WO2021110042A1 - Led显示装置 - Google Patents

Led显示装置 Download PDF

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Publication number
WO2021110042A1
WO2021110042A1 PCT/CN2020/133345 CN2020133345W WO2021110042A1 WO 2021110042 A1 WO2021110042 A1 WO 2021110042A1 CN 2020133345 W CN2020133345 W CN 2020133345W WO 2021110042 A1 WO2021110042 A1 WO 2021110042A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
receiving hole
display device
led display
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PCT/CN2020/133345
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English (en)
French (fr)
Inventor
田梓峰
徐虎
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深圳市绎立锐光科技开发有限公司
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Publication of WO2021110042A1 publication Critical patent/WO2021110042A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces

Definitions

  • the utility model relates to the field of display devices, in particular to an LED display device.
  • the LED display device mainly adjusts the current of the three primary color LED chips (ie, red LED chip, green LED chip and blue LED chip) to control the brightness value, so as to achieve the combination of the three primary colors to achieve full-color display. effect.
  • the LED display device In the actual LED production and packaging process, there is a process of dividing the LED into Bins. In different Bins, the peak wavelength will move, and the chromaticity and brightness of the LED will have consistency deviation problems. In this process, due to different The LEDs grown on the wafer are likely to be in different Bins, so the deviation of the chromaticity consistency of the LEDs is an inevitable phenomenon.
  • the black partition wall absorbs light, which causes the light extraction efficiency of the LED display module to decrease, that is, it is impossible to ensure high light extraction efficiency while ensuring high contrast.
  • an LED display device which includes:
  • a white partition substrate, the partition substrate is covered and fixed to the circuit substrate, and the partition substrate is provided with a receiving hole penetrating therethrough;
  • the LED chip is accommodated in the receiving hole, and the LED chip is fixed on the circuit substrate and electrically connected with the circuit substrate;
  • a fluorescent layer which is filled in the receiving hole, is formed by mixing and curing a fluorescent material and a resin material, and the fluorescent layer and the LED chip are arranged in one-to-one correspondence; and,
  • a transparent sealing layer is attached to an end of the separating substrate away from the circuit substrate and completely covering the receiving hole, and the transparent sealing layer and the LED chip are spaced apart.
  • the partition substrate further includes a glass fiber cloth for modifying and strengthening the partition substrate, and the content of the glass fiber cloth accounts for 39% to 60% of the total mass of the partition substrate;
  • the fiber cloth is arranged in a row along a plane perpendicular to the penetrating direction of the receiving hole.
  • the thickness of the partition substrate is greater than 0.2 mm; the cross-sectional shape of the receiving hole is round or square, and the hole diameter of the receiving hole is 0.02 mm to 1 mm.
  • the accommodating holes include a plurality of accommodating holes and are arranged at intervals, and the width of the side wall of the partition substrate arranged between two adjacent accommodating holes is 0.05 mm to 0.3 mm.
  • the accommodating hole includes a first accommodating hole, a second accommodating hole, and a third accommodating hole that are spaced apart from each other;
  • the fluorescent layer includes:
  • a red light layer, the red light layer is formed by filling the first receiving hole with red powder and resin material;
  • a green light layer, the green light layer is formed by filling the second receiving hole with green powder and resin material;
  • the blue light layer is formed by filling the third receiving hole with one of blue powder and quantum dot materials and a resin material.
  • the LED display device further includes:
  • a first blue light absorbing layer, the first blue light absorbing layer is coated on the upper surface of the red light layer away from the circuit substrate; and/or,
  • a second blue light absorbing layer, the second blue light absorbing layer is coated on the upper surface of the green light layer away from the circuit substrate; and/or,
  • the third blue light absorbing layer is coated on the lower surface of the transparent sealing layer close to the circuit substrate.
  • the LED display device further includes:
  • the black absorption layer is coated on the upper surface of the separation substrate on the side away from the circuit substrate.
  • the LED display device further includes:
  • Adhesive film the opposite sides of the adhesive film are respectively glued and fixed with the separation substrate and the circuit substrate, and the position of the adhesive film and the receiving hole is provided with a penetrating through it. Through hole.
  • the adhesive film is made of epoxy resin or a mixture of scattering particle material and epoxy resin;
  • the scattering particle material includes titanium dioxide, aluminum oxide, silicon oxide, barium sulfate, zinc sulfide, and zinc oxide And at least one of yttrium oxide.
  • the thickness of the adhesive film is 15-50 microns, and the thickness of the adhesive layer is greater than or equal to twice the thickness of the circuit substrate.
  • the separation substrate is made of white polyethylene terephthalate or polyimide, and its glass transition temperature is higher than the thermal curing temperature of the adhesive film.
  • the inner side of the partition substrate and the inner side of the adhesive film are respectively provided with a white reflective layer for reflecting light
  • the white reflective layer is made of one of phenyl silica gel and epoxy resin. It is formed by mixing and solidifying the scattering particle material; the scattering particle material includes at least one of titanium dioxide, aluminum oxide, silicon oxide, barium sulfate, zinc sulfide, zinc oxide, and yttrium oxide.
  • the LED display device of the present invention by providing a receiving hole in the partition substrate, the LED chip and the fluorescent layer corresponding to the LED chip are respectively arranged in the receiving hole, thereby avoiding the light emitted by the LED chip.
