WO2020237857A1 - 液晶显示母板结构及其切割方法 - Google Patents

液晶显示母板结构及其切割方法 Download PDF

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Publication number
WO2020237857A1
WO2020237857A1 PCT/CN2019/102243 CN2019102243W WO2020237857A1 WO 2020237857 A1 WO2020237857 A1 WO 2020237857A1 CN 2019102243 W CN2019102243 W CN 2019102243W WO 2020237857 A1 WO2020237857 A1 WO 2020237857A1
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WO
WIPO (PCT)
Prior art keywords
sub
cutting line
sealant
display panel
plane
Prior art date
Application number
PCT/CN2019/102243
Other languages
English (en)
French (fr)
Inventor
王恺君
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/617,512 priority Critical patent/US20210356781A1/en
Publication of WO2020237857A1 publication Critical patent/WO2020237857A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • This application relates to a display technology, in particular to a liquid crystal display mother board structure and a cutting method thereof.
  • the manufacturing process of a flexible liquid crystal display device generally includes: making corresponding film layers on a flexible substrate on a rigid substrate to form a color filter substrate and an array substrate; then pairing the array substrate and the color filter substrate; The board is peeled off to separate the motherboard from the rigid substrate; finally, the motherboard is cut into multiple independent flexible display panels and the flexible printed circuit board is bound to each flexible display panel for polarizer attachment .
  • the main way to separate the mother board and the rigid substrate is laser separation, but the energy generated by the laser separation will cause the flexible substrate of the mother board to generate stress, thereby curling toward the side of the rigid substrate. This curling not only affects the uniformity during laser separation, but also causes the polarizer attachment and binding process to fail.
  • the embodiments of the present application provide a liquid crystal display mother board structure and a cutting method thereof to solve the technical problem that the flexible substrate of the mother board is prone to curling when the existing liquid crystal display panel uses a laser to separate the mother board and the rigid substrate. .
  • the embodiment of the application provides a liquid crystal display motherboard structure, which includes a flexible display motherboard and a first rigid substrate and a second rigid substrate arranged on both sides of the flexible display motherboard.
  • the flexible display motherboard includes a plurality of displays. Panel, where
  • the display panel includes a first sealant for bonding a color filter substrate and an array substrate, and a small chip cutting line is provided on the flexible display mother board, and the small chip cutting line is used to cut out a single display panel;
  • the display panel includes a binding area
  • the first sealant includes a first sub seal, a second sub seal, a third sub seal, and a fourth sub seal.
  • the first sub seal is close to the In the binding area
  • the second sub-frame glue is arranged opposite to the first sub-frame glue
  • the third sub-frame glue is connected to the same side of the first sub-frame glue and the second sub-frame glue, so
  • the fourth sub-frame glue is arranged opposite to the third sub-frame glue;
  • the small piece cutting line includes a first sub-cutting line, a second sub-cutting line, a third sub-cutting line, and a fourth sub-cutting line, the first sub-cutting line is close to the binding area; the second sub-cutting The line, the third sub-cutting line, and the fourth sub-cutting line are respectively set in one-to-one correspondence with the second, third, and fourth sub-frame glues;
  • the orthographic projection of the first sub-cutting line on the plane where the display panel is located is outside the orthographic projection of the first framing glue on the plane where the display panel is located;
  • the third sub-cutting line corresponds to the orthographic projection of the part of the third sealant on the plane where the display panel is located, and is located in the orthographic projection of the third sealant on the plane where the display panel is located;
  • the fourth sub-cutting line corresponds to the orthographic projection of the part of the fourth sealant on the plane where the display panel is located, and is located in the orthographic projection of the fourth sealant on the plane where the display panel is located;
  • the flexible display mother board is provided with a peripheral cutting line, and the peripheral cutting line divides the flexible display mother board into a peripheral area and an inner peripheral area for setting the display panel.
  • the peripheral area is surrounded by The outer peripheral side of the inner enclosure area;
  • the flexible display mother board includes a second sealant; the orthographic projection of the peripheral cutting line on the plane where the flexible display mother board is located is within the orthographic projection of the second sealant on the plane where the flexible display mother board is located .
  • the second sub-cutting line divides the second sub-frame glue into a second outer sub-frame glue and a second inner sub-frame glue;
  • the third frame sealant is divided into a third outer frame sealant and a third inner frame sealant;
  • the fourth sub-cutting line divides the fourth frame sealant into a fourth outer frame sealant and a fourth inner frame sealant.
  • the second outer frame sealant, the third outer frame sealant, and the fourth outer frame sealant all have a first set width
  • the second inner frame sealant and the third inner frame sealant The widths of the fourth and fourth inner sealant are both greater than the first set width
  • the flexible display motherboard is provided with a bonding area cutting line, and the bonding area cutting line is used to cut out the bonding area of the array substrate of the display panel, and A third sealant is arranged between the cutting line of the binding area and the first sub-cutting line.
  • an edge cutting line is also provided on one side of the color filter substrate of the display panel, and the edge cutting line is used to remove a portion of a single color filter substrate corresponding to the binding area. To expose the binding area.
  • An embodiment of the application provides a liquid crystal display motherboard structure, including a flexible display motherboard and a first rigid substrate and a second rigid substrate arranged on both sides of the flexible display motherboard, the flexible display motherboard includes a plurality of Display panel,
  • the display panel includes a first sealant for bonding a color filter substrate and an array substrate, and a small chip cutting line is provided on the flexible display mother board, and the small chip cutting line is used to cut out a single display panel;
  • the orthographic projection of the part of the small piece cutting line on the plane where the display panel is located is within the orthographic projection of the first sealant on the plane where the display panel is located.
  • the display panel includes a binding area
  • the first sealant includes a first sub-frame sealant, a second sub-frame sealant, a third sub-frame sealant, and a fourth sub-frame sealant.
  • the first sub-frame glue is close to the binding area
  • the second sub-frame glue is arranged opposite to the first sub-frame glue
  • the third sub-frame glue is connected to the first sub-frame glue
  • the fourth sub-frame glue is arranged opposite to the third sub-frame glue
  • the small piece cutting line includes a first sub-cutting line, a second sub-cutting line, a third sub-cutting line, and a fourth sub-cutting line, the first sub-cutting line is close to the binding area; the second sub-cutting The line, the third sub-cutting line, and the fourth sub-cutting line are respectively set in one-to-one correspondence with the second, third, and fourth sub-frame glues;
  • the orthographic projection of the first sub-cutting line on the plane where the display panel is located is outside the orthographic projection of the first framing glue on the plane where the display panel is located;
  • the third sub-cutting line corresponds to the orthographic projection of the part of the third sealant on the plane where the display panel is located, and is located in the orthographic projection of the third sealant on the plane where the display panel is located;
  • the fourth dividing line corresponds to the orthographic projection of the part of the fourth sealant on the plane where the display panel is located, and is located in the orthographic projection of the fourth sealant on the plane where the display panel is located.
  • the second sub-cutting line divides the second sub-frame glue into a second outer sub-frame glue and a second inner sub-frame glue;
  • the third frame sealant is divided into a third outer frame sealant and a third inner frame sealant;
  • the fourth sub-cutting line divides the fourth frame sealant into a fourth outer frame sealant and a fourth inner frame sealant.
  • the second outer frame sealant, the third outer frame sealant, and the fourth outer frame sealant all have a first set width
  • the second inner frame sealant and the third inner frame sealant The widths of the fourth and fourth inner sealant are both greater than the first set width
  • the width of the first sealant is between 1-2.5cm, and the first set width is between 0.1-0.8cm.
  • the width of the first sealant is between 1.8-2.5cm, and the first set width is between 0.1-0.5cm.
  • the flexible display motherboard is provided with a bonding area cutting line, and the bonding area cutting line is used to cut out the bonding area of the array substrate of the display panel, and A third sealant is arranged between the cutting line of the binding area and the first sub-cutting line.
  • an edge cutting line is also provided on one side of the color filter substrate of the display panel, and the edge cutting line is used to remove a portion of a single color filter substrate corresponding to the binding area. To expose the binding area.
  • the flexible display motherboard is provided with a peripheral cutting line, and the peripheral cutting line divides the flexible display motherboard into a peripheral area and an inner area for arranging the display panel. Enclosed area, the peripheral area is enclosed on the outer peripheral side of the inner enclosure area;
  • the flexible display mother board includes a second sealant; the orthographic projection of the peripheral cutting line on the plane where the flexible display mother board is located is in the orthographic projection of the second sealant on the plane where the flexible display mother board is located.
