WO2021117684A1 - 直動機構及びパーティクルの飛散抑制方法 - Google Patents
直動機構及びパーティクルの飛散抑制方法 Download PDFInfo
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- WO2021117684A1 WO2021117684A1 PCT/JP2020/045507 JP2020045507W WO2021117684A1 WO 2021117684 A1 WO2021117684 A1 WO 2021117684A1 JP 2020045507 W JP2020045507 W JP 2020045507W WO 2021117684 A1 WO2021117684 A1 WO 2021117684A1
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- seal belt
- moving body
- opening
- case body
- linear motion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
Definitions
- This disclosure relates to a linear motion mechanism and a particle scattering suppression method.
- a substrate processing apparatus for manufacturing a semiconductor performs various processes such as film formation processing by supplying various chemicals such as resist to a semiconductor wafer (hereinafter referred to as wafer) which is a substrate, and development processing of a resist film. ..
- a substrate processing apparatus includes, for example, a transport arm for transporting a wafer and a nozzle moving mechanism for supplying a chemical solution.
- the moving mechanism of these transport arms and nozzles incorporates a linear motion mechanism that moves a moving object such as a wafer holding portion and a nozzle in a linear direction.
- the linear motion mechanism for example, as described in Patent Document 1, a case in which the inside is exhausted, a linear motion mechanism in which a moving member is reciprocated in a linear direction inside the case, and a slit formed in the case are used. , A seal means (seal belt) for closing the slit from the inside of the case is known. Further, in Patent Document 1, a part of the moving member is projected to the outside through the slit to be connected to the moving object, and when the moving object is moved, the local pressure in the case due to the movement of the moving member is obtained. It has been shown that the case is provided with a vent that allows the inside and outside of the case to communicate with each other in order to suppress the rise.
- the linear motion mechanism of the present disclosure includes a case body in which the inside is exhausted and a case body.
- Connection part and A seal belt is provided inside the case so as to extend in the linear direction and close the opening, and one side of both ends in the width direction is separated from the mouth edge of the opening and faces the seal belt.
- the other surface side of both ends in the width direction of the seal belt In order to suppress deformation of the seal belt connected to the internal moving body so as to move in the linear direction in response to the movement of the internal moving body, the other surface side of both ends in the width direction of the seal belt.
- Deformation suppression unit provided facing the Alternatively, the first portion corresponding to the position of the internally moving body is hung on the internally moving body so as to be farther from the opening than the second portion which is different from the first portion in the linear direction.
- a suction portion provided on the case body for sucking one side of both ends of the seal belt and bringing the second portion into close contact with the mouth edge portion of the opening. Equipped with.
- the opening provided in the case body for connecting the internal moving body and the external moving body is used. It is possible to suppress the scattering of particles to the outside of the case body.
- FIG. 1 shows a perspective view of a processing unit 10 including the above-mentioned transfer arm 11 forming a substrate transfer mechanism and a module group to which a wafer W is transferred by the transfer arm 11.
- the processing unit 10 constitutes a coating and developing device, which is a substrate processing device described later, and is provided in an atmospheric atmosphere.
- the above-mentioned semiconductor does not mean a semiconductor as a substance, but a semiconductor device including an element such as a transistor or a diode composed of the semiconductor.
- reference numeral 12 denotes a housing in which a plurality of resist coating modules 14 for applying resist to the wafer W are stored, and includes a transfer port 13 for the wafer W.
- the housing 12 faces the transfer path 15 of the wafer W to which the transfer arm 11 moves, and the resist coating modules 14 are arranged along the length direction of the transfer path 15.
- a plurality of heating modules 17 are provided along the length direction of the transport path 15 so as to face the housing 12 with the transport path 15 in between.
- the heating modules 17 are stacked in two upper and lower stages to form a laminated body.
- a tower T1 is provided on one end side of the transport path 15 in the length direction, and the tower T1 is provided with a transfer module TRS which is a module for carrying the wafer W to the processing unit 10.
- the transfer arm 11 transfers the wafer W from the transfer module TRS in the order of the resist coating module 14 and the heating module 17, and the wafer W is sequentially formed with a resist film and heat-treated. Subsequently, the transfer arm 11 transfers the heat-treated wafer W to the transfer module TRS (not shown in FIG. 1) for carrying out from the processing unit 10.
- the transport arm 11 includes two support portions 2, a base 21, an elevating base 22, a frame 23, and a case body 24, and is composed of the frame 23 and the case body 24.
- the support portion 2, the base 21, the elevating platform 22, and the frame 23 correspond to an external moving body, and exhaust each part for moving the case body 24 and the frame 23 included in the case body 24 described later and the inside of the case body 24.
- the linear motion mechanism 1 is configured by the fan.
- the support portion 2 supports the back surface of the wafer W.
- the two support portions 2 are provided on the base 21 so as to be vertically overlapped with each other, and move back and forth on the base 21 independently of each other.
- the base 21 is provided on the elevating table 22, and is configured to be rotatable around the vertical axis on the elevating table 22.
- the elevating table 22 is provided so as to be surrounded by the frame 23 extended in the vertical direction, and moves up and down in the frame 23.
- the frame 23 is configured to be horizontally movable as described later. Wafers W can be transferred between modules by coordinating the operations of the support portion 2, the base 21, the elevating platform 22, and the frame 23.
- the case body 24 has a rectangular shape, and is provided below the laminated body of the heating module 17 so as to extend in the arrangement direction of the laminated body.
- An opening 25 is provided on the side surface of the case body 24 toward the transport path 15.
- the opening 25 is formed in a straight line so as to extend in the horizontal direction, which is the length direction of the case body 24.
- the opening 25 side of the case body 24 will be referred to as the front side, and the back side of the case body 24 as seen from the opening 25 will be described as the rear side.
- a moving body (internal moving body) 26 is provided in the case body 24.
- the front end portion of the moving body 26 projects to the outside of the case body 24 through the opening 25. This front end portion is connected to the frame 23 and supports the frame 23 as a connecting portion.
- a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26 and the frame 23 is provided inside the case body 24, a moving mechanism 30 for operating the moving body 26
- the moving mechanism 30 includes a main pulley 32, a driven pulley 33, a belt 34, and a motor 35.
- a main pulley 32 and a driven pulley 33 are provided on one end side and the other end side of the case body 24 in the length direction, and are configured to be rotatable around a horizontal axis parallel to each other.
- a belt 34 is wound around these pulleys 32 and 33, and the belt 34 is connected to the moving body 26.
- a motor 35 is connected to the main pulley 32.
- the belt 34 is driven by the rotation of the motor 35, the moving body 26 moves in a linear direction (the length direction of the case body 24) along the opening 25, and the frame 23 moves along the transport path along with the movement of the moving body 26. It moves linearly along the length direction of 15.
- a fan 27 for exhausting the inside of the case body 24 is provided on the rear side of the case body 24.