  • the fluorescent layer of other colors adjacent to it to solve the problem of color crosstalk between adjacent LED chips, so that the contrast of the LED display device is high; at the same time, because the circuit substrate and the partition substrate are both white, that is, the partition substrate
  • the inner surface of the receiving hole and the upper surface of the circuit board and the upper surface of the receiving hole are all white, which is beneficial to reflect the light irradiated on the inner surface of the partition substrate and the upper surface of the circuit board to avoid light absorption. Effectively improve the light extraction efficiency.
  • Fig. 1 is a schematic cross-sectional view of the first embodiment of the LED display device of the present invention
  • FIG. 2 is a top view of a part of the structure of the first embodiment of the LED display device of the present invention
  • FIG. 3 is a schematic diagram of the relationship between the content of the glass fiber cloth and the flexural modulus and reflectivity of the partition substrate in the first embodiment of the LED display device of the present invention
  • FIG. 4 is a schematic cross-sectional view of the second embodiment of the LED display device of the present invention.
  • the present invention provides an LED display device 100, which is characterized in that it includes a circuit substrate 1, a partition substrate 2, an LED chip (not shown in the figure), and a phosphor layer (not shown in the figure) , Transparent sealing layer 3 and adhesive film 4.
  • the partition substrate 2 is covered and fixed to the circuit substrate 1, and the partition substrate 2 is provided with a receiving hole (not shown in the figure) penetrating through it.
  • the partition substrate 2 is made of white polyethylene terephthalate or polyimide, so that the partition substrate 2 is white as a whole, that is, the partition substrate 2 is located on the The inner surface of the receiving hole is white, which can effectively reflect the light irradiated on the inner surface of the partition substrate 2 outward.
  • the circuit substrate 1 is made of white plastic material, and the specific material is not limited.
  • the circuit substrate 1 The white polyethylene terephthalate and polyimide are made of one of the materials, so that the circuit board 1 is white as a whole, that is, the upper part of the circuit board 1 and the receiving hole is arranged correspondingly.
  • the surface is white, which is conducive to reflecting the light irradiated on the circuit substrate 1 and improving the light extraction efficiency; more preferably, the circuit substrate 1 and the separation substrate 2 are made of the same material, which effectively makes The thermal expansion coefficient between the two is consistent, which makes the reliability higher.
  • the partition substrate 2 further includes a glass fiber cloth for modifying and strengthening the partition substrate 2; the glass fiber cloth is arranged in a plane perpendicular to the through direction of the receiving hole.
  • the content of fiberglass cloth directly affects the flexural modulus and reflectivity of the separator substrate 2.
  • the flexural strength is less than 20 GPa. Because the flexural strength is too low, the separation substrate 2 cannot be machined and punched, but when the glass fiber cloth content is higher than 60%, the separation substrate 2 The reflectivity of the inner side surface is lower than 88%, which is not conducive to reflecting light outward.
  • the content of the glass fiber cloth accounts for 39% to 60% of the total mass of the partition substrate 2, which provides conditions for punching receiving holes on the partition substrate 2 while ensuring the punching
  • the inner surface of the partition substrate 2 behind the hole has a higher reflectivity, which is beneficial to reflect light outward.
  • the thickness d1 of the separation substrate 2 is positively correlated with the reflectivity of the inner surface of the separation substrate 2. More preferably, in order to further improve the reflectivity of the inner surface of the separation substrate 2, the separation substrate The thickness d1 of 2 is greater than 0.2 mm.
  • the shape of the cross section of the receiving hole is not limited, and it can be specifically set according to the actual use situation, and the hole diameter corresponding to the shape of the cross section is also not limited, for example, in this embodiment
  • the cross-sectional shape of the receiving hole is square
  • the aperture of the receiving hole is the side length of the cross-section of the receiving hole, and the side length is preferably 0.02 mm to 1 mm; of course, the cross-section of the receiving hole is round.
  • the aperture of the receiving hole is the diameter of the cross section of the receiving hole, and the diameter is preferably 0.02 mm to 1 mm.
  • the accommodating hole includes a plurality of accommodating holes arranged at intervals, and the width d2 of the sidewall 21 between the separating substrate 2 arranged between two adjacent accommodating holes affects the light extraction efficiency of the LED display device 100 And chromatic aberration.
  • the width d2 is less than 0.05 mm, the reflectivity of the inner side surface of the partition substrate 2 is low, resulting in low light extraction efficiency of the LED display device 100, and when the width d2 is greater than 0.3 mm, the LED The display device 100 has a large color difference at different horizontal viewing angles and a poor display effect; therefore, preferably, the width d2 of the sidewall 21 of the partition substrate 2 disposed between two adjacent receiving holes is 0.05 mm to 0.3 mm, to ensure that the LED display device 100 has a high light output efficiency, and at the same time to ensure that the display color difference is small.
  • the LED display device 100 further includes a black absorption layer (not shown); in this embodiment, the black absorption layer is coated on the separation substrate 2
  • the black absorption layer can absorb ambient light or leakage light between adjacent pixels, effectively improving the display contrast of the LED display device 100; it should be noted that the The thickness of the black absorption layer is not limited, and the thickness is preferably between 0.01 ⁇ m and 10 ⁇ m.
  • the LED chip is received in the receiving hole, and the LED chip is fixed on the circuit substrate 1 and electrically connected to the circuit substrate 1.