  • This application also relates to a method for cutting the LCD motherboard structure, which includes the following steps:
  • the display motherboard includes a plurality of display panels, wherein the flexible display motherboard is provided with a peripheral cutting line, a chip cutting line, a binding area cutting line, and an edge cutting line, and the peripheral cutting line divides the flexible display motherboard into The peripheral area and the inner peripheral area for setting the display panel; the small piece cutting line is used to cut a single display panel; the orthographic projection of the portion of the small piece cutting line on the plane where the display panel is located is located in the first The sealant is in the orthographic projection of the plane where the display panel is located; the binding area cutting line is used to cut out the binding area of a single array substrate of the display panel; the edge cutting line is used to remove a single color film substrate A part corresponding to the binding area to expose the binding area;
  • the circuit board is bound in the binding area of the further display panel to obtain a flexible liquid crystal display panel.
  • the first sealant includes a first sub-frame glue, a second sub-frame glue, a third sub-frame glue, and a fourth sub-frame glue.
  • the sealant is close to the binding area, the second sub-frame seal is arranged opposite to the first sub-frame seal, and the third sub-frame seal is connected to the first and second sub-frame seals.
  • the fourth sub-frame glue is arranged opposite to the third sub-frame glue;
  • the small piece cutting line includes a first sub-cutting line, a second sub-cutting line, a third sub-cutting line, and a fourth sub-cutting line, the first sub-cutting line is close to the binding area; the second sub-cutting The line, the third sub-cutting line, and the fourth sub-cutting line are respectively set in one-to-one correspondence with the second, third, and fourth sub-frame glues;
  • the orthographic projection of the first dividing line on the plane where the display panel is located is outside of the orthographic projection of the first framing glue on the plane where the display panel is located;
  • the orthographic projection of the second dividing line on the plane where the display panel is located is within the orthographic projection of the second framing glue on the plane where the display panel is located;
  • the third sub-cutting line corresponds to the orthographic projection of the part of the third sealant on the plane where the display panel is located in the orthographic projection of the third sealant on the plane where the display panel is located;
  • the fourth sub-cut line corresponds to the orthographic projection of the part of the fourth sealant on the plane where the display panel is located within the orthographic projection of the fourth sealant on the plane where the display panel is located.
  • the second sub-cutting line divides the second sub-frame glue into a second outer sub-frame glue and a second inner sub-frame glue;
  • the cutting line divides the third frame glue into a third outer frame glue and a third inner frame glue;
  • the fourth cutting line divides the fourth frame glue into a fourth outer frame glue and The fourth inner frame glue;
  • the second outer frame sealant, the third outer frame sealant, and the fourth outer frame sealant all have a first set width
  • the second inner frame sealant and the third inner frame sealant The widths of the fourth and fourth inner sealant are both greater than the first set width
  • the width of the first sealant is between 1-2.5cm, and the first set width is between 0.1-0.8cm.
  • the width of the first sealant is between 1.8-2.5cm, and the first set width is between 0.1-0.5cm.
  • a third sealant is further coated on the color filter substrate or the array substrate; the third sealant is set on the cutting line and Between the first sub-cutting line.
  • a second sealant is further coated on the color filter substrate or the array substrate; wherein the peripheral cutting line is on the plane where the flexible display motherboard is located.
  • the orthographic projection of is located in the orthographic projection of the second sealant on the plane where the flexible display motherboard is located.
  • the liquid crystal display mother board structure and the cutting method thereof of the present application correspond to setting the part of the small chip cutting line in the first sealant, and the peripheral cutting line Correspondingly set in the second sealant, when cut along the two cutting lines respectively, make the two kinds of sealant after cutting are flush with the edge of the cut, and then the laser separation
  • the stresses of the flexible substrate cancel each other out, which will not cause energy unevenness caused by the curling of the peripheral flexible substrate during laser separation, avoid carbonization in areas with more energy, and inability to separate areas with less energy, which greatly improves the yield of laser separation ; It solves the technical problem that the flexible substrate of the motherboard is prone to curling when the existing liquid crystal display panel uses a laser to separate the motherboard and the rigid substrate.
  • FIG. 1 is a schematic structural diagram of a prior art LCD motherboard structure
  • FIG. 2 is a schematic structural diagram of a liquid crystal display motherboard structure according to an embodiment of the application.
  • FIG. 3 is a schematic diagram of a part of the structure of a liquid crystal display motherboard according to an embodiment of the application;
  • FIG. 4 is another schematic diagram of the structure of the LCD motherboard according to the embodiment of the application.
  • FIG. 5 is a flowchart of a method for cutting a liquid crystal display motherboard structure according to an embodiment of the application.
  • the prior art LCD motherboard structure 100 is provided with a peripheral cutting line 11, a small chip cutting line 12 and an edge cutting line 13, wherein the small chip cutting line 12 is used to cut the entire display panel and the binding area of the display panel; the edge cutting line 13 is used to cut the part of the color filter substrate corresponding to the binding area of the array substrate and expose the binding area.
  • the liquid crystal display mother board 100 further includes a first sealant 14 and a second sealant 15, and the first sealant 14 is used for bonding the color film substrate and the array substrate to form a display panel.
  • the sealant is set at least 200um inside the cutting line, for example, the distance between the first sealant 14 and the small piece cutting line 12, and the second sealant 15 and the outer cutting line The distance is 11 to prevent the cutter wheel from cutting on the frame rubber and failing to split due to accuracy problems during cutting.
  • FIG. 2 is a schematic structural diagram of a liquid crystal display motherboard structure of an embodiment of the application
  • FIG. 3 is a structural diagram of a part of a liquid crystal display motherboard structure of an embodiment of the application
  • the liquid crystal display mother board structure 2000 of the embodiment of the present application includes a flexible display mother board 200 and a first rigid substrate 31 and a second rigid substrate 32 disposed on both sides of the flexible display mother board 200.
  • the flexible display mother board 200 includes a plurality of display panels 20.
  • the display panel 20 includes a color filter substrate 21 formed on a first rigid substrate 31, an array substrate 22 formed on a second rigid substrate 32, and a first sealant 23 disposed between the color filter substrate 21 and the array substrate 22 .
  • the color filter substrate 21 and the array substrate 22 both include a flexible substrate 201, and the flexible substrate 201 is formed on the first rigid substrate 31 and the second rigid substrate 32, respectively.
  • the color filter substrate 21 and the array substrate 22 are sealed and bonded by the first sealant 23.
  • the first sealant 23 is rectangular, but it is not limited to this.
  • the flexible display motherboard 200 is provided with a small chip cutting line 2a.
  • the small piece cutting line 2a is used to cut a single preliminary display panel.
  • the chip cutting line 2a is rectangular, but it is not limited to this.
  • the orthographic projection of the part of the chip cutting line 2a on the plane where the display panel 20 is located is within the orthographic projection of the first sealant 23 on the plane where the display panel is located.
  • the stresses of the two flexible substrates 201 face the first rigid substrate 31 and the second rigid substrate 32 respectively.
  • the stresses of the two are in opposite directions.
  • the first sealant 23 bonds the two together, so that the stresses of the two flexible substrates 201 cancel each other out.
  • the edge of the first sealant 23 of the preliminary display panel obtained after cutting is flush with the edge of the preliminary display panel; then, the preliminary display panel is separated from the first
  • the rigid substrate 31 and the second rigid substrate 32 are separated by laser, the stresses of the flexible substrate 201 bonded on the upper and lower part of the first sealant 23 cancel each other out, which will not cause energy loss caused by the curling of the peripheral flexible substrate during laser separation. Even, it avoids the situation that the energy is more carbonized and the energy cannot be separated, and the laser separation yield is greatly improved.
  • the flatness of the array substrate 22 and the color filter substrate 21 can be maintained after the first rigid substrate 31 and the second rigid substrate 32 are removed , Can prevent the difficulty of sticking polarizer.
  • the display panel 20 includes a binding area, and the binding area is a binding area of the array substrate 22.
  • the first sealant 23 includes a first separate sealant 231, a second separate sealant 232, a third separate sealant 233, and a fourth separate sealant 234.
  • the first sealant 231 is close to the binding area.
  • the second sealant 232 and the first sealant 231 are arranged opposite to each other.
  • the third sealant 233 is connected to the same side of the first sealant 231 and the second sealant 232.
  • the fourth sealant 234 and the third sealant 233 are arranged opposite to each other.
  • the small piece cutting line 2a includes a first sub-cutting line 2a1, a second sub-cutting line 2a2, a third sub-cutting line 2a3, and a fourth sub-cutting line 2a4.
  • the first cutting line 2a1 is close to the binding area.
  • the second sub-cutting line 2a2, the third sub-cutting line 2a3, and the fourth sub-cutting line 2a4 are respectively set in one-to-one correspondence with the second sub-frame glue 232, the third sub-frame glue 233, and the fourth sub-frame glue 234.
  • the orthographic projection of the first dividing line 2a1 on the plane where the display panel 20 is located is outside the orthographic projection of the first framing glue 231 on the plane where the display panel 20 is located.
  • the orthographic projection of the second dividing line 2a2 on the plane where the display panel 20 is located is within the orthographic projection of the second framing glue 232 on the plane where the display panel 20 is located.
