WO2021006429A1 - Composition d'acide polyamique, procédé de production d'une composition d'acide polyamique et polyimide la contenant - Google Patents

Composition d'acide polyamique, procédé de production d'une composition d'acide polyamique et polyimide la contenant Download PDF

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WO2021006429A1
WO2021006429A1 PCT/KR2019/014429 KR2019014429W WO2021006429A1 WO 2021006429 A1 WO2021006429 A1 WO 2021006429A1 KR 2019014429 W KR2019014429 W KR 2019014429W WO 2021006429 A1 WO2021006429 A1 WO 2021006429A1
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fluorine
polyamic acid
monomer
acid composition
dianhydride
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PCT/KR2019/014429
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English (en)
Korean (ko)
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황인환
이익상
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피아이첨단소재 주식회사
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Publication of WO2021006429A1 publication Critical patent/WO2021006429A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

  • the present application relates to a polyamic acid composition, a method of preparing a polyamic acid composition, and a polyimide comprising the same.
  • Polyimide (PI) is a polymer material with thermal stability based on a rigid aromatic backbone and has mechanical properties such as excellent strength, chemical resistance, weather resistance, and heat resistance based on the chemical stability of the imide ring.
  • Polyimide is applied to a wide range of industries such as electronics, communication, and optics due to its excellent electrical properties such as insulation properties and low dielectric constant, but implementing a dielectric constant below a certain level has technical limitations.
  • a fluorine-based particle was mixed with a polyimide resin as an additive to implement the dielectric properties, but in this case, the dielectric constant may be greatly reduced, but due to the compatibility and dispersibility problems with the polyimide resin, the heat resistance of the film And a problem of deteriorating mechanical properties. Therefore, it is an important technical task to provide a polyimide that simultaneously satisfies dielectric constant, heat resistance, and mechanical properties.
  • the present application provides a polyamic acid composition capable of simultaneously realizing mechanical properties under severe conditions such as low dielectric constant and high temperature, a method of preparing a polyamic acid composition, and a polyimide including the same.
  • the present application relates to a polyamic acid composition.
  • the polyamic acid composition of the present application includes a diamine monomer and a dianhydride monomer as a polymerization unit.
  • the polyamic acid composition of the present application may include a non-fluorine-based diamine monomer and a non-fluorine-based dianhydride monomer as a polymerization unit, and at least one of a fluorine-based diamine monomer and a fluorine-based dianhydride monomer as a polymerization unit.
  • the fact that the polyamic acid composition contains the monomer as a polymerized unit means a state in which a polymerization reaction has occurred between each monomer before curing with polyimide.
  • the polyamic acid composition may have a dielectric constant of 3.0 or less after curing, and may have a storage modulus of 300 MPa or more at 500° C. after curing.
  • the upper limit of the permittivity is not particularly limited, and may be 2.95, 2.93, 2.9, 2.88, 2.86, 2.84, 2.82, 2.8 or 2.78, and the lower limit of the permittivity may be 1 or 1.5.
  • the lower limit of the storage modulus at 500° C. may be 320 MPa, 350 MPa, 380 MPa, 400 MPa, 420 MPa, 450 MPa, 480 MPa, 500 MPa or 530 MPa, and the upper limit may be 1000 MPa or 700 MPa or less.
  • the polyamic acid composition may have a storage modulus of 3200 MPa or more at 100° C. after curing.
  • the lower limit of the storage modulus at 100° C. is not particularly limited, but may be 3300 MPa, 3350 MPa, 3400 MPa, 3500 MPa, 3800 MPa, 4000 MPa, 4200 MPa, 4500 MPa, 4700 MPa, or 4800 MPa or more
  • the upper limit of the storage modulus may be 10000 MPa or 7000 MPa or less.
  • the polyamic acid composition of the present application may provide a polyimide capable of simultaneously satisfying low dielectric constant, heat resistance, and mechanical properties at high temperature after curing by including the monomer.
  • the fluorine-based diamine monomer and the fluorine-based dianhydride monomer may refer to a monomer including a fluorine atom in a molecular structure.
