WO2021107402A1 - Film de polyimide et son procédé de fabrication - Google Patents

Film de polyimide et son procédé de fabrication Download PDF

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Publication number
WO2021107402A1
WO2021107402A1 PCT/KR2020/014232 KR2020014232W WO2021107402A1 WO 2021107402 A1 WO2021107402 A1 WO 2021107402A1 KR 2020014232 W KR2020014232 W KR 2020014232W WO 2021107402 A1 WO2021107402 A1 WO 2021107402A1
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Prior art keywords
polyimide film
gpa
polyamic acid
dianhydride
mol
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PCT/KR2020/014232
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English (en)
Korean (ko)
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김동영
박세주
원동영
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피아이첨단소재 주식회사
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Priority to JP2022530798A priority Critical patent/JP7382505B2/ja
Priority to CN202080082127.6A priority patent/CN114829465B/zh
Publication of WO2021107402A1 publication Critical patent/WO2021107402A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

  • It relates to a polyimide film and a method for manufacturing the same. More particularly, it relates to a polyimide film having a high yield point at a low modulus of elasticity and thus less damaged even by repeated deformation, and a method for manufacturing the same.
  • Flexible displays such as curved, bendable, foldable, and rollable displays are next-generation displays that have recently been attracting attention from both academia and industry.
  • functional film/coating materials are important polymer substrate materials constituting flexible displays and are essential for the successful implementation and development of flexible displays. is attracting attention.
  • Polyimide is a polymer characterized by having a heteroimide ring in its main chain. In addition to excellent heat resistance, it has excellent mechanical properties, flame retardancy, chemical resistance, low dielectric constant, etc., and is applied to a wide range of applications such as coating materials, molding materials, and composite materials.
  • a polymer substrate for a flexible display The most important physical property required for a polymer substrate for a flexible display is flexibility.
  • a polymer substrate should not only not be damaged during the bending, bending, folding, rolling, and stretching processes in which the flexible display repeatedly deforms, but also should not lose various initial properties.
  • Another object of the present invention is to provide a method for producing the above-described polyimide film.
  • the polyimide film according to one aspect is induced by imidization of polyamic acid having a weight average molecular weight of about 250,000 g/mol to about 440,000 g/mol, and may have a modulus of about 2 GPa to about 5 GPa.
  • the polyimide film according to another aspect is induced by imidizing a polyamic acid solution having a polyamic acid solid content of about 14 wt% to about 20 wt%, and may have a modulus of about 2 GPa to about 5 GPa.
  • the polyimide film may have a yield point of about 2.1% or more.
  • the polyimide film may have a yield strength of about 47 MPa or more.
  • the polyamic acid is formed from a reaction of a dianhydride monomer and a diamine monomer
  • the dianhydride monomer is pyromellitic dianhydride (PMDA), 3,3', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) or a combination thereof
  • the diamine monomer is 4,4'-oxydianiline (ODA), m-tolidine (m-TD), 1, 3-bis(4-aminophenoxy)benzene (TPE-R), 2,2-bis(4-[4-aminophenoxy]-phenyl)propane (BAPP), or combinations thereof.
  • the dianhydride monomer comprises pyromellitic dianhydride (PMDA)
  • the diamine monomer comprises 4,4'-oxydianiline (ODA)
  • the polyimide film comprises:
  • the yield point may be greater than or equal to about 2.1%.
  • the dianhydride monomer comprises pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), and the diamine monomer is Including 4,4'-oxydianiline (ODA), the polyimide film may have a yield point of about 2.35% or more.
  • the molar ratio of pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) is from about 1:9 to about 9:1 can
  • a method for manufacturing the polyimide film comprises mixing and reacting a dianhydride monomer, a diamine monomer and an organic solvent to form a polyamic acid solution; forming a polyimide precursor composition by mixing a dehydrating agent and an imidizing agent with the polyamic acid solution; casting the polyimide precursor composition on a support and drying to prepare a gel film; And, heat-treating the gel film to form a polyimide film; may include steps.
  • the heat treatment may be performed at about 100 °C to about 700 °C.
