不大，若将目标PCB板202设置于和主板203设置于不同的平面，且所述主板203沿所述主板203所在平面的法线方向的投影与目标PCB板202所在的区域部分或全部重叠，则在主板203所在的平面方向上，目标PCB板202和主板203所占的面积小于现有的主板203所占的面积，即利用了计算装置内部的高度方向(垂直于主板所在的平面的方向)的尺寸来布置目标PCB板202。更进一步的，所述目标PCB板202沿所述主板203所在平面的法线方向的投影在所述主板203所在的区域内，使得主板203在沿所述主板203所在平面的法线方向占据的区域最小化。在一种可能的实现中，所述主板所在的平面与所述目标PCB板所在的平面之间的夹角小于预设值。主板与所述目标PCB板接近于平行设置，可以降低沿与主板垂直方向的空间占用。
在一种可能的实现中，所述目标PCB板上设置有所述SOC的一面朝向所述散热组件。本实施例中，目标PCB板上设置有所述SOC的一面朝向所述散热组件，使得所述SOC产生的热量可传递至所述散热组件。
在一种可能的实现中，所述SOC与所述散热组件之间设置有第一均温板。本申请实施例中，SOC与所述散热组件之间设置有第一均温板，SOC发出的热量可以传递至第一均温板，进而由第一均温板传递至散热组件上，相当于通过第一均温板扩大了SOC的散热面积。
在一种可能的实现中，所述第一均温板与所述SOC之间填充有导热材料，其中，导热材料可以但不限于为导热硅脂、导热凝胶、导热垫、相变导热材料等，或者其他导热系数接近于上述材料的导热材料。第一均温板与所述SOC之间填充有导热材料，可以扩大SOC的散热面积，减少SOC散热的接触热阻。
在一种可能的实现中，车载计算装置还可以包括：装置外壳；所述主板203和/或所述散热组件201固定在所述装置外壳上。本实施例中的目标PCB板可以可拆卸的固定在散热组件上，而作为目标PCB板固定的结构基础，散热组件可以固定在计算设备的装置外壳上，或者，散热组件可以与主板连接，主板固定在计算设备的装置外壳上，或者，散热组件和主板都固定在装置外壳上。
在一种可能的实现中，所述目标PCB板背向所述散热组件的一面贴合有固定板，所述固定板固定在所述装置外壳上固定板可以用来增强目标PCB板强度，保证目标PCB板的插拔过程中，目标PCB板不变形。
在一种可能的实现中，所述主板背向所述散热组件的一侧设置有发热器件；所述发热器件上贴合有第二均温板，所述第二均温板的边缘与所述散热组件连接。在现有的实现中，主板上的背面器件与计算装置下壳体内表面通过导热材料贴壳散热，主要通过下壳体与外部环境自然对流散热,散热能力有限，因此只能布局低功耗器件，同时器件长期处于高温环境下运行，器件长期可靠性寿命低。本实施例中，在主板背侧上排布的发热器件上贴合有第二均温板，且将第二均温板的边缘与所述散热组件连接，以使所述发热器件产生的热量可以通过所述第二均温板传递至所述散热组件。发热器件可以为电容、电阻、电感、二极管、三极管、芯片或外围电路等等。
在一种可能的实现中，所述发热器件与所述第二均温板之间填充有导热材料，其中，导热材料可以但不限于为导热硅脂、导热凝胶、导热垫、相变导热材料等，或者其他导热系数接近于上述材料的导热材料。
在一种可能的实现中，所述散热组件为液冷板，所述液冷板上朝向所述SOC的区域设置有液冷管。
在一种可能的实现中，所述散热组件为风冷散热器，所述SOC位于所述风冷散热器的风冷散热区域内。
本申请实施例中，若主板和目标PCB板上的发热器件的功耗较高，散热组件可以采用液冷板，若主板和目标PCB板上的发热器件的功耗较低，散热组件可以采用风冷散热器。
主板、散热组件以及目标印制电路板(printed circuit board，PCB)板，所述目标PCB板上设置有系统级芯片SOC和连接组件；所述主板的一侧与所述散热组件贴合；所述目标PCB板位于所述散热组件背向所述主板的一侧，并通过所述连接组件与所述散热组件可拆卸连接。
第二方面，本申请提供了一种车载计算装置的装配方法，包括：
将主板203的一侧安装在散热组件的一侧；
将第二均温板的边缘区域固定到散热组件上，且所述主板位于所述第二均温板的中央区域和所述散热组件之间，且所述主板203另一侧的发热器件与所述第二均温板贴和；
将目标PCB板通过连接组件固定到散热组件的另一侧；
将上盖和底盖固定到散热组件上，以密封所述主板203。
