WO2022004171A1 - 物品の製造装置、物品の製造方法、プログラム、記録媒体 - Google Patents

物品の製造装置、物品の製造方法、プログラム、記録媒体 Download PDF

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Publication number
WO2022004171A1
WO2022004171A1 PCT/JP2021/018998 JP2021018998W WO2022004171A1 WO 2022004171 A1 WO2022004171 A1 WO 2022004171A1 JP 2021018998 W JP2021018998 W JP 2021018998W WO 2022004171 A1 WO2022004171 A1 WO 2022004171A1
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WIPO (PCT)
Prior art keywords
unit
work
mounting
grade
substrate
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PCT/JP2021/018998
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English (en)
French (fr)
Japanese (ja)
Inventor
昭宏 林
亮太 岡崎
智史 塩田
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キヤノン株式会社
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Publication of WO2022004171A1 publication Critical patent/WO2022004171A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Definitions

  • the present invention relates to an apparatus and a method for mounting a mounting component such as a semiconductor chip on a work such as a substrate.
  • the present invention relates to a device and a method for mounting mounting components classified into a plurality of grades on a work according to the grade.
  • a semiconductor package or a circuit package is manufactured by the following procedure, for example. First, a large number of integrated circuits are formed on a semiconductor wafer, and the semiconductor wafer is cut and divided into semiconductor chips (dies) in a dicing process. Then, in the bonding process, electronic components such as semiconductor chips (dies) are bonded to workpieces such as lead frames and circuit boards.
  • the device used in this bonding process is a so-called die bonder die bonding device.
  • a die bonder is a device that places electronic components on a lead frame or substrate and bonds them using a bonding material such as solder, gold, or resin. In some cases, it is placed on an electronic component that has already been bonded to the substrate. It can also be used to mount and bond other electronic components.
  • the substrate, etc. When bonding electronic components to the surface of a substrate, etc. using a die bonder, the substrate, etc. is transported to the bonding stage and set. Then, the electronic component is picked up by using a suction nozzle called a collet, placed at a predetermined position to be bonded, and the substrate or the like on the bonding stage is heated to perform bonding.
  • a suction nozzle called a collet
  • Patent Document 1 discloses a die bonder that classifies dies having different electrical characteristics into a plurality of grades and mounts a specific grade die on a specific substrate.
  • it is a device that mounts a specific classification die on a specific classification board.
  • one classification board has a plurality of mounted points, and the number of dies classified into a specific grade included in the wafer set in the die bonder may be insufficient compared to the number of mounted points. be.
  • the mounted portion where the bonding is not completed remains on the classification substrate, and the dies classified into other grades remain on the wafer. Will be there.
  • the classification board in which the mounted portion where bonding has not been completed remains is discharged to the supply / discharge section, and instead, another classification board is set in the bonding stage to obtain another grade. It is conceivable to bond the dies. However, in this method, the classified board in the process of being discharged to the supply / discharge unit is mixed with the completed board for which mounting is completed, which complicates the management of the board. Further, in the transfer mechanism of the die bonder disclosed in Patent Document 1, the transfer of the classified substrate in the process of completion and the transfer of the new substrate on which the die is not mounted at all cannot be performed at the same time, so that the processing time is long. Therefore, the throughput may decrease.
  • a first aspect of the present invention comprises a supply unit that supplies a work having a plurality of mounted regions, a first transport unit that moves the work supplied by the supply unit to a bonding stage, and a plurality of mounting components.
  • a buffer unit for storing a work on which mounting components are mounted, a second transport unit for moving the work from the bonding stage to the accommodating unit or the buffer unit, and a control unit for controlling the operation of each unit are provided.
  • the control unit controls the first transport unit so as to transport the first work supplied from the supply unit to the bonding stage, and uses the grade information stored in the mounting component grade information storage unit to transport the first work to the bonding stage.
  • the mounting unit is controlled so that only the mounting components of the first grade among the mounting components held by the mounting component holding unit are mounted in the mounted area of the first work, and a plurality of mounted components in the first work are mounted.
  • the second transport unit is controlled so as to move the first work from the bonding stage to the accommodating unit. Even if all of the first grade mounted components held by the mounted component holding unit are mounted on the first work, if there is an unmounted area on the first work, the mounted area is described.
  • the second transport unit is controlled so as to move the first work from the bonding stage to the buffer unit, the first work is stored in the buffer unit, and then the first work is stored in the mounting component holding unit. It is an article manufacturing apparatus that controls the second transport unit so as to move the first work stored in the buffer unit to the bonding stage when a grade mounting component is newly held. ..
  • a second aspect of the present invention includes a supply unit that supplies a work having a plurality of mounted regions, a first transport unit that moves the work supplied by the supply unit to a bonding stage, and a plurality of mounting units.
  • a mounting component holding unit that can hold components, a mounting component grade information storage section that stores grade information of each of the plurality of mounting components held by the mounting component holding section, and the mounting that is held by the mounting component holding section.
  • the second transport unit comprises a step of moving the first work stored in the buffer unit to the bonding stage, which is a method of manufacturing an article.
  • a third aspect of the present invention is a supply unit for supplying a workpiece, a mounting component holding unit capable of holding a plurality of mounting components, and a mounting component for storing grade information of the mounting component held by the mounting component holding section.
  • the mounted component is provided with a grade information storage unit, an accommodating unit for accommodating the work on which the mounted component is mounted, and a buffer unit for storing the work on which the mounted component is mounted only in a part of the mounted area of the work.
  • the grade information stored in the grade information storage unit only the first grade mounted components are mounted in the mounted area of the first workpiece, but the first grade mounted components held by the mounted component holding section. Even if all the mounted parts are mounted, if there is an unmounted area in the first work, the first work is moved from the bonding stage to the buffer portion in the article manufacturing apparatus. be.
