WO2019128034A1 - 柔性介质的切割方法 - Google Patents

柔性介质的切割方法 Download PDF

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Publication number
WO2019128034A1
WO2019128034A1 PCT/CN2018/086161 CN2018086161W WO2019128034A1 WO 2019128034 A1 WO2019128034 A1 WO 2019128034A1 CN 2018086161 W CN2018086161 W CN 2018086161W WO 2019128034 A1 WO2019128034 A1 WO 2019128034A1
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Prior art keywords
flexible medium
protective film
cutting
flexible
vacuum adsorption
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PCT/CN2018/086161
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English (en)
French (fr)
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段艳强
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019128034A1 publication Critical patent/WO2019128034A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the invention relates to a production process of a flexible display panel, in particular to a method of cutting a flexible medium.
  • OLED display panels have the advantages of self-luminous, high contrast, thin thickness, wide viewing angle and fast response speed. They are representative of the new generation of flat display technology and are increasingly being accepted by the industry. Admired. Flexible OLED display panels are an important development trend. Flexible OLED display panels can not only be thinner and lighter in volume, but also reduce power consumption, which helps to improve the endurance of the corresponding products. At the same time, due to the flexibility and flexibility of the flexible OLED display panel, it is also more durable than ordinary hard display panels. Flexible OLED display panels can be widely used in various products with display functions, such as tablet computers, televisions, mobile terminals, and various types of wearable devices.
  • the flexible OLED display panel has its own drawbacks while bringing a series of advantages. Due to the flexibility and thermal expansion of the flexible substrate, the processing of the display device is inconvenient, and the substrate is prone to sag, or even wrinkles or breaks. It is difficult to accurately carry out the subsequent film preparation process. In order to solve this problem, it is necessary to connect a flexible substrate to a rigid substrate such as a glass substrate to support and fix the flexible substrate to facilitate film formation. After the layers of the display panel are formed on the flexible substrate, the rigid substrate is peeled off from the flexible substrate by a lift-off process, thereby completing the preparation work of the flexible display panel.
  • the current mainstream flexible OLED display panel manufacturing methods include:
  • Step S1 using a glass substrate as a carrier, coating a whole layer of the glass substrate with a polyimide (PI) film as a flexible substrate, and preparing an OLED display mother board on the flexible substrate, the OLED display mother board Includes multiple OLED display panels.
  • PI polyimide
  • Step S2 applying a cutting process, cutting the glass substrate and the OLED display mother board to split the plurality of OLED display panels to form a single-piece OLED display panel.
  • Step S3 Separating the PI film from the glass substrate by using a laser lift off (LLO) process for each of the single-piece OLED display panels, thereby obtaining a flexible OLED display panel.
  • LLO laser lift off
  • step S2 for the cutting process of step S2, a laser cutting device is usually used.
  • laser cutting equipment is relatively expensive and the use cost of the equipment is also high.
  • the glass substrate is also required to be cut during the laser cutting process, which not only consumes man-hours and materials, but also increases Loss and use costs of laser cutting equipment.
  • the prior art solution is: firstly, the OLED display mother board including the plurality of OLED display panels is peeled off from the glass substrate; and then the OLED display mother board is cut into a plurality of OLED display panels. Splitting each other to form a single piece of flexible OLED display panel. That is, in the above-described process steps S1 to S3, after step S1 is performed, step S3 is performed first and step S2 is performed, and it is not necessary to cut the glass substrate.
  • the OLED display mother board which is usually peeled off from the glass substrate is called a fully flexible OLED display mother board.
  • the first is a fully flexible OLED display mother board 1
  • the adsorption is fixed on the vacuum adsorption platform, and the vacuum adsorption platform 1 includes an adsorption hole 2; then the fully flexible OLED display mother board 5 is cut along the predetermined cutting line 4 by using the laser cutting device 3, and the plurality of OLED display panels 6 are cut.
  • This cutting process has the following problems:
  • the cutting line 4 (the edge of the OLED display panel 6) is usually located between the adsorption holes 2, and the cutting line 4 and the adsorption hole 2 have a large distance, corresponding to the adsorption force at the position of the cutting line. It is weak, and the edge of the OLED display panel 6 is prone to warpage after the laser cutting process.
