WO2020226088A1 - 被覆切削工具 - Google Patents
被覆切削工具 Download PDFInfo
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- WO2020226088A1 WO2020226088A1 PCT/JP2020/017962 JP2020017962W WO2020226088A1 WO 2020226088 A1 WO2020226088 A1 WO 2020226088A1 JP 2020017962 W JP2020017962 W JP 2020017962W WO 2020226088 A1 WO2020226088 A1 WO 2020226088A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0664—Carbonitrides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/16—Milling-cutters characterised by physical features other than shape
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
Definitions
- the present invention relates to a coated cutting tool.
- the present application claims priority based on Japanese Patent Application No. 2019-089303 filed in Japan on May 9, 2019, the contents of which are incorporated herein by reference.
- nitrides mainly composed of Al and Cr are film types having excellent heat resistance and are widely applied to coating cutting tools.
- Patent Document 1 discloses a coating cutting tool provided with a hard coating obtained by adding at least one of B, W, Mo, Ta, and Nb to a nitride of Al and Cr.
- Patent Document 2 discloses a coating cutting tool provided with a hard film in which AlCrB nitride and TiAl nitride are alternately laminated.
- the hard film is composed of a b-layer made of a nitride or a carbonitride, which is arranged on the base material.
- the content ratio of aluminum (Al) is 55 atomic% or more, followed by chromium (Cr), and at least boron (B) with respect to the total amount of metal (including metalloid) elements.
- Cr chromium
- B at least boron
- the c2 layer of carbonitride and the c layer which is a laminated film in which each is alternately laminated with a thickness of 50 nm or less, Have,
- the c layer has a peak intensity caused by the (010) plane of AlN having a hexagonal close-packed structure as Ih, and has an AlN having a face-centered cubic lattice structure.
- the structure may have a nitride or carbonitride containing Ti and Si on the c layer. Further, the structure may have an AlCr-based nitride or carbonitride, or an AlTi-based nitride or carbonitride on the c-layer. Further, it is preferable that the c layer is the thickest film with respect to the total film thickness of the hard film. Further, the c layer is composed of columnar particles, and the average width of the columnar particles is preferably 90 nm or less.
- FIG. 1 is a diagram showing a cross-sectional structure of the coated cutting tool of the embodiment.
- the present inventor examined a method for improving the tool life of a coated cutting tool provided with AlCrB-based nitride or carbonitride.
- the present inventor describes Al-rich AlCr-based nitrides or carbonitrides (hereinafter, may be referred to as AlCrN-based) and Al-rich AlTi-based nitrides or carbonitrides (hereinafter, referred to as AlTiN-based).
- AlCrN-based Al-rich AlCr-based nitrides or carbonitrides
- AlTiN-based Al-rich AlTi-based nitrides or carbonitrides
- the coated cutting tool of the present embodiment has, for example, the cross-sectional structure shown in FIG.
- the coated cutting tool of the present embodiment has a base material and a hard film formed on the base material.
- the hard film is an a layer provided as needed, a b layer made of nitride or carbonitride, a c layer made of a laminated film, and a d layer of an upper layer provided as needed, in order from the base material side. And have.
- each layer will be described in detail.
- the base material is not particularly limited, but it is preferable to use a WC-Co-based cemented carbide having excellent strength and toughness as the base material.
- the layer b according to the present embodiment is a nitride or carbonitride arranged on the base material.
- the b layer is a base layer that enhances the adhesion between the base material and the c layer, which is a laminated film. Since the b layer arranged on the base material is nitride or carbonitride, it becomes a coating cutting tool having excellent adhesion between the base material and the hard film.
- the layer b preferably contains Al in an amount of 55 atomic% or more with respect to the total amount of metal (including metalloids; the same applies hereinafter) elements. Further, the Al of the b layer is preferably 60 atomic% or more.
- the b layer Al-rich By making the b layer Al-rich, the composition difference from the c layer made of the Al-rich laminated film described later becomes small, and the adhesion is improved. Further, by making the b layer Al-rich, the heat resistance of the entire hard film is enhanced. Further, the b layer is preferably a nitride having excellent heat resistance and wear resistance. However, if the Al content ratio of the b layer becomes too large, the amount of AlN having a fragile hcp structure increases. Therefore, the Al content of the b layer is preferably 75 atomic% or less. Further, in order to further enhance the adhesion to the c layer which is a laminated film, the b layer preferably contains a metal element contained in the c1 layer or the c2 layer described later.
- the b layer shows the maximum peak intensity due to the fcc structure in the intensity profile obtained from the selected area diffraction pattern of the X-ray diffraction or transmission electron microscope.
- the c layer which is an Al-rich laminated film provided on the b layer, AlN having a fragile hcp structure contained in the microstructure of the c layer is reduced, so that the durability of the coated cutting tool is improved. improves.
- the layer b is a nitride or a carbonitride, it may be composed of a plurality of layers having different compositions.
- the film thickness of the b layer is preferably 0.1 ⁇ m or more and 5.0 ⁇ m or less. Further, the film thickness of the b layer is preferably 0.2 ⁇ m or more. Further, the film thickness of the b layer is preferably 3.0 ⁇ m or less. The upper limit value and the lower limit value of the film thickness of the b layer can be appropriately combined.
- the c layer according to the present embodiment is an Al-rich laminated film provided between the b layer, which is the above-mentioned base layer, and the d layer, which will be described later.
- the c layer contains 55 atomic% or more of aluminum (Al), followed by chromium (Cr), based on the total amount of metal (including metalloid) elements, and at least boron (B). ), And a nitride containing 55 atomic% or more of aluminum (Al) and then a large amount of titanium (Ti) with respect to the total amount of metal (including metalloid) elements and the c1 layer of the nitride or carbonitride.
