WO2022024326A1 - Système de gestion de qualité d'impression et procédé de gestion de qualité d'impression - Google Patents

Système de gestion de qualité d'impression et procédé de gestion de qualité d'impression Download PDF

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Publication number
WO2022024326A1
WO2022024326A1 PCT/JP2020/029338 JP2020029338W WO2022024326A1 WO 2022024326 A1 WO2022024326 A1 WO 2022024326A1 JP 2020029338 W JP2020029338 W JP 2020029338W WO 2022024326 A1 WO2022024326 A1 WO 2022024326A1
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WO
WIPO (PCT)
Prior art keywords
printing
print quality
target opening
image
mask
Prior art date
Application number
PCT/JP2020/029338
Other languages
English (en)
Japanese (ja)
Inventor
光昭 加藤
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to JP2022539924A priority Critical patent/JP7458488B2/ja
Priority to DE112020007473.0T priority patent/DE112020007473T5/de
Priority to CN202080102111.7A priority patent/CN115734878A/zh
Priority to PCT/JP2020/029338 priority patent/WO2022024326A1/fr
Publication of WO2022024326A1 publication Critical patent/WO2022024326A1/fr
Priority to JP2024042603A priority patent/JP2024069552A/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/0027—Devices for scanning originals, printing formes or the like for determining or presetting the ink supply
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/02—Arrangements of indicating devices, e.g. counters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F35/00—Cleaning arrangements or devices
    • B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
    • B41F35/005—Cleaning arrangements or devices for screen printers or parts thereof for flat screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Definitions

  • This specification discloses the technology related to the print quality control system and the print quality control method.
  • the print inspection apparatus described in Patent Document 1 performs a process of obtaining mask aperture data indicating the position and shape of each pattern hole provided on the mask plate by recognizing the image pickup result obtained by imaging the mask plate.
  • the mask aperture data is used as inspection data for print inspection.
  • the printing inspection machine determines that the printing condition is defective, there is a request to check the condition of the opening where the printing condition is determined to be defective.
  • the present specification discloses a print quality control system and a print quality control method capable of confirming the state of an opening for which a print inspection machine has determined a defective print state.
  • the image pickup unit is a printing inspection machine that inspects the printing state of the solder printed by a printing machine in which the squeegee slides the mask and prints the solder on the substrate through the opening of the mask.
  • the image pickup device is made to take an image of the target opening, which is the opening for which the defective printing state is determined.
  • the display unit causes the display device to display an image of the target opening imaged by the image pickup device.
  • this specification discloses a print quality control method including an imaging process and a display process.
  • the imaging step the printing inspection machine that inspects the printing state of the solder printed by the printing machine in which the squeegee slides the mask and prints the solder on the substrate through the opening of the mask is defective in the printing state.
  • the image pickup device is made to take an image of the target opening, which is the opening for which the defective printing state is determined.
  • the display step the display device displays an image of the target opening imaged by the image pickup device.
  • the print quality management system can display the image of the target opening imaged by the image pickup device on the display device. Therefore, for example, the operator can confirm the state of the target opening.
  • the above-mentioned matters regarding the print quality control system can be applied to the print quality control method as well.
  • Embodiment 1-1 Configuration example of the anti-board work line WML
  • the board-to-board work line WML of the present embodiment may include a printing machine WM1 and a printing inspection machine WM2, and the type and number of the board-to-board work machines WM constituting the board-to-board work line WML are not limited.
  • the board-to-board work line WML of this embodiment is a plurality (five) board-to-board work of a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5.
  • the machine WM is provided, and the substrate 90 is conveyed in this order by the substrate transfer device.
  • the printing machine WM1 prints the solder 80 at the mounting positions of a plurality of parts on the substrate 90.
  • the printing inspection machine WM2 inspects the printing state of the solder 80 printed by the printing machine WM1.
  • the component mounting machine WM3 mounts a plurality of components on the substrate 90 on which the solder 80 is printed by the printing machine WM1.
  • the component mounting machine WM3 may be one or a plurality. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share and mount a plurality of parts.
  • the reflow furnace WM4 heats the substrate 90 on which a plurality of parts are mounted by the parts mounting machine WM3, melts the solder 80, and performs soldering.