  • the present invention provides a method of cutting a flexible medium that avoids the problem of warping of the edges of the flexible medium and also prevents the surface of the vacuum adsorption platform from being damaged by the cutting.
  • a method of cutting a flexible medium comprising:
  • the flexible medium comprising opposing first and second surfaces
  • the flexible medium to which the protective film is attached is placed on a vacuum adsorption platform, and the protective film is connected to the vacuum adsorption platform;
  • the protective film is peeled off.
  • the cutting depth of the laser cutting process is not less than the thickness of the flexible medium and less than the sum of the thicknesses of the flexible medium and the protective film.
  • the thickness of the protective film is greater than 100 ⁇ m.
  • the protective film has a thickness of 100 ⁇ m to 200 ⁇ m.
  • the flexible medium is a flexible OLED display panel.
  • the vertical distance between the boundary of the protective film and the closest adsorption hole located in the boundary is not more than 5 mm.
  • the protective film is peeled off from the flexible medium by manual manual tearing.
  • the protective film is peeled off from the flexible medium by a stripping jig.
  • the vacuum adsorption platform is provided with a load bearing assembly, the flexible medium to which the protective film is attached is placed on the load bearing assembly, and the protective film is connected with the load bearing assembly; wherein the load bearing Providing a through hole in fluid communication with the adsorption hole, the through hole transmitting a vacuum adsorption force generated by the vacuum adsorption platform to the protection film to adsorb and fix the protective film and the flexible medium;
  • the arrangement density of the through holes in the load bearing assembly is greater than the arrangement density of the adsorption holes in the vacuum adsorption platform.
  • a vertical distance between a boundary of the protective film and a through hole located closest to the boundary is no more than 5 mm.
  • the carrying assembly includes opposing upper and lower surfaces, the protective film is coupled to the upper surface, the lower surface is coupled to the vacuum adsorption platform; wherein the lower surface is provided with a recess, The through hole communicates the groove to the upper surface, and an opening of the groove on the lower surface surrounds the plurality of adsorption holes.
  • the lower surface of the load bearing assembly is connected to the vacuum suction platform by a seal, and the seal member is disposed around the edge of the groove.
  • the cutting method of the flexible medium provided by the embodiment of the invention firstly attaches a protective film on the flexible medium, and then adsorbs and fixes the flexible medium together with the protective film on the vacuum adsorption platform, and the flexible medium and the protective film are stable and uniform. Adhesion, so the flexible medium does not warp at the edge of the cutting line during the cutting process.
  • the protective film is connected between the flexible medium and the vacuum adsorption platform, and the parameters for controlling the laser cutting are such that the protective film is not penetrated when the flexible medium is cut, and the surface of the vacuum adsorption platform is not damaged.
  • FIG. 1 is a schematic top plan view of a conventional flexible display mother board when it is cut;
  • FIG. 2 is a schematic cross-sectional structural view of a fully flexible display mother board when cutting in the prior art
  • FIG. 3 is a process flow diagram of a method for cutting a flexible medium according to Embodiment 1 of the present invention.
  • FIGS. 4a-4e are structural diagrams corresponding to respective process steps in the method for cutting a flexible medium according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic top plan view showing a flexible medium placed on a vacuum adsorption platform in Embodiment 1 of the present invention
  • FIG. 6 is a schematic structural view showing a flexible medium connected to a vacuum adsorption platform through a load bearing assembly in Embodiment 2 of the present invention
  • FIG. 7 is a top plan view showing the placement of a flexible medium on a load bearing assembly in Embodiment 2 of the present invention.
  • This embodiment provides a method for cutting a flexible medium.
  • the cutting method includes the following steps:
  • the flexible medium 10 is, for example, a flexible OLED display panel, in particular a fully flexible OLED display panel after being peeled off from the glass substrate.
  • a protective film 20 is attached on the first surface 10a of the flexible medium 10.
  • the protective film 20 is selected as a protective film having good adhesion with the flexible medium 10, and can be removed by mechanical force peeling, and preferably can be manually removed by hand.