- the fans 27 are provided on one end side and the other end side of the case body 24 in the length direction, respectively, and the operation of the fan 27 causes the inside of the case body 24 to have a negative pressure with respect to the transport path 15. Particles generated by sliding of each part of the moving mechanism 30 and particles generated from the grease used in the motor 35 are removed by the fan 27.
- a seal belt 40 is provided to close the opening 25 from the inside.
- the seal belt 40 is an annular belt having a width larger than the vertical opening width of the opening 25.
- driven rollers 42 rotatably configured near the four corners when viewed in a plane are provided, and the rotating shaft 41 of each driven roller 42 is vertically oriented. ..
- the above-mentioned seal belt 40 is stretched on such four driven rollers 42, and the seal belt 40 faces one side (surface side) of both end portions in the width direction of the seal belt 40 so as to be separated from the mouth edge portion of the opening 25.
- the surface sides of both ends face the front wall forming member 51 provided at the rim of the opening 25, which will be described later.
- the moving body 26 described above penetrates the seal belt 40 that closes the opening 25. Therefore, the moving body 26 is connected to the seal belt 40, and when the moving body 26 moves linearly by the moving mechanism 30, the seal belt 40 follows a substantially rectangular trajectory in the case body 24 according to the movement of the moving body 26. Looking at the portion of the seal belt 40 that circulates and faces the opening 25, it moves in a straight line along the length direction of the case body 24. In this way, the seal belt 40 moves together with the moving body 26, but regardless of the position of the moving body 26, the opening 25 is provided by the portion of the seal belt 40 stretched between the two driven rollers 42 on the front side. Is maintained in a closed state.
- the surface of the seal belt 40 facing from the opening 25 is defined as one surface side (front surface side), and the surface opposite to one surface in contact with the driven roller 42 is defined as the other surface side (rear surface side).
- the seal belt 40 is a part of the circumference of the seal belt 40 that is stretched on the front side (stretched between the driven rollers 42 on the front side). It shall refer to the part).
- the atmosphere in the destination region of the moving body 26 in the length direction in the case body 24 is compressed by the moving body 26 and boosted.
- the seal belt 40 is deformed as described above and the gap between the rim portion of the opening 25 of the case body 24 and both ends in the width direction on the surface side of the seal belt 40 is widened, FIG.
- the boosted atmosphere may flow out of the case body 24 through the gap. Then, it is conceivable that the particles 100 in the case body 24 are released into the transport path 15 along with the flow of the atmosphere.
- the upper end portion of the seal belt 40 is suppressed in order to suppress the expansion of the gap between the mouth edge portion of the opening 25 and both end portions (upper end portion and lower end portion) in the width direction of the seal belt 40.
- a surrounding portion 5 is provided so as to surround the lower end portion. Therefore, a total of two surrounding portions 5 are provided on the upper end side and the lower end side of the seal belt 40, respectively.
- the surrounding portion 5 provided on the upper end side of the seal belt 40 and the surrounding portion 5 provided on the lower end side are configured to be mirror-symmetrical with respect to the horizontal plane passing through the center of the seal belt 40.
- the surrounding portion 5 provided on the upper end side of the belt 40 will be described as an example.
- the surrounding portion 5 is composed of an upper edge portion of the opening 25 of the case body 24, a front wall forming member 51 provided at the edge portion, and a deformation suppressing portion 52 for suppressing deformation of the seal belt 40. There is.
- the surrounding portion 5 is formed as a recess that surrounds the end portion in the width direction of the seal belt 40 when viewed in the moving direction of the seal belt 40 (the length direction of the case body 24).
- the front wall forming member 51 is a square member that protrudes rearward from the case body 24 and is formed long along the length direction of the opening 25, and is one end of the opening 25 in the length direction. It is formed from the to the other end.
- the height of the lower end of the front wall forming member 51 is aligned with the height of the upper edge of the opening 25, and the height of the upper edge of the front wall forming member 51 is higher than the height of the upper edge of the seal belt 40.
- the front wall forming member 51 forms a side wall on the front side of the recess, and faces the surface of the upper end portion of the seal belt 40 via a gap. In this way, the front wall forming member 51 adjusts the size of the gap formed on the front side of the end portion in the width direction of the seal belt 40, and makes the seal belt 40 have a desired seal property.
- the front wall forming member 51 is made of, for example, UPE (ultra high molecular weight polyethylene: Ultra High Molecular Weight Polyethylene).
- the deformation suppressing portion 52 includes a horizontal wall 50A and a vertical wall 50B.
- a horizontal wall 50A is provided on the inner wall of the case body 24 so as to project rearward from a position slightly above the front wall forming member 51.
- the rear end side of the horizontal wall 50A bends downward to form the vertical wall 50B.
- a portion within a range of, for example, approximately 6 mm from the lower end of the vertical wall 50B projects forward to form a ridge 53 along the length direction of the opening 25.
- the front end portion of the ridge portion 53 faces the upper end portion of the back surface of the seal belt 40 with a gap. Further, the ridge portion 53 is formed in a circular shape when viewed in the moving direction of the seal belt 40.
- the deformation suppressing portion 52 forms the bottom portion of the recess and the side wall on the rear side, and is made of UPE like the front wall forming member 51, for example.
- UPE is used as a material to reduce the friction generated between the seal belt 40 and the seal belt 40 when the seal belt 40 comes into contact with the seal belt 40, but the material is not limited to UPE.
- the gap dimension between the surface of the seal belt 40 and the front wall forming member 51 is, for example, 0.5 mm or more and 1.0 mm or less.
- the gap between the back surface of the seal belt 40 and the ridge portion 53 is, for example, 0.5 mm or less.
- the deformation suppressing portion 52 is provided from one end to the other end of the opening 25 along the length direction of the case body 24. It is formed over. That is, in the length direction of the opening 25, the position of one end of the deformation suppressing portion 52 is the same as one end of the opening 25 or the position outside the opening 25, and the position of the other end of the deformation suppressing portion 52. Is the same position as the other end of the opening 25 or a position outside the opening 25.
- N 2 gas nitrogen gas
- the gas discharge port 54 is formed in a slit shape extending along the moving direction of the seal belt 40, and is formed, for example, from one end to the other end of the opening 25.
- the gas discharge port 54 communicates with the buffer chamber 55 formed inside the ridge portion 53.
- the buffer chamber 55 is a space for diffusing gas in the extending direction of the deformation suppressing portion 52 (the length direction of the case body 24), and is formed in a circular shape having a diameter of, for example, 4 mm when viewed in the extending direction.
- a pipe forming a gas supply path 56 for supplying the above N 2 gas as a contact prevention gas is connected to the deformation suppressing unit 52 to the buffer chamber 55, and the upstream side of the pipe is connected to the N 2 gas supply source 57.
- Reference numerals 58 and 59 in FIG. 7 are flow rate adjusting units and valves, respectively.
- a vent 60 along the thickness direction of the vertical wall 50B Is formed.
