WO2021053790A1 - Machine de montage de composant - Google Patents

Machine de montage de composant Download PDF

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Publication number
WO2021053790A1
WO2021053790A1 PCT/JP2019/036759 JP2019036759W WO2021053790A1 WO 2021053790 A1 WO2021053790 A1 WO 2021053790A1 JP 2019036759 W JP2019036759 W JP 2019036759W WO 2021053790 A1 WO2021053790 A1 WO 2021053790A1
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WO
WIPO (PCT)
Prior art keywords
component
substrate
mounting machine
image
head
Prior art date
Application number
PCT/JP2019/036759
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English (en)
Japanese (ja)
Inventor
錠二 門川
辰次 野澤
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2019/036759 priority Critical patent/WO2021053790A1/fr
Priority to JP2021546134A priority patent/JP7249426B2/ja
Publication of WO2021053790A1 publication Critical patent/WO2021053790A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the solder applied on the substrate may peel off and adhere to the component side.
  • the solder adhering to the component is removed by cleaning and then the component is remounted on the board, there is a risk that the electrical connection between the electrode portion of the component and the land portion of the board may be defective due to insufficient solder. is there.
  • the main purpose of this disclosure is to suppress the occurrence of defective products.
  • This disclosure has taken the following measures to achieve the above-mentioned main purpose.
  • the component mounting machine of the present disclosure is A component mounting machine that holds components and mounts them on a board.
  • a head having a holding member for holding the component,
  • An imaging device that is moved by the moving device to image the substrate, and
  • An inspection process for controlling the imaging device and inspecting the mounting state of the component based on the captured image is executed, and if the inspection result of the inspection process is abnormal, the component related to the abnormality is the substrate.
  • a control device that controls the moving device and the head so as to be removed from the board, and performs an error processing that makes an operator call to prompt confirmation of the state of the board.
  • the gist is to prepare.
  • the component mounting machine of the present disclosure includes an imaging device for imaging a substrate by being moved by a moving device for moving the head. Further, the component mounting machine executes a mounting process for controlling the components held by the holding member to be mounted on the board, and then images the components mounted on the board and the mounting state of the components based on the captured image. Perform an inspection process to inspect. Then, when the inspection result is abnormal, the component mounting machine executes an abnormality processing in which an operator call is made to remove the abnormal component from the board and prompt the confirmation of the state of the board. In this way, the occurrence of defective products can be suppressed by allowing the operator to check the state of the board (solder state) after removing the abnormal component from the board.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting machine 10 of the present embodiment.
  • FIG. 2 is an explanatory diagram showing an electrical connection relationship between the control device 60 and the management device 80 of the component mounting machine 10.
  • the left-right direction is the X-axis direction
  • the front (front) rear (back) direction is the Y-axis direction
  • the vertical direction is the Z-axis direction.
  • the component mounting machine 10 mounts components (surface mount) on the substrate S. That is, the component mounting machine 10 mounts the components so that the electrode portion comes into contact with the solder printed by a printing machine (not shown) on the copper foil which is the land portion of the substrate S.
  • the component mounting machine 10 includes a component supply device 21, a board transfer device 22, a head moving device 30, a head 40, an image display device 50, a speaker 51 (see FIG. 2), and a speaker 51 (see FIG. 2). It includes a light 52 (see FIG. 2) and a control device 60 (see FIG. 2). In addition to these, the component mounting machine 10 also includes a parts camera 24, a mark camera 25, a disposal box 26, a nozzle station 27, and the like. A plurality of component mounting machines 10 are arranged side by side in the substrate transport direction (X-axis direction) to form a production line. The production line is managed by the management device 80 (see FIG. 2).
  • the parts supply device 21 includes a tape feeder provided at the front end of the base 11 of the parts mounting machine 10.
  • the tape feeders are installed so as to line up in the left-right direction (X-axis direction), and tapes in which parts are housed in a plurality of recesses formed at predetermined intervals in the longitudinal direction are placed in the front-rear direction (Y-axis direction) from the reel. Supply parts by pulling out to.
  • the board transfer device 22 includes a pair of conveyor rails arranged on the base 11 at intervals in the front-rear direction (Y-axis direction).
  • the substrate transfer device 22 transports the substrate S from the left to the right (board transfer direction) in FIG. 1 by driving a pair of conveyor rails.
