WO2014180082A1 - 显示面板及其制造方法 - Google Patents
显示面板及其制造方法 Download PDFInfo
- Publication number
- WO2014180082A1 WO2014180082A1 PCT/CN2013/083001 CN2013083001W WO2014180082A1 WO 2014180082 A1 WO2014180082 A1 WO 2014180082A1 CN 2013083001 W CN2013083001 W CN 2013083001W WO 2014180082 A1 WO2014180082 A1 WO 2014180082A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- flexible circuit
- substrate
- array substrate
- display panel
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 129
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000000565 sealant Substances 0.000 claims description 7
- 238000001802 infusion Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000011946 reduction process Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Definitions
- Embodiments of the present invention relate to a display panel and a method of fabricating the same. Background technique
- the liquid crystal display panel is formed by aligning an array substrate and a counter substrate (for example, a color filter substrate), and injecting liquid crystal between the two substrates.
- a flexible circuit board (COF) and a printed circuit board (PCB) are attached to the peripheral region of the array substrate through an anisotropic conductive paste (ACF).
- ACF anisotropic conductive paste
- FIG. 1 After the opposite substrate and the array substrate are prepared, the process is performed by liquid crystal infusion and sealing of the sealant, and then the process is performed, and then the cutting process is performed, and then the peripheral area of the array substrate is pasted. Attached to flexible circuit boards and printed circuit boards.
- the structure of the conventional display panel is as shown in FIG. 2 and FIG. 3, and includes: an array substrate 11, a color filter substrate 12, and a gate line end flexible circuit board 13 attached to the array substrate 11, and a data line end flexible circuit board 14. And a printed circuit board 15.
- the color filter substrate is usually smaller than the array substrate, and the peripheral portion of the array substrate is used for attaching the flexible circuit board and the printed circuit board.
- the flexible circuit board in the display panel thus produced is liable to cause poor bonding, and it is easy to cause poor contact between the flexible circuit board and the array substrate under the action of external force, thereby causing the display panel to display abnormality. Summary of the invention
- Embodiments of the present invention provide a display panel having a high precision of a cartridge, a good adhesion effect of a flexible circuit board, and a light leakage avoidance, and a method of manufacturing the same.
- a display panel includes: a relatively opposite opposing substrate and an array substrate, wherein the opposite substrate and the array substrate are filled with liquid crystal, and the array substrate
- the peripheral non-display area is provided with a flexible circuit board, and the flexible circuit board is located between the array substrate and the opposite substrate.
- the opposite substrate is, for example, a color filter substrate.
- the flexible circuit board includes a flexible circuit board at a gate line end and a flexible circuit board at a data line end.
- the flexible circuit board is attached to the array substrate by an anisotropic conductive paste.
- the region on the array substrate to which the flexible circuit board is attached is subjected to a thickness thinning process.
- a region of the opposite substrate that is in contact with the flexible circuit board is subjected to a thickness thinning process.
- the thickness of the thinning is on the order of several tens of micrometers.
- a method of manufacturing a display panel including: preparing an opposite substrate and an array substrate;
- the cut opposing substrate and the array substrate attached to the flexible circuit board are bonded to each other to form a display panel.
- attaching the cut array substrate to the flexible circuit board comprises:
- the diced array substrate is attached to the printed circuit board.
- the method further includes:
- the area of the diced array substrate to which the flexible circuit board is to be attached is subjected to thickness thinning treatment.
- the method further includes:
- the diced opposite substrate and the array substrate attached to the flexible circuit board are bonded to each other to form a display panel, and the diced opposite substrate is formed before the display panel is formed.
- the area where the flexible circuit board is to be contacted is subjected to thickness thinning.
- FIG. 1 is a schematic view showing a manufacturing process of a conventional display panel
- FIG. 2 is a plan view showing a conventional display panel structure
- Figure 3 is a perspective view of a conventional display panel structure
- FIG. 4 is a top plan view of a display panel in accordance with one embodiment of the present invention.
- FIG. 5 is a perspective view of a display panel in accordance with one embodiment of the present invention
- FIG. 6 is a flow chart of a method of manufacturing a display panel according to an embodiment of the present invention. detailed description
- FIG. 4 and FIG. 5 are schematic diagrams showing the structure of a display panel according to an exemplary embodiment of the present invention.
- the display panel includes: a relatively aligned array substrate 21 and a counter substrate 22, the array substrate 21 and the opposite substrate
- the liquid crystal is filled between 22, and a peripheral portion of the array substrate 21 is provided with a flexible circuit board (COF).