- the air flowing into the case body 24 from the transport path 15 through the opening 25 due to the negative pressure inside the case body 24 with respect to the transport path 15 passes through the vent 60.
- the air is exhausted toward the rear of the case body 24.
- a plurality of vents 60 are provided at equal intervals, for example, along the extending direction of the deformation suppressing portion 52.
- the lower surrounding portion 5 is composed of a lower edge portion of the opening 25 of the case body 24.
- the front wall forming member 51 provided on the lower edge of the opening 25 faces the surface of the lower end of the seal belt 40. Further, the height of the upper end of the front wall forming member 51 is aligned with the height of the lower end edge of the opening 25, and is located higher than the height of the lower edge of the seal belt 40.
- the horizontal wall 50A is provided below the front wall forming member 51, the vertical wall 50B is formed upward from the horizontal wall 50A, and the front end portion of the ridge portion 53. Is opposed to the lower end of the back surface of the seal belt 40, which is a difference.
- the guide rail 31 and the pulley can be moved on the base 21 of the support portion 2 and the lifting table 22 in the same manner as the movement of the frame 23. It is performed by a drive system including 32, 33, a belt 34, and a motor 35.
- the drive system of the support portion 2 is provided in the base 21, and the drive system of the lift 22 is provided in the frame 23. Further, the rotation of the base 21 on the elevating table 22 is also performed by a drive system composed of the motor 35, and the drive system is provided in the elevating table 22.
- the space provided with each drive system communicates with the space inside the case body 24 and is exhausted by the fan 27, but the illustration of each drive system and the space provided with the drive system is omitted.
- the transfer arm 11 stands by at a position where the wafer W is received from, for example, the transfer module TRS of the tower T1. Therefore, in the case body 24, the moving body 26 is located on the delivery module TRS side as shown in FIG. At this time, the fan 27 is rotating, with an atmosphere containing particles 100 of the case body 24 is exhausted toward the rear surface of the seal belt 40 from the gas discharge port 54 N 2 gas is discharged.
- the inside of the case body 24 has a negative pressure.
- air flows from the transport path 15 into the opening 25, and the air flows into the gap between the seal belt 40 and the front wall forming member 51 and the vent 60 formed in the deformation suppressing portion 52. In order, it flows toward the fan 27 and is exhausted.
- a part of the N 2 gas discharged from the gas discharge port 54 to the seal belt 40 flows along the surface of the ridge portion 53 toward the bottom side of the recess formed by the surrounding portion 5, and is ventilated as described above. It merges with the flow of air passing through the port 60, passes through the vent 60, flows toward the fan 27, and is exhausted.
- the other part of the N 2 gas discharged to the seal belt 40 flows along the surface of the ridge portion 53 toward the opening side of the recess, and is directed toward the fan 27 from between the two upper and lower surrounding portions 5. Flows and is exhausted.
- Both ends of the seal belt 40 in the width direction are pushed rearward by the above-mentioned air flow.
- the rearward movement of both ends in the width direction that is, the deformation of the seal belt 40 described with reference to FIGS. 4 and 5 is suppressed.
- the action of the air flow is relatively large, and even when the seal belt 40 is deformed, both ends of the seal belt 40 in the width direction come into contact with the ridges 53, and the amount of deformation is suppressed. .. Therefore, the gap between both ends of the seal belt 40 in the width direction and the front wall forming member 51 (the mouth edge portion of the opening 25) does not become large.
- the transfer arm 11 receives the wafer W from the transfer module TRS of the tower T1 and transfers it to, for example, the resist coating module 14 on the innermost side when viewed from the tower T1.
- the moving body 26 moves from the front side to the back side when viewed from the tower T1.
- the atmosphere of the space (space on the back side) in the traveling direction of the moving body 26 in the case body 24 is compressed and boosted.
- the deformation of the seal belt 40 is suppressed as described above, the gap between both ends in the width direction and the front wall forming member 51 is narrow. Therefore, the compressed atmosphere is suppressed from being released into the transport path 15 as shown in FIG. Therefore, the particles 100 are also suppressed from being emitted from the case body 24 into the transport path 15.
- the state of the seal belt 40 when the wafer W is transferred from the transfer module TRS to the resist coating module 14 has been described, but the seal belt 40 is also used when the wafer W is transferred between other modules. The deformation is suppressed, and the emission of the particles 100 to the transport path 15 is suppressed.
- the moving body 26 housed in the case body 24 is moved, and the opening 25 is closed when the frame 23 connected to the moving body 26 is linearly moved through the opening 25.
- a seal belt 40 is provided.
- a surrounding portion 5 provided with a deformation suppressing portion 52 facing the other surface side at both ends in the width direction of the seal belt 40 is provided. Therefore, even if the inside of the case body 24 is exhausted by the fan 27, the size of the gap between both ends in the width direction of the seal belt 40 and the mouth edge of the opening 25 increases due to the deformation of the seal belt 40. Is suppressed. Therefore, the particles 100 are suppressed from being scattered from the inside of the case body 24 to the transport path 15 through the opening 25.
- the adhesion of the particles 100 to the wafer W passing through the transport path 15 is suppressed, and the decrease in the yield of the semiconductor product manufactured from the wafer W can be suppressed.
- the deformation of the seal belt 40 is suppressed and the sealing property of the opening 25 is high, it is possible to suppress the scattering of particles into the transport path 15 while suppressing the rotation speed of the fan 27. By suppressing the rotation speed of the fan 27 in this way, the electric power supplied to the fan 27 can be reduced. Therefore, the operating cost of the transfer arm 11 can be reduced.
- the deformation of the seal belt 40 is suppressed more reliably, and the contact of the seal belt 40 with the deformation suppressing portion 52 is suppressed.
- the generation of particles is suppressed, so that the scattering of particles to the transport path 15 is more reliably suppressed.
- deterioration of the seal belt 40 can also be suppressed.
- the gas discharge port 54 is formed in a slit shape extending along the moving direction of the seal belt 40, the deformation suppressing portion is formed at each position of the seal belt 40 along the length direction of the opening 25 as described above. It is preferable because contact with 52 can be suppressed.
- the gas discharge port 54 may be configured so that a large number of small-diameter discharge ports are formed at intervals along the moving direction of the seal belt 40. When the gas discharge ports 54 are formed in a slit shape, a plurality of gas discharge ports 54 may be formed at intervals.
- the gas discharge port 54 is provided in the projection 53 of the vertical wall 50B which forms a deformation suppressing portion 52, the position relative to the seal belt 40 N 2 gas is discharged from the relatively close position. Therefore, the pressing force of the gas on the seal belt 40 can be made relatively large. Further, in the vertical wall 50B, since the portion other than the ridge portion 53 in which the gas discharge port 54 is formed is relatively far from the seal belt 40, it is difficult to come into contact with the seal belt 40. That is, by discharging the gas from the ridge portion 53, the contact between the seal belt 40 and the deformation suppressing portion 52 can be suppressed more reliably, which is preferable.
