WO2021136270A1 - 柔性显示器件及其制备方法 - Google Patents

柔性显示器件及其制备方法 Download PDF

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Publication number
WO2021136270A1
WO2021136270A1 PCT/CN2020/140850 CN2020140850W WO2021136270A1 WO 2021136270 A1 WO2021136270 A1 WO 2021136270A1 CN 2020140850 W CN2020140850 W CN 2020140850W WO 2021136270 A1 WO2021136270 A1 WO 2021136270A1
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Prior art keywords
substrate
flexible display
adhesive
layer
adhesive layer
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PCT/CN2020/140850
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English (en)
French (fr)
Inventor
谷朋浩
谢春燕
钱玲芝
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京东方科技集团股份有限公司
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Priority to US17/419,037 priority Critical patent/US11991894B2/en
Publication of WO2021136270A1 publication Critical patent/WO2021136270A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of flexible display, in particular to a flexible display device and a preparation method thereof.
  • the flexible display device generally includes a flexible display panel and a back support film or a back protection film coupled to the back of the flexible display panel.
  • the flexible display panel usually includes a film layer structure such as an encapsulation film layer, a light emitting film layer, a backplane film layer, and a flexible substrate. These film layers are all supported and protected by a back support film attached to the entire back of the flexible display panel.
  • the thickness of the back support film is generally much larger than the thickness of the flexible display panel. Therefore, when the flexible display device is bent, the bending recovery performance, breaking strength, and deformability of the thickest back support film will directly affect the overall bending performance of the panel attached to it.
  • the present disclosure provides a flexible display device including a flexible display panel and a back support film combined with the back of the flexible display panel, the flexible display panel including a bonding area and a non-bonding Area;
  • the back support film includes: a first substrate layer combined with the flexible display panel in at least a part of the bonding area, and a first substrate layer combined with the flexible display panel in at least a part of the non-bonding area
  • the second substrate layer
  • the first substrate layer is combined with the flexible display panel through a transparent first adhesive layer, and the first substrate layer has a light transmittance of 85% or more and a haze of 5% or less, and the first substrate layer has a light transmittance of 85% or more and a haze of 5% or less.
  • the adhesive layer is a UV cured adhesive layer;
  • the second substrate layer is combined with the flexible display panel through a second adhesive layer, the second substrate is different from the first substrate, and the second adhesive is different from the first adhesive.
  • the UV-curable adhesive is a UV-curable acrylic adhesive.
  • the peel strength of the first adhesive layer is more than 400 grams force/inch.
  • the elastic modulus of the first adhesive is higher than the elastic modulus of the second adhesive.
  • the first adhesive has an elastic modulus of 150-500 kPa
  • the second adhesive has an elastic modulus of 1-150 kPa.
  • the second adhesive is a pressure sensitive adhesive.
  • the first substrate is polyethylene terephthalate
  • the second substrate is polyimide or stainless steel.
  • the present disclosure provides a manufacturing method of the above-mentioned flexible display device, the manufacturing method comprising:
  • UV-irradiating the UV-curable transparent adhesive layer through the mask so that the UV-curable transparent adhesive layer at the at least partial area of the bonding area of the flexible display panel is cured and the adhesion is enhanced;
  • the second adhesive layer and the second substrate layer are bonded in the non-bonding zone.
  • the UV curable transparent adhesive is an acrylic adhesive added with an ultraviolet photoinitiator.
  • the UV radiation having 2000mJ / cm 2 -4000mJ power / cm of lighting energy and 600-800mW 2 / cm 2,.
  • the peel strength of the UV-curable transparent adhesive layer is less than 20 grams force/inch.
  • the second substrate layer coated with the second adhesive layer is adhered to the non-bonding area by a roller sticking method.
  • Figure 1 shows the black spots in the back support film made of polyimide material.
  • FIG. 2 shows an exemplary embodiment of the flexible display device of the present disclosure.
  • FIG. 3 shows an exemplary process for preparing one embodiment of the flexible display device of the present disclosure.
  • PET polyethylene terephthalate
  • the elastic modulus and breaking strength of PET material are not high. This leads to its limited resistance to deformation and resilience as a back support film.
  • Traditional PET materials form irreversible creases after being bent at a large angle, and the unrecovered angle after half-folding is usually over 120°, that is, the angle difference from the flat initial position is over 120°.
  • the PET material has a large elongation at break, when the bending radius is small, there is still a risk of cracking. Therefore, it is considered to choose to use other materials with higher elastic modulus and/or breaking strength as the back support film substrate attached to the entire surface.
  • PET substrates also include good transparency, that is, high transmittance, close to 90%, and substantially no haze and black spots.
  • This is very advantageous in the production of flexible substrates, because such a transparent support film facilitates the observation of electronic circuits in the bonding area of the display panel through it, so that automatic optical inspection (AOI) can be smoothly performed.
  • AOI automatic optical inspection
  • the above-mentioned other materials with high elastic modulus and/or breaking strength are usually poor in transparency, and it is difficult to fully meet the requirements of AOI to clearly observe the bonding zone and determine the indentation.
  • the conventional back support film is composed of a single substrate.
  • PET Polyethylene terephthalate
  • PET polyethylene terephthalate
  • FIG 1 shows the appearance of a polyimide (PI) material with relatively high bending resistance. It can be seen that there are a large number of black spots that will seriously affect AOI.
  • the present disclosure proposes a flexible display device including two different substrates in a back support film to solve the above-mentioned problems.
  • one substrate can be bonded first, and after the substrate is patterned, the other substrate can be bonded.
  • the patterning process needs to cut off the first bonded substrate through subtractive manufacturing.
  • Subtractive manufacturing refers to the process of reducing material from the overall material to obtain the final product.
  • subtractive manufacturing refers to bonding more substrates first, and then removing excess substrates by cutting to obtain the required substrate layer size, rather than preparing substrates of accurate size in advance. Glue.
  • the adhesive has high bonding strength, once the substrate is bonded, it will become difficult to remove it. However, if the adhesive strength is low, the substrate may not be able to be adhered stably to the back of the display panel.
  • the present disclosure proposes a flexible display device including a flexible display panel and a back support film combined with the back of the flexible display panel, the flexible display panel including a bonding area and Non-bonding area; of which
  • the back support film includes: a first substrate layer combined with the flexible display panel in at least a part of the bonding area, and a first substrate layer combined with the flexible display panel in at least a part of the non-bonding area
  • the second substrate layer
  • the first substrate layer is combined with the flexible display panel through a transparent first adhesive layer, and the first substrate layer has a light transmittance of 85% or more and a haze of 5% or less, and the first substrate layer has a light transmittance of 85% or more and a haze of 5% or less.
  • the adhesive layer is a UV cured adhesive layer;
  • the second substrate layer is combined with the flexible display panel through a second adhesive layer, the second substrate is different from the first substrate, and the second adhesive is different from the first adhesive.
  • the back support film uses a single substrate in various areas of the display panel.
  • flexible materials with high transparency, high uniformity, high bending resistance and high resilience are relatively rare. Therefore, the use of a conventional single substrate cannot meet the performance requirements of the back support film required by various areas.
  • the present disclosure proposes a solution to regionally design the back support film and the adhesive layer for different areas of the display panel.
