WO2022004151A1 - Dispositif de fabrication d'article et procédé de fabrication d'article - Google Patents

Dispositif de fabrication d'article et procédé de fabrication d'article Download PDF

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Publication number
WO2022004151A1
WO2022004151A1 PCT/JP2021/018404 JP2021018404W WO2022004151A1 WO 2022004151 A1 WO2022004151 A1 WO 2022004151A1 JP 2021018404 W JP2021018404 W JP 2021018404W WO 2022004151 A1 WO2022004151 A1 WO 2022004151A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
substrate
bonding stage
support portion
bonding
Prior art date
Application number
PCT/JP2021/018404
Other languages
English (en)
Japanese (ja)
Inventor
亮太 岡崎
昭宏 林
智史 塩田
Original Assignee
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノン株式会社 filed Critical キヤノン株式会社
Publication of WO2022004151A1 publication Critical patent/WO2022004151A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • a transport lane 50a and a transport lane 50b that support the edge of the board from below are arranged along the side extending in the X direction of the board.
  • the height of the upper surface of the support portion of the transfer lane 50a and the transfer lane 50b is set to be equal to the upper surface of the support portion 72a and the support portion 72b of the substrate storage portion 72. This is to prevent the edge portion of the substrate from being caught by the end portion of the transport lane when the board 110 is sent out from the board storage portion to the transport lane.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

La présente invention concerne une microsoudeuse de puces (100) comprenant : une unité d'alimentation (70) pour fournir une pièce à travailler (110) ; un étage de liaison (20) pour maintenir la pièce à travailler (110) fournie par l'unité d'alimentation (70) ; une voie de transport (50a, 50b) pour transporter la pièce à travailler (110) de l'unité d'alimentation (70) vers l'étage de liaison (20) ; et une unité de support de pièce à travailler (400) disposée entre l'unité d'alimentation (70) et l'étage de liaison (20). La voie de transport (50a, 50b) supporte deux côtés de la pièce à travailler (110), une partie inférieure de la pièce à travailler (110) est supportée par l'unité de support de pièce à travailler (400), puis la pièce à travailler (110) est guidée vers l'étage de liaison (20).
PCT/JP2021/018404 2020-06-30 2021-05-14 Dispositif de fabrication d'article et procédé de fabrication d'article WO2022004151A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-112727 2020-06-30
JP2020112727A JP2022011530A (ja) 2020-06-30 2020-06-30 物品の製造装置、物品の製造方法

Publications (1)

Publication Number Publication Date
WO2022004151A1 true WO2022004151A1 (fr) 2022-01-06

Family

ID=79315263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/018404 WO2022004151A1 (fr) 2020-06-30 2021-05-14 Dispositif de fabrication d'article et procédé de fabrication d'article

Country Status (3)

Country Link
JP (1) JP2022011530A (fr)
TW (1) TW202203332A (fr)
WO (1) WO2022004151A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (ja) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd チップのボンディング装置
JP2003224054A (ja) * 2002-01-29 2003-08-08 Canon Inc 半導体露光装置
JP2009010161A (ja) * 2007-06-28 2009-01-15 Sumitomo Heavy Ind Ltd レーザ加工装置、及び、レーザ加工方法
JP2013187493A (ja) * 2012-03-09 2013-09-19 Disco Abrasive Syst Ltd ウエーハの搬出方法
KR20140070071A (ko) * 2012-11-30 2014-06-10 세메스 주식회사 기판 공급 장치
JP2017084951A (ja) * 2015-10-27 2017-05-18 株式会社日本製鋼所 被処理体搬送装置、半導体製造装置および被処理体搬送方法
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
JP2019145692A (ja) * 2018-02-22 2019-08-29 東レエンジニアリング株式会社 実装装置
JP2020038951A (ja) * 2018-09-06 2020-03-12 キヤノンマシナリー株式会社 搬送装置、搬送方法、ダイボンダ、およびボンディング方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (ja) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd チップのボンディング装置
JP2003224054A (ja) * 2002-01-29 2003-08-08 Canon Inc 半導体露光装置
JP2009010161A (ja) * 2007-06-28 2009-01-15 Sumitomo Heavy Ind Ltd レーザ加工装置、及び、レーザ加工方法
JP2013187493A (ja) * 2012-03-09 2013-09-19 Disco Abrasive Syst Ltd ウエーハの搬出方法
KR20140070071A (ko) * 2012-11-30 2014-06-10 세메스 주식회사 기판 공급 장치
JP2017084951A (ja) * 2015-10-27 2017-05-18 株式会社日本製鋼所 被処理体搬送装置、半導体製造装置および被処理体搬送方法
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
JP2019145692A (ja) * 2018-02-22 2019-08-29 東レエンジニアリング株式会社 実装装置
JP2020038951A (ja) * 2018-09-06 2020-03-12 キヤノンマシナリー株式会社 搬送装置、搬送方法、ダイボンダ、およびボンディング方法

Also Published As

Publication number Publication date
TW202203332A (zh) 2022-01-16
JP2022011530A (ja) 2022-01-17

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