WO2021258510A1 - 一种防止金属化半孔毛刺的加工方法 - Google Patents

一种防止金属化半孔毛刺的加工方法 Download PDF

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Publication number
WO2021258510A1
WO2021258510A1 PCT/CN2020/106994 CN2020106994W WO2021258510A1 WO 2021258510 A1 WO2021258510 A1 WO 2021258510A1 CN 2020106994 W CN2020106994 W CN 2020106994W WO 2021258510 A1 WO2021258510 A1 WO 2021258510A1
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WIPO (PCT)
Prior art keywords
hole
processing
holes
metallized
gong
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PCT/CN2020/106994
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English (en)
French (fr)
Inventor
黄双双
林映生
唐宏华
武守坤
陈春
柯涵
Original Assignee
惠州市金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
西安金百泽电路科技有限公司
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Application filed by 惠州市金百泽电路科技有限公司, 深圳市金百泽电子科技股份有限公司, 西安金百泽电路科技有限公司 filed Critical 惠州市金百泽电路科技有限公司
Publication of WO2021258510A1 publication Critical patent/WO2021258510A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate

Definitions

  • the invention belongs to the technical field of circuit board processing, and in particular relates to a processing method for preventing metallized half-hole burrs.
  • PCB printed Circuit Board
  • the Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board.
  • the metallized half-hole PCB means that after a hole is drilled, it is drilled and shaped again, and finally half of the metalized hole is retained.
  • the specific process flow of the metallized half-hole PCB is: drilling, plate surface plating, external light imaging, pattern plating, drying, half-hole processing, film removal, etching, tin removal, other processes, and shapes.
  • the copper burr is formed due to the high-speed rotation of the gong knife, and most of the copper burr exists in the part that extends to the inner wall of the half hole.
  • the burr is removed by chemical liquid etching, there are still some burrs remaining After tin plating and copper plating, when the burr adheres to the board surface, the tin side of the burr faces upwards. If the etching is not clean, residual copper will remain and the formation will be short, and because the metal burr is quite fine, it is difficult to be detected by the AOI optical inspection machine , Or during testing, the burrs fall off and are back on the board surface, forming an inner short that further affects the PCB yield rate;
  • the present invention provides a processing method for preventing metallized semi-porous burrs.
  • the present invention can effectively prevent the production of metalized semi-porous burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
  • the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
  • a milling cutter with a diameter of 0.6-1.0 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
  • the design structure of the gong groove is shown in Fig. 1.
  • the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
  • the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
  • the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
  • a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
  • the slot is pre-larged by 1mil.
  • the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
  • a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
  • the inner wall of the long groove has a film resistant to developing solution.
  • the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
  • the film-fading section adopts a film-fading speed of 1m/min-2m/min, so that the inner wall of the long groove is cleaned.
  • the general processing technology is: pre-processing ⁇ drilling ⁇ copper sinking ⁇ one copper ⁇ shape layer ⁇ outer layer AOI ⁇ pattern plating ⁇ gong half hole ⁇ chemical etching ⁇ solder mask ⁇ post process.
  • the inventor of the present application has improved the following processes through a large number of creative experiments, and achieved the technical effects of the present invention, specifically: sinking the copper half hole before drilling after drilling; before printing the wet film, adopting The method of sealing the holes with blue glue prevents the wet film of the metalized small holes in the PCB board from entering the holes. Due to the slow exchange of the developing solution, the wet film on the hole wall of the small hole remains on the hole wall due to inexhaustible development, which makes it impossible to sink copper and electroplating , It affects the electrical conduction of the product; the printed wet film protects the inner wall of the long groove so that the hole wall cannot form a copper layer.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • Fig. 1 is a schematic diagram of processing a half hole of a gong according to the present invention.
  • a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
  • the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
  • a milling cutter with a diameter of 0.8 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
  • the design structure of the gong groove is shown in Fig. 1.
  • the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
  • the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
