WO2022042092A1 - 一种散热组件及汽车 - Google Patents

一种散热组件及汽车 Download PDF

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Publication number
WO2022042092A1
WO2022042092A1 PCT/CN2021/105891 CN2021105891W WO2022042092A1 WO 2022042092 A1 WO2022042092 A1 WO 2022042092A1 CN 2021105891 W CN2021105891 W CN 2021105891W WO 2022042092 A1 WO2022042092 A1 WO 2022042092A1
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WO
WIPO (PCT)
Prior art keywords
plate
temperature equalizing
cold plate
heat
heat dissipation
Prior art date
Application number
PCT/CN2021/105891
Other languages
English (en)
French (fr)
Inventor
彭耀锋
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21859932.2A priority Critical patent/EP4199669A4/en
Priority to KR1020237010896A priority patent/KR20230056783A/ko
Priority to CN202190000672.6U priority patent/CN221178222U/zh
Publication of WO2022042092A1 publication Critical patent/WO2022042092A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of hardware structures, and in particular, to a heat dissipation component and an automobile.
  • a printed circuit board (PCB) board also called an AI gusset
  • AI artificial intelligence
  • a connector through a connector.
  • an AI sub-board has a certain amount of computing power.
  • Customers can install as many AI boards as they need, whether they need data reasoning or data analysis, which can be flexibly configured.
  • the cold plate in order to dissipate heat from the heat-generating components on the main board, the cold plate can be placed between the main board and the gusset plate, and the main heating components of the main board and the gusset board are attached to the cold plate for heat dissipation, and the heating components can pass through the cold plate.
  • Heat dissipation solves the problem of difficult heat dissipation of components between the gusset and the motherboard.
  • the thickness of the cold board is limited and the heat dissipation capacity is poor, making it difficult to support the heat dissipation of the main chip with high power consumption.
  • Capacitors and inductors need to pass through the cold plate, and the flow channels inside the cold plate will be broken and fragmented, resulting in a decrease in the cooling capacity of the cold plate.
  • the present application provides a heat dissipation assembly, comprising: a cold plate, a temperature equalizing plate, and a heat conduction assembly; one side of the temperature equalizing plate is attached to a heating device on a main board; the temperature equalizing plate faces away from all One side of the main board is provided with the cold plate; a PCB board is fixed between the temperature equalizing plate and the cold plate, a connector is fixed on the PCB board, and one end of the connector is connected to the PCB board connection, the connector passes through the temperature chamber, and the other end of the connector extends toward the main board and is fixed on the main board; the cold plate and the temperature chamber pass through the The thermally conductive assembly is connected so that the heat generated by the heat generating device is transferred to the cold plate through the vapor chamber and the thermally conductive assembly.
  • the temperature equalizing plate may be a thin copper plate with good thermal conductivity, a thin aluminum plate for welding heat pipes, a thin flat plate heat pipe, or a graphene sheet, etc., which is not limited in this application.
  • the heating device can be a device such as a SOC, a local area network switch LAN SW or a microcontroller unit.
  • the cold plate may be a structure with heat conduction and heat dissipation functions.
  • the cold plate is a metal plate, for example, the cold plate is an aluminum alloy material or a steel plate.
  • the cold plate can also be made of other thermally conductive materials, such as ceramic plates or plastics with thermal conductivity.
  • the cold plate may include pipes, and the pipes may be filled with liquid, and then the heat may be taken away by the flow of the liquid, and the liquid may be water or other refrigerants.
  • a PCB board with AI chips arranged on the main board may be fixed. Between the PCB board with AI chip and the main board, however, on the one hand, the PCB board with AI chip is connected to the main board through the connector, the connector will affect the structure of the cold plate, and the PCB board with AI chip is arranged with the main board The distance between them is very small, which limits the thickness of the cold plate, making the heat dissipation less efficient.
  • the cold plate is arranged on the side of the PCB that faces away from the main board, and the connector will only pass through the temperature equalizing plate between the main board and the PCB, but not through the cold plate.
  • the metal conducts heat, and there is no flow channel inside, so there is no problem that the heat dissipation capacity is significantly reduced due to the interruption of the flow channel, thereby improving the heat dissipation performance of the cold plate.
  • one end of the heat-conducting component is fixed to the cold plate, and the other end of the heat-conducting component extends toward the vapor chamber and is connected to the vapor chamber.
  • the central area of the temperature equalizing plate is attached to the heating device on the mainboard, and the edge area of the temperature equalizing plate extends toward the mainboard and is fixed on the mainboard.
  • the vapor chamber has a "cover-like" structure, in which the central area of the vapor chamber bulges away from the host to form a hollow area. The area is fixed to the motherboard, which in turn allows the heat from the motherboard to be transferred to the vapor chamber. It should be understood that the above-mentioned "central area” and “edge area” are relative position expressions, not absolute position definitions, that is, the central area of the vapor chamber is closer to the center of the vapor chamber than the edge area.
  • the vapor chamber can also be fixed to the main board in a non-edge area. As long as the vapor chamber can be secured to the main board, and there can be an area for heating devices between the vapor chamber and the main board, this application does not Define the fixing method between the vapor chamber and the main board.