- the ridge portion 53 is circular when viewed in the moving direction of the seal belt 40, the N 2 gas discharged from the gas discharge port 54 flows along the surface of the ridge portion 53 without stagnation and flows through the fan 27. Head to. Therefore, it is possible to prevent the N 2 gas discharged from the back surface side of the seal belt 40 from staying and increasing the pressure on the back surface side so that the front side of the seal belt 40 comes into contact with the front wall forming member 51. .. Further, since the ridge portion 53 is so circular, the friction generated is relatively small even when it comes into contact with the seal belt 40, and the deterioration of the seal belt 40 and the generation of particles 100 are suppressed. Therefore, it is preferable.
- a vent 60 is provided at a position near the bottom of the recess formed by the surrounding portion 5.
- the amount of air flowing from the transport path 15 to the opening 25 flows to the rear of the case body 24 through the vent 60, so that the amount of air passing between the ridge portion 53 and the seal belt 40 is reduced. .. That is, it is suppressed that the air flows across the N 2 gas flow discharged from the gas discharge port 54 and the pressing force of the N 2 gas flow on the seal belt 40 is weakened. Therefore, the contact between the seal belt 40 and the deformation suppressing portion 52 described above is more reliably suppressed.
- the linear motion mechanism 1 of the present disclosure is not limited to being applied to the transfer arm 11.
- the elevating table 22, the base 21, and the frame 23 are relatively heavy because they are provided with a drive mechanism. Therefore, it may be necessary to make the connecting portion of the moving body 26 that supports each of these members and is connected to the frame 23 relatively large in order to increase the strength.
- the moving body 26 is configured in this way, the opening 25 of the case body 24 becomes wide. As the opening 25 becomes wider, the area of the seal belt 40 that closes the opening 25 also needs to be increased. Such an increase in the area may cause the seal belt 40 to loosen, and the seal belt 40 described with reference to FIGS. 4 and 5 may be easily deformed. That is, it is considered preferable to apply the linear motion mechanism 1 to the transport arm 11 because it is considered that the deformation thereof can be suppressed and a high effect of suppressing the scattering of particles can be obtained.
- the case body 24 can be disassembled and the inside can be opened.
- the upper wall portion of the case body 24 can be used as a lid 24A, and the case body 24 can be detachably attached to another portion (case body) 24B.
- the deformation suppressing portion 52 is detachably configured with respect to the case body 24.
- the deformation suppressing portion 52 can be removed from the case body 24B from which the lid 24A has been removed, and maintenance such as cleaning can be performed.
- the case body 24 and the deformation suppressing portion 52 are attached and detached, and the case body 24B and the lid 24A are attached and detached by using fasteners (not shown) such as bolts and nuts, for example.
- FIGS. 14 to 17 showing each modification, the front wall forming member 51 forming the recess surrounding the seal belt 40 and the horizontal wall 50A forming the deformation suppressing portion are simplified as compared with the display shown in FIGS. It is shown as a model.
- the deformation suppressing portion 52A shown in FIG. 14 includes a cam follower 62, which is a columnar rotating body that stands up instead of the vertical wall 50B described above, and a shaft 61.
- a shaft 61 extends from the rear portion of the horizontal wall 50A toward the central portion side in the width direction of the seal belt 40, and a cam follower 62 is rotatably provided around the shaft 61 at the end of the shaft 61. Therefore, the shaft 61 and the cam follower 62 form a side wall on the rear side of the recess as seen from the side surface.
- the axis 61 extends along the vertical direction and is therefore orthogonal to the moving direction of the seal belt 40.
- a plurality of shafts 61 and cam followers 62 are arranged at equal intervals, for example, along the moving direction of the seal belt 40.
- the seal belt 40 By providing a plurality of cam followers 62 on the back surface side of the seal belt 40 in this way, the positions of both ends of the seal belt 40 in the width direction can be regulated, and the deformation of the seal belt 40 can be suppressed. Further, when the seal belt 40 moves, if the peripheral surface of the cam follower 62 is in contact with the seal belt 40, the seal belt 40 rotates in the moving direction of the seal belt 40. Therefore, the friction between the cam follower 62 and the seal belt 40 can be reduced, the deterioration of the seal belt 40 is suppressed, and the generation of particles is suppressed. In the state where the seal belt 40 is not deformed, the seal belt 40 may be in contact with the peripheral surface of the cam follower 62 or may be slightly separated from the peripheral surface.
- the deformation suppressing portion 52B shown in FIG. 16 is not provided with a vent 60 on the vertical wall 50B.
- the ridge portion 53 of the deformation suppressing portion 52B includes a plate-shaped airflow guide member 63.
- the airflow guide member 63 is provided so as to extend from the rim portion of the gas discharge port 54 of the ridge portion 53 toward the central portion side in the width direction of the seal belt 40. Since the airflow guide member 63 extends from the rim portion of the gas discharge port 54 as described above, the airflow guide member 63 is close to the seal belt 40.
- the airflow guide member 63 is a guide portion that regulates the airflow by forming a gap having a small front-rear width on the back surface side of both ends in the width direction of the seal belt 40.
- the airflow flowing through the gap on the back surface side of the seal belt 40 generates a vacuum suction force according to Bernoulli's principle, and both ends of the seal belt 40 in the width direction are attracted to the airflow guide member 63. At the same time, it becomes a non-contact state. Therefore, the positions of both ends in the width direction are restricted, the deformation of the seal belt 40 is suppressed, and the contact between the seal belt 40 and the ridge 53 can be more reliably suppressed, which is preferable.
- the gas discharge port 54 and the airflow guide member 63 may be provided on the front wall forming member 51 to suck both ends of the seal belt 40 in the width direction forward and to be in a non-contact state with the front wall forming member 51. ..
- the gas discharge port 54 and the air flow guide member 63 may be provided on both the front surface side and the back surface side of the seal belt 40.
- the deformation suppressing portion 52C shown in FIG. 17 will be described.
- the deformation suppressing portion 52C is not provided with a vent 60.
- the end portion of the vertical wall 50B is extended from the ridge portion 53 toward the center portion in the width direction of the seal belt 40.
- An exhaust passage 65 is formed inside the stretched portion, and a suction port 64 communicating with the exhaust passage 65 is opened on the front surface facing the seal belt 40. Therefore, the suction port 64 is provided on the opening side of the recess with respect to the gas discharge port 54.
- FIG. 18 shows another configuration example of the case body 24.
- Horizontal partition plates 68 are provided in the front and rear central portions of the case body 24 of FIG. 18, and divide the area where the moving body 26 and the belt 34 move and the area above the moving body 26 (referred to as a partition area 66).
