WO2022006789A1 - 一种复合电路板的制备方法 - Google Patents

一种复合电路板的制备方法 Download PDF

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WO2022006789A1
WO2022006789A1 PCT/CN2020/100922 CN2020100922W WO2022006789A1 WO 2022006789 A1 WO2022006789 A1 WO 2022006789A1 CN 2020100922 W CN2020100922 W CN 2020100922W WO 2022006789 A1 WO2022006789 A1 WO 2022006789A1
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circuit board
conductive ink
preparing
composite circuit
laser
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PCT/CN2020/100922
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English (en)
French (fr)
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王成勇
刘志华
郭紫莹
姚俊雄
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广东工业大学
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Priority to PCT/CN2020/100922 priority Critical patent/WO2022006789A1/zh
Publication of WO2022006789A1 publication Critical patent/WO2022006789A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the invention relates to the technical field of circuit boards, in particular to a preparation method of a composite circuit board.
  • circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board Thin circuit boards, printed (copper etching technology) circuit boards, etc.
  • the circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.
  • the circuit board can be called a printed circuit board or a printed circuit board, the English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board (FPC circuit board is also called flexible circuit board Flexible circuit board is based on polyimide Or polyester film as the base material is a highly reliable, excellent flexible printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness and good bending.) and soft and hard Combination plate (reechas, Soft and hard combination plate) - The birth and development of FPC and PCB gave birth to the new product of soft and hard combination plate.
  • the rigid-flex board is a flexible circuit board and a rigid circuit board, which are combined according to the relevant process requirements through lamination and other processes to form a circuit board with FPC characteristics and PCB characteristics; 3D printing usually uses digital technology materials. printer to achieve. It is often used to make models in the fields of mold making, industrial design, etc., and then gradually used for the direct manufacturing of some products. There are already parts printed using this technology.
  • the technology has applications in jewelry, footwear, industrial design, architecture, engineering and construction (AEC), automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, firearms, and more.
  • the purpose of the present invention is to avoid the deficiencies in the prior art and provide a method for preparing a composite circuit board, which not only simplifies the production process, saves the production time, but also improves the composite circuit board.
  • the bonding strength between materials and layers of layer materials is to avoid the deficiencies in the prior art and provide a method for preparing a composite circuit board, which not only simplifies the production process, saves the production time, but also improves the composite circuit board.
  • a preparation method of a composite circuit board comprising the following steps:
  • the insulating plate is any one of PP, PPO, PTFE, and POM plates.
  • the laser is an ultra-short pulse picosecond laser.
  • step (2) the path of the laser engraving is consistent with the circuit arrangement of the layer.
  • the conductive ink is any one of liquid nano-silver material, copper wire material, gold wire material, and silver wire material.
  • step (3) the moving path of the extrusion device is consistent with the circuit arrangement of the layer.
  • step (4) the solidification mode is cooling.
  • the circuit is drawn on the insulating sheet by laser or mechanical processing, and then the conductive ink is applied layer by layer using an extrusion device, and finally the circuit board is hot-pressed.
  • the method of the circuit board not only simplifies the manufacturing process, but also improves the connection strength between the materials and the layers of the composite multi-layer material.
  • Fig. 1 is the process flow diagram of the preparation method of a kind of composite circuit board of the present invention
  • this embodiment provides a method for preparing a composite circuit board, which includes the following steps:
  • the insulating plate is any one of PP, PPO, PTFE, and POM plates, and the insulating plate of this material has the best insulation effect.
  • the laser is an ultra-short-pulse picosecond laser, and the engraving grooves engraved by the ultra-short-pulse picosecond laser have the best effect.
  • step (2) the path of the laser engraving groove is consistent with the circuit arrangement of the layer, so as to ensure that the arrangement direction of the engraving groove and the circuit is consistent.
  • the conductive ink is any metal wire material selected from liquid nano-silver material, copper, gold, and silver, and the conductive ink of this material has the best conductive effect.
  • step (3) the moving path of the extrusion device is consistent with the circuit arrangement of the layer, so as to ensure that the extruded conductive ink is consistent with the wire arrangement direction.
