WO2013002614A2 - Acide polyamique, solution d'acide polyamique, couche protectrice de polyimide, et film de polyimide - Google Patents

Acide polyamique, solution d'acide polyamique, couche protectrice de polyimide, et film de polyimide Download PDF

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Publication number
WO2013002614A2
WO2013002614A2 PCT/KR2012/005230 KR2012005230W WO2013002614A2 WO 2013002614 A2 WO2013002614 A2 WO 2013002614A2 KR 2012005230 W KR2012005230 W KR 2012005230W WO 2013002614 A2 WO2013002614 A2 WO 2013002614A2
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Prior art keywords
polyamic acid
acid solution
polyimide
mol
protective layer
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PCT/KR2012/005230
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English (en)
Korean (ko)
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WO2013002614A3 (fr
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박상윤
정학기
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코오롱인더스트리 주식회사
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Priority to CN201280032811.9A priority Critical patent/CN103649175B/zh
Publication of WO2013002614A2 publication Critical patent/WO2013002614A2/fr
Publication of WO2013002614A3 publication Critical patent/WO2013002614A3/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors

Definitions

  • the present invention relates to a polyamic acid, a polyamic acid solution, a polyimide protective layer and a polyimide film.
  • the type of flexible display currently developed is being developed in the same manner as LCD, OLED, and EPD based on passive or active driving elements. These are methods in which a display is driven by mounting a passive or active driving element on a flexible polymer substrate as a structure, and attention is gradually shifting to active type with precise pixel implementation rather than passive type.
  • the active flexible display constitutes a unit device of a display by structuring a gate, an insulating film, a source, and a drain on a polymer material substrate and finally mounting an electrode and a display element.
  • the active display device since most of the manufacturing processes are often performed at high temperature, if a polymer substrate material having no heat resistance is used, the dimensions of the polymer substrate are easily deformed and thermally deformed during device fabrication. There is a problem in that the alignment of the pattern does not match or changes in the surface properties of the polymer substrate, so that the pattern may be used as a display substrate.
  • typical heat-resistant plastic materials include polyethylene naphthalate (PEN) and polyether sulfone (PES) polycarbonate (PC).
  • PEN polyethylene naphthalate
  • PES polyether sulfone
  • PC polycarbonate
  • Tg glass transition temperature
  • Tg coefficient of thermal expansion
  • Possible adverse effects on quality John Scheirs and Timothy E. Long, Modern Polyesters: Chemistry and Technology of Polyesters and Copolyesters, 2004); And Sumilite® FS-1300, Sumitomo Bakelite Catalog 4).
  • the display element is manufactured by adhering on the metal foil or the glass plate.
  • the adhesive film and the metal foil or the glass plate are further bonded and peeled off by using the adhesive. If the adhesion is not smooth, there may be a problem in the smoothness.
  • the present invention provides a polyamic acid and a polyamic acid solution that can produce a substrate or a protective layer of a flexible display having excellent thermal stability even at a high temperature of 500 ° C. or higher and having excellent thermal expansion in the temperature range of 50 to 450 ° C. after film formation.
  • a polyimide protective layer and a polyimide film are examples of polyimide film.
  • the polyamic acid of the present invention is polymerized from an aromatic diamine monomer and an aromatic dianhydride monomer, and the aromatic diamine monomer comprises 2- (4-aminophenyl) -5-aminobenzoxazole.
  • the aromatic dianhydride-based monomer may include pyromellitic anhydride alone, or 70 mol% or more of pyromellitic anhydride and 30 mol% or less of biphenyltetracarbosyl anhydride.
  • the polyamic acid solution of the present invention includes the polyamic acid, and has a viscosity of 50 to 5,000 poise.
  • the polyimide protective layer of the present invention is characterized in that the polyamic acid solution of claim 3 is coated on a laminated component of a display device, and is produced by imidization thereof.
  • the polyimide film of the present invention comprises a unit structure derived from an aromatic diamine monomer and a unit structure derived from an aromatic dianhydride monomer, wherein the aromatic monomer is 2- (4-aminophenyl) -5-aminobenzoxazole
  • the aromatic dianhydride-based monomer comprises pyromellitic anhydride alone, or more than 70 mol% of pyromellitic anhydride and 30 mol% or less of biphenyltetracarbolic acid anhydride It is desirable to.
  • the present invention is a polyamic acid, polya which can manufacture a substrate or a protective layer of a flexible display having excellent thermal stability even at a high temperature of 500 °C or more, and excellent thermal expansion coefficient in the temperature range of 50 ⁇ 450 °C after film formation
  • a mixed acid solution, a polyimide protective layer, and a polyimide film were provided.
  • the polyamic acid, the polyamic acid solution, the polyimide film, and the protective layer of the present invention are aromatic diamine-based monomers and aromatic dianhydrides in order to have excellent thermal stability and thermal expansion coefficient when the final product is made of a substrate or a protective layer. It superposes
  • the pyrolysis temperature at which TGA 1% weight loss occurs may be 500 ° C or higher, and in the temperature range of 50 to 450 ° C.
  • Thermal expansion coefficient may be 20 ppm / degrees C or less.
  • the polyamic acid of the present invention contains 2- (4-aminophenyl) -5-aminobenzoxazole as an aromatic diamine monomer, and at this time, 70 mol% of pyromellitic anhydride as the aromatic dianhydride monomer.
  • the thermal stability and thermal expansion rate of the polyimide after imidation can be made excellent.
  • the polyamic acid to be provided in the present invention may be provided in a liquid form, which is provided in the form of a film, and thus, the film itself does not have a supporting force capable of maintaining its shape.
