WO2022114695A1 - Film de polyimide et dispositif optique le comprenant - Google Patents

Film de polyimide et dispositif optique le comprenant Download PDF

Info

Publication number
WO2022114695A1
WO2022114695A1 PCT/KR2021/017146 KR2021017146W WO2022114695A1 WO 2022114695 A1 WO2022114695 A1 WO 2022114695A1 KR 2021017146 W KR2021017146 W KR 2021017146W WO 2022114695 A1 WO2022114695 A1 WO 2022114695A1
Authority
WO
WIPO (PCT)
Prior art keywords
mol
polyimide film
film
gpa
optical device
Prior art date
Application number
PCT/KR2021/017146
Other languages
English (en)
Korean (ko)
Inventor
유대건
김동영
원동영
Original Assignee
피아이첨단소재 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피아이첨단소재 주식회사 filed Critical 피아이첨단소재 주식회사
Priority to JP2023530327A priority Critical patent/JP2023550755A/ja
Priority to CN202180077600.6A priority patent/CN116438224A/zh
Publication of WO2022114695A1 publication Critical patent/WO2022114695A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

  • It relates to a polyimide film and an optical device including the same, and more particularly, to a polyimide film satisfying physical properties required for an optical device film, for example, modulus, elongation, strength, and the like, and an optical device including the same.
  • Flexible displays such as curved, bendable, foldable, and rollable displays are the next-generation displays that have recently been attracting attention from both academia and industry.
  • functional film/coating materials are important polymer substrate materials constituting flexible displays and are essential for the successful implementation and development of flexible displays. is attracting attention.
  • Polyimide is a polymer characterized by having a heteroimide ring in its main chain. In addition to excellent heat resistance, it has excellent mechanical properties, flame retardancy, chemical resistance, low dielectric constant, etc.
  • a polymer substrate for a flexible display The most important physical property required for a polymer substrate for a flexible display is flexibility.
  • a polymer substrate should not only not be damaged during the bending, bending, folding, rolling, and stretching processes in which the flexible display repeatedly deforms, but also should not lose various initial properties.
  • Another object of the present invention is to provide an optical device including the polyimide film.
  • a polyimide film is provided.
  • the polyimide film may satisfy Equation 1 below, and the maximum elongation measured according to ASTM D882 may be 50% or more:
  • A is the modulus (unit: GPa) of the polyimide film measured at a tensile rate of 200 mm/min according to ASTM D882,
  • B is the tensile strength (unit: MPa) at 20% elongation of the polyimide film measured at a tensile rate of 200 mm/min according to ASTM D882.
  • A may be 2.5 GPa to 4.5 GPa.
  • B may be 140 MPa or more.
  • polyimide film according to any one of embodiments 1 to 3, wherein the polyimide film is derived from imidization of a polyamic acid formed from a reaction of a dianhydride monomer and a diamine monomer, and wherein the dianhydride monomer is the total amount of the dianhydride monomer.
  • pyromellitic dianhydride (PMDA) 55 mol% to 85 mol% and 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'- biphenyl tetracarboxylic dianhydride: BPDA) 15 mol% to 45 mol%
  • the diamine monomer is 50 mol of 4,4'-oxydianiline (ODA) based on the total number of moles of the diamine monomer % to 80 mol%
  • 4,4'-methylenedianiline (MDA) may include 20 mol% to 50 mol%.
  • the molar ratio (PMDA:MDA) of PMDA and MDA may be 1.1:1 to 3.25:1.
  • BPDA:MDA molar ratio of BPDA and MDA
  • optical device may include the polyimide film according to any one of the first to sixth embodiments.
  • optical device is a display device and may include the polyimide film as a back plate film.
  • the present invention has the effect of providing a polyimide film satisfying the physical properties required for an optical device film, for example, modulus, elongation, strength, and the like, and an optical device including the same.
  • the polyimide film according to an aspect of the present invention may satisfy Equation 1 below, and the maximum elongation measured according to ASTM D882 may be 50% or more:
  • Equation 1 A is the modulus (unit: GPa) of the polyimide film measured at a tensile rate of 200 mm/min according to ASTM D882, and B is the modulus (unit: GPa) of the polyimide film measured at a tensile rate of 200 mm/min according to ASTM D882. It is the tensile strength (unit: MPa) at 20% of elongation of a polyimide film.
  • the polyimide film may satisfy Equation 1 above. Accordingly, it may be advantageous to provide a polyimide film that satisfies physical properties required for a film for an optical device, for example, modulus, elongation, strength, and the like.