  • the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, an X-axis actuator 33 (see FIG. 2), a pair of Y-axis guide rails 35, and a Y-axis. It includes a slider 36 and a Y-axis actuator 37 (see FIG. 2).
  • the pair of Y-axis guide rails 35 are installed on the upper stage of the housing 12 so as to extend parallel to each other in the Y-axis direction.
  • the Y-axis slider 36 is bridged over a pair of Y-axis guide rails 35.
  • the Y-axis actuator 37 moves the Y-axis slider 36 along the Y-axis guide rail 35 in the Y-axis direction.
  • the pair of X-axis guide rails 31 are installed in front of the Y-axis slider 36 so as to extend parallel to each other in the X-axis direction.
  • the X-axis slider 32 is bridged over a pair of X-axis guide rails 31.
  • the X-axis actuator 33 moves the X-axis slider 32 in the X-axis direction along the X-axis guide rail 31.
  • a head 40 is attached to the X-axis slider 32.
  • the head moving device 30 moves the head 40 in the X-axis direction and the Y-axis direction by moving the X-axis slider 32 and the Y-axis slider 36.
  • the head 40 includes a Z-axis actuator 41 and a ⁇ -axis actuator 43.
  • the Z-axis actuator 41 moves a nozzle holder (not shown) in the vertical direction (Z-axis direction).
  • the ⁇ -axis actuator 43 rotates the nozzle holder around the Z-axis.
  • a suction nozzle 45 is detachably attached to the nozzle holder. The suction nozzle 45 is moved in the Z-axis direction together with the nozzle holder by the Z-axis actuator 41, and is rotated around the Z-axis together with the nozzle holder by the ⁇ -axis actuator 43.
  • the suction port of the suction nozzle 45 selectively communicates with the negative pressure source, the positive pressure source, and the air introduction port by a solenoid valve.
  • the head 40 attracts the component by the negative pressure acting on the suction port by bringing the suction port of the suction nozzle 45 into contact with the upper surface of the component in a state where the suction port of the suction nozzle 45 is communicated with the negative pressure source. be able to. Further, the head 40 can release the suction of the parts by the positive pressure acting on the suction port by communicating the suction port of the suction nozzle 45 with the positive pressure source.
  • the parts camera 24 is installed between the parts supply device 21 of the base 11 and the board transfer device 22.
  • the parts camera 24 takes an image of the bottom surface of the component from a direction perpendicular to the bottom surface of the component.
  • the captured image captured by the parts camera 24 is output to the control device 60.
  • the control device 60 inspects the suction state of the parts by performing image processing for recognizing the parts with respect to the captured image of the parts camera 24. For the inspection of the suction state, for example, it is determined whether or not the parts are sucked by the suction nozzle 45, whether or not the sucked parts are normal, and the X-axis direction of the sucked parts. This includes determining whether or not the amount of misalignment ( ⁇ x, ⁇ y, ⁇ ) in the Y-axis direction and the ⁇ -axis direction is within the permissible range.
  • the mark camera 25 is attached to the X-axis slider 32.
  • the mark camera 25 captures a mark attached to the surface of the substrate S from a direction perpendicular to the surface.
  • the captured image captured by the mark camera 25 is output to the control device 60.
  • the control device 60 confirms the position of the substrate S by performing image processing for recognizing the mark on the image captured by the mark camera 25.
  • the disposal box 26 is for disposing of the parts subject to the abnormality when the adsorbed parts have an abnormality.
  • the nozzle station 27 accommodates a plurality of replacement suction nozzles 45 suitable for suctioning the parts according to the type of the parts.
  • the image display device 50 is, for example, a liquid crystal display, and displays status information regarding the state of the component mounting machine 10, work information regarding setup change and component replenishment, and the like.
  • the image display device 50 has a touch panel attached to the screen so that it can be operated by an operator.
  • the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62, an HDD 63, a RAM 64, an input / output interface 65, and the like in addition to the CPU 61. These are electrically connected via the bus 66.
  • Various detection signals are input to the control device 60 via the input / output interface 65.
  • the various detection signals input to the control device 60 include a position signal from the X-axis position sensor 34 that detects the position of the X-axis slider 32 and a position from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36.