- the c layer is a nitride containing 55 atomic% or more of aluminum (Al), 20 atomic% or more of chromium (Cr), and 1 atomic% or more of boron (B) with respect to the total amount of metal elements.
- the c1 layer of the carbonitride and the c2 layer of the nitride or carbonitride containing 55 atomic% or more of aluminum (Al) and 20 atomic% or more of titanium (Ti) with respect to the total amount of the metal portion.
- the laminated film is alternately laminated with a film thickness of 50 nm or less.
- Al-rich AlCrN-based hard films and Al-rich AlTiN-based hard films having different composition systems are alternately laminated at the nano level, so that the progress of film fracture is easily suppressed. Further, it becomes difficult to contain AlN having an hcp structure in the c layer, the heat resistance of the entire hard film is increased, and the durability of the coated cutting tool is improved.
- the average composition of the c layer is preferably such that the Al content ratio is 55 atomic% or more and 75 atomic% or less, and more preferably the Al content ratio is 73 atomic% or less.
- the average composition of the c layer preferably has an Al content ratio of 60 atomic% or more and 70 atomic% or less.
- the average composition of the c layer is preferably such that the total content of Cr and Ti is 20 atomic% or more and 40 atomic% or less.
- the average composition of the c layer preferably has a B content ratio of 0.5 atomic% or more and 5 atomic% or less.
- the average composition of the c layer preferably has a B content ratio of 1 atomic% or more and 3 atomic% or less.
- the average composition of the c layer may be calculated by measuring the range of 500 nm ⁇ 500 nm or more.
- the c layer needs to have a small amount of AlN having an hcp structure contained in the microstructure.
- the present inventor has found that even if the peak intensity of AlN having an hcp structure is not confirmed by X-ray diffraction in the evaluation of the c layer, the microstructure may contain AlN having a fragile hcp structure. Then, the present inventor has confirmed that the durability of the coated cutting tool is improved by reducing the AlN of the fragile hcp structure contained in the microstructure of the c layer.
- the selected area diffraction pattern is obtained from the selected area diffraction pattern for the processed cross section of the hard film using a transmission electron microscope. Use the selected strength profile. Specifically, the relationship of Ih ⁇ 100 / Is is evaluated in the intensity profile of the selected area diffraction pattern of the transmission electron microscope. Ih and Is are defined as follows.
- Ih Peak intensity due to the (010) plane of AlN in the hcp structure.
- Is fcc structure, AlN (111) plane, TiN (111) plane, CrN (111) plane, AlN (200) plane, TiN (200) plane, CrN (200) plane, AlN
- the c-layer is configured to satisfy Ih ⁇ 100 / Is ⁇ 15 to realize a coated cutting tool having good durability.
- the selected area diffraction pattern confirms the AlN diffraction pattern of the hcp structure, if the amount is very small, no peak appears in the intensity profile and the value of Ih ⁇ 100 / Is becomes 0. There is. It is preferable that AlN having an hcp structure is not confirmed in the selected area diffraction pattern of the c layer in order to further enhance the durability of the coated cutting tool.
- the c1 layer contains 55 atomic% or more of aluminum (Al), then chromium (Cr), and at least boron (B), based on the total amount of metal (including metalloid) elements. It is a thing or a carbonitride. Further, the c1 layer is a nitride containing 55 atomic% or more of aluminum (Al), 20 atomic% or more of chromium (Cr), and 1 atomic% or more of boron (B) with respect to the total amount of metal elements. Alternatively, it is preferably a carbonitride. Nitride or carbonitride based on Al and Cr is a film type having excellent heat resistance.
- the c1 layer is preferably a nitride having excellent heat resistance and wear resistance.
- the c1 layer contains Al in an amount of 55 atomic% or more.
- the Al content ratio of the c1 layer is preferably 60 atomic% or more.
- the Al content ratio of the c1 layer is preferably 75 atomic% or less, 73 atomic% or less, and more preferably 70 atomic% or less.
- the wear resistance of Al and Cr-based nitrides or carbonitrides decreases when the Cr content ratio becomes too small.
- the c1 layer preferably contains Cr in an amount of 20 atomic% or more.
- the c1 layer contains a large amount of Cr next to Al in order to obtain an AlCr-based nitride or a carbonitride.
- the Cr content ratio of the c1 layer is preferably 40 atomic% or less, more preferably 35 atomic% or less.
- the total content ratio of Al and Cr to the total amount of metal (including metalloid) elements must be 85 atomic% or more. preferable.
- the c1 layer preferably contains B in an atomic% or more.
- the B content ratio of the c1 layer is preferably 5 atomic% or less, more preferably 3 atomic% or less.
- the c1 layer and the c2 layer are alternately laminated at the nano level, their compositions are mixed at the time of coating. Also, the composition of each other can be diffused. Therefore, the c1 layer may contain Ti which is essential for the c2 layer. However, in order to laminate the Al-rich AlCrN-based hard film and the Al-rich AlTiN-based hard film having different composition systems, the Ti content ratio of the c1 layer is made smaller than the Ti content ratio of the c2 layer.
- the c1 layer can contain metal elements other than Al, Cr and B.
- the c1 layer is, for example, one type selected from the elements of Group 4a, Group 5a, and Group 6a of the periodic table and Si and Y for the purpose of improving the wear resistance, heat resistance, lubricity, etc. of the hard film. It can contain two or more elements. These elements are elements that are generally added to AlTiN-based and AlCrN-based hard films in order to improve the characteristics of the hard film, and the durability of the coated cutting tool is not excessive unless the content ratio is excessive. Does not significantly decrease.
