WO2021068316A1 - 一种显示面板及其制作方法 - Google Patents

一种显示面板及其制作方法 Download PDF

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Publication number
WO2021068316A1
WO2021068316A1 PCT/CN2019/115577 CN2019115577W WO2021068316A1 WO 2021068316 A1 WO2021068316 A1 WO 2021068316A1 CN 2019115577 W CN2019115577 W CN 2019115577W WO 2021068316 A1 WO2021068316 A1 WO 2021068316A1
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WO
WIPO (PCT)
Prior art keywords
transparent substrate
layer
sealant
display panel
protective layer
Prior art date
Application number
PCT/CN2019/115577
Other languages
English (en)
French (fr)
Inventor
赵念
朱清永
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Filing date
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/620,924 priority Critical patent/US20220229321A1/en
Publication of WO2021068316A1 publication Critical patent/WO2021068316A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133357—Planarisation layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements

Definitions

  • the present application relates to the technical field of display panels, and in particular to a display panel and a manufacturing method thereof.
  • the existing COA (Color Filter on Array) type panel through a kind of PFA (Polymer Film on Array) process, covering the R/G/B color resist with a flat protective layer of transparent organic material to replace the original inorganic material (SiNx), which not only saves chemical vapor deposition (CVD, Chemical) in the process Vapol Deposition) and stripping (Stripper) steps, and can also flatten R/G/B color resist terrain, improve the coating characteristics of the process; at the same time, the role of the sealant in the panel is to use its adhesion to move the cell up and down.
  • Two glass separation substrates ie, the first transparent substrate and the second transparent substrate
  • the gap between the first transparent substrate and the second transparent substrate in the panel is small due to the presence of a flat protective layer.
  • the cross-sectional area of the sealant is fixed. The smaller the gap, the wider the width of the sealant, which makes the panel unable to meet the demand for narrow frames. There is an urgent need to improve the sealant width in the panel structure to cope with the narrowness.
  • the embodiments of the present application provide a display panel and a manufacturing method thereof to solve the problem that in the existing panel structure, due to the presence of a flat protective layer in the sealant coating area, the gap between the sealant coating is shortened, and the sealant width cannot be adapted.
  • the embodiment of the present application provides a display panel including a seal area
  • the display panel includes a first transparent substrate and a second transparent substrate disposed oppositely, a flat protective layer is provided between the first transparent substrate and the second transparent substrate, and the flat protective layer is formed in the sealant area. Hollowed part, between the first transparent substrate and the second transparent substrate, a sealant located in the sealant area is provided, and the sealant extends into the hollowed part so that the first transparent substrate and the second transparent substrate The transparent substrate is fixed by the sealant.
  • a TFT layer is provided on the side of the first transparent substrate close to the second transparent substrate, and a passivation protection is provided on the side of the TFT layer close to the second transparent substrate.
  • the flat protective layer is disposed on the passivation protective layer, and the sealant is disposed between the passivation protective layer and the second transparent substrate.
  • the display panel further includes a color resist layer, a conductive layer and a liquid crystal layer located in the inner area of the sealant, and the color resist layer is provided on the passivation protection layer,
  • the flat protective layer is disposed on the color resist layer and the passivation protective layer and covers the color resist layer
  • the conductive layer is disposed on the flat protective layer
  • the liquid crystal layer is disposed on the conductive layer.
  • the conductive layer includes a pixel electrode
  • the drain in the TFT layer is provided with a via hole that sequentially passes through the passivation protective layer, the color resist layer, and the flat protective layer.
  • the pixel electrode passes through the via hole and is electrically connected to the drain.
  • the via hole includes a first via hole disposed on the passivation protection layer, a second via hole disposed on the color resist layer and corresponding to the first via hole, And a third via hole disposed on the flat protection layer and corresponding to the second via hole.
  • the pixel electrode sequentially passes through the third via hole, the second via hole, and the first via hole and is electrically connected to the drain electrode.
  • a black matrix is provided on a side of the second transparent substrate close to the first transparent substrate, and the sealant is disposed between the passivation protection layer and the black matrix.
  • the width of the sealant is 300um-400um.
  • the height of the sealant is 5um-7um.
  • a manufacturing method of a display panel including:
  • the flat protective layer is formed with a hollow portion in the sealant area
  • a sealant located in the sealant area is formed between the first transparent substrate and the second transparent substrate, and the sealant extends into the hollow portion so that the first transparent substrate and the second transparent substrate It is fixed by the frame glue.