在一种可能的实现中，所述方法还包括：
将第一均温板安装在目标PCB板和散热组件之间，以使得第一均温板与目标PCB板和散热组件的另一侧贴和。
在一种可能的实现中，所述方法还包括：
将固定板固定在所述目标PCB板背向所述散热组件的一面。
第三方面，本申请提供了一种汽车，包括车体，以及设置在所述车体内的如上述第一方面任一项所述的计算装置。
本申请实施例提供了一种车载计算装置，包括：主板、散热组件以及目标PCB板，所 述目标PCB板上设置有系统级芯片SOC和连接组件；所述主板的一侧与所述散热组件贴合；所述目标PCB板位于所述散热组件背向所述主板的一侧，并通过所述连接组件与所述散热组件可拆卸连接。本申请实施例中，计算装置可以包括目标PCB板，目标PCB板与主板为独立的两块PCB板，目标PCB板上可以设置有SOC和连接组件，且目标PCB板可以通过连接组件和计算装置中的固定组件可拆卸连接，若需要在计算装置中配置不同的SOC，不需要开发不同的系统主板，只需要选择设置有需要的SOC的目标PCB板，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。
附图说明
图1为一种汽车的结构示意；
图2为本申请实施例提供的一种计算装置的爆炸图示意；
图3为本申请实施例提供的一种计算装置的爆炸图示意；
图4为本申请实施例提供的一种计算装置的爆炸图示意；
图5为本申请实施例提供的一种计算装置的爆炸图示意；
图6为本申请实施例提供的一种计算装置的爆炸图示意；
图7a为本申请实施例提供的一种计算装置的爆炸图示意；
图7b为本申请实施例提供的一种计算装置的爆炸图示意；
图8为本申请实施例提供的一种计算装置的爆炸图示意；
图9为本申请实施例提供的一种计算装置的爆炸图示意；
图10为本申请实施例提供的一种计算装置的爆炸图示意；
图11为本申请实施例提供的一种计算装置的爆炸图示意；
图12为本申请实施例提供的一种汽车的结构示意。
具体实施方式
下面结合本发明实施例中的附图对本发明实施例进行描述。本发明的实施方式部分使用的术语仅用于对本发明的具体实施例进行解释，而非旨在限定本发明。
下面结合附图，对本申请的实施例进行描述。本领域普通技术人员可知，随着技术的发展和新场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的术语在适当情况下可以互换，这仅仅是描述本申请的实施例中对相同属性的对象在描述时所采用的区分方式。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，以便包含一系列单元的过程、方法、系统、产品或设备不必限于那些单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它单元。
首先，介绍本申请提供的计算装置的应用场景，本申请提供的计算装置可以如车载计算装置、存储器、手机和服务器等。为便于描述，以下内容以计算装置为车载计算装置为例进行说明(后文中的计算装置可以认为是车载计算装置)，车载计算装置可以应用于智能汽车的自动驾驶(automated driving)中，其中，智能汽车包括支持无人驾驶(unmanned driving)、 辅助驾驶(driver assistance/ADAS)、智能驾驶(intelligent driving)、网联驾驶(connected driving)、智能网联驾驶(intelligent network driving)和汽车共享(car sharing)的电动汽车或者汽油驱动的汽车。车载计算装置用于对智能汽车进行行驶状态控制和状态监控，包括但不限于车载移动数据中心(mobile data center，MDC)、实现人机交互控制器功能的硬件监视器(hardware monitor interface，HMI)、车载娱乐(in-vehicle infotainment，IVI)控制器，车身控制器(body control module，BCM)、整车控制器(vehicle control unit,VCU)。