WO2021196221A1 - 感光组件、摄像头模组及电子设备 - Google Patents

感光组件、摄像头模组及电子设备 Download PDF

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Publication number
WO2021196221A1
WO2021196221A1 PCT/CN2020/083345 CN2020083345W WO2021196221A1 WO 2021196221 A1 WO2021196221 A1 WO 2021196221A1 CN 2020083345 W CN2020083345 W CN 2020083345W WO 2021196221 A1 WO2021196221 A1 WO 2021196221A1
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Prior art keywords
board
image sensor
sub
side plate
pad
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PCT/CN2020/083345
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English (en)
French (fr)
Inventor
帅文华
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南昌欧菲光电技术有限公司
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Priority to PCT/CN2020/083345 priority Critical patent/WO2021196221A1/zh
Publication of WO2021196221A1 publication Critical patent/WO2021196221A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of imaging technology, in particular to a photosensitive component, a camera module and electronic equipment.
  • the traditional photosensitive component is large in size and cannot meet the needs of miniaturization, lightness and thinness. Therefore, there is a need for a photosensitive component that meets the corresponding functional requirements and has a small overall volume, so as to meet the high requirements of users for product miniaturization and thinning.
  • the purpose of the present invention is to provide a photosensitive component, a camera module and an electronic device, which are used to solve the problem of large volume of the traditional photosensitive component, camera module and electronic device.
  • the photosensitive component of the present application includes an image sensor and a bent circuit board.
  • the bent circuit board includes a bearing sub-board and a connecting sub-board.
  • the connecting sub-board is arranged at an end of the bearing sub-board, and the bearing
  • the daughter board and the connecting daughter board form an accommodating space, the accommodating space is provided with an opening, the image sensor is accommodated in the accommodating space, and the image sensor includes a welding area facing the opening
  • the bent circuit board includes a connecting sub-board, the connecting sub-board includes an inner surface facing the soldering area, the inner surface of the connecting sub-board is provided with a pad, and the soldering area of the image sensor is provided There is a metal bonding pad, and the metal bonding pad is electrically connected to the pad.
  • the bonding pad of the bent circuit board is bent to a position facing the image sensor, and the bonding pad can be in a position opposite to the metal bonding pad of the image sensor
  • the bonding pad can be in a position opposite to the metal bonding pad of the image sensor
  • the photosensitive component further includes a connector, and the connector is provided between the metal bonding pad and the bonding pad, so that the metal bonding pad and the bonding pad are electrically connected.
  • the existence of the connecting member makes the electrical connection between the metal bonding pad and the bonding pad more stable.
  • connection between the metal pad, the connecting member and the pad includes pressure welding and/or conductive glue connection.
  • pressure welding and/or conductive adhesive connection By means of pressure welding and/or conductive adhesive connection, effective electrical connection can be achieved between the metal bonding pad, the connection member and the pad, and the connection structure between the three is relatively stable.
  • the connecting member is at least one of a gold ball, a gold wire and a conductive glue.
  • the above-mentioned connecting member can effectively realize the electrical connection between the metal pad and the bonding pad, and when the gold ball is used as the connecting member, there is no need to reserve a large lateral welding space, which further reduces the photosensitive material described in this application.
  • the volume of the component is at least one of a gold ball, a gold wire and a conductive glue.
  • the bearing sub-board includes a bottom plate and a side plate, the side plate is provided on a part or all of the circumference of the bottom plate, the connecting sub-board is provided at an end of the side plate away from the bottom plate, and the bottom plate
  • the side plate and the connecting sub-board form the accommodating space
  • the image sensor is arranged on the bottom plate, and the side plate partially surrounds the image sensor or completely surrounds the image sensor. Under this structure, the volume of the photosensitive component is reduced, and at the same time, it has a certain structural stability.
  • a first bending mark line is arranged between the bottom plate and the side plate, and the side plate is bent with the first bending mark line as an axis.
  • the existence of the first bending mark line makes the bending operation of the bent circuit board between the bottom plate and the side plate more convenient, and the bending position is more accurate.
  • a second bending mark line is provided between the side plate and the connecting sub-board, and the connecting sub-board is bent with the second bending mark line as an axis.
  • the existence of the second bending mark line makes the bending operation of the bent circuit board between the side plate and the connecting sub-board more convenient, and the bending position is more accurate.
  • the bottom plate and the side plate are spliced to form the bearing sub-board, and/or the bearing sub-board and the connecting sub-board are spliced to form the bent circuit board.
  • the assembly of the photosensitive component described in the present application is more convenient and more flexible.
  • the camera module of the present application includes the photosensitive component, bracket, lens group and lens barrel described in any one of the above.
  • the projection on the connecting daughter board does not exceed the inner edge and/or the outer edge of the connecting daughter board, the lens barrel is mounted on the bracket, the lens group is assembled in the lens barrel, and the lens barrel
  • the projection on the connecting daughter board does not exceed the inner edge and/or the outer edge of the connecting daughter board.
  • the electronic equipment described in this application includes the aforementioned camera module. Due to the existence of the bent circuit board, the soldering pad of the bent circuit board is bent to a position facing the image sensor, and the soldering pad can be soldered at the opposite position to the metal soldering pad of the image sensor.
  • the lateral space for welding reduces the volume of the photosensitive component, thereby reducing the volume of the camera module composed of the photosensitive component, thereby realizing the miniaturization, lightness and thinness of the electronic device.
  • Figure 1 is a schematic diagram of the structure of a conventional camera module.
  • Fig. 2 is a partial enlarged view of a welding part in the conventional camera module shown in Fig. 1.
  • FIG. 3 is a schematic structural diagram of a camera module provided by an embodiment of the present application.
  • Fig. 4 is a partial enlarged view of the welding part in the camera module shown in Fig. 3.
  • Fig. 5 is a schematic diagram of the expanded structure of the photosensitive component in the camera module.