  • the specific type of the LED chip is not limited, and it may include at least one of a blue LED chip, a violet LED chip, and an ultraviolet LED chip; wherein the blue LED chip is used to emit at a wavelength of 420 Blue light from nanometers to 480 nanometers, the violet LED chip is used to emit violet light with a wavelength less than 420 nanometers, and the ultraviolet light chip is used to emit ultraviolet light.
  • the fluorescent layer is composed of fluorescent material and resin material filled in the receiving hole. Mix and cure to form.
  • the fluorescent material includes one of fluorescent powder and quantum dot material; the fluorescent powder includes one of red powder, green powder and blue powder, and the particle size of the fluorescent powder is 0.1 micrometer to 30 micrometers; the resin material is not limited, in order to improve the molding efficiency of the fluorescent layer, the resin material is preferably one of phenyl silica gel and epoxy resin, and the fluorescent layer formed Good airtightness and high refractive index.
  • the blue layer PB is formed by mixing and curing a quantum dot material with scattering particles and a resin material; of course, the LED chip may also When it is a purple LED chip with an emission wavelength of less than 420 nanometers or an ultraviolet LED chip, the blue layer PB is formed by curing blue powder and resin.
  • the accommodating hole includes a first accommodating hole, a second accommodating hole, and a third accommodating hole that are spaced apart from each other.
  • the LED chip Since the blue LED chip has the advantages of high electro-optical conversion efficiency, highest color consistency, slow aging, and high reliability, the LED chip is preferably a blue LED chip.
  • the LED chip includes a first LED chip B1, a second LED chip B2, and a third LED chip B3.
  • the fluorescent layer includes a red light layer PR, a green light layer PG, and a blue light layer PB.
  • the first LED chip B1 is received in the first receiving hole, and is electrically connected to the circuit substrate 1 through the first electrode layer E1, and the red light layer PR is filled with red powder and resin material in the first Formed in the receiving hole.
  • the second LED chip B2 is received in the second receiving hole, and is electrically connected to the circuit substrate 1 through the second electrode layer E2, and the green layer PG is filled with green powder and resin material in the first The blue light emitted by the second LED chip B2 is excited by the green light layer PG and then emits green light outward.
  • the third LED chip B3 is received in the third receiving hole, and is electrically connected to the circuit substrate 1 through the third electrode layer E3, and the blue light layer PB is filled in the first with a quantum dot material and a resin material. Three accommodating holes are formed.
  • the blue light emitted by the first LED chip B1 is excited by the red light layer PR and then emits red light, and the blue light emitted by the second LED chip B2 passes through the green light layer.
  • the blue light emitted by the third LED chip B3 passes through the blue layer PG, and then emits blue light, and the generated fluorescence is reflected outward by the inner surface of the partition substrate 2 Go out, so that the LED display device 100 can generate three colors of red light, green light and blue light (that is, the three primary colors of RGB) to realize the color display function;
  • the LED display device 100 controls the thickness and area of the red light layer PR and the green light layer PG to adjust the consistency of the red light and the green light respectively.
  • the operation of adjusting the consistency of the red light and the green light Convenient and low cost;
  • blue LED chips have higher electro-optical conversion efficiency.
  • the use of blue LED chips has higher excitation efficiency for phosphors, especially through The blue LED chip has a higher excitation efficiency for green light, which effectively improves the light extraction efficiency of the LED display device 100 for red and green light, so that the color display effect is better; in addition, it is worth mentioning that due to the In the embodiment, only one color of LED chips is used, that is, only blue LED chips are used, which makes the packaging of the LED display device more convenient, and provides favorable conditions for manufacturing miniature LED devices with small chip and small pitch manufacturing process.
  • the value of the wavelength of the blue light emitted by the first LED chip B1, the second LED chip B2, and the third LED chip B3 is not limited, and it is specifically set according to the actual application, such as , And more preferably, the first LED chip B1 and the second LED chip B2 both emit short-wave blue light with a wavelength of 440 nanometers to 455 nanometers, and the third LED chip B3 emits a wavelength of 460 nanometers to 480 nanometers. Long-wave blue light and short-wave blue light excite red powder and green powder more efficiently than long-wave blue light, which effectively improves the light extraction efficiency of red light and green light, and makes the color display effect of the LED display device better.
  • a blue light absorption layer for absorbing blue light can be provided at the position of the light exit of the first receiving hole and/or the position of the light exit of the second receiving hole ( Figure (not marked), that is, on the upper surface of the red light layer PR away from the circuit substrate 1, and/or the green light layer PG away from the upper surface of the circuit substrate 1, and/or the transparent sealing layer 3
  • a layer of blue light absorption layer is arranged close to the lower surface of the circuit substrate 1, and the blue light absorption layer can be specifically arranged according to actual design requirements.
  • the blue light absorption layer includes:
  • the blue light emitted from the second receiving hole is effectively absorbed, thereby avoiding the mixing of the green light emitted outward
  • the problem of color crosstalk is more effectively avoided, and the color purity, color uniformity and stability of red and green light are further improved, so that the display contrast of the LED display device 100 is higher, and the color display effect is better.
  • the transparent sealing layer 3 is attached to an end of the separation substrate 2 away from the circuit substrate 1 and completely covers the receiving hole, and the transparent sealing layer 3 is spaced apart from the LED chip.
  • the transparent sealing layer 3 is a single-layer film structure made of one of polyurethane, epoxy resin, parylene, silicon oxide and silicon nitride, or polyurethane, epoxy resin, and Perry.
  • a multilayer film structure made of at least two materials in the forest.