  • a fourth aspect of the present invention is a supply unit for supplying a workpiece, a mounting component holding unit capable of holding a plurality of mounting components, and a mounting component for storing grade information of the mounting component held by the mounting component holding section.
  • only the first grade mounted component is mounted in the mounted area of the first work by using the grade information stored in the mounted component grade information storage unit. Even if all of the first grade mounted components held by the component holding unit are mounted, if there is an unmounted area in the first work, the first work is mounted from the bonding stage. It is a method of manufacturing an article that moves to the buffer portion.
  • FIG. A side view of the first transport unit and the bonding stage according to the embodiment as viewed along the + X direction.
  • the front view of the bonding stage and the 2nd transfer part which concerns on embodiment.
  • the plan view of the bonding stage and the moving mechanism thereof which concerns on embodiment.
  • the front view of the bonding stage and the moving mechanism thereof which concerns on embodiment.
  • the schematic plan view for demonstrating the temperature control mechanism of the bonding stage which concerns on embodiment.
  • the schematic front view for demonstrating the temperature control mechanism of the bonding stage which concerns on embodiment.
  • the schematic plan view for demonstrating the adsorption mechanism of the bonding stage which concerns on embodiment. Schematic plan view showing a plurality of mounted areas provided on a substrate.
  • the schematic plan view which shows the operation position of the die mounting part at the time of bonding a die to a plurality of mounted areas.
  • Schematic plan view for explaining the operating procedure when selecting a specific grade die and mounting it on a specific board.
  • An operation time chart for explaining the operation of each part when bonding a die to a plurality of mounted areas.
  • An operation time chart showing the operation of each part until the board is housed in the buffer part.
  • the schematic perspective view of the die bonder which concerns on Embodiment 2.
  • FIG. 1 is a schematic perspective view for explaining a die bonder according to the present embodiment.
  • the XYZ coordinate system which is a Cartesian coordinate system, may be referred to, but the X axis is the direction in which the substrate is horizontally conveyed (from left to right in FIG. 1), and the Y axis is a horizontal plane.
  • the Z-axis is the vertical direction (direction opposite to gravity).
  • the direction parallel to the X axis may be referred to as the X direction, the same direction as the substrate transport direction (arrow of the X axis) in the X direction may be referred to as the + X direction, and the direction opposite to the + X direction may be referred to as the ⁇ X direction.
  • the direction parallel to the Y axis may be referred to as the Y direction, the same direction as the arrow on the Y axis in the Y direction may be referred to as the + Y direction, and the direction opposite to the + Y direction may be referred to as the ⁇ Y direction.
  • the direction parallel to the Z axis is the Z direction
  • the vertically upward direction (Z-axis arrow) opposite to gravity is the + Z direction
  • the direction opposite to the + Z direction is called the -Z direction. be.
  • the most characteristic part of this embodiment is a board supply section for supplying an unmounted board, a board housing section for accommodating a board for which mounting has been completed, and a board on which only a part of the mounted area is mounted.
  • a buffer part is provided to store the above, but first we will explain the overall configuration of the die bonder.
  • the die bonder 100 includes a gantry 01, a substrate supply unit 70 for supplying a substrate 110 as a work, a bonding stage 20, a die supply unit 90, a die mounting unit 10, a substrate accommodating unit 80, and a buffer unit 120.
  • the control unit 200 is provided. Further, a first transport unit 50 is provided between the substrate supply unit 70 and the bonding stage 20, and a second transport unit 60 is provided between the bonding stage 20 and the substrate accommodating unit 80.
  • a stage moving track 41 extending along the X direction, which is the substrate transport direction, is installed on the gantry 01, and the moving table 42 is movably mounted on the stage moving track 41. ..
  • the bonding stage 20 is supported on the moving table 42, and moves on the stage moving track 41 together with the moving table.
  • the board supply unit 70 includes a board storage unit 72 capable of storing a plurality of boards 110 on which a die (mounting component) is not mounted.
  • the substrate supply unit 70 includes two substrate storage units 72, but the substrate storage unit 72 may be a single unit or three or more units.
  • the board storage unit 72 can be moved in the Y direction by the Y direction drive mechanism 70Y, and can be moved in the Z direction by the Z direction drive mechanism 70Z. By driving these drive mechanisms, any board in the board stored in the board storage unit 72 can be set in the carry-out port.
  • the carry-out port is provided with a board extrusion mechanism 71 for pushing out the board in the + X direction and sending it out to the first transport unit 50.
  • the first transport unit 50 includes an X-direction moving mechanism 50X for moving in the X direction and a Z-direction moving mechanism 50Z for moving in the Z direction.
  • the first transport unit 50 can receive the substrate from the substrate supply unit 70, transfer it onto the bonding stage 20, and place it on the bonding stage 20.
  • FIG. 2 is a side view of the first transport unit 50 and the bonding stage 20 as viewed along the ⁇ X direction.
  • the first transport unit 50 includes a grip portion 54a and a grip portion 54b for gripping two sides of the substrate 110 extending in the X direction (board transport direction).
  • the grip portion 54a includes a fixed claw 51a that supports the substrate from below along one side of the substrate 110 extending along the substrate transport direction, and a movable claw 52a that presses the substrate from above along the one side.
  • the fixed claw 51a and the movable claw 52a can be integrally moved in the Y direction by the Y direction moving mechanism 53a, and the movable claw 52a can be moved up and down in the Z direction by the Z direction moving mechanism 55a.
  • the grip portion 54a sandwiches or releases the substrate 110 from above and below along one side of the substrate 110 extending along the substrate transport direction. It is possible to do it.
  • the grip portion 54b has a fixed claw 51b that supports the substrate from below along the other side of the substrate 110 extending along the substrate transport direction, and a movable claw that presses the substrate from above along the other side. 52b is provided.