- a fan 67 is provided in the partition area 66 separately from the fan 27. The air that has flowed into the case body 24 from the opening 25 flows into the compartment area 66 by the fan 67, further toward the rear of the compartment area 66, and is exhausted by the fan 27. That is, an exhaust path is formed that bypasses the region where the moving body 26 moves. With this configuration, the number of particles 100 in the moving region of the moving body 26 is reduced.
- the linear motion mechanism according to the second embodiment includes an internal moving body 70 that linearly moves along a guide rail 31 provided in the case body 24.
- the internal moving body 70 corresponds to the moving body 26 of the first embodiment, and like the moving body 26, moves horizontally by each member provided in the case body 24 such as the motor 35 and the belt 34.
- the illustration of the member is omitted.
- the height dimension of the internally moving body 70 is larger than the width dimension of the opening 25 and the width dimension of the seal belt 40, and the peripheral edge of the upper and lower end portions on the front surface of the internally moving body 70 is the rim of the opening 25 in the width direction. Face each other. Further, in front of the internal moving body 70, a connecting portion 71 which is connected to an external moving body (not shown) and projects from the opening 25 to the outside of the case body 24 is provided.
- the seal belt 40 is arranged so that one surface side of both end portions in the width direction thereof faces the mouth edge portion of the opening 25 of the case body 24.
- the seal belt 40 is provided so as to penetrate the internally moving body 70.
- the seal belt 40 is not annular.
- One end side and the other end side of the seal belt 40 in the length direction are fixed to the support columns 72 in the case body 24, respectively, and the seal belt 40 is arranged so as to close the opening 25.
- Reference numeral 73 in FIG. 19 is a driven roller for regulating the position of the seal belt 40 so as to be stretched in the vicinity of the opening 25, and is outside the opening 25 in the length direction of the opening 25. Have been placed.
- outer driven rollers 74 are provided in the vicinity of both side walls facing the moving direction of the internal moving body 70 (the length direction of the case body 24).
- the outer driven roller 74 has a role of restricting the position of the seal belt 40 so as to pass near the opening 25 on the outside of the internal moving body 70, and is provided in the vicinity of the opening 25.
- the case body 24 is provided at the position apart from each other in the length direction of the case body 24.
- the rotation axes of the rollers 73 to 75 are along the vertical axes.
- the internal moving body 70 moves with respect to the seal belt 40.
- the seal belt 40 corresponds to the position of the internally moving body 70 in the case body 24, and the front and rear positions of the seal belt 40 in the length direction are changed so that the seal belt 40 is the rollers 74 and 75 of the internally moving body 70. Is hung on.
- the portion of the seal belt 40 that fits inside the internal moving body 70 is on the rear side
- the portion outside the internal moving body 70 (second portion) is on the front side, that is, It is located near the opening 25.
- suction holes 76 are opened rearward at the upper edge portion and the lower edge portion of the opening 25 on the inner surface of the case body 24, respectively.
- suction holes 76 are formed in two upper and lower stages at the upper edge portion and the lower edge portion, respectively.
- a large number of suction holes 76 are provided at intervals along the length direction of the opening 25 at each of the upper edge portion and the lower edge portion.
- the suction hole 76 is configured as a suction portion that sucks the surface side of both end portions in the width direction of the seal belt 40, and the outer portion of the internal moving body 70 in the seal belt 40 is brought into close contact with the mouth edge portion of the opening 25. Can be done.
- the region of the seal belt 40 where the internal moving body 70 moves and enters the internal moving body 70 is the rim portion of the opening 25 as shown in FIG. 21 due to the stress applied by the movement of the internal moving body 70. Be separated from.
- the region of the seal belt 40 that protrudes from the inside to the outside of the internally moving body 70 is located near the opening 25 as shown in FIG. 20, and is sucked by the suction hole 76 to form the opening 25. Adhere to the rim.
- the seal belt 40 Since the seal belt 40 is in close contact with the case body 24 in this way, the seal belt 40 that closes the opening 25 is not pulled into the rear of the case body 24 even when the inside of the case body 24 is exhausted to a negative pressure. Therefore, the gap between the peripheral edges of both ends of the seal belt 40 in the width direction and the rim of the opening 25 is not widened, and even when the inside of the case body 24 is boosted by the movement of the internal moving body 70, the atmosphere containing the particles 100 is contained. However, it is possible to prevent the case body 24 from flowing out to the outside.
- the suction hole 76 may be a horizontally long slit.
- the suction portion that sucks the seal belt 40 onto the case body 24 is not limited to the above configuration.
- the widthwise edge of the seal belt 40 contains metal, and a magnet is arranged at the mouth edge of the opening 25 of the case body.
- a portion located near the opening 25 on the outside of the internally moving body 70 may be attracted to the rim portion by the magnetic force of the magnet to be brought into close contact with the seal belt 40. That is, the configuration is not limited to the configuration in which the seal belt 40 is sucked by exhaust gas.
- the linear motion mechanism according to the third embodiment will be described focusing on the differences from the linear motion mechanism 1 according to the first embodiment.
- the linear motion mechanism 1 according to the third embodiment has a different configuration of the surrounding portion 5 from the linear motion mechanism 1 according to the first embodiment.
- the surrounding portion 5 of the linear motion mechanism according to the third embodiment includes a holder 77 extending along the length direction of the case body 24.
- the vertical cross section of the holder 77 forms a recess 77A.
- the two holders 77 are arranged so that the opening sides of the recess 77A face each other. That is, the recess 77A of the upper holder 77 opens downward, and the recess 77A of the lower holder 77 opens upward.
- the holder 77 is provided with an electromagnet 79 on the side opposite to the opening side of the recess 77A, that is, on the outside of the recess 77A, and the electromagnet 79 is in the length direction of the holder 77 (the length direction of the case body 24). ) Is arranged.
- Each recess 77A is filled with a magnetic fluid 78, and is held in the recess 77A by the magnetic force of the electromagnet 79.
- Both ends of the seal belt 40 in the width direction are located in the recess 77A and are in contact with the magnetic fluid 78, but are not in contact with the holder 77.
- the gap between the seal belt 40 and the opening 25 is sealed by the magnetic fluid 78.
- both ends of the seal belt 40 in the width direction are located in the recess 77A, the movement to the rear is restricted.
- the gap is sealed by the magnetic fluid 78 as described above, the scattering of particles from the case body 24 to the transport path 15 is more reliably suppressed.
- the end portion of the seal belt 40 moves in the magnetic fluid 78, a large frictional force does not act on the end portion of the seal belt 40, and deterioration of the seal belt 40 and generation of particles due to rubbing of the seal belt 40 are suppressed. Can be done.
- each holder 77 may be installed so that the recess 77A opens rearward, and both ends of the seal belt 40 in the width direction may be bent forward so as to come into contact with the magnetic fluid 78.
- 24 and 25 are schematic longitudinal side views and plan views of the coating and developing apparatus, respectively.
- This coating / developing device is configured by connecting the carrier block D1, the processing block D2, and the interface block D3 in this order in a straight line. With respect to the interface block D3, the exposure apparatus D4 is connected to the side opposite to the connection direction of the processing block D2.
