WO2017020370A1 - 柔性显示面板的制作方法以及用于其制作的基板组件 - Google Patents

柔性显示面板的制作方法以及用于其制作的基板组件 Download PDF

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Publication number
WO2017020370A1
WO2017020370A1 PCT/CN2015/088021 CN2015088021W WO2017020370A1 WO 2017020370 A1 WO2017020370 A1 WO 2017020370A1 CN 2015088021 W CN2015088021 W CN 2015088021W WO 2017020370 A1 WO2017020370 A1 WO 2017020370A1
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Prior art keywords
substrate
flexible substrate
flexible
rigid
rigid substrate
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PCT/CN2015/088021
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English (en)
French (fr)
Inventor
余威
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深圳市华星光电技术有限公司
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Priority to US14/889,126 priority Critical patent/US9899599B2/en
Publication of WO2017020370A1 publication Critical patent/WO2017020370A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular, to a method for fabricating a flexible display panel and a substrate assembly therefor.
  • OLED Organic Light Laser Display
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • the plastic substrate 12 is attached to the glass substrate 11 with the adhesive 13 , and then the process is completed on the plastic substrate 12 . Finally, the plastic substrate 12 is peeled off from the glass substrate 11 to obtain a flexible OLED panel. .
  • the film layer and the device formed on the plastic substrate 12 are easily damaged, resulting in device failure.
  • Embodiments of the present invention provide a method for fabricating a flexible display panel and a substrate assembly therefor, which can reduce the occurrence of bending caused by bending of the flexible substrate during the fabrication of the flexible substrate.
  • the invention provides a method for manufacturing a flexible display panel, comprising: providing a rigid substrate and a flexible substrate; forming a closed plastic frame on the rigid substrate and/or the flexible substrate; and performing the rigid substrate and the flexible substrate in a vacuum environment Fixing and curing the closed plastic frame, so that the flexible substrate is fixed on the rigid substrate by the closed plastic frame, and the area of the flexible substrate inside the closed plastic frame after the rigid substrate and the flexible substrate are taken out from the vacuum environment are Attaching to a rigid substrate under negative pressure; forming a display device on the flexible substrate; cutting the rigid substrate and/or the flexible substrate to separate the flexible substrate from the rigid substrate; wherein the surface of the rigid substrate is provided with a plurality of spaced surfaces
  • the support column is formed on the outer periphery of the plurality of support columns, so that the area of the flexible substrate located inside the closed plastic frame is attached to the support column under the action of negative pressure; and the rigid substrate and/or the flexible substrate are performed.
  • the step of cutting includes cutting the rigid substrate and/or the flexible
  • the rigid substrate is a glass substrate
  • the support column is a glass support column formed by etching the glass substrate.
  • the step of cutting the rigid substrate and/or the flexible substrate comprises: cutting the flexible substrate along the inner side of the closed plastic frame, and removing the closed plastic frame and the remaining portion of the flexible substrate from the rigid substrate.
  • the invention provides a method for manufacturing a flexible display panel, comprising: providing a rigid substrate and a flexible substrate; forming a closed plastic frame on the rigid substrate and/or the flexible substrate; and performing the rigid substrate and the flexible substrate in a vacuum environment Fixing and curing the closed plastic frame, so that the flexible substrate is fixed on the rigid substrate by the closed plastic frame, and the area of the flexible substrate inside the closed plastic frame after the rigid substrate and the flexible substrate are taken out from the vacuum environment are Attached to the rigid substrate under negative pressure; forming a display device on the flexible substrate; cutting the rigid substrate and/or the flexible substrate to separate the flexible substrate from the rigid substrate.
  • the surface of the rigid substrate is provided with a plurality of support columns arranged at intervals, and the closed plastic frame is formed on the periphery of the plurality of support columns, so that the region of the flexible substrate located inside the closed plastic frame is attached under the action of negative pressure. Support column.
  • the rigid substrate is a glass substrate
  • the support column is a glass support column formed by etching the glass substrate.