车载计算装置具体可以具有计算和处理能力的芯片，也可以是集成在印制电路板(printed circuit board，PCB)中处理器、存储器等多个器件的集合，其中，处理器包括但不限于中央处理器(central processing unit，CPU)，通用处理器、数字信号处理器(digital signal processing，DSP)、专用集成电路(application-specific integrated circuit，ASIC)、现场可编程门阵列(field-programmable gate array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件、图形处理器单元(graphics processing unit，GPU)、人工智能(artificial intelligence，AI)芯片。通用处理器可以是微处理器或者是任何常规的处理器等。
示例性的，如图1所示，车载计算装置1201可以安装在中控台或靠近整车液冷泵等合适位置，通过安装在车身上的各类传感器(例如毫米波雷达106、激光雷达105、摄像头102等等)，探测汽车所处环境，然后反馈给车载计算装置1201内置的芯片等进行实时推理运算，最后车载计算装置1201下发操作命令给整车控制器(vehicle control unit，VCU)104，通过VCU104控制机动车辆(刹车、减速等)，实现各种级别的自动驾驶功能。车载计算装置1201还可通过T-BOX(telematics BOX)103将数据上传到后端的云数据中心。可选的，车载计算装置1201可以与摄像头102之间通过多媒体串行链路(multimedia serial link，MSL)传输；与激光雷达105之间通过车载以太链路传输；与VCU104之间通过控制器局域网络(controller area network，CAN)总线传输；与毫米波雷达106之间通过CAN总线传输；与T-BOX103之间通过车载以太链路传输。
参照图2，图2为本申请实施例提供的一种车载计算装置的爆炸图示意，其中，车载计算装置可以为图1以及相关实施例中描述的车载计算装置，应理解，为了简化描述，下述实施例中的车载计算装置也可以称之为计算装置，如图2示出的那样，本申请实施例提供的车载计算装置可以包括：
主板203、散热组件201以及目标PCB板202，所述目标PCB板202上设置有SOC 205和连接组件206。
本申请实施例中，主板203还可以称之系统主板，主板203可以为矩形电路板，主板203上可以布置有电容、电阻、电感、二极管、三极管、SOC或外围电路等等。在现有的实现中，计算装置中所有的器件(包含SOC)布置在一块主板上，随着需要布置的器件越来越多，所需的主板面积不断增大，进而导致计算模块的尺寸增大、重量增加，且对于需要不同算力，不同驾驶等级的计算装置，需要开发不同的系统主板。
本申请实施例中，将原本位于主板上的SOC设置在与主板相独立的另一块PCB板(本实施例中称之为目标PCB板)上，具体的，本申请实施例中，计算装置可以包括目标PCB 板202，目标PCB板202与主板203为独立的两块PCB板，目标PCB板202上可以设置有SOC205和连接组件206，且目标PCB板202可以通过连接组件206和计算装置中的散热组件201可拆卸连接。
本实施例中，散热组件可以作为目标PCB板的可拆卸固定的对象，即目标PCB板可以将散热组件作为机械固定的对象，在安装时可拆卸的安装在散热组件上，在需要更换目标PCB时，可以将目标PCB板从散热组件上拆卸下来。
接下来描述所述目标PCB板202如何与所述散热组件201通过所述连接组件206进行可拆卸连接。
本实施例中，连接组件206可以为目标PCB板202上的一个凸起或者其他形状的结构，在散热组件201上可以设置有与连接组件206相配合的结构，连接组件206可以可拆卸的固定在散热组件201上与连接组件206相配合的结构，进而实现目标PCB板与散热组件201的可拆卸连接。
例如，连接组件206可以为目标PCB板202上的凸起部，凸起部上可以具有卡扣，散热组件201上可以具有与凸起部对应的固定部，安装时凸起部上的卡扣可以扣接在散热组件201上的固定部，凸起部上的卡扣可以从散热组件201上的固定部上拆卸下来，以实现目标PCB板202和固定部之间的可拆卸连接。此外，连接组件206还可以为线束或者柔性线路板等，本申请并不限定。