  • the visual inspection machine WM5 inspects the mounting state of a plurality of parts mounted by the component mounting machine WM3.
  • the board-to-board work line WML uses a plurality of (five) board-to-board work machines WM to sequentially convey the boards 90 and execute a production process including an inspection process to produce the board product 900. Can be done.
  • the board work line WML includes, for example, a board work machine WM such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can also prepare.
  • a board work machine WM such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can also prepare.
  • the plurality (five) anti-board work machines WM and the management device WMC constituting the anti-board work line WML are communicably connected by the communication unit LC.
  • the communication unit LC may perform communication by wire or may communicate by wireless. Further, the communication method may be various methods.
  • a premises information communication network (LAN: Local Area Network) is configured by a plurality of (five) anti-board work machines WM and management device WMC.
  • LAN Local Area Network
  • the plurality (five) anti-board working machines WM can communicate with each other via the communication unit LC. Further, the plurality (five) anti-board working machines WM can communicate with the management device WMC via the communication unit LC.
  • the management device WMC controls a plurality of (five) anti-board work machines WM constituting the anti-board work line WML, and monitors the operating status of the anti-board work line WML.
  • the management device WMC stores various control data for controlling a plurality (five) anti-board working machines WM.
  • the management device WMC transmits control data to each of the plurality (five) anti-board working machines WM. Further, each of the plurality (five) anti-board working machines WM transmits the operation status and the production status to the management device WMC.
  • a data server DSV can be provided in the management device WMC.
  • the data server DSV can store, for example, the acquired data acquired by the board-to-board work machine WM regarding the board-to-board work. For example, various image data captured by the anti-board working machine WM are included in the acquired data.
  • the record (log data) of the operating status acquired by the board work machine WM is included in the acquired data.
  • the data server DSV can also store various production information regarding the production of the substrate 90.
  • component data such as information on the shape of each type of component, information on electrical characteristics, and information on how to handle the component is included in the production information.
  • inspection results by inspection machines such as the printing inspection machine WM2 and the appearance inspection machine WM5 are included in the production information.
  • the squeegee 34 slides the mask 70 to print the solder 80 on the substrate 90 through the opening 71 of the mask 70.
  • the printing machine WM1 includes a substrate transfer device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41.
  • the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2) is the X-axis direction.
  • the front-back direction (left-right direction in FIG. 2) of the printing machine WM1 orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction.
  • the vertical direction (vertical direction in FIG. 2) orthogonal to the X-axis direction and the Y-axis direction is defined as the Z-axis direction.
  • the board transfer device 10 conveys the board 90 to be printed.
  • the substrate 90 is a circuit board, and an electronic circuit, an electric circuit, a magnetic circuit, and the like are formed.
  • the substrate transfer device 10 is provided on the base BS1 of the printing machine WM1.
  • the substrate transfer device 10 conveys the substrate 90 by, for example, a belt conveyor extending in the X-axis direction.
  • the board transfer device 10 includes a board holding unit 11 that holds the board 90 carried into the printing machine WM1.
  • the substrate holding portion 11 is provided below the mask 70, and is configured to be able to move up and down in the Z-axis direction by a linear motion mechanism such as a feed screw mechanism, for example. Specifically, the substrate holding portion 11 is lowered when the substrate 90 is transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and the upper surface of the substrate 90 is brought into close contact with the lower surface of the mask 70. The substrate 90 is held in this state.
  • the mask support device 20 is provided above the substrate transfer device 10.
  • the mask support device 20 supports the mask 70 by a pair of support bases.
  • the pair of supports are on the left side (the back side of the paper in FIG. 2 and shown) and the right side (the front side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 in the front direction. It is arranged and formed so as to extend along the Y-axis direction.
  • FIG. 2 is a partial cross-sectional view of the printing press WM1 cut along the Y-axis direction, and schematically shows the inside of the printing press WM1 in the side view and the cross section of the mask 70 and the substrate 90. ing.
  • the mask 70 is formed with an opening 71 that penetrates at a predetermined position on the wiring pattern of the substrate 90.