  • the lower limit of the (A ⁇ B)/10 value is any one of 45, 46, 47, 48, 49, and 50, and the upper limit is 60, 59, 58, 57, 56, 55, 54, 53, 52 and 51.
  • the (A ⁇ B)/10 value may be 45 to 55, but is not limited thereto.
  • the polyimide film has a maximum elongation of 50% or more (eg, 55% or more, 60% or more, 65% or more, 70% or more, 75% or more, 80% or more, 85% or more, or 90% or more).
  • a polyimide film that satisfies physical properties required in the film for optical devices, for example, modulus, elongation, strength, and the like.
  • the maximum elongation of the polyimide film may be, for example, from 50% to 150%, for another example from 50% to 100%, for another example from 55% to 95%, but is not limited thereto.
  • A is 2.5 GPa to 4.5 GPa (eg, 2.5 GPa, 2.6 GPa, 2.7 GPa, 2.8 GPa, 2.9 GPa, 3.0 GPa, 3.1 GPa, 3.2 GPa, 3.3 GPa, 3.4 GPa) GPa, 3.5 GPa, 3.6 GPa, 3.7 GPa, 3.8 GPa, 3.9 GPa, 4.0 GPa, 4.1 GPa, 4.2 GPa, 4.3 GPa, 4.4 GPa or 4.5 GPa).
  • A may be, for example, 2.5 GPa to 4 GPa, for example, 3 GPa to 4 GPa, for another example, 3 GPa to 3.5 GPa, but is not limited thereto.
  • B in Equation 1 may be 140 MPa or more (eg, 141 MPa or more, 142 MPa or more, 143 MPa or more, 144 MPa or more, or 145 MPa or more).
  • B may be, for example, 140 MPa to 300 MPa, for another example, 140 MPa to 200 MPa, for another example, 140 MPa to 170 MPa, for another example, 140 MPa to 160 MPa, but is not limited thereto.
  • the thickness of the polyimide film may be, for example, 10 ⁇ m to 500 ⁇ m, for example 10 ⁇ m to 100 ⁇ m, and for another example 30 ⁇ m to 50 ⁇ m, but is limited thereto not.
  • the polyimide film may be derived from imidization of a polyamic acid formed from the reaction of a dianhydride monomer and a diamine monomer.
  • a dianhydride monomer and the diamine monomer well-known dianhydride monomers and diamine monomers may be used without limitation within a range that does not impair the purpose of the present invention.
  • dianhydride monomers include pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-biphenyl tetracarboxylic dianhydride).
  • the diamine monomer may include 4,4'-oxydianiline (4,4'-oxydianiline: ODA) and 4,4'-methylenedianiline (4,4'-methylenedianiline: MDA).
  • ODA 4,4'-oxydianiline
  • MDA 4,4'-methylenedianiline
  • the dianhydride monomer includes 55 mol% to 85 mol% of PMDA and 15 mol% to 45 mol% of BPDA based on the total number of moles of the dianhydride monomer, and the diamine monomer is based on the total number of moles of the diamine monomer.
  • the dianhydride monomer contains 55 mol%, 56 mol%, 57 mol%, 58 mol%, 59 mol%, 60 mol%, 61 mol%, 62 mol% of PMDA based on the total number of moles of the dianhydride monomer.
  • the diamine monomer contains 50 mol%, 51 mol%, 52 mol%, 53 mol%, 54 mol%, 55 mol%, 56 mol%, 57 mol%, 58 mol% of ODA based on the total number of moles of the diamine monomer.
  • the molar ratio of BPDA and MDA is 0.3:1 to 2.3:1 (eg, 0.3:1, 0.4:1, 0.5:1, 0.6:1, 0.7:1, 0.8). :1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1, 1.7:1, 1.8:1, 1.9:1, 2:1 , 2.1:1, 2.2:1, or 2.3:1, for example, 0.3:1 to 1.75:1), and in this case, physical properties required for an optical device film, for example, modulus, elongation, strength, etc. It may be more advantageous to provide a satisfactory polyimide film.
  • the molar ratio of PMDA and MDA is from 1.1:1 to 4.3:1 (eg, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6). :1, 1.7:1, 1.8:1, 1.9:1, 2:1, 2.1:1, 2.2:1, 2.3:1, 2.4:1, 2.5:1, 2.6:1, 2.7:1, 2.8:1 , 2.9:1, 3:1, 3.1:1, 3.2:1, 3.3:1, 3.4:1, 3.5:1, 3.6:1, 3.7:1, 3.8:1, 3.9:1, 4:1, 4.1 :1, 4.2:1 or 4.3:1, for example, 1.1:1 to 3.25:1), and in this case, it may be a film that satisfies the physical properties required for an optical device film, for example, modulus, elongation, strength, etc. It may be more advantageous to provide a polyimide film.
  • the molar ratio of BPDA and ODA is 0.1:1 to 0.9:1 (eg, 0.1:1, 0.2:1, 0.3:1, 0.4:1, 0.5:1, 0.6). :1, 0.7:1, 0.8:1, or 0.9:1, for example, 0.3:1 to 0.9:1), and in this case, physical properties required for an optical device film, such as modulus, elongation, and strength It may be more advantageous to provide a polyimide film that satisfies the following requirements.
  • the molar ratio of PMDA and ODA is 0.6:1 to 1.7:1 (eg, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1). :1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1 or 1.7:1, for example 0.8:1 to 1.7:1), in which case the film for optical devices It may be more advantageous to provide a polyimide film that satisfies required physical properties, for example, modulus, elongation, strength, and the like.
  • the polyamic acid is added by adding the other one of BPDA and PMDA and the other one of MDA and ODA to any one of BPDA and PMDA, and any one of MDA and ODA, so that at least a portion of the pre-reactant is It may be formed by extending the end.