- the c1 layer contains a large amount of metal elements other than Al, Cr and B, the basic characteristics of the AlCrN-based hard film are impaired and the durability of the coated cutting tool is lowered. Therefore, in the c1 layer, the total amount of metal elements other than Al, Cr and B is 25 atomic% or less, further 20 atomic% or less, and further 15 atomic% or less with respect to the total amount of metal (including metalloid) elements. Is preferable.
- the c2 layer is a nitride or carbonitride containing 55 atomic% or more of aluminum (Al) and then a large amount of titanium (Ti) with respect to the total amount of metal (including metalloid) elements. Further, the c2 layer is preferably a nitride or a carbonitride containing aluminum (Al) in an amount of 55 atomic% or more and titanium (Ti) in an amount of 20 atomic% or more with respect to the total amount of metal elements. Nitride or carbonitride mainly composed of Al and Ti is a film type having excellent wear resistance and heat resistance.
- the c2 layer contains Al in an amount of 55 atomic% or more. Further, the Al content of the c2 layer is preferably 60 atomic% or more. However, if the Al content ratio becomes too large, the AlN of the hcp structure increases, so that the durability of the hard film decreases. Therefore, the Al content ratio of the c2 layer is preferably 75 atomic% or less, 73 atomic% or less, and more preferably 70 atomic% or less.
- the c2 layer preferably contains Ti in an amount of 20 atomic% or more.
- the c2 layer contains a large amount of Ti next to Al in order to form an AlTi-based nitride or carbon nitride.
- the Ti content ratio of the c2 layer is preferably 40 atomic% or less, more preferably 35 atomic% or less.
- the total content ratio of Al and Ti to the total amount of metal (including metalloid) elements must be 80 atomic% or more. preferable.
- the c2 layer may contain Cr and B which are essential in the c1 layer.
- the Cr content ratio of the c2 layer is made smaller than the Cr content ratio of the c2 layer.
- B having a small content ratio in the c1 layer may not be contained in the c2 layer.
- the c2 layer can contain metal elements other than Al and Ti.
- the c2 layer is selected from the elements of groups 4a, 5a, and 6a of the periodic table and Si, B, and Y for the purpose of improving the wear resistance, heat resistance, and lubricity of the hard film, for example. It can contain a species or two or more elements. These elements are elements that are generally added to AlTiN-based and AlCrN-based hard films in order to improve the characteristics of the hard film, and the durability of the coated cutting tool is not excessive unless the content ratio is excessive. Does not significantly decrease.
- the AlTiN-based hard film contains an element of W (tungsten) because it tends to have excellent durability under a harsher usage environment.
- the c2 layer contains a large amount of metal elements other than Al and Ti, the basic characteristics of the AlTiN-based hard film are impaired and the durability of the coated cutting tool is lowered. Therefore, in the c2 layer, the total amount of metal elements other than Al and Ti is 25 atomic% or less, further 20 atomic% or less, and further 15 atomic% or less with respect to the total amount of metal (including metalloid) elements. Is preferable.
- the hard film having the same composition as the b layer is a thicker film on the b layer side of the c layer.
- the b layer is an AlTiN-based hard film
- the c1 layer is thicker than the c2 layer in the portion of the c layer on the b layer side.
- the b layer is an AlCrN-based hard film
- the c2 layer is thicker than the c1 layer in the portion of the c layer on the b layer side.
- the adhesion between the b layer, which is the base layer, and the c layer, which is the laminated film tends to increase, and the durability of the coated cutting tool is further improved depending on the tool shape and usage environment. In some cases.
- the c layer is the thickest film with respect to the total film thickness of the hard film. Since the c layer is the main layer of the hard film, both adhesion and wear resistance are compatible at a high level, and the durability of the coated cutting tool is improved.
- the optimum film thickness of each layer differs depending on the type of tool, tool diameter, work material, etc., but it is easy to realize excellent durability because the c layer is the thickest film.
- the film thickness ratio of the c layer is preferably 50% or more, more preferably 60% or more, and further 70% or more.
- the film thickness ratio of the c layer is preferably 90% or less, more preferably 85% or less.
- the film thickness ratio of the b layer is preferably 5% or more.
- the film thickness ratio of the d layer is preferably 10% or more.
- the film thickness of each of the c1 layer and the c2 layer is preferably 20 nm or less. Further, if the individual film thicknesses of the c1 layer and the c2 layer are too small, it becomes difficult to form a laminated film having a different composition system. Therefore, the film thicknesses of the c1 layer and the c2 layer are preferably 2 nm or more. Further, the film thickness of each of the c1 layer and the c2 layer is preferably 5 nm or more. The upper limit value and the lower limit value of the film thickness of the c1 layer and the c2 layer can be appropriately combined.
- a d layer may be provided as a protective film on the upper layer of the c layer, which is a laminated film, if necessary.
- a nitride or carbonitride containing Ti and Si which are film types having excellent wear resistance
- an AlCr-based or AlTi-based nitride or a carbonitride may be provided.
- a nitride or carbonitride having a composition other than TiSi-based, AlCr-based and AlTi-based may be provided.
- a metal other than nitride or carbonitride, a carbide, a boride or the like may be provided.
- the hard film b-layer, c-layer, and d-layer according to this embodiment are preferably nitrides having excellent heat resistance and wear resistance. Since the entire hard film is nitride, the durability of the coated cutting tool is further improved. In general, even nitrides contain minute amounts of oxygen and carbon. That is, the metal nitride has a peak intensity in which a metal element is bonded with oxygen or carbon in a micro analysis.
- the hard film according to the present embodiment may partially contain carbonitride or oxynitride as long as it is mainly nitride.
- the durability of the coated cutting tool is not significantly reduced. ..
- the nitrogen content ratio is larger than that of carbon in order to further improve the heat resistance and wear resistance of the hard film.
