WO2022019087A1 - 印刷土台 - Google Patents

印刷土台 Download PDF

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Publication number
WO2022019087A1
WO2022019087A1 PCT/JP2021/025098 JP2021025098W WO2022019087A1 WO 2022019087 A1 WO2022019087 A1 WO 2022019087A1 JP 2021025098 W JP2021025098 W JP 2021025098W WO 2022019087 A1 WO2022019087 A1 WO 2022019087A1
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WO
WIPO (PCT)
Prior art keywords
printing
support portion
functional layer
ink
resin particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/025098
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English (en)
French (fr)
Japanese (ja)
Inventor
角田竜規
平尾尚大
堺学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022538672A priority Critical patent/JP7464127B2/ja
Priority to CN202180045660.XA priority patent/CN115943471B/zh
Publication of WO2022019087A1 publication Critical patent/WO2022019087A1/ja
Priority to US18/097,612 priority patent/US12522743B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Definitions

  • the present invention relates to a printing base that serves as a base when printing with ink.
  • a method of manufacturing a ceramic electronic component such as a multilayer ceramic capacitor by printing using a 3D printer is known. If the ink bleeds during this printing, it becomes impossible to produce a ceramic electronic component having a desired shape.
  • Patent Document 1 In order to suppress such ink bleeding, in Patent Document 1, a PVA (polyvinyl alcohol) aqueous solution is applied to the surface of a ceramic green sheet to form a PVA layer, and an aqueous solution in which the solvent is water is formed. A method of printing with ink is described. According to this printing method, it is said that the water-based ink reacts with the resin in the PVA layer to gel, thereby suppressing the bleeding of the ink.
  • PVA polyvinyl alcohol
  • Patent Document 1 exhibits an effect of suppressing ink bleeding when a water-based ink is used, but when a solvent-based ink in which the solvent is an organic solvent is used, a gelation reaction is exhibited. Does not occur, and the effect of suppressing ink bleeding is not exhibited.
  • the present invention solves the above problems, and provides a technique capable of suppressing ink bleeding when not only water-based ink but also solvent-based ink is used as the ink used for printing.
  • the purpose is a technique capable of suppressing ink bleeding when not only water-based ink but also solvent-based ink is used as the ink used for printing.
  • the printing base of the present invention is A support part that is a porous structure and A functional layer provided in contact with the support portion and containing a plurality of resin particles whose surface is at least partially covered with polyvinyl alcohol. It is characterized by having.
  • the solvent of the ink is sucked between the resin particles in the functional layer and into the support portion which is a porous structure. Therefore, bleeding can be suppressed regardless of whether the ink is a water-based ink or a solvent-based ink.
  • the printing base of the present invention serves as a base for printing with ink on the printing base.
  • Printing can be done by any method to produce anything.
  • a ceramic electronic component such as a multilayer ceramic capacitor is manufactured on the printing base of the present invention by printing using a 3D printer.
  • ink for a dielectric layer, ink for an internal electrode, ink for an external electrode, and the like are prepared as inks used for printing.
  • FIG. 1 is a side view schematically showing the structure of the printing base 10 according to the embodiment of the present invention.
  • the printing base 10 in one embodiment is provided in contact with the support portion 1 which is a porous structure and the support portion 1, and at least a part of the surface thereof is covered with polyvinyl alcohol (hereinafter referred to as PVA) 22.
  • PVA polyvinyl alcohol
  • the functional layer 2 containing the resin particles 21 of the above is provided.
  • the support portion 1 is a porous structure having a plurality of holes inside or on the surface, and is, for example, a calcined sheath.
  • the support portion 1 is made of, for example, a material containing aluminum oxide as a main component, whose chemical formula is represented by Al 2 O 3.
  • the support portion 1 is made of a material mainly composed of mullite represented by the chemical formula 3Al 2 O 3 ⁇ 2SiO 2.
  • Mullite is a compound of aluminum oxide (Al 2 O 3 ) and silicon dioxide (SiO 2).
  • the support portion 1 is made of a material mainly composed of cordierite having the formula of 2MgO ⁇ 2Al 2 O 3 ⁇ 5SiO 2.
  • Codylite is a compound of magnesium oxide (MgO), aluminum oxide (Al 2 O 3 ) and silicon dioxide (SiO 2).
  • the support portion 1 may contain an amount of subcomponents and impurities whose characteristics do not change.
  • the plurality of resin particles 21 constituting the functional layer 2 include resin particles whose entire surface is covered with PVA22 and resin particles whose surface is partially covered with PVA22. included.