  • it is easy to control the number of bonds of BPDA-MDA, BPDA-ODA, PMDA-MDA and PMDA-ODA present in the polyimide film, and as a result, physical properties required in the film for optical devices, for example, modulus, It may be more advantageous to provide a polyimide film satisfying elongation, strength, and the like.
  • the method for producing the polyimide film is not particularly limited, and known methods can be freely used. For example, reacting a dianhydride monomer and a diamine monomer in a solvent to form a polyamic acid solution; mixing an imidizing agent and/or a dehydrating agent with the polyamic acid solution to form a precursor composition for a polyimide film; applying the precursor composition on a support and drying to form a gel film; And the gel film may be peeled from the support and heat-treated to prepare a polyimide film.
  • a polyamic acid solution may be formed by reacting a dianhydride monomer and a diamine monomer in a solvent.
  • a dianhydride monomer and a diamine monomer refer to the above bar.
  • the solvent is not particularly limited as long as it can dissolve the polyamic acid.
  • the solvent may include an aprotic polar solvent.
  • the aprotic polar solvent include amide solvents such as N,N'-dimethylformamide (DMF) and N,N'-dimethylacetamide (DMAc), and phenolic solvents such as p-chlorophenol and o-chlorophenol. solvent, N-methyl-pyrrolidone (NMP), gamma butyrolactone (GBL), Diglyme, and the like, and these may be used alone or in combination of two or more.
  • the solubility of polyamic acid may be controlled by using an auxiliary solvent such as toluene, tetrahydrofuran (THF), acetone, methyl ethyl ketone (MEK), methanol, ethanol, and water.
  • an auxiliary solvent such as toluene, tetrahydrofuran (THF), acetone, methyl ethyl ketone (MEK), methanol, ethanol, and water.
  • the diamine monomer and the dianhydride monomer are included in the solvent to form a substantially equimolar amount and react, where 'substantially equimolar' means 99.8 to 100.2 mol% of the dianhydride monomer based on the total number of moles of the diamine monomer could mean to be
  • the polyamic acid may be included in an amount of 5 parts by weight to 35 parts by weight based on 100 parts by weight of the polyamic acid solution.
  • the polyamic acid solution may have a molecular weight and viscosity suitable for forming a film.
  • the polyamic acid may be included in an amount of 5 to 30 parts by weight, for example, 15 to 20 parts by weight, based on 100 parts by weight of the polyamic acid solution, but is not limited thereto.
  • the polyamic acid solution may have a viscosity of 100,000 cP to 500,000 cP at 23° C. and 1s ⁇ 1 shear rate.
  • the polyamic acid may have a predetermined molecular weight and excellent processability when forming a polyimide film.
  • 'viscosity' may be measured using a HAAKE Mars Rheometer.
  • the viscosity of the polyamic acid solution may be 100,000cP to 450,000cP, for example 100,000cP to 400,000cP, for another example 100,000cP to 350,000cP at 23°C, 1s -1 shear rate, but It is not limited.
  • the polyamic acid may have a weight average molecular weight of 100,000 g/mol to 500,000 g/mol. Within the above range, it may be more advantageous to provide a polyimide film that satisfies the physical properties required in the film for optical devices, for example, modulus, elongation, strength, and the like.
  • the 'weight average molecular weight' may be measured using gel chromatography (GPC) and using polystyrene as a standard sample.
  • the weight average molecular weight of the polyamic acid may be 150,000 g/mol to 500,000 g/mol, for example, 100,000 g/mol to 400,000 g/mol, but is not limited thereto.
  • an imidizing agent and/or a dehydrating agent may be mixed with the polyamic acid solution to form a precursor composition for a polyimide film.
  • the 'dehydrating agent' promotes the ring closure reaction by dehydrating the polyamic acid.
  • the dehydrating agent include aliphatic acid anhydride, aromatic acid anhydride, N,N'-dialkylcarbodiimide, lower aliphatic halide, halogenated lower aliphatic acid anhydride, arylphosphonic acid dihalide, thionyl halide, and the like. , These may be used alone or in combination of two or more. Among them, aliphatic acid anhydrides such as acetic anhydride, propionic anhydride and lactic acid anhydride can be used from the viewpoints of availability and cost.
  • the 'imidating agent' promotes the ring closure reaction of the polyamic acid.
  • the imidizing agent include aliphatic tertiary amines, aromatic tertiary amines, and heterocyclic tertiary amines.
  • a heterocyclic tertiary amine can be used from the viewpoint of reactivity as a catalyst.