  • an SOC is arranged on the PCB board.
  • an SOC is arranged on a side of the PCB facing the cold plate, and the SOC is attached to the cold plate. Then the heat generated by the SOC or other heating devices on the PCB can be directly transferred to the cold plate.
  • an SOC is arranged on a side of the PCB facing the vapor chamber, and the SOC is attached to the vapor chamber. Then, the heat generated by the SOC or other heat-generating components on the PCB can be transferred to the vapor chamber, and then transferred to the cold plate through the vapor chamber and the heat conducting component.
  • the present application provides an installation method for an in-vehicle computing device, including:
  • a PCB board is fixed between the temperature equalizing plate and the cold plate, a connector is fixed on the PCB board, and one end of the connector is connected to the PCB board;
  • the cold plate and the vapor chamber are connected through the heat conducting assembly.
  • the present application provides an automobile, which is characterized by comprising a vehicle body, and the heat dissipation assembly according to any one of the above-mentioned first aspects disposed in the vehicle body.
  • the present application can further combine to provide more designs.
  • An embodiment of the present application provides a heat dissipation assembly, including: a cold plate, a temperature equalizing plate, and a heat conduction assembly; one side of the temperature equalizing plate is attached to a heating device on a main board; the temperature equalizing plate faces away from the main board
  • the cold plate is arranged on one side of the cooling plate; the cold plate and the temperature-spreading plate are connected through the heat-conducting component, so that the heat generated by the heating device is transferred to the the cold plate.
  • a temperature equalizing plate is added to the main board, and a cold plate is arranged on the side of the temperature uniformizing plate facing away from the main board.
  • a PCB board can be arranged between the boards, so that the connector between the PCB board and the main board will not interrupt the flow channel of the cold board, thereby improving the heat dissipation performance of the cold board.
  • FIG. 1a provides a schematic structural diagram of a vehicle according to an embodiment of the application
  • FIG. 1b provides a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application
  • FIG. 2 provides a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application
  • FIG. 3 provides a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application
  • FIG. 4 provides a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application.
  • the heat dissipation components provided by the present application can be applied to automobiles, for example, in-vehicle computing devices in automobiles.
  • smart cars include support for unmanned driving (unmanned driving), assisted driving (driver assistance/ADAS), intelligent driving (intelligent driving), connected driving (connected driving), intelligent network driving (intelligent network driving) and Car-sharing electric cars or gasoline-powered cars.
  • the on-board computing device is used to control and monitor the driving status of the smart car, including but not limited to the on-board mobile data center (MDC), and the hardware monitor interface (HMI) that realizes the function of the human-computer interaction controller.
  • MDC on-board mobile data center
  • HMI hardware monitor interface
  • In-vehicle infotainment (IVI) controller body control module (BCM), vehicle control unit (VCU).
  • the in-vehicle computing device may specifically have a chip with computing and processing capabilities, or may be a collection of multiple devices such as processors and memories integrated in a printed circuit board (PCB), where the processor includes but is not limited to the central Processor (central processing unit, CPU), general-purpose processor, digital signal processor (digital signal processing, DSP), application-specific integrated circuit (application-specific integrated circuit, ASIC), field-programmable gate array (field-programmable gate array) , FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, graphics processing unit (GPU), artificial intelligence (AI) chips.
  • CPU central processing unit
  • DSP digital signal processor
  • ASIC application-specific integrated circuit
  • FPGA field-programmable gate array
  • FPGA field-programmable gate array
  • a general purpose processor may be a microprocessor or any conventional processor or the like. It can be seen from the above description that the in-vehicle computing device is provided with a chip with a large amount of calculation, so when it is used, it requires higher requirements for heat dissipation. heat radiation.
  • the in-vehicle computing device 201 can be installed in the center console or in a suitable position near the liquid cooling pump of the vehicle. , camera 202, etc.), detect the environment where the car is located, and then feed it back to the built-in chip of the on-board computing device 201 for real-time reasoning operations, and finally the on-board computing device 201 issues an operation command to the vehicle controller (Vehicle control unit, VCU) 204 , controlling the motor vehicle (braking, decelerating, etc.) through the VCU 204 to realize various levels of automatic driving functions.
  • VCU vehicle control unit
  • the in-vehicle computing device 201 can also upload data to the back-end cloud data center through a T-BOX (telematics BOX) 203 .
  • the in-vehicle computing device 201 may transmit with the camera 202 through a multimedia serial link (MSL); with the lidar 205 through an in-vehicle Ethernet link; with the VCU 204 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX203 through the vehicle Ethernet link.
  • MSL multimedia serial link
  • the lidar 205 through an in-vehicle Ethernet link
  • the VCU 204 through a controller area network Network (controller area network, CAN) bus transmission; transmission between the millimeter wave radar 106 through the CAN bus; transmission between the T-BOX203 through the vehicle Ethernet link.
  • controller area network Network controller area network, CAN
  • the in-vehicle computing device 201 in the present application may include a heat dissipation component for providing heat dissipation for the heat-dissipating device in the in-vehicle computing device 201 .