  • FIG. 6 is a schematic diagram of the expanded structure of the photosensitive component of the camera module in another embodiment.
  • FIG. 7 is a schematic diagram of the expanded structure of the photosensitive component of the camera module in a third embodiment.
  • FIG. 8 is a schematic diagram of the connection structure between the photosensitive component and the connector in an embodiment.
  • FIG. 1 is a schematic structural diagram of a conventional camera module 200.
  • FIG. 2 is a partial enlarged view of a welding part in the conventional camera module 200 shown in FIG. 1.
  • the circuit board is usually a flat structure, and the image sensor 20 is arranged on the flat circuit board 10, and the electrical connection between the image sensor 20 and the flat circuit board 10 is realized by welding the connector 40.
  • the peripheral area of the surface of the image sensor 20 away from the flat circuit board 10 is the soldering area 201
  • the soldering area 201 of the image sensor 20 is provided with a metal soldering pad 21
  • the planar circuit board 10 is provided with a soldering pad 321.
  • One end of 40 is welded to the metal pad 21, and the other end of the connector 40 is welded to the pad 321, so as to realize the electrical connection between the image sensor 20 and the flat circuit board 10.
  • the conventional camera module 200 since the distance between the bonding pad 321 and the metal bonding pad 21 is relatively long, a relatively long connecting member 40 is usually required to connect the bonding pad 321 and the metal bonding pad 21.
  • the gold wire 41 solders the bonding pad 321 to the metal bonding pad 21.
  • the longer gold wire 41 can meet the long-distance welding needs, in the assembly process, a larger lateral space for welding the gold wire 41 needs to be reserved in the traditional camera module 200, so that the traditional camera module
  • the 200 has a large volume and occupies a large space, which cannot meet the design requirements of miniaturization, lightness and thinness.
  • FIG. 3 is a schematic structural diagram of a camera module 100 provided by an embodiment of the present application.
  • FIG. 4 is a partial enlarged view of the welding part in the camera module 100 shown in FIG. 3.
  • the camera module 100 provided by the embodiment of the present application includes a photosensitive component 110, wherein the photosensitive component 110 includes an image sensor 20 and a bent circuit board 30.
  • the bent circuit board 30 includes a bearing sub-board 31 and a connecting sub-board 32.
  • the connecting sub-board 32 is provided at an end of the bearing sub-board 31, and the bearing sub-board 31 and the connecting sub-board 32 form an accommodating space.
  • the accommodating space is provided with an opening, and the image sensor 20 is accommodated in the accommodating space.
  • the image sensor 20 includes a soldering area 201 facing the opening, the connecting daughter board 32 includes an inner surface that faces the soldering area 201, the inner surface of the connecting daughter board 32 is provided with a pad 321, and the soldering area 201 of the image sensor 20 is provided with a metal pad 21.
  • the metal pad 21 is electrically connected to the pad 321.
  • the bonding pad 321 of the bent circuit board 30 is bent to a position facing the image sensor 20.
  • the bonding pad 321 can be welded at an opposite position to the metal pad 21 of the image sensor 20, and there is no need to reserve a larger lateral space for welding, so that the photosensitive component 110 provided by the embodiment of the present application is compared with the traditional photosensitive component. In other words, it has the advantage of being smaller.
  • the bent circuit board 30 is composed of a supporting sub-board 31 and a connecting sub-board 32.
  • the bearing sub-board 31 is composed of a bottom plate 33 and a side plate 34.
  • the side plate 34 is disposed on the periphery of the bottom plate 33.
  • the side plate 34 can be disposed on a part of the periphery or the entire periphery of the bottom plate 33.
  • the supporting sub-board 31 is formed.
  • the connecting sub-board 32 is provided at the end of the supporting sub-board 31, that is, the connecting sub-board 32 is provided at the end of the side plate 34 away from the bottom plate 33.
  • the bottom plate 33, the side plate 34 and the connecting sub-board 32 are formed together for accommodating the image sensor 20.
  • the housing space is formed together for accommodating the image sensor 20.
  • the image sensor 20 is provided on the bottom plate 33. It can be understood that, in order to reduce the size of the camera module 100, the size of the bottom plate 33 may be designed to correspond to the size of the image sensor 20. It should be noted that the bottom plate 33 and the side plates 34, and/or the bearing sub-board 31 and the connecting sub-board 32 can be integrally connected to make the structure more stable, or they can be connected in a splicing manner to make the assembly process More convenient and flexible.
  • the side plate 34 surrounds the image sensor 20. It should be noted that the side plate 34 surrounds the image sensor 20. It is not limited to the side plate 34 that completely surrounds the image sensor 20. The side plate 34 can also partially surround the image sensor 20. Structure to determine. The number of side plates 34 is greater than or equal to 1 and less than or equal to 4. When the number of side plates 34 is less than 4, the side plates 34 partially surround the image sensor 20. When the number of side plates 34 is 4, the side plates 34 are completely Surround the image sensor 20. Among them, the number of side plates 34 is determined by the structure of the metal pads 21 of the image sensor 20. When the metal pads 21 are only distributed in one direction, only one side plate 34 corresponding to that direction needs to be provided. When the pads 21 are distributed in multiple directions, multiple side plates 34 are required to correspond to them.
  • FIG. 5 is a schematic diagram of the expanded structure of the photosensitive component 110 in the camera module 100.
  • FIG. 6 is a schematic diagram of an expanded structure of the photosensitive component 110 in the camera module 100 in another embodiment.
  • FIG. 7 is a schematic diagram of the expanded structure of the photosensitive component 110 in the camera module 100 in the third embodiment.
  • the number of side plates 34 is two, and they are arranged on the periphery of the bottom plate 33 relative to each other.
  • the side plates 34 and the bottom plate 33 are connected at an angle to surround the The image sensor 20 on the bottom plate 33. Since the side plate 34 has a symmetrical structure, the structure of the camera module 100 formed by the side plate 34 is also relatively stable. Among them, various electronic components 341 are also provided on the side plate 34 to meet functional requirements.