  • step of cutting the rigid substrate and/or the flexible substrate comprises: cutting the rigid substrate and/or the flexible substrate along the inner side of the closed plastic frame.
  • the step of cutting the rigid substrate and/or the flexible substrate comprises: cutting the flexible substrate along the inner side of the closed plastic frame, and removing the closed plastic frame and the remaining portion of the flexible substrate from the rigid substrate.
  • the present invention also provides a substrate assembly for a flexible display panel, the substrate assembly comprising a rigid substrate, a flexible substrate, and a closed plastic frame disposed between the rigid substrate and the flexible substrate, wherein the flexible substrate is fixed by the closed plastic frame On the rigid substrate, a negative pressure is formed inside the closed plastic frame, so that the region of the flexible substrate inside the closed plastic frame is attached to the rigid substrate under the action of negative pressure.
  • the surface of the rigid substrate is provided with a plurality of support columns arranged at intervals, and the closed plastic frame is formed on the periphery of the plurality of support columns, so that the region of the flexible substrate located inside the closed plastic frame is attached under the action of negative pressure. Support column.
  • the rigid substrate is a glass substrate
  • the support column is a glass support column formed by etching the glass substrate.
  • the support columns are arranged in a matrix, and the cross section of the support column along the surface of the rigid substrate is at least one of a square shape and a circular shape.
  • the height of the closed plastic frame is substantially the same as the height of the support column.
  • the present invention has the beneficial effects that the present invention forms a closed plastic frame on a rigid substrate and/or a flexible substrate; and the rigid substrate and the flexible substrate are bonded together in a vacuum environment to cure the closed plastic frame. So that the flexible substrate is fixed on the rigid substrate by the closed plastic frame, and the region of the flexible substrate inside the closed plastic frame is attached to the rigid substrate under the negative pressure after the rigid substrate and the flexible substrate are taken out from the vacuum environment.
  • FIG. 1 is a schematic view of a method of fabricating a flexible display panel of the prior art
  • FIG. 2 is a schematic flow chart of a method for fabricating a flexible display panel according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of a substrate assembly for manufacturing a flexible display panel according to an embodiment of the present invention
  • FIG. 4 is a top plan view of the substrate assembly of FIG. 3 for flexible display panel fabrication.
  • FIG. 2 is a schematic flow chart of a method for fabricating a flexible display panel according to an embodiment of the present invention. As shown in FIG. 2, the manufacturing method of the flexible display panel includes:
  • Step S10 providing a rigid substrate and a flexible substrate.
  • the surface of the rigid substrate is provided with a plurality of support columns arranged at intervals.
  • the support post can be formed by etching a glass by a yellow/etch process.
  • the support column may be circular or square, and is not limited herein.
  • the height of the closed frame is substantially the same as the height of the support column.
  • a plurality of support columns may form a matrix arrangement.
  • the area outside the support post after etching is a thinned area.
  • Step S11 forming a closed plastic frame on the rigid substrate and/or the flexible substrate.
  • the closed frame is preferably an Ultraviolet Rays (UV) glue that can be cured by UV irradiation.
  • UV Ultraviolet Rays
  • Step S12 attaching the rigid substrate and the flexible substrate in a vacuum environment to cure the closed plastic frame, so that the flexible substrate is fixed on the rigid substrate by the closed plastic frame, and the rigid substrate and the flexible substrate are in a vacuum environment. After the removal, the region of the flexible substrate inside the closed frame is attached to the rigid substrate under the action of negative pressure.
  • the negative pressure function refers to a vacuum environment formed between the region of the flexible substrate inside the closed plastic frame and the rigid substrate, and the flexible substrate is tightly fixed on the rigid substrate by the vacuum.
  • the closed plastic frame is formed on the outer periphery of the plurality of support columns, so that the area of the flexible substrate located inside the closed plastic frame is attached to the support column under the action of negative pressure.