  • FIG. 1b is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application. As shown in FIG. 1b
  • one side of the temperature equalizing plate 104 is attached to the heating device 105 on the main board 103 .
  • the temperature equalizing plate 104 may be a thin copper plate with good thermal conductivity, a thin aluminum plate for welding heat pipes, a thin flat plate heat pipe, or a graphene sheet, etc., which is not limited in this application.
  • the temperature equalizing plate 104 may include two sides, one of which is attached to the heating device 105 on the main board 103 .
  • the main board 103 may be a PCB board, on which one or more heating devices 105 may be provided, and the heating devices 105 may be devices such as an SOC, a local area network switch LAN SW, or a microcontroller unit (MCU).
  • the heating devices 105 may be devices such as an SOC, a local area network switch LAN SW, or a microcontroller unit (MCU).
  • MCU microcontroller unit
  • one side of the temperature equalizing plate 104 is attached to the heating device 105 on the main board 103, which is equivalent to one side of the heating device 105 being fixed on the main board 103, and the other side is connected to the heating device 103.
  • Plate 104 fits. It should be understood that one side of the vapor chamber 104 can be in direct contact with the heating device 105 on the main board 103 and attached, or indirectly through some thermally conductive materials, as long as the heating device 105 can effectively transfer the generated heat to the vapor chamber 104.
  • the present embodiment does not limit the direct bonding method of the heating device 105 and the temperature equalizing plate 104.
  • the central area of the temperature equalizing plate 104 is attached to the heating device 105 on the main board 103 , and the edge area of the temperature equalizing plate 104 extends toward the main board 103 and fixed on the motherboard 103 .
  • the temperature-spreading plate 104 has a "cover-like" structure, wherein the central area of the temperature-spreading plate 104 is raised toward the direction away from the host to form a hollow area.
  • the edge area of the board 104 is fixed with the main board 103 , so that the heat on the main board 103 can be transferred to the vapor chamber 104 .
  • central area and edge area are relative position expressions, not absolute position definitions, that is, the central area of the vapor chamber 104 is closer to the center of the vapor chamber 104 than the edge area.
  • the vaporizing plate 104 can also be fixed to the main board 103 in a non-edge area, as long as the vaporizing plate 104 and the main board 103 can be secured, and a heating device 105 can be left between the vaporizing plate 104 and the main board 103 The application does not limit the fixing method between the vapor chamber 104 and the main board 103 .
  • the cold plate 101 is provided on the side of the temperature equalizing plate 104 facing away from the main board 103 .
  • the cold plate 101 may be a structure with heat conduction and heat dissipation functions.
  • the cold plate 101 is a metal plate, for example, the cold plate 101 is made of an aluminum alloy material or a steel plate.
  • the cold plate 101 can also be made of other thermally conductive materials, such as ceramic plates or plastics with thermal conductivity.
  • the cold plate 101 may include pipes, and the pipes may be filled with liquid, and then the heat may be taken away by the flow of the liquid, and the liquid may be water or other refrigerants (eg, Freon R22).
  • the cold plate 101 and the vapor chamber 104 may be connected through the thermally conductive assembly 102 , so that the heat generated by the heating device 105 passes through the vapor chamber 104 and the thermally conductive assembly 102 is passed to the cold plate 101 .
  • one end of the heat-conducting component 102 is fixed to the cold plate 101 , and the other end of the heat-conducting component 102 extends toward the temperature-spreading plate 104 and is connected to the temperature-spreading plate 104 .
  • FIG. 2 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • the heat conduction assembly 102 may include a heat conduction assembly body 1021 and a boss 1022, wherein one end of the heat conduction assembly body 1021 is connected to all the The cold plate 101 is fixed, the other end of the heat-conducting component 102 extends toward the temperature-spreading plate 104 , and the boss 1022 disposed on the other end of the heat-conducting component 102 is connected to the temperature-spreading plate 104 .
  • FIG. 1021 As shown in FIG. 2, the heat conduction assembly body 1021 and a boss 1022, wherein one end of the heat conduction assembly body 1021 is connected to all the The cold plate 101 is fixed, the other end of the heat-conducting component 102 extends toward the temperature-spreading plate 104 , and the boss 1022 disposed on the other end of the heat-conducting component 102 is connected to the temperature-spreading plate 104
  • both the temperature equalizing plate 104 and the main board 103 can be fixed on the bosses 1022 of the heat-conducting component 102 with screws, and the temperature-spreading plate 104 is in close contact with the bosses 1022 .
  • the part of the main board 103 in contact with the vapor chamber 104 can be treated with bright copper, and then the heat on the main board 103 can be transferred to the bosses 1022 on the cold plate 101 through the vapor chamber 104 to realize heat transfer. , lowering the temperature of the motherboard 103 .
  • the temperature equalizing plate 104 can collect the heat of the heating device 105 in the main board 103 and transfer it to the cold plate 101 , thereby realizing the heat dissipation of the heating device 105 .
  • a PCB board 106 is fixed between the temperature equalizing plate 104 and the cold plate 101 , a connector 108 is fixed on the PCB board 106 , and one end of the connector 108 is connected to the The PCB board 106 is connected, the connector 108 passes through the temperature equalizing plate 104 , and the other end of the connector 108 extends toward the main board 103 and is fixed on the main board 103 .
