WO2021258510A1 - 一种防止金属化半孔毛刺的加工方法 - Google Patents
一种防止金属化半孔毛刺的加工方法 Download PDFInfo
- Publication number
- WO2021258510A1 WO2021258510A1 PCT/CN2020/106994 CN2020106994W WO2021258510A1 WO 2021258510 A1 WO2021258510 A1 WO 2021258510A1 CN 2020106994 W CN2020106994 W CN 2020106994W WO 2021258510 A1 WO2021258510 A1 WO 2021258510A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- processing
- holes
- metallized
- gong
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000003754 machining Methods 0.000 title abstract 2
- 238000012545 processing Methods 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- 238000003801 milling Methods 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000011161 development Methods 0.000 claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 15
- 230000009466 transformation Effects 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 68
- 239000003292 glue Substances 0.000 claims description 44
- 238000003672 processing method Methods 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 7
- 238000007781 pre-processing Methods 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 9
- 238000003912 environmental pollution Methods 0.000 abstract description 8
- 230000008021 deposition Effects 0.000 abstract 1
- 239000003814 drug Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
Definitions
- the invention belongs to the technical field of circuit board processing, and in particular relates to a processing method for preventing metallized half-hole burrs.
- PCB printed Circuit Board
- the Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board.
- the metallized half-hole PCB means that after a hole is drilled, it is drilled and shaped again, and finally half of the metalized hole is retained.
- the specific process flow of the metallized half-hole PCB is: drilling, plate surface plating, external light imaging, pattern plating, drying, half-hole processing, film removal, etching, tin removal, other processes, and shapes.
- the copper burr is formed due to the high-speed rotation of the gong knife, and most of the copper burr exists in the part that extends to the inner wall of the half hole.
- the burr is removed by chemical liquid etching, there are still some burrs remaining After tin plating and copper plating, when the burr adheres to the board surface, the tin side of the burr faces upwards. If the etching is not clean, residual copper will remain and the formation will be short, and because the metal burr is quite fine, it is difficult to be detected by the AOI optical inspection machine , Or during testing, the burrs fall off and are back on the board surface, forming an inner short that further affects the PCB yield rate;
- the present invention provides a processing method for preventing metallized semi-porous burrs.
- the present invention can effectively prevent the production of metalized semi-porous burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
- the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
- a milling cutter with a diameter of 0.6-1.0 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
- the design structure of the gong groove is shown in Fig. 1.
- the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
- the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
- the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
- a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
- the slot is pre-larged by 1mil.
- the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
- a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
- the inner wall of the long groove has a film resistant to developing solution.
- the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
- the film-fading section adopts a film-fading speed of 1m/min-2m/min, so that the inner wall of the long groove is cleaned.
- the general processing technology is: pre-processing ⁇ drilling ⁇ copper sinking ⁇ one copper ⁇ shape layer ⁇ outer layer AOI ⁇ pattern plating ⁇ gong half hole ⁇ chemical etching ⁇ solder mask ⁇ post process.
- the inventor of the present application has improved the following processes through a large number of creative experiments, and achieved the technical effects of the present invention, specifically: sinking the copper half hole before drilling after drilling; before printing the wet film, adopting The method of sealing the holes with blue glue prevents the wet film of the metalized small holes in the PCB board from entering the holes. Due to the slow exchange of the developing solution, the wet film on the hole wall of the small hole remains on the hole wall due to inexhaustible development, which makes it impossible to sink copper and electroplating , It affects the electrical conduction of the product; the printed wet film protects the inner wall of the long groove so that the hole wall cannot form a copper layer.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- Fig. 1 is a schematic diagram of processing a half hole of a gong according to the present invention.
- a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
- the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
- a milling cutter with a diameter of 0.8 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
- the design structure of the gong groove is shown in Fig. 1.
- the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
- the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
- the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
- a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
- the slot is pre-larged by 1mil.
- the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
- a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
- the inner wall of the long groove has a film resistant to developing solution.
- the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
- the film-removing section adopts a film-removing speed of 1.5 m/min to make the inner wall of the long groove clean.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
- the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
- a milling cutter with a diameter of 0.8 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
- the design structure of the gong groove is shown in Fig. 1.
- the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
- the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
- the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
- a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
- the slot is pre-larged by 1mil.
- the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
- a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
- the inner wall of the long groove has a film resistant to developing solution.
- the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
- the film-removing section adopts a film-removing speed of 1.5 m/min to make the inner wall of the long groove clean.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
- the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
- a milling cutter with a diameter of 0.6 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
- the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
- the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
- the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
- a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
- the slot is pre-larged by 1mil.
- the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
- a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
- the inner wall of the long groove has a film resistant to developing solution.
- the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
- the film-removing section adopts a film-removing speed of 1 m/min to make the inner wall of the long groove clean.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
- the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
- a milling cutter with a diameter of 1.0 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
- the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
- the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
- the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
- a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
- the slot is pre-larged by 1mil.
- the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
- a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
- the inner wall of the long groove has a film resistant to developing solution.
- the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
- the film removing section adopts a film removing speed of 2m/min, so that the inner wall of the long groove is cleaned.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
- the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
- 一种防止金属化半孔毛刺的加工方法,其特征在于,包括以下步骤:前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述锣半孔加工中,选择直径为0.6-1.0mm铣刀,在需要制作金属化半孔的位置锣槽。
- 根据权利要求2所述的防止金属化半孔毛刺的加工方法,其特征在于,所述锣半孔加工中,锣槽的长度视所需成排的半孔长度而确定,以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点,以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点,两点之间的距离为长槽长度。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述贴蓝胶加工中,在锣半孔后,整板双面贴蓝胶,将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述蓝胶开窗加工中,采用CO 2激光切割机,将上述半孔及锣半孔时形成的长槽切割开窗,开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述印湿膜加工中,采用整板印湿膜将,选择耐电镀药水的湿膜,使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述图形转型加工中,选择激光直接成像机,将锣半孔所形成的长槽曝光,使得长槽内壁的感光薄膜发生光聚合反应,形成新的抗显影液的薄膜。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述湿膜显影加工中,正常显影后,长槽内壁有抗显影液的薄膜。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,在经过正常沉铜、一铜加工后,长槽内壁有一层薄膜,使得长槽内壁无法形成铜层。
- 根据权利要求1所述的防止金属化半孔毛刺的加工方法,其特征在于,所述外层蚀刻加工中,褪膜段采用1m/min-2m/min褪膜速度。
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CN202010585550.X | 2020-06-24 | ||
CN202010585550.XA CN111970856B (zh) | 2020-08-05 | 2020-08-05 | 一种防止金属化半孔毛刺的加工方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114710881A (zh) * | 2022-03-15 | 2022-07-05 | 金禄电子科技股份有限公司 | 半金属化孔锣板处理方法以及厚铜半孔线路板 |
CN115157713A (zh) * | 2022-07-14 | 2022-10-11 | 西安微电子技术研究所 | 一种微波盲槽外形铣切方法 |
CN115915622A (zh) * | 2022-12-24 | 2023-04-04 | 宏俐(汕头)电子科技有限公司 | 线路板半铜孔加工装置 |
CN115958226A (zh) * | 2023-01-10 | 2023-04-14 | 湖北全成信精密电路有限公司 | 针对采用成型辅助槽针对毛刺的改良工艺 |
CN116329881A (zh) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | 半槽产品捞形加工方法 |
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