  • the functional layer 2 may contain resin particles whose surface is not covered with PVA22.
  • FIG. 2 shows a photograph of the functional layer 2 when observed with a scanning electron microscope (SEM).
  • the shape of the resin particles 21 is spherical as shown in FIG.
  • the sphere here has distortion and dents, it also includes a shape that is regarded as a sphere as a whole.
  • the shape of the resin particles 21 is not limited to a spherical shape.
  • the shape of the resin particles 21 may be a spheroid (see FIG. 3A) obtained by rotating the ellipse with a major axis or a minor axis as a rotation axis, or a rectangular parallelepiped (see FIG. 3B). It may be a triangular pyramid (see FIG. 3 (c)), a square pyramid (see FIG. 3 (d)), a cylinder (see FIG. 3 (e)), or a cone (see FIG. 3 (e)). It may have an irregular shape (see f)) or an irregular shape (see FIG. 3 (g)). That is, there are no particular restrictions on the shape of the resin particles 21.
  • the resin particles 21 are made of, for example, an acrylic resin, a cellulose resin, a polyvinyl butyral resin, or the like.
  • the resin particles 21 are acrylic resins such as methyl methacrylate / ethylene glycol dimethacrylate copolymer ( ⁇ CH 2 C (CH 3 ) COOCH 3 ⁇ m ⁇ ⁇ CH 2 C (CH 3 ) COOCH 2 CH 2 OOC. It consists of (CH 3 ) CCH 2 ⁇ n).
  • PVA22 may contain impurities such as methanol and methyl acetate, for example.
  • the resin particles 21 in the functional layer 2 are connected to the adjacent resin particles 21 by the PVA 22 covering the surface thereof.
  • the average particle size of the resin particles 21 is, for example, 1 ⁇ m.
  • the thickness of the functional layer 2 in the stacking direction of the support portion 1 and the functional layer 2 is, for example, 10 ⁇ m.
  • the particle size of the solid content of the ink printed on the printing base 10, more specifically, on the functional layer 2, is, for example, 100 nm or more and 500 nm or less.
  • the ink solvent is sucked between the resin particles 21 in the functional layer 2 and into the support portion 1 which is a porous structure. Therefore, regardless of whether the ink is a water-based ink or a solvent-based ink, it is possible to suppress ink bleeding when an ink containing a solvent is used.
  • an unfired ceramic element is produced by printing on a printing stage, and then the unfired ceramic element is peeled off from the printing stage and replaced with a fired pod.
  • an intermediate material such as inkjet paper is placed on the printing stage and printing is performed on the intermediate to produce an unfired ceramic element, and then the inkjet paper is formed together with the unfired ceramic element. It was remounted on the calcined pod. After that, the firing pods were placed in a firing furnace and fired to obtain ceramic electronic components.
  • the printing base 10 in one embodiment when the printing base 10 in one embodiment is used, printing is performed on the printing base 10 to produce an unfired ceramic element, and then the printing base 10 is placed in a firing furnace. Ceramic electronic parts can be obtained by firing. Therefore, since it is not necessary to replace the unfired ceramic prime field which is a printed matter, the manufacturing process can be simplified and the manufacturing time can be shortened.
  • FIG. 4 is a flowchart for explaining an example of the manufacturing method of the printing base 10 in one embodiment.
  • step S1 impurities are removed by baking the prepared support portion 1 in the air.
  • the baking is performed at 950 ° C. for 3 hours, for example.
  • step S2 following step S1 PVA is dissolved in water to prepare a PVA solution.
  • step S3 resin particles are added to the PVA solution.
  • the ratio of the PVA solution to the resin particles is, for example, 1: 1 by volume.
  • step S4 following step S3, the resin particles are dispersed by stirring the PVA solution containing the resin particles.
  • a stirrer "ARE-500” manufactured by Shinky Co., Ltd. is used for stirring under the conditions of a rotation speed of 1000 rpm and a stirring time of 10 minutes.
  • step S5 following step S4, the calcined pod is immersed in the PVA solution.
  • the time for immersing the calcined pod is, for example, 2 seconds to 3 seconds.
  • step S6 the calcined pod is pulled up from the PVA solution and waits for about 20 seconds so that the PVA solution does not drip naturally.
  • step S7 following step S6, after wiping off the drops of the PVA solution adhering to the lower part of the calcined pod with a waste cloth or the like, it is left standing as it is and dried.