  • the SOC 107 is arranged on the PCB board 106 .
  • the SOC107 may be an AI chip.
  • a PCB board 106 with an AI chip arranged on the main board 103 may be fixed.
  • the cold plate 101 is arranged between the PCB board 106 arranged with the AI chip and the main board 103 , however, on the one hand, the PCB board 106 arranged with the AI chip is connected to the main board 103 through the connector 108 , and the connector 108 will affect the cold plate 101
  • the distance between the PCB board 106 on which the AI chip is arranged and the main board 103 is small, which limits the thickness of the cold plate 101 and makes the heat dissipation efficiency low.
  • the cold plate 101 is disposed on the side of the PCB board 106 that faces away from the main board 103 , and the connector 108 only passes through the temperature equalizing plate 104 between the main board 103 and the PCB board 106 , but does not pass through the cold plate 101. Since the vapor chamber 104 conducts heat through metal, there is no flow channel inside, and there is no problem that the heat dissipation capability is significantly reduced due to the interruption of the flow channel.
  • the SOC 107 is arranged on the side of the PCB board 106 facing the vapor chamber 104, and the SOC 107 is connected with the SOC 107.
  • the temperature equalizing plate 104 is attached. Then, the heat generated by the SOC 107 or other heating devices 105 on the PCB board 106 can be directly transferred to the cold plate 101 .
  • FIG. 3 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application.
  • a portion of the PCB board 106 facing the temperature equalizing plate 104 is shown in FIG. 3 .
  • An SOC 107 is arranged on the side, and the SOC 107 is attached to the vapor chamber 104 . Then, the heat generated by the SOC 107 or other heating devices 105 on the PCB board 106 can be transferred to the vapor chamber 104 , and then transferred to the cold plate 101 through the vapor chamber 104 and the thermally conductive component 102 .
  • a heating device 109 (as shown in FIG. 4 ) can also be arranged on the side of the main board facing away from the temperature equalizing plate, and a bottom case can also be provided on the side of the main board facing away from the temperature equalizing plate, and the heating device 109 can be arranged with the bottom
  • the shell 110 is in thermally conductive contact.
  • the cold plate 101 , the heat-conducting component 102 and the bottom case can be fixed and used as the housing of the vehicle-mounted computing device.
  • the heat dissipation assembly in the present application can be applied to an in-vehicle computing device, and the heat dissipation assembly can provide a heat dissipation function for the PCB board in the in-vehicle computing device and the heat dissipation device on the PCB board.
  • the embodiment of the present application provides a heat dissipation assembly, including: a cold plate 101, a temperature equalization plate 104, and a heat conduction assembly 102; one side of the temperature equalization plate 104 is attached to the heating device 105 on the main board 103; The cold plate 101 is provided on the side of the plate 104 facing away from the main board 103; It is transmitted to the cold plate 101 through the vapor chamber 104 and the heat conducting component 102 .
  • a temperature equalizing plate 104 is added to the main board 103, and a cold plate 101 is arranged on the side of the temperature equalizing plate 104 facing away from the main board 103.
  • a PCB board 106 can be arranged between the cold plate 101, the temperature equalizing plate 104 and the cold plate 101, so that the connector 108 between the PCB board 106 and the main board 103 will not interrupt the flow channel of the cold plate 101, thereby improving the cold plate 101. Thermal performance.
  • the device embodiments described above are only schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be A physical unit, which can be located in one place or distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.
  • the computer program product includes one or more computer instructions.
  • the computer may be a general purpose computer, special purpose computer, computer network, or other programmable device.
  • the computer instructions may be stored in or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be retrieved from a website, computer, training device, or data Transmission from the center to another website site, computer, training facility or data center via wired (eg coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (eg infrared, wireless, microwave, etc.) means.
  • wired eg coaxial cable, fiber optic, digital subscriber line (DSL)
  • wireless eg infrared, wireless, microwave, etc.
  • the computer-readable storage medium may be any available medium that can be stored by a computer, or a data storage device such as a training device, a data center, or the like that includes an integration of one or more available media.