  • the rigid substrate is preferably a glass substrate, and correspondingly, the support column is a glass support column formed by etching the glass substrate.
  • the flexible substrate is preferably a plastic substrate.
  • Step S13 forming a display device on the flexible substrate.
  • Step S14 cutting the rigid substrate and/or the flexible substrate to separate the flexible substrate from the rigid substrate.
  • the rigid substrate and/or the flexible substrate may be cut along the inner side of the closed plastic frame to break the vacuum environment formed between the region of the flexible substrate inside the closed plastic frame and the rigid substrate, and the flexible substrate will automatically fall off. There is no need to perform peeling again, which can reduce the occurrence of bending in the flexible substrate when the flexible substrate is peeled off, resulting in device failure.
  • the flexible substrate is slit along the inner side of the closed frame and the closed frame and the remaining portion of the flexible substrate are removed from the rigid substrate.
  • the substrate assembly 20 for flexible display panel fabrication includes a rigid substrate 21 , a flexible substrate 22 , and a closed plastic frame 23 disposed between the rigid substrate 21 and the flexible substrate 22 .
  • the flexible substrate 22 is fixed on the rigid substrate 21 by the closed plastic frame 23, and a negative pressure is formed inside the closed plastic frame 23, so that the region of the flexible substrate 22 located inside the closed plastic frame 23 is attached under the action of negative pressure.
  • Rigid substrate 21 is rigid substrate 21 , a flexible substrate 22 , and a closed plastic frame 23 disposed between the rigid substrate 21 and the flexible substrate 22 .
  • the closed frame is preferably a UV glue that can be cured by UV irradiation.
  • the surface of the rigid substrate 21 is provided with a plurality of support columns 24 that are spaced apart.
  • the closed plastic frame 23 is formed on the outer periphery of the plurality of support columns 24, so that the region of the flexible substrate 22 located inside the closed plastic frame 23 is attached to the support column 24 under the action of negative pressure.
  • the negative pressure action means that a vacuum environment is formed between the region of the flexible substrate 22 inside the closed plastic frame 23 and the rigid substrate 21, and the flexible substrate 22 is tightly fixed to the rigid substrate 21 by the vacuum.
  • the rigid substrate 21 is preferably a glass substrate
  • the support post 24 is a glass support column formed by etching a glass substrate.
  • the flexible substrate 22 is preferably a plastic substrate.
  • the support columns 24 may be arranged in a matrix, and the interval outside the support post 24 after etching is the thinned region 25.
  • the support columns 24 may also be arranged in other shapes, which are not limited herein.
  • the cross section of the support post 24 along the surface of the rigid substrate 21 is at least one of a square shape and a circular shape.
  • the height of the closed frame 23 is substantially the same as the height of the support column 24.
  • a display device can be fabricated on the flexible substrate 22.
  • the rigid substrate 21 and/or the flexible substrate 22 are cut, and the flexible substrate 22 and the rigid substrate 21 are separated.
  • the rigid substrate 21 and/or the flexible substrate 22 may be cut along the inner side of the closed plastic frame 23 to break the vacuum environment formed between the region of the flexible substrate 22 located inside the closed plastic frame 23 and the rigid substrate 21, and the flexible substrate 22 will automatically fall off, no need to peel off again, so that the flexible substrate 22 can be reduced, and the flexible substrate 22 is bent to cause device failure.
  • the flexible substrate 22 is cut along the inner side of the closed frame 23, and the closed frame 23 and the remaining portion of the flexible substrate 22 are removed from the rigid substrate 21.
  • the present invention forms a closed plastic frame on a rigid substrate and/or a flexible substrate; the rigid substrate and the flexible substrate are bonded together in a vacuum environment to cure the closed plastic frame, so that the flexible substrate is
  • the closed plastic frame is fixed on the rigid substrate, and after the rigid substrate and the flexible substrate are taken out from the vacuum environment, the region of the flexible substrate inside the closed plastic frame is attached to the rigid substrate under the action of negative pressure; formed on the flexible substrate.