  • the solidification method is cooling, which is not only simple and convenient, but also does not require the provision of external substances, saving energy and protecting the environment.
  • the present embodiment provides a preparation method of a composite circuit board, comprising the following steps:
  • Bedding insulating sheet the insulating sheet is PP sheet
  • the extrusion device uses the extrusion device to extrude the conductive ink along the corresponding path.
  • the specific process is: the conductive ink is extruded by the extrusion device, the conductive ink is a liquid nano-silver material, and the extrusion head melts the material by heating or ultrasonic vibration,
  • the moving path of the extrusion device is consistent with the circuit arrangement of the layer, and also consistent with the groove and hole position;
  • the specific process is: after the conductive ink is extruded, the grooves and holes are filled, and the conductive ink is cured by cooling;
  • the present embodiment provides a preparation method of a composite circuit board, comprising the following steps:
  • Bedding insulating sheet the insulating sheet is PPO sheet
  • the extrusion device uses the extrusion device to extrude the conductive ink along the corresponding path.
  • the specific process is: the conductive ink is extruded by the extrusion device, the conductive ink is copper metal wire, and the extrusion head melts the material by heating or ultrasonic vibration,
  • the moving path of the extrusion device is consistent with the circuit arrangement of the layer, and also consistent with the groove and hole position;
  • the specific process is: after the conductive ink is extruded, the grooves and holes are filled, and the conductive ink is cured by cooling;
  • the present embodiment provides a preparation method of a composite circuit board, comprising the following steps:
  • Bedding insulating sheet the insulating sheet is PTFE sheet
  • the extrusion device uses the extrusion device to extrude the conductive ink along the corresponding path.
  • the specific process is: the conductive ink is extruded by the extrusion device, the conductive ink is silver metal wire, and the extrusion head melts the material by heating or ultrasonic vibration,
  • the moving path of the extrusion device is consistent with the circuit arrangement of the layer, and also consistent with the groove and hole position;