  • the size of the bottom plate 33 may be slightly larger than the size of the image sensor 20 on the plane where the photosensitive surface is located, so that there is a certain gap between the side plate 34 and the image sensor 20 to prevent the image sensor 20 from being squeezed and damaged. .
  • the side plate 34 is arranged perpendicular to the bottom plate 33. It should be noted that in process design and production, due to limitations of errors or process levels, the vertical in the embodiment of the present application may not be strictly perpendicular to each other. That is, in the camera module 100 provided in the embodiment of the present application, the side plate The included angle between the side plate 34 and the bottom plate 33 is close to 90°, but not 90°. However, in the camera module 100 provided by the embodiment of the present application, the included angle error between the side plate 34 and the bottom plate 33 due to the process is very important for It should be acceptable to those skilled in the art, and the included angle should not affect the realization of the objectives of the embodiments of the present invention.
  • the number of side plates 34 is one, which is provided on the periphery of the bottom plate 33, and the side plates 34 and the bottom plate 33 are connected at an angle, thereby partially enclosing the image sensor 20 provided on the bottom plate 33. . Since the number of side plates 34 is only one, the structural stability of the camera module 100 formed by it is poor. Therefore, the structure of the camera module 100 shown in this embodiment is only used under certain circumstances, and under certain circumstances Next, it needs to be stabilized.
  • the number of side plates 34 is three, which are provided on the periphery of the bottom plate 33, and the side plates 34 and the bottom plate 33 are connected at an angle, thereby partially enclosing the image sensor 20 provided on the bottom plate 33.
  • the three side plates 34 are respectively arranged at positions corresponding to the metal pads 21.
  • the connecting sub-board 32 is provided at an end of the side plate 34 away from the bottom plate 33. Further, the connecting sub-board 32 is located in a direction away from the bottom plate 33 of the image sensor 20, and is accommodating In the space, the inner surface of the connecting sub-board 32 is opposite to the welding area 201 of the image sensor 20. On the inner surface of the connecting sub-board 32, that is, the side facing the image sensor 20, there is provided a pad 321, which is used for welding with The metal pads 21 on the area 201 are connected, so as to realize the electrical connection between the bent circuit board 30 and the image sensor 20.
  • the camera module 100 can be connected to the main board of the electronic device through the connector 80.
  • the connector 80 is connected to the photosensitive component 110. It is understood that the connector 80 can be arranged in any The location that meets the functional requirements is not further limited here.
  • the flat circuit board 10 is usually bent to form the bent circuit board 30 instead of directly forming the bent circuit board 30 through a mold. Therefore, a bending mark line is provided on the bent circuit board 30, which is beneficial to the bending process.
  • a first bending mark line 35 is provided between the bottom plate 33 and the side plate 34.
  • the side plate 34 can be bent with the first bending mark line 35 as an axis. Therefore, during the bending operation, the connection position between the side plate 34 and the bottom plate 33 can be accurately and conveniently determined, and the side plate 34 can be easily bent to connect it with the bottom plate 33 at an angle, so that the side plate 34 and the bottom plate 33 can be connected at an angle.
  • the bending operation between the bottom plates 33 is simple and accurate.
  • a second bending mark line 36 is provided between the side plate 34 and the connecting sub-board 32.
  • the connecting sub-board 32 can be bent with the second bending mark line 36 as an axis. Therefore, when the bending operation is performed, the connection position between the side plate 34 and the connecting sub-board 32 can be accurately and conveniently determined, and the connecting sub-board 32 can be easily bent so that the connecting sub-board 32 faces the image sensor 20.
  • the inner surface of the connecting sub-board 32 faces the image sensor 20 and is opposite to the welding area 201, so that the bending operation between the side plate 34 and the connecting sub-board 32 is simple and accurate.
  • a first bending mark line 35 is provided between the bottom plate 33 and the side plate 34, and a second bending mark line 36 is also provided between the side plate 34 and the connecting sub-board 32.
  • the bending mark lines are set at the two positions at the same time, so that the process of bending to form the bent circuit board 30 is simpler and more accurate.
  • the image sensor 20 is disposed on the bottom plate 33, and the image sensor 20 is fixedly connected to the bottom plate 33 by glue. It can be understood that the image sensor 20 is connected to the bottom plate 33.
  • the connection between the connections is not limited to glue connection, but can also be connected in other ways.
  • the surface of the image sensor 20 away from the bottom plate 33 includes a sensing area 202 and a welding area 201 surrounding the sensing area 202.
  • the sensing area 202 is used to meet the requirements of image sensing functions.
  • the welding area 201 is provided with a metal pad 21, and the metal pad 21 is used for It is welded together with the pad 321 on the connecting daughter board 32, so that an electrical connection between the bent circuit board 30 and the image sensor 20 is realized.
  • the connecting daughter board 32 and the image sensor 20 are disposed opposite to each other.
  • the size of the connecting daughter board 32 should be within the set range.
  • the setting range means that the connecting daughter board 32 should only be located within the area corresponding to the welding area 201, and the sensing area 202 cannot be shielded, thereby avoiding The working performance of the camera module 100 is affected.
  • the photosensitive component 110 further includes a connector 40.
  • the connector 40 is arranged between the metal pad 21 and the pad 321.
  • the metal pad 21 and the pad 321 are connected to each other. Together, an electrical connection between the metal pad 21 and the pad 321 is achieved.
  • the connecting member 40 is at least one of a gold ball 42, a gold wire and a conductive glue.
  • the gold ball 42 is a spherical or spherical structure made of gold with a purity of 99.9% and above.
  • the gold ball 42 as the connecting member 40 to connect the metal pad 21 and the bonding pad 321, for example, a pressure welding method and/or a conductive glue connection method.