  • the third cutting line 2a3 corresponds to the orthographic projection of the part of the third sealant 233 on the plane where the display panel 20 is located, and is located in the orthographic projection of the third sealant 233 on the plane where the display panel 20 is located.
  • the fourth cutting line 2a4 corresponds to the orthographic projection of the part of the fourth sealant 234 on the plane where the display panel 20 is located, and is located in the orthographic projection of the fourth sealant 234 on the plane where the display panel 20 is located.
  • the flexible display motherboard 200 is provided with a binding area cutting line 2b.
  • the bonding area cutting line 2b is used to cut out the bonding area of the array substrate 22 of the display panel 20, and a third sealant 25 is provided between the bonding area cutting line 2b and the first cutting line 2a1.
  • a binding area of the array substrate 22 is provided on the side of the bonding area cutting line 2b close to the first sealant 23.
  • the third sealant 25 is provided on the other side of the cutting line 2b of the binding area. After the chip cutting line 2a is cut, the third sealant 25 bonds the periphery of the binding area of the array substrate 22 and the periphery of the color filter substrate 21 together. Therefore, during laser stripping of the rigid substrate, the flexible substrate in the binding area will not be curled, and the situation that the circuit board cannot be bound in the binding area is avoided.
  • the second sub-cutting line 2a2 divides the second sub-frame glue 232 into a second outer sub-frame glue 2321 and a second inner sub-frame glue 2322.
  • the third sub-cutting line 2a3 divides the third sub-frame glue 233 into a third outer sub-frame glue 2331 and a third inner sub-frame glue 2332.
  • the fourth dividing line 2a4 divides the fourth dividing frame glue 234 into a fourth outer dividing frame glue 2341 and a fourth inner dividing frame glue 2342.
  • the second outer frame glue 2321, the third outer frame glue 2331, and the fourth outer frame glue 2341 all have a first set width.
  • the widths of the second inner frame glue 2322, the third inner frame glue 2332, and the fourth inner frame glue 2342 are all greater than the first set width.
  • the width of the first sealant 23 is between 1-2.5 cm, and the first set width is between 0.1-0.8 cm.
  • the width of the first sealant 23 is between 1.8-2.5 cm, and the first set width is between 0.1-0.5 cm.
  • an edge cutting line 2c is also provided on one side of the color filter substrate 21 of the display panel 20.
  • the edge cutting line 2c is used to remove the part of the single color filter substrate 21 corresponding to the binding area to expose the binding area.
  • a peripheral cutting line 2d is provided on the flexible display mother board 200.
  • the peripheral cutting line 2d divides the flexible display mother board 200 into a peripheral area and an inner peripheral area for setting the display panel 20.
  • the outer area is enclosed on the outer peripheral side of the inner area.
  • the peripheral cutting line 2d has a rectangular shape, but it is not limited to this.
  • the flexible display mother board 200 includes a second sealant 24.
  • the second sealant 24 is rectangular, but it is not limited to this.
  • the orthographic projection of the peripheral cutting line 2d on the plane where the flexible display mother board 200 is located is in the orthographic projection of the second sealant 24 on the plane where the flexible display mother board 200 is located.
  • the preliminary flexible display mother board is obtained after cutting, wherein the edge of the second sealant 24 of the preliminary flexible display mother board is flush with the edge of the preliminary flexible display mother board ; Then, when the preliminary flexible display mother board is separated from the first rigid substrate 31 and the second rigid substrate 32 by laser, the stresses of the flexible substrate 201 bonded on the upper and lower part of the second sealant 24 cancel each other out.
  • the uneven energy caused by the curling of the peripheral flexible substrate during laser separation is caused, which avoids carbonization where there is more energy and cannot separate where the energy is small, and greatly improves the yield of laser separation.
  • the flatness of the array substrate 22 and the color filter substrate 21 can be maintained after the first rigid substrate 31 and the second rigid substrate 32 are removed , Can prevent the difficulty of sticking polarizer.
  • the peripheral cutting line 2d divides the second sealant 24 into the inner sealant 241 and the outer sealant 242, wherein the width of a single frame of the inner sealant 241 is greater than the width of a single frame of the outer sealant 242.
  • the width of a single frame of the outer frame glue 242 may be equal to the first set width, but it is not limited to this.
  • the liquid crystal display mother board structure 2000 of the embodiment of the present application is used to manufacture a flexible display panel, there can be two cutting methods. One is to first cut the peripheral dividing line 2d, and then separate the first rigid substrate 31 and the second rigid substrate 32 Then, the chip cutting line 2a is cut; the other is to first cut the peripheral dividing line 2d, then the chip cutting line 2a is cut, and then the first rigid substrate 31 and the second rigid substrate 32 are separated. Therefore, the present application can only set the first sealant 23 to correspond to the second cutting method to solve the technical problem of the flexible substrate curling caused by laser separation of the rigid substrate; or only set the second sealant 24 to correspond to the first A cutting method solves the technical problem of curling of flexible substrates caused by laser separation of rigid substrates. Of course, the embodiment of the present application not only sets the first sealant 23 but also sets the second sealant 24 to correspond to the two cutting methods.
  • FIG. 5 is a flowchart of a method for cutting a liquid crystal display motherboard structure according to an embodiment of the application. This application also relates to a method for cutting the LCD motherboard structure, which includes the following steps:
  • the flexible display mother board includes a plurality of display panels, wherein the flexible display mother board is provided with a peripheral cutting line, a small chip cutting line, a binding area cutting line and an edge cutting line, and the peripheral cutting line connects the flexible display mother board.
  • the small piece cutting line is used to cut a single display panel; the orthographic projection of the portion of the small piece cutting line on the plane where the display panel is located is located in the The first sealant is in the orthographic projection of the plane where the display panel is located; the binding area cutting line is used to cut out the binding area of a single array substrate of the display panel; the edge cutting line is used to remove a single color A portion of the film substrate corresponding to the binding area to expose the binding area;
  • S4 Perform laser separation on the flexible display motherboard, and remove the first rigid substrate and the second rigid substrate;
  • Step S1 providing a first rigid substrate 31 and a second rigid substrate 32, forming a color filter substrate 21 on the first rigid substrate 31, and forming an array substrate 22 on the second rigid substrate 32.
  • step S1 includes:
  • a flexible substrate 201 is formed on each of the first rigid substrate 31 and the second rigid substrate 31;
  • the array fabrication is completed on another flexible substrate 201 to form the array substrate 22.
  • Step S2 apply a first sealant 23 on the color filter substrate 21 or the array substrate 22, and bond the color filter substrate 21 and the array substrate 22 through the first sealant 23 to form a flexible display mother board 200.
  • the flexible display mother board 200 includes a plurality of display panels 20, wherein the flexible display mother board 200 is provided with a peripheral cutting line 2d, a small chip cutting line 2a, a binding area cutting line 2b, and an edge cutting line 2c.
  • the peripheral cutting line 2d divides the flexible display mother board 200 into a peripheral area and an inner peripheral area for setting the display panel 20.
  • the peripheral cutting line 2d is used to cut the peripheral area of the flexible display mother board 200.
  • the second sealant 24 is coated on the color filter substrate 21 or the array substrate 22.
  • the orthographic projection of the peripheral cutting line 2d on the plane where the flexible display mother board 200 is located is in the orthographic projection of the second sealant 24 on the plane where the flexible display mother board 200 is located.
  • the peripheral cutting line 2d and the second sealant 24 are both rectangular, as an example, but not limited to this.
  • the peripheral cutting line 2d divides the second sealant 24 into the inner sealant 241 and the outer sealant 242, wherein the width of a single frame of the inner sealant 241 is greater than the width of a single frame of the outer sealant 242.
  • the width of the single frame of the outer frame glue 242 may be equal to the first set width (explained below), but it is not limited thereto.
  • the small piece cutting line 2a is used to cut a single preliminary display panel.
  • the orthographic projection of the part of the chip cutting line 2a on the plane where the display panel 20 is located is within the orthographic projection of the first sealant 23 on the plane where the display panel 20 is located.
  • the small piece cutting line 2a and the first sealant 23 are both rectangular, as an example, but not limited to this.
  • the display panel 20 includes a binding area, and the binding area is a binding area of the array substrate 22.
  • the first sealant 23 includes a first separate sealant 231, a second separate sealant 232, a third separate sealant 233, and a fourth separate sealant 234.
  • the first sealant 231 is close to the binding area.
  • the second sealant 232 and the first sealant 231 are arranged opposite to each other.
  • the third sealant 233 is connected to the same side of the first sealant 231 and the second sealant 232.
  • the fourth sealant 234 and the third sealant 233 are arranged opposite to each other.
  • the small piece cutting line 2a includes a first sub-cutting line 2a1, a second sub-cutting line 2a2, a third sub-cutting line 2a3, and a fourth sub-cutting line 2a4.
  • the first cutting line 2a1 is close to the binding area.
  • the second sub-cutting line 2a2, the third sub-cutting line 2a3, and the fourth sub-cutting line 2a4 are respectively set in one-to-one correspondence with the second sub-frame glue 232, the third sub-frame glue 233, and the fourth sub-frame glue 234.