  • the thickness of the protective film is selected to be greater than 100 ⁇ m. In a preferred embodiment, the thickness of the protective film is selected to be in the range of 100 ⁇ m to 200 ⁇ m.
  • the flexible medium 10 to which the protective film 20 is attached is placed on a vacuum adsorption platform 30, and the protective film 20 is connected to the vacuum adsorption platform 30.
  • the flexible medium 10 is cut from the second surface 10b of the flexible medium 10 using a laser cutting process.
  • the flexible medium 10 is cut from the second surface 10b of the flexible medium 10 along a predetermined cutting line 10c using a laser cutting device 40.
  • the parameters of the laser cutting are controlled such that the protective film 20 is not penetrated when the flexible medium 10 is cut. That is, the cutting depth of the laser cutting process is controlled to be not less than the thickness of the flexible medium 10 and smaller than the sum of the thicknesses of the flexible medium 10 and the protective film 20, and therefore, when performing the cutting process, It is ensured that the flexible medium 10 is smoothly cut without being cut to the surface of the vacuum suction platform 30.
  • the protective film 20 is peeled off from the cut flexible medium 10. Specifically, it can be manually removed by hand or peeled off by some stripping jig.
  • the method for cutting a flexible medium provided by this embodiment firstly attaches a protective film 20 to the flexible medium 10, and then adsorbs and fixes the flexible medium 10 together with the protective film 20 on the vacuum adsorption platform 30, the flexible medium 10 and the protective film 20. There is a stable and uniform adhesion between them, so that the flexible medium 10 does not have a problem of warpage at the edge of the cutting line when the cutting process is performed.
  • the protective film 20 is connected between the flexible medium 10 and the vacuum adsorption stage 30, and the parameters for controlling the laser cutting are such that the protective film 20 is not penetrated when the flexible medium 10 is cut, and the surface of the vacuum adsorption stage 30 is not damaged.
  • the embodiment provides a method for cutting a flexible medium.
  • the difference from Embodiment 1 is that, in step S13 in Embodiment 1, the protective film 20 is not directly connected to the vacuum adsorption platform in this embodiment. Instead of 30, a load bearing assembly is first attached to the vacuum adsorption platform 30, and then the protective film 20 is attached to the load bearing assembly.
  • the vacuum adsorption platform 30 is provided with a carrier assembly 50 on which the flexible medium 10 to which the protective film 20 is attached is placed, the protective film 20 and the The carrier assembly 50 is connected.
  • the bearing assembly 50 is provided with a through hole 51 in fluid communication with the adsorption hole 31 of the vacuum adsorption platform 30, and the through hole 51 transmits the vacuum adsorption force generated by the vacuum adsorption platform 30 to the protection.
  • the film 20 is configured to adsorb and fix the protective film 20 and the flexible medium 10.
  • the arrangement density of the through holes 51 in the load bearing assembly 50 is greater than the arrangement density of the adsorption holes 31 in the vacuum adsorption platform 30, that is, the hole pitch of the through holes 51 is smaller than that of the adsorption holes 31. Hole spacing.
  • the vacuum adsorption stage 30 used in production has a fixed hole pitch of the adsorption holes 31 and a large pitch. If the protective film 20 and the flexible medium 10 are directly connected to the vacuum adsorption platform 30, the adsorption force at the position of the adsorption hole 31 is large, and the position between the two adsorption holes 31 is the adsorption force.
  • the carrier assembly 50 by providing the carrier assembly 50 and increasing the arrangement density of the through holes 51 therein, the adsorption force applied to the respective positions of the protective film 20 is more stable and uniform, and the cutting process is improved. Stability and increase yield.
  • the load bearing assembly 50 since the load bearing assembly 50 is also spaced between the flexible medium 10 and the vacuum adsorption platform 30, it is less likely to cut into the vacuum adsorption platform 30 during the cutting process, thereby effectively avoiding the vacuum. The surface of the adsorption platform 30 is damaged by the cut.
  • the carrier assembly 50 includes an opposite upper surface 50a and a lower surface 50b, and the protective film 20 is coupled to the upper surface 50a, the lower surface 50b and the vacuum adsorption platform. 30 connections.