  • a UV-cured adhesive layer is also selected as the first adhesive layer for bonding the first substrate in the bonding zone, so that the adhesion of the adhesive layer can be changed during the preparation process. Sex. Specifically, the first substrate layer can be first bonded with a UV-curable adhesive layer, followed by subtractive manufacturing for patterning, and finally the UV-curable adhesive layer is cured by UV. In this way, it is not only conducive to the progress of material reduction manufacturing, but also high adhesion can be obtained.
  • the bonding area requires higher adhesion to the back support film than the non-bonding area. Therefore, in the present disclosure, the UV-cured adhesive layer is arranged in the bonding zone for the first substrate, which can simultaneously meet the requirement of high adhesion in the bonding zone. In other words, the regionalized design of the present disclosure also takes the adhesive into consideration. Correspondingly, during the preparation process, the first substrate layer will be formed first.
  • the first base material layer uses a transparent material, and has a light transmittance of 85% or more and a haze of 5% or less.
  • the first substrate layer has good transparency and low haze, so it can be used for the AOI in the bonding area of the display panel, and can fully meet the requirements of the AOI to clearly observe the bonding area and determine the indentation condition.
  • the first substrate layer also needs to have sufficient flexibility and proper bending resistance and resilience.
  • the glass transition temperature Tg of the first substrate is above 150° C. so as to be able to withstand the heat treatment temperature in the bonding zone process.
  • the second substrate is different from the first substrate.
  • the performance of the second substrate should meet the needs of the non-bonding zone as much as possible.
  • the second substrate should provide sufficient flexibility, good bending resistance and resilience. Flexural resistance and resilience are comprehensive properties that are affected by factors such as the material, microstructure, and size of the substrate layer, and it is difficult to limit it with a single physical parameter.
  • the elastic modulus and/or breaking strength of the second substrate may be higher than that of the first substrate. When the elastic modulus and/or breaking strength of the substrate layer is higher, the bending resistance and resilience are generally better.
  • the elastic modulus and/or breaking strength of the second substrate may be much higher than that of the first substrate, or may be close to that of the first substrate.
  • one or both of the elastic modulus and breaking strength of the second substrate may even be lower than that of the first substrate, as long as the second substrate layer has flexural resistance and return strength in the non-bonding zone.
  • the elasticity is better than that of the first substrate layer.
  • the second substrate layer can also achieve better bending resistance and resilience by having a different thickness or microstructure from the first substrate layer.
  • the elastic modulus and/or breaking strength of the second substrate be higher than that of the first substrate.
  • the elastic modulus and/or breaking strength of the second substrate is close to that of the first substrate.
  • the elastic modulus of the first substrate is in the range of 2GPa-6GPa
  • the breaking strength is in the range of 100MPa-400MPa, preferably the elastic modulus is in the range of 2-4GPa, and the breaking strength is in the range of 100-300MPa.
  • the elastic modulus of the second substrate is in the range of 2GPa-10GPa
  • the breaking strength is in the range of 100MPa-400MPa, such as the breaking strength is in the range of 140-400MPa, such as 140MPa-200MPa.
  • the first substrate is PET and the second substrate is PI.
  • the elastic modulus and breaking strength of the second substrate are much greater than that of the first substrate.
  • the elastic modulus of the first substrate is in the range of 2GPa-6GPa
  • the breaking strength is in the range of 100MPa-400MPa
  • the elastic modulus is in the range of 2-4GPa
  • the breaking strength is in the range of 100-300MPa.
  • the elastic modulus of the second substrate is in the range of 150GPa-300GPa, and the breaking strength is above 1400MPa, such as the range of 1500MPa-2000MPa.
  • the first substrate is PET and the second substrate is stainless steel (SUS).
  • the unrecovered angle of the second substrate layer after being folded in half is 60° or less.
  • the unrecovered angle after folding in half refers to the angle measured as follows. Place a film-like material sample on a horizontal surface and fold it in half so that the upper surface on one side of the crease is turned over and touches the upper surface on the other side of the crease. Then the external force is removed, so that the folded side rebounds. After rebounding, the angle between the folded side and its initial horizontal position is the unrecovered angle after folding in half.
  • the second substrate layer of the present disclosure has much higher bending resistance and resilience compared with a PET material layer whose unrecovered angle is greater than 120° after being folded in half.
  • the light transmittance of the second substrate layer may be lower than 85% or the haze may be higher than 5%. Since the second substrate layer is completely or mainly disposed in a non-bonding zone where there is no requirement for transparency at all, it can be translucent or even opaque. This is an important benefit of the present disclosure because it greatly broadens the selection range of the second substrate. In addition, the second substrate does not need to be able to withstand the heat treatment temperature in the bonding zone process, so its glass transition temperature Tg does not need to reach 150°C or higher. For example, it may be sufficient above 60°C. This is also an important benefit of the present disclosure, because it also greatly broadens the selection range of the second substrate.
  • the display panel of the present disclosure refers to a display device that has not yet been combined with a back support film. It can usually include encapsulation film layer, light-emitting film layer, backplane film layer, flexible substrate and other film layer structures, and includes bonding area and non-bonding area.
  • the present disclosure may use a flexible display panel conventionally combined with a back support film.
  • the present disclosure proposes a flexible display device in which at least a part of the back support film substrate of the bonding area is a first substrate, and part or all of the back support film substrate of the non-bonding area is a second substrate.
  • the first substrate is different from the second substrate.
  • the first substrate and the second substrate may be arranged in the same layer.
  • Such a back support film can not only have excellent bending resistance and resilience in the non-bonded area, but also have high transparency and low haze in the bonded area to suit AOI.
  • the first substrate in addition to the light transmittance of 85% or more and the haze of 5% or less, the first substrate should also have proper bending resistance and resilience.
  • the first substrate should have a glass transition temperature sufficient to withstand the heat treatment temperature in the bonding zone. Since the requirements for bending resistance and resilience are not very high, the first substrate can have the following properties: the elastic modulus is in the range of 2GPa-6GPa, the breaking strength is in the range of 100MPa-400MPa, and the elastic modulus is preferably 2 Within the range of -4GPa, the breaking strength is in the range of 100-300MPa; the breaking elongation is 60%-80%.
  • the first substrate is PET.
  • PET is suitable for processes such as bonding.
  • the elastic modulus of PET is generally in the range of 2-4 GPa, usually around 2 GPa, and the breaking strength is about 115 MPa, which can meet the basic requirements of the back support film.
  • the second substrate is mainly selected from materials with high bending resistance and good resilience, and the requirements for transmittance and haze can be relatively relaxed, and even further selected from non-transparent materials.
  • the second substrate has relatively low requirements for the glass transition temperature, which usually only needs to be above 60°C.
  • the types of materials that can be used include polymer substrates.
  • the polymer substrate can have the following properties: the elastic modulus is in the range of 2GPa-10GPa, such as the range of 3-7GPa; the breaking strength is in the range of 100MPa-400MPa, such as the range of 140-400MPa, such as 140MPa-200MPa Within the range of ⁇ 170MPa; elongation at break 5%-40%, preferably 10%-30%; moisture absorption rate is less than 2%, preferably less than 1%; there is no requirement for transmittance, haze and black point.