  • the adhesive and peeling process of the polymer film and the metal foil or the glass plate using the adhesive is additionally generated, and when the adhesion is not smooth, a problem may occur in the smoothness, so the polyamic acid to be provided in the present invention is in the form of a film. It is provided in a liquid form instead of being applied to the pretreated ceramic support and dried to form an imidization film, which is an advantage that can be easily used a process for manufacturing a display device while maintaining the form of the pretreated ceramic support Because of this.
  • the polyamic acid solution of the present invention contains 2- (4-aminophenyl) -5-aminobenzoxazole as the aromatic diamine monomer in order to ensure uniformity of the coating, and the like as the aromatic dianhydride monomer It is preferable that the polyamic acid contains 70 mol% or more of pyromellitic anhydrides, and 30 mol% or less of biphenyl tetracarbosyl anhydride, or contains pyromellitic anhydride independently, and it is preferable that a viscosity is 50-5,000 poise.
  • the protective layer of the present invention contains 2- (4-aminophenyl) -5-aminobenzoxazole as an aromatic diamine monomer on the laminated component of the display device, and at this time, the aromatic dianhydride monomer A polyamic acid solution containing not less than 70 mol% of pyromellitic anhydride and not more than 30 mol% of biphenyltetracarbosilic anhydride, or containing pyromellitic anhydride alone, having a viscosity of 50 to 5,00 poise, is already applied. It is preferable to make it and to produce it.
  • the polyimide film of the present invention comprises 2- (4-aminophenyl) -5-aminobenzoxazole as an aromatic diamine monomer, wherein at least 70 mol% of pyromellitic anhydride as the aromatic dianhydride monomer and By containing 30 mol% or less of biphenyl tetracarbosyl anhydride or containing pyromellitic anhydride alone, it can be used as a material of a board
  • the dianhydride component and the diamine component are dissolved in a substantially equimolar amount to react with each other to prepare a polyamic acid.
  • the reaction temperature is preferably -20 to 80 ° C, and the reaction time is preferably 2 to 48 hours. Moreover, it is more preferable that it is inert atmosphere, such as argon and nitrogen, at the time of reaction.
  • the organic solvent for the polymerization of the polyamic acid is not particularly limited as long as it is a solvent that dissolves the polyamic acid, and known reaction solvents include m-cresol, N-methyl-2-pyrrolidone (NMP), and dimethylformamide ( One or more polar solvents selected from DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO), acetone and diethyl acetate.
  • DMF dimethylacetamide
  • DMSO dimethylsulfoxide
  • acetone and diethyl acetate acetone and diethyl acetate.
  • low boiling point solutions such as tetrahydrofuran (THF), chloroform or low absorbing solvents such as ⁇ -butyrolactone may be used.
  • the content of the organic solvent is not particularly limited, but in order to obtain appropriate molecular weight and viscosity of the polyamic acid, the organic solvent is preferably 50 to 95% by weight of the total polyamic acid solution, and more preferably 70 to 90% by weight. More preferred.
  • a filler may be added to the polyamic acid solution for the purpose of improving various properties such as surface properties and thermal conductivity of the polyimide coating layer.
  • a filler As a preferable specific example, a silica, titanium oxide, layered silica, carbon nanotube, alumina, silicon nitride, boron nitride, calcium hydrogen phosphate, calcium phosphate, mica, etc. are mentioned.
  • the particle diameter of the filler may vary depending on the characteristics of the coating layer to be modified and the type of filler to be added, but is not particularly limited. In general, the average particle diameter is preferably 0.001 to 50 ⁇ m, and preferably 0.005 to 25 ⁇ m. It is more preferable, More preferably, it is good that it is 0.01-10 micrometers. In this case, the effect of modifying the polyimide coating layer is likely to appear, and good surface property, insulation, conductivity and mechanical properties can be obtained in the polyimide coating layer.
  • the amount of the filler added may vary depending on the characteristics of the coating layer to be modified, the filler particle size, and the like.
  • the content of the filler is preferably 0.001 to 20 parts by weight, more preferably 0.01 to 15 parts by weight, based on 100 parts by weight of the polyamic acid solution in order to exhibit properties to be modified without disturbing the bonding structure of the polymer resin. It is good that it is a weight part.
  • the addition method of a filler is not specifically limited, For example, the method of adding to a polyamic-acid solution before superposition
  • the method which simulates the flexible display manufacturing process can be used,
  • coating a polyamic acid solution uniformly to a support body is mentioned. That is, the display device manufacturing process generally proceeds in the order of sequentially stacking electrodes and display parts on the upper surface of the substrate layer.
  • the polyamic acid solution may be formed on a separate support (ceramic support, etc.).
  • the polyimide coating layer imidized by applying the polyamic acid solution on a component laminated on the display device may be applied as a protective layer.
  • the chemical imidization method is a method of imidizing a polyamic acid solution by imidating a dehydrating agent represented by an acid anhydride such as acetic anhydride and an imidization catalyst represented by tertiary amines such as isoquinoline, ⁇ -picolin and pyridine.
  • a dehydrating agent represented by an acid anhydride such as acetic anhydride
  • an imidization catalyst represented by tertiary amines such as isoquinoline, ⁇ -picolin and pyridine.
  • the heating conditions of the polyamic acid solution may vary depending on the kind of the polyamic acid solution, the required imidization film thickness, and the like.
  • the imidization film formation method After the dehydrating agent and the imidization catalyst are added to the polyamic acid solution and cast on a separate support, 80 to 200
  • the imidized film can be obtained by heating at 100 ° C, preferably 100-180 ° C, activating the dehydrating agent and the imidization catalyst, partially curing and drying, and then heating at 200-400 ° C for 1-120 minutes.