  • the method before forming a flat protective layer between the first transparent substrate and the second transparent substrate, the method further includes:
  • a TFT layer is formed on the first transparent substrate, a passivation protection layer is formed on the TFT layer, a first via hole is formed on the passivation protection layer, and the flat protection layer is formed on the passivation protection layer. The side of the layer away from the TFT layer.
  • the method before forming the sealant located in the sealant area between the first transparent substrate and the second transparent substrate, the method further includes:
  • a third via corresponding to the first via is formed on the flat protection layer, a conductive layer is formed on the flat protection layer, and the conductive layer passes through the first via and the second The three via holes are electrically connected to the drain of the TFT layer.
  • the method before forming a flat protective layer between the first transparent substrate and the second transparent substrate, the method further includes:
  • a color resist layer is formed on the passivation protective layer, and a second via corresponding to the first via is formed on the color resist layer; the flat protective layer is formed on the color resist layer and On the passivation protection layer and covering the color resist layer, the conductive layer passes through the first via hole, the second via hole, and the third via hole and is electrically connected to the drain electrode of the TFT layer connection.
  • the beneficial effect of the present application is that the present application reduces the thickness of the original flat protective layer in the sealant coating area by removing part of the flat protective layer in the frame seal area of the display panel in the existing structure, thereby increasing the first transparency.
  • the space required to be sealed between the substrate and the second transparent substrate increases the coating space required for the sealant, thereby narrowing the width of the sealant, and realizing the market's demand for narrow bezels; at the same time, the manufacturing method of the present application adopts The change of the structure of the flat protective layer realizes the narrowing of the frame of the display panel on the basis of ensuring that the ejection volume and speed parameters of the frame glue remain unchanged in the original frame glue coating process.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic block diagram of a process flow of a manufacturing method of a display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic block diagram of the flow of another method for manufacturing a display panel provided by an embodiment of the application.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the specific meanings of the above-mentioned terms in this application can be understood under specific circumstances.
  • an embodiment of the present application provides a display panel including a sealant area 10;
  • the display panel 1 includes a first transparent substrate 100 and a second transparent substrate 200 disposed oppositely, a flat protection layer 300 is provided between the first transparent substrate 100 and the second transparent substrate 200, and the flat protection layer 300 is
  • the sealant area 10 is formed with a hollow portion 310, and a sealant 400 located in the sealant area 10 is provided between the first transparent substrate 100 and the second transparent substrate 200, and the sealant 400 extends to the entire area.
  • the first transparent substrate 100 and the second transparent substrate 200 are fixed by the sealant 400.
  • the technical solution of the present application hollows out a portion of the flat protective layer corresponding to the sealant area to form a hollow portion 310, thereby increasing the required sealing distance between the first transparent substrate 100 and the second transparent substrate 200.
  • this method is suitable for use in a variety of panel structures similar to a flat protective layer extending into the sealant area 10.
  • this embodiment uses COA (Color The Filter on Array) type panel is taken as an example for specific description.
  • the flat protective layer 300 is formed with a hollow portion 310 in the sealant area 10, and a sealant located in the sealant area 10 is provided between the first transparent substrate 100 and the second transparent substrate 200 400.
  • the sealant 400 extends into the hollow portion 310.
  • the flat protective layer 300 is located in the inner area sealed and fixed by the sealant 400. Specifically, it may be connected to the frame
  • the glue 400 has a certain interval, and may also be other structural forms that satisfy the requirement that the flat protective layer 300 has a hollow portion 310 formed in the frame glue area 10, which is not limited here.
  • a TFT layer 500 is provided on the side of the first transparent substrate 100 close to the second transparent substrate 200, and a passivation is provided on the side of the TFT layer 500 close to the second transparent substrate 200.
  • the protection layer 600, the flat protection layer 300 is disposed on the passivation protection layer 600, and the sealant 400 is disposed between the passivation protection layer 600 and the second transparent substrate 200.
  • the flat protective layer 300 is hollowed out in the sealant area 10, so that the frame The height of the glue 400 is increased, and the width of the glue 400 is narrowed on the basis of ensuring that the amount and speed of the glue in the original glue coating process remain unchanged, and the narrow frame of the display panel is realized; specifically, The width of the sealant 400 is 300um ⁇ 400um; the height of the sealant 400 is 5um ⁇ 7um.