  • the display device; cutting the rigid substrate and/or the flexible substrate to separate the flexible substrate and the rigid substrate, can reduce the occurrence of bending in the flexible substrate when the flexible substrate is peeled off, resulting in device failure.

Abstract

一种柔性显示面板的制作方法以及用于其制作的基板组件(20)。方法包括：提供一刚性基板(21)及一柔性基板(22)；在刚性基板(21)和/或柔性基板(22)上形成一封闭式胶框(23)；在真空环境下将刚性基板(21)与柔性基板(22)进行贴合并对封闭式胶框(23)进行固化，以使得柔性基板(22)由封闭式胶框(23)固定于刚性基板(21)上，并使得在刚性基板(21)与柔性基板(22)从真空环境取出后柔性基板(22)的位于封闭式胶框(23)内部的区域在负压作用下贴附于刚性基板(21)；在柔性基板(22)上形成显示器件；对刚性基板(21)和/或柔性基板(22)进行切割，进而分离柔性基板(22)与刚性基板(21)。通过以上方式，能够减少柔性基板(22)制作中，柔性基板(22)剥离时产生弯折导致器件失效。

Description

柔性显示面板的制作方法以及用于其制作的基板组件
【技术领域】
本发明涉及液晶显示技术领域，特别是涉及一种柔性显示面板的制作方法以及用于其制作的基板组件。
【背景技术】
有机电激光显示（Organic Light-Emitting Diode，OLED）器是新一代的显示器，其因为可自发光，高亮度，宽视角，低能耗，可绕曲等特性受到广泛关注，目前已被应用于手机和电视上。OLED基板不需要背光，通过对制作在玻璃上的有机材料通电，则可使有机材料发光。因为是很薄的有机材料进行自发光的特点，使柔性显示成为可能。目前OLED柔性显示面板的制作过程中，通常采用的是聚萘二甲酸乙二醇酯（PEN）或聚对苯二甲酸乙二醇酯（PET）等塑胶基板，但因塑胶基板易弯曲变形，无法单独进行制程工艺。如图1所示，将塑胶基板12用胶材13贴附在玻璃基板11上，然后在塑胶基板12上完成制程，最后将塑胶基板12从玻璃基板11上剥离，即可得到柔性OLED面板 。但此方法制作的柔性OLED面板在剥离过程中，因为对塑胶基板12的弯折，很容易损坏制作在塑胶基板12上的膜层和器件，导致器件失效。
【发明内容】
本发明实施例提供了一种柔性显示面板的制作方法以及用于其制作的基板组件，能够减少柔性基板制作中，柔性基板剥离时产生弯折导致器件失效。
本发明提供一种柔性显示面板的制作方法，包括：提供一刚性基板及一柔性基板；在刚性基板和/或柔性基板上形成一封闭式胶框；在真空环境下将刚性基板与柔性基板进行贴合并对封闭式胶框进行固化，以使得柔性基板由封闭式胶框固定于刚性基板上，并使得在刚性基板与柔性基板从真空环境取出后柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板；在柔性基板上形成显示器件；对刚性基板和/或柔性基板进行切割，进而分离柔性基板与刚性基板；其中，刚性基板的表面设置有间隔设置的多个支撑柱，封闭式胶框形成于多个支撑柱的外围，进而使得柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于支撑柱上；对刚性基板和/或柔性基板进行切割的步骤包括：沿封闭式胶框的内侧切割刚性基板和/或柔性基板。
其中，刚性基板为玻璃基板，支撑柱为对玻璃基板进行蚀刻而形成的玻璃支撑柱。
其中，对刚性基板和/或柔性基板进行切割的步骤包括：沿封闭式胶框的内侧切裂柔性基板，并从刚性基板上移除封闭式胶框及柔性基板的剩余部分。