应理解，在安装时除了在机械连接上需要将目标PCB板与散热组件进行连接，为了实现目标PCB板上的器件与主板上的器件之间的信号传递，还可以配置目标PCB板上的器件和主板上的器件的电路线，以上述实施例中连接组件206为目标PCB板202上的凸起部为例，上述凸起部可以为具有空腔的凸起，空腔中可以设置有电路线，目标PCB板202上的SOC 205或者其他器件可以通过空腔中的电路线与主板203上的器件电连接。
本申请实施例中，若需要在计算装置中配置不同的SOC，不需要开发不同的系统主板，只需要选择设置有需要的SOC的目标PCB板，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。
应理解，本实施例中的目标PCB板可以可拆卸的固定在散热组件上，而作为目标PCB板固定的结构基础，散热组件可以固定在计算设备的装置外壳上，或者，散热组件可以与主板连接，主板固定在计算设备的装置外壳上，或者，散热组件和主板都固定在装置外壳上。
本实施例中，计算装置可以包括装置外壳，装置外壳可以包括顶盖212和底盖213，顶盖212和底盖213位于计算装置的外侧，顶盖212和底盖213连接，形成中空区域，主板203、散热组件201以及目标PCB板202位于中空区域中，装置外壳可以作为主板203、散热组件201以及目标PCB板202之间固定的结构基础。在现有的实现中，由于主板上需要布置大量的器件，因此主板的面积很大，由于主板通常是矩形板状，因此在主板所在的平面内，现有的主板所占据的面积很大。本实施例中，将SOC设置在与主板相独立的另一块目标PCB板上，且将散热组件设置于主板和目标PCB板202之间，相当于将主板的一部分设置于垂直于主板所在的空间内，通过这种方式来减少计算装置在主板所在的平面的所需要的空间占用。
在一种可能的实现中，所述散热组件201位于所述主板203和所述目标PCB板202之间，且所述目标PCB板202沿所述主板203所在平面的法线方向的投影与所述主板203重叠。
本申请实施例中独立设置了包括SOC 205的目标PCB板202，在目标PCB板202的布置规则上，若将目标PCB板202设置于和主板203同一个平面上，则在主板203所在的平面上，目标PCB板202和主板203所占的面积和现有的主板203所占的面积变化不大，若将目标PCB板202设置于和主板203设置于不同的平面，且所述主板203沿所述主板203所在平面的法线方向的投影与目标PCB板202所在的区域部分或全部重叠，则在主板203所在的平面方向上，目标PCB板202和主板203所占的面积小于现有的主板203所占的面积，即利用了计算装置内部的高度方向(垂直于主板所在的平面的方向)的尺寸来布置目标PCB板202。更进一步的，所述目标PCB板202沿所述主板203所在平面的法线方向的投影在所述主板203所在的区域内，使得主板203在沿所述主板203所在平面的法线方向占据的区域最小化。
在一种实现中，所述主板203所在的平面与所述目标PCB板202所在的平面之间的夹角小于预设值。预设值可以为10度以内的角度，本实施例为了尽量少的占用计算装置内部高度方向的尺寸，可以将主板203所在的平面与所述目标PCB板202所在的平面之间的夹角设置为接近0，即将主板203与所述目标PCB板202进行平行或接近于平行的设置，可以在降低了主板所在平面方向的空间占用的前提下，进一步降低沿与主板203垂直方向的空间占用。
此外，本申请实施例中，为了给目标PCB板和/或主板上的发热器件提供散热，可以将散热组件设置在主板和目标PCB板之间，目标PCB板和/或主板上的发热器件可以贴合在散热组件上，例如直接接触或者通过导热介质将目标PCB板和/或主板上的发热器件产生的热量传递到散热组件上。
在一种实现中，散热组件201所述目标PCB板202上设置有所述SOC 205的一面朝向所述散热组件201，以使所述SOC 205产生的热量可传递至所述散热组件201。
在一种可能的实现中，SOC 205可以通过导热介质将产生的热量传递至所述散热组件201，散热组件201可以为液冷板，所述液冷板上朝向所述SOC 205的区域设置有液冷管，示例性的，液冷板可以具有一个进水口和一个出水口，并且和车上的液冷套件等组成一个完整的液冷系统，以实现整个系统的散热。所述散热组件201还可以为风冷散热器，所述SOC 205位于所述风冷散热器的风冷散热区域内，SOC 205可以通过导热介质将产生的热量传递至风冷散热器的风冷散热区域。