  • the usable media may be magnetic media (eg, floppy disks, hard disks, magnetic tapes), optical media (eg, DVD), or semiconductor media (eg, Solid State Disk (SSD)), and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请实施例提供了一种散热组件，包括：冷板、均温板以及导热组件；均温板的一侧与主板上的发热器件贴合；均温板背向主板的一侧设置有冷板；均温板与冷板之间固定有PCB板，PCB板上固定有连接器，连接器的一端与PCB板连接，连接器穿过均温板，且连接器的另一端向主板延伸并固定在主板上；冷板与均温板之间通过导热组件连接，以便发热器件产生的热量通过均温板和导热组件传递至冷板。本申请提供的散热组件可以应用在自动驾驶汽车、智能汽车、网联汽车、新能源汽车上，本实施例由均温板将主板上的发热器件的热量传递至冷板，均温板和冷板之间设置PCB板，使得PCB板与主板之间的连接器不会打断冷板流道，进而提高了冷板的散热性能。

Description

一种散热组件及汽车
本申请要求于2020年08月31日提交中国专利局、申请号为202010901484.2、发明名称为“一种散热组件及汽车”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到硬件结构技术领域，尤其涉及一种散热组件及汽车。
背景技术
当前出现一种自动驾驶模块的新架构，布置有人工智能(artificial intelligence，AI)芯片的印制电路板(printed circuit board，PCB)板(也可以称之为AI扣板)通过连接器装到主板上，一块AI扣板具有一定的算力，客户需要多少算力就安装多少块AI单板，需要数据推理还是数据分析，都可以灵活配置。
现有的实现中，为了对主板上的发热器件进行散热，可以将冷板放在主板和扣板之间，把主板和扣板主要的发热器件都贴冷板散热，发热器件可以通过冷板散热，解决了扣板和主板之间器件散热困难的问题。但由于扣板和主板之间的空间较小，导致冷板的厚度受限，散热能力较差，很难支持大功耗的主芯片散热，同时扣板连接器以及主板和扣板之间的电容和电感需要穿过冷板，冷板内部的流道会被打断得支离破碎，导致冷板的散热能力下降。
发明内容
第一方面，本申请提供了一种散热组件，包括：冷板、均温板以及导热组件；所述均温板的一侧与主板上的发热器件贴合；所述均温板背向所述主板的一侧设置有所述冷板；所述均温板与所述冷板之间固定有PCB板，所述PCB板上固定有连接器，所述连接器的一端与所述PCB板连接，所述连接器穿过所述均温板，且所述连接器的另一端向所述主板延伸并固定在所述主板上；所述冷板与所述均温板之间通过所述导热组件连接，以便所述发热器件产生的热量通过所述均温板和所述导热组件传递至所述冷板。其中，均温板可以是导热性能好的薄铜板、焊接热管的薄铝板、薄形的平板热管、或者石墨烯薄片等等，本申请并不限定。发热器件可以为SOC、局域网交换机LAN SW或微控制单元等器件。其中，冷板可以为具有导热及散热功能的结构。在一种可选的实施方式中，冷板为金属板件，例如：冷板为铝合金材质或钢板等。其它实施方式中，冷板也可以为其它的导热材料，例如陶瓷板或具有导热能力的塑料。其它实施方式中，冷板可以包括管路，管路中可以填充液体，进而通过液体的流动将热量带走，液体可以为水或其它制冷工质。
本申请实施例中，主板上可以固定有布置有AI芯片的PCB板，在现有的实现中，为了对布置有AI芯片的PCB板和主板上的发热器件进行散热，将冷板设置在布置有AI芯片的PCB板和主板之间，然而，一方面，布置有AI芯片的PCB板通过连接器与主板连接，连接器会影响到冷板的结构，且布置有AI芯片的PCB板与主板之间的距离很小，限制了冷板的厚度，使得散热效率较低。本申请实施例中，冷板设置在PCB板背向主板的一侧，连接器只会穿过主板与PCB板之间的均温板，而不会穿过冷板，由于均温板是通过金属导热，内部没有流道，不会因为流道被打断导致散热能力显著下降的问题，进而提高了冷板的散热 性能。
在一种可能的实现中，所述导热组件的一端与所述冷板固定，所述导热组件的另一端向所述均温板延伸，并与所述均温板连接。
在一种可能的实现中，所述均温板的中央区域和所述主板上的发热器件贴合，所述均温板的边缘区域向所述主板延伸并固定在所述主板上。相当于，均温板为“盖状”结构，其中均温板的中央区域朝背向主办的方向凸起进而形成中空区域，该中空区域的内壁可以与发热器件贴合，均温板的边缘区域则与主板固定，进而可以使得主板上的热量传递至均温板。应理解上述“中央区域”和“边缘区域”为相对的位置表达，并不是绝对的位置限定，也就是说均温板的中央区域相对于边缘区域更靠近均温板的中央。在其他的实现中，均温板也可以是非边缘区域与主板固定，只要可以保证均温板与主板的固定，且可以在均温板与主板之间留有发热器件的区域，本申请并不限定均温板与主板之间的固定方式。
在一种可能的实现中，所述PCB板上布置有SOC。
在一种可能的实现中，所述PCB板上朝向所述冷板的一侧布置有SOC，且所述SOC与所述冷板贴合。则PCB板上的SOC或者其他发热器件产生的热量可以直接传递至冷板。
在一种可能的实现中，所述PCB板上朝向所述均温板的一侧布置有SOC，且所述SOC与所述均温板贴合。则PCB板上的SOC或者其他发热器件产生的热量可以传递至均温板，进而通过所述均温板和所述导热组件传递至所述冷板。
第二方面，本申请提供了一种车载计算装置的安装方法，包括：