  • the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
  • a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
  • the slot is pre-larged by 1mil.
  • the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
  • a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
  • the inner wall of the long groove has a film resistant to developing solution.
  • the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
  • the film-removing section adopts a film-removing speed of 1.5 m/min to make the inner wall of the long groove clean.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
  • the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
  • a milling cutter with a diameter of 0.8 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
  • the design structure of the gong groove is shown in Fig. 1.
  • the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
  • the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
  • the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
  • a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
  • the slot is pre-larged by 1mil.
  • the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
  • a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
  • the inner wall of the long groove has a film resistant to developing solution.
  • the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
  • the film-removing section adopts a film-removing speed of 1.5 m/min to make the inner wall of the long groove clean.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
  • the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
  • a milling cutter with a diameter of 0.6 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
  • the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
  • the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
  • the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
  • a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
  • the slot is pre-larged by 1mil.
  • the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
  • a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
  • the inner wall of the long groove has a film resistant to developing solution.
  • the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
  • the film-removing section adopts a film-removing speed of 1 m/min to make the inner wall of the long groove clean.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • a processing method for preventing metallized half-hole burrs which is characterized in that it comprises the following steps: pre-processing ⁇ drilling ⁇ gong half-hole ⁇ applied blue glue ⁇ blue glue opening window ⁇ printing wet film ⁇ graphic transformation ⁇ wet film development ⁇ Tear blue glue ⁇ sink copper ⁇ one copper ⁇ shape layer ⁇ figure plating ⁇ outer layer etching ⁇ outer layer AOI ⁇ post process.
  • the processing of the half hole of the gong is arranged after the drilling processing and before the sinking copper processing.
  • a milling cutter with a diameter of 1.0 mm is selected, and the gong groove is made at the position where the metalized half-hole needs to be made.
  • the length of the gong groove is determined according to the length of the half-holes in a row, and the length of the selected milling cutter diameter is equal to the length of the selected milling cutter after the outer edge of the first half-hole extends outward.
  • the starting point take the length of the selected milling cutter diameter and the same length as the end point of the outer edge of the last half hole extending outwards, and the distance between the two points is the long groove length.
  • the whole board is pasted with blue glue on both sides, and one short side of both sides of the circuit board is reserved with a width of 2 cm, and the reserved blue glue is folded in half to fit tightly.
  • a CO 2 laser cutting machine is used to cut the long grooves formed when the above half holes and gongs and half holes are cut to open the windows.
  • the slot is pre-larged by 1mil.
  • the entire plate is used to print the wet film, and a wet film resistant to electroplating chemicals is selected, so that a photosensitive film is formed on the inner wall of the long groove formed when the whole plate, half holes and half holes are formed.
  • a laser direct imaging machine is selected to expose the long groove formed by the half hole of the gong, so that the photosensitive film on the inner wall of the long groove undergoes a photopolymerization reaction to form a new film resistant to developer.
  • the inner wall of the long groove has a film resistant to developing solution.
  • the inner wall of the long groove has a thin film, so that the inner wall of the long groove cannot form a copper layer.
  • the film removing section adopts a film removing speed of 2m/min, so that the inner wall of the long groove is cleaned.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.
  • the invention can effectively prevent the generation of metallized half-hole burrs, and does not need to use chemical liquid etching to remove the burrs and cause environmental pollution.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