  • the orthographic projection of the first dividing line 2a1 on the plane where the display panel 20 is located is outside the orthographic projection of the first framing glue 231 on the plane where the display panel 20 is located.
  • the orthographic projection of the second dividing line 2a2 on the plane where the display panel 20 is located is within the orthographic projection of the second framing glue 232 on the plane where the display panel 20 is located.
  • the third cutting line 2a3 corresponds to the orthographic projection of the part of the third sealant 233 on the plane where the display panel 20 is located, and is located in the orthographic projection of the third sealant 233 on the plane where the display panel 20 is located.
  • the fourth cutting line 2a4 corresponds to the orthographic projection of the part of the fourth sealant 234 on the plane where the display panel 20 is located, and is located in the orthographic projection of the fourth sealant 234 on the plane where the display panel 20 is located.
  • the bonding area cutting line 2 b is used to cut out the bonding area of the single array substrate 22 of the display panel 20.
  • the edge cutting line 2b is used to remove the part of the single color filter substrate 21 corresponding to the binding area to expose the binding area.
  • the second dividing line 2a2 divides the second dividing frame glue 232 into a second outer dividing frame glue 2321 and a second inner dividing frame glue 2322.
  • the third sub-cutting line 2a3 divides the third sub-frame glue 233 into a third outer sub-frame glue 2331 and a third inner sub-frame glue 2332.
  • the fourth dividing line 2a4 divides the fourth dividing frame glue 234 into a fourth outer dividing frame glue 2341 and a fourth inner dividing frame glue 2342.
  • the second outer frame glue 2321, the third outer frame glue 2331, and the fourth outer frame glue 2341 all have a first set width.
  • the widths of the second inner frame glue 2322, the third inner frame glue 2332, and the fourth inner frame glue 2342 are all greater than the first set width.
  • the width of the first sealant 23 is between 1-2.5 cm, and the first set width is between 0.1-0.8 cm.
  • the width of the first sealant 23 is between 1.8-2.5 cm, and the first set width is between 0.1-0.5 cm.
  • the color filter substrate 21 or the array substrate 22 is further coated with a third sealant 25.
  • the third sealant 25 is arranged between the cutting line 2b of the binding area and the first sub-cutting line 2a1.
  • the edge cutting line 2c is used to remove the part of the single color filter substrate 21 corresponding to the binding area to expose the binding area of the array substrate 22.
  • step S3 cutting the LCD mother board structure 2000 along the peripheral cutting line 2d to remove the peripheral area of the flexible display mother board 200 to obtain a preliminary flexible display mother board 200.
  • a laser is first used for cutting to cut the flexible substrate 201 and the film layer thereon, and then a mechanical cutter wheel is used to cut the rigid substrate into split pieces.
  • a larger energy laser can be used to cut the rigid substrate and the flexible substrate and the film layer thereon at one time.
  • Laser cutting includes but is not limited to ultraviolet cutting, infrared cutting, CO2 cutting, etc.
  • the second sealant 24 is divided into an inner sealant 241 and an outer sealant 242. After cutting, the edge of the inner frame glue 241 is flush with the edge of the preliminary flexible display mother board 200.
  • the cut flexible display panel 200 also has an inner frame glue 241 which bonds the flexible substrate 201 on the color filter substrate 21 and the flexible substrate 201 on the array substrate 22 together.
  • Step S4 Perform laser separation on the flexible display mother board 200, and remove the first rigid substrate 31 and the second rigid substrate 32.
  • the stresses of the flexible substrate 201 adhered to the upper and lower inner frame glue 241 cancel each other out the energy unevenness caused by the curling of the outer flexible substrate 201 during laser separation will not be caused, and the carbonization of more energy is avoided.
  • the situation where the separation is not possible in smaller places greatly improves the yield of laser separation.
  • the stresses of the flexible substrates 201 bonded to the upper and lower sides of the inner frame glue 241 cancel each other out the flatness of the array substrate 22 and the color filter substrate 21 can be maintained after the first rigid substrate 31 and the second rigid substrate 32 are removed. It can prevent the difficulty of sticking the polarizer.
  • the cutting line 2b of the binding area is close to the first sealant 23 .
  • the third sealant 25 is provided on the other side of the cutting line 2b of the binding area. After the chip cutting line 2a is cut, the third sealant 25 bonds the periphery of the binding area of the array substrate 22 and the periphery of the color filter substrate 21 together. Therefore, during laser stripping of the rigid substrate, the flexible substrate in the binding area will not be curled, and the situation that the circuit board cannot be bound in the binding area is avoided.
  • Step S6 Attach a polarizer on the preliminary display panel. Specifically, polarizers are attached to the color filter substrate 21 and the array substrate 22 respectively. Then go to step S7.
  • Step S7 simultaneously cutting the array substrate 22 and the color filter substrate 21 of the display panel along the cutting line 2b of the binding area, and cutting the color filter substrate 21 along the edge cutting line 2c to obtain a further display panel.
  • cutting is performed along the cutting line 2b of the binding area to remove the third sealant 25 after the binding area. Cut along the edge cutting line 2c to remove the part of the color filter substrate 21 corresponding to the binding area to expose the binding area.
  • the flexible substrate 201 is adhered between the upper and lower polarizers without natural curling, which facilitates the bonding process of the bonding area in step S8. Then go to step S8.
  • steps S5 and S4 may be performed in sequence, and finally steps S6, S7, and S8 are performed. That is, step S4 and step S5 of the above-mentioned embodiment are reversed.
  • step S5 is first performed: cutting the flexible display mother board 200 along the chip cutting line 2a to obtain a preliminary display panel.
  • the preliminary display panel also has rigid substrates (the first rigid substrate 31 and the second rigid substrate 32).
  • step S4 laser separation is performed on the flexible display mother board 200, and the first rigid substrate 31 and the second rigid substrate 32 are removed.
  • the "flexible display motherboard 200" in “laser separation of the flexible display motherboard 200” is the remaining preliminary display panel of the flexible display motherboard 200 after step S5.
  • the edge of the first sealant 23 of the preliminary display panel obtained after cutting is flush with the edge of the preliminary display panel; and then, the preliminary display panel is respectively
  • the stress of the flexible substrate 201 bonded on the upper and lower part of the first sealant 23 cancels each other out, which will not cause the curling of the peripheral flexible substrate during laser separation.
  • the uneven energy avoids carbonization where there is more energy and cannot separate where there is less energy, which greatly improves the yield of laser separation.
  • the flatness of the array substrate 22 and the color filter substrate 21 can be maintained after the first rigid substrate 31 and the second rigid substrate 32 are removed , Can prevent the difficulty of sticking polarizer.
  • the liquid crystal display mother board structure and the cutting method thereof of the present application correspond to setting the part of the small chip cutting line in the first sealant, and the peripheral cutting line Correspondingly set in the second sealant, when cut along the two cutting lines respectively, make the two kinds of sealant after cutting are flush with the edge of the cut, and then the laser separation
  • the stresses of the flexible substrate cancel each other out, which will not cause energy unevenness caused by the curling of the peripheral flexible substrate during laser separation, avoid carbonization in areas with more energy, and inability to separate areas with less energy, which greatly improves the yield of laser separation ; It solves the technical problem that the flexible substrate of the motherboard is prone to curling when the existing liquid crystal display panel uses a laser to separate the motherboard and the rigid substrate.