- the carbon content is preferably 20 atomic% or less, and more preferably 10 atomic% or less, based on the nitrogen content.
- a layer a in which the nanobeam diffraction pattern is indexed to the crystal structure of the WC may be provided between the base material and the layer b which is the base layer.
- the a layer is formed on the surface of the base material by the metal ion bombard. Since layer a is a layer formed by diffusing the metal elements used in the metal ion bombard, when the WC-Co group cemented carbide is used as the base material, the total amount of metal elements contains the largest amount of W (tungsten). Then, it contains the metal element used for the metal ion bombard. By having such a layer, the adhesion between the base material and the base layer provided on the base material tends to be remarkably improved.
- the layer a is provided in a ball end mill in which the ridgeline of the cutting edge is not easily broken by the metal ion bombard and the cutting edge is not formed with an acute angle. If the film thickness of layer a is too thin or too thick, the effect of improving adhesion cannot be obtained. Therefore, the film thickness of layer a is preferably 1 nm or more and 10 nm or less.
- layer a is a layer in which the nanobeam diffraction pattern is indexed by the crystal structure of WC, it is mainly composed of carbides.
- the layer a may contain nitrogen or oxygen in part as long as the nanobeam diffraction pattern is indexed to the crystal structure of WC.
- the a layer may partially contain a metal layer or a crystal phase having an fcc structure.
- the bombard treatment using an alloy target mainly composed of metal Ti or Ti has a great effect of improving adhesion. Therefore, it is preferable that the layer a contains a large amount of Ti next to W in terms of the content ratio of the metal element. However, if the content ratio of Ti contained in the layer a is too large or too small, it is difficult to obtain the effect of improving the adhesion.
- the layer a preferably contains Ti in an amount of 10 atomic% or more and 30 atomic% or less.
- the coating cutting tool of the present embodiment described above is a laminated film of a c1 layer made of an AlCr-based hard film and a c2 layer made of an AlTi-based hard film, and the AlN content of the hcp structure is high.
- the reduced c-layer heat resistance and abrasion resistance can be improved with respect to the conventional AlCr-based hard film.
- the c1 layer containing B the lubricity of the hard film can be improved. Therefore, according to this embodiment, a coated cutting tool having excellent durability is provided.
- the hard film according to this embodiment is preferably coated by the arc ion plating method having a high target ionization rate. Further, the target may be coated by a high-power sputtering method having a high ionization rate. Then, for the Al-rich laminated film, in order to increase the crystallinity and reduce the AlN of the hcp structure contained in the microstructure, it is preferable to use a cathode having a magnetic flux density of 10 mT or more in the vertical direction near the center of the target.
- the cathode for forming an AlCr-based hard film it is preferable to form a film in a range where the cathode voltage is 20 V or more and 35 V or less. If the cathode voltage is too low, the laminated film has a large amount of AlN having an hcp structure, and the durability is lowered. Further, if the cathode voltage becomes too high, the film structure of the laminated film becomes too coarse and the durability tends to decrease.
- the cathode for forming an AlTi-based hard film it is preferable to form the cathode voltage in the range of 20 V or more and 30 V or less. If the cathode voltage becomes too low, the laminated film has a large amount of AlN having an hcp structure, and the durability is lowered. Further, if the cathode voltage becomes too high, the film structure of the laminated film becomes too coarse and the durability tends to decrease.
- the cathode current is preferably 120 A or more and 200 A or less, respectively.
- the absolute value of the negative bias voltage applied to the substrate is increased. Is preferable. According to this production method, the formation of AlN having an hcp structure is suppressed in the microstructure. Thereby, the value of Ih ⁇ 100 / Is in the c layer can be made smaller than 15.
- the negative bias voltage applied to the base material is preferably ⁇ 200 V or more and less than -100 V. Further, ⁇ 120 V or less is preferable. If the absolute value of the bias voltage becomes too large, the film formation becomes difficult to stabilize and it becomes difficult to adjust the film thickness. Further, if the absolute value of the bias voltage becomes too small, the AlN of the hcp structure increases in the laminated film, and the durability is lowered.
- the coating temperature is preferably 400 ° C. or higher and 600 ° C. or lower.
- nitrogen gas is introduced into the furnace to cover the nitride.
- the nitrogen gas pressure at the time of coating is preferably 2.0 Pa or more and 8.0 Pa or less.
- a part of the nitrogen gas may be replaced with methane gas.
- This film forming apparatus includes a plurality of cathodes (arc evaporation sources), a vacuum vessel, and a substrate rotation mechanism.
- cathode one cathode with coil magnets mounted on the outer circumference of the target (hereinafter referred to as "C1") and permanent magnets mounted on the back surface and outer circumference of the target are provided to provide a magnetic flux density in the direction perpendicular to the target surface.
- C2 Three cathodes (hereinafter referred to as "C2, C3, C4") having a magnetic flux density of 14 mT in the vertical direction near the center of the target are mounted.
- C1 to C4 are arranged at intervals of about 90 ° around the region where the base material is arranged, and are provided so that C1 and C4 and C2 and C3 face each other.
- the inside of the vacuum container is exhausted by a vacuum pump, and gas is introduced from the supply port.
- a bias power supply is connected to each base material installed in the vacuum vessel, and a negative DC bias voltage can be independently applied to each base material.
- the base material rotation mechanism includes a planetary, a plate-shaped jig arranged on the planetary, and a pipe-shaped jig arranged on the plate-shaped jig, and the planetary has a speed of 3 rotations per minute.
- the plate-shaped jig and the pipe-shaped jig rotate on their own.