  • the metal pad 21, the connector 40 and the pad 321 are connected through the joint action of the pressure welding and the conductive glue connection, so as to realize the electrical connection between the metal pad 21 and the pad 321, that is, the bending circuit The electrical connection between the board 30 and the image sensor 20.
  • the gold ball 42 is welded to the pad 321 and the metal pad 21 by pressure welding, and pressure is applied to make the atoms on the surface of the gold ball 42 and the pad 321 and the metal pad 21 respectively.
  • a metal bond is formed between the atoms to be connected together, thereby achieving electrical connection between the bonding pad 321 and the metal bonding pad 21.
  • welding is performed by pressure welding, there is no need to reserve space for the welding operation, so that the camera module 100 has a more compact structure and a smaller volume.
  • the joint structure of the gold ball 42, the bonding pad 321, and the metal pad 21 can be further reinforced by the conductive glue on the basis of the pressure welding, so that the structure is more stable.
  • the conductive adhesive uses anisotropic conductive adhesive. When an anisotropic conductive adhesive is used for connection, the pad 321 and the metal pad 21 can be electrically connected through the anisotropic conductive adhesive at the same time. The unidirectional conductivity of the anisotropic conductive adhesive can ensure that there is no short circuit between adjacent conductive units.
  • the distance between the welding area 201 and the inner surface of the connecting daughter board 32 ranges from 60 ⁇ m to 80 ⁇ m.
  • the distance between the metal pad 21 and the pad 321 is in the range of 60 ⁇ m to 80 ⁇ m, that is, the height of the space for placing the gold ball 42 is 60 ⁇ m to 80 ⁇ m.
  • the formed camera module 100 can meet the corresponding functional requirements.
  • the camera module 100 provided by the embodiment of the present application further includes a bracket 50 that can be used to carry the filter 51.
  • the bracket 50 is provided on the connecting sub-board 32 and is away from the bottom plate 33.
  • the projection on the connecting daughter board 32 does not exceed the inner edge and/or the outer edge of the connecting daughter board 32.
  • the bracket 50 When the projection of the bracket 50 on the connecting daughter board 32 does not exceed the inner edge of the connecting daughter board 32, the bracket 50 will not block the light, and the bracket 50 will not cover the sensing area 202 of the image sensor 20, and will not affect The performance of the image sensor 20; when the projection of the bracket 50 on the connecting sub-board 32 does not exceed the outer edge of the connecting sub-board 32, the space occupied by the bracket 50 is small, thereby reducing the size of the camera module 100.
  • the camera module 100 provided by the embodiment of the present application further includes a lens group 60 and a lens barrel 70.
  • the lens group 60 is arranged opposite to the photosensitive component 110, and the lens group 60 and the image sensor 20 in the photosensitive component 110 are located in the same light.
  • the lens barrel 70 is installed on the bracket 50, the lens group 60 is assembled in the lens barrel 70, and the projection of the lens barrel 70 on the connecting sub-board 32 does not exceed the inner edge and/or the outer edge of the connecting sub-board 32.
  • the projection of the lens barrel 70 on the connecting daughter board 32 does not exceed the inner edge of the connecting daughter board 32, the lens barrel 70 will not block the light, and the lens barrel 70 will not cover the sensing area 202 of the image sensor 20.
  • the performance of the image sensor 20 will not be affected; when the projection of the lens barrel 70 on the connecting daughter board 32 does not exceed the outer edge of the connecting daughter board 32, the space occupied by the lens barrel 70 is small, thereby reducing the camera module 100 the size of.
  • the bonding pad 321 of the bent circuit board 30 is bent to a position facing the image sensor 20, and the bonding pad 321 can be connected to the image sensor 20.
  • the metal bonding pads 21 are welded at opposite positions, so there is no need to reserve a large lateral space for welding, and the volume of the camera module 100 is reduced.
  • the embodiment of the present application provides an electronic device, including but not limited to a camera, a camera, a tablet computer, a mobile phone, etc.
  • the electronic device includes the camera module 100 provided in the foregoing embodiment. It should be noted that the electronic device provided in this embodiment The working principle of the camera module 100 is the same as that of the camera module 100 in the above-mentioned embodiment, and will not be repeated here.
  • the bonding pad 321 of the bending circuit board 30 is bent to a position facing the image sensor 20
  • the soldering pad 321 can be soldered at the opposite position to the metal soldering pad 21 of the image sensor 20, and there is no need to reserve a large lateral space for soldering, which reduces the volume of the photosensitive component 110 and the composition of the photosensitive component 110.
  • the volume of the camera module 100 further reduces the volume of the electronic device, so that the electronic device provided in the embodiments of the present application meets the requirements of miniaturization and lightness.