  • the heterocyclic tertiary amine include quinoline, isoquinoline, ⁇ -picoline, pyridine, and the like, and these may be used alone or in combination of two or more.
  • the addition amount of the dehydrating agent and/or imidizing agent is not particularly limited, but the dehydrating agent may be used in a ratio of 0.5 to 5 moles (for example, 1 to 4 moles) based on 1 mole of the amic acid group in the polyamic acid.
  • the imidizing agent may be used in a ratio of 0.05 moles to 3 moles (for example, 0.2 moles to 2 moles) based on 1 mole of the amic acid group in the polyamic acid. In the above range, imidization is sufficient, and casting into a film form may be easy.
  • the precursor composition may then be applied on a support and dried to form a gel film.
  • the 'gel film' may mean that it is in an intermediate stage of curing from polyamic acid to polyimide and has self-supporting properties.
  • Examples of the support include, but are not limited to, a glass plate, an aluminum foil, an endless stainless belt, a stainless drum, and the like.
  • Examples of the coating method include, but are not limited to, a casting method.
  • the drying temperature may be, for example, 40° C. to 300° C., for example, 80° C. to 200° C., but is not limited thereto.
  • the drying time may be, for example, 3 minutes to 10 minutes, for example, 4 minutes to 8 minutes, but is not limited thereto.
  • the gel film can be peeled from the support and heat-treated to prepare a polyimide film.
  • the solvent and the like remaining in the gel film may be removed by heat treatment of the gel film, and most of the remaining amic acid groups may be imidized.
  • the heat treatment temperature may be, for example, 50° C. to 700° C., for example, 150° C. to 600° C., and for another example, 200° C. to 600° C., but is not limited thereto.
  • the heat treatment time may be, for example, 5 minutes to 20 minutes, for example, 7 minutes to 15 minutes, but is not limited thereto.
  • the method may further include stretching the gel film in order to control the thickness of the finally obtained polyimide film and improve orientation.
  • the stretching may be performed in at least one of a machine direction (MD) and a transverse direction (TD).
  • the polyimide film obtained after heat treatment of the gel film may be heat-finished at 400° C. to 650° C. for 5 seconds to 400 seconds to further harden the polyimide film.
  • heat finishing may be performed under a predetermined tension, but is not limited thereto.
  • the above-described polyimide film or the polyimide film prepared by the above-described manufacturing method may satisfy physical properties required for an optical device film, for example, modulus, elongation, strength, and the like, and thus may be suitably used for an optical device.
  • the above-described optical device may be a display device, and the above-described polyimide film may be used as a backplate film, but is not limited thereto.
  • an optical device including the above-described polyimide film.
  • the optical device is a display device, and may include the above-described polyimide film as a backplate film.
  • a polyamic acid solution having a viscosity of 150,000 cP was prepared by mixing a dianhydride monomer and a diamine monomer as described in Table 1 in dimethylformamide (DMF) and reacting at 30° C. for 2 hours. At this time, the dianhydride monomer and the diamine monomer were substantially equimolar, and the reaction conditions were controlled so that the reaction of BPDA and MDA takes precedence over the reaction between other monomers.
  • DMF dimethylformamide
  • acetic anhydride in a molar ratio of 3.2 molar ratio and isoquinoline in a molar ratio of 1.0 per mole of amic acid group were added to obtain a precursor composition for a polyimide film.
  • composition was cast on a SUS plate (100SA, Sandvik) using a doctor blade, and dried at 110° C. for 4 minutes to prepare a gel film.
  • the present invention has the effect of providing a polyimide film satisfying the physical properties required for an optical device film, for example, modulus, elongation, strength, and the like, and an optical device including the same.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un film de polyimide et un dispositif optique le comprenant, le film de polyimide satisfaisant l'équation 1 et ayant un allongement maximal de 50 % ou plus tel que mesuré selon la norme ASTM D882.
PCT/KR2021/017146 2020-11-25 2021-11-22 Film de polyimide et dispositif optique le comprenant WO2022114695A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023530327A JP2023550755A (ja) 2020-11-25 2021-11-22 ポリイミドフィルムおよびこれを含む光学装置
CN202180077600.6A CN116438224A (zh) 2020-11-25 2021-11-22 聚酰亚胺膜和包含其的光学装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200160337A KR102456932B1 (ko) 2020-11-25 2020-11-25 폴리이미드 필름 및 이를 포함한 광학 장치
KR10-2020-0160337 2020-11-25