  • the lower surface 50b of the carrier assembly 50 is provided with a groove 52 that communicates the groove 52 to the upper surface 50a, and the groove 52 is on the lower surface 50b.
  • the opening surrounds the plurality of adsorption holes 31.
  • the lower surface 50b of the carrier assembly 50 is coupled to the vacuum suction platform 30 by a seal 53 that surrounds the edge of the recess 52.
  • the seal 53 seals the load bearing assembly 50 and the vacuum suction platform 30 to prevent air leakage when the vacuum adsorption platform 30 is evacuated.
  • the seal 53 is a sealant.
  • the size of the protective film 20 is larger than that of the flexible medium 10 to be cut.
  • the protective film 20 is sized such that when the protective film 20 is adsorbed and fixed on the carrier assembly 50, the boundary 21 of the protective film 20 is closest to the distance within the boundary 21.
  • the method for cutting a flexible medium provided by the embodiment of the present invention can avoid the problem that the edge of the flexible medium is warped, and can also prevent the surface of the vacuum adsorption platform from being damaged by cutting.

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Abstract

一种柔性介质的切割方法，其包括：提供待切割的柔性介质，所述柔性介质包括相对的第一表面和第二表面；在所述柔性介质的第一表面上贴附保护膜；将贴附有所述保护膜的所述柔性介质放置于真空吸附平台上，所述保护膜与所述真空吸附平台连接；控制所述真空吸附平台的吸附孔产生真空吸附力，将所述保护膜以及所述柔性介质吸附固定；应用激光切割工艺从所述第二表面切割所述柔性介质；剥离去除所述保护膜。该切割方法可以避免柔性介质的边缘发生翘曲的问题，并且还可以避免真空吸附平台的表面被切割损伤。

Description

柔性介质的切割方法 技术领域
本发明涉及柔性显示面板的生产工艺，尤其涉及一种柔性介质的切割方法。
背景技术
有机电致发光二极管(Organic light-emitting diodes，OLED)显示面板具备自发光、对比度高、厚度薄、视角广和反应速度快等优点，是新一代平面显示技术的代表，越来越受到业界的推崇。柔性OLED显示面板是其中的一个重要发展趋势，柔性OLED显示面板不仅能够在体积上更加轻薄，而且能够降低功耗，从而有助于提升相应产品的续航能力。同时，由于柔性OLED显示面板的可弯曲性和柔韧性，其耐用程度也高于普通硬质显示面板。柔性OLED显示面板可广泛应用于各种带显示功能的产品中，例如可以应用于平板电脑、电视、移动终端和各类可穿戴式设备中。