将均温板的一侧与主板上的发热器件贴合；
在所述均温板与所述冷板之间固定PCB板，所述PCB板上固定有连接器，所述连接器的一端与所述PCB板连接；
将所述连接器穿过所述均温板，使得所述连接器的另一端向所述主板延伸并固定在所述主板上；
将所述冷板与所述均温板通过所述导热组件连接。
第三方面，本申请提供了一种汽车，其特征在于，包括车体，以及设置在所述车体内的如上述第一方面任一项所述的散热组件。
本申请在上述各方面提供的设计的基础上，还可以进行进一步组合以提供更多设计。
本申请实施例提供了一种散热组件，包括：冷板、均温板以及导热组件；所述均温板的一侧与主板上的发热器件贴合；所述均温板背向所述主板的一侧设置有所述冷板；所述冷板与所述均温板之间通过所述导热组件连接，以便所述发热器件产生的热量通过所述均温板和所述导热组件传递至所述冷板。通过上述方式，在主板上添加了均温板，且在均温板背向主板的一侧设置冷板，由均温板将主板上的发热器件的热量传递至冷板，均温板和冷板之间可以设置PCB板，使得PCB板与主板之间的连接器不会打断冷板流道，进而提高了冷板的散热性能。
附图说明
图1a为本申请实施例提供一种车辆的结构示意；
图1b为本申请实施例提供一种散热组件的结构示意；
图2为本申请实施例提供一种散热组件的结构示意；
图3为本申请实施例提供一种散热组件的结构示意；
图4为本申请实施例提供一种散热组件的结构示意。
具体实施方式
下面结合本发明实施例中的附图对本发明实施例进行描述。本发明的实施方式部分使用的术语仅用于对本发明的具体实施例进行解释，而非旨在限定本发明。
下面结合附图，对本申请的实施例进行描述。本领域普通技术人员可知，随着技术的发展和新场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的术语在适当情况下可以互换，这仅仅是描述本申请的实施例中对相同属性的对象在描述时所采用的区分方式。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，以便包含一系列单元的过程、方法、系统、产品或设备不必限于那些单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它单元。
首先，介绍本申请提供的散热组件的应用场景，本申请提供散热组件可以应用于汽车中，例如，可以应用在汽车内的车载计算装置中，车载计算装置可以应用于智能汽车的自动驾驶(automated driving)中，智能汽车包括支持无人驾驶(unmanned driving)、辅助驾驶(driver assistance/ADAS)、智能驾驶(intelligent driving)、网联驾驶(connected driving)、智能网联驾驶(intelligent network driving)和汽车共享(car sharing)的电动汽车或者汽油驱动的汽车。车载计算装置用于对智能汽车进行行驶状态控制和状态监控，包括但不限于车载移动数据中心(mobile data center，MDC)、实现人机交互控制器功能的硬件监视器(hardware monitor interface，HMI)、车载娱乐(in-vehicle infotainment，IVI)控制器，车身控制器(body control module，BCM)、整车控制器(vehicle control unit,VCU)。车载计算装置具体可以具有计算和处理能力的芯片，也可以是集成在印制电路板(printed circuit board，PCB)中处理器、存储器等多个器件的集合，其中，处理器包括但不限于中央处理器(central processing unit，CPU)，通用处理器、数字信号处理器(digital signal processing，DSP)、专用集成电路(application-specific integrated circuit，ASIC)、现场可编程门阵列(field-programmable gate array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件、图形处理器单元(graphics processing unit，GPU)、人工智能(artificial intelligence，AI)芯片。通用处理器可以是微处理器或者是任何常规的处理器等。由上述描述可以看出，车载计算装置设置有计算量较大的芯片，因此其在使用时，散热需要较高的要求，为此本申请提供了一种散热组件来改善车载计算装置中芯片的散热效果。
示例性的，如图1a所示，车载计算装置201可以安装在中控台或靠近整车液冷泵等合适位置，通过安装在车身上的各类传感器(例如毫米波雷达206、激光雷达205、摄像头202等等)，探测汽车所处环境，然后反馈给车载计算装置201内置的芯片等进行实时推理运算，最后车载计算装置201下发操作命令给整车控制器(vehicle control unit，VCU)204，通过 VCU204控制机动车辆(刹车、减速等)，实现各种级别的自动驾驶功能。车载计算装置201还可通过T-BOX(telematics BOX)203将数据上传到后端的云数据中心。可选的，车载计算装置201可以与摄像头202之间通过多媒体串行链路(multimedia serial link，MSL)传输；与激光雷达205之间通过车载以太链路传输；与VCU204之间通过控制器局域网络(controller area network，CAN)总线传输；与毫米波雷达106之间通过CAN总线传输；与T-BOX203之间通过车载以太链路传输。
本申请中的车载计算装置201可以包括散热组件，用于为车载计算装置201中的散热器件提供散热。