Publications (1)

Publication Number Publication Date
WO2022114695A1 true WO2022114695A1 (fr) 2022-06-02

Family

ID=81756151

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/017146 WO2022114695A1 (fr) 2020-11-25 2021-11-22 Film de polyimide et dispositif optique le comprenant

Country Status (4)

Country Link
JP (1) JP2023550755A (fr)
KR (1) KR102456932B1 (fr)
CN (1) CN116438224A (fr)
WO (1) WO2022114695A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010215840A (ja) * 2009-03-18 2010-09-30 Teijin Ltd ポリイミド及びポリイミドフィルム
KR20160002386A (ko) * 2014-06-30 2016-01-07 코오롱인더스트리 주식회사 고내열 폴리아믹산 용액 및 폴리이미드 필름
WO2016175344A1 (fr) * 2015-04-28 2016-11-03 코오롱인더스트리 주식회사 Résine de polyimide et film utilisant celle-ci
KR20190053794A (ko) * 2017-11-10 2019-05-20 에스케이씨코오롱피아이 주식회사 도체 피복용 폴리아믹산 조성물
KR20200129337A (ko) * 2019-05-08 2020-11-18 피아이첨단소재 주식회사 폴리이미드 필름 제조방법 및 이에 의해 제조된 폴리이미드 필름