  • the polyimide film and the manufacturing method thereof of the present invention may have an effect of providing a polyimide film having a high yield point at a low elastic modulus and thus less damaged even after repeated deformation.
  • the modulus, yield point, and yield strength may be measured using a tensile tester based on ASTM D 882 standards, but with a tensile rate of 200 mm/min, but is not limited thereto.
  • the inventors of the present invention control the weight average molecular weight of the polyamic acid or control the content of the polyamic acid solid content in the polyamic acid solution from about 2 GPa to about 5 GPa (eg, 2 GPa, 2.1 GPa, 2.2 GPa, 2.3 GPa) , 2.4 GPa, 2.5 GPa, 2.6 GPa, 2.7 GPa, 2.8 GPa, 2.9 GPa, 3 GPa, 3.1 GPa, 3.2 GPa, 3.3 GPa, 3.4 GPa, 3.5 GPa, 3.6 GPa, 3.7 GPa, 3.8 GPa, 3.9 GPa, 4
  • a polyimide film having a modulus of GPa, 4.1 GPa, 4.2 GPa, 4.3 GPa, 4.4 GPa, 4.5 GPa, 4.6 GPa, 4.7 GPa, 4.8 GPa, 4.9 GPa or 5 GPa was prepared
  • the polyimide film has a weight average molecular weight of about 250,000 g/mol to about 440,000 g/mol (eg, 250,000 g/mol, 260,000 g/mol, 270,000 g/mol, 280,000 g/mol, 290,000 g/mol, 300,000 g/mol, 310,000 g/mol, 320,000 g/mol, 330,000 g/mol, 340,000 g/mol, 350,000 g/mol, 360,000 g/mol, 370,000 g/mol, 380,000 g/mol, 390,000 g/mol, 400,000 g/mol, 410,000 g/mol, 420,000 g/mol, 430,000 g/mol or 440,000 g/mol), derived by imidization of a polyamic acid, and having a modulus of about 2 GPa to about 5 GPa.
  • the polyimide film may have a high yield point at a low modulus of elasticity.
  • the 'weight average molecular weight' may mean a weight average molecular weight in terms of polystyrene measured using gel permeation chromatography (GPC).
  • the polyimide film has a polyamic acid solids content of from about 14 wt% to about 20 wt% (eg, 14 wt%, 14.5 wt%, 15 wt%, 15.5 wt%, 16 wt%, 16.5 wt% %, 17 wt%, 17.5 wt%, 18 wt%, 18.5 wt%, 19 wt%, 19.5 wt% or 20 wt%), derived by imidizing a polyamic acid solution of from about 2 GPa to about 5 GPa It can have a modulus.
  • the polyimide film may have a high yield point at a low modulus of elasticity.
  • the polyamic acid solution may comprise from about 14% to about 20% by weight polyamic acid solids and from about 80% to about 86% by weight organic solvent.
  • the polyimide film may have a yield point of about 2.1% or more.
  • the polyimide film may have a yield point of about 2.1% to about 2.9% (eg, 2.1%, 2.15%, 2.2%, 2.25%, 2.3%, 2.35%, 2.4%, 2.45%, 2.5%, 2.55%).
  • %, 2.6%, 2.65%, 2.7%, 2.75%, 2.8%, 2.85% or 2.9% for example from about 2.1% to about 2.8%, for another example from about 2.15% to about 2.7%
  • the present invention is not limited thereto.
  • the polyimide film may have a yield strength of about 47 MPa or more.
  • the yield strength of the polyimide film is from about 47 MPa to about 80 MPa (eg, 47 MPa, 48 MPa, 49 MPa, 50 MPa, 51 MPa, 52 MPa, 53 MPa, 54 MPa, 55 MPa, 56 MPa, 57 MPa, 58 MPa, 59 MPa, 60 MPa, 61 MPa, 62 MPa, 63 MPa, 64 MPa, 65 MPa, 66 MPa, 67 MPa, 68 MPa, 69 MPa, 70 MPa, 71 MPa, 72 MPa , 73 MPa, 74 MPa, 75 MPa, 76 MPa, 77 MPa, 78 MPa, 79 MPa or 80 MPa), for example from about 47 MPa to about 75 MPa, for another example from about 47 MPa to about 70 MPa may be, but is not limited thereto.