  • the opposite sides of the adhesive film 4 are glued and fixed to the separation substrate 2 and the circuit substrate 1, respectively, and the adhesive film 4 is provided with a through hole at a position corresponding to the receiving hole. Hole (not marked in the picture).
  • the adhesive film 4 is made of epoxy resin or a mixture of scattering particle materials and epoxy resin; the scattering particle materials include titanium dioxide, aluminum oxide, silicon oxide, barium sulfate, sulfide At least one of zinc, zinc oxide, and yttrium oxide.
  • the adhesive film 4 is preferably made of a mixture of scattering particle materials and epoxy resin.
  • the thickness of the adhesive film 4 is 15-50 microns, and the thickness of the adhesive layer 4 is greater than or equal to twice the thickness of the circuit substrate 1, which effectively ensures the adhesion
  • the adhesive strength between the adhesive layer 4 and the circuit substrate 1 makes the fixing between the two more reliable.
  • the glass transition temperature (Tg temperature) of the partition substrate 2 is higher than the thermal curing temperature of the adhesive film 4, so as to prevent the partition substrate 2 from being greatly deformed and warped.
  • the structure of the LED display device 100' of the second embodiment is basically the same as that of the LED display device of the first embodiment.
  • the same parts of the two will not be repeated one by one.
  • the difference between the two lies in the implementation.
  • the LED display device 100' of the second mode is provided with a white reflective layer, specifically:
  • the inner surface of the partition substrate 2'of the LED display device 100' and the inner surface of the adhesive film 4' are respectively provided with a white reflective layer 5'for reflecting light.
  • the white reflective layer 5' is formed by mixing and curing one of phenyl silica gel and epoxy resin with a scattering particle material; the scattering particle material includes titanium dioxide, aluminum oxide, silicon oxide, and barium sulfate. , At least one of zinc sulfide, zinc oxide and yttrium oxide.
  • the arrangement of the white reflective layer 5'further improves the reflectance and reflectance consistency of the inner side of the separating substrate 2'and the inner side of the adhesive film 4', effectively improving the performance of the LED display device 100' Light efficiency.
  • the LED display device of the present invention by providing a receiving hole in the partition substrate, the LED chip and the fluorescent layer corresponding to the LED chip are respectively arranged in the receiving hole, thereby avoiding the light emitted by the LED chip.