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102638825B1 (ko) * 2018-01-24 2024-02-21 주식회사 동진쎄미켐 폴리이미드 필름 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010215840A (ja) * 2009-03-18 2010-09-30 Teijin Ltd ポリイミド及びポリイミドフィルム
KR20160002386A (ko) * 2014-06-30 2016-01-07 코오롱인더스트리 주식회사 고내열 폴리아믹산 용액 및 폴리이미드 필름
WO2016175344A1 (fr) * 2015-04-28 2016-11-03 코오롱인더스트리 주식회사 Résine de polyimide et film utilisant celle-ci
KR20190053794A (ko) * 2017-11-10 2019-05-20 에스케이씨코오롱피아이 주식회사 도체 피복용 폴리아믹산 조성물
KR20200129337A (ko) * 2019-05-08 2020-11-18 피아이첨단소재 주식회사 폴리이미드 필름 제조방법 및 이에 의해 제조된 폴리이미드 필름

Also Published As

Publication number Publication date
KR20220072574A (ko) 2022-06-02
CN116438224A (zh) 2023-07-14
JP2023550755A (ja) 2023-12-05
KR102456932B1 (ko) 2022-10-21

Similar Documents

Publication Publication Date Title
WO2019088454A1 (fr) Film de polyimide noir ultra mince et son procédé de fabrication
WO2010036049A2 (fr) Film de polyimide
WO2021060613A1 (fr) Composition d'acide polyamique, son procédé de préparation et film de polyimide la comprenant
WO2020054912A1 (fr) Film de polyimide ayant une qualité de surface améliorée et son procédé de fabrication
WO2013002614A2 (fr) Acide polyamique, solution d'acide polyamique, couche protectrice de polyimide, et film de polyimide
WO2019132184A1 (fr) Film de polyimide pour fabriquer un stratifié revêtu de cuivre flexible et stratifié plaqué de cuivre flexible le comprenant
WO2021096245A2 (fr) Film de polyimide ultra-mince ayant une stabilité dimensionnelle améliorée et son procédé de fabrication
WO2012081763A1 (fr) Film en polyimide
WO2021091014A1 (fr) Film de polyimide ayant des propriétés diélectriques améliorées, et procédé de fabrication associé
WO2021085851A1 (fr) Film de polyimide pour feuille de graphite, et feuille de graphite fabriquée à partir de celui-ci
WO2021107294A1 (fr) Film de polyimide, son procédé de production, et stratifié plaqué de feuille métallique flexible le comprenant
WO2021054515A1 (fr) Film de polyimide, son procédé de fabrication, et stratifié de feuille métallique flexible le comprenant
WO2021091012A1 (fr) Film de polyimide présentant de faibles propriétés diélectriques et son procédé de fabrication
WO2011049357A2 (fr) Solution d'acide polyamique, résine de polyimide et stratifié flexible plaqué cuivre l'utilisant
WO2021095976A1 (fr) Film polyimide hautement élastique et résistant à la chaleur et son procédé de production
WO2016003146A1 (fr) Solution de poly(acide amique) résistant à la chaleur élevée et film de polyimide
WO2021107402A1 (fr) Film de polyimide et son procédé de fabrication
WO2020230969A1 (fr) Polyimide et son procédé de fabrication
WO2021006427A1 (fr) Composition d'acide polyamique, procédé de préparation d'une composition d'acide polyamique et polyimide la comprenant
WO2022114695A1 (fr) Film de polyimide et dispositif optique le comprenant
WO2022114852A1 (fr) Film de polyimide pour feuille de graphite, procédé de production s'y rapportant et feuille de graphite fabriquée à partir de ceux-ci
WO2021060612A1 (fr) Composition d'acide polyamique, son procédé de préparation et film de polyimide la comprenant
WO2020096364A1 (fr) Film composite de polyimide ayant d'excellentes performances de protection contre les ondes électromagnétiques et procédé de fabrication de ce film
WO2022107966A1 (fr) Composition d'acide polyamique et polyimide la comprenant
WO2016129926A1 (fr) Acide polyamique, résine de polyimide et film de polyimide

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21898521

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023530327

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21898521

Country of ref document: EP

Kind code of ref document: A1