  • the printing base 10 in which the functional layer 2 is formed on the surface of the support portion 1 can be obtained.
  • the functional layer 2 is formed on the surface of the support portion 1 by immersing the calcined sheath which is the support portion 1 in the PVA solution containing the resin particles.
  • the method of forming the functional layer 2 is not limited to the dipping method.
  • the PVA solution containing the resin particles may be printed on the surface of the support portion 1 by a method such as inkjet printing, dispenser printing, spray printing, screen printing, or gravure printing.
  • Example 1 A plurality of printing bases 10 having different thicknesses of the functional layer 2 were prepared, and their characteristics were investigated.
  • five types of printing bases 10 having different thicknesses of the functional layer 2 of 1 ⁇ m, 5 ⁇ m, 10 ⁇ m, 30 ⁇ m, and 100 ⁇ m are prepared, and ink bleeding, ink intrusion into the support portion 1, and solid components of the ink are penetrated into the support portion 1. , The peeling of the printed matter on the functional layer 2 was investigated.
  • the five types of printing bases 10 are the printing bases 10 of the present invention including the support portion 1 and the functional layer 2. Table 1 shows the characteristics of the five types of printing bases 10.
  • the printed matter on the functional layer 2 with less peeling is indicated by “ ⁇ ” which means “good", and the printed matter with particularly little peeling is “best”. It is indicated by “ ⁇ ” which means ".”
  • the thickness of the functional layer 2 is preferably 5 ⁇ m or more.
  • the thickness of the functional layer 2 is preferably 5 ⁇ m or more.
  • the resin particles 21 remain as soot. Further, the solid component of the ink that has entered the functional layer 2 is present in the soot. Therefore, by discarding the soot, the solid component of the ink can also be discarded.
  • Example 2 A plurality of printing bases 10 having different average particle sizes of the resin particles 21 contained in the functional layer 2 were prepared, and their characteristics were investigated.
  • five types of printing bases 10 are prepared in which the shape of the resin particles 21 is spherical and the average particle size is 0.8 ⁇ m, 1 ⁇ m, 1.8 ⁇ m, 5 ⁇ m, and 10 ⁇ m, respectively, and ink bleeding is performed. The intrusion of the solid component of the ink into the support portion 1 and the peeling of the printed matter on the functional layer 2 were investigated.
  • the five types of printing bases 10 are the printing bases 10 of the present invention including the support portion 1 and the functional layer 2. Table 2 shows the characteristics of the five types of printing bases 10. In Table 2, the meanings of “ ⁇ ” and “ ⁇ ” in the evaluation results are the same as in Table 1.
  • the average particle size of the resin particles 21 in the functional layer 2 is preferably 1.8 ⁇ m or less.
  • the average particle size of the resin particles 21 is 1 ⁇ m or more, the peeling of the printed matter is particularly small. Therefore, in order to further suppress the peeling of the printed matter, the average particle size of the resin particles 21 should be 1 ⁇ m or more. Is preferable.
  • Example 3 A plurality of printing bases 10 having different types of resin particles 21 contained in the functional layer 2 were prepared, and their characteristics were investigated.
  • the resin of the resin particles 21 three types of resins using a cellulose resin, polymethyl methacrylate ( ⁇ CH 2 C (CH 3 ) COOCH 3 ⁇ n ), and a methyl methacrylate / ethylene glycol dimethacrylate copolymer are used, respectively.
  • a printing base 10 was prepared, and the presence or absence of residue, low temperature reaction, burnout property of the functional layer 2 at 500 ° C., and non-defective rate were examined.
  • polymethyl methacrylate was used as an example of an acrylic resin other than the methyl methacrylate / ethylene glycol dimethacrylate copolymer.
  • acrylic resin other than the methyl methacrylate / ethylene glycol dimethacrylate copolymer a crosslinked alkyl acrylate copolymer, a methacrylic acid ester polymer, or the like can be used.
  • the three types of printing bases 10 are the printing bases 10 of the present invention including the support portion 1 and the functional layer 2. Table 3 shows the characteristics of the three types of printing bases 10.
  • the residue is what remains after firing and causes unnecessary foreign matter, so it is better to have less residue.
  • Table 3 those having a residue but being usable are indicated by “ ⁇ ”, and those having a small amount of residue and being able to be used stably are indicated by “ ⁇ ”.
  • the three types of printing bases 10 having different types of resin particles 21 can be used, although the residue is present.