Abstract

一种液晶显示母板结构（2000）及其切割方法。液晶显示母板结构（2000）包括柔性显示母板（200），柔性显示母板（200）包括多个显示面板（20），显示面板（20）包括用于贴合彩膜基板（21）和阵列基板（22）的第一框胶（23），柔性显示母板（200）上设置有小片切割线（2a），小片切割线（2a）用于切割出单个显示面板（20）；小片切割线（2a）的部分于显示面板（20）所在平面的正投影，位于第一框胶（23）于所述显示面板（20）所在平面的正投影内。

Description

液晶显示母板结构及其切割方法 技术领域
本申请涉及一种显示技术，特别涉及一种液晶显示母板结构及其切割方法。
 背景技术
柔性有机发光二极管（Organic Light-emitting Diode,OLED）面板将逐步实现量产化。同时，行业内也兴起了柔性液晶显示装置的研究开发。柔性液晶显示装置的制作过程，一般包括：在刚性基板上的柔性衬底上分别制作相应膜层，形成彩膜基板和阵列基板；然后将阵列基板和彩膜基板进行对组；接着，对母板进行剥离处理，将母板与刚性基板处于分离的状态；最后，将母板切割成多个独立的柔性显示面板以及在每个柔性显示面板上绑定柔性印刷电路板，进行偏光片贴附。
目前，将母板和刚性基板进行分离的主要方式为激光分离，但激光分离产生的能量会使得母板的柔性衬底产生应力，从而向朝着刚性基板的一侧卷曲。这种卷曲不仅影响激光分离时的均匀性，也会造成偏光片贴附及绑定工艺无法进行。
 技术问题
本申请实施例提供一种液晶显示母板结构及其切割方法，以解决现有的液晶显示面板采用激光对母板和刚性基板的分离时，促使母板的柔性衬底容易发生卷曲的技术问题。
 技术解决方案
本申请实施例提供一种液晶显示母板结构，包括柔性显示母板和设置在所述柔性显示母板两侧的第一刚性基板以及第二刚性基板，所述柔性显示母板包括多个显示面板，其中，
所述显示面板包括用于贴合彩膜基板和阵列基板的第一框胶，所述柔性显示母板上设置有小片切割线，所述小片切割线用于切割出单个显示面板；
所述小片切割线的部分于所述显示面板所在平面的正投影，位于所述第一框胶于所述显示面板所在平面的正投影内；
所述显示面板包括一绑定区域，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接在所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
其中，所述第一分切割线于所述显示面板所在平面的正投影，位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
所述第二分切割线于所述显示面板所在平面的正投影，位于所述第二分框胶于所述显示面板所在平面的正投影内；
所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影，位于所述第三分框胶于所述显示面板所在平面的正投影内；
所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影，位于所述第四分框胶于所述显示面板所在平面的正投影内；
所述柔性显示母板上设置有一外围切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区，所述外围区围设在所述内围区的外周侧；
所述柔性显示母板包括第二框胶；所述外围切割线于所述柔性显示母板所在平面的正投影，位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
在本申请的液晶显示母板结构中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
在本申请的液晶显示母板结构中，所述柔性显示母板上设置有绑定区切割线，所述绑定区切割线用于切割出所述显示面板的阵列基板的绑定区域，且所述绑定区切割线和所述第一分切割线之间设置有第三框胶。
在本申请的液晶显示母板结构中，所述显示面板的彩膜基板的一侧还设置有边缘切割线，所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域。
本申请实施例提供还一种液晶显示母板结构，包括柔性显示母板和设置在所述柔性显示母板两侧的第一刚性基板以及第二刚性基板，所述柔性显示母板包括多个显示面板，
所述显示面板包括用于贴合彩膜基板和阵列基板的第一框胶，所述柔性显示母板上设置有小片切割线，所述小片切割线用于切割出单个显示面板；
所述小片切割线的部分于所述显示面板所在平面的正投影，位于所述第一框胶于所述显示面板所在平面的正投影内。
在本申请的液晶显示母板结构中，所述显示面板包括一绑定区域，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接于所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
其中，所述第一分切割线于所述显示面板所在平面的正投影，位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
所述第二分切割线于所述显示面板所在平面的正投影，位于所述第二分框胶于所述显示面板所在平面的正投影内；
所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影，位于所述第三分框胶于所述显示面板所在平面的正投影内；
所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影，位于所述第四分框胶于所述显示面板所在平面的正投影内。
在本申请的液晶显示母板结构中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
第一框胶的宽度在1-2.5cm之间，第一设定宽度在0.1-0.8cm之间。可选的，第一框胶的宽度在1.8-2.5cm之间，第一设定宽度在0.1-0.5cm之间。这样，可保证柔性液晶显示面板足够的框胶，使得后续弯折时不易分开，且能保证激光切割后，面板边缘与框胶边缘齐整，能更好的控制上下柔性衬底的应力抵消。
在本申请的液晶显示母板结构中，所述柔性显示母板上设置有绑定区切割线，所述绑定区切割线用于切割出所述显示面板的阵列基板的绑定区域，且所述绑定区切割线和所述第一分切割线之间设置有第三框胶。
在本申请的液晶显示母板结构中，所述显示面板的彩膜基板的一侧还设置有边缘切割线，所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域。
在本申请的液晶显示母板结构中，所述柔性显示母板上设置有一外围切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区，所述外围区围设在所述内围区的外周侧；
所述柔性显示母板包括第二框胶；所述外围切割线于所述柔性显示母板所在平面的正投影位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
本申请还涉及一种液晶显示母板结构的切割方法，其包括以下步骤：
提供第一刚性基板和第二刚性基板，并在所述第一刚性基板上形成彩膜基板，在所述第二刚性基板上形成阵列基板；
在所述彩膜基板或所述阵列基板上涂布第一框胶，并通过所述第一框胶将所述彩膜基板和所述阵列基板进行贴合形成柔性显示母板，所述柔性显示母板包括多个显示面板，其中所述柔性显示母板设置有一外围切割线、小片切割线、绑定区切割线和边缘切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区；所述小片切割线用于切割出单个显示面板；所述小片切割线的部分于所述显示面板所在平面的正投影位于所述第一框胶于所述显示面板所在平面的正投影内；所述绑定区切割线用于切割出所述显示面板的单个阵列基板的绑定区域；所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域；
沿着所述外围切割线对所述液晶显示母板结构进行切割，去除所述柔性显示母板的外围区；
对所述柔性显示母板进行激光分离，去除所述第一刚性基板和所述第二刚性基板；
沿着所述小片切割线对所述柔性显示母板进行切割，得到初步的显示面板；
在所述初步的显示面板上贴附偏光片；
沿着所述绑定区切割线对所述显示面板的阵列基板和彩膜基板进行同时切割，且沿着所述边缘切割线对所述彩膜基板进行切割，得到进一步的显示面板；
在所述进一步的显示面板的绑定区域绑定电路板，得到柔性液晶显示面板。
在本申请的液晶显示母板结构的切割方法中，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接于所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
其中，所述第一分切割线于所述显示面板所在平面的正投影位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
所述第二分切割线于所述显示面板所在平面的正投影位于所述第二分框胶于所述显示面板所在平面的正投影内；
所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影位于所述第三分框胶于所述显示面板所在平面的正投影内；
所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影位于所述第四分框胶于所述显示面板所在平面的正投影内。
在本申请的液晶显示母板结构的切割方法中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
第一框胶的宽度在1-2.5cm之间，第一设定宽度在0.1-0.8cm之间。可选的，第一框胶的宽度在1.8-2.5cm之间，第一设定宽度在0.1-0.5cm之间。这样，可保证柔性液晶显示面板足够的框胶，使得后续弯折时不易分开，且能保证激光切割后，面板边缘与框胶边缘齐整，能更好的控制上下柔性衬底的应力抵消。
在本申请的液晶显示母板结构的切割方法中，在所述彩膜基板或所述阵列基板上还涂布第三框胶；所述第三框胶设置在所述绑定区切割线和所述第一分切割线之间。