  • the TFT layer 500 includes a gate electrode 510, a source electrode 520, a drain electrode 530, a gate protection layer 540, and a metal wiring layer 550. The specific structure is shown in FIG. 1 and all are in the prior art. , I won’t repeat it here.
  • the display panel 1 further includes a color resist layer 700, a conductive layer 800, and a liquid crystal layer 900 located in the inner area of the sealant 400, and the color resist layer 700 is provided on the passivation protection layer.
  • the flat protective layer 300 is provided on the color resist layer 700 and the passivation protective layer 600 and covers the color resist layer 700
  • the conductive layer 800 is provided on the flat protective layer 300
  • the liquid crystal layer 900 is disposed on the conductive layer 800.
  • the conductive layer 800 includes a pixel electrode 810, and the drain electrode 530 in the TFT layer 500 is provided with a passivation protection layer 600, a color resist layer 700, and a flat protection layer 300 above the drain electrode 530. Via 20, the pixel electrode 810 passes through the via 20 and is electrically connected to the drain 530.
  • a black matrix 210 is provided on the side of the second transparent substrate 200 close to the first transparent substrate 100, and the sealant 400 is disposed between the passivation protection layer 600 and the black matrix 210 Obviously, in the sealant structure of a variety of panels, the combined form of the sealant 400 and the black matrix 210 belongs to a conventional structure and will not be described in detail here.
  • the present application reduces the thickness of the original flat protective layer in the sealant coating area by removing part of the flat protective layer in the frame seal area of the display panel in the existing structure, thereby increasing the first transparent substrate and The required sealing interval between the second transparent substrates increases the required coating interval of the sealant, thereby narrowing the width of the sealant, and realizing the market's demand for narrow bezels.
  • FIG. 2 there is also provided a manufacturing method of a display panel, including:
  • Step S1 providing a first transparent substrate 100 and a second transparent substrate 200 that are arranged oppositely, and the display panel 1 includes a sealant area 10;
  • Step S2 forming a flat protective layer 300 between the first transparent substrate 100 and the second transparent substrate 200, the flat protective layer 300 has a hollow portion 310 formed in the sealant area 10;
  • Step S3 a sealant 400 located in the sealant area 10 is formed between the first transparent substrate 100 and the second transparent substrate 200, and the sealant 400 extends into the hollow portion 310 so that The first transparent substrate 100 and the second transparent substrate 200 are fixed by the sealant 400.
  • the method before forming the flat protective layer 300 between the first transparent substrate 100 and the second transparent substrate 200, the method further includes:
  • a TFT layer 500 is formed on the first transparent substrate 100, a passivation protection layer 600 is formed on the TFT layer 500, a first via 21 is formed on the passivation protection layer 600, and the flat protection layer 300 Formed on the side of the passivation protection layer 600 away from the TFT layer 500;
  • the method further includes:
  • a third via 23 corresponding to the first via 21 is formed on the flat protection layer 300, and a conductive layer 800 is formed on the flat protection layer 300 so that the conductive layer 800 passes through the first
  • the via 21 and the third via 23 are electrically connected to the drain 530 of the TFT layer 500.
  • the method before forming the flat protective layer 300 between the first transparent substrate 100 and the second transparent substrate 200, the method further includes:
  • a color resist layer 700 is formed on the passivation protection layer 600, and a second via hole 22 corresponding to the first via hole 21 is formed on the color resist layer 700; the flat protection layer 300 is formed on The color resist layer 700 and the passivation protection layer 600 are on and cover the color resist layer 700, and the conductive layer 800 passes through the first via 21, the second via 22 and the third The via 23 is electrically connected to the drain 530 of the TFT layer 500.
  • the third via 23 and the hollow portion 310 formed on the flat protective layer 300 can be formed by the same patterning process; specifically, through exposure and development, in this process, the flat protective layer 300 can be formed.
  • the area of the part removed near the sealant 400 is larger than the area of the hollow portion 310.
  • the manufacturing methods of other functional layers are all existing technologies. No longer.
  • FIG. 3 specifically, it includes:
  • Step S10 providing a first transparent substrate 100, on which the TFT layer 500, the passivation protection layer 600, the color resist layer 700, the flat protection layer 300 with the hollow portion 310, and the conductive layer are sequentially formed on the first transparent substrate 100 800.
