WO2019132515A1 - Procédé de préparation d'acide polyamique, et acide polyamique, résine de polyimide et film de polyimide ainsi fabriqués - Google Patents

Procédé de préparation d'acide polyamique, et acide polyamique, résine de polyimide et film de polyimide ainsi fabriqués Download PDF

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WO2019132515A1
WO2019132515A1 PCT/KR2018/016671 KR2018016671W WO2019132515A1 WO 2019132515 A1 WO2019132515 A1 WO 2019132515A1 KR 2018016671 W KR2018016671 W KR 2018016671W WO 2019132515 A1 WO2019132515 A1 WO 2019132515A1
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bis
bpda
pmda
6fda
block structure
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PCT/KR2018/016671
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English (en)
Korean (ko)
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최두리
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코오롱인더스트리 주식회사
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Priority to CN201880084832.2A priority Critical patent/CN111542562B/zh
Priority to JP2020532593A priority patent/JP6980919B2/ja
Publication of WO2019132515A1 publication Critical patent/WO2019132515A1/fr
Priority to JP2021187189A priority patent/JP7206358B2/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film

Definitions

  • the present invention relates to a process for producing a polyamic acid, a polyamic acid, a polyimide resin and a polyimide film produced therefrom.
  • a polyimide (PI) film is a film made of a polyimide resin, and a polyimide resin is produced by solution polymerization of an aromatic dianhydride and an aromatic diamine or aromatic diisocyanate to prepare a polyamic acid derivative, Refers to a high heat-resistant resin produced by imidization.
  • Such a polyimide film has excellent mechanical, heat resistance and electrical insulation properties, it is used in a wide range of electronic materials such as a semiconductor insulating film, a substrate for an electrode protection film flexible printed wiring circuit of a TFT-LCD, and the like.
  • the polyimide resin is colored in brown and yellow due to its high aromatic ring density, and thus has low transmittance in the visible light region and yellowish color to lower the light transmittance and has a large birefringence, making it difficult to use the polyimide resin as an optical member have.
  • the present invention relates to a method for producing a polyamic acid having an improved linear thermal expansion coefficient while maintaining the same raw materials and the same amount of an existing composition but changing the method of injection to maintain the optical properties and a polyamic acid, a polyimide resin and a polyimide film And an image display device including the same.
  • 1,2,4-benzene tetracarboxylic acid (2,2'-bis (trifluoromethyl) benzidine, TFDB) dianhydride
  • the molar ratio of at least one selected from PMDA to 6FDA and BPDA is 90 to 25:10 to 75.
  • the molar ratio of PMDA to BPDA is 90 to 25: 10 to 75.
  • the molar ratio of PMDA to 6FDA to BPDA is 90 to 50: 5 to 30: 5 to 20.
  • the diamine may be selected from the group consisting of 9,9-bis (4-aminophenyl) fluorene (FDA) and 9,9-bis (3-fluoro- , And the like.
  • the polyamic acid comprises a block structure comprising repeating units.
  • the molar ratio of at least one selected from the group consisting of 6FDA and BPDA in the second block structure to the PMDA in the first block structure is 90 to 25:10 to 75.
  • the molar ratio of PMDA in the first block structure to 6FDA in the second block structure is 90 to 70: 10 to 30.
  • the molar ratio of PMDA in the first block structure to BPDA in the second block structure is 90 to 25: 10 to 75.
  • the molar ratio of PMDA in the first block structure to 6FDA in the second block structure to BPDA in the second block structure is 90 to 50: 5 to 30: 5 to 20.
  • the block structure containing repeating units derived from bis TFDB and repeating units derived from at least one selected from 6FDA and BPDA is composed of 9,9-bis (4-aminophenyl) fluorene (FDA) and (9,9-Bis (3-fluoro-4-aminophenyl) fluorene, and FFDA).
  • the content of at least one selected from FDA and FFDA is 1 mol% to 20 mol% based on the total molar amount of diamine.
  • Another preferred embodiment of the present invention is to provide a polyimide resin produced from the above-mentioned polyamic acid.
  • Another preferred embodiment of the present invention is to provide a polyimide film made of the polyimide resin.
  • the polyimide film is characterized by having a coefficient of thermal expansion of 30 ppm / ° C or less at 50 to 350 ° C, a transmittance of 85% or more at 550 nm when measured by a UV spectrometer, and a yellowness of 10 or less .
  • Another preferred embodiment of the present invention is to provide an image display device including a polyimide film.
  • diamines including 1,2-bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5-benzene tetracarboxylic dianhydride, PMDA); And 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA (trifluoromethyl) benzidine, TFDB) ) And biphenyltetracarboxylic dianhydride (BPDA) in the presence of at least one dianhydride selected from the group consisting of dianhydride, to provide.
  • one kind of diamine can be added under one or more conditions, for example, primary and secondary, under specific conditions, and the linear thermal expansion coefficient can be improved while keeping the optical characteristics at a good level.
  • a diamine containing pyrazolinic dianhydride (1,2, 3, 4, 5, 6, 7, 4,5-benzene tetracarboxylic dianhydride, PMDA); And 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA (trifluoromethyl) benzidine, TFDB) ) And biphenyltetracarboxylic dianhydride (BPDA), and a second step of introducing a dianhydride containing at least one member selected from the group consisting of biphenyltetracarboxylic dianhydride and 3,3,4,4-biphenyltetracarboxylic dianhydride Do.