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Abstract

本申请提供一种感光组件、摄像头模组以及电子设备。感光组件包括图像传感器和弯折电路板，弯折电路板包括承载子板与连接子板，连接子板设于承载子板的端部，承载子板与连接子板形成一个容置空间，容置空间设有开口，图像传感器容置于容置空间内，图像传感器包括朝向开口的焊接区，连接子板包括朝向焊接区的内表面，连接子板的内表面设有焊盘，图像传感器的焊接区上设有金属焊垫，金属焊垫与焊盘电连接。由于摄像头模组中弯折电路板的弯折结构设计，使得焊盘与图像传感器的金属焊垫在相对的位置进行焊接，感光组件无需预留较大的用于焊接金线的横向空间，减小了感光组件的体积，从而使得由感光组件组成的摄像头模组实现小型化。

Description

感光组件、摄像头模组及电子设备 技术领域
本发明涉及摄像技术领域，特别涉及一种感光组件、摄像头模组及电子设备。
背景技术
随着多媒体的快速发展，拍照功能已成为各类电子设备的基础配置，摄像头模组已被广泛应用于手机、电脑、微型摄像头等电子设备中，同时，电子设备的小型化、轻薄化已经成为主流趋势。
然而，传统的感光组件体积较大，无法满足小型化、轻薄化的需求。因此，需要一种感光组件，在满足相应功能需求的同时，整体的体积较小，从而满足用户对产品小型化及轻薄化的较高要求。
发明内容
本发明的目的在于提供一种感光组件、摄像头模组及电子设备，用于解决传统的感光组件、摄像头模组和电子设备体积较大的问题。
本申请所述感光组件，包括图像传感器和弯折电路板，所述弯折电路板包括承载子板与连接子板，所述连接子板设于所述承载子板的端部，所述承载子板与所述连接子板形成一个容置空间，所述容置空间设有开口，所述图像传感器容置于所述容置空间内，所述图像传感器包括朝向所述开口的焊接区，所述弯折电路板包括连接子板，所述连接子板包括朝向所述焊接区的内表面，所述连接子板的内表面设有焊盘，所述图像传感器的所述焊接区上设有金属焊垫，所述金属焊垫与所述焊盘电连接。
本申请所述感光组件中，由于弯折电路板的弯折结构设计，使得弯折电路板的焊盘弯折到朝向图像传感器的位置，焊盘可以与图像传感器的金属焊垫在相对的位置进行焊接，进而无需预留较大的用于焊接的横向空间，减小了本申请所述感光组件的体积，从而实现小型化。
其中，所述感光组件还包括连接件，所述连接件设于所述金属焊垫与所述 焊盘之间，以使所述金属焊垫与所述焊盘进行电连接。所述连接件的存在，使得所述金属焊垫与所述焊盘之间的电连接更加稳定。
其中，所述金属焊垫、所述连接件和所述焊盘之间的连接方式包括压焊，和/或导电胶连接。通过压焊和/或导电胶连接的方式，所述金属焊垫、所述连接件和所述焊盘之间能够实现有效电连接，且三者之间的连接结构较为稳定。
其中，所述连接件为金球、金线和导电胶中的至少一种。上述连接件能有效实现所述金属焊垫和所述焊盘之间的电连接，且当以金球作为连接件，无需预留较大的横向焊接空间，进一步减小了本申请所述感光组件的体积。
其中，所述承载子板包括底板以及侧板，所述侧板设于所述底板的部分周缘或全部周缘，所述连接子板设于所述侧板远离所述底板的一端，所述底板、所述侧板以及所述连接子板形成所述容置空间，所述图像传感器设于所述底板上，所述侧板部分包围所述图像传感器，或完全包围所述图像传感器。在此结构下，所述感光组件的体积减小，同时，具有一定的结构稳定性。
其中，所述底板与所述侧板之间设置第一弯折标志线，所述侧板以所述第一弯折标志线为轴进行弯折。所述第一弯折标志线的存在，使得所述弯折电路板在所述底板与所述侧板之间的弯折操作更加方便，且弯折的位置更加精准。
其中，所述侧板与所述连接子板之间设置有第二弯折标志线，所述连接子板以所述第二弯折标志线为轴进行弯折。所述第二弯折标志线的存在，使得所述弯折电路板在所述侧板与所述连接子板之间的弯折操作更加方便，且弯折的位置更加精准。
其中，所述底板和所述侧板以拼接的方式形成所述承载子板，和/或所述承载子板与所述连接子板以拼接的方式形成所述弯折电路板。在此结构下，使得本申请所述感光组件的组装更加方便且灵活性更强。
本申请所述摄像头模组，包括上述任一项所述的感光组件、支架、透镜组和镜筒，所述支架设于所述连接子板上，且背离所述底板，所述支架在所述连接子板上的投影不超过所述连接子板的内边缘和/或外边缘，所述镜筒安装在所述支架上，所述透镜组组装于所述镜筒内，所述镜筒在所述连接子板上的投影不超过所述连接子板的内边缘和/或外边缘。控制所述支架在所述连接子板上的投影不超过所述连接子板的内边缘，避免了所述支架对光线的遮挡，控制 所述支架在所述连接子板上的投影不超过所述连接子板的外边缘，从而减小了所述摄像头模组的体积；控制所述镜筒在所述连接子板上的投影不超过所述连接子板的内边缘，避免了所述镜筒对光线的遮挡，控制所述镜筒在所述连接子板上的投影不超过所述连接子板的外边缘，从而减小了所述摄像头模组的体积。
本申请所述电子设备，包括上述摄像头模组。由于弯折电路板的存在，使得弯折电路板的焊盘弯折到朝向图像传感器的位置，焊盘可以与图像传感器的金属焊垫在相对的位置进行焊接，进而无需预留较大的用于焊接的横向空间，减小了感光组件的体积，从而减小了由感光组件组成的摄像头模组的体积，进而实现了所述电子设备的小型化、轻薄化。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是传统摄像头模组的结构示意图。
图2是图1所示传统摄像头模组中焊接部位的局部放大图。
图3是本申请实施例提供的摄像头模组的结构示意图。
图4是图3所示摄像头模组中焊接部位的局部放大图。
图5是摄像头模组中感光组件的展开结构示意图。
图6是摄像头模组中感光组件在另一种实施方式下的展开结构示意图。
图7是摄像头模组中感光组件在第三种实施方式下的展开结构示意图。
图8是在感光组件与连接器在一种实施方式下的连接结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1和图2，图1是传统摄像头模组200的结构示意图。
图2是图1所示传统摄像头模组200中焊接部位的局部放大图。