- the carrier block D1 has a role of applying the carrier C and carrying it in and out of the developing device 1A, and has a mounting table 91 of the carrier C, an opening / closing portion 92 that moves up and down to open / close the lid portion of the carrier C, and an opening / closing portion.
- a transfer mechanism 93 for transporting the wafer W from the carrier C via 92 is provided.
- the processing block D2 is configured by stacking unit blocks E1 to E6 in order from the bottom.
- Each of the unit blocks E1 to E3 corresponds to the above-mentioned processing unit 10, and forms a resist film on the wafer W.
- the unit blocks E4 to 6 have substantially the same configuration as the unit blocks E1 to E3, but include a developing module instead of the resist coating module 14.
- the tower T1 shown in FIG. 1 is provided on the carrier block D1 side and extends vertically across the unit blocks E1 to E6.
- a delivery module TRS is provided at each height of the unit blocks E1 to E6.
- a transfer arm 95 that can be raised and lowered is provided for transferring the wafer W to the tower T1.
- the transport arms 11 of the unit blocks E1 to E6 are shown as F1 to F6.
- the interface block D3 includes towers T2, T3, and T4 extending vertically across the unit blocks E1 to E6. Wafers W are delivered to the tower T2 and the tower T3 by the elevating and lowering interface arm 96, and to the tower T2 and the tower T4 by the elevating and lowering interface arm 97, respectively. Further, an interface arm 98 for transferring the wafer W between the tower T2 and the exposure apparatus D4 is provided. Modules such as the delivery module TRS are stacked on the tower T2. Modules are also provided in the towers T3 and T4, respectively, but the description thereof will be omitted here.
- the wafer W conveyed by the carrier C is conveyed to the unit blocks E1 to E3, and undergoes the resist film forming treatment and the heat treatment in order as described above. Then, the wafer W is conveyed to the exposure apparatus D4 via the transfer module TRS at each height of the unit blocks E1 to E3 of the tower T2 of the interface block D3, and is subjected to the exposure process. The exposed wafer W is conveyed to the transfer module TRS at each height of the unit blocks E4 to E6 of the tower T2. Subsequently, the wafer W is subjected to heat treatment and development treatment in order in the unit blocks E4 to E6, and after a pattern is formed on the resist film, it is returned to the carrier C.
- the linear motion mechanism 1 according to the present disclosure may be applied to the opening / closing portion 92 that opens the lid portion of the carrier C in the coating / developing apparatus shown in FIG. 24.
- the linear motion mechanism according to the present disclosure it is possible to suppress the emission of particles into the transport path of the wafer W carried out from the carrier C, and it is possible to suppress the adhesion of particles to the wafer W.
- the linear motion mechanism according to the present disclosure may be applied to the resist coating module 14. More specifically, it is applied to, for example, a moving mechanism of a nozzle for discharging a resist.
- Reference numeral 87 in the drawing is a cup that surrounds the wafer W for processing.
- the nozzle moving mechanism 8 includes a first housing 81 and a second housing 82 having substantially the same structure as the linear motion mechanism 1 shown in the first embodiment, respectively. ..
- the first housing 81 is a nozzle which is an external moving body.
- the 80 is connected to the moving body 84, which is an internally moving body, via an arm 83, which is a connecting portion, and is arranged so as to move the nozzle 80 in the vertical direction.
- the first housing 81 is formed with an exhaust port 85 on the lower surface instead of being provided with the fan 27.
- the second housing 82 is installed so that the opening 25 faces upward, and is configured to move the first housing 81, which is an external moving body, in the horizontal direction.
- the connecting portion 86 that supports the first housing 81 is formed in a tubular shape. One end of the connection portion 86 is connected to the exhaust port 85 of the first housing 81, and the other end is open in the second housing 82. Then, when the fan 27 of the second housing 82 exhausts the air, the inside of the first housing 81 is also exhausted collectively via the connection portion 86.
- the nozzle 80 moves between a processing position having a predetermined height with respect to the wafer W in the cup 87 and a standby position having a predetermined height outside the cup 87. Since each of the first housing 81 and the second housing 82 is configured in the same manner as the linear motion mechanism 1, the scattering of particles from each housing is suppressed when the nozzle 80 is moved in this way. , It is possible to suppress the adhesion of the particles to the wafer W.
- the linear motion mechanism of the present disclosure is not limited to being applied to the transfer arm 11.
- the linear motion mechanism of the present technology may be applied to the nozzle moving mechanism of the device that supplies the chemical solution other than the resist.
- the linear motion mechanism may be applied to an elevating mechanism for raising and lowering an elevating pin provided for delivering the substrate to a transport mechanism. ..
- the moving mechanism for moving the mounting table 91 of the carrier C between the unload position (the position where the carrier C is delivered to the mounting table 91) and the loading position (the position where the wafer W is carried into the apparatus) is directly connected to the moving mechanism.
- a dynamic mechanism may be applied.
- the moving direction of the external moving body by the linear motion mechanism is not limited to the vertical direction and the horizontal direction as in each of the above-described examples, and may be, for example, an oblique direction.
- FIGS. 27 and 28 show cross sections at positions different from each other in the moving direction (straight line direction) of the seal belt 40.
- the surrounding portions 5 forming recesses in the moving direction of the seal belt 40 are provided on the upper and lower sides of the inside of the case body 24, respectively.
- the upper surrounding portion 5 will be described as a representative.
- the surrounding portion 5 in this modified example is a member that is long in the moving direction of the seal belt 40, and is made of, for example, resin, and each side wall and the bottom wall forming the recess are integrally formed. More specifically, the front wall forming member 51 described in the first embodiment is configured to be connected to the horizontal wall 50A, and the front wall forming member 51, the horizontal wall 50A, and the vertical wall 50B are integrated.
- the surrounding portion 5 is formed as a recess, and the surrounding portion 5 surrounds the upper end portion of the seal belt 40.
- the vertical wall 50B (one side wall of the recess) of the surrounding portion 5 of this modified example is not provided with the ridge portion 53 and the vent 60, and the front surface of the vertical wall 50B is the upper end portion of the seal belt 40. It is configured as a vertical surface 59 that faces and is close to (that is, slightly separated from the seal belt 40) the back surface side (other surface side) of the above.
- a plurality of the surrounding portions 5 are provided on the upper side of the case body 24 at intervals in the moving direction of the seal belt 40.
- a plurality of roller units 110 are provided on the upper side of the case body 24.
- Each roller unit 110 includes a base 101 and a roller 102.
- the base 101 is provided at a position above the upper end of the seal belt 40, a vertically long roller 102 extends downward from the base 101, and the peripheral surface of the roller 102 faces the back surface of the upper end of the seal belt 40. doing.