  • the fluorescent layer of other colors adjacent to it to solve the problem of color crosstalk between adjacent LED chips, so that the contrast of the LED display device is high; at the same time, because the circuit substrate and the partition substrate are both white, that is, the partition substrate
  • the inner surface of the receiving hole and the upper surface of the circuit board and the upper surface of the receiving hole are all white, which is beneficial to reflect the light irradiated on the inner surface of the partition substrate and the upper surface of the circuit board to avoid light absorption. Effectively improve the light extraction efficiency.

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Abstract

一种LED显示装置（100），其包括呈白色的电路基板（1）、呈白色的分隔基板（2）、LED芯片、荧光层以及透明密封层（3）；分隔基板（2）盖设固定于电路基板（1），分隔基板（2）设有贯穿其上的收容孔；LED芯片收容于收容孔内，且LED芯片固定于电路基板（1）上并与电路基板（1）电连接；荧光层填充于收容孔内，其由荧光材料和树脂材料混合固化形成，且荧光层与LED芯片一一对应设置；透明密封层（3）贴设于分隔基板（2）远离电路基板（1）一端并完全覆盖收容孔，且透明密封层（3）与LED芯片间隔设置。该LED显示装置对比度高且出光效率高。

Description

LED显示装置 【技术领域】
本实用新型涉及显示装置领域，尤其涉及一种LED显示装置。
【背景技术】
随着显示装置领域的不断发展，LED显示装置的应用越来越广泛。其中，LED显示装置主要是通过分别调节三基色LED芯片(即红光LED芯片、绿光LED芯片和蓝光LED芯片)的电流以控制其亮度值，从而实现三基色的组合，达到全彩显示的效果。在实际的LED生产和封装过程中有一个对LED分Bin的过程，在不同的Bin中，峰值波长会发生移动，LED的色度、亮度等会存在一致性偏离问题，在这个过程中由于不同晶圆生长出的LED很大概率处于不同Bin中，所以LED的色度一致性偏离是一个必然现象。
相关技术中，通过现有荧光转换的方式制作的LED显示模块中，相邻蓝光LED芯片之间和不同颜色荧光粉间的颜色串扰是显而易见的，通常采用在像素间设置黑色分隔壁以提高对比度，解决颜色串扰的问题。
然而，相关技术中，黑色分隔壁会吸收光，造成LED显示模块的出光效率下降，即不能在保证对比度高的同时，保证出光效率高。
因此，实有必要提供一种新的LED显示装置解决上述技术问题。
【实用新型内容】
本实用新型的目的在于提供一种LED显示装置，在保证高对比度的同时，解决了颜色串扰问题，提高出光效率。
为达到上述目的，本实用新型提供一种LED显示装置，其包括：
呈白色的电路基板；
呈白色的分隔基板，所述分隔基板盖设固定于所述电路基板，所述分隔基板设有贯穿其上的收容孔；
LED芯片，所述LED芯片收容于所述收容孔内，且所述LED芯片固定于所述电路基板上并与所述电路基板电连接；
荧光层，所述荧光层填充于所述收容孔内，其由荧光材料和树脂材料混合固化形成，且所述荧光层与所述LED芯片一一对应设置；以及，
透明密封层，所述透明密封层贴设于所述分隔基板远离所述电路基板一端并完全覆盖所述收容孔，且所述透明密封层与所述LED芯片间隔设置。
优选的，所述分隔基板还包括用于对所述分隔基板进行改性增强的玻纤布，所述玻纤布的含量占所述分隔基板的总质量的39％至60％；所述玻纤布沿与所述收容孔的贯穿方向垂直的平面排列设置。
优选的，所述分隔基板的厚度大于0.2毫米；所述收容孔横截面的形状呈圆形或方形，所述收容孔的孔径为0.02毫米至1毫米。
优选的，所述收容孔包括多个且相互间隔设置，所述分隔基板设置于相邻两个所述收容孔之间的侧壁的宽度为0.05毫米至0.3毫米。
优选的，所述收容孔包括相互间隔设置的第一收容孔、第二收容孔以及第三收容孔；所述荧光层包括：
红光层，所述红光层由红粉和树脂材料填充于所述第一收容孔内形成；
绿光层，所述绿光层由绿粉和树脂材料填充于所述第二收容孔内形成；
蓝光层，所述蓝光层由蓝粉和量子点材料中其中一种与树脂材料填充于所述第三收容孔内形成。
优选的，所述LED显示装置还包括：
第一蓝光吸收层，所述第一蓝光吸收层涂覆于所述红光层远离所述电路基板的上表面；和/或，
第二蓝光吸收层，所述第二蓝光吸收层涂覆于所述绿光层远离所述电路基板的上表面；和/或，
第三蓝光吸收层，所述第三蓝光吸收层涂覆于所述透明密封层靠近所述电路基板的下表面。
优选的，所述LED显示装置还包括：
黑色吸收层，所述黑色吸收层涂覆于所述分隔基板远离所述电路基板一侧的上表面。
优选的，所述LED显示装置还包括：
粘接胶膜，所述粘接胶膜的相对两侧分别与所述分隔基板及所述电路基板胶合固定，且所述粘接胶膜与所述收容孔对应的位置设有贯穿其上的通孔。
优选的，所述粘接胶膜由环氧树脂制成或由散射粒子材料和环氧树脂混合制成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。