本发明提供一种柔性显示面板的制作方法，包括：提供一刚性基板及一柔性基板；在刚性基板和/或柔性基板上形成一封闭式胶框；在真空环境下将刚性基板与柔性基板进行贴合并对封闭式胶框进行固化，以使得柔性基板由封闭式胶框固定于刚性基板上，并使得在刚性基板与柔性基板从真空环境取出后柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板；在柔性基板上形成显示器件；对刚性基板和/或柔性基板进行切割，进而分离柔性基板与刚性基板。
其中，刚性基板的表面设置有间隔设置的多个支撑柱，封闭式胶框形成于多个支撑柱的外围，进而使得柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于支撑柱上。
其中，刚性基板为玻璃基板，支撑柱为对玻璃基板进行蚀刻而形成的玻璃支撑柱。
其中，对刚性基板和/或柔性基板进行切割的步骤包括：沿封闭式胶框的内侧切割刚性基板和/或柔性基板。
其中，对刚性基板和/或柔性基板进行切割的步骤包括：沿封闭式胶框的内侧切裂柔性基板，并从刚性基板上移除封闭式胶框及柔性基板的剩余部分。
本发明还提供一种用于柔性显示面板制作的基板组件，基板组件包括刚性基板、柔性基板以及设置于刚性基板与柔性基板之间的封闭式胶框，其中柔性基板通过封闭式胶框固定于刚性基板上，封闭式胶框内部形成负压，以使柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板。
其中，刚性基板的表面设置有间隔设置的多个支撑柱，封闭式胶框形成于多个支撑柱的外围，进而使得柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于支撑柱上。
其中，刚性基板为玻璃基板，支撑柱为对玻璃基板进行蚀刻而形成的玻璃支撑柱。
其中，支撑柱呈矩阵排列，且支撑柱沿刚性基板表面的截面为方形和圆形的至少之一。
其中，封闭式胶框的高度与支撑柱的高度基本持平。
通过上述方案，本发明的有益效果是：本发明通过在刚性基板和/或柔性基板上形成一封闭式胶框；在真空环境下将刚性基板与柔性基板进行贴合并对封闭式胶框进行固化，以使得柔性基板由封闭式胶框固定于刚性基板上，并使得在刚性基板与柔性基板从真空环境取出后柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板；在柔性基板上形成显示器件；对刚性基板和/或柔性基板进行切割，进而分离柔性基板与刚性基板，能够减少柔性基板制作中，柔性基板剥离时产生弯折导致器件失效。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是现有技术的柔性显示面板的制作方法的示意图；
图2是本发明实施例的柔性显示面板的制作方法的流程示意图；
图3是本发明实施例的用于柔性显示面板制作的基板组件的结构示意图；
图4是图3中的用于柔性显示面板制作的基板组件的俯视图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参见图2所示，图2是本发明实施例的柔性显示面板的制作方法的流程示意图。如图2所示，柔性显示面板的制作方法包括：
步骤S10：提供一刚性基板及一柔性基板。
其中，刚性基板的表面设置有间隔设置的多个支撑柱。支撑柱可以通过黄光/刻蚀制程对玻璃进行刻蚀形成。支撑柱可为圆形或方形，在此不作限制。封闭式胶框的高度与支撑柱的高度基本持平。多个支撑柱可以形成矩阵排列。刻蚀后支撑柱外的区间为减薄区。
步骤S11：在刚性基板和/或柔性基板上形成一封闭式胶框。
封闭式胶框优选为紫外光固化（Ultraviolet Rays，UV）胶，可以通过UV照射进行固化。
步骤S12：在真空环境下将刚性基板与柔性基板进行贴合并对封闭式胶框进行固化，以使得柔性基板由封闭式胶框固定于刚性基板上，并使得在刚性基板与柔性基板从真空环境取出后柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板。