  • various signals input to the control device 60 include an image signal from the parts camera 24, an image signal from the mark camera 25, an operation signal from the image display device 50 (touch panel), and the like.
  • various control signals are output from the control device 60 via the input / output interface 65.
  • Various control signals output from the control device 60 include a control signal to the component supply device 21 and a control signal to the substrate transfer device 22.
  • the various control signals output from the control device 60 include a drive signal to the X-axis actuator 33, a drive signal to the Y-axis actuator 37, a drive signal to the Z-axis actuator 41, and a drive signal to the ⁇ -axis actuator 43. And so on. Further, the various control signals output from the control device 60 include a control signal to the parts camera 24, a control signal to the mark camera 25, a control signal to the image display device 50, a control signal to the speaker 51, and a light 52. There is also a control signal to. Further, the control device 60 is connected to the management device 80 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.
  • the management device 80 is, for example, a general-purpose computer, and includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, an input / output interface 85, and the like, as shown in FIG. These are electrically connected via the bus 86.
  • An input signal is input to the management device 80 from an input device 87 such as a mouse or a keyboard via the input / output interface 85. Further, the image signal to the display 88 is output from the management device 80 via the input / output interface 85.
  • the HDD 83 stores the production job of the substrate S.
  • the production job of the board S includes production of which parts are mounted on the board S in what order in each component mounting machine 10, and how many boards S on which the components are mounted are manufactured. Includes schedule.
  • the management device 80 generates a production job based on various data input by the operator via the input device 87, and transmits the generated production job to each component mounting machine 10 to the component mounting machine 10. Instruct the start of production.
  • FIG. 3 is a flowchart showing an example of a control routine executed by the CPU 61 of the control device 60. This routine is executed when the operator instructs the start of production.
  • the control device 60 receives the production job transmitted from the management device 80, and executes the control routine based on the received production job.
  • the CPU 61 of the control device 60 first mounts the components on the substrate S and performs a component mounting process for inspecting the mounting state of the mounted components (S10). Subsequently, the CPU 61 determines whether or not the inspection result is abnormal (S20). Then, if the inspection result is not abnormal, the CPU 61 returns to S10 and repeats the component mounting process, and if the inspection result is abnormal, executes an abnormal time process for removing the component related to the abnormality (S30).
  • S10 the inspection result is abnormal
  • S30 an abnormal time process for removing the component related to the abnormality
  • FIG. 4 is a flowchart showing an example of the component mounting process.
  • the CPU 61 first performs a suction operation of sucking the component supplied from the component supply device 21 to the suction nozzle 45 (S100). Specifically, the suction operation controls the drive of the head moving device 30 so that the suction nozzle 45 moves above the component supply position where the component is supplied from the component supply device 21, and the tip (suction port) of the suction nozzle 45.
  • the Z-axis actuator 41 is driven and controlled so that the suction nozzle 45 descends until the suction nozzle 45 comes into contact with the upper surface of the component, and the electromagnetic valve is driven and controlled so that a negative pressure acts on the suction port of the suction nozzle 45.
  • the CPU 61 drives and controls the head moving device 30 so that the parts sucked by the suction nozzle 45 move upward of the parts camera 24 (S110), and images the parts with the parts camera 24 (S120).
  • the CPU 61 When the CPU 61 captures an image of the component, the CPU 61 performs image processing for recognizing the component in the obtained captured image (S130). Then, the CPU 61 inspects the suction state of the recognized component (S140), and determines whether or not the inspection result is normal (S150). In the inspection of the suction state, as described above, it is determined whether or not the component is adsorbed on the adsorption nozzle 45 (the component is normally recognized in the captured image), and the adsorbed component is normal (the component is adsorbed normally).
  • the CPU 61 determines that the inspection result of the suction state is not normal and abnormal, the CPU 61 drives and controls the head moving device 30 so that the parts sucked by the suction nozzle 45 move above the waste box 26 (S220). Then, the CPU 61 disposes of the component in the disposal box 26 by releasing the adsorption of the component (S230), and returns to step S100 in order to redo the adsorption operation of the component.