  • a sealant 400 is formed on the passivation protection layer 600 corresponding to the sealant area 10;
  • Step S20 providing a second transparent substrate 200, and forming a black matrix 210 on the second transparent substrate 200;
  • step S30 the side of the second transparent substrate 200 close to the black matrix 210 is buttly sealed to the sealant 400.
  • the via hole 20 also includes the production of the via hole 20.
  • the specific steps are that after the passivation protection layer 600 is produced, a patterning process is performed, such as the steps of coating photoresist, developing and etching in sequence,
  • the first via hole 21 is formed on the passivation protection layer 600; then, after the color resist layer 700 is fabricated, the second via hole 22 may be formed on the color resist layer 700 by exposure and development; and finally After the flat protective layer 300 is fabricated, the third via 23 may be formed on the flat protective layer 300 by exposure and development.
  • the first via 21, the second via 22 and The third via 23 constitutes the via 20 in the foregoing structure.
  • a conductive layer 800 is subsequently fabricated.
  • the conductive layer 800 is electrically connected to the drain 530 of the TFT layer 500 through the first via 21, the second via 22, and the third via 23. The steps of connection and other methods will not be repeated.
  • the passivation protective layer, the color resist layer, the second via, the flat protective layer, the third via, and finally the first via are prepared in the order
  • the original flat protective layer that does not need to be hollowed out can be used as a mask for etching.
  • the flat protective layer is hollowed out in the sealant area 10, according to the existing In the process flow, in the process of forming the first via hole, it is easy to etch part of the passivation protection layer in the sealant area 10, so that the metal wiring layer 550 of the TFT layer 500 is exposed, resulting in a short circuit; therefore, the present application
  • the first via 21 is directly formed on the passivation protection layer to avoid the aforementioned situation.