- the roller 102 is a rotating body that rotates around a vertical axis, and the upper end side of the roller 102 is surrounded by a bearing 103 and is connected to the base 101 via the bearing 103.
- the front end of the roller 102 When viewed in the moving direction of the seal belt 40, the front end of the roller 102 is provided at a position closer to the back surface of the seal belt 40 than the vertical surface 55 of the vertical wall 50B of the surrounding portion 5. For example, it is in close proximity to or in contact with the back surface.
- a plurality of roller units 110 are also provided on the upper side of the seal belt 40, and the roller unit 110 and the surrounding portion 5 are alternately arranged in the moving direction of the seal belt 40. Therefore, the roller 102 and the vertical wall 50B are provided side by side in the moving direction.
- the configuration near the opening of the case body 24 is vertically mirror-symmetrical as in each of the above-described examples. Therefore, a plurality of surrounding portions 5 and a plurality of roller units 110 are provided on the lower side in the case body 24, and these surrounding portions 5 and the roller unit 110 are provided along the moving direction of the seal belt 40. They are arranged alternately. In this way, the lower end portion of the seal belt 40 is surrounded by the lower side surrounding portion 5 in the case body 24, and the vertical wall 50B of the surrounding portion 5 faces the back surface of the lower end portion of the seal belt 40.
- the base 101 of the roller unit 110 provided on the lower side in the case body 24 is located below the lower end of the seal belt 40, and the roller 102 projects upward from the base 101.
- the positional relationship between the vertical wall 50B of the surrounding portion 5 provided on the lower side of the case body 24 and the roller 102 is the vertical wall of the surrounding portion 5 provided on the upper side of the case body 24 as described above. This is the same as the positional relationship between the 50B and the roller 102.
- the positions of the surrounding portion 5 and the roller unit 110 on the upper side and the surrounding portion 5 and the roller unit 110 on the lower side are not necessarily the same in the moving direction of the seal belt 40, and are slightly deviated from each other, for example. You may.
- the vertical wall 50B of the surrounding portion 5 located on the back surface side of the seal belt 40 prevents the seal belt 40 from being relatively significantly deformed.
- the roller 102 located on the back surface side of the seal belt 40 as well as the vertical wall 50B also contributes to the suppression of the deformation of the seal belt 40. Therefore, as in the first embodiment, the sealing property of the opening 25 of the case body 24 can be improved.
- the vertical wall 50B and the roller 102 correspond to the deformation suppressing portion of the seal belt 40.
- the roller unit 102 may be configured to include a shaft 61 and a cam follower 62 which is a roller having a diameter larger than that of the shaft 61 and rotating with respect to the shaft 61. ..
- the roller 102 extends downward and upward from the base 102 having bearings 103 arranged above and below the seal belt 40, respectively.
- the roller 102 can have a small diameter and can be located relatively forward to the opening 25 with respect to the rotation axis of the roller 102. Therefore, since the width of the front and rear of the roller unit 110 can be suppressed, it is possible to prevent the case body 24 from becoming large.
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Abstract
Description
前記ケース体に形成される開口部と、
前記ケース体内に設けられ、直線方向に移動する内部移動体と、
前記開口部から当該ケース体の外部へ突出するように前記内部移動体に設けられると共にケース体の外部において外部移動体と接続され、前記内部移動体の移動に伴い前記外部移動体を移動させるための接続部と、
前記直線方向に延びて前記開口部を塞ぐようにケース体内に設けられると共に、幅方向における両端部の一面側が当該開口部の口縁部に離れて対向するシールベルトと、
前記内部移動体の移動に応じて前記直線方向に移動するように当該内部移動体に接続された前記シールベルトについての変形を抑制するために、当該シールベルトの幅方向の両端部の他面側に対向して設けられる変形抑制部か、
あるいは、前記内部移動体の位置に対応する第1の部位が、当該第1の部位とは前記直線方向に異なる第2の部位よりも前記開口部から離れるように当該内部移動体に掛けられる前記シールベルトについての前記両端部の一面側を吸引して、前記第2の部位を前記開口部の口縁部に密着させるために、前記ケース体に設けられる吸引部と、
を備えた。