  • the preferred polymer material is polyimide.
  • Available material types also include metal substrates, which can have the following properties: elastic modulus in the range of 150GPa-300GPa; breaking strength above 1400MPa, such as in the range of 1500MPa-2000MPa; elongation at break 30% Below; no requirements for transmittance, haze and black spots.
  • the preferred metal material is SUS, and its unrecovered angle after being folded in half can be below 60°.
  • the second substrate can provide excellent mechanical support and protection for the non-bonding area of the display panel.
  • the thickness of the first substrate layer and the second substrate layer may be the same.
  • the thickness of the adhesive layer is also the same, so that the surface of the substrate of the back support film is in the same plane.
  • the first substrate layer and the second substrate layer can also have different thicknesses, and correspondingly the thickness of the adhesive layer is also different to ensure that the surface of the substrate is on the same plane.
  • the first substrate layer and the second substrate layer may have a thickness of 20 ⁇ m to 80 ⁇ m.
  • the substrate layer is bonded to the back surface of the flexible display panel through an adhesive layer.
  • the adhesive layer between the first substrate layer and the flexible display panel is referred to as the first adhesive layer
  • the adhesive layer between the second substrate layer and the flexible display panel is referred to as the second adhesive layer.
  • the first adhesive layer and the second adhesive layer use different adhesives.
  • the first adhesive layer is a UV cured adhesive layer.
  • the UV-cured adhesive layer has high adhesiveness and is suitable for bonding requirements in the bonding zone.
  • its adhesiveness is variable during the preparation process and is suitable for patterning the substrate layer by subtractive manufacturing. Requirements.
  • the UV-curable adhesive is a UV-curable acrylic adhesive. These UV-cured adhesives have sufficient transparency and do not interfere with the AOI in the bonding zone; their initial tack is moderate, which can position the first substrate and are easy to remove in the subsequent elimination process; their adhesiveness after UV irradiation It is greatly enhanced to meet the adhesion requirements of the bonding area.
  • the peel strength of the first adhesive layer can reach more than 400 grams force/inch, which provides excellent precision adhesion for the bonding zone. The peel strength is measured by a 180° peel test.
  • the second adhesive layer is different from the first adhesive layer.
  • the second adhesive layer is located in the non-bonding zone, so it does not need to have as high precision adhesion as the first adhesive layer.
  • the second adhesive layer is used in the non-bonding area and will not affect the AOI, so it does not need to be transparent.
  • the second adhesive is not a transparent adhesive, thereby greatly broadening the selection range of the second adhesive.
  • the second substrate layer in the non-bonding zone has lower requirements for positioning accuracy, it can be formed without subtractive manufacturing, and therefore the second adhesive layer does not need to be a UV-cured adhesive layer.
  • the elastic modulus of the first adhesive is higher than the elastic modulus of the second adhesive.
  • the first adhesive may have an elastic modulus of 150-500 kPa
  • the second adhesive may have an elastic modulus of 1-150 kPa.
  • the first adhesive layer and the second adhesive layer may have a thickness of 10 ⁇ m-50 ⁇ m.
  • the second adhesive may be a pressure sensitive adhesive.
  • the pressure-sensitive adhesive facilitates the easy attachment of the back support film to the display panel.
  • the preferred peel strength of the second adhesive is above 400 grams force/inch.
  • the second adhesive may also be an acrylic adhesive.
  • the bonding area and the first substrate layer need to have an overlap
  • the non-bonding area and the second substrate layer need to have an overlap.
  • the first substrate layer is used for the bonding area
  • the second substrate layer is used for the non-bonding area.
  • a small amount of the first substrate may also be present in the non-bonded area
  • a small amount of the second substrate may also be present in the bonded area, as long as it conforms to the spirit of the present disclosure.
  • part of the orthographic projection of the first substrate layer on the display panel may be in the non-bonding area
  • part of the orthographic projection of the second substrate layer on the display panel may be in the bonding area.
  • all the non-bonding regions of the display panel are combined with the second substrate layer.
  • the display panels in the non-bonding area are supported and protected by the back support film with high bending resistance and high resilience, and the display panel in the bonding area has a part without the back support film on the back to facilitate the narrowing of the frame.
  • the display panel in the bonding area has a part without the back support film on the back to facilitate the narrowing of the frame.
  • the patterns of the first and second adhesive layers and the patterns of the first and second substrate layers may be completely the same, respectively.
  • Figure 2 further illustrates the display device of the present disclosure.
  • FIG. 2 shows an exemplary embodiment of the flexible display device of the present disclosure.
  • the flexible display device includes a flexible display panel (201) and a back support film combined with the back of the flexible display panel, and the flexible display panel (201) includes a bonding area (207) and a non-bonding area (208);
  • the back support film includes: a first substrate layer (204) combined with the flexible display panel (201) in at least a part of the bonding area (207), and a first substrate layer (204) in the non-bonding area (208) The second substrate layer (205) where at least a part of the area of) is combined with the flexible display panel (201),
  • the first substrate layer (204) is combined with the flexible display panel (201) through a transparent first adhesive layer (202), and the first substrate layer (204) has a light transmittance of more than 85% And a haze of less than 5%, the first adhesive layer (202) is a UV-cured adhesive layer; and
  • the second substrate layer (205) is combined with the flexible display panel through a second adhesive layer (203), the second substrate is different from the first substrate, and the second adhesive is different from the first substrate.
  • the first adhesive is different.
  • the first adhesive layer is a UV-cured transparent adhesive.
  • the second adhesive layer may be a pressure sensitive adhesive.
  • the flexible display device of the present disclosure can be accurately prepared by the method of the present disclosure.
  • the preparation method of the present disclosure includes:
  • UV-irradiating the UV-curable transparent adhesive layer through the mask so that the UV-curable transparent adhesive layer at the at least partial area of the bonding area of the flexible display panel is cured and the adhesion is enhanced;
  • the second adhesive layer and the second substrate layer are bonded in the non-bonding zone.
  • the method of the present disclosure solves the contradiction between the requirement of low adhesiveness in the process and the requirement of high adhesiveness in the final product by changing the adhesiveness of the first adhesive during the process of bonding the first substrate, so it can be used for Precisely prepare flexible display devices with two substrates.
  • the elastic modulus of the adhesive in the bonding area can be greatly improved after UV curing, which can meet the precise adhesion requirements of the bonding area.
  • the adhesive layer of the transparent UV curable bonding region is irradiated with UV light may have energy 2000mJ / cm 2 -4000mJ / cm 2 and a power 600-800mW / cm 2 in.
  • Such irradiation parameters can fully cure and increase the viscosity of the first adhesive without causing damage to the substrate layer.
  • a UV photosensitizer can also be added to the UV-curable transparent adhesive layer.
  • the peel strength can be increased from less than 20 grams force/inch, such as 2 grams force/inch, to more than 400 grams force/inch. The peel strength of less than 20 grams force/inch before irradiation, preferably less than 10 grams force/inch, facilitates the removal of the uncured transparent adhesive layer and the first substrate layer thereon.
  • an adhesion method can be used, that is, a stronger adhesive adhesion is used to remove the first substrate layer and take away the uncured transparent adhesive layer at the same time.