  • the manufacturing method of the present application achieves a narrow frame of the display panel by changing the structure of the flat protective layer, while ensuring that the ejection volume and speed parameters of the original sealant coating process remain unchanged. ; Moreover, by adjusting the process, the problem of exposure of the metal wiring layer due to the change of the flat protective layer structure is avoided.
  • the present application reduces the thickness of the original flat protective layer in the sealant coating area by removing part of the flat protective layer in the frame seal area of the display panel in the existing structure, thereby increasing the first transparent substrate and the second transparent substrate.
  • the space required to be sealed between the transparent substrates increases the coating space required for the sealant, thereby narrowing the width of the sealant, and realizing the market's demand for narrow bezels; at the same time, the manufacturing method of the present application adopts a flat protective layer structure
  • the change of the frame size of the display panel realizes the narrowing of the frame of the display panel on the basis of ensuring that the frame size and speed parameters remain unchanged in the original frame size coating process.

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Abstract

一种显示面板（1）及其制作方法，显示面板（1）包括相对设置的第一透明基板（100）和第二透明基板（200），第一透明基板（100）与第二透明基板（200）之间设有平坦保护层（300），平坦保护层（300）在框胶区（10）形成有镂空部（310），第一透明基板（100）与第二透明基板（200）之间设有位于框胶区（10）内的框胶（400），框胶（400）延伸至镂空部（310）内，使第一透明基板（100）和第二透明基板（200）通过框胶（400）固定。

Description

一种显示面板及其制作方法 技术领域
本申请涉及显示面板技术领域，尤其涉及一种显示面板及其制作方法。
 背景技术
现有的COA（Color Filter on Array）型面板中，通过一种PFA（Polymer Film on Array）工艺，在R/G/B色阻上覆盖一种透明有机材料的平坦保护层，以取代原有的无机材料（SiNx），不仅在制程上可节省化学气相沉积（CVD ,Chemical Vapol Deposition）和剥离(Stripper)的步骤，而且还可平坦R/G/B色阻地形，改善制程涂布特性；同时，面板中框胶（sealant）的作用是利用其黏着性将Cell中上下两片玻离基板（即第一透明基板和第二透明基板）组合固定，保护液晶不和外界水气及杂质接触，防止液晶外流和撑住面板边缘间隙。
 技术问题
现有采用PFA的面板结构，在框胶（sealant）涂布区，由于平坦保护层的存在导致面板中第一透明基板和第二透明基板两基板间的间隙较小，而现有制作工艺对框胶吐出的截面积是固定的，间隙gap越小，框胶宽度越宽，使得该面板无法适应对窄边框的需求；现急需一种改善面板结构中框胶（sealant）宽度，以应对窄边框需求的结构和方法。
 技术解决方案
本申请实施例提供一种显示面板及其制作方法，以解决现有面板结构中，在框胶涂布区由于平坦保护层的存在，缩短了框胶涂布的间隙，导致框胶宽度无法适应窄边框需求的问题。
本申请实施例提供了一种显示面板，包括框胶区；
所述显示面板包括相对设置的第一透明基板和第二透明基板，所述第一透明基板与第二透明基板之间设有平坦保护层，所述平坦保护层在所述框胶区形成有镂空部，所述第一透明基板与第二透明基板之间设有位于所述框胶区内的框胶，所述框胶延伸至所述镂空部内，使所述第一透明基板和第二透明基板通过所述框胶固定。