- Composition WC (bal.)-Co (8% by mass) -Cr (0.5% by mass) -V (0.3% by mass) Hardness: 94.0 HRA Blade diameter: 1 mm, number of blades: 2
- a metallic titanium target was installed in C1
- an AlTi alloy target was installed in C2
- an AlCrB alloy target was installed in C3
- an AlCrB alloy target was installed in C4.
- Table 1 shows the target composition used.
- Each base material was fixed to a pipe-shaped jig in a vacuum vessel, and the following process was carried out before film formation.
- the inside of the vacuum vessel was evacuated to 5 ⁇ 10 ⁇ 2 Pa or less.
- the base material was heated to a temperature of 500 ° C. by a heater installed in the vacuum vessel, and vacuum exhaust was performed.
- the set temperature of the base material was set to 500 ° C.
- the pressure in the vacuum vessel was set to 5 ⁇ 10 ⁇ 2 Pa or less.
- ⁇ Ti bombard process> Then, the vacuum was evacuated so that the pressure in the vacuum vessel was 8 ⁇ 10 -3 Pa or less. Subsequently, an arc current of 120 A was supplied to C1, a negative pressure bias voltage of ⁇ 800 V was applied to the base material, and a Ti bombard treatment was carried out for 15 minutes.
- the set temperature of the base material was set to 480 ° C.
- nitrogen gas was introduced into the vacuum vessel, and the pressure inside the furnace was set to 3.2 Pa.
- the negative bias voltage applied to the base material of each sample was ⁇ 120 V
- the current applied to C2 was 200 A.
- the b layer was provided with about 0.5 ⁇ m.
- the negative bias voltage applied to the substrate was changed depending on the sample. Further, while the power input to C2 is constant, the power input to C3 is gradually increased, and the c2 layer (AlTiN system) is more than the c1 layer (AlCrN system) in the b-layer side portion of the c layer.
- the cathode voltage of C2 was 20 V or more and 30 V or less
- the cathode voltage of C3 was 20 V or more and 35 V or less.
- the negative bias voltage applied to the base material of each sample was ⁇ 120 V
- the current applied to C4 was 150 A.
- the d layer was provided with a thickness of about 1.5 ⁇ m. Table 2 shows the film forming conditions for the c layer.
- the produced coated cutting tool was subjected to a cutting test under the following cutting conditions. Table 3 shows the cutting test results.
- the details of the cutting conditions are as follows. ⁇ Processing conditions> ⁇ Cutting method: Side cutting ⁇ Work material: STAVAX (52HRC) -Tools used: 2-flute ball end mill (tool diameter 1 mm) ⁇ Notch: Axial direction, 0.04 mm, radial direction, 0.04 mm ⁇ Spindle speed: 24000min -1 -Feed rate: 860 mm / min ⁇ Coolant: Dry processing (air blow) ⁇ Cutting distance: 90m
- Comparative Example 1 has the same film composition as that of Example 1, but has a larger maximum wear width.
- Comparative Example 2 had a composition in which the Al content ratio of the laminated film was smaller than that in Example 1, and the maximum wear width was large.
- a micro analysis of the laminated film was performed in order to elucidate the factor of excellent durability for this Example 1.
- the composition is analyzed by the attached wavelength dispersive electron probe microanalysis (WDS-EPMA) using an electron probe microanalyzer (model number: JXA-8500F) manufactured by JEOL Ltd. It was confirmed that the nitride had almost the same composition as the target alloy.
- WDS-EPMA wavelength dispersive electron probe microanalysis
- Example 1 a ball end mill for evaluating physical properties was processed, and the processed cross section was observed with a transmission electron microscope (TEM). It was confirmed that the c layer, which is a laminated film, was formed of fine columnar particles having an average width of 50 to 70 nm. Table 4 shows an example of the result of the composition analysis of the entire laminated film.
- the composition of the c1 layer and the c2 layer was determined by analyzing the central portion of each layer using an energy dispersive X-ray spectrometer (EDS) with the analysis region set to ⁇ 1 nm. The value after the decimal point was rounded off.
- EDS energy dispersive X-ray spectrometer
- the c layer of Example 1 was Al-rich as a whole of the laminated film, and contained at least B, Ti, and Cr.
- Example 1 the compositions of the c1 layer and the c2 layer were mixed with each other, and the c1 layer contained the total of Ti and W in an amount of 10 atomic% or less. Further, the c2 layer of Example 1 contained Cr in an amount of 10 atomic% or less.
- the selected area diffraction pattern of the laminated film was determined under the conditions of an accelerating voltage of 120 kV, a limited field of view region of ⁇ 750 nm, a camera length of 100 cm, and an incident electron amount of 5.0 pA / cm 2 (on a fluorescent screen).
- the brightness of the selected selected area diffraction pattern was converted, and the intensity profile was obtained.
- the analysis point was an intermediate part in the film thickness direction.
- Example 1 of the present invention no peak caused by AlN (010) of the hcp structure was confirmed, and Ih ⁇ 100 / Is was 0.
- Example 1 there was a peak caused by AlN (010) of the hcp structure, and Ih ⁇ 100 / Is was 19.
- the peak intensity caused by AlN of the hcp structure was not confirmed by X-ray diffraction, but the peak intensity caused by AlN of the hcp structure was different in the selected area diffraction pattern. occured.
- Example 1 it is presumed that the durability was significantly improved because the AlN of the hcp structure contained in the microstructure was small.