提供一种防止金属化半孔毛刺的加工方法，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。

Description

一种防止金属化半孔毛刺的加工方法 技术领域
本发明属于线路板加工技术领域，具体涉及一种防止金属化半孔毛刺的加工方法。
 背景技术
PCB （Printed Circuit Board），中文名称为印制电路板，又称印刷线路板，是重要的电子部件，是电子元器件的支撑体，是电子元器件电气连接的载体。由于它采用电子印刷术制作的，故被称为“印刷”电路板。其中，金属化半孔PCB是指一钻孔经孔化后，再二钻、外形工艺，最终保留金属化孔一半。金属化半孔PCB具体工艺流程为：一钻孔、板面电镀、外光成像、图形电镀、烘干、半孔处理、退膜、蚀刻、退锡、其他流程、外形。
技术问题
现有的金属化PCB金属毛刺通常需要通过蚀刻的方式除去毛刺，存在以下两个问题：
1 、锣金属化半孔时，孔铜因锣刀的高速旋转的拉扯，形成铜毛刺，绝大部分铜毛刺存在向半孔内壁延伸的部分，使用化学药水蚀刻除去毛刺时，仍有部分毛刺残留后镀锡、镀铜，当毛刺附着于板面时，毛刺的锡面朝上，若蚀刻不净会存留残铜，并形成微短，且由于金属毛刺相当细致，难以被AOI光学检测机检测，或者在检测时，毛刺脱落并反沾到板面上，形成内短进一步影响PCB良品率；
2 、使用化学药水蚀刻除去毛刺，存在金属化半孔内壁部分孔铜被蚀刻的风险。
技术解决方案
有鉴于此，本发明提供一种防止金属化半孔毛刺的加工方法，本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
本发明的技术方案为：
一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
特别的，本发明中，所述锣半孔加工设置在钻孔加工后，沉铜加工前。
进一步的，所述锣半孔加工中，选择直径为0.6-1.0mm铣刀，在需要制作金属化半孔的位置锣槽。所述锣槽的设计结构如图1所示。
进一步的，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
进一步的，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
进一步的，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
进一步的，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
进一步的，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
进一步的，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
进一步的，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
进一步的，所述外层蚀刻加工中，褪膜段采用1m/min-2m/min褪膜速度，使得长槽内壁褪膜干净。
    现有技术中，一般的加工工艺为：前处理→钻孔→沉铜→一铜→外形图层→外层AOI→图形电镀→锣半孔→化学蚀刻→阻焊→后流程。
 有益效果
与现有技术相比较，本申请发明人通过大量的创造性试验，对以下工艺进行改进，达到了本发明的技术效果，具体为：钻孔后沉铜前锣半孔；印湿膜前，采用贴蓝胶封孔的方式，防止PCB板中的金属化小孔湿膜入孔，因显影药水交换缓慢，小孔孔壁湿膜因显影不尽，而残留在孔壁，导致无法沉铜电镀，影响产品电性导通；印湿膜保护长槽内壁，使其孔壁无法形成铜层。
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
 附图说明
图1为本发明加工锣半孔的示意图。
 本发明的最佳实施方式
为使本发明的目的、技术方案及优点更加清楚明白，以下结合具体实施方式，对本发明进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本发明，并不限定本发明的保护范围。
一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
特别的，本发明中，所述锣半孔加工设置在钻孔加工后，沉铜加工前。
进一步的，所述锣半孔加工中，选择直径为0.8mm铣刀，在需要制作金属化半孔的位置锣槽。所述锣槽的设计结构如图1所示。
进一步的，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
进一步的，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
进一步的，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
进一步的，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
进一步的，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
进一步的，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
进一步的，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
进一步的，所述外层蚀刻加工中，褪膜段采用1.5m/min褪膜速度，使得长槽内壁褪膜干净。
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
 本发明的实施方式
实施例1
一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
特别的，本发明中，所述锣半孔加工设置在钻孔加工后，沉铜加工前。
进一步的，所述锣半孔加工中，选择直径为0.8mm铣刀，在需要制作金属化半孔的位置锣槽。所述锣槽的设计结构如图1所示。
进一步的，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
进一步的，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
进一步的，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
进一步的，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
进一步的，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
进一步的，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
进一步的，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
进一步的，所述外层蚀刻加工中，褪膜段采用1.5m/min褪膜速度，使得长槽内壁褪膜干净。
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
实施例2
一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
特别的，本发明中，所述锣半孔加工设置在钻孔加工后，沉铜加工前。
进一步的，所述锣半孔加工中，选择直径为0.6mm铣刀，在需要制作金属化半孔的位置锣槽。
进一步的，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
进一步的，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
进一步的，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
进一步的，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
进一步的，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
进一步的，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
进一步的，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
进一步的，所述外层蚀刻加工中，褪膜段采用1m/min褪膜速度，使得长槽内壁褪膜干净。
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
 