在本申请的液晶显示母板结构的切割方法中，在所述彩膜基板或所述阵列基板上还涂布第二框胶；其中，所述外围切割线于所述柔性显示母板所在平面的正投影位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
 有益效果
相较于现有技术的液晶显示母板结构的切割方法，当本申请的液晶显示母板结构及其切割方法通过将小片切割线的部分对应设置在第一框胶中，以及将外围切割线对应设置在第二框胶中，当分别沿着两种切割线进行切割后，使得切割后两种框胶与切割的边缘平齐，再进行激光分离时，粘接在两种框胶上下的柔性衬底应力相互抵消，不会造成激光分离时因外围柔性衬底卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率；解决了现有的液晶显示面板采用激光对母板和刚性基板的分离时，促使母板的柔性衬底容易发生卷曲的技术问题。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面对实施例中所需要使用的附图作简单的介绍。下面描述中的附图仅为本申请的部分实施例，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1为现有技术的液晶显示母板结构的结构示意图；
图2为本申请的实施例的液晶显示母板结构的结构示意图；
图3为本申请的实施例的液晶显示母板结构的部分的结构示意图；
图4为本申请的实施例的液晶显示母板结构的另一结构示意图；
图5为本申请的实施例的液晶显示母板结构的切割方法的流程图。
 本发明的实施方式
请参照附图中的图式，其中相同的组件符号代表相同的组件。以下的说明是基于所例示的本申请具体实施例，其不应被视为限制本申请未在此详述的其它具体实施例。
首先，请参照图1，本文简单介绍一下现有技术的液晶显示母板结构。现有技术的液晶显示母板结构100设置有外围切割线11、小片切割线12和边缘切割线13，其中小片切割线12用于切割出整个显示面板和显示面板的绑定区域；边缘切割线13用于切割彩膜基板对应于阵列基板的绑定区域的部分并裸露出该绑定区域。另外，液晶显示母板100还包括第一框胶14和第二框胶15，第一框胶14用于贴合彩膜基板和阵列基板，以形成显示面板。
在现有技术中，考虑到切割精度的问题，都会将框胶设置在切割线内侧至少200um，比如，第一框胶14与小片切割线12的距离，以及第二框胶15与外围切割线11的距离，以防止切割时因精度问题，导致刀轮切在框胶上而无法裂片。
但是该种设计应用在柔性液晶显示面板上，由于柔性液晶显示面板的边缘距离框胶有至少200um的距离，在激光分离时，因应力问题，框胶外侧边缘部分向刚性载体基板一侧卷曲，造成激光的焦点改变，使得分离不均匀，从而导致激光能量较大处柔性衬底炭化，激光能量较小处无法分离，同时，该种情况造成的卷曲会增加偏贴和绑定难度。
请参照图2至图4，图2为本申请的实施例的液晶显示母板结构的结构示意图；图3为本申请的实施例的液晶显示母板结构的部分的结构示意图；图4为本申请的实施例的液晶显示母板结构的另一结构示意图。
本申请实施例的液晶显示母板结构2000包括柔性显示母板200和设置在柔性显示母板200两侧的第一刚性基板31以及第二刚性基板32。柔性显示母板200包括多个显示面板20。显示面板20包括形成在第一刚性基板31上的彩膜基板21、形成在第二刚性基板32上的阵列基板22、以及设置在彩膜基板21和阵列基板22之间的第一框胶23。其中，彩膜基板21和阵列基板22均包括柔性衬底201，柔性衬底201分别形成在第一刚性基板31以及第二刚性基板32上。
彩膜基板21和阵列基板22通过第一框胶23密封贴合。其中，在本实施例中，第一框胶23为矩形状，但并不限于此。柔性显示母板200上设置有小片切割线2a。小片切割线2a用于切割出单个初步的显示面板。其中，在本实施例中，小片切割线2a呈矩形状，但并不限于此。
小片切割线2a的部分于显示面板20所在平面的正投影，位于第一框胶23于所述显示面板所在平面的正投影内。
需要说明是，两个柔性衬底201的应力分别朝向第一刚性基板31和第二刚性基板32。当彩膜基板21和阵列基板22成盒后，二者的应力是相反方向。第一框胶23将两者粘接在一起，使得两个柔性衬底201的应力相互抵消。
当激光沿着小片切割线2a进行切割时，使得切割后得到的初步的显示面板的第一框胶23的边缘与初步的显示面板的边缘齐平；而后，将初步的显示面板分别与第一刚性基板31和第二刚性基板32进行激光分离时，由于粘接在第一框胶23上下的柔性衬底201的应力相互抵消，不会造成激光分离时因外围柔性衬底卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率。并且，因粘接在第一框胶23上下的柔性衬底201应力相互抵消，可在去除第一刚性基板31和第二刚性基板32后仍能保持阵列基板22和彩膜基板21的平整性，可防止出现偏光片的粘贴困难。
具体的，显示面板20包括一绑定区域，该绑定区域为阵列基板22的绑定区域。第一框胶23包括第一分框胶231、第二分框胶232、第三分框胶233和第四分框胶234。第一分框胶231靠近绑定区域。第二分框胶232与第一分框胶231相对设置。第三分框胶233连接在第一分框胶231和第二分框胶232的同一侧。第四分框胶234与第三分框胶233相对设置。
小片切割线2a包括第一分切割线2a1、第二分切割线2a2、第三分切割线2a3和第四分切割线2a4。第一分切割线2a1靠近绑定区域。第二分切割线2a2、第三分切割线2a3和第四分切割线2a4分别与第二分框胶232、第三分框胶233和第四分框胶234一一对应设置。
其中，第一分切割线2a1于显示面板20所在平面的正投影，位于第一分框胶231于显示面板20所在平面的正投影的外侧。
第二分切割线2a2于显示面板20所在平面的正投影，位于第二分框胶232于显示面板20所在平面的正投影内。
第三分切割线2a3对应于第三分框胶233的部分于显示面板20所在平面的正投影，位于第三分框胶233于显示面板20所在平面的正投影内。
第四分切割线2a4对应于第四分框胶234的部分于显示面板20所在平面的正投影，位于第四分框胶234于显示面板20所在平面的正投影内。
另外，柔性显示母板200上设置有绑定区切割线2b。绑定区切割线2b用于切割出显示面板20的阵列基板22的绑定区域，且绑定区切割线2b和第一分切割线2a1之间设置有第三框胶25。其中，绑定区切割线2b靠近第一框胶23的一侧设置有阵列基板22的绑定区域。绑定区切割线2b的另一侧设置有该第三框胶25。当切割完小片切割线2a后，第三框胶25将阵列基板22的绑定区域的外围和彩膜基板21的外围粘接在一起。因此在进行刚性基板的激光剥离时，绑定区域的柔性衬底不会发生卷曲，避免发生无法在绑定区域绑定电路板的情况。
在本实施例中，第二分切割线2a2将第二分框胶232分割为第二外分框胶2321和第二内分框胶2322。第三分切割线2a3将第三分框胶233分割为第三外分框胶2331和第三内分框胶2332。第四分切割线2a4将第四分框胶234分割为第四外分框胶2341和第四内分框胶2342。
其中，第二外分框胶2321、第三外分框胶2331和第四外分框胶2341均具有第一设定宽度。第二内分框胶2322、第三内分框胶2332和第四内分框胶2342的宽度均大于第一设定宽度。
第一框胶23的宽度在1-2.5cm之间，第一设定宽度在0.1-0.8cm之间。可选的，第一框胶23的宽度在1.8-2.5cm之间，第一设定宽度在0.1-0.5cm之间。这样，可保证柔性液晶显示面板足够的框胶，使得后续弯折时不易分开，且能保证激光切割后，面板边缘与框胶边缘齐整，能更好的控制上下柔性衬底201的应力抵消。
在本实施例中，显示面板20的彩膜基板21的一侧还设置有边缘切割线2c。边缘切割线2c用于去除单个彩膜基板21对应于绑定区域的部分以裸露出绑定区域。
且柔性显示母板200上设置有一外围切割线2d。外围切割线2d将柔性显示母板200分为外围区和用于设置显示面板20的内围区。外围区围设在内围区的外周侧。其中，外围切割线2d呈矩形状，但并不限于此。
柔性显示母板200包括第二框胶24。在本实施例中，第二框胶24呈矩形状，但并不限于此。外围切割线2d于柔性显示母板200所在平面的正投影，位于第二框胶24于柔性显示母板200所在平面的正投影内。
当激光沿着外围切割线2d进行切割时，使得切割后得到的初步的柔性显示母板，其中初步的柔性显示母板的第二框胶24的边缘与初步的柔性显示母板的边缘齐平；而后，将初步的柔性显示母板分别与第一刚性基板31和第二刚性基板32进行激光分离时，由于粘接在第二框胶24上下的柔性衬底201的应力相互抵消，不会造成激光分离时因外围柔性衬底卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率。并且，因粘接在第二框胶24上下的柔性衬底201应力相互抵消，可在去除第一刚性基板31和第二刚性基板32后仍能保持阵列基板22和彩膜基板21的平整性，可防止出现偏光片的粘贴困难。
具体的，外围切割线2d将第二框胶24分割为了内框胶241和外框胶242，其中内框胶241的单条框的宽度大于外框胶242的单条框的宽度。可选的，外框胶242的单条框的宽度可以等于第一设定宽度，但并不限于此。
本申请实施例的液晶显示母板结构2000在制作柔性显示面板时，可以有两种切割方法，一种是先切割外围分割线2d，接着进行第一刚性基板31和第二刚性基板32的分离，后在进行小片切割线2a的切割；另一种是先切割外围分割线2d，接着进行过小片切割线2a的切割，后进行第一刚性基板31和第二刚性基板32的分离。因此本申请可以仅设置第一框胶23以对应于第二种切割方法，解决刚性基板激光分离时，引起的柔性衬底卷曲的技术问题；也可以仅设置第二框胶24以对应于第一种切割方法，解决刚性基板激光分离时，引起的柔性衬底卷曲的技术问题。当然本申请的实施例不仅设置了第一框胶23，而且设置第二框胶24，以对应两种切割方法。
本实施例的液晶显示母板2000的切割方法的具体步骤过程，请参照下文的本申请的一种液晶显示母板结构的切割方法的具体内容，在此不赘述。需要说明的是，本实施例的液晶显示母板2000的结构和下文中的液晶显示母板结构的结构一致。