- COF flexible circuit board
- the peripheral area herein refers to a peripheral non-display area which is not filled with liquid crystal, and the flexible circuit board is located between the array substrate 21 and the opposite substrate 22 while being in contact with the opposite substrate 22.
- the counter substrate may be, for example, a color filter substrate.
- the flexible circuit board may include a gate line end flexible circuit board 23 and a data line end flexible circuit board
- the gate line end flexible circuit board 23 and the data line end flexible circuit board 24 may be attached to the array substrate 21 through an anisotropic conductive paste (ACF).
- ACF anisotropic conductive paste
- the four sides of the opposite substrate 22 and the array substrate 21 are aligned, and may not be completely aligned in practical applications, but the flexible circuit board must be located between the array substrate 21 and the opposite substrate 22, It is in contact with the array substrate 21 and is also in contact with the opposite substrate 22. Since the two-layer substrate is pressed, the flexible circuit board has a better attaching effect. Therefore, when subjected to an external force, the flexible circuit board is less likely to fall off from the substrate and cause poor contact, thereby improving the reliability of the product.
- a typical flexible circuit board has a thickness of several tens of micrometers, and a gap value between the opposite substrate and the array substrate after the box is about ten micrometers. Therefore, in order to ensure that the gap value after the array substrate and the opposite substrate are formed into a box is not affected, the area on the array substrate to which the flexible circuit board is attached may be thinned, or the area on the opposite substrate that contacts the flexible circuit board. Perform thinning.
- the thickness of the thinned plate depends on the thickness of the flexible circuit board, for example on the order of a few tens of microns.
- FIG. 6 is a flowchart of a method of manufacturing a display panel according to an embodiment of the present invention, the method includes:
- Step S3 may further include:
- the cut array substrate 21 is attached to a printed circuit board 25 (PCB).
- PCB printed circuit board
- the counter substrate is, for example, a color filter substrate.
- the cutting process is first performed, that is, the entire substrate (for example, glass, quartz, plastic substrate) is cut.
- the array substrate is attached to the flexible circuit board, and then the liquid crystal is filled and the sealant is coated, and the cut opposite substrate and the array substrate attached with the flexible circuit board are boxed, thereby completing the whole preparation.
- the area of the array substrate to be attached with the flexible circuit board may be thinned before step S3; or, before step S4 It is also possible to perform a thinning treatment on the region of the opposite substrate that is to be in contact with the flexible circuit board after cutting.
- the embodiment of the invention can make the flexible circuit board be located between the two substrates, so that the flexible circuit board has better adhesion effect under the pressing of the two-layer substrate, and the flexible circuit board is not easily contacted with the substrate if subjected to an external force. Bad, improve the credibility of the product.
- the embodiment of the present invention also improves the manufacturing process of the display panel, that is, changes the conventional "boxing ⁇ cutting ⁇ COF and PCB attaching" process to "cutting ⁇ COF and PCB attaching ⁇ forming The process of the box. By boxing after cutting, the accuracy of the box is significantly improved, thereby avoiding light leakage caused by misalignment.
- TFT-LCD display panel has been described above as an embodiment, but the scope of application of the embodiment of the present invention is not limited to a TFT-LCD, OLED, or the like display panel.
- the embodiment of the invention enables the flexible circuit board to be located between the opposite substrate and the array substrate. Under the pressing of the two substrates, the flexible circuit board has better adhesion effect and can prevent the external force from being affected to some extent. Poor contact between the flexible circuit board and the substrate improves the reliability of the product. In addition, since the process of the cartridge is performed after the cutting process, the accuracy of the cartridge is remarkably improved, thereby avoiding light leakage caused by misalignment.