  • the CPU 61 determines that the inspection result of the suction state is normal, the CPU 61 corrects the mounting position of the component based on each position deviation amount ( ⁇ x, ⁇ y, ⁇ ) determined in step S140 (S160). Then, the CPU 61 performs a mounting operation of mounting the component sucked on the suction nozzle 45 at the corrected mounting position (S170). Specifically, in the mounting operation, the head moving device 30 is driven and controlled so that the component sucked by the suction nozzle 45 moves above the mounting position, and the suction nozzle 45 is lowered until the component abuts on the substrate S.
  • the Z-axis actuator 41 is driven and controlled, and the solenoid valve is driven and controlled so that a positive pressure acts on the suction port of the suction nozzle 45.
  • the CPU 61 drives and controls the head moving device 30 so that the mark camera 25 moves above the mounting position of the mounted component when the mounting operation is performed (S180). Subsequently, the CPU 61 takes an image of the component mounted by the mark camera 25 (S190), and performs image processing for recognizing the component in the obtained captured image (S200). Then, the CPU 61 inspects the recognized mounting state of the component (S210), and ends the component mounting process. As an inspection of the mounting state, the CPU 61 determines whether or not the positions (x, y, ⁇ ) of the parts recognized by the image processing match the mounting positions described above. When the component mounting process is completed, the CPU 61 returns to the control routine and determines whether or not the inspection result of the mounting state is abnormal in step S20 as described above. Then, when the CPU 61 determines that the inspection result is abnormal, the CPU 61 executes an abnormality processing (S30).
  • FIG. 5 is a flowchart showing an example of processing at the time of abnormality.
  • the CPU 61 first uses the suction nozzle 45 (return target nozzle) mounted on the head 40 to suck and remove the parts related to the abnormality, and the dedicated suction nozzle 45 (replacement target). Nozzle replacement process is performed (S300).
  • the CPU 61 executes the following processing in the nozzle replacement processing. That is, the CPU 61 first drives and controls the head moving device 30 so that the nozzle holder holding the nozzle to be returned moves above the empty accommodating portion in which the suction nozzle 45 is not accommodated among the plurality of accommodating portions of the nozzle station 27. To do.
  • the CPU 61 drives and controls the Z-axis actuator 41 so that the nozzle holder is lowered, and returns the nozzle to be returned to the nozzle station 27 by releasing the holding of the nozzle to be returned by the nozzle holder.
  • the CPU 61 drives and controls the head moving device 30 so that the nozzle holder that has returned the nozzle to be returned moves above the accommodating portion that accommodates the nozzle to be replaced.
  • the CPU 61 drives and controls the Z-axis actuator 41 so that the nozzle holder is lowered, and causes the nozzle holder to hold the nozzle to be replaced, thereby taking out the nozzle to be replaced from the nozzle station 27.
  • the CPU 61 drives and controls the head moving device 30 and the head 40 so that the replaced dedicated suction nozzle 45 sucks and removes the abnormal parts (S310). Subsequently, the CPU 61 drives and controls the head moving device 30 so that the mark camera 25 moves above the mounting position of the component removed from the board S (S320), and the mark camera 25 images the board S (S330). Then, the CPU 61 displays the captured image of the substrate S on the image display device 50 (S340), and prompts the operator to confirm the state of the substrate S by outputting the sound from the speaker 51 and turning on the light 52. (S350).
  • FIG. 6 is an explanatory diagram showing an example of a confirmation screen for confirming the solder state.
  • the elliptical broken line indicates a portion where the component is removed from the substrate S.
  • the confirmation screen displays an image of the substrate S captured by the mark camera 25 and an enlarged enlarged image of the portion of the substrate S from which the component has been removed.
  • the operator confirms whether or not sufficient solder remains on the land portion (on the copper foil) of the substrate S, and if there is no abnormality, taps the "OK” button, and if there is an abnormality, clicks the "NG” button. Tap.
  • the CPU 61 determines that there is no abnormality in the solder state (“OK” button is tapped) (“NO” in S360), the CPU 61 remounts the component in the removed portion of the board S (S380). Ends abnormal processing.
  • the components removed from the substrate S in step S310 are held in the suction nozzle 45, and the mounting position is corrected and held based on the inspection result of the mounting state performed in step S210 of the component mounting process. It may be carried out by mounting the above-mentioned parts. Further, the remounting of the components may be performed by discarding the components removed from the substrate S in the disposal box 26, and then sucking new components and mounting them on the substrate S.