  • the fixed claw 51b and the movable claw 52b can be integrally moved in the Y direction by the Y direction moving mechanism 53b, and the movable claw 52b can be moved up and down in the Z direction by the Z direction moving mechanism 55b.
  • the grip portion 54b can hold the substrate 110 from above and below along the other side of the substrate 110 extending along the substrate transport direction. It is possible to release it.
  • the bonding stage 20 is a stage that holds the substrate as a work when the work of bonding the die to the substrate is performed.
  • the bonding stage 20 fixed on the moving table 42 can move along the X direction in a horizontal plane together with the moving table 42.
  • the substrate supplied from the substrate supply unit 70 can be received and horizontally moved to the bonding work position. Then, during the bonding work, the substrate can be held and heated at the bonding work position, and after the bonding work, the substrate can be conveyed to the substrate accommodating portion 80 side.
  • FIG. 2 is a side view of the bonding stage 20 and its moving mechanism seen along the + X direction
  • FIG. 3 is a front view showing the substrate accommodating portion 80 and the like
  • FIG. 4 is a plan view and a view seen along the ⁇ Z direction
  • 5 is a front view seen along the + Y direction.
  • FIG. 6 is a schematic plan view for explaining the temperature control mechanism included in the bonding stage 20
  • FIG. 7 is a schematic front view
  • FIG. 8 is for explaining the adsorption mechanism included in the bonding stage 20. It is a schematic plan view.
  • the bonding stage 20 is supported on a moving table 42 movably mounted in the X direction on the stage moving track 41, and is supported by the moving table and the stage moving track. It can move freely in the X direction on 41.
  • a drive mechanism using a motor and a ball screw may be used, but when the distance between the stage moving tracks 41 is long, a drive mechanism using a linear motor is preferable.
  • the bonding stage 20 is provided with a suction mechanism for sucking the substrate 110 on its upper surface, and the suction mechanism has a suction path 30 and a suction hole 31 (suction portion). As shown in FIG. 8, a large number of suction holes 31 two-dimensionally arranged in a plan view are connected to the suction control unit 32 by an airtight path via a suction path 30.
  • the suction control unit 32 includes, for example, a negative pressure generator 33 such as a vacuum pump, a flow path switching valve 34, and a leak path 35 such as an atmospheric communication path, and operates under the control of the control unit 200.
  • the control unit 200 sends an instruction to the suction control unit 32, sucks the substrate from the suction hole 31 (suction portion) via the suction path 30, and bonds the substrate 110.
  • the substrate can be fixed on the stage.
  • the substrate can be released from adsorption by leaking a negative pressure through the suction path 30.
  • the bonding stage 20 includes a heating mechanism for controlling the temperature of the substrate 110 mounted on the upper surface thereof, and the heating mechanism includes a heater 24.
  • the heater 24 is arranged at a position farther from the substrate 110 than the suction mechanism when viewed in the Z direction as shown in FIG. 2, and is arranged in a direction intersecting the suction path 30 in a plan view as shown in FIG.
  • the layout of the heater 24 is not limited to this example.
  • the heating mechanism includes a temperature sensor 23 such as a thermocouple as a temperature detecting unit, and the temperature sensor 23 is a temperature control unit 21. Is connected to.
  • the temperature control unit 21 operates under the control of the control unit 200, and when the substrate 110 is transferred onto the bonding stage 20, the control unit 200 adjusts the temperature of the bonding stage 20 to control the temperature of the substrate 110. ..
  • the method and arrangement of the temperature sensors 23 are not limited to this example, and for example, a plurality of temperature sensors may be arranged two-dimensionally in a plan view.
  • the temperature sensor may measure the temperature of the portion of the bonding stage close to the substrate, but may also measure the temperature of the substrate itself by a contact type or non-contact type sensor (for example, an infrared sensor).
  • the die supply unit 90 is a device that supplies a die (mounting component) for die bonding, but can be paraphrased as a mounting component holding unit.
  • a mounting component holding unit For example, a semiconductor wafer diced to a large number of semiconductor chips (dies) can be held.
  • the die mounting unit 10 includes a collet capable of adsorbing the die and a collet drive unit for moving the collet in each direction of XYZ.
  • FIG. 10 is a schematic plan view of the die supply unit 90 and the die mounting unit 10 (mounting unit) in a plan view, and a large number of dies 111 as mounting components diced on the die supply unit 90 are placed on the die supply unit 90. It shows the situation that was done.
  • the die mounting unit 10 (mounting unit) includes a collet 13, a Y moving unit 11 that moves the collet 13 in the Y direction, and a Z moving unit 12 that moves the collet 13 in the Z direction.
  • the die mounting unit 10 attracts the die 111 by using the collet 13 in the die supply unit 90, conveys the die 111 to the bonding work position, and places the die 111 at a predetermined position of the substrate 110 held on the bonding stage 20.
  • a pressing force can be applied to the die 111 toward the substrate 110 in the ⁇ Z direction.
  • the drive positions (TP-x1 to TP-x10) of the moving table 42 are shown.
  • the die mounting portion may be provided with a plurality of collets.
  • two Z moving portions are arranged on the Y moving portion 11 and collets are provided for each, and between the bonding stage 20 and the die supply portion 90.
  • It may be configured to have an intermediate stand.
  • the collet on the die supply unit 90 side picks up the die 111 from the die supply unit 90 and places it on the intermediate stand, and the collet on the bonding stage 20 side takes out the die 111 from the intermediate table and places it on the bonding stage 20. It is mounted on the board 110.
  • a second transport unit 60 is provided between the bonding stage 20 and the substrate accommodating unit 80.
  • the second transport unit 60 includes an X-direction moving mechanism 60X for moving in the X direction and a Z-direction moving mechanism 60Z for moving in the Z direction. Further, the second transport unit 60 includes a gripping mechanism having the same configuration as the first transport unit 50 described with reference to FIG. 2. The second transport unit 60 can pick up the substrate mounted on the bonding stage 20 and carry it out to the substrate accommodating unit 80 or the buffer unit 120.