  • the polyamic acid may be formed from the reaction of a dianhydride monomer and a diamine monomer.
  • the types of the dianhydride monomer and the diamine monomer are not particularly limited, but, for example, the dianhydride monomer is pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) or a combination thereof, wherein the diamine monomer is 4,4'-oxydianiline (ODA), m-tolidine (m-TD), 1,3-bis(4-aminophenoxy)benzene ( TPE-R), 2,2-bis(4-[4-aminophenoxy]-phenyl)propane (BAPP), or a combination thereof.
  • PMDA pyromellitic dianhydride
  • BPDA 3,3',4,4'-biphenyltetracarboxylic dianhydride
  • BPDA 3,3',4,4'-
  • the dianhydride monomer comprises pyromellitic dianhydride (PMDA), the diamine monomer comprises 4,4'-oxydianiline (ODA), and the polyimide film has a yield point of about 2.1% or more.
  • the dianhydride monomer comprises pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), and the diamine monomer is 4,4 It contains '-oxydianiline (ODA), and the polyimide film may have a yield point of about 2.35% or more.
  • the molar ratio of pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) is about 1:9 to about 9:1 (eg, 1:9) , 2:8, 3:7, 4:6, 5:5, 6:4, 7:3, 8:2 or 9:1, for example from about 2:8 to about 8:2, yet another example
  • it may be about 3:7 to about 7:3), and in the above range, the polyimide film may have a high yield point at a low elastic modulus, but is not limited thereto.
  • the thickness of the polyimide film may be appropriately selected in consideration of the purpose of the polyimide film, the use environment, physical properties, and the like.
  • the thickness of the polyimide film may be from about 10 ⁇ m to about 500 ⁇ m, for example from about 20 ⁇ m to about 50 ⁇ m, and for another example from about 40 ⁇ m to about 50 ⁇ m, but is limited thereto no.
  • the above-described polyimide film may be prepared by various methods commonly used in the field of polyimide film production.
  • the polyimide film is prepared by mixing and reacting a dianhydride monomer, a diamine monomer and an organic solvent to form a polyamic acid solution; forming a polyimide precursor composition by mixing a dehydrating agent and an imidizing agent with the polyamic acid solution; casting the polyimide precursor composition on a support and drying to prepare a gel film; And, heat-treating the gel film to form a polyimide film; It can be prepared including steps. Since the description of the dianhydride monomer and the diamine monomer has been described above, a description thereof will be omitted.
  • a dianhydride monomer, a diamine monomer, and an organic solvent may be mixed and reacted to form a polyamic acid solution.
  • all the monomers may be added at once, or each of the monomers may be added sequentially, and in this case, partial polymerization between the monomers may occur.
  • the organic solvent is not particularly limited as long as it is a solvent in which the polyamic acid can be dissolved, and may be, for example, an aprotic polar organic solvent.
  • aprotic polar organic solvent include amide solvents such as N,N'-dimethylformamide (DMF), N,N'-dimethylacetamide (DMAc), p-chlorophenol, and o-chloro and phenolic solvents such as phenol, N-methylpyrrolidone (NMP), gamma-butyrolactone (GBL), and Diglyme, and these may be used alone or in combination of two or more.
  • the solubility of the polyamic acid may be adjusted by using an auxiliary solvent such as toluene, tetrahydrofuran, acetone, methyl ethyl ketone, methanol, ethanol, or water.
  • the organic solvent may be an amide-based solvent, for example, N,N-dimethylformamide and N,N-dimethylacetamide, but is not limited thereto.
  • the polyamic acid solution is about 100,000 cP to about 500,000 cP (eg, 100,000 cP, 150,000 cP, 200,000 cP, 250,000 cP, 300,000 cP, 350,000 cP, 400,000 cP, 450,000 cP or 500,000 cP at 25°C). cP).
  • processability may be excellent when forming a polyimide film.
  • 'viscosity' may be measured using a Brookfield viscometer.