  • the CPU 61 determines that the solder state is abnormal (the "NG" button has been tapped) ("YES" in S360)
  • the CPU 61 waits until the operator corrects the solder state and performs a release operation ("YES"). S370), when the release operation is performed, the component is remounted (S380), and the abnormal processing is terminated.
  • the CPU 61 finishes the abnormal processing it returns to S10 of the control routine and executes the component mounting process.
  • the suction nozzle 45 of the present embodiment corresponds to the holding member
  • the head 40 corresponds to the head
  • the mark camera 25 corresponds to the image pickup device
  • the control device 60 corresponds to the control device.
  • the image display device 50 corresponds to the image display device
  • the head moving device 30 corresponds to the moving device
  • the mark camera 25 corresponds to the imaging device.
  • the CPU 61 when the CPU 61 has an abnormality in the mounting state of the parts mounted on the board S, the CPU 61 removes the parts related to the abnormality from the board S and then makes an operator call to the operator. It was decided to prompt confirmation of the solder condition at the place where the parts were removed. However, the CPU 61 may check the solder state at the portion where the component is removed based on the captured image of the substrate S. In this case, the CPU 61 may execute the abnormality processing of FIG. 7 instead of FIG. Of the abnormal processing in FIG. 7, the same processing as in FIG. 5 is assigned the same step number, and detailed description thereof will be omitted. In the abnormality processing shown in FIG.
  • the CPU 61 when the CPU 61 removes the component related to the abnormality from the substrate S in steps S310 to S330 and then images the substrate S with the mark camera 25, the component of the substrate S is captured in the obtained image.
  • the solder region of the removed portion is detected (S400). This process can be performed by comparing the color of the image with the color of the solder registered in advance for each pixel within a predetermined range including the mounting position of the removed component in the captured image. Subsequently, the CPU 61 extracts the contour of the detected solder region (S410) and calculates the area of the extracted contour (S420). This process can be performed by counting the number of pixels in the contour of the solder.
  • the CPU 61 inspects the solder state at the portion where the component of the substrate S is removed based on the calculated area (S430). In the inspection of the solder condition, for example, if the calculated area is equal to or more than the predetermined value, the solder condition is judged to be normal, and if the calculated solder area is less than the predetermined value, the solder condition is abnormal (parts are removed). Therefore, it is determined that the solder on the substrate S has peeled off). When the CPU 61 determines that there is no abnormality in the solder state (“NO” in S440), the CPU 61 remounts the component (S380) and ends the abnormality processing.
  • NO no abnormality in the solder state
  • the CPU 61 determines that there is an abnormality in the solder state (“YES” in S440)
  • the CPU 61 displays the image of the substrate S captured in step S330 on the image display device 50 (S340) and makes an operator call. (S350).
  • the CPU 61 waits until the release operation is performed by the operator, and when the release operation is performed, the component is remounted (S370, S380), and the abnormality processing is terminated.
  • the CPU 61 can confirm the solder state at the portion where the component of the substrate S has been removed and remount the component.
  • the CPU 61 when there is an abnormality in the mounting state of the components mounted on the board S, the CPU 61 removes the components related to the abnormality from the board S, and then uses the mark camera 25 to take an image of the board S.
  • the captured image is displayed on the image display device 50 and an operator call is made.
  • the CPU 61 may only make an operator call and do not display the captured image. In this case, the operator needs to take out the board S from the component mounting machine 10 and check it directly.
  • the CPU 61 is intended to display an enlarged image of the portion where the component of the substrate S is removed as the image to be displayed on the image display device 50, the enlarged image may not be displayed.
  • the CPU 61 is replaced with a dedicated suction nozzle 45, and the replaced suction nozzle 45 is used to suck and remove the component determined to be in an abnormal mounting state.
  • the CPU 61 is used for mounting the component.
  • the suction nozzle 45 may be used to suck and remove the parts.
  • the component mounting machine of the present disclosure is a component mounting machine that holds a component and mounts the component on a board, and includes a head having a holding member for holding the component and a moving device for moving the head.
  • An image pickup device that is moved by the moving device to image the substrate, and a mounting process that controls the moving device and the head so that the components held by the holding member are mounted on the board are executed.
  • the moving device and the imaging device are controlled so that the component mounted on the substrate is imaged, and an inspection process for inspecting the mounting state of the component based on the captured image is executed, and the inspection is performed.