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示面板，包括：相对贴合的对置基板（22）和阵列基板（21），所述对置基板（22）和所述阵列基板（21）之间填充有液晶，所述阵列基板（21）的外围非显示区域设有柔性电路板（23，24），所述柔性电路板（23，24）位于所述阵列基板（21）和所述对置基板（22）之间。从而，柔性电路板（23，24）的贴附效果更好，显著改善对盒精度，避免对位不准造成的漏光。还披露了一种显示面板的制造方法。
Description
显示面板及其制造方法 技术领域
本发明的实施例涉及一种显示面板及其制造方法。 背景技术
液晶显示面板是由阵列基板和对置基板 (例如彩膜基板 )进行对位贴合， 并在这两个基板之间注入液晶形成的。 在阵列基板的外围区域通过各向异性 导电胶（ACF )贴附有柔性电路板 ( COF )和印刷电路板（PCB )。 常规的显 示面板的制造流程如图 1所示， 制备好对置基板和阵列基板后， 经液晶灌注 及封框胶涂布后进行成盒工艺， 然后进行切割工艺， 之后在阵列基板外围区 域贴附柔性电路板和印刷电路板。
常规的显示面板的结构如图 2和图 3所示， 包括： 阵列基板 11、 彩膜基 板 12、 以及贴附在阵列基板 11上的栅线端柔性电路板 13、 数据线端柔性电 路板 14和印刷电路板 15。 常规的显示面板在制备过程中， 通常彩膜基板比 阵列基板要小， 阵列基板的外围多出的区域用于贴附柔性电路板和印刷电路 板。 这样制作的显示面板中柔性电路板很容易产生绑定（Bonding )不良， 并 且在外力的作用下很容易造成柔性电路板与阵列基板接触不良， 从而导致显 示面板显示异常。 发明内容
本发明的实施例提供一种对盒精度高、 柔性电路板贴附效果好并且能避 免对位漏光的显示面板及其制造方法。
根据本发明的一个方面， 提供一种显示面板， 该显示面板包括： 相对贴 合的对置基板和阵列基板， 所述对置基板和所述阵列基板之间填充有液晶， 所述阵列基板的外围非显示区域设有柔性电路板， 所述柔性电路板位于所述 阵列基板和所述对置基板之间。 该对置基板例如为彩膜基板。
根据本发明的一个实施例， 所述柔性电路板包括栅线端的柔性电路板和 数据线端的柔性电路板。
根据本发明的一个实施例， 所述柔性电路板通过各向异性导电胶贴附到 所述阵列基板上。
根据本发明的一个实施例， 所述阵列基板上贴附柔性电路板的区域进行 过厚度减薄处理。
根据本发明的一个实施例， 所述对置基板上接触到柔性电路板的区域进 行过厚度减薄处理。
根据本发明的一个实施例， 所述减薄处理中， 减薄的厚度在几十微米量 级。
根据本发明的另一个方面， 提供了一种显示面板的制造方法， 包括： 制备对置基板和阵列基板；
对所述对置基板和所述阵列基板进行切割；
将切割后的阵列基板贴附柔性电路板； 以及
进行液晶灌注和封框胶涂布后， 将切割后的对置基板和贴附柔性电路板 后的阵列基板进行对盒贴合， 以形成显示面板。
根据本发明的一个实施例， 所述将切割后的阵列基板贴附柔性电路板包 括：
将切割后的阵列基板贴附印刷电路板。
根据本发明的一个实施例， 还包括：
在所述将切割后的阵列基板贴附柔性电路板之前， 对切割后的阵列基板 上将要贴附柔性电路板的区域进行厚度减薄处理。
根据本发明的一个实施例， 还包括：
在所述进行液晶灌注和封框胶涂布后， 将切割后的对置基板和贴附柔性 电路板后的阵列基板进行对盒贴合， 以形成显示面板之前， 对切割后的对置 基板上将要接触柔性电路板的区域进行厚度减薄处理。 附图说明
以下将结合附图对本发明的实施例进行更详细的说明， 以使本领域普通 技术人员更加清楚地理解本发明， 其中：
图 1是常规的显示面板的制造流程示意图；
图 2是常规的显示面板结构俯视图；
图 3是常规的显示面板结构立体图；
图 4是根据本发明一个实施例的显示面板俯视图；
图 5是根据本发明一个实施例的显示面板立体图；
图 6是根据本发明的一个实施例提供的显示面板的制造方法流程图。 具体实施方式
为使本发明的实施例的目的、 技术方案和优点更加清楚， 下面将结合本 发明实施例的附图对本发明的实施例的技术方案进行清楚、 完整的描述。 显 然， 所描述的实施例仅是本发明的一部分示例性实施例， 而不是全部的实施 例。 基于所描述的本发明的示例性实施例， 本领域普通技术人员所获得的所 有其它实施例、 改进或变型都应属于本发明的保护范围。
图 4和图 5是根据本发明一个示例性实施例的显示面板的结构示意图， 该显示面板包括： 相对贴合的阵列基板 21和对置基板 22, 所述阵列基板 21 和所述对置基板 22之间填充有液晶， 所述阵列基板 21的外围区域设有柔性 电路板（COF )。 这里的外围区域指没有填充液晶的外围非显示区域， 所述柔 性电路板位于所述阵列基板 21和所述对置基板 22之间， 其同时与所述对置 基板 22相接触。 对置基板例如可以为彩膜基板。
所述柔性电路板可以包括栅线端柔性电路板 23 和数据线端柔性电路板