参照图1b，图1b为本申请实施例提供一种散热组件的结构示意，如图1b所示，本申请实施例提供的散热组件包括：冷板101、均温板104以及导热组件102。
本申请实施例中，所述均温板104的一侧与主板103上的发热器件105贴合。
其中，均温板104可以是导热性能好的薄铜板、焊接热管的薄铝板、薄形的平板热管、或者石墨烯薄片等等，本申请并不限定。
其中，均温板104可以包括两侧，其中一侧与主板103上的发热器件105贴合。
本申请实施例中，主板103可以为PCB板，其上可以设置有一个或多个发热器件105，发热器件105可以为SOC、局域网交换机LAN SW或微控制单元(microcontroller unit，MCU)等器件。
本申请实施例中，如图1b所示，均温板104的一侧与主板103上的发热器件105贴合，相当于发热器件105的一侧固定在主板103上，另一侧与均温板104贴合。应理解，均温板104的一侧可以与主板103上的发热器件105直接接触并贴合，或者通过一些导热材料间接贴合，只要发热器件105可以将产生的热量有效的传递至均温板104，本实施例并不限定发热器件105与均温板104直接的贴合方式。
如图1b所示，本申请实施例中，所述均温板104的中央区域和所述主板103上的发热器件105贴合，所述均温板104的边缘区域向所述主板103延伸并固定在所述主板103上。相当于，均温板104为“盖状”结构，其中均温板104的中央区域朝背向主办的方向凸起进而形成中空区域，该中空区域的内壁可以与发热器件105贴合，均温板104的边缘区域则与主板103固定，进而可以使得主板103上的热量传递至均温板104。应理解上述“中央区域”和“边缘区域”为相对的位置表达，并不是绝对的位置限定，也就是说均温板104的中央区域相对于边缘区域更靠近均温板104的中央。在其他的实现中，均温板104也可以是非边缘区域与主板103固定，只要可以保证均温板104与主板103的固定，且可以在均温板104与主板103之间留有发热器件105的区域，本申请并不限定均温板104与主板103之间的固定方式。
本申请实施例中，所述均温板104背向所述主板103的一侧设置有所述冷板101。
其中，冷板101可以为具有导热及散热功能的结构。在一种可选的实施方式中，冷板101为金属板件，例如：冷板101为铝合金材质或钢板等。其它实施方式中，冷板101也可以为其它的导热材料，例如陶瓷板或具有导热能力的塑料。其它实施方式中，冷板101可以包括管路，管路中可以填充液体，进而通过液体的流动将热量带走，液体可以为水或 其它制冷工质(例如：氟利昂R22)。
本申请实施例中，所述冷板101可以与所述均温板104之间通过所述导热组件102连接，以便所述发热器件105产生的热量通过所述均温板104和所述导热组件102传递至所述冷板101。
在一种可能的实现中，所述导热组件102的一端与所述冷板101固定，所述导热组件102的另一端向所述均温板104延伸，并与所述均温板104连接。
参照图2，图2为本申请实施例提供的一种散热组件的结构示意，如图2所示，导热组件102可以包括导热组件本体1021以及凸台1022，其中导热组件本体1021的一端与所述冷板101固定，所述导热组件102的另一端向所述均温板104延伸，且设置于所述导热组件102的另一端的凸台1022与所述均温板104连接。如图2所示，可以用螺钉将均温板104和主板103都固定在导热组件102的凸台1022上，均温板104与凸台1022紧密接触。应理解，为了实现热量传递，主板103与均温板104接触的部分可以进行亮铜处理，进而主板103上的热量可以通过均温板104传递到冷板101上凸台1022，实现热量的传递，降低主板103的温度。
本申请实施例中，均温板104可以收集主板103中发热器件105的热量后传递给冷板101，进而实现对发热器件105的散热。
在一种可能的实现中，所述均温板104与所述冷板101之间固定有PCB板106，所述PCB板106上固定有连接器108，所述连接器108的一端与所述PCB板106连接，所述连接器108穿过所述均温板104，且所述连接器108的另一端向所述主板103延伸并固定在所述主板103上。其中，所述PCB板106上布置有SOC107。该SOC107可以是AI芯片。
本申请实施例中，主板103上可以固定有布置有AI芯片的PCB板106，在现有的实现中，为了对布置有AI芯片的PCB板106和主板103上的发热器件105进行散热，将冷板101设置在布置有AI芯片的PCB板106和主板103之间，然而，一方面，布置有AI芯片的PCB板106通过连接器108与主板103连接，连接器108会影响到冷板101的结构，且布置有AI芯片的PCB板106与主板103之间的距离很小，限制了冷板101的厚度，使得散热效率较低。本申请实施例中，冷板101设置在PCB板106背向主板103的一侧，连接器108只会穿过主板103与PCB板106之间的均温板104，而不会穿过冷板101，由于均温板104是通过金属导热，内部没有流道，不会因为流道被打断导致散热能力显著下降的问题。
为了保证PCB板106上SOC107的散热，如图1b所示，在一种可能的实现中，所述PCB板106上朝向所述均温板104的一侧布置有SOC107，且所述SOC107与所述均温板104贴合。则，PCB板106上的SOC107或者其他发热器件105产生的热量可以直接传递至冷板101。
参照图3，图3为本申请实施例提供的一种散热组件的结构示意，如图3所示，在一种可能的实现中，所述PCB板106上朝向所述均温板104的一侧布置有SOC107，且所述SOC107与所述均温板104贴合。则，PCB板106上的SOC107或者其他发热器件105产生的热量可以传递至均温板104，进而通过所述均温板104和所述导热组件102传递至所述冷板101。