在本申请实施例的显示面板中，所述第一透明基板靠近所述第二透明基板的一侧设有TFT层，所述TFT层靠近所述第二透明基板的一侧设有钝化保护层，所述平坦保护层设于所述钝化保护层上，所述框胶设置于所述钝化保护层与第二透明基板之间。
在本申请实施例的显示面板中，所述显示面板还包括位于所述框胶内侧区域内的色阻层、导电层和液晶层，所述色阻层设于所述钝化保护层上，所述平坦保护层设于所述色阻层及所述钝化保护层上且覆盖所述色阻层，所述导电层设于所述平坦保护层上，所述液晶层设于所述导电层上。
在本申请实施例的显示面板中，所述导电层包括像素电极，所述TFT层中的漏极上方设有依次穿过所述钝化保护层、色阻层和平坦保护层的过孔，所述像素电极穿过所述过孔与所述漏极电性连接。
在本申请实施例的显示面板中，所述过孔包括设置于钝化保护层上的第一过孔、设置于色阻层上并与所述第一过孔相对应的第二过孔、及设置于平坦保护层上并与所述第二过孔相对应的第三过孔。
在本申请实施例的显示面板中，所述像素电极依次穿过所述第三过孔、第二过孔和第一过孔与所述漏极电性连接。
在本申请实施例的显示面板中，所述第二透明基板靠近所述第一透明基板的一侧设有黑色矩阵，所述框胶设置于所述钝化保护层与黑色矩阵之间。
在本申请实施例的显示面板中，所述框胶的宽度为300um～400um。
在本申请实施例的显示面板中，所述框胶的高度为5um～7um。
根据本发明的上述目的，还提供一种显示面板的制作方法，包括：
提供一相对设置的第一透明基板和第二透明基板，所述显示面板包括框胶区；
在所述第一透明基板与第二透明基板之间形成平坦保护层，所述平坦保护层在所述框胶区形成有镂空部；以及
在所述第一透明基板与第二透明基板之间形成位于所述框胶区内的框胶，所述框胶延伸至所述镂空部内，以使所述第一透明基板和第二透明基板通过所述框胶固定。
在本申请实施例显示面板的制作方法中，所述在所述第一透明基板与第二透明基板之间形成平坦保护层之前还包括：
在所述第一透明基板上形成TFT层，在所述TFT层上形成钝化保护层，在所述钝化保护层上形成第一过孔，所述平坦保护层形成于所述钝化保护层远离所述TFT层的一侧。
在本申请实施例显示面板的制作方法中，所述在所述第一透明基板与第二透明基板之间形成位于所述框胶区内的框胶之前还包括：
在所述平坦保护层上形成与所述第一过孔相对应的第三过孔，在所述平坦保护层上形成导电层，使所述导电层通过所述第一过孔和所述第三过孔与所述TFT层的漏极电性连接。
在本申请实施例显示面板的制作方法中，所述在所述第一透明基板与第二透明基板之间形成平坦保护层之前还包括：
在所述钝化保护层上形成色阻层，并在所述色阻层上形成与所述第一过孔相对应的第二过孔；所述平坦保护层形成于所述色阻层及所述钝化保护层上且覆盖所述色阻层，所述导电层通过所述第一过孔、所述第二过孔和所述第三过孔与所述TFT层的漏极电性连接。
 有益效果
本申请的有益效果为：本申请通过将现有结构中位于显示面板框胶区内的部分平坦保护层去除，减少了框胶涂布区内原有平坦保护层的厚度，从而增加了第一透明基板与第二透明基板之间所需密封的间距，使得框胶所需涂布间距增大，从而使框胶的宽度变窄，实现市场对窄边框需求；同时，本申请的的制作方法通过平坦保护层结构的改变，在保证原有框胶涂布工艺中框胶吐出量和速度参数不变的基础上，实现了显示面板的窄边框化。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种显示面板的结构示意图；
图2为本申请实施例提供的一种显示面板的制作方法的流程示意框图；及
图3为本申请实施例提供的又一种显示面板的制作方法的流程示意框图。
 本发明的实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用来描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用来描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和实施例对本申请作进一步说明。
如图1所示，本申请实施例提供了一种显示面板，包括框胶区10；
所述显示面板1包括相对设置的第一透明基板100和第二透明基板200，所述第一透明基板100与第二透明基板200之间设有平坦保护层300，所述平坦保护层300在所述框胶区10形成有镂空部310，所述第一透明基板100与第二透明基板200之间设有位于所述框胶区10内的框胶400，所述框胶400延伸至所述镂空部310内，使所述第一透明基板100和第二透明基板200通过所述框胶400固定。
可以理解的是，本申请技术方案通过将平坦保护层对应于框胶区内的部分镂空形成镂空部310，从而增加了第一透明基板100与第二透明基板200之间所需密封的间距，以达到框胶400宽度窄边化的目的，此种方式适合应用于多种类似平坦保护层延伸到框胶区10内的面板结构中，具体的，本实施例以COA（Color Filter on Array）型面板为例进行具体说明。
承上，所述平坦保护层300在所述框胶区10形成有镂空部310，所述第一透明基板100与第二透明基板200之间设有位于所述框胶区10内的框胶400，所述框胶400延伸至所述镂空部310内，可以理解的是，所述平坦保护层300位于所述框胶400所密封固定的内侧区域内，具体的，可以是与所述框胶400具有一定间距，也可以是其它满足所述平坦保护层300在所述框胶区10形成有镂空部310的结构形式，在此，不做限定。