第1の実施形態として、半導体製造用の基板であるウエハWを搬送する搬送アーム11に、本技術に係る直動機構を適用した例を説明する。図1は基板搬送機構をなす上記の搬送アーム11と、搬送アーム11によりウエハWが受け渡されるモジュール群とを備えた処理部10の斜視図を示している。この処理部10は、後述する基板処理装置である塗布、現像装置を構成し、大気雰囲気に設けられる。なお、上記の半導体とは物質としての半導体の意味ではなく、半導体により構成されるトランジスタやダイオードなどの素子を含む半導体デバイスの意味である。
なお、以下明細書中では、シールベルト40における開口部25から臨む面を一面側(表面側)とし、一面とは反対側の従動ローラ42に接する側の面を他面側(裏面側)とする。そして、以下の説明では特に部位を指定しない場合、シールベルト40とは、当該シールベルト40の周のうち、前方側にて張架されている部位(前方側の従動ローラ42間に張架される部位)のことを指すものとする。
さらに、シールベルト40の変形が抑制され、開口部25のシール性が高いので、ファン27の回転数を抑えつつ、パーティクルの搬送路15への飛散を抑制することができる。そのようにファン27の回転数が抑制されることで、ファン27に供給する電力を低下させることができる。従って、搬送アーム11の運用コストの低減を図ることができる。
第2の実施の形態に係る直動機構について説明する。図19に示すように第2の実施形態に係る直動機構は、ケース体24内に設けられたガイドレール31に沿って直線移動する内部移動体70を備えている。内部移動体70は、第1の実施形態の移動体26に相当し、移動体26と同様にモータ35及びベルト34等のケース体24内に設けられる各部材により水平移動するが、これらの各部材の図示は省略している。
第3の実施形態に係る直動機構について、第1の実施形態に係る直動機構1との差異点を中心に説明する。第3の実施形態に係る直動機構1は、囲み部5の構成が第1の実施形態に係る直動機構1と異なる。図22に示すように第3の実施形態に係る直動機構の囲み部5は、ケース体24の長さ方向に沿って延在する保持具77を備えている。この保持具77の縦断面は凹部77Aを形成している。2つの保持具77は、凹部77Aの開口側を互いに対向させるように配置されている。つまり、上側の保持具77の凹部77Aは下方に向かって開口し、下側の保持具77の凹部77Aは上方に向かって開口している。そして保持具77については、凹部77Aの開口側とは反対側、即ち凹部77Aの外側に電磁石79が設けられており、電磁石79は、保持具77の長さ方向(ケース体24の長さ方向)に沿って配置されている。そして各凹部77A内には、磁性流体78が充填されており、電磁石79の磁力により当該凹部77A内に保持されている。そして、シールベルト40の幅方向の両端部は凹部77A内に位置し、磁性流体78と接触する一方で、保持具77とは非接触となっている。
ノズル移動機構8の作用により、ノズル80についてはカップ87内のウエハWに対する所定の高さの処理位置と、カップ87の外側における所定の高さの待機位置との間で移動する。第1の筐体81及び第2の筐体82の各々が直動機構1と同様に構成されることで、そのようにノズル80を移動させるにあたり、各筐体からのパーティクルの飛散が抑制され、当該パーティクルのウエハWへの付着を抑制することができる。
続いて、第1の実施形態の更なる変形例について図27及び図28の縦断側面図、図29の斜視図を参照して、図6等で示した第1の実施形態との差異点を中心に説明する。なお、図27、図28はシールベルト40の移動方向(直線方向)において、互いに異なる位置の断面を示している。この変形例においても第1の実施形態と同様、ケース体24の内部の上側、下側に、シールベルト40の移動方向に見て凹部をなす囲み部5が各々設けられている。以下、代表して上側の囲み部5について説明する。
25 開口部
26 移動体
40 シールベルト
52 変形抑制部
76 吸引孔
Claims (17)
- 内部が排気されるケース体と、
前記ケース体に形成される開口部と、
前記ケース体内に設けられ、直線方向に移動する内部移動体と、
前記開口部から当該ケース体の外部へ突出するように前記内部移動体に設けられると共にケース体の外部において外部移動体と接続され、前記内部移動体の移動に伴い前記外部移動体を移動させるための接続部と、
前記直線方向に延びて前記開口部を塞ぐようにケース体内に設けられると共に、幅方向における両端部の一面側が当該開口部の口縁部に離れて対向するシールベルトと、
前記内部移動体の移動に応じて前記直線方向に移動するように当該内部移動体に接続された前記シールベルトについての変形を抑制するために、当該シールベルトの幅方向の両端部の他面側に対向して設けられる変形抑制部か、
あるいは、前記内部移動体の位置に対応する第1の部位が、当該第1の部位とは前記直線方向に異なる第2の部位よりも前記開口部から離れるように当該内部移動体に掛けられる前記シールベルトについての前記両端部の一面側を吸引して、前記第2の部位を前記開口部の口縁部に密着させるために、前記ケース体に設けられる吸引部と、
を備えた直動機構。 - 前記変形抑制部が、前記シールベルトの幅方向の両端部の他面側に、当該シールベルトに対して離れて設けられ、
前記直線方向に見て、当該シールベルトの両端部を各々囲む凹部が形成され、前記凹部の一方の側壁、他方の側壁は前記変形抑制部、前記開口部の口縁部により夫々構成される請求項1記載の直動機構。 - 前記各変形抑制部には、当該変形抑制部と前記シールベルトとの接触を防止するための接触防止部が設けられる請求項2記載の直動機構。
- 前記各変形抑制部は、前記直線方向に延在し、
前記接触防止部は、前記直線方向に複数設けられるか、あるいは当該直線方向に延在するスリットとして形成された、前記シールベルトの幅方向の両端部の他面側に、当該変形抑制部への接触防止用ガスを吐出するガス吐出口を備える請求項3記載の直動機構。 - 前記変形抑制部によって形成される前記凹部の側壁は、前記開口部の口縁部へ向けて突出すると共に前記直線方向に形成された突条部を備え、
前記ガス吐出口は当該突条部に設けられる請求項4記載の直動機構。 - 前記突条部の先端部は、前記直線方向に見て円形である請求項5記載の直動機構。
- 前記シールベルトと前記突条部との距離は0.5mm以下であり、前記シールベルトと前記開口部の口縁部との距離は0.5mm以上、1mm以下である請求項5記載の直動機構。
- 前記接触防止部は、前記突条部に開口した前記ガス吐出口の口縁部から前記シールベルトの幅方向の中心部側へ向けて延伸されて形成され、当該変形抑制部と前記シールベルトとの間の前記接触防止用のガスの流れをガイドするガイド部を含む請求項4記載の直動機構。
- 前記変形抑制部は、前記ガス吐出口から吐出されたガスを吸引するための吸引口を、当該ガス吐出口に対して前記凹部の開口側に備える請求項4記載の直動機構。
- 前記変形抑制部によって形成される前記凹部の側壁において、前記ガス吐出口よりも当該凹部の底部寄りに、当該凹部の内外を連通させる通気口が設けられる請求項3記載の直動機構。
- 前記変形抑制部は前記ケース体に対して着脱自在である請求項2記載の直動機構。
- 前記凹部内には磁性流体が充填され、前記磁性流体を前記凹部内に保持するための磁石が当該凹部の外側に設けられる請求項2記載の直動機構。
- 前記変形抑制部が、前記シールベルトの幅方向の両端部の他面側に設けられ、
当該変形抑制部は、前記シールベルトとの摩擦を低減するために当該シールベルトの移動方向に直交する回転軸回りに回転する回転体を備える請求項1記載の直動機構。 - 前記直線方向に見て、当該シールベルトの両端部を各々囲む凹部が形成され、
前記変形抑制部は、前記直線方向に並んで設けられる前記回転体と前記凹部の一方の側壁と、を含み、
前記凹部の一方の側壁は、前記シールベルトの幅方向の両端部の他面側に、当該シールベルトに対して離れて設けられ、前記回転体は当該凹部の一方の側壁よりも前記シールベルトの近くに位置する請求項13記載の直動機構。 - 前記吸引部が設けられ、
当該吸引部は、前記ケース体に形成されたベルト密着用の吸引孔を備える請求項1記載の直動機構。 - 前記外部移動体は、半導体製造用の基板を支持する基板支持部を備える請求項1記載の直動機構。
- 開口部が形成されるケース体の内部を排気する工程と、
前記ケース体内に設けられる内部移動体を、直線方向に移動させる工程と、
前記開口部から当該ケース体の外部へ突出するように前記内部移動体に設けられると共にケース体の外部において外部移動体と接続される接続部を移動させ、前記内部移動体の移動に伴い前記外部移動体を移動させる工程と、
前記ケース体の外側に、前記接続部に接続されて設けられる外部移動体を、前記内部移動体の移動に応じて前記直線方向に移動させる工程と、
前記直線方向に延びてケース体内に設けられると共に、幅方向における両端部の一面側が当該開口部の口縁部に離れて対向するシールベルトにより、前記開口部を塞ぐ工程と、
前記シールベルトの幅方向の両端部の他面側に対向して設けられる変形抑制部により、前記内部移動体の移動に応じて前記直線方向に移動するように当該内部移動体に接続された前記シールベルトについての変形を抑制する工程か、
あるいは、前記内部移動体の前記直線方向の位置に対応する第1の部位が、当該第1の部位とは異なる第2の部位よりも前記開口部から離れるように当該内部移動体に掛けられる前記シールベルトの前記両端部の一面側を、前記ケース体に設けられる吸引機構により吸引して前記第1の部位を前記開口部の口縁部に密着させる工程と、
を備えたパーティクルの飛散抑制方法。
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