  • the specific process is: after the conductive ink is extruded, the grooves and holes are filled, and the conductive ink is cured by cooling;
  • the beneficial effects of the present invention are as follows: in the preparation process of the composite circuit board, the circuit is drawn on the insulating plate by laser or mechanical processing, and then the conductive ink is applied layer by layer using an extrusion device, and finally the circuit board is hot-pressed.
  • the method for composite manufacturing a circuit board not only simplifies the production process, but also improves the connection strength between materials and layers of the composite multi-layer material.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及线路板技术领域，特别是涉及一种复合电路板的制备方法，包括以下步骤：（1）铺垫绝缘板材；（2）利用激光在绝缘板材上按照电路刻槽、打孔；（3）使用挤出装置将导电油墨沿对应路径挤出；（4）固化导电油墨；（5）重复1-4步骤，直至完成所有层的制作；（6）通过热压法将上述所有板材粘结为电路板，不仅简化了制作工艺，节省了制作时间，同时也提高了复合多层材料的材料间、层间的连接强度。

Description

一种复合电路板的制备方法 技术领域
本发明涉及线路板技术领域，特别是涉及一种复合电路板的制备方法。
背景技术
电路板的名称有：陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，PCB板，铝基板，高频板，厚铜板，阻抗板，PCB，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等。电路板使电路迷你化、直观化，对于固定电路的批量生产和优化用电器布局起重要作用。电路板可称为印刷线路板或印刷电路板，英文名称为(Printed Circuit Board)PCB、(Flexible Printed Circuit board)FPC线路板(FPC线路板又称柔性线路板柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。)和软硬结合板(reechas，Soft and hard combination plate)-FPC与PCB的诞生与发展，催生了软硬结合板这一新产品。因此，软硬结合板，就是柔性线路板与硬性线路板，经过压合等工序，按相关工艺要求组合在一起，形成的具有FPC特性与PCB特性的线路板；3D打印通常是采用数字技术材料打印机来实现的。常在模具制造、工业设计等领域被用于制造模型，后逐渐用于一些产品的直接制造，已经有使用这种技术打印而成的零部件。该技术在珠宝、鞋类、工业设计、建筑、工程和施工(AEC)、汽车，航空航天、牙科和医疗产业、教育、地理信息系统、土木工程、枪支以及其他领域都有所应用。
但是现有的复合电路板在制作的过程当中，不仅复合方式复制，制备工艺繁琐，同时还会存在复合多层材料的材料间、层间的连接强度较弱的问题。
发明内容
本发明的目的在于避免现有技术中的不足之处而提供一种复合电路板的制备方法，该复合制造电路板的方法，不仅简化了制作工艺，节省了制作时间，时也提高了复合多层材料的材料间、层间的连接强度。
本发明的目的通过以下技术方案实现：
一种复合电路板的制备方法，包括以下步骤：
(1)铺垫绝缘板材；
(2)利用激光在绝缘板材上按照电路刻槽、打孔；
(3)使用挤出装置将导电油墨沿对应路径挤出；
(4)固化导电油墨；
(5)重复1-4步骤，直至完成所有层的制作；
(6)通过热压法将上述所有板材粘结为电路板。
进一步的，步骤(1)中，所述绝缘板材为PP、PPO、PTFE、POM板中的任意一种板材。
进一步的，步骤(2)中，所述激光为超短脉冲的皮秒激光。
进一步的，步骤(2)中，所述激光刻槽路径与该层电路排布一致。
进一步的，步骤(3)中，所述导电油墨为液体纳米银材料、铜丝材、金丝材、银丝材中的任意一种。
进一步的，步骤(3)中，所述挤出装置的移动路径与该层电路排布一致。
进一步的，步骤(4)中，所述固化方式为冷却。
有益效果：由于该复合电路板的制备过程当中，通过在绝缘板材上使用激光或机械加工刻画电路，然后使用挤出装置逐层涂覆导电油墨，最后热压成电路板，因此这种复合制造电路板的方法，不仅简化了制作工艺，同时也提高了复合多层材料的材料间、层间的连接强度。
附图说明
利用附图对发明作进一步说明，但附图中的实施例不构成对本发明的任何限制，对于本领域的普通技术人员，在不付出创造性劳动的前提下，还可以根据以下附图获得其它的附图。
图1是本发明的一种复合电路板的制备方法的工艺流程图；
具体实施方式
结合以下实施例对本发明作进一步描述。
如图1所示，本实施例提供一种复合电路板的制备方法，包括以下步骤：
(1)铺垫绝缘板材；