在一实施例中，所述第一透明基板100靠近所述第二透明基板200的一侧设有TFT层500，所述TFT层500靠近所述第二透明基板200的一侧设有钝化保护层600，所述平坦保护层300设于所述钝化保护层600上，所述框胶400设置于所述钝化保护层600与第二透明基板200之间。
具体的，相比于原有COA型面板中框胶400设于平坦保护层上的结构，本申请中，由于将所述所述平坦保护层300在框胶区10内的部分镂空，使得框胶400的高度增加，在保证原有框胶涂布工艺中框胶吐出量和速度参数不变的基础上，使得框胶400的宽度变窄，实现了显示面板的窄边框化；具体的，所述框胶400的宽度为300um～400um；所述框胶400的高度为5um～7um。此外，所述TFT层500包括栅极510、源极520、漏极530、栅极保护层540和金属走线层550等，具体结构形式在如图1中进行了示意且均为现有技术，在此不再赘述。
在一实施例中，所述显示面板1还包括位于所述框胶400内侧区域内的色阻层700、导电层800和液晶层900，所述色阻层700设于所述钝化保护层600上，所述平坦保护层300设于所述色阻层700及所述钝化保护层600上且覆盖所述色阻层700，所述导电层800设于所述平坦保护层300上，所述液晶层900设于所述导电层800上。
在一实施例中，所述导电层800包括像素电极810，所述TFT层500中的漏极530上方设有依次穿过所述钝化保护层600、色阻层700和平坦保护层300的过孔20，所述像素电极810穿过所述过孔20与所述漏极530电性连接。
在一实施例中，所述第二透明基板200靠近所述第一透明基板100的一侧设有黑色矩阵210，所述框胶400设置于所述钝化保护层600与黑色矩阵210之间；显然，在多种面板的框胶结构中，框胶400与黑色矩阵210的组合形式，属于常规结构，在此不再详细说明。
综上所述，本申请通过将现有结构中位于显示面板框胶区内的部分平坦保护层去除，减少了框胶涂布区内原有平坦保护层的厚度，从而增加了第一透明基板与第二透明基板之间所需密封的间距，使得框胶所需涂布间距增大，从而使框胶的宽度变窄，实现市场对窄边框需求。
根据本发明的上述目的，如图2所示，还提供一种显示面板的制作方法，包括：
步骤S1，提供一相对设置的第一透明基板100和第二透明基板200，所述显示面板1包括框胶区10；
步骤S2，在所述第一透明基板100与第二透明基板200之间形成平坦保护层300，所述平坦保护层300在所述框胶区10形成有镂空部310；以及
步骤S3，在所述第一透明基板100与第二透明基板200之间形成位于所述框胶区10内的框胶400，所述框胶400延伸至所述镂空部310内，以使所述第一透明基板100和第二透明基板200通过所述框胶400固定。
在一实施例中，具体的，所述在所述第一透明基板100与第二透明基板200之间形成平坦保护层300之前还包括：
在所述第一透明基板100上形成TFT层500，在所述TFT层500上形成钝化保护层600，在所述钝化保护层600上形成第一过孔21，所述平坦保护层300形成于所述钝化保护层600远离所述TFT层500的一侧；
所述在所述第一透明基板100与第二透明基板200之间形成位于所述框胶区10内的框胶400之前还包括：
在所述平坦保护层300上形成与所述第一过孔21相对应的第三过孔23，在所述平坦保护层300上形成导电层800，使所述导电层800通过所述第一过孔21和所述第三过孔23与所述TFT层500的漏极530电性连接。
在一实施例中，具体的，所述在所述第一透明基板100与第二透明基板200之间形成平坦保护层300之前还包括：
在所述钝化保护层600上形成色阻层700，并在所述色阻层700上形成与所述第一过孔21相对应的第二过孔22；所述平坦保护层300形成于所述色阻层700及所述钝化保护层600上且覆盖所述色阻层700，所述导电层800通过所述第一过孔21、所述第二过孔22和所述第三过孔23与所述TFT层500的漏极530电性连接。
可以理解的是，在所述平坦保护层300上形成所述第三过孔23和镂空部310均可用过同一图案化制程形成；具体通过曝光显影，在此过程中，可以使得平坦保护层300在靠近框胶400处去除的部分面积大于所述镂空部310的面积，此外，其它各功能层的制作方式（如采用涂布、蚀刻、曝光显影等工艺方式）均为现有技术，在此不再赘述。
基于前述显示面板的制作方法步骤，可以理解的是，如图3所示，具体的，包括：
步骤S10，提供第一透明基板100，在所述第一透明基板100上依次形成所述TFT层500、钝化保护层600、色阻层700、具有镂空部310的平坦保护层300、导电层800、以及在所述框胶区10对应的钝化保护层600上形成框胶400；
步骤S20，提供一第二透明基板200，在所述第二透明基板200上形成黑色矩阵210；
步骤S30，将所述第二透明基板200靠近黑色矩阵210的一侧对合密封到所述框胶400上。
在一实施例中，还包括所述过孔20的制作，具体步骤为，在制作钝化保护层600后，通过一图案化制程，如依次通过涂布光刻胶、显影和蚀刻的步骤，以在钝化保护层600上形成第一过孔21；然后在制作色阻层700后，具体可以是通过曝光显影的方式，以在所述色阻层700上形成第二过孔22；最后在制作平坦保护层300后，具体可以是通过曝光显影的方式，在所述平坦保护层300上形成所述第三过孔23；显然，所述第一过孔21、第二过孔22和第三过孔23组成前述结构中的过孔20。此外，后续在制作导电层800，所述导电层800通过所述第一过孔21、所述第二过孔22和所述第三过孔23与所述TFT层500的漏极530电性连接等方式步骤就不再赘述。