柔性OLED显示面板在带来一系列优点的同时也具有其本身的缺陷，由于柔性基板具有挠性和热膨胀性等问题，给显示器件的加工带来不便，容易出现基板下垂，甚至产生褶皱或断裂，很难精准的进行后续膜层的制备工序。为了解决该问题，需要将柔性基板连接于刚性的基板如玻璃基板上，用以支撑和固定柔性基板以利于薄膜的形成。在柔性基板上制备形成显示面板的各层元件之后，再通过剥离工艺，将刚性基板从柔性基板上剥离开来，从而完成柔性显示面板的制备工作。
目前主流的柔性OLED显示面板的制作方法包括：
步骤S1、以玻璃基板为载体，在整面玻璃基板上涂覆一层聚酰亚胺(PI)膜作为柔性衬底，在柔性衬底上制备形成OLED显示母板，所述OLED显示母板包括多个OLED显示面板。
步骤S2、应用切割工艺，将玻璃基板以及OLED显示母板切割裂片将多个OLED显示面板相互分割，形成单片的OLED显示面板。
步骤S3、针对各个单片的OLED显示面板，应用激光剥离(Laser lift off， LLO)工艺将PI膜与玻璃基板分离，即得到柔性OLED显示面板。
以上的工艺步骤中，对于步骤S2的切割工艺，通常是使用激光切割设备。众所周知，激光切割设备是比较昂贵的并且设备的使用成本也较高，而在以上的步骤S2中，在进行激光切割工艺时还需要对玻璃基板进行切割，不仅耗费了工时和材料，也增加了激光切割设备的损耗和使用成本。
为了改善以上提到的问题，现有技术的解决方法是：首先是将包括多个OLED显示面板的OLED显示母板从玻璃基板上剥离；然后再对OLED显示母板切割将多个OLED显示面板相互分割，形成单片的柔性OLED显示面板。即，在以上的工艺步骤S1～S3中，在进行步骤S1之后，先进行步骤S3再进行步骤S2，不需要切割玻璃基板。
业内通常将从玻璃基板上剥离后的OLED显示母板称为全柔性OLED显示母板，针对全柔性显示母板的切割工艺，参阅图1和图2，首先是将全柔性OLED显示母板1吸附固定在真空吸附平台上，所述真空吸附平台1包括吸附孔2；然后应用激光切割装置3沿着预定的切割线4对全柔性OLED显示母板5进行切割，将多个OLED显示面板6(图1和图2中仅示例性示出了其中一个OLED显示面板6)相互分离。这种切割工艺存在着以下的问题：
(1)、参阅图1，切割线4(OLED显示面板6的边缘)通常位于吸附孔2之间，切割线4与吸附孔2之间具有较大的距离，对应于切割线位置的吸附力较弱，在进行激光切割工艺之后，OLED显示面板6的边缘容易产生翘曲的问题。
(2)、参阅图2，进行激光切割工艺时，在对应于切割线4的位置需要完全切断全柔性OLED显示母板5，此时真空吸附平台1的表面经常被激光损伤。
因此，现有技术还有待于改进和发展。
发明内容
鉴于现有技术存在的不足，本发明提供了一种柔性介质的切割方法，所述切割方法可以避免柔性介质的边缘发生翘曲的问题，并且还可以避免真空吸附平台的表面被切割损伤。
为了达到上述的目的，本发明采用了如下的技术方案：
一种柔性介质的切割方法，其包括：
提供待切割的柔性介质，所述柔性介质包括相对的第一表面和第二表面；
在所述柔性介质的第一表面上贴附保护膜；
将贴附有所述保护膜的所述柔性介质放置于真空吸附平台上，所述保护膜与所述真空吸附平台连接；
控制所述真空吸附平台的吸附孔产生真空吸附力，将所述保护膜以及所述柔性介质吸附固定；
应用激光切割工艺从所述第二表面切割所述柔性介质；
剥离去除所述保护膜。
其中，所述激光切割工艺的切割深度不小于所述柔性介质的厚度并且小于所述柔性介质和所述保护膜的厚度之和。
其中，所述保护膜的厚度大于100μm。
其中，所述保护膜的厚度为100μm～200μm。
其中，所述柔性介质为柔性OLED显示面板。
其中，所述保护膜吸附固定于所述真空吸附平台上时，所述保护膜的边界与位于所述边界内的距离最近的吸附孔的垂直距离不大于5mm。
其中，通过人工手动撕除将所述保护膜从所述柔性介质上剥离去除。
其中，通过剥膜治具将所述保护膜从所述柔性介质上剥离去除。