(2)利用激光在绝缘板材上按照电路刻槽、打孔；
(3)使用挤出装置将导电油墨沿对应路径挤出；
(4)固化导电油墨；
(5)重复1-4步骤，直至完成所有层的制作；
(6)通过热压法将上述所有板材粘结为电路板。
在优选实施例中，步骤(1)中，所述绝缘板材为PP、PPO、PTFE、POM板中的任 意一种板材，该材质的绝缘板，绝缘效果最佳。
在优选实施例中，步骤(2)中，所述激光为超短脉冲的皮秒激光，通过超短脉冲的皮秒激光雕刻出的雕刻槽效果最佳。
在优选实施例中，步骤(2)中，所述激光刻槽路径与该层电路排布一致，保证雕刻槽与电路的排布方向一致。
在优选实施例中，步骤(3)中，所述导电油墨为液体纳米银材料、铜、金、银中的任意一种金属丝材，该材料的导电油墨，导电效果最优。
在优选实施例中，步骤(3)中，所述挤出装置的移动路径与该层电路排布一致，保证挤出的导电油墨与电线排布方向一致。
在优选实施例中，步骤(4)中，所述固化方式为冷却，该固化方式不仅简单，方便，同时不需要提供外界物质，节能环保。
实施例1
本实施例提供一种复合电路板的制备方法，包括以下步骤：
(1)铺垫绝缘板材，绝缘板材为PP板材；
(2)利用激光在绝缘板材上按照电路刻槽、打孔，具体工艺是：利用超短脉冲的皮秒激光在绝缘板材上刻槽、打孔，激光切割路径与该层电路排布一致，所得凹槽或孔位即为导电线路的雏形；
(3)使用挤出装置将导电油墨沿对应路径挤出，具体工艺是：导电油墨由挤出装置挤出成型，导电油墨为液体纳米银材料，挤出头通过加热或超声振动让材料熔融，以便挤出成型，挤出装置移动路径与该层电路排布一致，亦与凹槽和孔位一致；
(4)固化导电油墨，具体工艺是：导电油墨挤出后填平凹槽和孔，通过冷却使导电油墨固化；
(5)重复1-4步骤，直至完成所有层的制作；
(6)通过热压法将上述所有板材粘结为电路板。
实施例2
本实施例提供一种复合电路板的制备方法，包括以下步骤：
(1)铺垫绝缘板材，绝缘板材为PPO板材；
(2)利用激光在绝缘板材上按照电路刻槽、打孔，具体工艺是：利用超短脉冲的皮秒激光在绝缘板材上刻槽、打孔，激光切割路径与该层电路排布一致，所得凹槽或孔位即为导电线路的雏形；
(3)使用挤出装置将导电油墨沿对应路径挤出，具体工艺是：导电油墨由挤出装置挤出成型，导电油墨为铜金属丝材，挤出头通过加热或超声振动让材料熔融，以便挤出成型，挤出装置移动路径与该层电路排布一致，亦与凹槽和孔位一致；
(4)固化导电油墨，具体工艺是：导电油墨挤出后填平凹槽和孔，通过冷却使导电油墨固化；
(5)重复1-4步骤，直至完成所有层的制作；
(6)通过热压法将上述所有板材粘结为电路板。
实施例3
本实施例提供一种复合电路板的制备方法，包括以下步骤：
(1)铺垫绝缘板材，绝缘板材为PTFE板材；
(2)利用激光在绝缘板材上按照电路刻槽、打孔，具体工艺是：利用超短脉冲的皮秒激光在绝缘板材上刻槽、打孔，激光切割路径与该层电路排布一致，所得凹槽或孔位即为导电线路的雏形；
(3)使用挤出装置将导电油墨沿对应路径挤出，具体工艺是：导电油墨由挤出装置挤出成型，导电油墨为银金属丝材，挤出头通过加热或超声振动让材料熔融，以便挤出成型，挤出装置移动路径与该层电路排布一致，亦与凹槽和孔位一致；
(4)固化导电油墨，具体工艺是：导电油墨挤出后填平凹槽和孔，通过冷却使导电油墨固化；
(5)重复1-4步骤，直至完成所有层的制作；
(6)通过热压法将上述所有板材粘结为电路板。
本发明的有益效果：由于该复合电路板的制备过程当中，通过在绝缘板材上使用激光或机械加工刻画电路，然后使用挤出装置逐层涂覆导电油墨，最后热压成电路板，因此这种复合制造电路板的方法，不仅简化了制作工艺，同时也提高了复合多层材料的材料间、层间的连接强度。
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (7)

  1. 一种复合电路板的制备方法，其特征在于：包括以下步骤：
    (1)铺垫绝缘板材；
    (2)利用激光在绝缘板材上按照电路刻槽、打孔；
    (3)使用挤出装置将导电油墨沿对应路径挤出；
    (4)固化导电油墨；
    (5)重复1-4步骤，直至完成所有层的制作；
    (6)通过热压法将上述所有板材粘结为电路板。
  2. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(1)中，所述绝缘板材为PP、PPO、PTFE、POM板中的任意一种板材。
  3. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(2)中，所述激光为超短脉冲的皮秒激光。
  4. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(2)中，所述激光刻槽路径与该层电路排布一致。
  5. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(3)中，所述导电油墨为液体纳米银材料、铜丝材、金丝材、银丝材中的任意一种。
  6. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(3)中，所述挤出装置的移动路径与该层电路排布一致。
  7. 如权利要1所述的一种复合电路板的制备方法，其特征在于：步骤(4)中，所述固化方式为冷却。
PCT/CN2020/100922 2020-07-08 2020-07-08 一种复合电路板的制备方法 WO2022006789A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
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