  • the fluorine atom may be included in various positions and structures in the monomer, and this is not particularly limited.
  • the fluorine-based diamine monomer and the fluorine-based dianhydride monomer may include at least one perfluoroalkyl group in the molecular structure.
  • the perfluoroalkyl group may be, for example, a perfluoromethyl group.
  • the dielectric constant can be lowered without the additive without problems of compatibility and dispersibility of the particles, thereby improving heat resistance and mechanical properties. Can be implemented together.
  • the fluorine-based diamine monomer and the fluorine-based dianhydride monomer may not be polymerized with each other. That is, in the polyamic acid composition of the present application, the fluorine-based diamine monomer and the fluorine-based dianhydride monomer do not react with each other, and may not directly meet each other in the entire polymerization unit.
  • the dielectric constant was lowered using a fluorine-based additive, and the present invention uses a fluorine-based monomer, but there is a limit to sufficiently lowering the dielectric constant when only a fluorine-based monomer is used without a fluorine-based additive.
  • the dielectric constant may be sufficiently lowered, while heat resistance and mechanical properties may be achieved after curing.
  • the types of the fluorine-based diamine monomer and the fluorine-based dianhydride monomer of the present application are not particularly limited.
  • the fluorine-based diamine monomer and the fluorine-based dianhydride monomer may have two or more benzene rings.
  • the fluorine-based diamine monomer may have, for example, a perfluoroalkyl group by substituting hydrogen of the benzene ring.
  • the fluorine-based diamine monomer may have the aforementioned perfluoroalkyl group in an alkylene group connecting two benzene rings.
  • the fluorine-based dianhydride monomer may have a perfluoroalkyl group by substituting hydrogen of the benzene ring, and in one example, the perfluoroalkyl group described above in the alkylene group connecting the two benzene rings Can have
  • the fluorine-based diamine monomer may be included in the range of 45 to 98 mol%, 48 to 95 mol%, or 49 to 92 mol% based on 100 mol% of the total diamine monomer.
  • the fluorine-based dianhydride monomer may be included in the range of 5 to 60 mol%, 8 to 57 mol%, or 9 to 55 mol% based on 100 mol% of the dianhydride monomer.
  • the total content of the fluorine-based diamine monomer and the fluorine-based dianhydride monomer is 20 to 70 mol%, 23 to 60 mol%, 30 to 58 mol%, 35 to 55 mol%, or It may be included in a proportion of 42 to 53 mol%.
  • the present application can implement excellent dielectric properties, heat resistance, and mechanical properties of the polyimide after curing by adjusting the content ratio of the monomer.
  • the polyamic acid composition may have the same meaning as the polyamic acid solution.
  • the dianhydride monomer that can be used in the preparation of the polyamic acid solution may be an aromatic tetracarboxylic dianhydride, and the aromatic tetracarboxylic dianhydride is pyromellitic dianhydride (or PMDA), 3,3 ',4,4'-biphenyltetracarboxylic dianhydride (or BPDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (or a-BPDA), oxydiphthalic Dianhydride (or ODPA), diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride (or DSDA), bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2 ,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophen
  • the dianhydride monomer may be used alone or in combination of two or more as necessary, but the present application considers the aforementioned bond dissociation energy, for example, pyromellitic dianhydride (PMDA), 3, 3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) or 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA).
  • PMDA pyromellitic dianhydride
  • s-BPDA 3, 3',4,4'-biphenyltetracarboxylic dianhydride
  • a-BPDA 2,3,3',4'-biphenyltetracarboxylic dianhydride
  • the diamine monomer that can be used for preparing the polyamic acid solution is an aromatic diamine, and is classified as follows and examples thereof are given.