其中，所述真空吸附平台上设置有承载组件，将贴附有所述保护膜的所述柔性介质放置于所述承载组件上，所述保护膜与所述承载组件连接；其中，所述承载组件中设置有与所述吸附孔流体连通的通孔，所述通孔将所述真空吸附平台产生的真空吸附力传递至所述保护膜，以吸附固定所述保护膜以及所述柔性介质；所述承载组件中的通孔的排布密度大于所述真空吸附平台中的吸附孔的排布密度。
其中，所述保护膜吸附固定于所述承载组件上时，所述保护膜的边界与位于所述边界内的距离最近的通孔的垂直距离不大于5mm。
其中，所述承载组件包括相对的上表面和下表面，所述保护膜连接于所述上表面上，所述下表面与所述真空吸附平台连接；其中，所述下表面设置有凹 槽，所述通孔将所述凹槽连通至所述上表面，所述凹槽在所述下表面上的开口包围多个所述吸附孔。
其中，所述承载组件的下表面通过密封件与所述真空吸附平台连接，所述密封件环绕设置于所述凹槽的边缘。
本发明实施例提供的柔性介质的切割方法，首先是在柔性介质上贴附保护膜，然后将柔性介质连同保护膜一起吸附固定在真空吸附平台上，柔性介质和保护膜之间具有稳定且均匀的附着力，因此在进行切割工艺时，柔性介质在切割线的边缘不会发生翘曲的问题。另外，保护膜是连接在柔性介质和真空吸附平台之间，控制激光切割的参数使得柔性介质被切断时保护膜未被穿透，不会损伤真空吸附平台的表面。
附图说明
图1是现有技术中对全柔性显示母板进行切割时的俯视结构示意图；
图2是现有技术中对全柔性显示母板进行切割时的剖面结构示意图；
图3是本发明实施例1提供的柔性介质的切割方法的工艺流程图；
图4a～4e是本发明实施例1提供的柔性介质的切割方法中，各个工艺步骤对应的结构图示；
图5是本发明实施例1中将柔性介质放置于真空吸附平台上的俯视结构示意图；
图6是本发明实施例2中将柔性介质通过承载组件连接到真空吸附平台上的结构示意图；
图7是本发明实施例2中将柔性介质放置于承载组件上的俯视结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附 图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
实施例1
本实施例提供了一种柔性介质的切割方法，参阅图3以及图4a～4e，所述切割方法包括步骤：
S11、如图4a所示，提供待切割的柔性介质10，所述柔性介质包括相对的第一表面10a和第二表面10b。其中，所述柔性介质10例如是柔性OLED显示面板，特别是从玻璃基板上剥离之后的全柔性OLED显示面板。
S12、如图4b所示，在所述柔性介质10的第一表面10a上贴附保护膜20。其中，所述保护膜20选择为与所述柔性介质10具有良好粘着力的保护膜，并且可以通过机械力剥离去除，最好是可以通过人工手动撕除。
其中，所述保护膜的厚度选择为大于100μm。在优选的技术方案中，所述保护膜的厚度选择在100μm～200μm的范围内。
S13、如图4c所示，将贴附有所述保护膜20的所述柔性介质10放置于真空吸附平台30上，所述保护膜20与所述真空吸附平台30连接。
S14、控制所述真空吸附平台30的吸附孔31产生真空吸附力，将所述保护膜20以及所述柔性介质10吸附固定。
S15、如图4d所示，应用激光切割工艺从所述柔性介质10的第二表面10b切割所述柔性介质10。具体地，采用激光切割装置40沿着预设的切割线10c从所述柔性介质10的第二表面10b切割所述柔性介质10。其中，控制激光切割的参数使得所述柔性介质10被切断时，所述保护膜20未被穿透。也就是说，控制所述激光切割工艺的切割深度为不小于所述柔性介质10的厚度并且小于所述柔性介质10和所述保护膜20的厚度之和，因此，在进行切割工艺时，既能够保证将所述柔性介质10顺利切割，又不会切割到所述真空吸附平台30的表面。
S16、如图4e所示，将所述保护膜20从切割后的柔性介质10上剥离去除。具体地，可以采用人工手动撕除，或者是借助一些剥膜治具剥离去除。
其中，所述保护膜20的尺寸可以根据实际需要选择裁切，通常地，所述保护膜20的尺寸要大于所述待切割的柔性介质10。在优选的方案中，在设计所述保护膜20的尺寸时还需要参考所述真空吸附平台30的吸附孔31间距大小，具 体地，参阅图5，保护膜20的尺寸设计为：当所述保护膜20吸附固定于所述真空吸附平台30上时，所述保护膜20的边界21与位于所述边界21内的距离最近的吸附孔31a的垂直距离H1、H2不大于5mm，最好是使得H1＝H2＝0，由此可以使得保护膜20能够得到更好地吸附固定。