承上，值得注意的是，现有COA面板结构中，按照依次制备钝化保护层、色阻层、第二过孔、平坦保护层、第三过孔、最后形成第一过孔的工艺顺序，在最后在钝化保护层形成第一过孔时，可以利用原有不用镂空的平坦保护层作为掩膜进行蚀刻，而本申请中由于平坦保护层在框胶区10镂空，按照现有的工艺流程，在形成第一过孔的过程中，容易将框胶区10内的部分钝化保护层蚀刻，使所述TFT层500的金属走线层550露出，导致短路；因此，本申请的制作方法中，在制作钝化保护层后，直接在钝化保护层上形成第一过孔21的过程中以避免前述状况发生。
综上所述，本申请的的制作方法通过平坦保护层结构的改变，在保证原有框胶涂布工艺中框胶吐出量和速度参数不变的基础上，实现了显示面板的窄边框化；并且，通过调整工艺，避免了由于平坦保护层结构的改变而导致金属走线层露出的问题。
综上，本申请通过将现有结构中位于显示面板框胶区内的部分平坦保护层去除，减少了框胶涂布区内原有平坦保护层的厚度，从而增加了第一透明基板与第二透明基板之间所需密封的间距，使得框胶所需涂布间距增大，从而使框胶的宽度变窄，实现市场对窄边框需求；同时，本申请的的制作方法通过平坦保护层结构的改变，在保证原有框胶涂布工艺中框胶吐出量和速度参数不变的基础上，实现了显示面板的窄边框化。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (13)

  1. 一种显示面板，包括框胶区；
    所述显示面板包括相对设置的第一透明基板和第二透明基板，所述第一透明基板与第二透明基板之间设有平坦保护层，所述平坦保护层在所述框胶区形成有镂空部，所述第一透明基板与第二透明基板之间设有位于所述框胶区内的框胶，所述框胶延伸至所述镂空部内，使所述第一透明基板和第二透明基板通过所述框胶固定。
  2. 根据权利要求1所述的显示面板，其中，所述第一透明基板靠近所述第二透明基板的一侧设有TFT层，所述TFT层靠近所述第二透明基板的一侧设有钝化保护层，所述平坦保护层设于所述钝化保护层上，所述框胶设置于所述钝化保护层与第二透明基板之间。
  3. 根据权利要求2所述的显示面板，其中，所述显示面板还包括位于所述框胶内侧区域内的色阻层、导电层和液晶层，所述色阻层设于所述钝化保护层上，所述平坦保护层设于所述色阻层及所述钝化保护层上且覆盖所述色阻层，所述导电层设于所述平坦保护层上，所述液晶层设于所述导电层上。
  4. 根据权利要求3所述的显示面板，其中，所述导电层包括像素电极，所述TFT层中的漏极上方设有依次穿过所述钝化保护层、色阻层和平坦保护层的过孔，所述像素电极穿过所述过孔与所述漏极电性连接。
  5. 根据权利要求4所述的显示面板，其中，所述过孔包括设置于钝化保护层上的第一过孔、设置于色阻层上并与所述第一过孔相对应的第二过孔、及设置于平坦保护层上并与所述第二过孔相对应的第三过孔。
  6. 根据权利要求5所述的显示面板，其中，所述像素电极依次穿过所述第三过孔、第二过孔和第一过孔与所述漏极电性连接。
  7. 根据权利要求2所述的显示面板，其中，所述第二透明基板靠近所述第一透明基板的一侧设有黑色矩阵，所述框胶设置于所述钝化保护层与黑色矩阵之间。
  8. 根据权利要求1所述的显示面板，其中，所述框胶的宽度为300um～400um。
  9. 根据权利要求8所述的显示面板，其中，所述框胶的高度为5um～7um。
  10. 一种显示面板的制作方法，包括：
    提供一相对设置的第一透明基板和第二透明基板，所述显示面板包括框胶区；
    在所述第一透明基板与第二透明基板之间形成平坦保护层，所述平坦保护层在所述框胶区形成有镂空部；以及
    在所述第一透明基板与第二透明基板之间形成位于所述框胶区内的框胶，所述框胶延伸至所述镂空部内，以使所述第一透明基板和第二透明基板通过所述框胶固定。
  11. 根据权利要求10所述的显示面板的制作方法，其中，
    所述在所述第一透明基板与第二透明基板之间形成平坦保护层之前还包括：
    在所述第一透明基板上形成TFT层，在所述TFT层上形成钝化保护层，在所述钝化保护层上形成第一过孔，所述平坦保护层形成于所述钝化保护层远离所述TFT层的一侧。
  12. 根据权利要求11所述的显示面板的制作方法，其中，
    所述在所述第一透明基板与第二透明基板之间形成位于所述框胶区内的框胶之前还包括：
    在所述平坦保护层上形成与所述第一过孔相对应的第三过孔，在所述平坦保护层上形成导电层，使所述导电层通过所述第一过孔和所述第三过孔与所述TFT层的漏极电性连接。
  13. 根据权利要求12所述的显示面板的制作方法，其中，
    所述在所述第一透明基板与第二透明基板之间形成平坦保护层之前还包括：
    在所述钝化保护层上形成色阻层，并在所述色阻层上形成与所述第一过孔相对应的第二过孔；所述平坦保护层形成于所述色阻层及所述钝化保护层上且覆盖所述色阻层，所述导电层通过所述第一过孔、所述第二过孔和所述第三过孔与所述TFT层的漏极电性连接。
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