  • the resin particles 21 are made of a methyl methacrylate / ethylene glycol dimethacrylate copolymer, the amount of residue is particularly small. Therefore, in order to reduce the residue after firing, it is preferable that the resin particles 21 are made of a methyl methacrylate / ethylene glycol dimethacrylate copolymer.
  • a reaction occurs in which the weight rapidly decreases when the temperature rises to about 280 ° C.
  • this reaction is called a low temperature reaction. If the low temperature reaction is poor in the degreasing process at the time of manufacturing the ceramic electronic component, the shrinkage of the ceramic electronic component may be hindered, which may lead to defects such as cracking. Therefore, it is preferable that the low temperature reaction is good.
  • Table 3 although the degree of low temperature reaction varies, those that can be used without inhibiting the shrinkage of ceramic electronic components are marked with " ⁇ ", and those that can be used quickly and stably are marked with " ⁇ ". It was shown by.
  • the three types of printing bases 10 having different types of resin particles 21 can be used, although some of them have variations in the degree of low temperature reaction.
  • the resin particles 21 are made of polymethyl methacrylate and the methyl methacrylate / ethylene glycol dimethacrylate copolymer, it has been confirmed that the low temperature reaction is good and stable use is possible. .. Since polymethylmethacrylate and methylethylene glycol dimethacrylate copolymer are a kind of acrylic resin, the resin particles 21 are acrylic when the low temperature reaction in the degreasing step at the time of manufacturing ceramic electronic parts is emphasized. It is preferably made of resin.
  • firing is performed at a temperature of 500 ° C. or higher. If the functional layer 2 is not burnt out during firing at 500 ° C., the shrinkage of the ceramic electronic component is hindered, which may lead to defects such as cracking.
  • Table 3 when the functional layer 2 is heated to 500 ° C., the burnability of the functional layer 2 varies, but the ones that can be used without inhibiting the shrinkage of the ceramic electronic components are marked with “ ⁇ ”, and the burnability is high and stable. Those that can be used are indicated by " ⁇ ".
  • the three types of printing bases 10 having different types of resin particles 21 can be used, although some of them have variations in the burnability of the functional layer 2.
  • the resin particles 21 are made of polymethyl methacrylate or a methyl methacrylate / ethylene glycol dimethacrylate copolymer
  • the functional layer 2 has high burnout property and can be used stably.
  • polymethylmethacrylate and methylethylene glycol dimethacrylate copolymer are a kind of acrylic resin, if the burning property of the functional layer 2 in the firing process at the time of manufacturing ceramic electronic parts is important, the resin is used. It is preferable that the particles 21 are made of acrylic resin.
  • the non-defective product rate represents the non-defective product rate of printed matter formed on the printing base 10 by printing with ink, and is the ratio of non-defective products without defects such as cracks out of a predetermined number (for example, 30 pieces). show.
  • a predetermined number for example, 30 pieces.
  • the resin particles 21 are made of polymethyl methacrylate and the methyl methacrylate / ethylene glycol dimethacrylate copolymer, it has been confirmed that the non-defective rate is high and stable use is possible. .. Since the polymethyl methacrylate and the methylethylene glycol dimethacrylate copolymer are a kind of acrylic resin, it is preferable that the resin particles 21 are made of an acrylic resin in order to further improve the non-defective rate of printed matter.
  • Example 4 A plurality of printing bases 10 having different types of support portions 1 were prepared, and their characteristics were investigated.
  • those supporting portion 1 which is a porous structure of Al 2 O 3, made of Al 2 O 3 and SiO 2 compound, Al 2 O 3 and 3 types although made of SiO 2 and MgO compounds
  • the printing base 10 is prepared, and the bleeding of the ink, the intrusion of the solid component of the ink into the support portion 1, the peeling of the printed matter on the functional layer 2, the good quality rate of the printed matter, the reusability of the printed matter 10, and the printed matter.
  • the three types of printing bases 10 are the printing bases 10 of the present invention including the support portion 1 and the functional layer 2. Table 4 shows the characteristics of the three types of printing bases 10.
  • the support portion 1 made of Al 2 O 3 may contain an auxiliary component.
  • the support portion 1 may contain a sub-component in a compound of Al 2 O 3 and SiO 2 , or a sub-component in a compound of Al 2 O 3 and SiO 2 and Mg O. It may be.
  • the evaluation method for ink bleeding, ink intrusion into the support portion 1 of the solid component, and peeling of the printed matter on the functional layer 2 is the same as in Table 1.
  • the method for evaluating the non-defective rate of printed matter is the same as in Table 3.