  • a piece of conventional tape can be pasted on the surface of the first substrate layer in the uncured area of the adhesive, and then the first substrate can be removed by pulling the tape. Since the adhesive force of the general adhesive tape to the first substrate is much greater than the adhesive force of the uncured transparent adhesive to the flexible display panel, the first substrate and the uncured transparent adhesive layer can be easily removed. It is also possible to use a roller with adhesive tape to stick one corner of the first substrate, and then by clamping the raised corner and applying force, the other part of the first substrate is lifted or torn off.
  • the second substrate layer coated with the second adhesive layer is adhered to the non-bonding area by a roller sticking method. This method is convenient and fast, and is sufficient to provide accurate positioning of the second substrate layer.
  • a first substrate layer (204) and a UV-curable transparent adhesive layer (202) are provided on the carrier film (210).
  • the materials can be PET and acrylic adhesives with UV photoinitiator added.
  • the back side of the flexible display panel (201) is pasted on the adhesive layer (202).
  • the flexible display panel (201) includes a bonding area (207) and a non-bonding area (208).
  • a protective film (209) is provided on the front of the flexible display panel.
  • Fig. 3 schematically shows a case where there is only one display panel.
  • the carrier film can have a large area and can be manufactured in large quantities. Multiple substrates can be placed on the carrier film, and the first and second substrates can be alternately placed, so that multiple back support films can be prepared at one time, and then multiple display panels can be placed, and in the subsequent steps, a single Display device.
  • a mask (211) is used to irradiate the UV-curable transparent adhesive layer in the bonding area to increase the viscosity, forming a thickened area in the adhesive layer (202) (shown in gray in the figure).
  • Appropriate UV irradiation methods can be adopted here, such as direct lighting or adding UV lamp equipment to the laminating machine after turning over.
  • UV light energy can be 2000mJ/cm2-4000mJ/cm 2 ; power 600-800mW/cm 2 .
  • the peel strength increases from, for example, 2 grams force/inch to, for example, 400 grams force/inch and above.
  • a half-cut method is adopted along the pattern boundary of the cured transparent adhesive layer, that is, only the substrate layer and the adhesive layer are cut off, and the flexible display panel is not damaged. Then, the tape is removed or the roller tape is removed. The uncured adhesive and the first substrate are removed to obtain the first adhesive layer (202) and the first substrate layer (204) covering at least a part of the bonding region (207) as shown in FIG. 3d.
  • the second substrate (205) such as polyimide film or SUS, is bonded to the non-bonding area through the integrated structure of the high-viscosity pressure-sensitive adhesive (203) by roller bonding.
  • pressure-sensitive adhesive is coated on the second substrate (205) in advance.
  • the protective film (209) on the front of the display panel and the carrier film (210) on the surface of the first substrate are removed to obtain the flexible display device of the present disclosure.
  • the flexible display device is prepared according to the steps in FIG. 3.