  • the polyamic acid solution may have a viscosity of, for example, about 150,000 cP to about 450,000 cP, for example, about 150,000 cP to about 350,000 cP at 25° C., but is not limited thereto.
  • a polyimide precursor composition may be formed by mixing a dehydrating agent and an imidizing agent in the polyamic acid solution.
  • the dehydrating agent promotes the ring closure reaction through the dehydration action on the polyamic acid, for example, aliphatic acid anhydride, aromatic acid anhydride, N,N'-dialkylcarbodiimide, lower aliphatic halide, halogenated lower fatty acid anhydride, and arylphosphonic acid dihalides and thionyl halides, and these may be used alone or in combination of two or more.
  • aliphatic acid anhydrides such as acetic anhydride, propionic anhydride, and lactic anhydride, can be used individually or in mixture of 2 or more types from a viewpoint of availability and cost.
  • the imidizing agent means a component having an effect of promoting a ring closure reaction with respect to the polyamic acid, and for example, an aliphatic tertiary amine, an aromatic tertiary amine, and a heterocyclic tertiary amine may be used.
  • a heterocyclic tertiary amine can be used from the viewpoint of reactivity as a catalyst. Examples thereof include quinoline, isoquinoline, ⁇ -picoline, pyridine, and the like, and these may be used alone or in combination of two or more.
  • the addition amount of the dehydrating agent and the imidizing agent is not particularly limited, but the dehydrating agent is from about 0.5 mol to about 5 mol (for example, 0.5 mol, 1 mol, 1.5 mol, 2 mol, 2.5 mol) based on 1 mol of the amic acid group in the polyamic acid. , 3 moles, 3.5 moles, 4 moles, 4.5 moles or 5 moles), for example, in a ratio of about 1.0 mole to about 4 moles, and the imidizing agent is about 0.05 per mole of the amic acid group in the polyamic acid.
  • moles to about 3 moles e.g., 0.05 moles, 0.1 moles, 0.5 moles, 1 moles, 1.5 moles, 2 moles, 2.5 moles or 3 moles
  • imidization is sufficient, and casting into a film type may be easy.
  • the polyimide precursor composition may be cast on a support and dried to prepare a gel film.
  • a support conventionally used in the art may be used without limitation, and examples of the support include a glass plate, an aluminum foil, an endless stainless belt, a stainless drum, and the like.
  • Drying is, for example, from about 40° C. to about 300° C., for example from about 80° C. to about 200° C., for example from about 100° C. to about 180° C., for another example from about 100° C. to about 130° C. It can be carried out at a temperature of °C, whereby a dehydrating agent and an imidizing agent are activated, and partial curing and/or drying can take place to form a gel film.
  • the gel film is in the intermediate stage of curing from polyamic acid to polyimide and can be self-supporting.
  • it may include stretching the gel film to control the thickness and size of the finally obtained polyimide film and to improve orientation, and stretching is performed in the machine transport direction (MD) and the transverse direction to the machine transport direction.
  • MD machine transport direction
  • TD transverse direction to the machine transport direction.
  • the volatile matter content of the gel film is, but not limited to, about 5 wt% to about 500 wt%, for example, about 5 wt% to about 200 wt%, for example, about 5 wt% to about 150 wt%
  • the volatile matter content of the gel film can be calculated by using Equation 1 below, in Equation 1, A is the weight of the gel film, and B is the weight after heating the gel film at 450 ° C. for 20 minutes.
  • the gel film in the step of heat-treating the gel film, is subjected to a variable temperature range from about 50 °C to about 700 °C, for example from about 150 °C to about 600 °C, for example from about 200 °C to about 600 °C.
  • a polyimide film can be obtained by heat-treating at a phosphorus temperature to remove a solvent and the like remaining in the gel film, and imidizing most of the remaining amic acid groups.
  • the polyimide film obtained as described above may be heat-finished at a temperature of about 400° C. to about 650° C. for about 5 seconds to about 400 seconds to further harden the polyimide film, and the residual in the obtained polyimide film This may be done under a certain tension in order to relieve any internal stresses that may occur.
  • the above-described polyimide film has a high yield point (eg, 2.1% or more) at a low modulus of elasticity (eg, about 2 GPa to about 5 GPa), and thus may have an effect of less damage even with repeated deformation.