优选的，所述粘接胶膜的厚度为15微米至50微米，且所述粘接胶层的厚度大于或等于所述电路基板的厚度的两倍。
优选的，所述分隔基板由白色聚对苯二甲酸乙二醇酯或聚酰亚胺制成，其玻璃态转化温度高于所述粘接胶膜的热固化温度。
优选的，所述分隔基板的内侧面和所述粘接胶膜的内侧面分别设置一层用于反射光的白色反射层，所述白色反射层由苯基硅胶和环氧树脂中的其中一种与散射粒子材料混合固化形成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。
与相关技术相比，本实用新型的LED显示装置中，通过在分隔基板设置收容孔，将LED芯片和与该LED芯片对应的荧光层分别设置于收容孔内，避免了LED芯片发出的光照射在与其相邻的其他颜色的荧光层上，以解决相邻的LED芯片之间发生颜色串扰的问题，使得LED显示装置的对比度高；同时，由于电路基板和分隔基板均呈白色，即分隔基板位于收容孔内的内侧面和电路基板与收容孔对应设置的上表面均呈白色，有利于将照射在分隔基板的内侧面和电路基板的上表面的光向外反射，避免了将光吸收，有效地提高出光效率。
【附图说明】
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图 仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型LED显示装置实施方式一的截面示意图；
图2为本实用新型LED显示装置实施方式一的部分结构俯视图；
图3为本实用新型LED显示装置实施方式一的玻纤布含量与分隔基板的弯曲模量和反射率的关系示意图；
图4为本实用新型LED显示装置实施方式二的截面示意图。
【具体实施方式】
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
实施方式一
请参阅图1及图2所示，本实用新型提供一种LED显示装置100，其特征在于，其包括电路基板1、分隔基板2、LED芯片(图未标)、荧光层(图未标)、透明密封层3以及粘接胶膜4。
所述分隔基板2盖设固定于所述电路基板1，所述分隔基板2设有贯穿其上的收容孔(图未标)。
在本实施方式中，所述分隔基板2由白色聚对苯二甲酸乙二醇酯或聚酰亚胺制成，使得所述分隔基板2整体呈白色，即使得所述分隔基板2位于所述收容孔内的内侧面呈白色，能够有效地将照射在所述分隔基板2内侧面的光向外反射出去。
进一步的，所述电路基板1由白色塑料材质制成，其具体的材料是不限的，为了更好地将照射所述电路基板1上的光向外反射，优选的，所述电路基板1呈白色的聚对苯二甲酸乙二醇酯和聚酰亚胺中的其中一种材料制成，使得电路基板1整体呈白色，即使得所述电路基板1与所述收容孔对应设置的上表面呈白色，有利于将照射在所述电路基板1的光向外反射， 提高了出光效率；更优的，所述电路基板1与所述分隔基板2采用相同的材料制成，有效地使得两者之间的热膨胀系数一致，使得可靠性更高。
更优的，所述分隔基板2还包括用于对所述分隔基板2进行改性增强的玻纤布；所述玻纤布沿与所述收容孔的贯穿方向垂直的平面排列设置。在此，需要指出的是，玻纤布的含量直接影响所述分隔基板2的弯曲模量和反射率，具体如图3所示，在所述分隔基板2中，当玻纤布的含量低于39％时，抗折强度低于20GPa，由于抗折强度过低，无法进行对所述分隔基板2进行机加打孔，但当玻纤布含量高于60％时，所述分隔基板2内侧面的反射率低于88％，不利于将光向外反射。
因此，在所述分隔基板2中，所述玻纤布的含量占所述分隔基板2的总质量的39％至60％，为在分隔基板2上打收容孔提供了条件，同时保证了打孔后的分隔基板2的内侧面具有较高的反射率，有利于将光向外反射。
值得一提的是，所述分隔基板2的厚度d1与分隔基板2的内侧面的反射率呈正相关，更优的，为了进一步提高所述分隔基板2的内侧面的反射率，所述分隔基板2的厚度d1大于0.2毫米。
而所述收容孔的横截面的形状是不限的，其可以根据实际使用的情况进行具体的设置，而收容孔与该横截面的形状对应的孔径也是不限的，比如，在本实施方式中，所述收容孔横截面的形状呈方形，所述收容孔的孔径为该收容孔横截面的边长，该边长优选为0.02毫米至1毫米；当然，所述收容孔横截面呈圆形也是可以的，所述收容孔的孔径为该收容孔横截面的直径，该直径优选为0.02毫米至1毫米。
更优的，所述收容孔包括多个且相互间隔设置，所述分隔基板2设置于相邻两个所述收容孔之间的侧壁21的宽度d2对所述LED显示装置100的出光效率和色差，当该宽度d2小于0.05毫米时，所述分隔基板2的内侧面的反射率低，导致所述LED显示装置100的出光效率低，而当该宽度d2大于0.3毫米时，所述LED显示装置100在不同水平视角的色差较大，显示效果较差；因此，优选的，所述分隔基板2设置于相邻两个所述收容孔之间的侧壁21的宽度d2为0.05毫米至0.3毫米，保证所述LED显示装 置100的出光效率高，同时保证显示的色差小。
更优的，为了提高所述LED显示装置100显示的对比度，所述LED显示装置100还包括黑色吸收层(图未标)；在本实施方式中，该黑色吸收层涂覆于所述分隔基板2远离所述电路基板1一侧的上表面，该黑色吸收层可以吸收环境光或者相邻像素间的泄漏光，有效地提高所述LED显示装置100显示的对比度；需要说明的是，所述黑色吸收层的厚度是不限的，其厚度优选为0.01微米至10微米之间。
所述LED芯片收容于所述收容孔内，且所述LED芯片固定于所述电路基板1上与所述电路基板1电连接。
需要说明的是，所述LED芯片具体的类型是不限，其可以包括蓝光LED芯片、紫光LED芯片和紫外光LED芯片中的至少一种；其中，所述蓝光LED芯片用于发射波长为420纳米至480纳米的蓝光，所述紫光LED芯片用于发射波长小于420纳米的紫光，所述紫外光芯片用于发射紫外光。
而为了实现所述LED显示装置100的彩色显示功能，需在所述收容孔内设置与所述LED芯片对应设置的荧光层，该荧光层由填充于所述收容孔内的荧光材料和树脂材料混合固化形成。