在传统摄像头模组200中，电路板通常为平板结构，图像传感器20设置在平板电路板10上，采用连接件40焊接的方式实现图像传感器20与平板电路板10之间的电连接。具体的，图像传感器20背离平板电路板10的表面的周缘区域为焊接区201，图像传感器20的焊接区201上设置有金属焊垫21，平板电路板10上设置有焊盘321，将连接件40的一端与金属焊垫21焊接在一起，将连接件40的另一端与焊盘321焊接在一起，从而实现图像传感器20与平板电路板10之间的电连接。然而，在传统摄像头模组200中，由于焊盘321与金属焊垫21之间的距离较远，通常需要较长的连接件40将焊盘321与金属焊垫21连接，如采用较长的金线41将焊盘321与金属焊垫21焊接。虽然较长的金线41能够满足较远距离的焊接需求，但在组装过程中，需要在传统摄像头模组200中预留较大的用于焊接金线41的横向空间，使得传统摄像头模组200的体积较大，所占用的空间较大，不能够达到小型化、轻薄化的设计要求。
请一并参阅图3和图4，图3是本申请实施例提供的摄像头模组100的结构示意图。
图4是图3所示摄像头模组100中焊接部位的局部放大图。
本申请实施例提供的摄像头模组100包括感光组件110，其中感光组件110包括图像传感器20和弯折电路板30。弯折电路板30包括承载子板31与连接子板32，连接子板32设于承载子板31的端部，承载子板31与连接子板32形成一个容置空间。容置空间设有开口，图像传感器20容置于容置空间内。图像传感器20包括朝向开口的焊接区201，连接子板32包括朝向焊接区201的内表面，连接子板32的内表面设有焊盘321，图像传感器20的焊接区201上设有金属焊垫21，金属焊垫21与焊盘321电连接。
本申请实施例提供的感光组件110中，由于弯折电路板30的存在，使得弯折电路板30的焊盘321弯折到朝向图像传感器20的位置。焊盘321可以与图像传感器20的金属焊垫21在相对的位置进行焊接，进而无需预留较大的用 于焊接的横向空间，使得本申请实施例提供的感光组件110相对于传统的感光组件来说，具有体积较小的优势。
弯折电路板30由承载子板31与连接子板32构成。在一种实施方式中，承载子板31由底板33和侧板34构成，侧板34设置于底板33的周缘，其中，侧板34可以设于底板33的部分周缘或全部周缘，两者共同构成承载子板31。连接子板32设于承载子板31的端部，即连接子板32设于侧板34远离底板33的一端，底板33、侧板34和连接子板32共同形成用于容置图像传感器20的容置空间。图像传感器20设于底板33上。可以理解的是，为了减小摄像头模组100的体积，底板33的尺寸可设计为与图像传感器20的尺寸相对应。需要说明的是，底板33与侧板34之间，和/或承载子板31与连接子板32之间可以为一体成型连接，使结构更加稳定，也可以以拼接的方式连接，使得组装过程更加方便且灵活。
其中，侧板34包围图像传感器20，需要说明的是，侧板34包围图像传感器20，不仅限于侧板34完全包围图像传感器20，还可以为侧板34部分包围图像传感器20，需要根据具体的结构来进行确定。侧板34的数量大于等于1个并且小于等于4个，当侧板34的数量小于4个时，侧板34部分包围图像传感器20，当侧板34的数量为4个时，侧板34完全包围图像传感器20。其中，侧板34的数量由图像传感器20的金属焊垫21结构来决定，当金属焊垫21仅分布在一个方向时，仅需在该方向上设置一个侧板34与之对应，当金属焊垫21在多个方向上分布时，则需要多个侧板34与之对应。
请一并参阅图5、图6、和图7，图5是摄像头模组100中感光组件110的展开结构示意图。
图6是摄像头模组100中感光组件110在另一种实施方式下的展开结构示意图。
图7是摄像头模组100中感光组件110在第三种实施方式下的展开结构示意图。
如图5所示，在本申请实施例所示的感光组件110中，侧板34的数量为2个，且相对设置于底板33周缘，侧板34与底板33呈角度连接，从而包围设于底板33上的图像传感器20。由于侧板34为对称结构，使得其组成的摄 像头模组100的结构也较为稳定。其中，在侧板34上还设置有各类电子元器件341，以满足功能需求，可以理解的是，为了避免图像传感器20与侧板34之间相接触而导致对图像传感器20功能造成不良影响，底板33的尺寸可以略大于图像传感器20在感光面所在平面上的尺寸，使得侧板34与图像传感器20之间存在一定的间隙，防止图像传感器20受挤压而导致损坏。。
在一种具体的实施方式中，侧板34垂直于底板33设置。需要说明的是，在工艺设计以及生产中，由于受误差或者工艺水平的限制，本申请实施例中的垂直可能不是严格的互相垂直，即本申请实施例提供的摄像头模组100中，侧板34与底板33之间的夹角接近90°，但不是90°，但本申请实施例提供的摄像头模组100中，侧板34与底板33之间的因工艺所带来的夹角误差对于本领域的技术人员来说应该是能够接受的，且该夹角不应该影响本发明实施例目的的实现。
如图6所示，在一种实施方式中，侧板34的数量为1个，设置于底板33周缘，侧板34与底板33呈角度连接，从而部分包围设于底板33上的图像传感器20。由于侧板34的数量仅为1个，其组成的摄像头模组100的结构稳定性较差，因此，仅在特定情况下采用本实施方式所示的摄像头模组100结构，且在一定的情况下，需要对其进行稳定性补强。
如图7所示，在一种实施方式中，侧板34的数量为3个，设置于底板33周缘，侧板34与底板33呈角度连接，从而部分包围设于底板33上的图像传感器20，3个侧板34分别设置在金属焊垫21对应的位置。
在本申请实施例所示的摄像头模组100中，连接子板32设于侧板34远离底板33的一端，进一步的，连接子板32位于图像传感器20远离底板33的方向，且在容置空间内，连接子板32的内表面与图像传感器20的焊接区201相对，在连接子板32的内表面，即朝向图像传感器20的一面，设置有焊盘321，焊盘321用于与焊接区201上的金属焊垫21相连接，从而实现弯折电路板30与图像传感器20的电连接。
请参阅图8，摄像头模组100可通过连接器80与电子设备的主板连接，在一种实施方式中，连接器80连接在感光组件110上，可以理解的是，连接器80可设置在任意满足功能需求的位置，在此不对其连接位置进行进一步的 限定。