  • the display device components and the like may be sequentially stacked on the imidization film as described above, and a solution in which a dehydrating agent and an imidization catalyst is added to the polyamic acid solution is applied onto the display device components, and then an imidization film is formed. It can also be applied as a protective layer.
  • the polyamic acid solution As described above, by applying the polyamic acid solution to the display device, a display device having excellent thermal stability and appropriate flexibility and mechanical strength can be provided.
  • a method of producing a polyimide film as a flexible display substrate after applying a solution containing the polyamic acid of the present invention on the support for forming a film, the thermal imidization method and / or chemical imidization method It can also imide using and manufacture a polyimide film.
  • the obtained polyamic acid solution was vacuum degassed, cooled to room temperature, cast to a thickness of 60-100 ⁇ m on a stainless plate and dried for 10 minutes with hot air at 150 ° C. Then, the mixture was heated up to 450 ° C., heated for 30 minutes, and slowly cooled to separate from the support to obtain a polyimide membrane having a thickness of 12 ⁇ m.
  • the obtained polyamic acid solution was vacuum degassed, cooled to room temperature, cast to a thickness of 60-100 ⁇ m on a stainless plate and dried for 10 minutes with hot air at 150 ° C. Then, the mixture was heated up to 450 ° C., heated for 30 minutes, and gradually cooled to separate from the support to obtain a polyimide membrane having a thickness of 12 ⁇ m.
  • the polyamic acid solution and the polyimide coating layer were obtained in the same manner as in Example 2, except that the components and amounts of diamine and dianhydride were changed as shown in the following molar ratio of Table 1, and the thickness of the polyimide membrane was adjusted. It was.
  • the reactor was filled with 500 g of N, N-dimethylacetamide (DMAc) while passing nitrogen through a 1 L reactor equipped with a stirrer, a nitrogen injection device, a dropping funnel, a temperature controller, and a cooler. 3,3-Oxydianilne] 24.86 g (0.2299 mol) was dissolved to maintain this solution at 25 ° C. PMDA 50.14 g (0.2299 mol) was added thereto and stirred for 24 hours to obtain a polyamic acid solution having a viscosity of 760 Poise.
  • DMAc N, N-dimethylacetamide
  • the obtained polyamic acid solution was vacuum degassed, cooled to room temperature, cast to a thickness of 60-100 ⁇ m on a stainless plate and dried for 10 minutes with hot air at 150 ° C. Then, the mixture was heated up to 450 ° C., heated for 30 minutes, and slowly cooled to separate from the support to obtain a polyimide membrane having a thickness of 11 ⁇ m.
  • the obtained polyamic acid solution was vacuum degassed, cooled to room temperature, cast to a thickness of 60-100 ⁇ m on a stainless plate and dried for 10 minutes with hot air at 150 ° C. Then, the mixture was heated up to 450 ° C., heated for 30 minutes, and slowly cooled to separate from the support to obtain a polyimide membrane having a thickness of 11 ⁇ m.
  • Comparative Example 2 the component and the amount of the diamine and dianhydride were changed as shown in Table 1 below and the molar ratio of the component, and the polyamic acid solution and the polyimide coating layer in the same manner except that the thickness of the polyimide film was adjusted. Obtained.
  • the sample Prior to measuring the thermal expansion rate, the sample was annealed at 450 ° C. for 10 minutes.
  • the method of measuring the coefficient of thermal expansion was performed by cutting a portion of the polyimide coating layer sample into a width of 4mm ⁇ length 24mm and measuring the coefficient of thermal expansion (Coefficient of thermal expansion) using a Thermo Mechanical Apparatus of TA.
  • the sample was placed on a support and subjected to a force of 50 mN, and then heated at a temperature increase rate of 5 ° C./min from 50 ° C. to 450 ° C. in a nitrogen atmosphere to measure thermal expansion rate.
  • the coefficient of thermal expansion was calculated to the first decimal place in the range of 50 ° C to 450 ° C, and the unit is expressed in [° C / ppm].
  • Pyrolysis temperature was measured by using a TGA measuring device of Perkin Elmer. After cutting the imide membrane into 3mm x 3mm size and placing it on a pre-treated and weighed fan, heat insulation was performed at 110 ° C for 30 minutes, cooled to room temperature, and then heated again at 600 ° C at a rate of 5 ° C per minute to measure the weight loss. . The pyrolysis temperature was calculated by setting the weight reduction ratio to 1% of the weight of the first loaded imide membrane.
  • the polyamic acid solution according to the embodiment of the present invention had no problem in imidization and coating.
  • the polyimide coating layer obtained from the polyamic acid solution according to Examples 1 to 7 had excellent thermal stability with a thermal decomposition temperature of 500 ° C. or higher, and a thermal expansion coefficient measurement result in Examples 5 to 7 at 20 ppm / 50 ° C. Below 2 ° C, Examples 2 to 4 were below 10 ppm / ° C.
  • Example 1 which contains pyromellitic anhydride alone as an aromatic anhydride monomer, showed a very good thermal expansion rate of 0.01 ppm / ° C.
  • the polyimide coating layer formed of the polyamic acid solution according to the comparative example has satisfactory thermal decomposition temperature, but the thermal expansion rate is much higher than 20 ppm / ° C., thus forming the base layer or the protective layer of the display device as compared to the polyamic acid solution according to the embodiments. It can be seen that the coefficient of thermal expansion is low when used in.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un acide polyamique et un dispositif d'affichage, et plus spécifiquement un dispositif d'affichage comprenant un acide polyamique et un film imidé de celui-ci qui peut être appliqué en tant que couche de base ou couche protectrice du dispositif d'affichage grâce à d'excellentes propriétés thermiques de faible taux de dilatation thermique et température de pyrolyse élevée.
PCT/KR2012/005230 2011-06-30 2012-07-02 Acide polyamique, solution d'acide polyamique, couche protectrice de polyimide, et film de polyimide WO2013002614A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280032811.9A CN103649175B (zh) 2011-06-30 2012-07-02 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺保护层以及聚酰亚胺膜