本实施例提供的柔性介质的切割方法，首先是在柔性介质10上贴附保护膜20，然后将柔性介质10连同保护膜20一起吸附固定在真空吸附平台30上，柔性介质10和保护膜20之间具有稳定且均匀的附着力，因此在进行切割工艺时，柔性介质10在切割线的边缘不会发生翘曲的问题。另外，保护膜20是连接在柔性介质10和真空吸附平台30之间，控制激光切割的参数使得柔性介质10被切断时保护膜20未被穿透，不会损伤真空吸附平台30的表面。
实施例2
本实施例提供了一种柔性介质的切割方法，与实施例1不同的是，对应于实施例1中的步骤S13，本实施例中不是将所述保护膜20直接连接到所述真空吸附平台30上，而是在所述真空吸附平台30上首先连接一个承载组件，然后再将所述保护膜20连接到所述承载组件。
如图6所示，所述真空吸附平台30上设置有承载组件50，将贴附有所述保护膜20的所述柔性介质10放置于所述承载组件50上，所述保护膜20与所述承载组件50连接。其中，所述承载组件50中设置有与所述真空吸附平台30的吸附孔31流体连通的通孔51，所述通孔51将所述真空吸附平台30产生的真空吸附力传递至所述保护膜20，以吸附固定所述保护膜20以及所述柔性介质10。
其中，所述承载组件50中的通孔51的排布密度大于所述真空吸附平台30中的吸附孔31的排布密度，即，所述通孔51的孔间距小于所述吸附孔31的孔间距。通常地，在生产中使用的真空吸附平台30，其中吸附孔31的孔间距的固定的，并且间距较大。若是将所述保护膜20以及所述柔性介质10直接连接到所述真空吸附平台30上，正对于吸附孔31位置的吸附力较大，而位于两个吸附孔31之间的位置则吸附力较小，当吸附孔31的孔间距较大时，这种吸附力的差异尤为明显，而施加在所述保护膜20各个位置的吸附力不均匀时，增大了切割工艺出现异常的风险。因此，本实施例中，通过设置所述承载组件50，并且增加其中的通孔51的排布密度，使得施加在所述保护膜20各个位置的吸附力更加稳定并且均匀，提升且切割工艺的稳定性并提高良率。另外，由于所述柔性介质10和所述真空吸附平台30之间还间隔着所述承载组件50，因此在进 行切割工艺时更不可能切割到所述真空吸附平台30，更加有效地避免了真空吸附平台30的表面被切割损伤。
具体地，如图6所示，所述承载组件50包括相对的上表面50a和下表面50b，所述保护膜20连接于所述上表面50a上，所述下表面50b与所述真空吸附平台30连接。进一步地，所述承载组件50的下表面50b设置有凹槽52，所述通孔51将所述凹槽52连通至所述上表面50a，所述凹槽52在所述下表面50b上的开口包围多个所述吸附孔31。进一步地，所述承载组件50的下表面50b通过密封件53与所述真空吸附平台30连接，所述密封件53环绕设置于所述凹槽52的边缘。所述密封件53使得所述承载组件50和所述真空吸附平台30之间密封连接，防止在所述真空吸附平台30在抽真空时发生漏气。优选地，所述密封件53为密封胶。
本实施例中，所述保护膜20的尺寸要大于所述待切割的柔性介质10，在设计所述保护膜20的尺寸时还需要参考所述承载组件50的通孔51间距大小，具体地，参阅图7，保护膜20的尺寸设计为：当所述保护膜20吸附固定于所述承载组件50上时，所述保护膜20的边界21与位于所述边界21内的距离最近的通孔51a的垂直距离H3、H4不大于5mm，最好是使得H1＝H2＝0，由此可以使得保护膜20能够得到更好地吸附固定。
除了以上所述的将所述保护膜20和柔性介质10连接到所述真空吸附平台30的连接方式不同之外，本实施例中的其余工艺步骤与实施例1中的相同，因此不再赘述。
综上所述，本发明实施例提供的柔性介质的切割方法，其可以避免柔性介质的边缘发生翘曲的问题，并且还可以避免真空吸附平台的表面被切割损伤。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通 技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (19)