可以理解的是，在工业生产中，通常是将平板电路板10进行弯折处理形成弯折电路板30，而不是通过模具一次直接制成弯折电路板30。因此，在弯折电路板30上设置有弯折标志线，有利于弯折处理。
请再次参阅图5至图8。在一种实施方式中，底板33与侧板34之间设置第一弯折标志线35。在将平板电路板10弯折处理形成弯折电路板30的过程中，侧板34能够以第一弯折标志线35为轴进行弯折。因此，进行弯折操作时，能够准确方便的确定侧板34和底板33之间的连接位置，并可以轻松地将侧板34弯折，使其与底板33呈角度连接，使得侧板34与底板33间的弯折操作简单准确。
在一种实施方式中，侧板34与连接子板32之间设置有第二弯折标志线36。在将平板电路板10弯折处理形成弯折电路板30的过程中，连接子板32能够以第二弯折标志线36为轴进行弯折。因此，进行弯折操作时，能够准确方便的确定侧板34和连接子板32之间的连接位置，并可以轻松地将连接子板32弯折，使连接子板32与图像传感器20相对，连接子板32的内表面朝向图像传感器20，并与焊接区201相对，使得侧板34与连接子板32间的弯折操作简单准确。
在一种实施方式中，底板33与侧板34之间设置第一弯折标志线35，并且，侧板34与连接子板32之间也设置有第二弯折标志线36。两处位置同时设置弯折标志线，使得弯折形成弯折电路板30的工艺更加简单准确。
如图3所示，本申请实施例所述的摄像头模组100中，图像传感器20设置在底板33上，图像传感器20通过胶水与底板33固定连接，可以理解的是，图像传感器20与底板33之间的连接方式不仅限于胶水连接，还可以为其他方式连接。图像传感器20背离底板33的表面包括感应区202和包围感应区202的焊接区201，感应区202用于满足图像感应功能需求，焊接区201上设置有金属焊垫21，金属焊垫21用于和连接子板32上的焊盘321焊接在一起，使得弯折电路板30与图像传感器20之间实现电连接。需要说明的是，在将金属焊垫21与焊盘321焊接在一起的过程中，连接子板32与图像传感器20相对设置。其中，连接子板32的大小应该在设定范围内，设定范围指的是，连接 子板32应仅位于焊接区201对应的区域范围内，不能够对感应区202进行遮挡，从而避免了摄像头模组100的工作性能受到影响。
如图3所示，本申请实施例所述的感光组件110还包括连接件40，连接件40设于金属焊垫21与焊盘321之间，通过将金属焊垫21与焊盘321连接在一起，从而实现金属焊垫21与焊盘321之间电连接。在本申请实施例中，连接件40为金球42、金线和导电胶中的至少一种，当使用金线41时，由于本申请实施例提供的感光组件110中，焊盘321与金属焊垫21位于相对位置，可有效缩短金线41的长度，从而降低成本；当以金球42代替金线41作为连接件40，则无需给金线41焊接预留较大的横向空间，从而减小了感光组件110的体积，进一步实现了由感光组件110组成的摄像头模组100的小型化；当以导电胶作为连接件40时，同样能达到相应的功能效果；当以金线41、金球42和导电胶中的多种进行组合使用时，则可有效提升连接件40的结构稳定性。其中，金球42是纯度为99.9％及以上的金制成的类球状或球状结构。
需要说明的是，使用金球42作为连接件40连接金属焊垫21与焊盘321的方式可以为多种，例如，通过压焊的方式和/或导电胶连接的方式。
在一种实施方式中，通过压焊和导电胶连接的共同作用，连接金属焊垫21、连接件40和焊盘321，从而实现金属焊垫21和焊盘321的电连接，即弯折电路板30与图像传感器20之间的电连接。
其中，通过压焊的方式，使得金球42分别与焊盘321和金属焊垫21焊接在一起，是通过压力作用，使得金球42表面的原子分别与焊盘321和金属焊垫21表面的原子之间形成金属键从而连接在一起，进而实现焊盘321与金属焊垫21之间的电连接。并且，使用压焊的方式进行焊接时，无需给焊接操作预留空间，使得摄像头模组100的结构更加紧凑，体积更小。
其中，在压焊的基础上通过导电胶共同作用的方式，能够对金球42、焊盘321和金属焊垫21三者之间的连接结构进行进一步的补强，使其结构更加稳定。在具体的实施方式中，导电胶使用异方性导电胶，使用异方性导电胶进行连接时，焊盘321与金属焊垫21之间能够同时通过异方性导电胶进行电连接，且由于异方性导电胶的单向导电性，能够保证相邻导电单元之间不会发生短路。
其中，焊接区201与连接子板32的内表面之间的距离范围为60μm～80μm。在具体的实施方式中，金属焊垫21与焊盘321之间的距离处于60μm～80μm范围内，即用于放置金球42的空间高度为60μm～80μm，当处于上述距离范围内时，能够满足工艺加工需要，所组成的摄像头模组100能够满足相应的功能要求。
如图3所示，本申请实施例提供的摄像头模组100还包括支架50，支架50可以用来承载滤光片51，支架50设于连接子板32上，且背离底板33，支架50在连接子板32上的投影不超过连接子板32的内边缘和/或外边缘。当支架50在连接子板32上的投影不超过连接子板32的内边缘时，支架50不会对光线进行遮挡，且支架50不会覆盖在图像传感器20的感应区202上方，不会影响图像传感器20的性能；当支架50在连接子板32上的投影不超过连接子板32的外边缘时，支架50所占用的空间较小，从而减小了摄像头模组100的大小。
需要说明的是，本申请实施例提供的摄像头模组100还包括透镜组60和镜筒70，透镜组60与感光组件110相对设置，透镜组60与感光组件110内的图像传感器20位于同一光路上，其中镜筒70安装在支架50上，透镜组60组装于镜筒70内，镜筒70在连接子板32上的投影不超过连接子板32的内边缘和/或外边缘。当镜筒70在连接子板32上的投影不超过连接子板32的内边缘时，镜筒70不会对光线进行遮挡，且镜筒70不会覆盖在图像传感器20的感应区202上方，不会影响图像传感器20的性能；当镜筒70在连接子板32上的投影不超过连接子板32的外边缘时，镜筒70所占用的空间较小，从而减小了摄像头模组100的大小。