  • the mask 70 is supported by the mask support device 20 via, for example, a frame member provided on the outer peripheral edge.
  • the squeegee moving device 30 raises and lowers the squeegee 34 in the direction perpendicular to the mask 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the upper surface of the mask 70.
  • the squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of elevating devices 33, 33, and a pair of squeegees 34, 34.
  • the head drive device 31 is arranged on the upper side of the printing machine WM1.
  • the head drive device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.
  • the squeegee head 32 is clamped and fixed to a moving body constituting the linear motion mechanism of the head drive device 31.
  • the squeegee head 32 holds a pair of elevating devices 33, 33.
  • Each of the pair of elevating devices 33, 33 holds the squeegee 34 and can be driven independently of each other.
  • Each of the pair of elevating devices 33, 33 drives an actuator such as an air cylinder to elevate the squeegee 34 to be held.
  • each of the pair of squeegees 34, 34 is a plate-shaped member formed so as to extend along the X-axis direction orthogonal to the printing direction (Y-axis direction).
  • the front side (left side in FIG. 2) of the pair of squeegees 34, 34 is used for the printing process of moving the solder 80 from the front side to the rear side, and is in the direction from the front side to the rear side of the printing machine WM1. Is the direction of travel.
  • the rear side (right side of FIG. 2) of the pair of squeegees 34, 34 is used for the printing process of moving the solder 80 from the rear side to the front side, and is directed from the rear side to the front side of the printing machine WM1.
  • the direction is the direction of travel. Further, in any of the squeegees 34, the direction opposite to the traveling direction is set as the retreating direction.
  • Each of the pair of squeegees 34, 34 is held by the elevating device 33 at an angle so that the front portion located on the traveling direction side faces downward.
  • each of the pair of squeegees 34, 34 is held by the elevating device 33 at an angle so that the back surface portion located on the receding direction side faces upward.
  • the tilt angle of each of the pair of squeegees 34, 34 is adjusted by an adjusting mechanism provided in the lower part of the elevating device 33.
  • the control device 40 includes a known arithmetic unit and a storage device, and constitutes a control circuit.
  • the control device 40 is communicably connected to the management device WMC via the communication unit LC shown in FIG. 1, and can transmit and receive various data.
  • the control device 40 can drive and control the substrate transfer device 10, the mask support device 20, the squeegee movement device 30, and the display device 41 based on the production program, the detection results of various sensors, and the like.
  • the control device 40 is provided with a storage device 60.
  • a storage device 60 for example, a magnetic storage device such as a hard disk device, a storage device using a semiconductor element such as a flash memory, or the like can be used.
  • the storage device 60 stores a production program or the like for driving the printing machine WM1.
  • the control device 40 acquires various information stored in the storage device 60 and detection results of various sensors provided in the printing machine WM1.
  • the control device 40 drives and controls, for example, the squeegee moving device 30.
  • the control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results.
  • the positions of the pair of squeegees 34, 34 held in the squeegee head 32 in the Y-axis direction and the positions (height) in the Z-axis direction, as well as the moving speed and the tilt angle are controlled.
  • the pair of squeegees 34, 34 are driven and controlled, and the solder 80 is printed on the substrate 90 arranged on the lower surface side of the mask 70.
  • the control device 40 is provided with a display device 41.
  • the display device 41 can display the work status of the printing machine WM1. Further, the display device 41 is composed of a touch panel, and also functions as an input device that accepts various operations by the operator. The operator can know the working status of the printing machine WM1 via the display device 41. Further, the operator can set the printing machine WM1 and give instructions to the printing machine WM1 via the display device 41.
  • Configuration example of the print quality control system 50 When the print inspection machine WM2 determines that the print state is defective, the operator takes various measures. For example, the operator cleans the opening 71, supplies the solder 80, and the like according to the state of the opening 71 of the mask 70. Therefore, the operator needs to confirm the state of the opening 71 of the mask 70 for which the defective printing state is determined.
  • the print quality control system 50 is provided in the board-to-board work line WML of the present embodiment.
  • the print quality management system 50 includes an image pickup unit 51 and a display unit 52 when viewed as a control block.
  • the print quality management system 50 may also include a preprocessing unit 53.