请参照图2至图5，图5为本申请的实施例的液晶显示母板结构的切割方法的流程图。本申请还涉及一种液晶显示母板结构的切割方法，其包括以下步骤：
S1：提供第一刚性基板和第二刚性基板，并在所述第一刚性基板上形成彩膜基板，在所述第二刚性基板上形成阵列基板；
S2：在所述彩膜基板或所述阵列基板上涂布第一框胶，并通过所述第一框胶将所述彩膜基板和所述阵列基板进行贴合形成柔性显示母板，所述柔性显示母板包括多个显示面板，其中所述柔性显示母板设置有一外围切割线、小片切割线、绑定区切割线和边缘切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区；所述小片切割线用于切割出单个显示面板；所述小片切割线的部分于所述显示面板所在平面的正投影位于所述第一框胶于所述显示面板所在平面的正投影内；所述绑定区切割线用于切割出所述显示面板的单个阵列基板的绑定区域；所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域；
S3：沿着所述外围切割线对所述液晶显示母板结构进行切割，去除所述柔性显示母板的外围区；
S4：对所述柔性显示母板进行激光分离，去除所述第一刚性基板和所述第二刚性基板；
S5：沿着所述小片切割线对所述柔性显示母板进行切割，得到初步的显示面板；
S6：在所述初步的显示面板上贴附偏光片；
S7：沿着所述绑定区切割线对所述显示面板的阵列基板和彩膜基板进行同时切割，且沿着所述边缘切割线对所述彩膜基板进行切割，得到进一步的显示面板；
S8：在所述进一步的显示面板的绑定区域绑定电路板，得到柔性液晶显示面板。
对本申请的实施例的液晶显示母板结构2000的切割方法的具体阐述如下：
步骤S1：提供第一刚性基板31和第二刚性基板32，并在第一刚性基板31上形成彩膜基板21，在第二刚性基板32上形成阵列基板22。
具体的，步骤S1包括：
在第一刚性基板31和第二刚性基板31上各自形成柔性衬底201；
在其一柔性衬底201上完成彩膜制作，形成彩膜基板21；
在另一柔性衬底201上完成阵列制作，形成阵列基板22。
随后转入步骤S2。
步骤S2：在彩膜基板21或阵列基板22上涂布第一框胶23，并通过第一框胶23将彩膜基板21和阵列基板22进行贴合形成柔性显示母板200。
具体的，柔性显示母板200包括多个显示面板20，其中柔性显示母板200设置有一外围切割线2d、小片切割线2a、绑定区切割线2b和边缘切割线2c。
外围切割线2d将柔性显示母板200分为外围区和用于设置显示面板20的内围区。外围切割线2d用于切除柔性显示母板200的外围区。在彩膜基板21或阵列基板22上涂布第二框胶24。其中，外围切割线2d于柔性显示母板200所在平面的正投影，位于所第二框胶24于柔性显示母板200所在平面的正投影内。其中，本实施例以外围切割线2d和第二框胶24均为矩形，为例进行说明，但并不限于此。
具体的，外围切割线2d将第二框胶24分割为了内框胶241和外框胶242，其中内框胶241的单条框的宽度大于外框胶242的单条框的宽度。可选的，外框胶242的单条框的宽度可以等于第一设定宽度（下文有阐述），但并不限于此。
小片切割线2a用于切割出单个初步的显示面板。小片切割线2a的部分于显示面板20所在平面的正投影，位于所第一框胶23于显示面板20所在平面的正投影内。本实施例以小片切割线2a和第一框胶23均为矩形，为例进行说明，但并不限于此。
具体的，显示面板20包括一绑定区域，该绑定区域为阵列基板22的绑定区域。第一框胶23包括第一分框胶231、第二分框胶232、第三分框胶233和第四分框胶234。第一分框胶231靠近绑定区域。第二分框胶232与第一分框胶231相对设置。第三分框胶233连接在第一分框胶231和第二分框胶232的同一侧。第四分框胶234与第三分框胶233相对设置。
小片切割线2a包括第一分切割线2a1、第二分切割线2a2、第三分切割线2a3和第四分切割线2a4。第一分切割线2a1靠近绑定区域。第二分切割线2a2、第三分切割线2a3和第四分切割线2a4分别与第二分框胶232、第三分框胶233和第四分框胶234一一对应设置。
其中，第一分切割线2a1于显示面板20所在平面的正投影，位于第一分框胶231于显示面板20所在平面的正投影的外侧。
第二分切割线2a2于显示面板20所在平面的正投影，位于第二分框胶232于显示面板20所在平面的正投影内。
第三分切割线2a3对应于第三分框胶233的部分于显示面板20所在平面的正投影，位于第三分框胶233于显示面板20所在平面的正投影内。
第四分切割线2a4对应于第四分框胶234的部分于显示面板20所在平面的正投影，位于第四分框胶234于显示面板20所在平面的正投影内。
绑定区切割线2b用于切割出显示面板20的单个阵列基板22的绑定区域。边缘切割线2b用于去除单个彩膜基板21对应于绑定区域的部分以裸露出绑定区域。
第二分切割线2a2将第二分框胶232分割为第二外分框胶2321和第二内分框胶2322。第三分切割线2a3将第三分框胶233分割为第三外分框胶2331和第三内分框胶2332。第四分切割线2a4将第四分框胶234分割为第四外分框胶2341和第四内分框胶2342。
其中，第二外分框胶2321、第三外分框胶2331和第四外分框胶2341均具有第一设定宽度。第二内分框胶2322、第三内分框胶2332和第四内分框胶2342的宽度均大于第一设定宽度。
第一框胶23的宽度在1-2.5cm之间，第一设定宽度在0.1-0.8cm之间。可选的，第一框胶23的宽度在1.8-2.5cm之间，第一设定宽度在0.1-0.5cm之间。这样，可保证柔性液晶显示面板足够的框胶，使得后续弯折时不易分开，且能保证激光切割后，面板边缘与框胶边缘齐整，能更好的控制上下柔性衬底201的应力抵消。
彩膜基板21或阵列基板22上还涂布第三框胶25。第三框胶25设置在绑定区切割线2b和第一分切割线2a1之间。
边缘切割线2c用于去除单个彩膜基板21对应于绑定区域的部分以裸露出阵列基板22的绑定区域。
随后转入步骤S3：沿着外围切割线2d对液晶显示母板结构2000进行切割，去除柔性显示母板200的外围区，得到初步的柔性显示母板200。
具体的，先采用激光进行切割，将柔性衬底201及其上的膜层切断，再使用机械刀轮切割将刚性基板进行切割裂片。可选的，可使用较大能量的激光一次性将刚性基板及柔衬底和其上的膜层切断。激光切割包含但不限于紫外切割、红外切割、CO2切割等。
由于外围切割线2d将第二框胶24分割为了内框胶241和外框胶242。在切割后，内框胶241的边缘与初步的柔性显示母板200的边缘齐平。
因此切割后的柔性显示面板200还具有内框胶241，内框胶241将彩膜基板21上的柔性衬底201和阵列基板22上的柔性衬底201粘接在一起。
随后转入步骤S4。
步骤S4：对柔性显示母板200进行激光分离，去除第一刚性基板31和第二刚性基板32。
具体的，由于粘接在内框胶241上下的柔性衬底201的应力相互抵消，不会造成激光分离时因外围柔性衬底201卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率。并且，因粘接在内框胶241上下的柔性衬底201应力相互抵消，可在去除第一刚性基板31和第二刚性基板32后仍能保持阵列基板22和彩膜基板21的平整性，可防止出现偏光片的粘贴困难。
随后转入步骤S5。
S5：沿着小片切割线2a对柔性显示母板200进行切割，得到初步的显示面板。
由于绑定区切割线2b靠近第一框胶23的一侧设置有阵列基板22的绑定区域。绑定区切割线2b的另一侧设置有该第三框胶25。当切割完小片切割线2a后，第三框胶25将阵列基板22的绑定区域的外围和彩膜基板21的外围粘接在一起。因此在进行刚性基板的激光剥离时，绑定区域的柔性衬底不会发生卷曲，避免发生无法在绑定区域绑定电路板的情况。
随后转入S6。
步骤S6：在初步的显示面板上贴附偏光片。具体的，偏光片分别贴附在彩膜基板21和阵列基板22上。随后转入步骤S7。
步骤S7：沿着绑定区切割线2b对显示面板的阵列基板22和彩膜基板21进行同时切割，且沿着边缘切割线2c对彩膜基板21进行切割，得到进一步的显示面板。
具体的，沿着绑定区切割线2b进行切割，以去除绑定区域后的第三框胶25。沿着边缘切割线2c进行切割，去除彩膜基板21对应于绑定区域的部分，以裸露出绑定区域。另外，此时，由于贴附有偏光片，柔性衬底201粘接在上下偏光片之间，不会出现自然卷曲的情况，便于步骤S8进行绑定区区的绑定制程。随后转入步骤S8。
S8：在进一步的显示面板的绑定区域绑定电路板，得到柔性液晶显示面板。
这样便完成本申请实施例的液晶显示母板结构的切割方法。
另外，在一些实施例中，可以在进行步骤S3后，依次进行步骤S5、S4，最后进行步骤S6、S7和S8。也就是说，将上述实施例的步骤S4和步骤S5进行对调。
具体的，先进行步骤S5：沿着小片切割线2a对柔性显示母板200进行切割，得到初步的显示面板。其中初步的显示面板上还具有刚性基板（第一刚性基板31和第二刚性基板32）。
随后进行步骤S4：对柔性显示母板200进行激光分离，去除第一刚性基板31和第二刚性基板32。其中，“对柔性显示母板200进行激光分离”中的“柔性显示母板200”为步骤S5后的柔性显示母板200剩下的初步的显示面板。
其中，当激光沿着小片切割线2a进行切割时，使得切割后得到的初步的显示面板的第一框胶23的边缘与初步的显示面板的边缘齐平；而后，将初步的显示面板分别与第一刚性基板31和第二刚性基板32进行激光分离时，由于粘接在第一框胶23上下的柔性衬底201的应力相互抵消，不会造成激光分离时因外围柔性衬底卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率。并且，因粘接在第一框胶23上下的柔性衬底201应力相互抵消，可在去除第一刚性基板31和第二刚性基板32后仍能保持阵列基板22和彩膜基板21的平整性，可防止出现偏光片的粘贴困难。
相较于现有技术的液晶显示母板结构的切割方法，当本申请的液晶显示母板结构及其切割方法通过将小片切割线的部分对应设置在第一框胶中，以及将外围切割线对应设置在第二框胶中，当分别沿着两种切割线进行切割后，使得切割后两种框胶与切割的边缘平齐，再进行激光分离时，粘接在两种框胶上下的柔性衬底应力相互抵消，不会造成激光分离时因外围柔性衬底卷曲造成的能量不均，避免了能量较多处炭化，能量较小处无法分离的情况，大大提升了激光分离的良率；解决了现有的液晶显示面板采用激光对母板和刚性基板的分离时，促使母板的柔性衬底容易发生卷曲的技术问题。