应理解，主板上背向均温板的一侧还可以布置有发热器件109(如图4所示)，主板背 向均温板的一侧还可以设置有底壳，发热器件109可以与底壳110导热接触。本实施例中，冷板101、导热组件102和底壳可以固定并作为车载计算装置的外壳。
本申请中的散热组件可以应用于车载计算装置，散热组件可以为车载计算装置中的PCB板以及PCB板上的散热器件提供散热功能。
本申请实施例提供了一种散热组件，包括：冷板101、均温板104以及导热组件102；所述均温板104的一侧与主板103上的发热器件105贴合；所述均温板104背向所述主板103的一侧设置有所述冷板101；所述冷板101与所述均温板104之间通过所述导热组件102连接，以便所述发热器件105产生的热量通过所述均温板104和所述导热组件102传递至所述冷板101。通过上述方式，在主板103上添加了均温板104，且在均温板104背向主板103的一侧设置冷板101，由均温板104将主板103上的发热器件105的热量传递至冷板101，均温板104和冷板101之间可以设置PCB板106，使得PCB板106与主板103之间的连接器108不会打断冷板101流道，进而提高了冷板101的散热性能。
另外需说明的是，以上所描述的装置实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。另外，本申请提供的装置实施例附图中，模块之间的连接关系表示它们之间具有通信连接，具体可以实现为一条或多条通信总线或信号线。
通过以上的实施方式的描述，所属领域的技术人员可以清楚地了解到本申请可借助软件加必需的通用硬件的方式来实现，当然也可以通过专用硬件包括专用集成电路、专用CPU、专用存储器、专用元器件等来实现。一般情况下，凡由计算机程序完成的功能都可以很容易地用相应的硬件来实现，而且，用来实现同一功能的具体硬件结构也可以是多种多样的，例如模拟电路、数字电路或专用电路等。但是，对本申请而言更多情况下软件程序实现是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在可读取的存储介质中，如计算机的软盘、U盘、移动硬盘、ROM、RAM、磁碟或者光盘等，包括若干指令用以使得一台计算机设备(可以是个人计算机，训练设备，或者网络设备等)执行本申请各个实施例所述的方法。
在上述实施例中，可以全部或部分地通过软件、硬件、固件或者其任意组合来实现。当使用软件实现时，可以全部或部分地以计算机程序产品的形式实现。
所述计算机程序产品包括一个或多个计算机指令。在计算机上加载和执行所述计算机程序指令时，全部或部分地产生按照本申请实施例所述的流程或功能。所述计算机可以是通用计算机、专用计算机、计算机网络、或者其他可编程装置。所述计算机指令可以存储在计算机可读存储介质中，或者从一个计算机可读存储介质向另一计算机可读存储介质传输，例如，所述计算机指令可以从一个网站站点、计算机、训练设备或数据中心通过有线 (例如同轴电缆、光纤、数字用户线(DSL))或无线(例如红外、无线、微波等)方式向另一个网站站点、计算机、训练设备或数据中心进行传输。所述计算机可读存储介质可以是计算机能够存储的任何可用介质或者是包含一个或多个可用介质集成的训练设备、数据中心等数据存储设备。所述可用介质可以是磁性介质，(例如，软盘、硬盘、磁带)、光介质(例如，DVD)、或者半导体介质(例如固态硬盘(Solid State Disk，SSD))等。

Claims (7)

  1. 一种散热组件，其特征在于，包括：冷板(101)、均温板(104)以及导热组件(102)；
    所述均温板(104)的一侧与主板(103)上的发热器件(105)贴合；
    所述均温板(104)背向所述主板(103)的一侧设置有所述冷板(101)；
    所述均温板(104)与所述冷板(101)之间固定有PCB板(106)，所述PCB板(106)上固定有连接器(108)，所述连接器(108)的一端与所述PCB板(106)连接，所述连接器(108)穿过所述均温板(104)，且所述连接器(108)的另一端向所述主板(103)延伸并固定在所述主板(103)上；
    所述冷板(101)与所述均温板(104)之间通过所述导热组件(102)连接。
  2. 根据权利要求1所述的散热组件，其特征在于，所述导热组件(102)的一端与所述冷板(101)固定，所述导热组件(102)的另一端向所述均温板(104)延伸，并与所述均温板(104)连接。
  3. 根据权利要求1或2所述的散热组件，其特征在于，所述均温板(104)的中央区域和所述主板(103)上的发热器件(105)贴合，所述均温板(104)的边缘区域向所述主板(103)延伸并固定在所述主板(103)上。
  4. 根据权利要求1至3任一所述的散热组件，其特征在于，所述PCB板(106)上布置有系统级芯片SOC。
  5. 根据权利要求4所述的散热组件，其特征在于，所述PCB板(106)上朝向所述冷板(101)的一侧布置有所述SOC，且所述SOC与所述冷板(101)贴合。
  6. 根据权利要求4所述的散热组件，其特征在于，所述PCB板(106)上朝向所述均温板(104)的一侧布置有所述SOC，且所述SOC与所述均温板(104)贴合。
  7. 一种汽车，其特征在于，包括车体，以及设置在所述车体内的如所述权利要求1至6任一项所述的散热组件。
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