  • the print quality management system 50 of the present embodiment includes an imaging unit 51, a display unit 52, and a preprocessing unit 53.
  • the print quality control system 50 can be provided in various control devices such as the printing machine WM1, the anti-board working machine WM other than the printing machine WM1, the management device WMC, and various arithmetic units.
  • the print quality control system 50 may be provided in the printing machine WM1 in consideration of the work performed by the operator after confirming the state of the opening 71. As shown in FIG. 3, the print quality control system 50 of the present embodiment is provided in the control device 40 of the printing machine WM1.
  • the print quality management system 50 executes control according to the flowchart shown in FIG.
  • the image pickup unit 51 performs the determination shown in step S13 and the process shown in step S14.
  • the display unit 52 performs the processes shown in steps S15 and S16.
  • the pre-processing unit 53 performs the determination shown in step S11 and the processing shown in step S12.
  • Imaging unit 51 When the print inspection machine WM2 determines that the print state is defective, the image pickup unit 51 causes the image pickup device FC1 to take an image of the target opening 71t, which is the opening 71 for which the print state defect is determined (step shown in FIG. 4). S13 and step S14).
  • the image pickup device FC1 may take various forms as long as it can image the target opening 71t.
  • the image pickup apparatus FC1 may be provided with a camera that separately captures the target opening 71t, or may use another camera used for imaging.
  • a mark camera that images a positioning reference unit provided on each of the mask 70 and the substrate 90 is used.
  • the image pickup apparatus FC1 which is a mark camera can be moved in the X-axis direction and the Y-axis direction by, for example, an XY table.
  • the image pickup apparatus FC1 moves to the positioning reference portion provided on the substrate 90 and moves the positioning reference portion.
  • a predetermined area of the substrate 90 including the substrate 90 is imaged.
  • the image pickup apparatus FC1 images a predetermined area including the positioning reference portion of the mask 70.
  • the control device 40 processes the captured image to recognize the positioning reference unit of the substrate 90 and the positioning reference unit of the mask 70.
  • the control device 40 adjusts the positions of at least one of the mask 70 and the substrate 90 so as to correct the positional deviation between the two. As a result, the mask 70 and the substrate 90 are positioned.
  • the printing machine WM1, the printing inspection machine WM2, and the management device WMC are communicably connected to each other by the communication unit LC.
  • the substrate 90 on which the solder 80 is printed is conveyed to the printing inspection machine WM2.
  • the printing inspection machine WM2 sequentially inspects the printing state of the solder 80 of the conveyed substrate 90.
  • the printing inspection machine WM2 determines that the printing state is defective, the printing inspection machine WM2 notifies the printing machine WM1.
  • the notification includes information for specifying the position of the target opening 71t, which is the opening 71 for which the defective printing state is determined.
  • the image pickup unit 51 moves the image pickup device FC1 to a position facing the target opening 71t when the substrate holding unit 11 is lowered and the mask 70 and the substrate 90 are separated from each other. Let me. Then, the image pickup unit 51 causes the image pickup device FC1 to take an image of the target opening portion 71t.
  • the inspection result inspected by the printing inspection machine WM2 is stored in the data server DSV.
  • the inspection results indicating poor printing conditions include printing misalignment, bleeding, chipping, blurring, and bridging of the solder 80.
  • the printing misalignment of the solder 80 means a state in which the deviation of the solder 80 printed on the substrate 90 from the target printing position exceeds an allowable range.
  • the bleeding of the solder 80 means a state in which the area of the solder 80 printed on the substrate 90 is larger than the allowable upper limit value.
  • the chipping of the solder 80 means that the area of the solder 80 printed on the substrate 90 is smaller than the allowable lower limit value.
  • the faintness of the solder 80 means that the height of the solder 80 printed on the substrate 90 is lower than the allowable lower limit value.
  • the bridge of the solder 80 refers to a state in which the solder 80 printed at different positions on the substrate 90 is connected.
  • the printing inspection machine WM2 of the present embodiment can measure the printing state of the solder 80 printed on the substrate 90.
  • the measurement result measured by the print inspection machine WM2 is stored in the data server DSV.
  • the measurement result of the printed state includes at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90.
