JPWO2022019087A1 - - Google Patents

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Publication number
JPWO2022019087A1
JPWO2022019087A1 JP2022538672A JP2022538672A JPWO2022019087A1 JP WO2022019087 A1 JPWO2022019087 A1 JP WO2022019087A1 JP 2022538672 A JP2022538672 A JP 2022538672A JP 2022538672 A JP2022538672 A JP 2022538672A JP WO2022019087 A1 JPWO2022019087 A1 JP WO2022019087A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022538672A
Other languages
Japanese (ja)
Other versions
JPWO2022019087A5 (https=
JP7464127B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2022019087A1 publication Critical patent/JPWO2022019087A1/ja
Publication of JPWO2022019087A5 publication Critical patent/JPWO2022019087A5/ja
Application granted granted Critical
Publication of JP7464127B2 publication Critical patent/JP7464127B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
JP2022538672A 2020-07-22 2021-07-02 印刷土台 Active JP7464127B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020125003 2020-07-22
JP2020125003 2020-07-22
PCT/JP2021/025098 WO2022019087A1 (ja) 2020-07-22 2021-07-02 印刷土台

Publications (3)

Publication Number Publication Date
JPWO2022019087A1 true JPWO2022019087A1 (https=) 2022-01-27
JPWO2022019087A5 JPWO2022019087A5 (https=) 2023-02-16
JP7464127B2 JP7464127B2 (ja) 2024-04-09

Family

ID=79729717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538672A Active JP7464127B2 (ja) 2020-07-22 2021-07-02 印刷土台

Country Status (4)

Country Link
US (1) US12522743B2 (https=)
JP (1) JP7464127B2 (https=)
CN (1) CN115943471B (https=)
WO (1) WO2022019087A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025211364A1 (ja) * 2024-04-05 2025-10-09 株式会社村田製作所 電子部品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) * 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) * 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) * 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) * 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) * 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300801B2 (ja) 2001-04-20 2009-07-22 パナソニック株式会社 下地材、インキ及びそれを用いた電子部品の製造方法
JP2013120864A (ja) * 2011-12-08 2013-06-17 Showa Denko Kk 導体パターン形成方法および導体パターンを備える基板
JP2020032597A (ja) * 2018-08-29 2020-03-05 理想科学工業株式会社 印刷物の製造方法
JP6744672B1 (ja) * 2019-05-20 2020-08-19 株式会社Ｔｂｍ 印刷用シート及び印刷用シートの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) * 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) * 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) * 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) * 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) * 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Also Published As

Publication number Publication date
WO2022019087A1 (ja) 2022-01-27
CN115943471A (zh) 2023-04-07
US20230151240A1 (en) 2023-05-18
JP7464127B2 (ja) 2024-04-09
US12522743B2 (en) 2026-01-13
CN115943471B (zh) 2025-04-18

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