在一种可能的实现中，所述SOC 205与所述散热组件201之间设置有第一均温板208，所述第一均温板208与所述SOC 205之间填充有导热材料。第一均温板208可以通过螺钉或者其他方式固定在目标PCB板202上。本申请实施例中，第一均温板208可以为蒸汽腔(vapor chambers，VC)均热散热器，导热材料可以但不限于为导热硅脂，散热组件201与SOC 205之间通过导热硅脂填充，可以扩大SOC 205的散热面积，减少SOC 205散热的接触热阻。
在一种实现中，第一均温板208的一侧可以通过螺钉或者其他方式固定在目标PCB板202上，第一均温板208的另一侧可以通过弹簧螺钉209浮动连接在散热组件201上。
应理解，所述SOC 205还可以通过其他中间导热介质将热量传递至散热组件201，本申请实施例并不限定。
在一种可能的实现中，所述目标PCB板202背向所述散热组件201的一面贴合有固定板207。固定板207可以用来增强目标PCB板202强度，保证目标PCB板202的插拔过程中，目标PCB板202不变形。参照图2，固定板207可以为一个背板支架，背板支架可以通过螺钉等方式固定在目标PCB上背向散热组件201的一面。
在一种实现中，主板203的一面可以固定至散热组件201，如图3所示，主板203的一面可以固定至散热组件201，主板203的一面上的发热器件211可以紧贴散热组件201，发热器件211产生的热量可以传导到散热组件201上，并由散热组件201将热量带走。
在一种可能的实现中，所述主板203背向所述散热组件201的一侧设置有发热器件211发热器件211；所述发热器件211发热器件211上贴合有第二均温板210，所述第二均温板210的边缘与所述散热组件201连接，以使所述发热器件211发热器件211产生的热量可以通过所述第二均温板210传递至所述散热组件201。
在现有的实现中，主板203上的背面器件与计算装置下壳体内表面通过导热材料贴壳散热，主要通过下壳体与外部环境自然对流散热,散热能力有限，因此只能布局低功耗器件，同时器件长期处于高温环境下运行，器件长期可靠性寿命低。本实施例中，在主板203背侧上排布的发热器件211发热器件211发热器件211上贴合有第二均温板210，且将第二均温板210的边缘与所述散热组件201连接，以使所述发热器件211发热器件211发热器件211产生的热量可以通过所述第二均温板210传递至所述散热组件201。本申请实施例中，可以将第二均温板210固定到散热组件201上，主板203背面的所有发热器件211紧贴第二均温板210，产生的热量传导到第二均温板210上；第二均温板210与散热组件201之间可以通过螺钉或其他连接方式紧固连接，通过上述方式，第二均温板210上面的热量可以传递到散热组件201上。在一种可选的实现中，所述发热器件211发热器件211发热器件211与所述第二均温板210之间可以填充有导热材料。
示例性的，参照图2，第二均温板210可以为边缘具有凸起部的类盖状结构，在将第二均温板210安装至散热组件201时，可以将第二均温板210的凸起部固定在散热组件201上，同时主板203设置在散热组件201和第二均温板210之间。更细节的，参照图4，主板203可以贴合在散热组件201的一面，同时散热组件201的边缘侧留有一定的空隙，第二均温板210的边缘凸起可以固定至散热组件201的边缘侧所留的空隙处，例如可以通过固定螺钉214将第二均温板210的边缘凸起固定至散热组件201的边缘侧所留的空隙处。固定之后，第二均温板210朝向主板203的一面会与主板203上布置的发热器件211贴合(如图5中示出的那样)。
此外，为了防止外部的灰尘和水进入主板203以及目标PCB板202内，可以将顶盖212和底盖213固定到散热组件201上，其中，底盖213和散热组件201之间设置有第二均温板210和主板203，顶盖212和散热组件201之间设置有目标PCB板202，进而起到密封内部主板203以及目标PCB板202的作用。示例性的，可以参照图6，可以将底盖213固定至散热组件201上，图7a示出了将底盖213固定至散热组件201之后的结构示意。