  • the print quality control system 50 acquires the inspection result inspected by the print inspection machine WM2 and the measurement result measured by the print inspection machine WM2 from the data server DSV. be able to. Further, the print quality control system 50 can also directly acquire the above-mentioned inspection results and measurement results from the print inspection machine WM2. Further, the print inspection machine WM2 can also directly transmit the inspection result and the measurement result to the print quality control system 50. In either case, the print quality control system 50 can store the above-mentioned inspection results and measurement results in the storage device 60 shown in FIG.
  • the display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t captured by the image pickup device FC1 (step S15 shown in FIG. 4).
  • the display device 41 may take various forms as long as it can display the image PT0 of the target opening 71t.
  • the display device 41 may be separately provided with a display device for displaying the image PT0 of the target opening 71t, or a display device used for other display may be used.
  • the display device 41 of the present embodiment can display the work status of the printing machine WM1 and the like.
  • the print quality management system 50 of the present embodiment can set the subsequent processing in advance according to the content of the defective printing state determined by the printing inspection machine WM2.
  • the display device 41 is composed of a touch panel and also functions as an input device that accepts various operations by the operator.
  • the operator can display the work phase on the display device 41 by operating the operation unit BP11 to the operation unit BP41 surrounded by the broken line BL1 in FIG.
  • the display device 41 displays the work in the production program creation stage.
  • the display device 41 displays the work in the production stage.
  • the display device 41 displays the work in the tidying up stage.
  • the display device 41 displays the work at the error occurrence stage. Further, the operator can display the work status, the setting screen, etc. in each work phase by operating the operation unit BP22 to the operation unit BP24 surrounded by the broken line BL2, for example.
  • FIG. 5 shows an example of the setting screen.
  • the operator can set the content of the defect in the printing state, the number of pads and the number of substrates on which the defect has occurred, and the subsequent processing.
  • the setting at the top of FIG. 5 indicates that the process shown in process 1 is executed when the defective print state indicated by defect 1 occurs consecutively with the number of pads PD1 and the number of substrates BD1. ..
  • the conditions and processing contents are different, the above can be said for the defects in the printing state indicated by the defects 2 to 4.
  • the contents of the defective printing condition include the above-mentioned inspection results (printing deviation, bleeding, chipping, blurring, bridge, etc. of the solder 80).
  • the worker can select at least one from a plurality of types of inspection results.
  • the operator can input any number of pads and boards.
  • the printing machine WM1 is stopped, the image PT0 of the target opening 71t is displayed, the target opening 71t is manually cleaned, the mask 70 is unclamped during manual cleaning, and the target opening 71t is automatically cleaned. , Manual supply of solder 80, automatic supply of solder 80, and the like.
  • the operator can select any process including at least displaying the image PT0 of the target opening 71t.
  • the process shown in process 1 is the stop of the printing machine WM1 and the display of the image PT0 of the target opening 71t.
  • the control device 40 stops the printing machine WM1.
  • the display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t.
  • FIG. 6 shows an output example of the display device 41.
  • the operator can easily confirm the state of the target opening 71t.
  • FIG. 7 is an enlarged view of a part of the target opening 71t included in the image PT0.
  • the solder 80 is attached to the outer edge of the target opening 71t. If this state is left unattended, bleeding of the solder 80, bridges, and the like are likely to occur.
  • the print quality management system 50 alerts the worker by, for example, having the worker confirm the state of the target opening 71t, and deals with the worker (for example, cleaning of the target opening 71t, etc.). ) Can be urged.
  • the display unit 52 may display the image PT0 of the target opening 71t and the position-related information capable of specifying the position of the target opening 71t in the mask 70 on the display device 41. As a result, the operator can easily know the position of the target opening 71t, and it becomes easy to deal with it.
  • the position-related information is not limited as long as it is information that can specify the position of the target opening 71t in the mask 70.
  • circuit codes and coordinates (coordinates in the X-axis direction and coordinates in the Y-axis direction), which are symbols and numbers that specify elements (components) constituting the circuit, are included in the position-related information.
  • the display unit 52 can display the circuit code in the display area BP61, for example.
