CN202310269U - 多层电路板 - Google Patents
多层电路板 Download PDFInfo
- Publication number
- CN202310269U CN202310269U CN2011204013267U CN201120401326U CN202310269U CN 202310269 U CN202310269 U CN 202310269U CN 2011204013267 U CN2011204013267 U CN 2011204013267U CN 201120401326 U CN201120401326 U CN 201120401326U CN 202310269 U CN202310269 U CN 202310269U
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- CN
- China
- Prior art keywords
- adhesive sheet
- circuit board
- laminate
- multilayer circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011204013267U CN202310269U (zh) | 2011-10-20 | 2011-10-20 | 多层电路板 |
Applications Claiming Priority (1)
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CN2011204013267U CN202310269U (zh) | 2011-10-20 | 2011-10-20 | 多层电路板 |
Publications (1)
Publication Number | Publication Date |
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CN202310269U true CN202310269U (zh) | 2012-07-04 |
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Family Applications (1)
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CN2011204013267U Expired - Lifetime CN202310269U (zh) | 2011-10-20 | 2011-10-20 | 多层电路板 |
Country Status (1)
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CN (1) | CN202310269U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687308A (zh) * | 2012-09-14 | 2014-03-26 | 北大方正集团有限公司 | 盲孔压接多层印刷电路板及其制作方法 |
CN103811303A (zh) * | 2014-02-24 | 2014-05-21 | 无锡江南计算技术研究所 | 一种台阶封装基板台阶处垫平制作方法 |
-
2011
- 2011-10-20 CN CN2011204013267U patent/CN202310269U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687308A (zh) * | 2012-09-14 | 2014-03-26 | 北大方正集团有限公司 | 盲孔压接多层印刷电路板及其制作方法 |
CN103811303A (zh) * | 2014-02-24 | 2014-05-21 | 无锡江南计算技术研究所 | 一种台阶封装基板台阶处垫平制作方法 |
CN103811303B (zh) * | 2014-02-24 | 2016-06-22 | 无锡江南计算技术研究所 | 一种台阶封装基板台阶处垫平制作方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN WUZHU TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHENZHEN CITY WUZHOU CIRCUIT GROUP LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Co-patentee after: Meizhou Zhihao Electronic-Tech Co., Ltd. Patentee after: Shenzhen Wuzhu Technology Co., Ltd. Address before: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Co-patentee before: Meizhou Zhihao Electronic-Tech Co., Ltd. Patentee before: Shenzhen City Wuzhou Circuit Group Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
CX01 | Expiry of patent term |