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KR10-2011-0064665 2011-06-30
KR1020110064665A KR101531737B1 (ko) 2011-06-30 2011-06-30 폴리아믹산，폴리아믹산 용액，폴리이미드 보호층 및 폴리이미드 필름

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WO2014133297A1 (fr) * 2013-02-27 2014-09-04 한국과학기술원 Procédé de production de pellicule polyimide incolore et transparente imprégnée de tissu de verre et surface de planarisation de celle-ci
US9469735B2 (en) 2013-02-27 2016-10-18 Korea Advanced Institute Of Science And Technology Method of manufacturing colorless transparent polyimide film having impregnated glass fabric and of flattening surface thereof
JPWO2014129464A1 (ja) * 2013-02-19 2017-02-02 新日鉄住金化学株式会社 積層体、太陽電池用部材、太陽電池、表示装置用部材、表示装置及び積層体の製造方法

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KR101650223B1 (ko) * 2013-06-11 2016-08-30 주식회사 엘지화학 폴리이미드 전구체 조성물
KR102047345B1 (ko) * 2013-06-28 2019-11-21 코오롱인더스트리 주식회사 폴리이미드 필름 및 그 제조방법
CN104512075B (zh) * 2013-10-04 2017-06-23 财团法人工业技术研究院 离型层、基板结构、与柔性电子元件工艺
CN106405758B (zh) * 2016-06-12 2023-06-23 中国电子科技集团公司第八研究所 一种舱外耐辐照光缆及其制作方法
KR101912737B1 (ko) * 2017-05-23 2018-10-30 주식회사 대림코퍼레이션 레이저 박리 용이성 및 고내열성을 갖는 폴리아믹산 수지의 제조방법 및 이를 이용하여 제조한 폴리이미드 필름
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CN103649175A (zh) 2014-03-19

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