  • BPDA 3,3',4,4'-biphenyltetracarboxylic dianhydride
  • PMDA pyromellitic dianhydride
  • DMF dimethylformamide
  • ODA 4,4'-oxydihydride as diamine monomers
  • Aniline (ODA) was mixed in the molar ratio shown in Table 1 below and then polymerized to prepare a polyamic acid solution. At this time, the number of moles of the dianhydride monomer and the diamine monomer were substantially equimolar, and the content of the monomer and DMF used was controlled to control the solid content of the polyamic acid as described in Table 1.
  • Acetic anhydride in a molar ratio of 3.5 and isoquinoline in a molar ratio of 1.1 per mole of the amic acid group was added to the polyamic acid solution thus prepared to obtain a composition for preparing a polyimide film, and the composition was applied on a SUS plate (100SA, Sandvik Corporation) using a doctor blade.
  • a gel film was prepared by casting and drying at 90° C. for 4 minutes. After separating the gel film from the SUS plate, heat treatment was performed at 250° C. to 380° C. for 14 minutes to prepare a polyimide film having an average thickness of 50 ⁇ m.
  • a sample for gel permeation chromatography was prepared by mixing a polyamic acid solution at 2 wt% in N-methylpyrrolidone (NMP) solvent, and an HPLC device (1260 Infinity ll, agilent Technologies) was used for the sample.
  • NMP N-methylpyrrolidone
  • HPLC device (1260 Infinity ll, agilent Technologies) was used for the sample.
  • the weight average molecular weight in terms of polystyrene was obtained under the conditions of 50 °C and 0.9 ml/min solvent flow by a conventional method.
  • the prepared polyimide film was cut into 15 mm ⁇ 50 mm to prepare a specimen, and according to ASTM D 882, at a tensile speed of 200 mm/min, using a tensile tester (Instron 5564, Instron) at room temperature (room temp .) to measure the modulus, yield point and yield strength, and the results are shown in Table 1 below.
  • Example 1 100 100 20 250,000 3.15 2.16 48.95
  • Example 2 100 100 17 350,000 3.05 2.22 47.04
  • Example 3 100 100 15 430,000 3.11 2.30 49.08
  • Example 4 35 65 100 18.5 290 thousand 3.26 2.36 55.16
  • Example 5 35 65 100 15 430,000 3.29 2.65 58.24
  • Example 6 35 65 100 14.0 430,000 3.30 2.58 58.25
  • Example 7 70 30 100 18.5 300,000 3.44 2.55 64.21
  • Example 8 70 30 100 15 440,000 3.45 2.62 65.0 Comparative Example 1 - 100 100 23 200,000 3.15 2.05 47.35 Comparative Example 2 - 100 100 13 600,000 3.01 1.98 46.75
  • the polyimide films of Comparative Examples 1 and 2 are not It can be easily predicted that it has a higher yield point compared to the mid film, and as a result, the degree of damage to the cyclic deformation applied to the polyimide film will be small.

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Abstract

Un film de polyimide et son procédé de fabrication sont divulgués, le film de polyimide étant dérivé par imidisation d'acide polyamique ayant un poids moléculaire moyen en poids d'environ 250 000 g/mol à environ 440 000 g/mol, ou étant dérivé par imidisation d'une solution d'acide polyamique ayant une teneur en solides d'acide polyamique d'environ 14 % en poids à environ 20 % en poids, le film de polyimide ayant un module d'environ 2 GPa à environ 5 GPa.
PCT/KR2020/014232 2019-11-29 2020-10-19 Film de polyimide et son procédé de fabrication WO2021107402A1 (fr)

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JP2022530798A JP7382505B2 (ja) 2019-11-29 2020-10-19 ポリイミドフィルムおよびその製造方法
CN202080082127.6A CN114829465B (zh) 2019-11-29 2020-10-19 聚酰亚胺薄膜及其制造方法

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Citations (5)

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US8906463B2 (en) * 2006-05-19 2014-12-09 Ube Industries, Ltd. Method for producing polyimide film and polyamic acid solution composition
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