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Abstract
Description
本願は、2019年5月9日に、日本に出願された特願2019-089303号に基づき優先権を主張し、その内容をここに援用する。
基材と、前記基材上に形成される硬質皮膜とを備え、
前記硬質皮膜は、前記基材の上に配置される、窒化物または炭窒化物からなるb層と、
前記b層の上に配置され、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでクロム(Cr)の含有比率が多く、更に、少なくともホウ素(B)を含有する窒化物または炭窒化物のc1層と、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでチタン(Ti)を多く含有する窒化物または炭窒化物のc2層と、がそれぞれ50nm以下の膜厚で交互に積層した積層皮膜であるc層と、
を有し、
前記c層は、透過型電子顕微鏡の制限視野回折パターンから求められる強度プロファイルにおいて、六方最密充填構造のAlNの(010)面に起因するピーク強度をIhとし、面心立方格子構造の、AlNの(111)面、TiNの(111)面、CrNの(111)面、AlNの(200)面、TiNの(200)面、CrNの(200)面、AlNの(220)面、TiNの(220)面、およびCrNの(220)面に起因するピーク強度と、六方最密充填構造の、AlNの(010)面、AlNの(011)面、およびAlNの(110)面に起因するピーク強度と、の合計をIsとした場合、Ih×100/Is≦15の関係を満たす被覆切削工具である。
また、前記硬質皮膜の総膜厚に対して、前記c層が最も厚い膜であることが好ましい。
また、前記c層は、柱状粒子から構成されており、前記柱状粒子の平均幅は90nm以下であることが好ましい。
本実施形態の被覆切削工具においては、基材は特段限定されないが、強度と靭性に優れるWC-Co基超硬合金を基材とすることが好ましい。
本実施形態に係るb層は、基材の上に配置される窒化物または炭窒化物である。b層は、基材と積層皮膜であるc層との密着性を高める下地層である。基材の上に配置されるb層が窒化物または炭窒化物であることで、基材と硬質皮膜の密着性が優れる被覆切削工具となる。b層は、金属(半金属を含む。以下、同様。)元素の総量に対して、Alを55原子%以上で含有することが好ましい。更には、b層のAlは60原子%以上が好ましい。b層をAlリッチとすることで、後述するAlリッチの積層皮膜からなるc層との組成差が小さくなり密着性が向上する。また、b層をAlリッチとすることで、硬質皮膜の全体で耐熱性が高まる。更には、b層は、耐熱性と耐摩耗性に優れる窒化物であることが好ましい。但し、b層のAlの含有比率が大きくなり過ぎると脆弱なhcp構造のAlNが多くなる。そのため、b層のAlは75原子%以下が好ましい。また、積層皮膜であるc層との密着性をより高めるため、b層は後述するc1層またはc2層が含有する金属元素を含有することが好ましい。また、b層は、X線回折または透過型電子顕微鏡の制限視野回折パターンから求められる強度プロファイルにおいて、fcc構造に起因するピーク強度が最大を示すことが好ましい。これにより、b層の上に設けられるAlリッチの積層皮膜であるc層において、c層のミクロ組織に含有される脆弱なhcp構造のAlNが低減されることにより、被覆切削工具の耐久性が向上する。b層は窒化物または炭窒化物であれば、組成が異なる複数の層から構成されてもよい。
本実施形態に係るc層は、上述した下地層であるb層と、後述するd層との間に設けられるAlリッチな積層皮膜である。
具体的には、c層は、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでクロム(Cr)の含有比率が多く、更に、少なくともホウ素(B)を含有する窒化物または炭窒化物のc1層と、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでチタン(Ti)を多く含有する窒化物または炭窒化物のc2層と、がそれぞれ50nm以下の膜厚で交互に積層した積層皮膜である。
更には、c層は、金属元素の総量に対して、アルミニウム(Al)を55原子%以上、クロム(Cr)を20原子%以上、ホウ素(B)を1原子%以上、を含有する窒化物または炭窒化物のc1層と、金属部分の総量に対して、アルミニウム(Al)を55原子%以上、チタン(Ti)を20原子%以上、を含有する窒化物または炭窒化物のc2層とが50nm以下の膜厚で交互に積層した積層皮膜であることが好ましい。組成系が互いに異なるAlリッチなAlCrN系の硬質皮膜とAlリッチなAlTiN系の硬質皮膜とがナノレベルで交互に積層されることで、皮膜破壊の進展が抑制され易くなる。また、c層中にhcp構造のAlNを含有し難くなり、硬質皮膜の全体で耐熱性が高まり被覆切削工具の耐久性が向上する。
c層の平均組成は、Alの含有比率が55原子%以上75原子%以下であることが好ましく、Alの含有比率が73原子%以下であることがより好ましい。更には、c層の平均組成は、Alの含有比率が60原子%以上70原子%以下であることが好ましい。また、c層の平均組成は、CrとTiの合計の含有率が20原子%以上40原子%以下であることが好ましい。また、c層の平均組成は、Bの含有比率が0.5原子%以上5原子%以下であることが好ましい。更には、c層の平均組成は、Bの含有比率が1原子%以上3原子%以下であることが好ましい。なお、c層の平均組成は、500nm×500nm以上の範囲を測定して算出すればよい。
更には、c層はミクロ組織に含有されるhcp構造のAlNが少ないことが必要である。本発明者は、c層の評価においてX線回折ではhcp構造のAlNのピーク強度が確認されない場合でも、ミクロ組織には脆弱なhcp構造のAlNを含有する場合があることを知見した。そして、本発明者は、c層のミクロ組織に含まれる脆弱なhcp構造のAlNを低減することで、被覆切削工具の耐久性が向上することを確認した。