本申请实施例中，若主板203和目标PCB板202上的发热器件211的功耗较高，散热组件201可以采用液冷板，若主板203和目标PCB板202上的发热器件211的功耗较低，散热组件201可以采用风冷散热器。示例性的，可以参照图7b，其中，风冷散热器可以包 括风扇模块217和风扇模块218，风扇模块217和风扇模块218之间可以为风冷散热区域。
接下来以散热组件为液冷板为例介绍一种车载计算装置的装配流程的示意。
参照图3，首先可以将主板203固定到液冷板上，以使得主板203正面的发热器件紧贴液冷板背面，发热器件产生的热量可以传导到液冷板上，通过液体循环把热量带至外界。
参照图4，之后可以将第二均温板固定到液冷板上，主板203背面的发热器件紧贴第二均温板，主板203背面的发热器件产生的热量传导到第二均温板上，第二均温板与液冷板之间可以填充导热硅脂，同时通过螺钉紧固连接，第二均温板上面的热量可以传递到液冷板上，然后液冷板通过液体循环把热量带至外界，第二均温板与液冷板完成装配后的示意图可以如图5所示。
参照图6，之后可以将底盖固定到液冷板上，起到密封内部系统主板203的作用，防止外部的灰尘和水进入系统主板203内，底盖与液冷板装配完成后示意图可以如图7a所示。
参照图8，之后可以将SOC扣卡模组(包括目标PCB板202)固定到液冷板上，具体的，SOC扣卡模组可以通过连接组件与液冷板连接，装配后的车载计算装置示意图可以如图10所示。
参照图11，之后可以将上盖固定到液冷板上，起到密封内部系统主板203的作用，防止外部的灰尘和水进入系统主板203内，装配后的示意可以如图11所示。
本申请实施例提供了一种车载计算装置，包括：主板、散热组件以及目标PCB板，所述目标PCB板上设置有系统级芯片SOC和连接组件；所述主板的一侧与所述散热组件贴合；所述目标PCB板位于所述散热组件背向所述主板的一侧，并通过所述连接组件与所述散热组件可拆卸连接。本申请实施例中，计算装置可以包括目标PCB板，目标PCB板与主板为独立的两块PCB板，目标PCB板上可以设置有SOC和连接组件，且目标PCB板可以通过连接组件和计算装置中的固定组件可拆卸连接，若需要在车载计算装置中配置不同的SOC，不需要开发不同的系统主板，只需要选择设置有需要的SOC的目标PCB板，并可拆卸的安装在散热组件上即可，在保证系统主板不变的前提下，只需要更换设置有不同类型或供应商的SOC的目标PCB板即可。
图12为本申请提供的一种汽车的示意图，如图所示，该汽车包括车体1200，以及设置在设备本体的车载计算装置1201。该车载计算装置1201可以为上述图2至图11描述的任一实施例描述的车载计算装置。车载计算装置的位置可以位于汽车的车头或者车身，本申请并不限定。
作为一种可能的实施例，本申请实施例除了应用在图11所示的汽车外，还可以应用于其他类型的系统中，例如，边缘小站设备、服务器、存储设备。在具体实施时，可以参考上述实施例中图2至图11提及的计算设备的结构特征。
另外需说明的是，以上所描述的装置实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以 不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。另外，本申请提供的装置实施例附图中，模块之间的连接关系表示它们之间具有通信连接，具体可以实现为一条或多条通信总线或信号线。
通过以上的实施方式的描述，所属领域的技术人员可以清楚地了解到本申请可借助软件加必需的通用硬件的方式来实现，当然也可以通过专用硬件包括专用集成电路、专用CPU、专用存储器、专用元器件等来实现。一般情况下，凡由计算机程序完成的功能都可以很容易地用相应的硬件来实现，而且，用来实现同一功能的具体硬件结构也可以是多种多样的，例如模拟电路、数字电路或专用电路等。但是，对本申请而言更多情况下软件程序实现是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在可读取的存储介质中，如计算机的软盘、U盘、移动硬盘、ROM、RAM、磁碟或者光盘等，包括若干指令用以使得一台计算机设备(可以是个人计算机，训练设备，或者网络设备等)执行本申请各个实施例所述的方法。
在上述实施例中，可以全部或部分地通过软件、硬件、固件或者其任意组合来实现。当使用软件实现时，可以全部或部分地以计算机程序产品的形式实现。