  • a base film made of PET is used as a carrier film, and a first substrate layer is provided on it.
  • the first substrate layer is a PET film, obtained by injection-stretching polyethylene terephthalate, and has a thickness of 50 ⁇ m.
  • a UV curable transparent adhesive layer is set on the PET.
  • the UV-curable transparent adhesive layer is an acrylic adhesive added with an ultraviolet photoinitiator, and the coating thickness is 15 ⁇ m.
  • the acrylic adhesive is prepared by mixing acrylate prepolymer and reactive diluent monomer, and an ultraviolet photoinitiator from IR651 etc. is added therein, and the ultraviolet photoinitiator accounts for about 3% of the total weight.
  • the peel strength of the UV-curable transparent adhesive layer when uncured is about 4 grams force/inch.
  • the back of the flexible display panel is pasted onto the UV curable transparent adhesive layer.
  • the surface on the back of the flexible display panel is made of polyimide material.
  • UV irradiation is performed on a part of the bonding area of the flexible display panel.
  • the light energy of UV irradiation is 3500mJ/cm 2 , and the power is 650mW/cm 2 .
  • the UV-curable transparent adhesive layer becomes a UV-curable adhesive layer under the action of ultraviolet light, with a peel strength of about 440 grams force/inch and an elastic modulus of about 300 kPa.
  • the adhesive and the first substrate are removed, and the back of the flexible substrate is re-exposed.
  • the adhesive tape used in the removal of the roller tape is a commercially available strong adhesive double-sided tape.
  • the second substrate is a polyimide pre-coated with a second adhesive.
  • the amine film has a thickness of 40 ⁇ m, and the second adhesive is a polyacrylate adhesive.
  • the elastic modulus of the second adhesive is about 50 kPa.
  • the prepared flexible display device can perform AOI smoothly, and has excellent bending resistance and recovery in the non-binding area or the display area. Moreover, its adhesion in the bonding zone is excellent, and the back support film is accurately set at the desired flexible display panel position.

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Abstract

本公开提供一种柔性显示装置及其制备方法，所述柔性显示装置在邦定区和非邦定区具有不同的背面支撑膜基材和胶粘剂，可以分别满足AOI和抗弯折性的要求，并且可以有利于包含减材制造的基材图案化步骤。

Description

柔性显示器件及其制备方法
对相关申请的交叉引用
本公开要求2020年1月3日提交的中国专利申请号202010013479.8的优先权，其通过引用以其全部结合在此。
技术领域
本公开涉及柔性显示领域，尤其是涉及一种柔性显示器件及其制备方法。
背景技术
柔性显示装置通常包括柔性显示面板和结合在其背面的背面支撑膜或者背面保护膜。柔性显示面板通常包括封装膜层、发光膜层、背板膜层、柔性衬底等膜层结构。这些膜层均由在柔性显示面板背面整面贴附的背面支撑膜支撑和保护。出于机械性能的考虑，背面支撑膜的厚度通常远大于柔性显示面板的厚度。因此，在柔性显示装置弯曲时，最厚的背面支撑膜的弯折回复性能、断裂强度、变形能力等将会直接影响贴覆在上面的面板的整体弯折性能。
对于柔性显示装置的背面支撑膜，仍存在改进的需要。
概述
在一个方面，本公开提供一种柔性显示装置，所述柔性显示装置包含柔性显示面板和与所述柔性显示面板的背面结合的背面支撑膜，所述柔性显示面板包括邦定区和非邦定区；
所述背面支撑膜包括：在所述邦定区的至少部分区域与所述柔性显示面板结合的第一基材层，以及在所述非邦定区的至少部分区域与所述柔性显示面板结合的第二基材层，
其中所述第一基材层通过透明的第一胶粘剂层与所述柔性显示面板结合，所述第一基材层具有85％以上的透光率和5％以下的雾度，所述第一胶粘剂层是UV固化的胶粘剂层；并且
其中所述第二基材层通过第二胶粘剂层与所述柔性显示面板结合，所述第二基材与所述第一基材不同，所述第二胶粘剂与所述第一胶粘剂不同。
可选地，所述UV固化的胶粘剂是UV固化的丙烯酸系胶粘剂。
可选地，所述第一胶粘剂层的剥离强度为400克力/英寸以上。
可选地，所述第一胶粘剂的弹性模量高于所述第二胶粘剂的弹性模量。
可选地，所述第一胶粘剂具有150-500kPa的弹性模量，且所述第二胶粘剂具有1-150kPa的弹性模量。
可选地，所述第二胶粘剂是压敏胶。
可选地，所述第一基材是聚对苯二甲酸乙二醇酯，并且所述第二基材是聚酰亚胺或不锈钢。
在另一个方面，本公开提供一种上述的柔性显示器件的制备方法，所述制备方法包括：
提供所述柔性显示面板；
在所述柔性显示面板的背面上形成可UV固化的透明胶粘剂层；
在所述可UV固化的透明胶粘剂层上粘合第一基材；
透过掩模对可UV固化的透明胶粘剂层进行UV照射，使得所述柔性显示面板的邦定区的所述至少部分区域处的可UV固化的透明胶粘剂层固化并且粘结性增强；
切割并移除未固化的透明胶粘剂层和其上的第一基材，形成所述透明的第一胶粘剂层和所述第一基材层；以及
在非邦定区粘合所述第二胶粘剂层和所述第二基材层。