需要说明的是，所述荧光材料包括荧光粉和量子点材料中的其中一种；所述荧光粉包括红粉、绿粉和蓝粉中其的其中一种，所述荧光粉的颗粒粒径为0.1微米至30微米；所述树脂材料是不限的，为了提高所述荧光层的成型效率，所述树脂材料优选为苯基硅胶和环氧树脂中的其中一种，且使得形成的荧光层气密性好、折射率高。
当所述LED芯片为发射波长为420纳米至480纳米蓝光的蓝光LED芯片时，所述蓝光层PB是由具有散射粒子的量子点材料和树脂材料混合固化形成；当然，所述LED芯片也可以为发射波长小于420纳米的紫光LED芯片或为紫外光LED芯片时，所述蓝光层PB是由蓝粉和树脂固化形成。
在本实施方式中，所述收容孔包括相互间隔设置的第一收容孔、第二收容孔和第三收容孔。
由于所述蓝光LED芯片具有电光转化效率高、颜色一致性最高，且老化缓慢，其可靠性高的优点，所述LED芯片优选为蓝光LED芯片。
所述LED芯片包括第一LED芯片B1、第二LED芯片B2和第三LED芯片B3。所述荧光层包括红光层PR、绿光层PG和蓝光层PB。
所述第一LED芯片B1收容于所述第一收容孔内，并通过第一电极层E1与所述电路基板1电连接，所述红光层PR由红粉和树脂材料填充于所述第一收容孔内形成。
所述第二LED芯片B2收容于所述第二收容孔内，并通过第二电极层E2与所述电路基板1电连接，所述绿光层PG由绿粉和树脂材料填充于所述第二收容孔内形成，所述第二LED芯片B2发射出的蓝光经所述绿光层PG的激发后，向外发射出绿光。
所述第三LED芯片B3收容于所述第三收容孔内，并通过第三电极层E3与所述电路基板1电连接，所述蓝光层PB由量子点材料与树脂材料填充于所述第三收容孔内形成。
上述结构中，所述第一LED芯片B1发射出的蓝光经所述红光层PR的激发后，向外发射出红光，所述第二LED芯片B2发射出的蓝光经所述绿光层PG的激发后，向外发射出绿光，所述第三LED芯片B3发射出的蓝光经所述蓝光层PG后，向外发射出蓝光，而产生的荧光经分隔基板2的内侧面向外反射出去，使得所述LED显示装置100能够产生的红光，绿光和蓝光(即RGB三基色)的三种色光以实现彩色显示功能；
同时，所述LED显示装置100通过分别控制通过红光层PR和绿光层PG的厚度和面积，以分别调整红光和绿光的一致性，其调整红光和绿光的一致性的操作方便，且成本低；另外，与红光LED芯片和绿光LED芯片相比，蓝光LED芯片的电光转换效率更高，因此，采用蓝光LED芯片对荧光粉的激发效率也更高，尤其是通过蓝光LED芯片对绿光的激发效率更高，有效地提高了所述LED显示装置100对红光和绿光的出光效率，使得彩色显示的效果更佳；另外，值得一提的是，由于本实施方式中只采用一种颜色的LED芯片，即只使用蓝光LED芯片，使得所述LED显示装置的 封装更为方便，为制作小芯片小间距制程的微型的LED设备提供有利条件。
需要说明的是，所述第一LED芯片B1、第二LED芯片B2和第三LED芯片B3发射出的蓝光的波长的值是不限的，其根据实际具体应用的情况进行具体的设置，比如，更优的，所述第一LED芯片B1和所述第二LED芯片B2均发射波长为440纳米至455纳米的短波蓝光，而所述第三LED芯片B3发射波长为460纳米至480纳米的长波蓝光，短波蓝光激发红粉和绿粉的效率高于长波蓝光，有效提高了红光和绿光的出光效率，使得所述LED显示装置的彩色显示效果更佳。
更优的，为了进一步提升色纯度和颜色均匀性和稳定性，可以在第一收容孔的出光口的位置和/或第二收容孔的出光口的位置设置用于吸收蓝光的蓝光吸收层(图未标)，即在所述红光层PR远离所述电路基板1的上表面，和/或所述绿光层PG远离所述电路基板1的上表面，和/或所述透明密封层3靠近所述电路基板1的下表面设置一层蓝光吸收层，所述蓝光吸收层可以根据实际设计的需要进行具体的设置，比如，在本实施方式中，所述蓝光吸收层包括：
第一蓝光吸收层(图未标)、第二蓝光吸收层(图未标)及第三蓝光吸收层(图未标)；所述第一蓝光吸收层涂覆于所述红光层PR远离所述电路基板1的上表面，所述第二蓝光吸收层涂覆于所述绿光层PG远离所述电路基板1的上表面，所述第三蓝光吸收层涂覆于所述透明密封层3靠近所述电路基板1的下表面，通过所述第一蓝光吸收层和所述第三吸收层的设置，有效地将由所述第一收容孔向外发射的蓝光吸收，从而避免向外发射的红光混合有蓝光，通过所述第一蓝光吸收层和所述第三吸收层的设置，有效地将由所述第二收容孔向外发射的蓝光吸收，从而避免向外发射的绿光混合有蓝光，更有效地避免了颜色串扰的问题，进一步提升红光和绿光的颜色纯度、颜色均匀性和稳定性，使得LED显示装置100的显示对比度更高，使得彩色显示的效果更佳。
所述透明密封层3贴设于所述分隔基板2远离所述电路基板1一端并 完全覆盖所述收容孔，且所述透明密封层3与所述LED芯片间隔设置。
进一步的，所述透明密封层3为聚氨酯、环氧树脂、派瑞林、氧化硅和氮化硅中的其中一种材料制成的单层膜结构，或为聚氨酯、环氧树脂和派瑞林中的至少两种材料制成的多层膜结构。
所述粘接胶膜4的相对两侧分别与所述分隔基板2及所述电路基板1胶合固定，且所述粘接胶膜4与所述收容孔对应的位置设有贯穿其上的通孔(图未标)。
值得一提的是，所述粘接胶膜4由环氧树脂制成或由散射粒子材料和环氧树脂混合制成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。当然，为了进一步防止RGB三基色的颜色串扰问题，在本实施方式中，所述粘接胶膜4优选为由散射粒子材料和环氧树脂混合制成。
进一步的，所述粘接胶膜4的厚度为15微米至50微米，且所述粘接胶层4的厚度大于或等于所述电路基板1的厚度的两倍，有效地保证了所述粘接胶层4与所述电路基板1之间的粘接强度，使得两者之之间的固定更可靠。
更进一步的，所述分隔基板2的玻璃态转化温度(Glass Transition Temperature，即Tg温度)高于所述粘接胶膜4的热固化温度，避免分隔基板2发生较大的变形而翘曲。
实施方式二
请参图4所示，实施方式二的LED显示装置100’与实施方式一的LED显示装置的结构基本相同，在此，两者相同的部分不再一一展开赘述，两者的区别在于实施方式二的LED显示装置100’设有白色反射层，具体的：
LED显示装置100’的分隔基板2’的内侧面和所述粘接胶膜4’的内侧面分别设置一层用于反射光的白色反射层5’。