  • the board accommodating unit 80 includes a substrate accommodating unit 82 for accommodating a substrate on which a die is mounted in all mounted areas after the bonding work is completed.
  • the substrate accommodating portion 80 includes two substrate accommodating portions 82, but the substrate accommodating portion 82 may be a single number or three or more.
  • the board accommodating portion 82 can be moved in the Y direction by the Y direction drive mechanism 80Y, and can be moved in the Z direction by the Z direction drive mechanism 80Z. By driving these drive mechanisms, the substrate can be accommodated at an arbitrary position of the substrate accommodating portion 82.
  • the buffer unit 120 includes a substrate storage unit that stores a substrate on which only a part of a plurality of mounted areas has been bonded (hereinafter, may be referred to as a partially mounted substrate).
  • the buffer unit 120 includes one board storage unit, but the buffer unit 120 may have a plurality of board storage units.
  • the buffer unit 120 can be moved in the Y direction in conjunction with the substrate accommodating unit 80 by the Y direction drive mechanism 80Y, and can be moved in the Z direction by the Z direction drive mechanism 120Z. By driving these drive mechanisms, the substrate can be accommodated in an arbitrary slot of the buffer unit 120 by using the second transport unit 60. Attached to the buffer unit 120, a substrate extrusion mechanism 121 for extruding the substrate in the ⁇ X direction and sending the substrate to the second transport unit 60 is provided.
  • the control unit 200 is a computer for controlling the operation of the die bonder 100, and has a CPU, a ROM, a RAM, an I / O port, and the like inside.
  • the program for executing various processes according to the present embodiment can be stored in a ROM, which is a non-temporary recording medium that can be read by a computer, together with other programs.
  • the program may be recorded on any recording medium that can be read by a computer. Further, the program may be loaded into the RAM from the outside via the network, or may be loaded into the RAM via the recording medium in which the program is recorded.
  • the I / O port is connected to an external device or network, and for example, data required for bonding can be input / output to / from an external computer. Further, the I / O port is connected to a monitor or an input device (not shown), and can display the operation status information of the die bonder to the operator and can receive a command from the operator.
  • the control unit 200 includes a substrate supply unit 70, a substrate extrusion mechanism 71, a first transfer unit 50, a moving table 42, a bonding stage 20, a die mounting unit 10, a second transfer unit 60, a substrate accommodating unit 80, a buffer unit 120, and a substrate. It controls the drive of each part including the extrusion mechanism 121.
  • the control unit 200 is electrically connected to the drive mechanism and the sensor of each unit so as to be able to exchange control signals, and controls these.
  • the RAM of the control unit 200 can store grade information related to each grade of the die held by the die supply unit 90 as a mounting component grade information storage unit.
  • the grade information associated with the wafer identification information may include a classification map that maps the relationship between the position of the die in the wafer and the grade of the die.
  • the grade information may be loaded into the RAM via the network, for example, from a device that measures the electrical characteristics of the die.
  • the die bonding method according to this embodiment will be described.
  • the die is bonded to the substrate 110 in which the mounted area 112 on which the die is mounted is provided at m ⁇ n positions in a plan view.
  • the same grade of dies are bonded to all the mounted regions 112 in each substrate.
  • a first grade die is bonded to all mounted areas of the first substrate
  • a second grade die is bonded to all mounted areas of the second substrate. do.
  • the grade of the die mounted on the second substrate can be appropriately determined by the control unit 200 according to the distribution of the grade of the die held in the die supply unit 90.
  • the first grade die may be bonded to all the mounted areas of the second substrate. The point is that when focusing on an arbitrary substrate, dies of the same grade are bonded to all mounted areas in the substrate.
  • the die bonder 100 programmed to perform the bonding operation based on the rule performs the following types of operations depending on the situation.
  • FIG. 11 is a schematic plan view for explaining a type of operation.
  • the grades of each die are distinguished by using three types of marks (one vertical bar, two vertical bars, and a circle). That is, in this example, the dies are classified into three grades, and the dies of the same grade are schematically shown with the same mark.
  • the classification of grades is not limited to three stages, and dies of the same grade are not always arranged together on the die supply unit 90.
  • Each point of 510 to 514 shown in FIG. 11 indicates a working position.
  • 510 is a position where the first transfer unit 50 receives the substrate from the substrate supply unit
  • 511 is a position where the substrate is transferred from the first transfer unit 50 to the bonding stage 20.
  • 512 is a position where the substrate is exchanged between the bonding stage 20 and the second transfer unit 60
  • 513 is a position where the substrate is transferred from the second transfer unit 60 to the substrate accommodating unit 80.
  • 514 is a position where the substrate is exchanged between the buffer unit 120 and the second transport unit 60.
  • each arrow of 610 to 614 indicates a movement path of the substrate.
  • Type 1 A substrate on which a die has not been mounted is transferred from the substrate supply unit 70 to the bonding stage 20, and dies of the same grade are sequentially picked up from the die supply unit 90 and bonded to the mounted area.
  • the substrate is moved from the bonding stage 20 to the substrate accommodating portion 80. That is, in Type 1, the substrate moves from the substrate supply unit 70 to the substrate accommodating unit 80 via the path 610, the path 611, and the path 612 shown in FIG.
  • Type 2 A substrate on which a die has not been mounted is transferred from the substrate supply unit 70 to the bonding stage 20, and dies of the same grade are sequentially picked up from the die supply unit 90 and bonded to the mounted area. If there are no more dies of the grade in the die supply unit 90 before bonding to all the mounted areas is completed, the partially mounted substrate is moved to the buffer unit 120 and stored. That is, in Type 2, the substrate moves from the substrate supply unit 70 to the buffer unit 120 via the path 610, the path 611, and the path 613 shown in FIG.