可选地，所述可UV固化的透明胶粘剂是添加有紫外光引发剂的丙烯酸系胶粘剂。
可选地，所述UV照射具有2000mJ/cm 2-4000mJ/cm 2的光照能量和600-800mW/cm 2的功率。
可选地，所述可UV固化的透明胶粘剂层的剥离强度低于20克力/英寸。
可选地，通过滚轮贴合法，将涂敷有第二胶粘剂层的第二基材层粘合至非邦定区。
附图说明
图1显示了聚酰亚胺材料制备的背面支撑膜中的黑点。
图2示出了本公开的柔性显示器件的一个示例性实施方案。
图3示出了制备本公开的柔性显示器件的一个实施方案的示例性流程。
具体实施方案
目前随着柔性显示屏幕的发展，人们对可折叠显示产品的期望也越来越高。众多柔性显示装置采用聚对苯二甲酸乙二醇酯(PET)作为背面支撑膜的基材。PET的材料弹性模量和断裂强度均不高。这导致其作为背面支撑膜抗变形能力和回弹性有限。传统PET材料在大角度弯折后，形成不可恢复的折痕，并且对折后未回复角通常在120°以上，即与平整初始位置的角度差异达到120°以上。此外，虽然PET材料具有较大的断裂伸长率，但当弯折半径较小时，其仍存在开裂的风险。因此，考虑选择使用其他具有更高弹性模量和/或断裂强度的材料作为整面贴附的背面支撑膜基材。
然而，PET基材具有的优点还包括透明性好，即透过率高，接近90％，同时基本上没有雾度(haze)和黑点。这在柔性基板生产中是非常有利的，因为这样的透明支撑膜便于透过其观察显示面板中邦定(bonding)区的电子线路，从而可以顺利进行自动光学检测(AOI)。上述其他具有高弹性模量和/或断裂强度的材料通常透明性差，均很难完全满足AOI清楚观察邦定区及判定压痕情况的要求。
柔性显示装置中，常规的背面支撑膜均由单一基材组成。聚对苯二甲酸乙二醇酯(PET)基材有利于在产品工业化制备中进行AOI，但其抗变形能力和回复能力不足。而其他具有高弹性模量和/或断裂强度的材料透明性差，并且具有较多的雾度或黑点。图1示出了抗弯折性相对较高的聚酰亚胺(PI)材料的外观。可以看到，其中存在大量会严重影响AOI的黑点。
本公开提出了背面支撑膜中包含两种不同基材的柔性显示装置，以解决上述问题。
当试图在背面支撑膜中设置两种不同基材时，可以先粘合一种基材，并且在对该基材进行图案化之后，再粘合另一种基材。此时，为了满足精度要求，图案化过程需要通过减材制造对先粘合的基材进行切除。减材制 造是指从整体材料中减少材料以获得最终产品的过程。在本公开中，减材制造指的是先粘合较多的基材，然后通过裁剪去除多余的基材，获得所需的基材层尺寸，而非预先制备好准确尺寸的基材后再进行粘合。然而，如果胶粘剂粘合强度高，一旦基材粘合，再将其移除将变得困难。但如果胶粘剂粘合强度低，可能会导致基材不能稳定地粘合在显示面板背面。
为同时解决此问题，本公开提出了一种柔性显示装置，所述柔性显示装置包含柔性显示面板和与所述柔性显示面板的背面结合的背面支撑膜，所述柔性显示面板包括邦定区和非邦定区；其中
所述背面支撑膜包括：在所述邦定区的至少部分区域与所述柔性显示面板结合的第一基材层，以及在所述非邦定区的至少部分区域与所述柔性显示面板结合的第二基材层，
其中所述第一基材层通过透明的第一胶粘剂层与所述柔性显示面板结合，所述第一基材层具有85％以上的透光率和5％以下的雾度，所述第一胶粘剂层是UV固化的胶粘剂层；并且
其中所述第二基材层通过第二胶粘剂层与所述柔性显示面板结合，所述第二基材与所述第一基材不同，所述第二胶粘剂与所述第一胶粘剂不同。
如上所述，现有的柔性显示装置中，背面支撑膜在显示面板的各种区域均使用单一基材。目前，常规经济的材料中，既具备高透明性、高均匀性，又具备较高抗弯折性和较高回弹性的柔性材料比较少见。因此，使用常规单一基材无法兼顾各种区域所需的背面支撑膜性能要求。本公开提出了针对显示面板的不同区域对背面支撑膜和粘胶剂层进行区域化设计的方案。
此外，如上所述，从包含减材制造的图案化步骤的角度看，这种区域化设计的方案对于胶粘剂的性质提出了要求。为此，本公开的柔性显示装置中，还选用UV固化的胶粘剂层作为用于粘接用于邦定区第一基材的第一胶粘剂层，从而可以在制备过程中改变胶粘剂层的粘合性。具体地，可以先将第一基材层用可UV固化的胶粘剂层粘接，接着实施减材制造进行图案化，最后再将可UV固化的胶粘剂层通过UV固化。这样，既有利于减材制造的进行，又可以得到高的粘合性。在柔性显示装置中，邦定区对背面支撑膜的粘合性要求高于非邦定区。因此，本公开将UV固化的胶粘 剂层设置在邦定区，用于第一基材，可以同时满足邦定区对高粘合性的要求。换言之，本公开的区域化设计方案也将胶粘剂考虑在内。相应地，在制备过程中，将先形成第一基材层。
在本公开中，第一基材和第二基材使用不同的材料，从而可以在不同区域提供不同的所需性能。第一基材层使用透明材料，具有85％以上的透光率和5％以下的雾度。第一基材层透明性好、雾度低，从而可以用于显示面板的邦定区的AOI，可以完全满足AOI清楚观察邦定区及判定压痕情况的要求。当然，作为柔性显示装置的背面支撑膜的基材，第一基材层也需具备足够的柔性和适当的抗弯折性和回弹性。不过，由于第一基材层完全或主要设置在对抗弯折性要求较低的邦定区，并且邦定区通常位于柔性显示装置的边框处，因此第一基材层的抗弯折性和回弹性不足对柔性显示装置的显示区几乎没有不利影响。优选地，第一基材的玻璃化转变温度Tg在150℃以上，以能够承受邦定区工艺中的热处理温度。
第二基材与第一基材不同。第二基材的性能应尽量满足非邦定区的需要。第二基材应提供足够的柔性、良好的抗弯折性和回弹性。抗弯折性和回弹性是受基材层的材料、微结构和尺寸等因素影响的综合性质，难以用单一的物理参数来限定。在一种实施方案中，第二基材的弹性模量和/或断裂强度可以高于第一基材。当基材层的弹性模量和/或断裂强度较高时，抗弯折性和回弹性通常较好。第二基材的弹性模量和/或断裂强度可以远远高于第一基材，也可以与第一基材接近。此外，本公开中，第二基材的弹性模量和断裂强度之一或两者甚至也可以低于第一基材，只要第二基材层在非邦定区的抗弯折性和回弹性比第一基材层好即可。例如，第二基材层也可以通过具有与第一基材层不同的厚度或微结构而达到更好的抗弯折性和回弹性。不过，第二基材的弹性模量和/或断裂强度高于第一基材经常是优选的。
在一种实施方案中，第二基材的弹性模量和/或断裂强度与第一基材接近。在一种实施方案中，第一基材弹性模量在2GPa-6GPa的范围内，断裂强度在100MPa-400MPa的范围内，优选弹性模量在2-4GPa的范围内，断裂强度在100-300MPa的范围内；第二基材弹性模量在2GPa-10GPa的范围内，断裂强度在100MPa-400MPa的范围内，如断裂强度在140-400MPa， 如140MPa-200MPa的范围内。在一种实施方案中，第一基材是PET，第二基材是PI。
在一种实施方案中，第二基材的弹性模量和断裂强度远远大于第一基材。在一种实施方案中，第一基材弹性模量在2GPa-6GPa的范围内，断裂强度在100MPa-400MPa的范围内，优选弹性模量在2-4GPa的范围内，断裂强度在100-300MPa的范围内；第二基材弹性模量在150GPa-300GPa的范围内，断裂强度在1400MPa以上，如1500MPa-2000MPa的范围内。在一种实施方案中，第一基材是PET，第二基材是不锈钢(SUS)。
在一种实施方案中，第二基材层对折后未回复角为60°以下。对折后未回复角指的是如下测得的角度。在水平面上放置薄膜状材料样品，将其对折，使得其折痕一侧的上表面翻转并接触折痕另一侧的上表面。随后撤去外力，使得该折起的一侧回弹。回弹后，该折起侧与其初始水平位置之间的夹角即为对折后未回复角。在这种情况下，与对折后未回复角在120°以上的PET材料层相比，本公开的第二基材层的抗弯折性和回弹性高得多。此外，第二基材层的透光率可以低于85％或雾度可以高于5％。由于第二基材层完全或主要设置在对透明性完全没有要求的非邦定区，因此，其可以是半透明甚至是不透明的。这是本公开的一个重要益处，因为这大大拓宽了第二基材的选择范围。此外，第二基材无需能够承受邦定区工艺中的热处理温度，因此其玻璃化转变温度Tg无需达到150℃以上。例如，在60℃以上可以是足够的。这是也本公开的一个重要益处，因为这也大大拓宽了第二基材的选择范围。