  • the gist is to provide a control device that executes time processing.
  • the component mounting machine of the present disclosure includes an imaging device for imaging a substrate by being moved by a moving device for moving the head. Further, the component mounting machine executes a mounting process for controlling the components held by the holding member to be mounted on the board, and then images the components mounted on the board and the mounting state of the components based on the captured image. Perform an inspection process to inspect. Then, when the inspection result is abnormal, the component mounting machine executes an abnormality processing in which an operator call is made to remove the abnormal component from the board and prompt the confirmation of the state of the board. In this way, the occurrence of defective products can be suppressed by allowing the operator to check the state of the board (solder state) after removing the abnormal component from the board.
  • Such a component mounting machine of the present disclosure includes an image display device for displaying an image, and the control device includes the head and the head so that the substrate after removing the component related to the abnormality is imaged as the processing at the time of abnormality.
  • the image of the substrate may be displayed on the image display device while controlling the image pickup device. In this way, the operator can easily check the state of the substrate.
  • the control device may enlarge and display the image of the substrate as the processing at the time of abnormality.
  • the control device calculates the area of the solder region printed on the portion where the component of the substrate is removed based on the captured image of the substrate as the processing at the time of abnormality. Then, the state of the substrate may be determined based on the calculated area. In this way, the burden of confirmation by the operator can be further reduced.
  • control device may suspend the execution of the mounting process as the error processing until the operator instructs the restart.
  • the present invention can be used in the manufacturing industry of component mounting machines and the like.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne une machine de montage de composant comprenant un dispositif de capture d'image déplacé par un dispositif mobile pour déplacer une tête et capturer une image d'un substrat. La machine de montage de composant réalise une opération de montage dans laquelle un composant maintenu par un élément de maintien est monté sur le substrat et effectue ensuite une inspection dans laquelle une image du composant monté sur le substrat est capturée et l'état de montage du composant est inspecté sur la base de l'image capturée. Si l'état de montage est trouvé comme étant anormal dans l'inspection, le composant trouvé comme étant anormal est retiré du substrat, et un traitement d'anomalie est effectué pour effectuer un appel d'opérateur pour demander une vérification de l'état du substrat.
PCT/JP2019/036759 2019-09-19 2019-09-19 Machine de montage de composant WO2021053790A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2019/036759 WO2021053790A1 (fr) 2019-09-19 2019-09-19 Machine de montage de composant
JP2021546134A JP7249426B2 (ja) 2019-09-19 2019-09-19 部品実装機

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Application Number Priority Date Filing Date Title
PCT/JP2019/036759 WO2021053790A1 (fr) 2019-09-19 2019-09-19 Machine de montage de composant

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WO2021053790A1 true WO2021053790A1 (fr) 2021-03-25

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039819A (ja) * 2002-07-02 2004-02-05 Fuji Mach Mfg Co Ltd 部品実装基板の修繕方法、修繕装置、修繕プログラム及び生産システム、
JP2004111424A (ja) * 2002-09-13 2004-04-08 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2005216958A (ja) * 2004-01-27 2005-08-11 Yamaha Motor Co Ltd 実装基板製造装置の作業状態確認方法および実装基板製造装置
JP2011018816A (ja) * 2009-07-10 2011-01-27 I-Pulse Co Ltd 電子部品の装着方法
WO2011043080A1 (fr) * 2009-10-08 2011-04-14 パナソニック株式会社 Système de montage de pièces et procédé de montage de pièces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039819A (ja) * 2002-07-02 2004-02-05 Fuji Mach Mfg Co Ltd 部品実装基板の修繕方法、修繕装置、修繕プログラム及び生産システム、
JP2004111424A (ja) * 2002-09-13 2004-04-08 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2005216958A (ja) * 2004-01-27 2005-08-11 Yamaha Motor Co Ltd 実装基板製造装置の作業状態確認方法および実装基板製造装置
JP2011018816A (ja) * 2009-07-10 2011-01-27 I-Pulse Co Ltd 電子部品の装着方法
WO2011043080A1 (fr) * 2009-10-08 2011-04-14 パナソニック株式会社 Système de montage de pièces et procédé de montage de pièces

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JPWO2021053790A1 (fr) 2021-03-25

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