  • 1,4-diaminobenzene or paraphenylenediamine, PDA
  • 1,3-diaminobenzene 2,4-diaminotoluene
  • 2,6-diaminotoluene 3,5-diaminobenzo
  • a diamine having one benzene nucleus in structure such as an acid acid (or DABA)
  • a diamine having a relatively rigid structure such as an acid acid (or DABA)
  • Diaminodiphenyl ether such as 4,4'-diaminodiphenyl ether (or oxydianiline, ODA), 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane (Methylenediamine), 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2'-bis (trifluoromethyl )-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-dicarboxy-4,4'-diaminodiphenylmethane , 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, bis(4-aminophenyl)sulfide, 4,4'-diaminobenz
  • the diamine monomer may be used alone or in combination of two or more, as needed, and the present application considers the aforementioned bond dissociation energy, for example, 1,4-diaminobenzene (PPD), 1,3 -Diaminobenzene (MPD), 2,4-diaminotoluene, 2,6-diaminotoluene or 4,4'-methylenediamine (MDA).
  • PPD 1,4-diaminobenzene
  • MPD 1,3 -Diaminobenzene
  • MDA 4,4'-methylenediamine
  • the polyamic acid composition may contain 15 to 40% by weight of solids based on the total weight.
  • the solid content of the polyamic acid composition it is possible to control an increase in viscosity and prevent an increase in manufacturing cost and processing time, which requires removing a large amount of solvent during the curing process.
  • the polyamic acid composition of the present application may be a composition having low viscosity characteristics.
  • the polyamic acid composition of the present application may have a viscosity of 10,000 cP or less and 9,000 cP or less, measured under conditions of a temperature of 23° C. and a shear rate of 1 s -1 .
  • the lower limit is not particularly limited, but may be 500 cP or more or 1000 cP or more.
  • the viscosity may be measured using, for example, Haake's Rheostress 600, and may be measured under conditions of a shear rate of 1/s, a temperature of 23° C., and a 1 mm plate gap.
  • the present application provides a precursor composition having excellent processability by adjusting the viscosity range, so that a film or substrate having desired physical properties can be formed when forming a film or substrate.
  • the polyamic acid composition of the present application has a weight average molecular weight of 10,000 to 100,000 g/mol, 15,000 to 80,000 g/mol, 18,000 to 70,000 g/mol, 20,000 to 60,000 g/mol, 25,000 to 55,000 g after curing /mol or 30,000 to 50,000 g/mol.
  • weight average molecular weight means a value converted to standard polystyrene measured by GPC (Gel permeation Chromatograph).
  • the polyamic acid composition may include an organic solvent.
  • the organic solvent is not particularly limited as long as it is an organic solvent in which polyamic acid can be dissolved, but may be an aprotic polar solvent as an example.
  • the aprotic polar solvent is, for example, N,N'-dimethylformamide (DMF), N,N'-diethylformamide (DEF), N,N'-dimethylacetamide (DMAc), dimethylpropane.
  • Amide solvents such as amide (DMPA), phenolic solvents such as p-chlorophenol and o-chlorophenol, N-methyl-pyrrolidone (NMP), gamma butyrolactone (GBL) and Diglyme, etc. And these may be used alone or in combination of two or more.
  • the solubility of polyamic acid may be adjusted by using an auxiliary solvent such as toluene, tetrahydrofuran, acetone, methyl ethyl ketone, methanol, ethanol, and water in some cases.
  • an auxiliary solvent such as toluene, tetrahydrofuran, acetone, methyl ethyl ketone, methanol, ethanol, and water in some cases.
  • the organic solvent may be, for example, N-methyl-pyrrolidone (NMP).
  • the polyamic acid composition of the present application may include a filler for the purpose of improving various properties of the film such as sliding property, thermal conductivity, conductivity, corona resistance, and loop hardness.
  • the filler to be added is not particularly limited, and examples thereof include silica, titanium oxide, alumina, silicon nitride, boron nitride, calcium hydrogen phosphate, calcium phosphate, and mica.
  • the particle diameter of the filler is not particularly limited, and may be determined according to the characteristics of the film to be modified and the type of filler to be added.
  • the average particle diameter may be 0.05 to 20 ⁇ m, 0.1 to 10 ⁇ m, 0.1 to 5 ⁇ m, or 0.1 to 3 ⁇ m. In the present specification, the average particle diameter may be an average particle diameter measured according to D50 particle size analysis unless otherwise specified.
  • the modification effect may be sufficiently maintained, and the surface properties may not be impaired and the mechanical properties may not be deteriorated.