  1. 一种柔性介质的切割方法，其中，包括：
    提供待切割的柔性介质，所述柔性介质包括相对的第一表面和第二表面；
    在所述柔性介质的第一表面上贴附保护膜；
    将贴附有所述保护膜的所述柔性介质放置于真空吸附平台上，所述保护膜与所述真空吸附平台连接；
    控制所述真空吸附平台的吸附孔产生真空吸附力，将所述保护膜以及所述柔性介质吸附固定；
    应用激光切割工艺从所述第二表面切割所述柔性介质；
    剥离去除所述保护膜。
  2. 根据权利要求1所述的柔性介质的切割方法，其中，所述激光切割工艺的切割深度不小于所述柔性介质的厚度并且小于所述柔性介质和所述保护膜的厚度之和。
  3. 根据权利要求2所述的柔性介质的切割方法，其中，所述保护膜的厚度大于100μm。
  4. 根据权利要求3所述的柔性介质的切割方法，其中，所述保护膜的厚度为100μm～200μm。
  5. 根据权利要求1所述的柔性介质的切割方法，其中，所述柔性介质为柔性OLED显示面板。
  6. 根据权利要求1所述的柔性介质的切割方法，其中，所述保护膜吸附固定于所述真空吸附平台上时，所述保护膜的边界与位于所述边界内的距离最近的吸附孔的垂直距离不大于5mm。
  7. 根据权利要求1所述的柔性介质的切割方法，其中，通过人工手动撕除将所述保护膜从所述柔性介质上剥离去除。
  8. 根据权利要求1所述的柔性介质的切割方法，其中，通过剥膜治具将所述保护膜从所述柔性介质上剥离去除。
  9. 一种柔性介质的切割方法，其中，包括：
    提供待切割的柔性介质，所述柔性介质包括相对的第一表面和第二表面；
    在所述柔性介质的第一表面上贴附保护膜；
    在真空吸附平台上设置承载组件，将贴附有所述保护膜的所述柔性介质放置于所述承载组件上，所述保护膜与所述承载组件连接；
    控制所述真空吸附平台的吸附孔产生真空吸附力，将所述保护膜以及所述柔性介质吸附固定于所述承载组件上；
    应用激光切割工艺从所述第二表面切割所述柔性介质；
    剥离去除所述保护膜；
    其中，所述承载组件中设置有与所述吸附孔流体连通的通孔，所述通孔将所述真空吸附平台产生的真空吸附力传递至所述保护膜，以吸附固定所述保护膜以及所述柔性介质。
  10. 根据权利要求9所述的柔性介质的切割方法，其中，所述承载组件中的通孔的排布密度大于所述真空吸附平台中的吸附孔的排布密度。
  11. 根据权利要求10所述的柔性介质的切割方法，其中，所述激光切割工艺的切割深度不小于所述柔性介质的厚度并且小于所述柔性介质和所述保护膜的厚度之和。
  12. 根据权利要求11所述的柔性介质的切割方法，其中，所述保护膜的厚度大于100μm。
  13. 根据权利要求12所述的柔性介质的切割方法，其中，所述保护膜的厚度为100μm～200μm。
  14. 根据权利要求10所述的柔性介质的切割方法，其中，所述柔性介质为柔性OLED显示面板。
  15. 根据权利要求10所述的柔性介质的切割方法，其中，所述保护膜吸附固定于所述承载组件上时，所述保护膜的边界与位于所述边界内的距离最近的通孔的垂直距离不大于5mm。
  16. 根据权利要求10所述的柔性介质的切割方法，其中，所述承载组件包 括相对的上表面和下表面，所述保护膜连接于所述上表面上，所述下表面与所述真空吸附平台连接；
    其中，所述下表面设置有凹槽，所述通孔将所述凹槽连通至所述上表面，所述凹槽在所述下表面上的开口包围多个所述吸附孔。
  17. 根据权利要求16所述的柔性介质的切割方法，其中，所述承载组件的下表面通过密封件与所述真空吸附平台连接，所述密封件环绕设置于所述凹槽的边缘。
  18. 根据权利要求9所述的柔性介质的切割方法，其中，通过人工手动撕除将所述保护膜从所述柔性介质上剥离去除。
  19. 根据权利要求9所述的柔性介质的切割方法，其中，通过剥膜治具将所述保护膜从所述柔性介质上剥离去除。
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