本公开的显示面板指的是尚未结合背面支撑膜的显示器件。其通常可以包括封装膜层、发光膜层、背板膜层、柔性衬底等膜层结构，并且包括邦定区和非邦定区。本公开可以使用常规与背面支撑膜结合的柔性显示面板。
由此，本公开提出了一种柔性显示装置，其中邦定区的至少一部分的背面支撑膜基材是第一基材，并且非邦定区的背面支撑膜基材的部分或全部是第二基材。第一基材与第二基材不同。在横向上(即平行于柔性显示面板方向上)第一基材和第二基材之间还可以具有间隙。间隙位于邦定区中，可以用于将邦定区折起以使边框窄化。第一基材和第二基材可以同层设置。 这样的背面支撑膜既可以在非邦定区具有出色的抗弯折性和回弹性，还可以在邦定区具有高透明性和低雾度以适合AOI。
如上所述，第一基材除了具有85％以上的透光率和5％以下的雾度之外，还应具有适当的抗弯折性和回弹性。此外，第一基材应具有足以承受邦定区热处理温度的玻璃化转变温度。由于对抗弯折性和回弹性要求不是很高，第一基材可以具有以下性能：弹性模量在2GPa-6GPa的范围内，断裂强度在100MPa-400MPa的范围内，优选弹性模量在2-4GPa的范围内，断裂强度在100-300MPa的范围内；断裂伸长率60％-80％。优选地，第一基材是PET。PET的透过率高，接近90％，同时基材品质较好，雾度极小，基本无黑点，玻璃化转变温度在150℃以上，且价格低廉。因此，PET适合于邦定等工艺。此外，PET弹性模量大体上在2-4GPa的范围，常规在2GPa左右，断裂强度115MPa左右，可以满足背面支撑膜的基本要求。
第二基材则主要选用抗弯折性高且回弹性好的材料，透过率和雾度要求则可以相对放宽，甚至进一步从非透明材料中选择。此外第二基材对玻璃化转变温度要求也较低，通常只需在60℃以上即可。可用的材料类型包括高分子基材。高分子基材可以具有以下性能：弹性模量在2GPa-10GPa的范围内，如3-7GPa的范围内；断裂强度在100MPa-400MPa的范围内，如140-400MPa的范围内，如140MPa-200MPa的范围内如≥170MPa；断裂伸长率5％-40％，优选10％-30％；吸湿率2％以下，优选低于1％；对透过率、雾度和黑点无要求。第二基材经过弯折后虽然也会变成曲状，有不可恢复的折痕，但其对折后未回复角可以在60°以下。优选的高分子材料为聚酰亚胺。可用的材料类型还包括金属基材，金属基材可以具有以下性能：弹性模量在150GPa-300GPa的范围内；断裂强度在1400MPa以上，如1500MPa-2000MPa的范围内；断裂伸长率为30％以下；对透过率、雾度和黑点无要求。优选的金属材料是SUS，其对折后未回复角可在60°以下。第二基材可以为显示面板的非邦定区提供优异的机械支撑和保护。
无论何种基材，必须具有足够的抗弯折性，优选可以满足100K R5动态弯折。满足100K R5动态弯折是指材料以5mm的弯折半径反复弯折10万(100K)次后仍不发生开裂。
第一基材层和第二基材层的厚度可以是相同的，这时，胶粘剂层的厚 度也相同，从而背面支撑膜的基材表面处于同一平面内。不过，第一基材层和第二基材层也可以采用不同的厚度，并且相应地胶粘剂层厚度也不同，以保证基材表面处于同一平面。一般地，第一基材层和第二基材层可以具有20μm-80μm的厚度。
基材层通过胶粘剂层结合到柔性显示面板的背面。本公开中，将在第一基材层和柔性显示面板之间的胶粘剂层称为第一胶粘剂层，将在第二基材层和柔性显示面板之间的胶粘剂层称为第二胶粘剂层。第一胶粘剂层和第二胶粘剂层使用不同的胶粘剂。
第一胶粘剂层是UV固化的胶粘剂层。UV固化的胶粘剂层一方面具有高粘合性，适用于邦定区的粘合要求，另一方面，其粘合性在制备过程中可变，适合于采用减材制造对基材层进行图案化的要求。优选地，UV固化的胶粘剂是UV固化的丙烯酸系胶粘剂。这些UV固化的胶粘剂具有足够的透明性，不妨碍邦定区的AOI；其初粘性适中，既可以将第一基材定位，又易于在随后的消除过程中除去；其UV照射后粘合性大大增强，满足邦定区的粘合性要求。优选地，第一胶粘剂层的剥离强度可达400克力/英寸以上，为邦定区提供优异的精密粘合性。剥离强度是通过180°剥离试验测量的。
第二胶粘剂层与第一胶粘剂层不同。第二胶粘剂层位于非邦定区，因此其无需具有如第一胶粘剂层那样高的精密粘合性。第二胶粘剂层用于非邦定区，不会影响AOI，因此无需是透明的。优选地，第二胶粘剂不是透明胶粘剂，从而大大拓宽第二胶粘剂的选择范围。此外，由于非邦定区的第二基材层对于定位精度要求较低，其可以不用减材制造形成，因此第二胶粘剂层也无需为UV固化的胶粘剂层。
在邦定区，对于胶粘剂精密粘合性要求较高。因此，优选地，第一胶粘剂的弹性模量高于第二胶粘剂的弹性模量。优选地，第一胶粘剂可以具有150-500kPa的弹性模量，而第二胶粘剂可以具有1-150kPa的弹性模量。一般地，第一胶粘剂层和第二胶粘剂层可以具有10μm-50μm的厚度。
优选地，第二胶粘剂可以是压敏胶。压敏胶有利于方便地将背面支撑膜粘贴至显示面板。优选的第二胶粘剂剥离强度在400克力/英寸以上。第二胶粘剂也可以为丙烯酸系胶粘剂。
邦定区的至少一部分结合有第一基材层，非邦定区的至少一部分结合有第二基材层。即邦定区与第一基材层需要有重叠部分，且非邦定区与第二基材层需要有重叠部分。总体上，本公开的柔性显示装置中，第一基材层用于邦定区，第二基材层用于非邦定区。不过，在非邦定区也可以存在少量第一基材，在邦定区也可以存在少量第二基材，只要符合本公开的精神即可。例如，第一基材层在显示面板上的正投影可以有一部分在非邦定区，第二基材层在显示面板上的正投影可以有一部分在邦定区。
第一基材层和第二基材层之间可以有间隙，并且间隙在所述显示面板上的投影在所述邦定区中，以使邦定区可以折起以使边框窄化。
优选地，显示面板的非邦定区全部结合有第二基材层。这样，非邦定区的显示面板均得到抗弯折性高且回弹性高的背面支撑膜的支撑和保护，而邦定区的显示面板的背面存在没有背面支撑膜的部分以利于边框窄化，并且还具有高透明性的背面支撑膜以利于AOI。
第一和第二胶粘剂层的图案与第一和第二基材层的图案可以分别完全相同。
图2进一步说明了本公开的显示装置。
图2示出了本公开的柔性显示装置的一个示例性实施方案。
柔性显示装置包含柔性显示面板(201)和与所述柔性显示面板的背面结合的背面支撑膜，所述柔性显示面板(201)包括邦定区(207)和非邦定区(208)；
所述背面支撑膜包括：在所述邦定区(207)的至少部分区域与所述柔性显示面板(201)结合的第一基材层(204)，以及在所述非邦定区(208)的至少部分区域与所述柔性显示面板(201)结合的第二基材层(205)，
其中所述第一基材层(204)通过透明的第一胶粘剂层(202)与所述柔性显示面板(201)结合，所述第一基材层(204)具有85％以上的透光率和5％以下的雾度，所述第一胶粘剂层(202)是UV固化的胶粘剂层；并且
其中所述第二基材层(205)通过第二胶粘剂层(203)与所述柔性显示面板结合，所述第二基材与所述第一基材不同，所述第二胶粘剂与所述第一胶粘剂不同。
第一胶粘剂层是UV固化的透明胶粘剂。第二胶粘剂层可以是压敏胶。
本公开的柔性显示器件可以通过本公开的方法精确制备。本公开的制备方法包括：
提供所述柔性显示面板；
在所述柔性显示面板的背面上形成可UV固化的透明胶粘剂层；
在所述可UV固化的透明胶粘剂层上粘合第一基材；
透过掩模对可UV固化的透明胶粘剂层进行UV照射，使得所述柔性显示面板的邦定区的所述至少部分区域处的可UV固化的透明胶粘剂层固化并且粘结性增强；
切割并移除未固化的透明胶粘剂层和其上的第一基材，形成所述透明的第一胶粘剂层和所述第一基材层；以及
在非邦定区粘合所述第二胶粘剂层和所述第二基材层。
本公开的方法通过在粘合第一基材的过程中改变第一胶粘剂的粘合性，解决了消除过程中要求低粘合性和最终产品中需要高粘合性的矛盾，因此可以用于精确地制备两种基材的柔性显示装置。此外，在邦定区的胶粘剂经过UV固化后弹性模量可以大大提高，可以满足邦定区的精密粘合性要求。