  • the present application is not particularly limited to the amount of the filler added, and may be determined by film properties to be modified or the particle diameter of the filler.
  • the amount of the filler added may be 0.01 to 10 parts by weight, 0.01 to 5 parts by weight, or 0.02 to 1 part by weight based on 100 parts by weight of the polyimide resin. According to the present application, by adjusting the content, the mechanical properties of the film may not be damaged while sufficiently maintaining the modifying effect of the filler.
  • the method of adding the filler is not particularly limited, and a method known in the same industry may be used.
  • the present application also relates to a method for preparing a polyamic acid composition.
  • the manufacturing method may be a manufacturing method of the above-described polyamic acid composition.
  • the manufacturing method includes a first step of polymerizing two non-fluorine-based dianhydride monomers in both amine groups of the fluorine-based diamine monomer; A second step of further polymerizing a non-fluorine-based diamine monomer to the polymerized non-fluorine-based dianhydride monomer and a third step of additionally polymerizing a fluorine-based or non-fluorine-based dianhydride monomer to the polymerized non-fluorine-based diamine monomer can do.
  • the manufacturing method of the present application includes a first step of polymerizing two non-fluorine-based diamine monomers in both anhydride groups of the fluorine-based dianhydride monomer; A second step of further polymerizing a non-fluorine-based dianhydride monomer to the polymerized non-fluorine-based diamine monomer, and a third step of additionally polymerizing a fluorine-based or non-fluorine-based diamine monomer to the polymerized non-fluorine-based dianhydride monomer.
  • the present application makes it possible to prevent the fluorine-based diamine monomer and the fluorine-based dianhydride monomer from reacting with each other through the three-step polymerization step, thereby achieving excellent dielectric constant and heat resistance and mechanical properties.
  • the second step which proceeds following the first step of polymerizing two non-fluorine-based dianhydride monomers in both amine groups of the fluorine-based diamine monomer, comprises two It may include that the non-fluorine-based diamine monomer is polymerized.
  • the third step may include polymerization of two fluorine-based or non-fluorine-based dianhydride monomers to the two non-fluorine-based diamine monomers.
  • the production method may include further polymerization of the polymerization unit polymerized up to the second step in the two fluorine-based or non-fluorine-based dianhydride monomers.
  • the polymerized units polymerized up to the second step may be connected to each other through a fluorine-based or non-fluorine-based dianhydride.
  • the present application can simultaneously implement low dielectric properties, heat resistance and mechanical properties by controlling the polymerization method and the polymerization sequence generated thereby.
  • two non-fluorine-based dianhydride monomers are polymerized on two non-fluorine-based diamine monomers.
  • two fluorine-based or non-fluorine-based diamine monomers may be polymerized on two non-fluorine-based dianhydride monomers.
  • a polymerization unit polymerized up to the second step may be further polymerized on the two fluorine-based or non-fluorine-based diamine monomers.
  • the polymerized units polymerized up to the second step may be connected to each other through a fluorine-based or non-fluorine-based diamine monomer.
  • the present application can simultaneously implement low dielectric properties, heat resistance and mechanical properties by controlling the polymerization method and the polymerization sequence generated thereby.
  • the total amount of the diamine monomer is put in a solvent, and then the dianhydride monomer is added so as to be substantially equimolar or excessive with the diamine monomer to perform polymerization or the total amount of the dianhydride monomer.
  • a diamine monomer and a dianhydride monomer are added so as to be substantially equimolar or in excess, followed by polymerization.
  • This method can also be used in the manufacturing method of the present application.
  • the present application also relates to a polyimide that is a cured product of the polyamic acid composition.
  • the polyimide may be a cured product of the above-described polyamic acid composition or a precursor composition prepared by the method of manufacturing the same.
  • the present application may be a polyimide film including the polyimide in a film or sheet form.
  • the present application relates to a method of manufacturing a polyimide film.
  • the present application comprises the steps of preparing a gel film by forming a film of the polyamic acid composition on a support and drying it; And it may provide a method for producing a polyimide film comprising the step of curing the gel film.