  • the image pickup unit 51 can also hold the image pickup device FC1 at a position facing the target opening portion 71t. As a result, the operator can easily know the position of the target opening 71t based on the position of the image pickup apparatus FC1, and it becomes easy to deal with it.
  • the display unit 52 may indicate that the image pickup apparatus FC1 is held at a position facing the target opening portion 71t on the screen shown in FIG.
  • the display unit 52 can display the mask 70 and the target opening 71t schematically represented on the display device 41 to guide the position of the target opening 71t in the mask 70.
  • the display method of the mask 70 and the target opening 71t is not limited.
  • the display unit 52 causes the display device 41 to display the layout image IM0 of the plurality of openings 71 in the mask 70, and if the display color of the target opening 71t is different from that of the other openings 71. Can be made.
  • the target opening 71t is shown in black for convenience of illustration, but the display color of the target opening 71t is preferably, for example, one that calls attention to red, yellow, or the like.
  • the display unit 52 can display the layout image IM0 of the plurality of openings 71 in the mask 70 on the display device 41 and display the target openings 71t in a blinking manner. Further, the display unit 52 can display the layout image IM0 of the plurality of openings 71 in the mask 70 on the display device 41 and display the icon in the vicinity of the target opening 71t.
  • the icon is preferably in a form that calls attention, such as an exclamation mark.
  • the display unit 52 can display the image PT0 of the target opening 71t selected by the operator on the display device 41 when a plurality of target openings 71t exist. As a result, the operator can easily confirm the image PT0 of the desired target opening 71t.
  • the images PT0 in which some of the target openings 71t out of the plurality of target openings 71t are captured are displayed in a predetermined order.
  • the display unit 52 can directly display the image PT0 of the specific target opening 71t on the display device 41 by inputting the position-related information described above by the operator.
  • the display unit 52 can also display the countermeasure process to be executed when a defect in the printing state occurs on the display device 41 so that the operator can select it (step S16 shown in FIG. 4). This makes it easier for the operator to take action as compared to the case where the action is not displayed.
  • the coping process is not limited.
  • the coping process includes at least one of cleaning the target opening 71t and supplying the solder 80.
  • the operator can operate the operation unit BP81 to select at least one coping process from a plurality of coping processes.
  • countermeasure processing such as manual cleaning of the target opening 71t, unclamping of the mask 70 at the time of manual cleaning, automatic cleaning of the target opening 71t, manual supply of the solder 80, and automatic supply of the solder 80 can be selected. It has become.
  • the worker can also specify a cleaning method. Cleaning methods include, for example, dry type, wet type (for example, a method of applying alcohol or the like for cleaning), a combination of dry type and wet type, and a suction type (a method of sucking and cleaning the residue remaining in the target opening 71t). And so on.
  • the display unit 52 of the target opening 71t after cleaning can be compared with the image PT0 of the target opening 71t before cleaning.
  • the image PT1 can also be displayed on the display device 41. Thereby, for example, the operator can easily confirm the effect of cleaning the target opening 71t. Further, the print quality management system 50 can also urge the operator to redo the cleaning when the cleaning of the target opening 71t is insufficient.
  • Pre-processing unit 53 When the measurement result of the print state measured by the print inspection machine WM2 exceeds the preliminary threshold value set more strictly than the inspection threshold when the print inspection machine WM2 determines the defect of the print state, the preprocessing unit 53 determines. , The countermeasure processing to be executed when a defect in the printing state occurs is executed in advance (steps S11 and S12 shown in FIG. 4).
  • the measurement content and coping process measured by the print inspection machine WM2 are not limited.
  • the measurement result of the printed state includes at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90.
  • the coping process includes at least one of cleaning of the opening 71 and supply of the solder 80 in which the measurement result of the printed state exceeds the preliminary threshold value.
  • FIG. 8 shows an example of the setting screen.
  • the operator can set the preliminary threshold value, the number of pads and the number of substrates, and the subsequent processing.
  • the area of the solder 80 printed on the substrate 90 is at least S1 (%) with respect to the target value (100%), the number of pads PD5 and the number of substrates BD5 , Indicates that the coping process shown in the process 5 is executed when the occurrences occur consecutively.