  • a die 111 for example, a semiconductor chip
  • a thermosetting adhesive film is attached to the lower surface of each die 111, that is, the surface that comes into contact with the substrate during bonding.
  • the substrate 110 as a mounted member (work) is set at a predetermined position of the substrate accommodating portion 72 of the substrate supply unit 70.
  • the grade information of each die 111 set in the die supply unit 90 (for example, a classification map mapping the relationship between the position where each die is placed and the grade of each die) is stored in the storage unit.
  • the substrate 110 is transferred from the substrate supply unit 70 to the bonding stage 20. Specifically, first, the control unit 200 moves the first transport unit 50 in the ⁇ X direction to a substrate delivery position in contact with or close to the substrate supply unit 70.
  • FIG. 12 is an operation time chart for explaining the subsequent movements of each part.
  • the bonding stage 20 that moves together with the moving table 42 is the transfer unit 40
  • the first transfer unit 50 is the substrate transfer unit
  • the second transfer unit 60 is the substrate ejection unit. It is written as a part.
  • the control unit 200 drives the substrate extrusion mechanism 71 to push the rear end of the substrate 110 and starts feeding the substrate 110 in the + X direction (951). ).
  • the control unit 200 controls the movable claws 52a and the movable claws 52a of the first transport unit 50.
  • the movable claw 52b is driven to grip (pinch) the substrate 110.
  • control unit 200 moves the first transport unit 50 gripping the substrate 110 in the + X direction to the work receiving position (952).
  • a bonding stage 20 supported by the moving table 42 stands by at the work receiving position, but the control unit 200 drives the heater 24 of the bonding stage 20 together with the movement of the first transport unit 50 to bond. Start heating the stage. This is because the bonding stage is preheated so that the substrate can be heated to the bonding working temperature in a short time after being transferred onto the bonding stage.
  • the control unit 200 moves the first transport unit 50 in the ⁇ Z direction. Then, the first transport unit 50 is released from gripping the substrate 110, the substrate 110 is placed on the bonding stage 20, and the suction control unit 32 of the bonding stage 20 is driven to suck the substrate 110. Then, the control unit 200 drives the moving table 42 to move the bonding stage 20 to the bonding work position in the + X direction (953).
  • the temperature of the substrate 110 rises to the preheating temperature (for example, 60 ° C.) by the heater 24 of the bonding stage 20 during movement, and further, at the bonding work position, the temperature is equal to or higher than the curing temperature of the adhesive. Ascend to.
  • the preheating temperature for example, 60 ° C.
  • the control unit 200 reciprocates the collet of the die mounting unit 10 between the die supply unit 90 and the substrate 110, and sequentially bonds the dies 111.
  • the control unit 200 has a drive position (TP-y1 to TP-y7) of the Y moving unit 11 of the die mounting unit 10 and a driving position of the bonding stage 20 (moving table 42). (TP-x1 to TP-x10) is controlled.
  • TP-X1 to TP-X70 is shown as TP-X1 to TP-X70.
  • control unit 200 drives the second transport unit 60 to move the bonded substrate from the bonding stage 20 to the substrate accommodating unit 80, and the substrate accommodating unit 200. It is housed in the appropriate slot of 82.
  • the substrate moves from the substrate supply unit 70 to the substrate accommodating unit 80 via the path 610, the path 611, and the path 612 shown in FIG. It should be noted that the time chart of FIG. 12 illustrates a situation in which the same type 1 operation is performed on the second substrate following the first substrate.
  • FIG. 13 is an operation time chart for explaining the movement of each part in the operation of type 2. The movement of each part from the board supply part 70 to the transfer of the board 110 to the bonding stage 20 and the start of die bonding is the same as in type 1.
  • a sufficient number (that is, 70) of dies of the same grade to be mounted in all the mounted areas 112 of the substrate 110 are set in the die supply unit, but in type 2, dies of the same grade are insufficient. (For example, there are only 40).
  • the second transfer unit 60 is driven (965).
  • the partially mounted board is stored in the buffer unit 120 (966). Due to the movement of each part described above, in the type 2, the substrate moves from the substrate supply part 70 to the buffer part 120 via the path 610, the path 611, and the path 613 shown in FIG.
  • FIG. 14 is an operation time chart for explaining the movement of each part in the movement of the type 4.
  • the second transport section 60 is driven to receive the partially mounted board from the buffer section 120 (971, 972) and transfer it to the bonding stage 20. Then, at the timing indicated as TP-X41 to TP-X70, 30 dies of the same grade as the dies partially mounted by the die mounting unit 10 are mounted in the remaining 30 mounted areas ( 973, 974). Then, when the mounting of the die on all the mounted areas is completed, the substrate on the bonding stage is received by the second transfer unit 60 (975), and the substrate is stored in an appropriate slot of the substrate accommodating unit 80 from the second transfer unit 60. (976).
  • FIG. 14 shows a case where 30 or more dies of a grade to be bonded to a partially mounted substrate are newly set in the die supply unit 90. However, if the number of newly set dies of the grade is 1 or more and less than 30, after the newly set dies of the grade are additionally mounted, the partially additionally mounted substrate is bonded to the bonding stage. Return from 20 to the buffer unit 120. That is, the second transport unit 60 is driven to receive the partially additionally mounted substrate from the bonding stage 20, and the partially additionally mounted substrate is removed to the buffer unit 120 via the path 613 shown in FIG.
  • each part in the types 1 to 4 has been described above.
  • the operations included in each of these types are not always performed independently at completely different timings, and two operations may be performed in duplicate at a certain timing.
  • the second transfer unit transfers the first work from the bonding stage to the accommodating unit or the buffer unit, and the second transfer unit transfers the first work.