本申请实施例提供的摄像头模组100中，由于弯折电路板30的存在，使得弯折电路板30的焊盘321弯折到朝向图像传感器20的位置，焊盘321可以与图像传感器20的金属焊垫21在相对的位置进行焊接，进而无需预留较大的用于焊接的横向空间，减小了摄像头模组100的体积。
本申请实施例提供一种电子设备，包括但不仅限于摄像机、摄影机、平板电脑、手机等，电子设备包括上述实施方式提供的摄像头模组100，需要说明的是，本实施例提供的电子设备中的摄像头模组100与上述实施方式中摄像头 模组100的工作原理相同，在此不再进行赘述。
在组装本申请实施例提供的电子设备时，由于其摄像头模组100中，弯折电路板30的弯折结构设计，使得弯折电路板30的焊盘321弯折到朝向图像传感器20的位置，焊盘321可以与图像传感器20的金属焊垫21在相对的位置进行焊接，进而无需预留较大的用于焊接的横向空间，减小了感光组件110的体积以及由感光组件110组成的摄像头模组100的体积，从而进一步减小了电子设备的体积，使得本申请实施例提供的电子设备达到了小型化和轻薄化的要求。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简介，未对上述实施例中的各个技术特征所以可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，可应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种感光组件，其特征在于，包括图像传感器和弯折电路板，所述弯折电路板包括承载子板与连接子板，所述连接子板设于所述承载子板的端部，所述承载子板与所述连接子板形成一个容置空间，所述容置空间设有开口，所述图像传感器容置于所述容置空间内，所述图像传感器包括朝向所述开口的焊接区，所述连接子板包括朝向所述焊接区的内表面，所述连接子板的内表面设有焊盘，所述图像传感器的所述焊接区上设有金属焊垫，所述金属焊垫与所述焊盘电连接。
  2. 根据权利要求1所述的感光组件，其特征在于，所述感光组件还包括连接件，所述连接件设于所述金属焊垫与所述焊盘之间，以使所述金属焊垫与所述焊盘进行电连接。
  3. 根据权利要求2所述的感光组件，其特征在于，所述金属焊垫、所述连接件和所述焊盘之间的连接方式包括压焊和/或导电胶连接。
  4. 根据权利要求2所述的感光组件，其特征在于，所述连接件为金球、金线和导电胶中的至少一种。
  5. 根据权利要求1所述的感光组件，其特征在于，所述承载子板包括底板以及侧板，所述侧板设于所述底板的部分周缘或全部周缘，所述连接子板设于所述侧板远离所述底板的一端，所述底板、所述侧板以及所述连接子板形成所述容置空间，所述图像传感器设于所述底板上，所述侧板部分包围所述图像传感器，或完全包围所述图像传感器。
  6. 根据权利要求5所述的感光组件，其特征在于，所述底板与所述侧板之间设置第一弯折标志线，所述侧板以所述第一弯折标志线为轴进行弯折。
  7. 根据权利要求5所述的感光组件，其特征在于，所述侧板与所述连接子板之间设置有第二弯折标志线，所述连接子板以所述第二弯折标志线为轴进行弯折。
  8. 根据权利要求5-7任一项所述的感光组件，其特征在于，所述底板和所述侧板以拼接的方式形成所述承载子板，和/或所述承载子板与所述连接子板以拼接的方式形成所述弯折电路板。
  9. 一种摄像头模组，其特征在于，包括如权利要求1-8任一项所述的感光组件、支架、透镜组和镜筒，所述支架设于所述连接子板上，且背离所述底板，所述支架在所述连接子板上的投影不超过所述连接子板的内边缘和/或外边缘，所述镜筒安装在所述支架上，所述透镜组组装于所述镜筒内，所述镜筒在所述连接子板上的投影不超过所述连接子板的内边缘和/或外边缘。
  10. 一种电子设备，其特征在于，所述电子设备包括权利要求9所述的摄像头模组。
PCT/CN2020/083345 2020-04-03 2020-04-03 感光组件、摄像头模组及电子设备 WO2021196221A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102331612A (zh) * 2010-07-13 2012-01-25 鸿富锦精密工业（深圳）有限公司 镜头模组及使用该镜头模组的便携式电子装置
US20170201660A1 (en) * 2016-01-12 2017-07-13 Primax Electronics Ltd. Camera module and assembling method thereof
CN206742240U (zh) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN108933151A (zh) * 2018-07-26 2018-12-04 苏州晶方半导体科技股份有限公司 一种影像传感芯片的封装结构以及封装方法
CN109194852A (zh) * 2018-08-31 2019-01-11 Oppo广东移动通信有限公司 摄像头模组及电子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102331612A (zh) * 2010-07-13 2012-01-25 鸿富锦精密工业（深圳）有限公司 镜头模组及使用该镜头模组的便携式电子装置
US20170201660A1 (en) * 2016-01-12 2017-07-13 Primax Electronics Ltd. Camera module and assembling method thereof
CN206742240U (zh) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN108933151A (zh) * 2018-07-26 2018-12-04 苏州晶方半导体科技股份有限公司 一种影像传感芯片的封装结构以及封装方法
CN109194852A (zh) * 2018-08-31 2019-01-11 Oppo广东移动通信有限公司 摄像头模组及电子装置

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