其中，负压作用指的是柔性基板的位于封闭式胶框内部的区域与刚性基板之间形成真空环境，柔性基板被该真空紧紧固定于刚性基板上。封闭式胶框形成于多个支撑柱的外围，进而使得柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于支撑柱上。刚性基板优选为玻璃基板，对应地，支撑柱为对玻璃基板进行蚀刻而形成的玻璃支撑柱。柔性基板优选为塑胶基板。
步骤S13：在柔性基板上形成显示器件。
步骤S14：对刚性基板和/或柔性基板进行切割，进而分离柔性基板与刚性基板。
在步骤S14中，可以沿封闭式胶框的内侧切割刚性基板和/或柔性基板，破坏柔性基板的位于封闭式胶框内部的区域与刚性基板之间形成的真空环境，柔性基板即会自动脱落，不需要再进行剥离，如此能够减少柔性基板制作中，柔性基板剥离时产生弯折导致器件失效。例如，沿封闭式胶框的内侧切裂柔性基板，并从刚性基板上移除封闭式胶框及柔性基板的剩余部分。
图3是本发明实施例的用于柔性显示面板制作的基板组件的结构示意图。如图3所示，用于柔性显示面板制作的基板组件20包括刚性基板21、柔性基板22以及设置于刚性基板21与柔性基板22之间的封闭式胶框23。其中柔性基板22通过封闭式胶框23固定于刚性基板21上，封闭式胶框23内部形成负压，以使柔性基板22的位于封闭式胶框23内部的区域在负压作用下贴附于刚性基板21。
在本发明实施例中，封闭式胶框优选为UV胶，可以通过UV照射进行固化。刚性基板21的表面设置有间隔设置的多个支撑柱24。封闭式胶框23形成于多个支撑柱24的外围，进而使得柔性基板22的位于封闭式胶框23内部的区域在负压作用下贴附于支撑柱24上。负压作用指的是柔性基板22的位于封闭式胶框23内部的区域与刚性基板21之间形成真空环境，柔性基板22被该真空紧紧固定于刚性基板21上。
其中，刚性基板21优选为玻璃基板，支撑柱24为对玻璃基板进行蚀刻而形成的玻璃支撑柱。柔性基板22优选为塑胶基板。如图4所示，支撑柱24可以呈矩阵排列，刻蚀后支撑柱24外的区间为减薄区25。当然在本发明的其他实施例中，支撑柱24也可以排列成其他形状，在此不作限制。支撑柱24沿刚性基板21表面的截面为方形和圆形的至少之一。封闭式胶框23的高度与支撑柱24的高度基本持平。
在本发明实施例中，基板组件20形成后，可以在柔性基板22上制作显示器件。并在显示器件制作完成后，对刚性基板21和/或柔性基板22进行切割，进而分离柔性基板22与刚性基板21。具体地，可以沿封闭式胶框23的内侧切割刚性基板21和/或柔性基板22，破坏柔性基板22的位于封闭式胶框23内部的区域与刚性基板21之间形成的真空环境，柔性基板22即会自动脱落，不需要再进行剥离，如此能够减少柔性基板22制作中，柔性基板22剥离时产生弯折导致器件失效。例如，沿封闭式胶框23的内侧切裂柔性基板22，并从刚性基板21上移除封闭式胶框23及柔性基板22的剩余部分。
综上所述，本发明通过在刚性基板和/或柔性基板上形成一封闭式胶框；在真空环境下将刚性基板与柔性基板进行贴合并对封闭式胶框进行固化，以使得柔性基板由封闭式胶框固定于刚性基板上，并使得在刚性基板与柔性基板从真空环境取出后柔性基板的位于封闭式胶框内部的区域在负压作用下贴附于刚性基板；在柔性基板上形成显示器件；对刚性基板和/或柔性基板进行切割，进而分离柔性基板与刚性基板，能够减少柔性基板制作中，柔性基板剥离时产生弯折导致器件失效。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种柔性显示面板的制作方法，其中，所述方法包括：
    提供一刚性基板及一柔性基板；
    在所述刚性基板和/或所述柔性基板上形成一封闭式胶框；