  • the first transport unit can be controlled so as to start the operation of transporting the second work supplied by the supply unit toward the bonding stage. Therefore, the buffer unit 120 may be arranged in a direction different from the direction from the bonding stage 20 toward the substrate supply unit 70 (the direction connecting the bonding stage 20 and the substrate supply unit 70).
  • the buffer unit 120 is preferably arranged at a position that does not interfere with the transport path of the first transport unit.
  • FIG. 15 is a flowchart showing a processing procedure for selecting and mounting a die of one grade among a plurality of classification grades when one wafer is set in the die supply unit 90.
  • the processing procedure shown in FIG. 15 can be applied to any grade of a plurality of classification grades, and once steps S16 have been completed for one grade, the same procedure is performed from step S1 for dies classified into different grades. Do the mounting work at.
  • control unit 200 confirms that the set wafer contains a die of the first grade, and the substrate in which the grade is partially mounted in the buffer unit 120. Check if is stored. (Step S1).
  • step S1: Yes the second transport unit 60 is driven to store the partially mounted board. It is moved from the buffer unit 120 to the bonding stage 20. (Step S2).
  • control unit 200 confirms the number of mounted areas on which the die is not mounted on the partially mounted board, that is, the required number for additionally mounting the first grade die (step S3).
  • step S4 When there are more than the required number of first grade dies on the wafer (step S4: Yes), the first grade dies are mounted in all the mounted areas where the dies are not mounted. (Step S5). After the mounting is completed in step S5, the substrate is housed in the board accommodating portion 80. (Step S6).
  • step S4 If it is determined in step S4 that the number of first grade dies on the wafer is less than the number required for mounting (step S4: No), the unmounted area of the partially mounted substrate is placed on the wafer. All of the first grade dies of the above are mounted (step S7). Even after step S7, the mounting is not completed in a part of the mounted area of this board, so that the board is stored in the buffer unit 120 again as a partially mounted board. (Step S8).
  • the above operations of steps S2 to S8 correspond to the operations of type 4 already described.
  • step S6 when the substrate on which the first grade dies are mounted is stored in the substrate accommodating unit 80, the control unit 200 classifies the number of first grade dies remaining in the die supply unit 90. Check based on the map. (Step S9). Even if the board on which the first grade dies are partially mounted is not stored in the buffer unit 120 in step S1, the process proceeds to step S9, and the number of first grade dies is classified into a classification map. Confirm based on.
  • step S9 Yes
  • the first transfer unit 50 is driven to transfer the unmounted substrate from the substrate supply unit 70 to the bonding stage 20. Supply. (Step S10).
  • step S11 the first grade die is mounted on the entire mounted area of the substrate, and after the mounting is completed, the substrate is housed in the substrate accommodating portion 80 in step S12. Then, after the storage is completed, the process returns to step S9 again.
  • steps S10 to S12 correspond to the operations of type 1 already described.
  • step S9 If there are no more than 70 mounted components on the wafer in step S9 (step S9: No), the process proceeds to step S13, and the control unit 200 determines whether the first grade die remains in the die supply unit 90. That is, it is determined based on the classification map whether the remaining number is more than 0. If 1 or more and less than 70 are left in the die supply unit 90, that is, if there are more than 0 (step S13: Yes), the process proceeds to step S14, and the substrate supply unit 70 has not been mounted on the bonding stage 20. Supply a new board. Then, in step S15, all the dies of the first grade remaining in the die supply unit 90 are mounted. When step S15 is completed, the process proceeds to step S16, and the partially mounted substrate is stored in the buffer unit 120.
  • the above operations of steps S14 to S16 correspond to the operations of type 2 already described.
  • step S16 When step S16 is completed, or when the above-mentioned step S8 is completed, all the mounting of the first grade dies set in the die supply unit 90 is completed, so that the next grade (for example, the second grade) die mounting work is started. That is, the work is started from step S1 for the second grade. That is, the operation of type 3 already described is executed.
  • the next grade For example, the second grade
  • step S13 when it is determined in step S13 that the die of the first grade does not exist in the die supply unit 90 (step S13: No), the process moves to the mounting work of the die of the next grade in the same manner, and the second grade is mounted. The work is started from step S1 for the grade of.
  • the die bonder 100 of the present embodiment when the wafer is set in the die supply unit 90, the mounting of the die of one grade is completed as described above, the die of another grade is mounted, and the die of all grades is mounted. This process flow is repeated until the die mounting process is completed. Then, when all the dies of the wafers set in the die supply unit 90 are mounted, a new wafer is set in the die supply unit 90, and the same processing flow is repeated.
  • the same grade of dies are bonded to all the mounted areas in each substrate.
  • the first grade is concerned.
  • the mounted board is temporarily stored in the buffer section. Thereby, the mounting work of the die other than the first grade (for example, the second grade) contained in the wafer can be started on another substrate.
  • the partially mounted board is returned to the board supply section 70 or temporarily housed in the board housing section 80 before starting the mounting work of the second grade die. become.
  • unmounted boards and partially mounted boards are mixed in the board supply unit 70, and in the latter, mounted boards and partially mounted boards are mixed, and either of them is adopted.
  • the management of the board becomes complicated. It is also conceivable to replace the wafer set in the die supply section in order to continue mounting the first grade die on the partially mounted board, but this requires a great deal of labor and time. be.
  • the present embodiment it is not necessary to remove the wafer from the die supply unit until the mounting of the dies of all grades contained in the wafer is completed. Further, when a new wafer including the first grade die is set in the die supply section after mounting all the dies of a certain wafer, the partially mounted substrate is easily taken out from the buffer section and the first grade is used. Dies can be additionally implemented. As described above, according to the present embodiment, the efficiency of the mounting work is very high in the apparatus or method of selecting a die of a specific grade from the dies classified into a plurality of grades and mounting the die on a specific substrate. Can be.