  • the reusability of the printing base 10 is that the printing base 10 is less deformed, there is no foreign matter such as a solid component of ink in the support portion 1, or a substance that repels ink is attached to the surface of the support portion 1. Judgment was made based on criteria such as whether or not there was any.
  • those that can be reused are indicated by " ⁇ ”
  • those that have particularly little deformation of the printing base 10 and have particularly high reusability are indicated by " ⁇ ”.
  • As for the quick-drying property of the printed matter those in which the ink of the printed matter dries quickly are indicated by " ⁇ ", and those in which the ink dries particularly quickly are indicated by " ⁇ ".
  • the support portion 1 in order to further reduce the bleeding of the ink, or the support unit 1 comprises a compound of Al 2 O 3 and SiO 2, or, Al 2 O 3 and SiO 2 and MgO It preferably contains a compound.
  • the support portion 1 when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 , and when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 and Mg O, the peeling of the printed matter is particularly small. Therefore, in order to further suppress the peeling of the printed material, or the support unit 1 comprises a Al 2 O 3 and SiO 2 compounds, or, preferably contains Al 2 O 3 and SiO 2 and MgO compounds.
  • the support portion 1 when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 , and when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 and Mg O, it was confirmed that the non-defective rate of the printed matter is particularly high. .. Therefore, in order to improve the yield rate of the printed material, or the support unit 1 comprises a Al 2 O 3 and SiO 2 compounds, or, preferably contains Al 2 O 3 and SiO 2 and MgO compounds. When the support portion 1 contains a compound of Al 2 O 3 and SiO 2 and Mg O, it is considered that the coefficient of thermal expansion is low, so that the influence on the printed matter at the time of firing is small and the non-defective product rate is further increased.
  • the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 and when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 and Mg O. Therefore, in order to improve the reusability of the printing base 10, or the support unit 1 comprises a compound of Al 2 O 3 and SiO 2, or comprises Al 2 O 3 and SiO 2 and MgO compounds Is preferable.
  • the support portion 1 contains a compound of Al 2 O 3 and SiO 2 , it is considered that the support portion 1 has high heat resistance, so that deformation is suppressed during firing and the reusability is particularly high. Further, when the support portion 1 is made of a compound of Al 2 O 3 and SiO 2 and Mg O, it is considered that the mechanical strength and thermal impact resistance are high, so that deformation is suppressed during firing and the reusability is particularly high. ..
  • the support portion 1 contains a compound of Al 2 O 3 and SiO 2 and Mg O.
  • the printing base 10 of the present invention when printing is performed a plurality of times on the printing base 10 to manufacture a product having a multi-layer structure, it is necessary to print one layer and dry it, and then print the next layer.
  • the printing base 10 of the present invention the printed matter has a high quick-drying property, so that the time until the next layer is printed can be shortened, and the manufacturing time of the multi-layered product can be shortened. can.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
PCT/JP2021/025098 2020-07-22 2021-07-02 印刷土台 Ceased WO2022019087A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022538672A JP7464127B2 (ja) 2020-07-22 2021-07-02 印刷土台
CN202180045660.XA CN115943471B (zh) 2020-07-22 2021-07-02 印刷基座
US18/097,612 US12522743B2 (en) 2020-07-22 2023-01-17 Printing foundation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-125003 2020-07-22
JP2020125003 2020-07-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/097,612 Continuation US12522743B2 (en) 2020-07-22 2023-01-17 Printing foundation

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WO2022019087A1 true WO2022019087A1 (ja) 2022-01-27

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US (1) US12522743B2 (https=)
JP (1) JP7464127B2 (https=)
CN (1) CN115943471B (https=)
WO (1) WO2022019087A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025211364A1 (ja) * 2024-04-05 2025-10-09 株式会社村田製作所 電子部品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) * 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) * 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) * 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) * 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) * 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300801B2 (ja) 2001-04-20 2009-07-22 パナソニック株式会社 下地材、インキ及びそれを用いた電子部品の製造方法
JP2013120864A (ja) * 2011-12-08 2013-06-17 Showa Denko Kk 導体パターン形成方法および導体パターンを備える基板
JP2020032597A (ja) * 2018-08-29 2020-03-05 理想科学工業株式会社 印刷物の製造方法
JP6744672B1 (ja) * 2019-05-20 2020-08-19 株式会社Ｔｂｍ 印刷用シート及び印刷用シートの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) * 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) * 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) * 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) * 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) * 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Cited By (1)

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