在本实施方式中，所述白色反射层5’由苯基硅胶和环氧树脂中的其中一种与散射粒子材料混合固化形成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。
通过白色反射层5’的设置，进一步提升所述分隔基板2’的内侧面和所述粘接胶膜4’的内侧面的反射率和反射率一致性，有效地提高LED显示装置100’的出光效率。
与相关技术相比，本实用新型的LED显示装置中，通过在分隔基板设置收容孔，将LED芯片和与该LED芯片对应的荧光层分别设置于收容孔内，避免了LED芯片发出的光照射在与其相邻的其他颜色的荧光层上，以解决相邻的LED芯片之间发生颜色串扰的问题，使得LED显示装置的对比度高；同时，由于电路基板和分隔基板均呈白色，即分隔基板位于收容孔内的内侧面和电路基板与收容孔对应设置的上表面均呈白色，有利于将照射在分隔基板的内侧面和电路基板的上表面的光向外反射，避免了将光吸收，有效地提高出光效率。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (12)

  1. 一种LED显示装置，其特征在于，其包括：
    呈白色的电路基板；
    呈白色的分隔基板，所述分隔基板盖设固定于所述电路基板，所述分隔基板设有贯穿其上的收容孔；
    LED芯片，所述LED芯片收容于所述收容孔内，且所述LED芯片固定于所述电路基板上并与所述电路基板电连接；
    荧光层，所述荧光层填充于所述收容孔内，其由荧光材料和树脂材料混合固化形成，且所述荧光层与所述LED芯片一一对应设置；以及，
    透明密封层，所述透明密封层贴设于所述分隔基板远离所述电路基板一端并完全覆盖所述收容孔，且所述透明密封层与所述LED芯片间隔设置。
  2. 根据权利要求1所述的LED显示装置，其特征在于，所述分隔基板还包括用于对所述分隔基板进行改性增强的玻纤布，所述玻纤布的含量占所述分隔基板的总质量的39％至60％；所述玻纤布沿与所述收容孔的贯穿方向垂直的平面排列设置。
  3. 根据权利要求2所述的LED显示装置，其特征在于，所述分隔基板的厚度大于0.2毫米；所述收容孔横截面的形状呈圆形或方形，所述收容孔的孔径为0.02毫米至1毫米。
  4. 根据权利要求3所述的LED显示装置，其特征在于，所述收容孔包括多个且相互间隔设置，所述分隔基板设置于相邻两个所述收容孔之间的侧壁的宽度为0.05毫米至0.3毫米。
  5. 根据权利要求1-4所述的LED显示装置，其特征在于，所述收容孔包括相互间隔设置的第一收容孔、第二收容孔以及第三收容孔；所述荧光层包括：
    红光层，所述红光层由红粉和树脂材料填充于所述第一收容孔内形成；
    绿光层，所述绿光层由绿粉和树脂材料填充于所述第二收容孔内形成；
    蓝光层，所述蓝光层由蓝粉和量子点材料中其中一种与树脂材料填充于所述第三收容孔内形成。
  6. 根据权利要求5所述的LED显示装置，其特征在于，所述LED显示装置还包括：
    第一蓝光吸收层，所述第一蓝光吸收层涂覆于所述红光层远离所述电路基板的上表面；和/或，
    第二蓝光吸收层，所述第二蓝光吸收层涂覆于所述绿光层远离所述电路基板的上表面；和/或，
    第三蓝光吸收层，所述第三蓝光吸收层涂覆于所述透明密封层靠近所述电路基板的下表面。
  7. 根据权利要求6所述的LED显示装置，其特征在于，所述LED显示装置还包括：
    黑色吸收层，所述黑色吸收层涂覆于所述分隔基板远离所述电路基板一侧的上表面。
  8. 根据权利要求1所述的LED显示装置，其特征在于，所述LED显示装置还包括：
    粘接胶膜，所述粘接胶膜的相对两侧分别与所述分隔基板及所述电路基板胶合固定，且所述粘接胶膜与所述收容孔对应的位置设有贯穿其上的通孔。
  9. 根据权利要求8所述的LED显示装置，其特征在于，所述粘接胶膜由环氧树脂制成或由散射粒子材料和环氧树脂混合制成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。
  10. 根据权利要求9所述的LED显示装置，其特征在于，所述粘接胶膜的厚度为15微米至50微米，且所述粘接胶层的厚度大于或等于所述电路基板的厚度的两倍。
  11. 根据权利要求8所述的LED显示装置，其特征在于，所述分隔基板由白色聚对苯二甲酸乙二醇酯或聚酰亚胺制成，其玻璃态转化温度高于 所述粘接胶膜的热固化温度。
  12. 根据权利要求8所述的LED显示装置，其特征在于，所述分隔基板的内侧面和所述粘接胶膜的内侧面分别设置一层用于反射光的白色反射层，所述白色反射层由苯基硅胶和环氧树脂中的其中一种与散射粒子材料混合固化形成；所述散射粒子材料包括二氧化钛、氧化铝、氧化硅、硫酸钡、硫化锌、氧化锌和氧化钇中的至少一种。
PCT/CN2020/133345 2019-12-02 2020-12-02 Led显示装置 WO2021110042A1 (zh)

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CN211555890U (zh) * 2019-12-02 2020-09-22 深圳市绎立锐光科技开发有限公司 Led显示装置
CN114824036A (zh) * 2021-01-19 2022-07-29 东莞市中麒光电技术有限公司 一种显示模块及其制作方法
CN113641041A (zh) * 2021-08-09 2021-11-12 惠柏新材料科技（上海）股份有限公司 量子点应用于显示领域的光源结构以及制造方法及显示装置
CN113809114A (zh) * 2021-09-13 2021-12-17 深圳市洲明科技股份有限公司 一种led显示模组的制造方法及led显示模组
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CN115483327B (zh) * 2022-11-09 2023-03-24 镭昱光电科技(苏州)有限公司 Micro LED微显示芯片及其制造方法

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