  • the molar ratio of at least one selected from the PMDA to 6FDA and BPDA is preferably 90 to 25:10 to 75, and more preferably 90 to 30:10 to 70.
  • the molar ratio of 6FDA at the time of the first charging to the amount of 6FDA at the time of the second charging is 90 to 70:10 to 30, And preferably 90 to 75: 10 to 25.
  • the linear thermal expansion coefficient may be very low, but the yellowing degree may be very high. If it is higher than this range, the yellowness index is very low, but the linear thermal expansion coefficient may increase.
  • the molar ratio of the BPDA at the time of the first charging to the BPDA at the time of the second charging is 90 to 25:10 to 75, And preferably from 85 to 30: 15 to 70.
  • the linear thermal expansion coefficient may be very low, but the yellowness may become very high. If the ratio of BPDA If it is higher than this range, the yellowness of PMDA is lowered, but the linear thermal expansion coefficient may be increased.
  • the PMDA at the first input, the 6FDA at the second input, and the BPDA Is in the range of 90 to 50: 5 to 30: 5 to 20.
  • the dianhydride containing at least one selected from the group consisting of 6FDA and BPDA is added to the dianhydride containing the PMDA,
  • the thermal expansion coefficient and the yellowness degree can be improved at the same time.
  • diamines including 1,2-bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5-benzene bis (trifluoromethyl) benzidine, TFDB) and 2,2-bis (3, 4-dihydroxybenzene) Dianhydride containing at least one member selected from the group consisting of 4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA) and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA) It is preferable that the hydride is added later to improve the physical properties of the present invention.
  • the diamine at the time of the second addition may be 9,9-Bis (4-aminophenyl) fluorene, FDA and 9,9-Bis (3-fluoro-4 -aminophenyl) fluorene, and FFDA) may be further added.
  • FDA and FFDA 9,9-Bis (4-aminophenyl) fluorene
  • FFDA 9,9-Bis (3-fluoro-4 -aminophenyl) fluorene
  • At least one selected from the above FDA and FFDA is contained in an amount of 1 mol% to 20 mol%, preferably 1 to 10 mol%, based on the total molar amount of diamine.
  • the content of the at least one selected from the above FDA and FFDA is out of the above range, the content is less than 1 mol% and the glass transition temperature may not be improved.
  • the content is more than 20 mol%, the yellowness and thermal expansion coefficient .
  • the diamines including the secondary addition and containing bis (trifluoromethyl) benzidine (TFDB) and 2,2-bis (3,4 (Biphenyltetracarboxylic dianhydride, BPDA), which is a dianhydride containing at least one member selected from the group consisting of dihydrocarbyl, dihydrocarbyl, dicarboxyphenyl, hexafluoropropane dianhydride (6FDA) and biphenyltetracarboxylic dianhydride
  • TFDB bis (trifluoromethyl) benzidine
  • BPDA 2,2-bis (3,4 (Biphenyltetracarboxylic dianhydride
  • BPDA 2,2-bis (3,4 (Biphenyltetracarboxylic dianhydride
  • BPDA 2,2-bis (3,4 (Biphenyltetracarboxylic dianhydride
  • the third step of injecting the rides may be carried out.
  • the diamine and dianhydride at the time of the third addition may be appropriately adjusted within the range of the molar ratio of the diamine and the dianhydride at the time of the first and second additions.
  • oxydianiline ODA
  • para-phenylene diamine pPDA
  • m-phenylenediamine metal-phenylene diamine
  • pMDA p-methylene dianiline
  • mMDA m-methylene dianiline
  • bisaminophenoxybenzene bis (4-aminophenoxy) benzene 133APB
  • 1,3-bis (4-aminophenoxy) benzene 134APB
  • 4BDAF 2,2'-bis (3-aminophenyl) hexafluoropropane, 33-6F, bisaminophenylhexafluoropropane 4-aminophenyl) hexafluoropropane, 4
  • the dianhydride used in the present invention may contain, in addition to PMDA, 6FDA and BPDA, 4- (2,5-dioxotetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene- 2-dicarboxylic anhydride (TDA), benzophenone tetracarboxylic dianhydride (BTDA), 4,4-oxydiphthalic dianhydride , ODPA), bis (3,4dicarboxyphenyl) dimethyl-silane dianhydride (SiDA), bisdicarboxyphenoxydiphenylsulfide dianhydride (4,4-bis (3,4-dicarboxyphenoxy ) diphenyl sulfide dianhydride (BDSDA), sulfonyldiphthalic anhydride (SO 2 DPA), cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) Isopropylidene
  • the above-mentioned diamine and dianhydride components are involved in the polymerization reaction.
  • the conditions for the reaction are not particularly limited, but the reaction temperature is preferably 0 to 80 ° C, and the reaction time is preferably 2 to 48 hours. It is more preferable that the atmosphere is an inert gas atmosphere such as argon or nitrogen during the reaction.
  • the organic solvent for the solution polymerization of the monomers is not particularly limited as long as it is a solvent dissolving the polyamic acid.
  • reaction solvents there may be used m-cresol, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO), acetone, (DEF), diethylacetamide (DEA), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, 3-methoxy-N, N-dimethylpropionamide and 3-butoxy-N , And N-methylpropionamide.
  • NMP N-methyl-2-pyrrolidone
  • DMF dimethylformamide
  • DMAc dimethylacetamide
  • DMSO dimethylsulfoxide
  • DEF diethylacetamide
  • PGME propylene glycol monomethyl ether
  • PMEA propylene glycol
  • a low boiling point solution such as tetrahydrofuran (THF), chloroform or a low-absorbency solvent such as? -Butyrolactone may be used.