24。 栅线端柔性电路板 23和数据线端柔性电路板 24可以通过各向异性导电 胶（ACF )贴附到所述阵列基板 21上。
本实施例中， 对置基板 22和阵列基板 21的四条边是对齐的， 在实际应 用中也可以是不完全对齐的，但必须保证柔性电路板位于阵列基板 21和对置 基板 22之间， 其不仅与阵列基板 21接触， 同时还与对置基板 22接触。 由于 有两层基板的挤压， 柔性电路板的贴附效果更好， 因此， 当受到外力作用时， 柔性电路板不容易从基板脱落而造成接触不良， 因此提高了产品的可信度。
一般的柔性电路板的厚度为几十个微米， 而对置基板和阵列基板对盒后 的间隙值在十微米左右。 因此， 为了保证阵列基板和对置基板成盒后的间隙 值不受影响， 可以对阵列基板上贴附柔性电路板的区域进行减薄处理， 或者 对对置基板上接触到柔性电路板的区域进行减薄处理。 减薄的厚度视柔性电 路板的厚度而定， 例如在大约几十微米的量级。
图 6是根据本发明的一个实施例提供的显示面板的制造方法的流程图， 该方法包括：
Sl、 制备对置基板 22和阵列基板 21 ;
S2、 对所述对置基板 22和所述阵列基板 21进行切割；
53、 将切割后的阵列基板 21贴附柔性电路板（COF ); 以及
54、 进行液晶灌注和封框胶涂布后， 将切割后的对置基板 22和贴附柔 性电路板后的阵列基板 21进行对盒贴合， 以完成最终成盒。
步骤 S3中还可以包括：
将切割后的阵列基板 21贴附印刷电路板 25 ( PCB )。
对置基板例如为彩膜基板。
本发明实施例的方法在对置基板和阵列基板的制备之后， 首先进行切割 工艺， 即对整张基板（例如， 玻璃、 石英、 塑料基板）进行切割。 之后对阵 列基板进行柔性电路板的贴附， 然后经液晶灌注及封框胶涂布后， 将切割后 的对置基板与贴附柔性电路板后的阵列基板对盒成盒， 从而完成整个制备工 艺
为了使阵列基板和对置基板成盒后的间隙值不受影响， 在步骤 S3之前 还可以对切割后的阵列基板上将要贴附柔性电路板的区域进行减薄处理； 或 者， 在步骤 S4之前还可以对切割后的对置基板上将要接触柔性电路板的区 域进行减薄处理。
本发明的实施例可以使柔性电路板位于两层基板之间， 这样柔性电路板 在两层基板的挤压之下贴附效果更好， 并且如果受到外力作用不容易造成柔 性电路板与基板接触不良， 提高产品的可信度。 此外， 本发明的实施例还对 显示面板的制作工艺进行了改进， 即， 将常规的 "成盒→切割→COF和 PCB 贴附" 的工艺流程改成 "切割→COF和 PCB贴附→成盒" 的工艺流程。 通 过在切割之后再成盒， 显著提高了对盒精度， 从而避免了对位不准造成的漏 光。
上面以 TFT-LCD显示面板为实施例进行了阐述， 但本发明的实施例的 适用范围不限于 TFT-LCD、 OLED等模式的显示面板。
本发明的实施例使得柔性电路板位于对置基板和阵列基板之间， 在两层 基板的挤压之下， 柔性电路板的贴附效果更好， 并且能够在一定程度上防止 外力作用造成的柔性电路板与基板的接触不良，提高了产品的可信度。此外， 由于在切割工艺之后再进行对盒工艺， 显著改善了对盒精度， 从而避免了对 位不准造成的漏光。
以上所述仅是本发明的示例性的实施例和实施方式， 应当理解， 对于本 技术领域的普通技术人员来说， 在不脱离本发明原理和精神的前提下， 可以
容易地想到许多其它实施例、 改进和替换， 而这些实施例、 改进和替换都应 视为本发明的保护范围。
Claims
1、 一种显示面板， 包括： 相对贴合的对置基板和阵列基板， 所述对置基 板和所述阵列基板之间填充有液晶， 所述阵列基板的外围非显示区域设有柔 性电路板， 所述柔性电路板夹在所述阵列基板和所述对置基板之间。
2、如权利要求 1所述的显示面板，其中所述柔性电路板包括栅线端的柔 性电路板和数据线端的柔性电路板。
3、如权利要求 1或 2所述的显示面板，其中所述柔性电路板通过各向异 性导电胶贴附到所述阵列基板上。
4、如权利要求 3所述的显示面板，其中所述阵列基板上贴附柔性电路板 的区域进行过厚度减薄处理。
5、如权利要求 1-4任一项所述的显示面板， 其中所述对置基板上接触到 柔性电路板的区域进行过厚度减薄处理。
6、如权利要求 4或 5所述的显示面板， 其中所述减薄处理中， 减薄的厚 度在几十微米量级。
7、如权利要求 1-6任一项所述的显示面板， 其中所述对置基板为彩膜基 板。
8、 一种显示面板的制造方法， 包括：
制备对置基板和阵列基板；
对所述对置基板和所述阵列基板进行切割；
将切割后的阵列基板贴附柔性电路板； 以及
进行液晶灌注和封框胶涂布后， 将切割后的对置基板和贴附柔性电路板 后的阵列基板进行对盒贴合， 以形成显示面板。
9、如权利要求 8所述的制造方法，其中所述将切割后的阵列基板贴附柔 性电路板包括：
将切割后的阵列基板贴附印刷电路板。
10、 如权利要求 8或 9所述的制造方法， 还包括：
