JP7464127B2 - 印刷土台 - Google Patents

印刷土台 Download PDF

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Publication number
JP7464127B2
JP7464127B2 JP2022538672A JP2022538672A JP7464127B2 JP 7464127 B2 JP7464127 B2 JP 7464127B2 JP 2022538672 A JP2022538672 A JP 2022538672A JP 2022538672 A JP2022538672 A JP 2022538672A JP 7464127 B2 JP7464127 B2 JP 7464127B2
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JP
Japan
Prior art keywords
printing
functional layer
resin particles
ink
support part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022538672A
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English (en)
Japanese (ja)
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JPWO2022019087A5 (https=
JPWO2022019087A1 (https=
Inventor
竜規 角田
尚大 平尾
学 堺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022019087A1 publication Critical patent/JPWO2022019087A1/ja
Publication of JPWO2022019087A5 publication Critical patent/JPWO2022019087A5/ja
Application granted granted Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
JP2022538672A 2020-07-22 2021-07-02 印刷土台 Active JP7464127B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020125003 2020-07-22
JP2020125003 2020-07-22
PCT/JP2021/025098 WO2022019087A1 (ja) 2020-07-22 2021-07-02 印刷土台

Publications (3)

Publication Number Publication Date
JPWO2022019087A1 JPWO2022019087A1 (https=) 2022-01-27
JPWO2022019087A5 JPWO2022019087A5 (https=) 2023-02-16
JP7464127B2 true JP7464127B2 (ja) 2024-04-09

Family

ID=79729717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538672A Active JP7464127B2 (ja) 2020-07-22 2021-07-02 印刷土台

Country Status (4)

Country Link
US (1) US12522743B2 (https=)
JP (1) JP7464127B2 (https=)
CN (1) CN115943471B (https=)
WO (1) WO2022019087A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025211364A1 (ja) * 2024-04-05 2025-10-09 株式会社村田製作所 電子部品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300801B2 (ja) 2001-04-20 2009-07-22 パナソニック株式会社 下地材、インキ及びそれを用いた電子部品の製造方法
JP2013120864A (ja) * 2011-12-08 2013-06-17 Showa Denko Kk 導体パターン形成方法および導体パターンを備える基板
JP2020032597A (ja) * 2018-08-29 2020-03-05 理想科学工業株式会社 印刷物の製造方法
JP6744672B1 (ja) * 2019-05-20 2020-08-19 株式会社Ｔｂｍ 印刷用シート及び印刷用シートの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067952A (ja) 2012-09-27 2014-04-17 Mitsubishi Paper Mills Ltd 導電性パターン形成用基材および導電性部材
WO2014142008A1 (ja) 2013-03-12 2014-09-18 Dic株式会社 高精細金属パターンの形成方法、高精細金属パターン及び電子部品
JP2018137325A (ja) 2017-02-21 2018-08-30 Tdk株式会社 積層型電子部品の製造方法
JP2019106400A (ja) 2017-12-08 2019-06-27 キヤノンファインテックニスカ株式会社 電子デバイス用の基板、電子デバイス、および電子デバイスの製造方法
JP2019149414A (ja) 2018-02-26 2019-09-05 Tdk株式会社 積層型電子部品の製造方法

Also Published As

Publication number Publication date
WO2022019087A1 (ja) 2022-01-27
CN115943471A (zh) 2023-04-07
US20230151240A1 (en) 2023-05-18
US12522743B2 (en) 2026-01-13
JPWO2022019087A1 (https=) 2022-01-27
CN115943471B (zh) 2025-04-18

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