  • THF tetrahydrofuran
  • chloroform chloroform
  • a low-absorbency solvent such as? -Butyrolactone
  • the solvent is not limited to those mentioned above, and these solvents may be used alone or in combination of two or more.
  • the content of the organic solvent is preferably 50 to 95% by weight, more preferably 70 to 90% by weight in the total polyamic acid solution in order to obtain the molecular weight and viscosity of an appropriate polyamic acid solution, Is more preferable.
  • a process for preparing a copolymer comprising repeating units derived from bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5 (2,2'-bis (trifluoromethyl) benzidine (TFDB)) and a second block structure containing a repeating unit derived from 2,2'-bis (tetrabutylammonium) benzene tetracarboxylic dianhydride At least one selected from bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA) and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA) And a second block structure including a repeating unit derived from the polyamic acid.
  • TFDB bis (trifluoromethyl) benzidine
  • TFDB pyromellitic dianhydride
  • the polyamic acid is preferably produced by the above-described production method.
  • the polyamic acid prepared by the above-mentioned method can be prepared by adding one diamine in one portion so as to contain a first block structure and a second block structure containing one diamine in a specific amount, It is possible to obtain an effect of improving the linear thermal expansion coefficient without lowering the yellowness and permeability as compared with polyamic acid.
  • the molar ratio of at least one selected from the group consisting of 6FDA and BPDA in the second block structure to the PMDA in the first block structure is 90 to 25:10 to 75, preferably 90 to 30:10 to 70.
  • At least one of PMDA in the first block structure and 6FDA and BPDA in the second block structure is out of the molar ratio range, it may have a yellowness degree of 10 or more or a thermal expansion coefficient of 30 ppm / have.
  • the molar ratio of PMDA in the first block structure to 6FDA in the second block structure is 90 to 70: 10 to 30, preferably 90 to 75: 10 to 25.
  • the linear thermal expansion coefficient may be very low, but the yellowness may be very high. Is higher than the range, the yellowness degree is very low, but the linear thermal expansion coefficient may increase.
  • the molar ratio of the PMDA in the first block structure to the BPDA in the second block structure is preferably 90 to 25:10 to 75, and more preferably 85 to 30:15 to 70.
  • the linear thermal expansion coefficient may be very low but the yellowness may be very high. If BPDA Is higher than the range, the yellowness degree of PMDA is lowered, but the linear thermal expansion coefficient may be increased.
  • the molar ratio of PMDA in the first block structure to 6FDA in the second block structure to BPDA in the second block structure is 90 to 50: 5 to 30: 5 to 20, More preferably from 55: 5 to 30: 5 to 15.
  • the block structure containing repeating units derived from bis TFDB and repeating units derived from at least one selected from 6FDA and BPDA may be a 9,9-bis (4-aminophenyl) fluorene, FDA ) And bis (4-fluoro-4-aminophenyl) fluorene (FFDA).
  • FDA 9,9-bis (4-aminophenyl) fluorene
  • FFDA bis (4-fluoro-4-aminophenyl) fluorene
  • At least one selected from the above FDA and FFDA is contained in an amount of 1 mol% to 20 mol%, preferably 1 to 10 mol, based on the total molar amount of diamine.
  • the content of the at least one selected from the above FDA and FFDA is out of the above range, the content is less than 1 mol% and the glass transition temperature may not be improved.
  • the content is more than 20 mol%, the yellowness and thermal expansion coefficient .
  • the method for producing the polyimide resin by imidizing the polyamic acid described above is not particularly limited, and conventionally known methods can be used.
  • As the imidization method of the polyamic acid a thermal imidation method, a chemical imidization method, a thermal imidation method and a chemical imidation method may be used in combination, and it is more preferable to use a heat imidation method. More preferably, the solution subjected to the chemical imidation method is subjected to precipitation, followed by purification, drying, and then dissolving in a solvent. This solvent is the same as the above-mentioned solvent.
  • a dehydrating agent represented by an acid anhydride such as acetic anhydride and a imidization catalyst represented by tertiary amines such as isoquinoline, p-picoline, and pyridine are applied to a polyamic acid solution.
  • the thermal imidation method can be used in combination with the chemical imidization method, and the heating conditions can be varied depending on the type of the polyamic acid solution, the thickness of the film, and the like.
  • a polyimide film made of the polyimide resin.
  • the polyimide film is obtained by imidizing the obtained polyamic acid solution, adding the imidized solution to a second solvent, precipitating, filtering and drying to obtain a solid component of the polyimide resin, 1 < / RTI > solvent dissolved in a solvent.
  • the above-mentioned polyamic acid is formed into a polyimide resin by a chemical imidization method, followed by precipitation, drying, dissolution in a solvent, and dissolution into a solvent to be applied to a support film.
  • the solution is filmed on the support by dry air and heat treatment.
  • the first solvent may be the same solvent as the solvent used in the polyamic acid solution polymerization.