  • Embodiment 2 of the present invention will be described with reference to the drawings. However, for the parts common to the first embodiment, a common reference number will be attached to the drawings, and detailed explanations will be omitted as much as possible.
  • FIG. 16 is a schematic perspective view for explaining the die bonder 100 according to the second embodiment.
  • the main difference from the die bonder of the first embodiment is that the preheating unit 22, the substrate inspection unit 322, and the preheating unit 222 are provided.
  • the preheating unit 22 is arranged between the substrate supply unit 70 and the bonding stage 20, and is for preheating the unmounted substrate supplied from the substrate supply unit 70 before transferring to the bonding stage 20. It is a heating device. By preheating the next substrate while the bonding work is being performed on one substrate in the bonding stage 20, when the next substrate is transferred to the bonding stage, the temperature rises to the bonding operation temperature in a short time. Can be warmed.
  • the preheating unit 22 includes a heat generation source such as a heater (not shown in FIG. 16), a temperature sensor such as a thermocouple, and a temperature control unit, and can heat the substrate 110 mounted on the upper surface thereof to a predetermined temperature.
  • the preheating unit 22 can be configured to be able to adsorb and stably hold the substrate 110 by providing an adsorption means (not shown) or the like.
  • the board inspection unit 322 is a device that inspects the board supplied from the board supply unit 70. That is, in this embodiment, the grade of the substrate can be inspected before the die mounting is started. In the first embodiment, the individuality of each substrate is not distinguished, but in the second embodiment, the grade of the substrate can be checked before the mounting work is started. As a result, the control unit 200 can not only eliminate the defective substrate before the mounting work, but also appropriately select the grade of the die to be mounted on the defective substrate according to the grade of the substrate. That is, the combination of the substrate grade and the die grade can be appropriately set.
  • the board inspection unit 322 is, for example, a device for examining the characteristics and shape of the wiring pattern and the insulating layer provided on the board, and may be provided with an electrical measuring instrument or an image sensor.
  • the substrate inspection unit 322 may be provided incidentally to the first transport unit 50, or may be installed in the moving path of the substrate from the substrate supply unit 70 to the preheating unit 22.
  • the preheating unit 222 is installed between the buffer unit 120 and the bonding stage 20 or attached to the buffer unit 120, and before the partially mounted substrate supplied from the buffer unit 120 is transferred to the bonding stage 20. It is a heating device that preheats. By preheating the partially mounted substrate while the bonding work is being performed on one substrate in the bonding stage 20, when the partially mounted substrate is transferred to the bonding stage, the bonding work temperature is reached. The temperature can be raised in a short time.
  • die bonding method Next, the die bonding method according to this embodiment will be described. Also in the present embodiment, as in the first embodiment, when the dies are bonded to a plurality of substrates, the same grade of dies are bonded to all the mounted regions 112 in each substrate. To.
  • the grade of the substrate as the work can be inspected, and a die having a grade suitable for the grade of the substrate can be selected and mounted. Further, in the present embodiment, by preheating the substrate in advance before transferring it to the bonding stage, the cycle of the bonding work can be increased and the throughput can be improved.
  • FIG. 17 is a schematic plan view for explaining the operation of the die bonder 100 in the present embodiment. This embodiment can also perform the same operation as the types 1 to 4 of the first embodiment described with reference to FIG. Although the description items common to FIG. 11 are omitted, the work position and the work content may be different from those of the first embodiment due to the difference in the device configuration.
  • 510 shown in FIG. 17 is a position where the substrate inspection unit 322 inspects the substrate received by the first transport unit 50 from the substrate supply unit and the substrate is placed on the preheating unit 22. Further, 511 is a position where the preheated substrate is transferred from the first transport unit 50 to the bonding stage 20. 512 is a position where the substrate is exchanged between the bonding stage 20 and the second transfer unit 60, and 513 is a position where the substrate is transferred from the second transfer unit 60 to the substrate accommodating unit 80. Further, 514 is a position where the substrate is exchanged between the buffer unit 120 and the second transport unit 60.
  • each arrow of 610 to 614 indicates a moving path of the substrate
  • 610 is a path from the preheating section 22 to the transfer to the bonding stage 20
  • 611 is placed on the bonding stage 20 to the bonding work position. It is a moving route.
  • Reference numeral 612 is a path for transporting the mounted substrate from the bonding stage 20 to the substrate accommodating section 80
  • 613 is a path for transporting the partially mounted substrate from the bonding stage 20 to the buffer section 120.
  • 614 is a path for transporting the partially mounted substrate preheated by the preheating unit 222 from the buffer unit 120 to the bonding stage 20.
  • the bonding stage 20 that moves together with the moving table 42 is the transfer unit 40
  • the first transfer unit 50 is the substrate transfer unit
  • the transport unit 60 is referred to as a substrate discharge unit.
  • FIG. 18 is an operation time chart for explaining the movement of each part in the movement of type 3. It is basically the same as the movement of each part of FIG. 14 described in the first embodiment, but in the present embodiment, the preheating part 222 is used to heat a partially mounted substrate. Therefore, as shown in 1107, the temperature of the substrate starts to rise earlier than that of the first embodiment, so that the time required to start mounting on the partially mounted substrate on the bonding stage can be shortened. Is possible.
  • FIG. 19 is an operation time chart for explaining the operation of the type 3 and the operation of each part when the operation of the type 1 is continuously performed. That is, in the first half of the time chart, the partially mounted substrate is moved from the buffer unit 120 to the bonding stage 20. Then, at the timing indicated as TP-X41 to TP-X70, the die mounting unit 10 mounts 30 dies of the same grade as the partially mounted dies in the remaining 30 mounted areas. When the mounting of the die on all the mounted areas is completed, the second transport unit 60 receives the substrate on the bonding stage and stores the substrate from the second transport unit 60 in an appropriate slot of the substrate accommodating unit 80.