    在真空环境下将所述刚性基板与所述柔性基板进行贴合并对所述封闭式胶框进行固化，以使得所述柔性基板由所述封闭式胶框固定于所述刚性基板上，并使得在所述刚性基板与所述柔性基板从所述真空环境取出后所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述刚性基板；
    在所述柔性基板上形成显示器件；
    对所述刚性基板和/或所述柔性基板进行切割，进而分离所述柔性基板与所述刚性基板;
    其中，所述刚性基板的表面设置有间隔设置的多个支撑柱，所述封闭式胶框形成于所述多个支撑柱的外围，进而使得所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述支撑柱上；
    所述对所述刚性基板和/或所述柔性基板进行切割的步骤包括：沿所述封闭式胶框的内侧切割所述刚性基板和/或所述柔性基板。
  2. 根据权利要求1所述的方法，其中，所述刚性基板为玻璃基板，所述支撑柱为对所述玻璃基板进行蚀刻而形成的玻璃支撑柱。
  3. 根据权利要求1所述的方法，其中，所述对所述刚性基板和/或所述柔性基板进行切割的步骤包括：
    沿所述封闭式胶框的内侧切裂所述柔性基板，并从所述刚性基板上移除所述封闭式胶框及所述柔性基板的剩余部分。
  4. 一种柔性显示面板的制作方法，其中，所述方法包括：
    提供一刚性基板及一柔性基板；
    在所述刚性基板和/或所述柔性基板上形成一封闭式胶框；
    在真空环境下将所述刚性基板与所述柔性基板进行贴合并对所述封闭式胶框进行固化，以使得所述柔性基板由所述封闭式胶框固定于所述刚性基板上，并使得在所述刚性基板与所述柔性基板从所述真空环境取出后所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述刚性基板；
    在所述柔性基板上形成显示器件；
    对所述刚性基板和/或所述柔性基板进行切割，进而分离所述柔性基板与所述刚性基板。
  5. 根据权利要求4所述的方法，其中，所述刚性基板的表面设置有间隔设置的多个支撑柱，所述封闭式胶框形成于所述多个支撑柱的外围，进而使得所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述支撑柱上。
  6. 根据权利要求5所述的方法，其中，所述刚性基板为玻璃基板，所述支撑柱为对所述玻璃基板进行蚀刻而形成的玻璃支撑柱。
  7. 根据权利要求4所述的方法，其中，所述对所述刚性基板和/或所述柔性基板进行切割的步骤包括：
    沿所述封闭式胶框的内侧切割所述刚性基板和/或所述柔性基板。
  8. 根据权利要求4所述的方法，其中，所述对所述刚性基板和/或所述柔性基板进行切割的步骤包括：
    沿所述封闭式胶框的内侧切裂所述柔性基板，并从所述刚性基板上移除所述封闭式胶框及所述柔性基板的剩余部分。
  9. 一种用于柔性显示面板制作的基板组件，其中，所述基板组件包括刚性基板、柔性基板以及设置于所述刚性基板与所述柔性基板之间的封闭式胶框，其中所述柔性基板通过所述封闭式胶框固定于所述刚性基板上，所述封闭式胶框内部形成负压，以使所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述刚性基板。
  10. 根据权利要求9所述的基板组件，其中，所述刚性基板的表面设置有间隔设置的多个支撑柱，所述封闭式胶框形成于所述多个支撑柱的外围，进而使得所述柔性基板的位于所述封闭式胶框内部的区域在负压作用下贴附于所述支撑柱上。
  11. 根据权利要求10所述的基板组件，其中，所述刚性基板为玻璃基板，所述支撑柱为对所述玻璃基板进行蚀刻而形成的玻璃支撑柱。
  12. 根据权利要求10所述的基板组件，其中，所述支撑柱呈矩阵排列，且所述支撑柱沿所述刚性基板表面的截面为方形和圆形的至少之一。
  13. 根据权利要求10所述的基板组件，其中，所述封闭式胶框的高度与所述支撑柱的高度基本持平。
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