  • the second solvent may be one having a lower polarity than that of the first solvent in order to obtain a solid content of the polyamic acid resin, Alcohols, ethers, and ketones.
  • the content of the second solvent is not particularly limited, but is preferably 5 to 20 times by weight of the polyamic acid solution.
  • the film-forming temperature condition of the applied film is preferably 250 to 500 ° C, and a glass plate, an aluminum foil, a circulating stainless belt, a stainless steel drum, or the like can be used.
  • the time required for film formation varies depending on the temperature, the type of the support, the amount of the applied polyamic acid solution, and the mixing conditions of the catalyst, and is not limited to a certain time. Preferably in a range of 5 minutes to 30 minutes.
  • the heat treatment temperature is in the range of 100 to 500 ° C. and the treatment time is 1 to 30 minutes. After the drying and imidization are completed by heat treatment, the support is peeled off.
  • the thickness of the obtained polyimide film is not particularly limited, but is preferably in the range of 10 to 250 ⁇ , more preferably 10 to 100 ⁇ .
  • polyimide of the present invention means a term that can include all polyimide-based polymers such as polyimide-amide.
  • the polyimide film produced in the present invention preferably has a coefficient of thermal expansion of 30 ppm / ° C or less at 50 to 350 ° C.
  • the polyimide film produced in the present invention preferably has a transmittance of 85% or more, preferably 90% or more at 550 nm when measuring the transmittance with a UV spectrometer based on a thickness of 10 to 100 ⁇ .
  • the polyimide film preferably has a yellowing degree of 10 or less, preferably 5 or less, based on a film thickness of 10 to 100 ⁇ .
  • NMP N-methyl-2-pyrrolidone
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • NMP N-methyl-2-pyrrolidone
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • Nitrogen was passed through a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, and 295.963 g of N-methyl-2-pyrrolidone (NMP) was charged. After 9.607 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Thereafter, 22.416 g of TFDB was further dissolved, and 15.268 g of PMDA was added thereto, followed by reaction for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained.
  • NMP N-methyl-2-pyrrolidone
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • NMP N-methyl-2-pyrrolidone
  • the obtained solution was coated on a glass plate, treated with hot air at 80 ° C for 20 minutes, reached 350 ° C, and was cured by isothermal treatment for 10 minutes. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • Nd, N-dimethylacetamide (DMAc) 283.076 g was charged into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, nitrogen was passed through the reactor and 13.450 g of TFDB was dissolved. And the mixture was stirred for 3 hours. After that, 23.825 g of TFDB and 1.384 g of FFDA were dissolved, and then 22.949 g of BPDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 20% by weight was obtained.
  • the obtained solution was coated on a glass plate, treated with hot air at 80 ° C for 20 minutes, reached 350 ° C, and was cured by isothermal treatment for 10 minutes. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • N-methyl-2-pyrrolidone (NMP) 288.638 was charged while passing nitrogen through a 500-ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 22.416 g of TFDB was dissolved, and PMDA 15.268 g, and the mixture was stirred for 3 hours. After that, 9.607 g of TFDB was further dissolved, and then 8.885 g of 6FDA was added and reacted for 3 hours. Finally, 2.942 g of BPDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained.
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • N-methyl-2-pyrrolidone (NMP) 288.638 was charged while passing nitrogen through a 500-ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 22.416 g of TFDB was dissolved, and PMDA 15.268 g, and the mixture was stirred for 3 hours. Then, 6.405 g of TFDB was further dissolved, and 8.885 g of 6FDA was added thereto, followed by reaction for 3 hours. Finally, after dissolving 3.202 g of TFDB, 2.942 g of BPDA was added and reacted for 15 hours.
  • NMP N-methyl-2-pyrrolidone
  • a polyamic acid solution having a solid concentration of 17 wt% was obtained.
  • the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
  • the transmittance was measured three times at 550 nm using a UV spectrometer (Kotikaminolta CM-3700d) and the average values are shown in Table 1.
  • Yellowness was measured according to ASTM E313 standard using a UV spectrometer (Konita Minolta, CM-3700d).
  • the linear thermal expansion coefficient at 50 ⁇ 350 ° C was measured twice using TMA (TA Instrument, Q400) according to the TMA method.
  • the size of the specimen was 4 mm ⁇ 24 mm, the load was 0.02 N, and the temperature raising rate was 10 ° C./min. Since the residual stress may remain in the film through the film formation and heat treatment, the residual stress is completely removed in the first run and the second value is presented as the measured value.
  • the PMDA content is preferably more than 65 mol% in order to have a linear thermal expansion coefficient of 30 ppm / DEG C or lower, and 90 mol %.
  • the same effect can be obtained by applying the second dianhydride to BPDA, and the linear thermal expansion coefficient can be improved by additionally adding TFDB even if FFDA is applied. It can be seen from Examples 3 and 4 that the improvement effect is greater when the first-input dianhydride is PMDA than when it is 6FDA. In Examples 7 and 8, it was confirmed that the linear thermal expansion coefficient was further improved as the amount of TFDB added in the tertiary dianhydride was increased.