实施例3
一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
特别的，本发明中，所述锣半孔加工设置在钻孔加工后，沉铜加工前。
进一步的，所述锣半孔加工中，选择直径为1.0mm铣刀，在需要制作金属化半孔的位置锣槽。
进一步的，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
进一步的，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
进一步的，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
进一步的，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
进一步的，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
进一步的，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
进一步的，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
进一步的，所述外层蚀刻加工中，褪膜段采用2m/min褪膜速度，使得长槽内壁褪膜干净。
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。需注意的是，本发明中所未详细描述的技术特征，均可以通过本领域任一现有技术实现。
 工业实用性
本发明可以有效防止金属化半孔毛刺的产生，且无需采用化学药水蚀刻除去毛刺而造成环境污染。

Claims (10)

  1. 一种防止金属化半孔毛刺的加工方法，其特征在于，包括以下步骤：前处理→钻孔→锣半孔→贴蓝胶→蓝胶开窗→印湿膜→图形转型→湿膜显影→撕蓝胶→沉铜→一铜→外形图层→图形电镀→外层蚀刻→外层AOI→后流程。
  2. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述锣半孔加工中，选择直径为0.6-1.0mm铣刀，在需要制作金属化半孔的位置锣槽。
  3. 根据权利要求2所述的防止金属化半孔毛刺的加工方法，其特征在于，所述锣半孔加工中，锣槽的长度视所需成排的半孔长度而确定，以第一个半孔外边沿向外延伸后流程成型所选铣刀直径等长的长度为起点，以最后一个半孔外边沿向外延伸流程成型所选铣刀直径等长的长度为终点，两点之间的距离为长槽长度。
  4. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述贴蓝胶加工中，在锣半孔后，整板双面贴蓝胶，将线路板两面一个短边预留蓝胶宽度2cm,将预留蓝胶对折紧贴。
  5. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述蓝胶开窗加工中，采用CO 2激光切割机，将上述半孔及锣半孔时形成的长槽切割开窗，开窗大小上述半孔及锣半孔时形成的长槽预大1mil。
  6. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述印湿膜加工中，采用整板印湿膜将，选择耐电镀药水的湿膜，使得整板、半孔及锣半孔时形成的长槽内壁形成一层感光薄膜。
  7. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述图形转型加工中，选择激光直接成像机，将锣半孔所形成的长槽曝光，使得长槽内壁的感光薄膜发生光聚合反应，形成新的抗显影液的薄膜。
  8. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述湿膜显影加工中，正常显影后，长槽内壁有抗显影液的薄膜。
  9. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，在经过正常沉铜、一铜加工后，长槽内壁有一层薄膜，使得长槽内壁无法形成铜层。
  10. 根据权利要求1所述的防止金属化半孔毛刺的加工方法，其特征在于，所述外层蚀刻加工中，褪膜段采用1m/min-2m/min褪膜速度。
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CN115958226A (zh) * 2023-01-10 2023-04-14 湖北全成信精密电路有限公司 针对采用成型辅助槽针对毛刺的改良工艺
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CN115915622A (zh) * 2022-12-24 2023-04-04 宏俐（汕头）电子科技有限公司 线路板半铜孔加工装置
CN115915622B (zh) * 2022-12-24 2023-08-08 宏俐（汕头）电子科技有限公司 线路板半铜孔加工装置
CN116329881A (zh) * 2022-12-30 2023-06-27 福莱盈电子股份有限公司 半槽产品捞形加工方法
CN115958226A (zh) * 2023-01-10 2023-04-14 湖北全成信精密电路有限公司 针对采用成型辅助槽针对毛刺的改良工艺

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