  • the board supply section side inspects the next board to be supplied by the board inspection section 322, and when the grade of the board is determined, preheating is performed. Preheating is started in the part 22.
  • the preheated new substrate is transferred from the preheating unit 22 to the bonding stage 20 using the first transport unit 50. Reprint.
  • the die is mounted on a new substrate at the timing indicated as TP-X1 to TP-X70, and when the mounting is completed, the die is carried from the bonding stage 20 to the substrate accommodating portion 80 by the second transport unit 60. is doing.
  • the same grade of dies are bonded to all the mounted areas in each substrate. ..
  • the first grade is concerned.
  • the mounted board is temporarily stored in the buffer section. Thereby, the mounting work of the die other than the first grade (for example, the second grade) contained in the wafer can be started on another substrate.
  • the partially mounted board is returned to the board supply section 70 or temporarily housed in the board housing section 80 before starting the mounting work of the second grade die. become.
  • unmounted boards and partially mounted boards are mixed in the board supply unit 70, and in the latter, mounted boards and partially mounted boards are mixed, and either of them is adopted.
  • the management of the board becomes complicated. It is also conceivable to replace the wafer set in the die supply section in order to continue mounting the first grade die on the partially mounted board, but this requires a great deal of labor and time. be.
  • the present embodiment it is not necessary to remove the wafer from the die supply unit until the mounting of the dies of all grades contained in the wafer is completed. Further, when a new wafer including the first grade die is set in the die supply section after mounting all the dies of a certain wafer, the partially mounted substrate is easily taken out from the buffer section and the first grade is used. Die can be implemented.
  • the buffer unit 120 may be arranged in a direction different from the direction from the bonding stage 20 toward the substrate supply unit 70 (the direction connecting the bonding stage 20 and the substrate supply unit 70). In other words, the buffer unit 120 may be arranged at a position that does not interfere with the transport path of the first transport unit.
  • the first is the effect that a new substrate or a partially mounted substrate can be preheated before being placed on the bonding stage 20. As a result, it is possible to shorten the time required to raise the temperature to the working temperature (above the curing temperature of the adhesive) after the substrate is transferred to the bonding stage 20.
  • the substrate to be supplied next can be inspected by the substrate inspection unit 322 to determine the grade of the substrate.
  • the inspection of the substrate can be performed in parallel during the bonding work of the previous substrate, so that the inspection does not waste time.
  • the efficiency of the mounting work is further improved in the apparatus or method of selecting a die of a specific grade from the dies classified into a plurality of grades and mounting the die on a specific substrate. Can be expensive.
  • the buffer unit 120 is arranged side by side with the substrate accommodating unit 80 and interlocked by the Y-direction drive mechanism 80Y, but the arrangement and drive mechanism of the buffer unit 120 are limited to this example. Do not mean.
  • the buffer unit 120 is located closer to the bonding stage 20 than the substrate accommodating unit 80 when viewed in the X direction, and the bonding stage is viewed in the Z direction. It may be arranged at a position higher than 20.
  • the drive of the buffer unit 120 is completely independent of the substrate accommodating unit 80.
  • the die bonder of the present embodiment can also exert the same effect as that of the second embodiment.
  • the die is not limited to a semiconductor element (semiconductor chip), and may be an electronic component such as a resistance element or a capacitor.
  • various mounted members such as a printed circuit board, a flexible board, and a lead frame can be used.
  • various materials can be used in addition to the thermosetting adhesive.
  • the present invention can be widely used not only as a method for manufacturing a semiconductor for die-bonding a semiconductor chip, but also as a method for manufacturing an article for mounting a component such as an electronic component.
  • An embodiment of the present invention also includes a control program capable of executing the control operation according to the die bonding method described above, and a computer-readable recording medium in which the control program is stored.
  • the present invention supplies a program that realizes one or more functions of an embodiment to a system or device via a network or storage medium, and one or more processors in the computer of the system or device reads and executes the program. But it is feasible. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.
  • a circuit for example, ASIC
  • the present invention can be widely implemented in a device for die-bonding a semiconductor chip, a device for mounting an electronic component or the like on a circuit board or the like, and the like.
  • the present invention is not limited to the above embodiments, and various modifications and modifications can be made without departing from the spirit and scope of the present invention. Therefore, in order to publicize the scope of the present invention, the following claims are attached.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
PCT/JP2021/018998 2020-07-03 2021-05-19 物品の製造装置、物品の製造方法、プログラム、記録媒体 WO2022004171A1 (ja)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297211A (ja) * 1994-04-26 1995-11-10 Toshiba Seiki Kk ダイボンディング装置
JP2006295098A (ja) * 2005-04-13 2006-10-26 King Yuan Electronics Co Ltd 集積回路チップのピックアップ及び分類装置
WO2009119193A1 (ja) * 2008-03-28 2009-10-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
WO2017164252A1 (ja) * 2016-03-22 2017-09-28 株式会社新川 ボンディング装置及びボンディング方法
JP2020068281A (ja) * 2018-10-24 2020-04-30 キヤノンマシナリー株式会社 マガジン装置、搬送装置、搬送方法、ダイボンダ、およびボンディング方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297211A (ja) * 1994-04-26 1995-11-10 Toshiba Seiki Kk ダイボンディング装置
JP2006295098A (ja) * 2005-04-13 2006-10-26 King Yuan Electronics Co Ltd 集積回路チップのピックアップ及び分類装置
WO2009119193A1 (ja) * 2008-03-28 2009-10-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
WO2017164252A1 (ja) * 2016-03-22 2017-09-28 株式会社新川 ボンディング装置及びボンディング方法
JP2020068281A (ja) * 2018-10-24 2020-04-30 キヤノンマシナリー株式会社 マガジン装置、搬送装置、搬送方法、ダイボンダ、およびボンディング方法

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