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Abstract

La présente invention concerne un procédé de préparation d'acide polyamique, et de l'acide polyamique, une résine de polyimide et un film de polyimide ainsi fabriqués et, plus spécifiquement, le développement d'une composition de polyimide ayant un coefficient de dilatation thermique linéaire amélioré d'un film de polyimide fabriqué à partir de celle-ci par un changement apporté à un procédé d'injection fractionnée lors de l'injection d'un type de diamine.
PCT/KR2018/016671 2017-12-29 2018-12-26 Procédé de préparation d'acide polyamique, et acide polyamique, résine de polyimide et film de polyimide ainsi fabriqués WO2019132515A1 (fr)

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JP2020532593A JP6980919B2 (ja) 2017-12-29 2018-12-26 ポリアミック酸の製造方法、これから製造されたポリアミック酸、ポリイミド樹脂、及びポリイミドフィルム
JP2021187189A JP7206358B2 (ja) 2017-12-29 2021-11-17 ポリアミック酸の製造方法、これから製造されたポリアミック酸、ポリイミド樹脂、及びポリイミドフィルム

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CN114854012A (zh) * 2022-06-20 2022-08-05 杭州福斯特电子材料有限公司 聚酰亚胺树脂、聚酰亚胺膜及其制备方法、铜覆板
WO2024186087A1 (fr) * 2023-03-07 2024-09-12 Pi Advanced Materials Co., Ltd. Composition d'acide polyamique comprenant du fluor et film de polyimide préparé à partir de celle-ci

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