所述计算机程序产品包括一个或多个计算机指令。在计算机上加载和执行所述计算机程序指令时，全部或部分地产生按照本申请实施例所述的流程或功能。所述计算机可以是通用计算机、专用计算机、计算机网络、或者其他可编程装置。所述计算机指令可以存储在计算机可读存储介质中，或者从一个计算机可读存储介质向另一计算机可读存储介质传输，例如，所述计算机指令可以从一个网站站点、计算机、训练设备或数据中心通过有线(例如同轴电缆、光纤、数字用户线(DSL))或无线(例如红外、无线、微波等)方式向另一个网站站点、计算机、训练设备或数据中心进行传输。所述计算机可读存储介质可以是计算机能够存储的任何可用介质或者是包含一个或多个可用介质集成的训练设备、数据中心等数据存储设备。所述可用介质可以是磁性介质，(例如，软盘、硬盘、磁带)、光介质(例如，DVD)、或者半导体介质(例如固态硬盘(Solid State Disk，SSD))等。

Claims (14)

  1. 一种车载计算装置(1201)，其特征在于，包括：主板(203)、散热组件(201)以及目标PCB板(202)，所述目标PCB板(202)上设置有系统级芯片SOC(205)和连接组件(206)；
    所述主板(203)的一侧固定在所述散热组件(201)上；
    所述目标PCB板(202)位于所述散热组件(201)背向所述主板(203)的一侧，并通过所述连接组件(206)与所述散热组件(201)可拆卸连接。
  2. 根据权利要求1所述的车载计算装置(1201)，其特征在于，所述目标PCB板(202)沿所述主板(203)所在平面的法线方向的投影与所述主板(203)所在的区域部分或全部重叠。
  3. 根据权利要求2所述的车载计算装置(1201)，其特征在于，所述目标PCB板(202)沿所述主板(203)所在平面的法线方向的投影在所述主板(203)所在的区域内。
  4. 根据权利要求1至3任一所述的车载计算装置(1201)，其特征在于，所述主板(203)所在的平面与所述目标PCB板(202)所在的平面之间的夹角小于预设值。
  5. 根据权利要求1至4任一所述的车载计算装置(1201)，其特征在于，所述目标PCB板(202)上设置有所述SOC(205)的一面朝向所述散热组件(201)。
  6. 根据权利要求5所述的车载计算装置(1201)，其特征在于，所述SOC(205)与所述散热组件(201)之间设置有第一均温板(208)，所述SOC(205)与所述第一均温板(208)贴合。
  7. 根据权利要求6所述的车载计算装置(1201)，其特征在于，所述第一均温板(208)与所述SOC(205)之间填充有导热材料。
  8. 根据权利要求2至7任一所述的车载计算装置(1201)，其特征在于，还包括：装置外壳；
    所述主板(203)和/或所述散热组件(201)固定在所述装置外壳上。
  9. 根据权利要求8所述的车载计算装置(1201)，其特征在于，所述目标PCB板(202)背向所述散热组件(201)的一面贴合有固定板(207)，所述固定板(207)固定在所述装置外壳上。
  10. 根据权利要求5至9任一所述的车载计算装置(1201)，其特征在于，所述主板(203) 背向所述散热组件(201)的一侧设置有发热器件(211)；所述发热器件(211)上贴合有第二均温板(210)，所述第二均温板(210)与所述散热组件(201)连接。
  11. 根据权利要求10所述的车载计算装置(1201)，其特征在于，所述发热器件(211)与所述第二均温板((210))之间填充有导热材料。
  12. 根据权利要求1至11任一所述的车载计算装置(1201)，其特征在于，所述散热组件(201)为液冷板，所述液冷板上朝向所述SOC的区域设置有液冷管。
  13. 根据权利要求1至11任一所述的车载计算装置(1201)，其特征在于，所述散热组件(201)为风冷散热器，所述SOC位于所述风冷散热器的风冷散热区域内。
  14. 一种汽车，其特征在于，包括车体，以及设置在所述车体内的如所述权利要求1至13任一项所述的车载计算装置(1201)。
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