在所述将切割后的阵列基板贴附柔性电路板之前， 对切割后的阵列基板 上将要贴附柔性电路板的区域进行厚度减薄处理。
11、 如权利要求 8-10任一项所述的制造方法， 还包括：
在所述进行液晶灌注和封框胶涂布后， 将切割后的对置基板和贴附柔性
电路板后的阵列基板进行对盒贴合， 以形成显示面板之前， 对切割后的对置 基板上将要接触柔性电路板的区域进行厚度减薄处理。
12、如权利要求 8-11任一项所述的制造方法， 其中所述对置基板为彩膜 基板。
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| CN201310165897.9 | 2013-05-08 | ||
| CN2013101658979A CN103278956A (zh) | 2013-05-08 | 2013-05-08 | 显示面板及其制造方法 |
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| CN103278956A (zh) * | 2013-05-08 | 2013-09-04 | 京东方科技集团股份有限公司 | 显示面板及其制造方法 |
| CN103745946B (zh) * | 2014-01-09 | 2017-02-01 | 北京京东方光电科技有限公司 | 一种显示面板的涂覆装置 |
| CN105468204B (zh) * | 2016-02-04 | 2018-07-17 | 京东方科技集团股份有限公司 | 一种显示模组、显示装置 |
| CN107479228B (zh) * | 2017-09-11 | 2020-08-25 | 京东方科技集团股份有限公司 | 显示模组及显示模组的制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001133756A (ja) * | 1999-11-02 | 2001-05-18 | Seiko Epson Corp | 液晶表示モジュール |
| JP2003107519A (ja) * | 2001-10-01 | 2003-04-09 | Matsushita Electric Ind Co Ltd | 駆動回路内蔵型ｔｆｔ液晶表示装置及びその製造方法 |
| CN1519617A (zh) * | 2003-01-20 | 2004-08-11 | 瀚宇彩晶股份有限公司 | 液晶显示装置 |
| CN1614624A (zh) * | 2003-11-06 | 2005-05-11 | 松下电器产业株式会社 | 触摸面板和使用该面板的液晶显示装置 |
| CN103278956A (zh) * | 2013-05-08 | 2013-09-04 | 京东方科技集团股份有限公司 | 显示面板及其制造方法 |
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| JPH11254705A (ja) * | 1998-03-13 | 1999-09-21 | Sony Corp | 記録装置及びその製造方法 |
| CN100553405C (zh) * | 2007-07-27 | 2009-10-21 | 日月光半导体制造股份有限公司 | 制作电路板的方法 |
| DE102009009288A1 (de) * | 2009-02-17 | 2010-08-26 | Osram Gesellschaft mit beschränkter Haftung | Starrflexible Trägerplatte |
| CN201440327U (zh) * | 2009-06-18 | 2010-04-21 | 刘振亚 | 前后双向读卡的复合式usb随身碟 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001133756A (ja) * | 1999-11-02 | 2001-05-18 | Seiko Epson Corp | 液晶表示モジュール |
| JP2003107519A (ja) * | 2001-10-01 | 2003-04-09 | Matsushita Electric Ind Co Ltd | 駆動回路内蔵型ｔｆｔ液晶表示装置及びその製造方法 |
| CN1519617A (zh) * | 2003-01-20 | 2004-08-11 | 瀚宇彩晶股份有限公司 | 液晶显示装置 |
| CN1614624A (zh) * | 2003-11-06 | 2005-05-11 | 松下电器产业株式会社 | 触摸面板和使用该面板的液晶显示装置 |
| CN103278956A (zh) * | 2013-05-08 | 2013-09-04 | 京东方科技集团股份有限公司 | 显示面板及其制造方法 |
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