以上所述，对于本领域的普通技术人员来说，可以根据本申请的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本申请后附的权利要求的保护范围。

Claims (15)

  1. 一种液晶显示母板结构，包括柔性显示母板和设置在所述柔性显示母板两侧的第一刚性基板以及第二刚性基板，所述柔性显示母板包括多个显示面板，其中，
    所述显示面板包括用于贴合彩膜基板和阵列基板的第一框胶，所述柔性显示母板上设置有小片切割线，所述小片切割线用于切割出单个显示面板；
    所述小片切割线的部分于所述显示面板所在平面的正投影，位于所述第一框胶于所述显示面板所在平面的正投影内；
    所述显示面板包括一绑定区域，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接在所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
    所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
    其中，所述第一分切割线于所述显示面板所在平面的正投影，位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
    所述第二分切割线于所述显示面板所在平面的正投影，位于所述第二分框胶于所述显示面板所在平面的正投影内；
    所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影，位于所述第三分框胶于所述显示面板所在平面的正投影内；
    所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影，位于所述第四分框胶于所述显示面板所在平面的正投影内；
    所述柔性显示母板上设置有一外围切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区，所述外围区围设在所述内围区的外周侧；
    所述柔性显示母板包括第二框胶；所述外围切割线于所述柔性显示母板所在平面的正投影，位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
  2. 根据权利要求1所述的液晶显示母板结构，其中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
    其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
  3. 根据权利要求1所述的液晶显示母板结构，其中，所述柔性显示母板上设置有绑定区切割线，所述绑定区切割线用于切割出所述显示面板的阵列基板的绑定区域，且所述绑定区切割线和所述第一分切割线之间设置有第三框胶。
  4. 根据权利要求3所述的液晶显示母板结构，其中，所述显示面板的彩膜基板的一侧还设置有边缘切割线，所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域。
  5. 一种液晶显示母板结构，包括柔性显示母板和设置在所述柔性显示母板两侧的第一刚性基板以及第二刚性基板，所述柔性显示母板包括多个显示面板，其中，
    所述显示面板包括用于贴合彩膜基板和阵列基板的第一框胶，所述柔性显示母板上设置有小片切割线，所述小片切割线用于切割出单个显示面板；
    所述小片切割线的部分于所述显示面板所在平面的正投影，位于所述第一框胶于所述显示面板所在平面的正投影内。
  6. 根据权利要求5所述的液晶显示母板结构，其中，所述显示面板包括一绑定区域，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接在所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
    所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
    其中，所述第一分切割线于所述显示面板所在平面的正投影，位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
    所述第二分切割线于所述显示面板所在平面的正投影，位于所述第二分框胶于所述显示面板所在平面的正投影内；
    所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影，位于所述第三分框胶于所述显示面板所在平面的正投影内；
    所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影，位于所述第四分框胶于所述显示面板所在平面的正投影内。
  7. 根据权利要求6所述的液晶显示母板结构，其中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
    其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
  8. 根据权利要求6所述的液晶显示母板结构，其中，所述柔性显示母板上设置有绑定区切割线，所述绑定区切割线用于切割出所述显示面板的阵列基板的绑定区域，且所述绑定区切割线和所述第一分切割线之间设置有第三框胶。
  9. 根据权利要求8所述的液晶显示母板结构，其中，所述显示面板的彩膜基板的一侧还设置有边缘切割线，所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域。
  10. 根据权利要求5所述的液晶显示母板结构，其中，所述柔性显示母板上设置有一外围切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区，所述外围区围设在所述内围区的外周侧；
    所述柔性显示母板包括第二框胶；所述外围切割线于所述柔性显示母板所在平面的正投影，位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
  11. 一种液晶显示母板结构的切割方法，其中，包括以下步骤：
    提供第一刚性基板和第二刚性基板，并在所述第一刚性基板上形成彩膜基板，在所述第二刚性基板上形成阵列基板；
    在所述彩膜基板或所述阵列基板上涂布第一框胶，并通过所述第一框胶将所述彩膜基板和所述阵列基板进行贴合形成柔性显示母板，所述柔性显示母板包括多个显示面板，其中所述柔性显示母板设置有一外围切割线、小片切割线、绑定区切割线和边缘切割线，所述外围切割线将所述柔性显示母板分为外围区和用于设置所述显示面板的内围区；所述小片切割线用于切割出单个显示面板；所述小片切割线的部分于所述显示面板所在平面的正投影位于所述第一框胶于所述显示面板所在平面的正投影内；所述绑定区切割线用于切割出所述显示面板的单个阵列基板的绑定区域；所述边缘切割线用于去除单个彩膜基板对应于所述绑定区域的部分以裸露出所述绑定区域；
    沿着所述外围切割线对所述液晶显示母板结构进行切割，去除所述柔性显示母板的外围区；
    对所述柔性显示母板进行激光分离，去除所述第一刚性基板和所述第二刚性基板；
    沿着所述小片切割线对所述柔性显示母板进行切割，得到初步的显示面板；
    在所述初步的显示面板上贴附偏光片；
    沿着所述绑定区切割线对所述显示面板的阵列基板和彩膜基板进行同时切割，且沿着所述边缘切割线对所述彩膜基板进行切割，得到进一步的显示面板；
    在所述进一步的显示面板的绑定区域绑定电路板，得到柔性液晶显示面板。
  12. 根据权利要求11所述的液晶显示母板结构的切割方法，其中，所述第一框胶包括第一分框胶、第二分框胶、第三分框胶和第四分框胶，所述第一分框胶靠近所述绑定区域，所述第二分框胶与所述第一分框胶相对设置，所述第三分框胶连接于所述第一分框胶和第二分框胶的同一侧，所述第四分框胶与所述第三分框胶相对设置；
    所述小片切割线包括第一分切割线、第二分切割线、第三分切割线和第四分切割线，所述第一分切割线靠近所述绑定区域；所述第二分切割线、第三分切割线和第四分切割线分别与所述第二分框胶、第三分框胶和第四分框胶一一对应设置；
    其中，所述第一分切割线于所述显示面板所在平面的正投影，位于所述第一分框胶于所述显示面板所在平面的正投影的外侧；
    所述第二分切割线于所述显示面板所在平面的正投影，位于所述第二分框胶于所述显示面板所在平面的正投影内；
    所述第三分切割线对应于所述第三分框胶的部分于所述显示面板所在平面的正投影，位于所述第三分框胶于所述显示面板所在平面的正投影内；
    所述第四分切割线对应于所述第四分框胶的部分于所述显示面板所在平面的正投影，位于所述第四分框胶于所述显示面板所在平面的正投影内。
  13. 根据权利要求12所述的液晶显示母板结构的切割方法，其中，所述第二分切割线将所述第二分框胶分割为第二外分框胶和第二内分框胶；所述第三分切割线将所述第三分框胶分割为第三外分框胶和第三内分框胶；所述第四分切割线将所述第四分框胶分割为第四外分框胶和第四内分框胶；
    其中，所述第二外分框胶、第三外分框胶和第四外分框胶均具有第一设定宽度，且所述第二内分框胶、所述第三内分框胶和第四内分框胶的宽度均大于所述第一设定宽度。
  14. 根据权利要求12所述的液晶显示母板结构的切割方法，其中，在所述彩膜基板或所述阵列基板上还涂布第三框胶；所述第三框胶设置在所述绑定区切割线和所述第一分切割线之间。
  15. 根据权利要求11所述的液晶显示母板结构的切割方法，其中，在所述彩膜基板或所述阵列基板上还涂布第二框胶；其中，所述外围切割线于所述柔性显示母板所在平面的正投影，位于所述第二框胶于所述柔性显示母板所在平面的正投影内。
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