Is:fcc構造の、AlNの(111)面、TiNの(111)面、CrNの(111)面、AlNの(200)面、TiNの(200)面、CrNの(200)面、AlNの(220)面、TiNの(220)面、およびCrNの(220)面に起因するピーク強度と、hcp構造の、AlNの(010)面、AlNの(011)面、およびAlNの(110)面に起因するピーク強度と、の合計。
c1層は、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでクロム(Cr)の含有比率が多く、更に、少なくともホウ素(B)を含有する窒化物または炭窒化物である。更には、c1層は、金属元素の総量に対して、アルミニウム(Al)を55原子%以上、クロム(Cr)を20原子%以上、ホウ素(B)を1原子%以上、を含有する窒化物または炭窒化物であることが好ましい。
AlとCrをベースとする窒化物または炭窒化物は耐熱性に優れる膜種である。特にAlの含有比率が大きくなると硬質皮膜の耐熱性が向上する傾向にあり、被覆切削工具の耐久性が向上する。更には、c1層は、耐熱性と耐摩耗性に優れる窒化物であることが好ましい。硬質皮膜に高い耐熱性を付与するために、c1層はAlを55原子%以上で含有する。更にはc1層のAl含有比率は60原子%以上が好ましい。但し、Alの含有比率が大きくなり過ぎると、ミクロ組織に含有される脆弱なhcp構造のAlNが多くなるため、硬質皮膜の耐久性が低下する。そのため、c1層のAl含有比率は75原子%以下、あるいは73原子%以下、更には70原子%以下が好ましい。
但し、c1層がAlとCrとB以外の金属元素を多く含有するとAlCrN系の硬質皮膜としての基礎特性が損なわれ被覆切削工具の耐久性が低下する。そのため、c1層はAlとCrとB以外の金属元素の合計が、金属(半金属を含む)元素の総量に対して、25原子%以下、更には20原子%以下、更には15原子%以下であることが好ましい。
c2層は、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでチタン(Ti)を多く含有する窒化物または炭窒化物である。更には、c2層は、金属元素の総量に対して、アルミニウム(Al)を55原子%以上、チタン(Ti)を20原子%以上、で含有する窒化物または炭窒化物であることが好ましい。AlとTiを主体とする窒化物または炭窒化物は、耐摩耗性および耐熱性に優れる膜種である。特に、Alの含有比率が大きくなると硬質皮膜の耐熱性が向上する傾向にあり、被覆切削工具の耐久性が向上する。更には、耐熱性と耐摩耗性に優れる窒化物であることが好ましい。硬質皮膜に高い耐熱性を付与するために、c2層はAlを55原子%以上で含有する。更にはc2層のAlは60原子%以上が好ましい。但し、Alの含有比率が大きくなり過ぎると、hcp構造のAlNが多くなるため、硬質皮膜の耐久性が低下する。そのため、c2層のAlの含有比率は75原子%以下、あるいは73原子%以下、更には70原子%以下が好ましい。
但し、c2層がAlとTi以外の金属元素を多く含有すると、AlTiN系の硬質皮膜としての基礎特性が損なわれ被覆切削工具の耐久性が低下する。そのため、c2層はAlとTi以外の金属元素の合計が、金属(半金属を含む)元素の総量に対して、25原子%以下、更には20原子%以下、更には15原子%以下であることが好ましい。
このような皮膜構造とすることで、下地層であるb層と積層皮膜であるc層との密着性が高まる傾向になり、工具形状や使用環境によっては、被覆切削工具の耐久性がより向上する場合もある。
各層の最適な膜厚は、工具の種類、工具径および被削材等により異なるが、何れもc層が最も厚い膜となることで優れた耐久性を実現し易い。そして、b層、c層、d層の合計の膜厚を100%とした場合、c層の膜厚比が50%以上、更には60%以上、更には70%以上が好ましい。但し、c層の膜厚比が大きくなり過ぎると、b層とd層の膜厚が小さくなるため、密着性や耐摩耗性が低下する。そのため、c層の膜厚比は90%以下、更には85%以下が好ましい。
b層の膜厚比は5%以上が好ましい。d層の膜厚比は10%以上が好ましい。
本実施形態では、積層皮膜であるc層の上層に、必要に応じて、保護皮膜としてd層を設けてもよい。例えば、d層として、耐摩耗性に優れる膜種であるTiとSiを含有する窒化物または炭窒化物を設けても良い。また、d層として、AlCr系やAlTi系の窒化物または炭窒化物を設けても良い。また、d層として、TiSi系、AlCr系およびAlTi系以外の組成系の窒化物や炭窒化物を設けても良い。また、d層として、窒化物や炭窒化物以外の金属、炭化物あるいはホウ化物等を設けても良い。
本実施形態では、必要に応じて、基材と下地層であるb層との間に、ナノビーム回折パターンがWCの結晶構造に指数付けされるa層を有してもよい。a層は金属イオンボンバードにより基材の表面に形成される。a層は金属イオンボンバードに用いた金属元素が拡散して形成される層であるため、WC-Co基超硬合金を基材とする場合、金属元素の総量でW(タングステン)を最も多く含有しており、次いで金属イオンボンバードに用いた金属元素を含有する。このようなa層を有することで、基材とその上に設ける下地層との密着性が著しく改善する傾向にある。
但し、工具径が小さくなると、刃先が鋭角になり易いスクエアエンドミルやラジアスエンドミルにおいては、金属イオンボンバードにより、刃先が溶損する場合があり、刃先稜線が破壊され易くなる。そのため、a層は、金属イオンボンバードにより刃先稜線が破壊され難い、鋭角な刃先が形成されないボールエンドミルに設けることが好ましい。a層の膜厚が薄すぎる場合や、厚すぎる場合には密着性の改善効果が得られない。そのため、a層の膜厚は1nm以上10nm以下が好ましい。
a層はTiを10原子%以上30原子%以下で含有することが好ましい。