  • a conventionally known method may be used for a method of imidizing the above polyamic acid composition to prepare a polyimide film.
  • the present application provides a polyamic acid composition capable of simultaneously realizing mechanical properties under severe conditions such as low dielectric constant and high temperature, a method of preparing a polyamic acid composition, and a polyimide including the same.
  • NMP N-methyl-pyrrolidone
  • APHF 2,2- Bis(4-aminophenyl)hexafluoropropane
  • BPDA Biphenyl-3,4,3',4'-tetracarbonic dianhydride
  • BAPP 2,2-Bis[4-(4-aminophenoxy)phenyl]propane
  • BAPP 2,2-Bis[4-(4-aminophenoxy)phenyl]propane
  • 6-FDA 2,2-bis(3,4-anhydrodicarboxyphenyl) hexafluoropropane
  • 6-FDA 2,2-bis(3,4-anhydrodicarboxyphenyl) hexafluoropropane
  • stirring was continued for 2 hours while heating by raising the temperature to 80° C. in a nitrogen atmosphere.
  • the polymerization reaction was carried out to prepare a polyamic acid solution.
  • Example 1 the polyamic acid compositions of Examples 2 to 4 and 6 were prepared in the same manner as in Example 1, except that the monomer and the content ratio thereof were changed as shown in Table 1 below.
  • Comparative Examples 1 to 4 and 6 are polyamic acid in the same manner as in Example 1, except that the monomers and their contents were changed as shown in Table 1 below, and two diamine monomers and two dianhydride monomers were added at the same time. The composition was prepared.
  • NMP N-methyl-pyrrolidone
  • Air bubbles were removed from the polyamic acid composition prepared in the above Examples and Comparative Examples by rotating at a high speed of 1,500 rpm or more. Thereafter, the defoamed polyamic acid composition was applied to the glass substrate using a spin coater. Thereafter, a gel film was prepared by drying in a nitrogen atmosphere and at a temperature of 120° C. for 30 minutes, and the gel film was heated to 450° C. at a rate of 2° C./min, heat-treated at 450° C. for 60 minutes, and then until 30° C. The polyimide film was obtained by cooling at a rate of 2° C./min. Thereafter, the polyimide film was separated from the glass substrate by dipping in distilled water. The physical properties of the prepared polyimide film were measured using the following method, and the results are shown in Table 2 below.
  • the thickness of the prepared polyimide film was measured using an Anritsu's Electric Film thickness tester.
  • DMA dynamic mechanical analysis
  • the film was held in tension and multi-frequency-strain mode with a rectangular specimen 20 mm wide, 0.01 to 0.03 mm thick and a 10 mm long sample in the MD direction with a 0.33 N-m (3 in-lb) torque force.
  • the static force in the longitudinal direction was 0.1 N, at which time the autotension was 125%.
  • the film was heated from 0°C to 500°C at a rate of 5°C/min at a frequency of 1 Hz.
  • the storage modulus at 100° C. and 500° C. are reported in the table.
  • the dielectric constant and dielectric loss tangent at 1 GHz of the polyimide films prepared in the above Examples and Comparative Examples were measured using an SPDR meter of Keysight. As a result, the measured dielectric constant and dielectric loss tangent are shown in Table 2 below.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

La présente invention concerne une composition d'acide polyamique, un procédé de production de la composition d'acide polyamique, et un polyimide contenant la composition d'acide polyamique. L'invention concerne : une composition d'acide polyamique pouvant obtenir une faible permittivité et une faible résistance à la chaleur, ainsi que des propriétés mécaniques suffisantes dans des conditions difficiles telles que des températures élevées ; un procédé de production de la composition d'acide polyamique ; et un polyimide contenant la composition d'acide polyamique.
PCT/KR2019/014429 2019-07-05 2019-10-30 Composition d'acide polyamique, procédé de production d'une composition d'acide polyamique et polyimide la contenant WO2021006429A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
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KR20070017001A (ko) * 2005-08-03 2007-02-08 이 아이 듀폰 디 네모아 앤드 캄파니 광학 타입 분야에 유용한 저색상 폴리이미드 조성물 및이와 관련된 방법 및 조성물
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