  • the ratio S1 corresponds to a preliminary threshold value, and in this case, the ratio S1 is set to be smaller than the upper limit value (ratio) of the inspection threshold value of the area of the solder 80 printed on the substrate 90.
  • the ratio S2 corresponds to a preliminary threshold value, and in this case, the ratio S2 is set to be larger than the lower limit value (ratio) of the inspection threshold value of the area of the solder 80 printed on the substrate 90.
  • the third-stage setting and the fourth-stage setting from the top are the conditions and processing settings for the volume of the solder 80 printed on the substrate 90, and are the same as the area of the solder 80 printed on the substrate 90. It is set. The same can be said for the measurement contents of other printing states (for example, deviation of the solder 80 printed on the substrate 90 from the target printing position).
  • the operator can input any number of pads and boards. Further, in the processes (countermeasure processes) that can be input in the processes 5 to 8, the manual cleaning of the opening 71 whose print state measurement result exceeds the preliminary threshold value, the unclamping of the mask 70 at the time of manual cleaning, and the opening. The automatic cleaning of the part 71, the manual supply of the solder 80, the automatic supply of the solder 80, and the like are included.
  • the processes (countermeasure processes) that can be input in the processes 5 to 8 may include stopping the printing machine WM1, displaying an image of the opening 71, and the like.
  • the processes shown in processes 5 and 6 are automatic cleaning of the opening 71 in which the measurement result of the printed state exceeds the preliminary threshold value.
  • the area of the solder 80 printed on the substrate 90 is not determined to be defective by the printing inspection machine WM2, but the predetermined number of pads and the predetermined number of substrates are in a state where the preliminary threshold value set more strictly than the inspection threshold value is exceeded.
  • the preprocessing unit 53 causes the printing machine WM1 to perform automatic cleaning.
  • the print quality control system 50 of the present embodiment includes the pre-processing unit 53, it is possible to execute the countermeasure processing before the printing inspection machine WM2 determines that the printing state is defective. Therefore, the print quality management system 50 can reduce the number of defects in which the printing inspection machine WM2 determines that the printing state is defective, as compared with the case where the countermeasure processing is not performed in advance. If the preparatory measures are insufficient, the print inspection machine WM2 determines that the print state is defective, and the image pickup unit 51 and the display unit 52 described above control the print state.
  • the print inspection machine WM2 determines that the print state is defective. After that, the image pickup unit 51 causes the image pickup device FC1 to image the target opening 71t, and the display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t.
  • the printing inspection machine WM2 determines the printing condition defect by performing the countermeasure processing to be executed in advance when the printing condition defect occurs.
  • the second print quality management system 500 includes the pre-processing unit 53 described above as an indispensable component. As a result, the second print quality management system 500 can execute the coping process before the printing inspection machine WM2 determines that the printing state is defective, and the defect occurs as compared with the case where the coping process is not performed. The number of cases can be reduced.
  • the measurement content and the coping process measured by the print inspection machine WM2 are not limited.
  • the measurement result of the printed state includes at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90.
  • the coping process includes at least one of cleaning of the opening 71 and supply of the solder 80 in which the measurement result of the printed state exceeds the preliminary threshold value.
  • the second print quality control system 500 can also include the image pickup unit 51 and the display unit 52 described above. The image pickup unit 51 and the display unit 52 may be in any of the above-described forms. Overlapping description is omitted herein.
  • the first print quality control method includes an imaging process and a display process.
  • the imaging step corresponds to the control performed by the imaging unit 51.
  • the display process corresponds to the control performed by the display unit 52.
  • the first print quality control method may also include a pretreatment step.
  • the pretreatment step corresponds to the control performed by the pretreatment unit 53.
  • the second print quality control method includes a pretreatment process.
  • the pretreatment step corresponds to the control performed by the pretreatment unit 53.
  • the second print quality control method can also include an imaging step and a display step.
  • the imaging step corresponds to the control performed by the imaging unit 51.
  • the display process corresponds to the control performed by the display unit 52.
  • an image pickup unit 51 and a display unit 52 are provided.
  • the print quality management system 50 can display the image PT0 of the target opening 71t imaged by the image pickup device FC1 on the display device 41. Therefore, for example, the operator can confirm the state of the target opening 71t.