优选地，对邦定区的可UV固化的透明胶粘剂层进行UV照射可以具有2000mJ/cm 2-4000mJ/cm 2的光照能量和600-800mW/cm 2的功率。这样的照射参数可以使第一胶粘剂充分固化增粘，并且不会对基材层造成伤害。可UV固化的透明胶粘剂层中还可以添加UV光敏剂。在一个实施方案中，剥离强度可以由低于20克力/英寸，如2克力/英寸，增至400克力/英寸以上。照射前低于20克力/英寸的剥离强度，优选低于10克力/英寸有利于移除未固化的透明胶粘剂层和其上的第一基材层。
本公开中可以使用粘附法，即使用更强的粘合剂粘附的方式移除第一基材层并将未固化的透明胶粘剂层同时带走。可以使用一段常规胶带粘贴在胶粘剂未固化区域的第一基材层表面上，然后通过拉动胶带来撕除第一基材。由于一般的胶带对第一基材的粘力远大于未固化的透明胶粘剂对柔性显示面板的粘力，因此第一基材和未固化的透明胶粘剂层可以容易地被移除。也可以采用带有胶带的滚轮粘起第一基材的一角，然后通过夹持住该翘起的角并施力，将第一基材其他部分揭起或撕除。
优选地，通过滚轮贴合法，将涂敷有第二胶粘剂层的第二基材层粘合至非邦定区。该方法方便快捷，并且足以提供第二基材层的准确定位。
以下结合图3说明本公开的制备显示装置的方法。
如图3a所示，在承载膜(210)上设置第一基材层(204)和可UV固化的透明胶粘剂层(202)，材料可以分别为PET和添加有紫外光引发剂的丙烯酸系胶粘剂。随后如图3b所示，在胶粘剂层(202)上粘贴柔性显示面板(201)的背面。柔性显示面板(201)包括邦定区(207)和非邦定区(208)。柔性显示面板正面设置保护膜(209)。
图3示意性示出只有一个显示面板的情况。不过，承载膜可以是大面积的，可以进行大批量制造。可以在承载膜上设置多块基材，并且第一和第二基材交替放置，从而可以一次性制备多块背面支撑膜，随后放置多块显示面板，并且在后续步骤中通过剪切得到单个显示装置。
随后，采用掩模(211)对邦定区的可UV固化的透明胶粘剂层进行照射增粘，在胶粘剂层(202)中形成增粘的区域(图中以灰色显示)。此处可以采取适当的UV照射方式，例如直接光照或翻转后贴合机台添加UV灯设备。UV光照能量可以为在2000mJ/cm2-4000mJ/cm 2；功率600-800mW/cm 2。照射后，剥离强度由例如2克力/英寸增至例如400克力/英寸及以上。
随后，沿固化的透明胶粘剂层的图案边界采用半切的方式，即只切断基材层和胶粘剂层，不损伤柔性显示面板的方式进行切割，并随后采用胶带撕除或者滚轮胶带撕去的方式将未固化的胶粘剂和第一基材移除，得到如图3d所示的覆盖邦定区(207)的至少一部分的第一胶粘剂层(202)和第一基材层(204)。
随后，采用滚轮贴合，将第二基材(205)例如聚酰亚胺膜或SUS通过与高粘力的压敏胶(203)一体化结构一起滚轮粘合至非邦定区。为此，预先在第二基材(205)上涂布压敏胶。
最后去除显示面板正面的保护膜(209)和第一基材表面的承载膜(210)，即得到本公开的柔性显示装置。
以下通过实施例进一步说明本公开。
实施例 柔性显示装置的制备
按照图3的步骤制备柔性显示装置。
使用PET材质的底膜作为承载膜，在其上设置第一基材层。第一基材层为PET膜，通过将聚对苯二甲酸乙二醇酯注塑拉伸得到，厚度为50μm。在PET上设置可UV固化的透明胶粘剂层。该可UV固化的透明胶粘剂层是添加有紫外光引发剂的丙烯酸系胶粘剂，涂敷厚度为15μm。所述丙烯酸系胶粘剂由丙烯酸酯预聚体与活性稀释单体混合制得，并且其中添加有得自IR651等的紫外光引发剂，紫外光引发剂占总重的约3％。该可UV固化的透明胶粘剂层在未固化时的剥离强度为约4克力/英寸。随后，将柔性显示面板的背面粘贴至该可UV固化的透明胶粘剂层上。柔性显示面板背面的表面是聚酰亚胺材料。柔性显示面板正面有保护膜。利用掩模，对柔性显示面板的邦定区的一部分进行UV照射。UV照射的光照能量为3500mJ/cm 2，功率为650mW/cm 2。可UV固化的透明胶粘剂层在紫外光的作用下，变成UV固化的胶粘剂层，具有约440克力/英寸的剥离强度，弹性模量约为300kPa。沿固化的透明胶粘剂层的图案边界采用半切的方式，即只切断基材层和胶粘剂层，不损伤柔性显示面板的方式进行切割，并随后采用滚轮胶带粘起一角随后撕去的方式将未固化的胶粘剂和第一基材移除，重新暴露出柔性基底的背面，其中滚轮胶带撕去中所用的胶带为市售的强粘性双面胶带。采用滚轮贴合，以适中的压力将第二基材层和第二胶粘剂一起粘合到柔性显示面板背面的非邦定区，其中第二基材是预先涂覆好第二胶粘剂的聚酰亚胺膜，厚度为40μm，第二胶粘剂是聚丙烯酸酯胶粘剂。第二胶粘剂的弹性模量为约为50kPa。最后，除去保护膜和残余的承载膜，即得到柔性显示装置。
制得的柔性显示装置可以顺利进行AOI，并且在非绑定区或显示区具有优良的抗弯折性和回复性。而且，其在邦定区的粘合性优异，并且背面支撑膜精确地设置在所需的柔性显示面板位置。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (12)

  1. 一种柔性显示装置，所述柔性显示装置包含柔性显示面板和与所述柔性显示面板的背面结合的背面支撑膜，所述柔性显示面板包括邦定区和非邦定区，其特征在于，
    所述背面支撑膜包括：在所述邦定区的至少部分区域与所述柔性显示面板结合的第一基材层，以及在所述非邦定区的至少部分区域与所述柔性显示面板结合的第二基材层，
    其中所述第一基材层通过透明的第一胶粘剂层与所述柔性显示面板结合，所述第一基材层具有85％以上的透光率和5％以下的雾度，所述第一胶粘剂层是UV固化的胶粘剂层；并且
    其中所述第二基材层通过第二胶粘剂层与所述柔性显示面板结合，所述第二基材与所述第一基材不同，所述第二胶粘剂与所述第一胶粘剂不同。
  2. 根据权利要求1所述的柔性显示装置，其特征在于，
    所述UV固化的胶粘剂是UV固化的丙烯酸系胶粘剂。
  3. 根据权利要求1所述的柔性显示装置，其特征在于，
    所述第一胶粘剂层的剥离强度为400克力/英寸以上。
  4. 根据权利要求1所述的柔性显示装置，其特征在于，
    所述第一胶粘剂的弹性模量高于所述第二胶粘剂的弹性模量。
  5. 根据权利要求4所述的柔性显示装置，其特征在于，
    所述第一胶粘剂具有150-500kPa的弹性模量，且所述第二胶粘剂具有1-150kPa的弹性模量。
  6. 根据权利要求1所述的柔性显示装置，其特征在于，
    所述第二胶粘剂是压敏胶。
  7. 根据权利要求1所述的柔性显示装置，其特征在于，
    所述第一基材是聚对苯二甲酸乙二醇酯，并且所述第二基材是聚酰亚胺或不锈钢。
  8. 一种权利要求1所述的柔性显示器件的制备方法，其特征在于，所述制备方法包括：
    提供所述柔性显示面板；
    在所述柔性显示面板的背面上形成可UV固化的透明胶粘剂层；
    在所述可UV固化的透明胶粘剂层上粘合第一基材；
    透过掩模对可UV固化的透明胶粘剂层进行UV照射，使得所述柔性显示面板的邦定区的所述至少部分区域处的可UV固化的透明胶粘剂层固化并且粘结性增强；
    切割并移除未固化的透明胶粘剂层和其上的第一基材，形成所述透明的第一胶粘剂层和所述第一基材层；以及
    在非邦定区粘合所述第二胶粘剂层和所述第二基材层。
  9. 根据权利要求8所述的方法，其特征在于，
    所述可UV固化的透明胶粘剂是添加有紫外光引发剂的丙烯酸系胶粘剂。
  10. 根据权利要求9所述的方法，其特征在于，
    所述UV照射具有2000mJ/cm 2-4000mJ/cm 2的光照能量和600-800mW/cm 2的功率。
  11. 根据权利要求8所述的方法，其特征在于，
    所述可UV固化的透明胶粘剂层的剥离强度低于20克力/英寸。
  12. 根据权利要求8所述的方法，其特征在于，
    通过滚轮贴合法，将涂敷有第二胶粘剂层的第二基材层粘合至非邦定区。
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