本実施形態に係る硬質皮膜は、ターゲットのイオン化率が高いアークイオンプレーティング法で被覆することが好ましい。また、ターゲットのイオン化率が高い高出力スパッタリング法で被覆してもよい。そして、Alリッチの積層皮膜について、結晶性を高めてミクロ組織に含有されるhcp構造のAlNを低減するために、ターゲット中心付近の垂直方向における磁束密度が10mT以上のカソードを用いることが好ましい。
成膜には、アークイオンプレーティング法を利用した成膜装置を用いた。この成膜装置は、複数のカソード(アーク蒸発源)、真空容器、および基材回転機構を備えている。カソードとしては、ターゲットの外周にコイル磁石が配備されたカソードを1基(以下、「C1」という。)と、ターゲットの背面および外周に永久磁石が配備され、ターゲット表面に垂直方向の磁束密度を有し、ターゲット中央付近における垂直方向の磁束密度が14mTであるカソードを3基(以下、「C2、C3、C4」という。)と、が搭載されている。
C1~C4は基材が配置される領域の周囲に約90°間隔に配置されており、C1とC4、C2とC3とが対向するように設けられている。
組成:WC(bal.)-Co(8質量%)-Cr(0.5質量%)-V(0.3質量%)
硬度:94.0HRA
刃径:1mm、刃数:2枚
その後、真空容器内にArガスを導入し、容器内圧を0.67Paとした。その後、フィラメント電極に35Aの電流を供給し、基材に-200Vの負圧のバイアス電圧を印加し、Arボンバードを15分間実施した。
その後、真空容器内の圧力が8×10-3Pa以下になるように真空排気した。続いて、C1に120Aのアーク電流を供給し、基材に-800Vの負圧のバイアス電圧を印加し、Tiボンバード処理を15分実施した。
その後、基材の設定温度を480℃として、真空容器内に窒素ガスを導入して、炉内圧力を3.2Paとした。
b層の被覆では、何れの試料も基材に印加する負のバイアス電圧を-120V、C2に印加する電流を200Aとした。b層は約0.5μm設けた。
c層の被覆では、試料により基材に印加する負のバイアス電圧を変化させた。また、C2に投入する電力は一定として、C3に投入する電力を徐々に増加させていき、c層のb層側の部分ではc2層(AlTiN系)の方がc1層(AlCrN系)よりも厚い膜になるよう被覆した。なお、被覆時の、C2のカソード電圧は20V以上30V以下、C3のカソード電圧は20V以上35V以下であった。
d層の被覆では、何れの試料も基材に印加する負のバイアス電圧を-120V、C4に印加する電流を150Aとした。d層は約1.5μm設けた。
表2にc層の成膜条件を示す。
表3に切削試験結果を示す。切削条件の詳細は、以下の通りである。
<加工条件>
・切削方法:側面切削
・被削材:STAVAX(52HRC)
・使用工具:2枚刃ボールエンドミル(工具径1mm)
・切り込み:軸方向、0.04mm、径方向、0.04mm
・主軸回転数:24000min-1
・送り速度: 860mm/min
・クーラント:ドライ加工(エアーブロー)
・切削距離:90m
本実施例1について耐久性が優れた要因を解明するために積層皮膜のミクロ解析を行った。
なお、b層とd層については、株式会社日本電子製の電子プローブマイクロアナライザー装置(型番:JXA-8500F)を用いて、付属の波長分散型電子プローブ微小分析(WDS-EPMA)で組成分析を行い、ターゲットの合金組成とほぼ同一の窒化物であることが確認された。
積層皮膜の全体の組成分析の結果の一例を表4に示す。c1層とc2層の組成は、エネルギー分散型X線分光器(EDS)を用いて、分析領域をφ1nmとして、各層の中心部分を分析することで求めた。小数点以下の値は四捨五入して求めた。
本実施例1のc層は、積層皮膜の全体でAlリッチであり、少なくともBとTiとCrを含有していた。本実施例1では、c1層とc2層の組成は相互に混ざっており、c1層はTiとWの合計を10原子%以下で含有していた。また、本実施例1のc2層はCrを10原子%以下で含有していた。
本発明例1はhcp構造のAlN(010)に起因するピークは確認されず、Ih×100/Isは0であった。一方、比較例1には、hcp構造のAlN(010)に起因するピークがあり、Ih×100/Isは19となった。
本実施例1および比較例1について、X線回折では、hcp構造のAlNに起因するピーク強度は確認されなかったが、制限視野回折パターンにおいては、hcp構造のAlNに起因するピーク強度に差異が生じた。本実施例1は、ミクロ組織に含有されるhcp構造のAlNが少ないために、耐久性が著しく改善されたと推定される。
Claims (1)
- 基材と、前記基材上に形成される硬質皮膜とを備え、
前記硬質皮膜は、
前記基材の上に配置される、窒化物または炭窒化物からなるb層と、
前記b層の上に配置され、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでクロム(Cr)の含有比率が多く、更に、少なくともホウ素(B)を含有する窒化物または炭窒化物のc1層と、金属(半金属を含む)元素の総量に対して、アルミニウム(Al)を55原子%以上、次いでチタン(Ti)を多く含有する窒化物または炭窒化物のc2層と、がそれぞれ50nm以下の膜厚で交互に積層した積層皮膜であるc層と、
を有し、
前記c層は、透過型電子顕微鏡の制限視野回折パターンから求められる強度プロファイルにおいて、六方最密充填構造のAlNの(010)面に起因するピーク強度をIhとし、面心立方格子構造の、AlNの(111)面、TiNの(111)面、CrNの(111)面、AlNの(200)面、TiNの(200)面、CrNの(200)面、AlNの(220)面、TiNの(220)面、およびCrNの(220)面に起因するピーク強度と、六方最密充填構造の、AlNの(010)面、AlNの(011)面、およびAlNの(110)面に起因するピーク強度と、の合計をIsとした場合、Ih×100/Is≦15の関係を満たすことを特徴とする被覆切削工具。
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