  • the above-mentioned matters regarding the print quality control system 50 can be applied to the print quality control method as well.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Le présent système de gestion de qualité d'impression comprend une unité d'imagerie et une unité d'affichage. Lorsqu'une machine d'inspection d'impression, qui sert à vérifier l'état d'impression de soudures imprimées sur un substrat par une machine d'impression qui imprime des soudures sur le substrat à travers des ouvertures d'un masque tandis qu'une raclette est glissée sur le masque, détermine un état d'impression défectueux, l'unité d'imagerie amène un dispositif d'imagerie à capturer une image d'une ouverture cible où l'état d'impression défectueux a été trouvé. L'unité d'affichage amène l'image de l'ouverture cible capturée par le dispositif d'imagerie à être affichée sur un dispositif d'affichage.
PCT/JP2020/029338 2020-07-30 2020-07-30 Système de gestion de qualité d'impression et procédé de gestion de qualité d'impression WO2022024326A1 (fr)

Priority Applications (5)

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JP2022539924A JP7458488B2 (ja) 2020-07-30 2020-07-30 印刷品質管理システムおよび印刷品質管理方法
DE112020007473.0T DE112020007473T5 (de) 2020-07-30 2020-07-30 Druckqualitätskontrollsystem und Druckqualitätskontrollverfahren
CN202080102111.7A CN115734878A (zh) 2020-07-30 2020-07-30 印刷品质管理系统及印刷品质管理方法
PCT/JP2020/029338 WO2022024326A1 (fr) 2020-07-30 2020-07-30 Système de gestion de qualité d'impression et procédé de gestion de qualité d'impression
JP2024042603A JP2024069552A (ja) 2020-07-30 2024-03-18 印刷品質管理システムおよび印刷品質管理方法

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WO2022024326A1 true WO2022024326A1 (fr) 2022-02-03

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JP2005156283A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Ind Co Ltd 半田検査装置および半田検査方法
WO2008081430A2 (fr) * 2006-12-28 2008-07-10 G-Pro G-T Ltd. Imprimantes à stencil et similaires, leurs systèmes optiques et procédés d'impression et d'inspection
JP2008298463A (ja) * 2007-05-29 2008-12-11 Pioneer Electronic Corp 印刷マスクの印刷検査装置、及び印刷マスクの印刷検査方法
JP4910880B2 (ja) * 2007-05-22 2012-04-04 パナソニック株式会社 スクリーン印刷方法
JP2020088296A (ja) * 2018-11-30 2020-06-04 パナソニックＩｐマネジメント株式会社 印刷システムおよび印刷方法

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Publication number Priority date Publication date Assignee Title
JP2004058298A (ja) 2002-07-25 2004-02-26 Matsushita Electric Ind Co Ltd 印刷検査装置および印刷検査方法
JP4735593B2 (ja) 2007-04-12 2011-07-27 パナソニック株式会社 印刷検査装置および印刷検査方法
JP4743172B2 (ja) 2007-06-26 2011-08-10 パナソニック株式会社 半田検査方法
JP6063483B2 (ja) 2012-12-28 2017-01-18 富士機械製造株式会社 スクリーン印刷機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005156283A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Ind Co Ltd 半田検査装置および半田検査方法
WO2008081430A2 (fr) * 2006-12-28 2008-07-10 G-Pro G-T Ltd. Imprimantes à stencil et similaires, leurs systèmes optiques et procédés d'impression et d'inspection
JP4910880B2 (ja) * 2007-05-22 2012-04-04 パナソニック株式会社 スクリーン印刷方法
JP2008298463A (ja) * 2007-05-29 2008-12-11 Pioneer Electronic Corp 印刷マスクの印刷検査装置、及び印刷マスクの印刷検査方法
JP2020088296A (ja) * 2018-11-30 2020-06-04 パナソニックＩｐマネジメント株式会社 印刷システムおよび印刷方法

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JPWO2022024326A1 (fr) 2022-02-03
CN115734878A (zh) 2023-03-03
JP7458488B2 (ja) 2024-03-29
DE112020007473T5 (de) 2023-05-11

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